Wafer rotary processing device

Abstract

The invention relates to the technical field of wafer processing, and discloses a wafer rotary processing device which comprises a shell, a rotating mechanism for driving a wafer to rotate is arranged on the shell, a first motor for driving the rotating mechanism to rotate is arranged in the shell, the rotating mechanism comprises a rotating table, and multiple layers of negative pressure ring cavities are formed in the top of the rotating table. The bottom of the rotating table is provided with a liftable negative pressure generating mechanism, a lifting mechanism is arranged in the shell, the lifting mechanism drives the negative pressure generating mechanism to complete lifting action, the top of the lifting mechanism is provided with a positioning mechanism, and the positioning mechanism clamps a wafer in the radial direction through a shaft, so that the axis of the wafer coincides with the axis of the rotating table. The device realizes automatic positioning and fixing work before wafer processing, can replace a rotating mechanism in most wafer processing equipment, can be independently used as split type rotating equipment, and is more comprehensive and efficient.

Description

Technical Field

[0001] The invention relates to the technical field of wafer processing, and in particular to a wafer rotation processing device. Background Art

[0002] Wafer is a basic material in the semiconductor manufacturing process, usually made of single crystal silicon. It is mainly used as the basic platform for integrated circuits and other semiconductor devices. Chips are formed through lithography, etching, deposition, ion implantation, cleaning, polishing and cutting. In most of the above processing techniques, a rotating mechanism is required. The rotating mechanism in existing wafer processing equipment is composed of a motor, a transmission mechanism and a rotating platform to provide rotating motion for wafer processing.

[0003] During the wafer processing process, multiple devices are needed to complete the transformation from silicon wafers to chips. The process is relatively complex and requires more equipment. Each time the wafer is transferred between different devices, positioning and fixing steps must be completed. There are more additional auxiliary equipment, which increases the construction cost. A rotating mechanism with strong functionality that can independently achieve positioning and fixing and can adapt to different usage scenarios is needed to improve the functionality and economy of rotating processing. Summary of the invention

[0004] The technical problem to be solved by the present invention is to overcome the above difficulties and provide a wafer rotation processing device.

[0005] In order to solve the above technical problems, the technical solution provided by the present invention is as follows: a wafer rotation processing device, comprising a shell, a rotating mechanism for driving the wafer to rotate is provided on the shell, and a motor for driving the rotating mechanism to rotate is provided in the shell; The rotating mechanism comprises a rotating table, a multi-layer negative pressure ring cavity is arranged on the top of the rotating table, the negative pressure ring cavities are connected through connecting grooves, a negative pressure generating mechanism that can be raised and lowered is arranged at the bottom of the rotating table, the negative pressure generating mechanism comprises a mounting plate, a plurality of arc plates are evenly arranged on the top of the mounting plate, and a sliding cavity 1 that slides with the arc plates is arranged in the negative pressure ring cavity; A lifting mechanism is provided in the shell, and the lifting mechanism includes a cylinder and a lifting ring table. The output end of the cylinder is connected to the lifting ring table. The lifting ring table is slidably arranged on the outside of the rotating table. The lifting ring table drives the negative pressure generating mechanism to complete the lifting action. A positioning mechanism is provided on the top of the lifting ring table. The positioning mechanism clamps the wafer radially through the axis so that the axis of the wafer coincides with the axis of the rotating table.

[0006] As an improvement: a limiting mechanism is provided inside the mounting disk, the limiting mechanism includes an insertion rod and an unlocking platform, the insertion rod is slidably arranged in a radially arranged slide groove 1 inside the mounting disk, the front end of the insertion rod is plugged into and matched with a slot on the inner side of the bottom of the rotating platform, a spring is provided at the rear end of the insertion rod, the unlocking platform is slidably arranged in a axially arranged slide groove 2 inside the mounting disk, and the inclined surface on the unlocking platform is slidably matched with the inclined surface at the middle through hole of the insertion rod.

[0007] As an improvement: a protective mechanism is provided on the rotating table, which includes a piston and a positioning platform. A sliding cavity 2 is provided in the negative pressure ring cavity. The piston and the positioning platform are slidably arranged in the sliding cavity 2. A threaded column is provided at the bottom of the piston, and a threaded hole matching the threaded column is provided at the top of the positioning platform. A clamping ring is provided on the outer side of the bottom of the positioning platform, which is clamped with the groove on the inner side of the sliding cavity 2. A ventilation groove is provided on the side of the positioning table, and a ventilation hole that runs through the rotating table is provided at the bottom of the sliding cavity 2.

[0008] As an improvement: a connecting platform is provided at the bottom of the lifting ring platform, a transmission plate is provided on the inner side of the connecting platform, a wing plate connected to the connecting platform is provided on the outer side of the transmission plate, a pushing platform is provided on the top of the transmission plate, the pushing platform contacts and cooperates with the bottom of the mounting plate, and a pulling plate is provided on the top of the lifting ring platform, the pulling plate contacts and cooperates with the groove at the top of the mounting plate.

[0009] As an improvement: a butt plate is provided at the bottom of the unlocking platform, and a second spring is provided between the butt plate and the bottom of the mounting plate. The butt plate contacts and cooperates with the top of the lifting ring platform. After the insertion rod is separated from the slot, the push platform contacts the bottom of the mounting plate.

[0010] As an improvement: the positioning mechanism includes motor 2, a swivel and a clamp. Motor 2 is arranged in the lifting ring platform. The swivel rotates in the rotating groove inside the lifting ring platform. Gear 2 is provided at the output end of motor 2, and a gear ring meshing with gear 2 is provided at the bottom of the swivel. The clamp slides radially on the lifting ring platform, and the lifting ring platform drives the clamp to move radially.

[0011] As an improvement: the clamp includes a moving platform, a spiral groove is provided on the top of the rotating ring, a driving platform matching the spiral groove is provided at the bottom of the moving platform, a clamping plate is provided on the front side of the moving platform, a sliding rod is provided on the rear side of the clamping plate, the sliding rod is slidably matched with the through hole on the moving platform, and a spring three is provided on the outside of the moving platform.

[0012] As an improvement: a rotating shaft is provided at the bottom of the rotating table, a limiting ring is provided on the rotating shaft, a retaining table which rotates with the limiting ring is provided on the inner side of the shell, a gear 1 is provided at the bottom of the rotating shaft, and the output end of motor 1 is transmitted with gear 1 through a gear set.

[0013] Compared with the prior art, the beneficial effects of the present invention are: the device realizes automatic positioning and fixing work before wafer processing, can replace the rotating mechanism in most wafer processing equipment, can be used alone as a split rotating device, and is more comprehensive and efficient. Specifically: 1. Through the cooperation of the negative pressure generating mechanism and the lifting mechanism, the lifting action of the arc plate realizes the generation of negative pressure in the negative pressure ring cavity, thereby fixing the wafer on the rotating table, and pushing the lifting mechanism to make the wafer leave the rotating table for easy transfer; 2. The positioning of the wafer is achieved through the cooperation of the positioning mechanism and the lifting mechanism. The synchronous radial movement and clamping of multiple clamps make the axis of the wafer coincide with the axis of the rotating table, which is convenient for subsequent processing; 3. The mounting plate is fixed after it drops to a certain position through the limiting mechanism, so that the negative pressure in the negative pressure ring cavity is stable, and the transmission plate and the mounting plate form a movable fit. During the rotation of the turntable, the load and friction are reduced, and the rotation efficiency is improved; 4. The protection mechanism can be used to adjust the preset negative pressure value and reduce the negative pressure protection when the negative pressure exceeds the critical value, which can effectively avoid the problem of wafer damage caused by excessive negative pressure and protect the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural schematic diagram of a wafer rotation processing device of the present invention.

[0015] Figure 2 It is an exploded view of a wafer rotation processing device of the present invention.

[0016] Figure 3 A cross-sectional view of a wafer rotation processing device of the present invention Figure 1 .

[0017] Figure 4 A cross-sectional view of a wafer rotation processing device of the present invention Figure 2 .

[0018] Figure 5 The present invention is a schematic structural diagram of a rotating mechanism and a negative pressure generating mechanism of a wafer rotating processing device.

[0019] Figure 6 It is an exploded view of a rotating mechanism and a negative pressure generating mechanism of a wafer rotating processing device of the present invention.

[0020] Figure 7 It is a cross-sectional view of a rotating mechanism and a negative pressure generating mechanism of a wafer rotating processing device of the present invention.

[0021] Figure 8 It is a cross-sectional view of a limiting mechanism of a wafer rotation processing device of the present invention.

[0022] Fig. 9 The present invention is a schematic structural diagram of a protection mechanism for a wafer rotation processing device.

[0023] Fig.10 The present invention is a schematic structural diagram of a wafer rotation processing device lifting mechanism and a positioning mechanism.

[0024] Fig.11 It is a cross-sectional view of a lifting mechanism and a positioning mechanism of a wafer rotation processing device of the present invention.

[0025] Fig.12 It is an exploded view of a lifting mechanism and a positioning mechanism of a wafer rotating processing device of the present invention.

[0026] Fig.13 It is a structural schematic diagram of a positioning mechanism of a wafer rotation processing device of the present invention.

[0027] Fig.14 It is a structural schematic diagram of a wafer rotation processing device holder of the present invention.

[0028] As shown in the figure: 01, wafer; 1, shell; 2, rotating mechanism; 3, negative pressure generating mechanism; 4, limiting mechanism; 5, protection mechanism; 6, lifting mechanism; 7, positioning mechanism; 8, motor 1; 11, limiting groove; 12, holding table; 21, rotating table; 22, rotating shaft; 221, limiting ring; 23, gear 1; 24, negative pressure ring cavity; 25, connecting groove; 26, sliding cavity 1; 27, sliding cavity 2; 28, vent; 29, slot; 31, mounting plate; 311, sliding groove 1; 312, sliding groove 2; 32, arc plate; 321, ball bearing; 41, plug rod; 42, spring 1; 43, unlocking table; 44, stop plate; 45, Spring 2; 51, piston; 511, threaded column; 52, positioning platform; 521, retaining ring; 522, ventilation groove; 61, cylinder; 62, lifting ring platform; 621, connecting platform; 622, limiting plate; 623, rotating groove; 624, drainage hole; 63, transmission plate; 631, wing plate; 632, pushing platform; 633, pulling plate; 71, motor 2; 711, gear 2; 72, rotating ring; 721, vortex groove; 722, gear ring; 73, clamp; 731, moving platform; 732, driving platform; 733, clamping plate; 734, sliding rod; 735, spring 3; 81, gear 3; 82, gear 4; 83, gear 5. DETAILED DESCRIPTION

[0029] The present invention is further described in detail below in conjunction with the accompanying drawings.

[0030] Combined with Figure 1 , Attachment Figure 2 , Attachment Figure 3 and attached Figure 5 As shown, a wafer rotation processing device includes a shell 1, on which a rotating mechanism 2 for driving a wafer 01 to rotate is provided, and a motor 8 for driving the rotating mechanism 2 to rotate is provided in the shell 1, and the rotating mechanism 2 includes a rotating table 21, and a multi-layer negative pressure ring cavity 24 is provided on the top of the rotating table 21, and the negative pressure ring cavities 24 are connected through connecting grooves 25, and a negative pressure generating mechanism 3 that can be raised and lowered is provided at the bottom of the rotating table 21, and a lifting mechanism 6 is provided in the shell 1, and the lifting mechanism 6 drives the negative pressure generating mechanism 3 to complete the lifting action, and a positioning mechanism 7 is provided on the top of the lifting mechanism 6, and the positioning mechanism 7 clamps the wafer 01 in the radial direction of the axis so that the axis of the wafer 01 coincides with the axis of the rotating table 21.

[0031] Combined with Figure 6 , Attachment Figure 7 , Attachment Figure 8 and attached Fig.12 As shown, the negative pressure generating mechanism 3 includes a mounting plate 31, a plurality of arc plates 32 are evenly arranged on the top of the mounting plate 31, a ball 321 is arranged in the ball groove on the top of the arc plate 32, a sliding cavity 26 that slidably cooperates with the arc plate 32 is arranged in the negative pressure ring cavity 24, a limiting mechanism 4 is arranged inside the mounting plate 31, and the limiting mechanism 4 includes an insertion rod 41 and an unlocking platform 43, the insertion rod 41 is slidably arranged in a sliding groove 311 radially arranged inside the mounting plate 31, and the front end of the insertion rod 41 is aligned with the insertion groove 311 on the inner side of the bottom of the rotating platform 21. The groove 29 is plug-in compatible, a spring 1 42 is provided at the rear end of the insertion rod 41, and the unlocking platform 43 is slidably arranged in the sliding groove 2 312 axially arranged inside the mounting plate 31. The inclined surface on the unlocking platform 43 slides with the inclined surface at the middle through hole of the insertion rod 41. A butt plate 44 is provided at the bottom of the unlocking platform 43, and a spring 2 45 is provided between the butt plate 44 and the bottom of the mounting plate 31. The butt plate 44 contacts and cooperates with the top of the lifting ring platform 62. After the insertion rod 41 is separated from the slot 29, the push platform 632 contacts with the bottom of the mounting plate 31.

[0032] The working principle of the negative pressure generating mechanism 3 and the limiting mechanism 4 is as follows: the wafer 01 is placed on the top of the mounting plate 31. After the center is positioned by the positioning mechanism 7, the mounting plate 31 is driven to descend by the lifting mechanism 6. The arc plate 32 descends with the mounting plate 31, and the arc plate 32 descends in the slide cavity 26, thereby generating negative pressure in the negative pressure ring cavity 24, and the wafer 01 is adsorbed and fixed on the mounting plate 31. During the descending process of the mounting plate 31, after the slide groove 311 is aligned with the slot 29, the insertion rod 41 in the slide groove 311 is inserted into the slot 29 under the push of the spring 42, so that the mounting plate 31 is fixed in position, thereby stabilizing the negative pressure in the negative pressure ring cavity 24. When the lifting ring platform 62 and the transmission plate 63 of the lifting mechanism 6 rise, the transmission plate 63 first contacts the abutment plate 44, pushing the unlocking platform 43 to rise, and the inclined surface of the unlocking platform 43 slides with the inclined surface at the middle through hole of the insertion rod 41 to push the insertion rod 41 to reset, so that the limit mechanism 4 is unlocked. At this time, the negative pressure generating mechanism 3 will rise a distance due to the negative pressure. After the transmission plate 63 continues to rise, the pushing platform 632 contacts the bottom of the mounting plate 31, pushing the mounting plate 31 and the arc plate 32 to rise, and the ball on the top of the arc plate 32 contacts the back of the wafer 01 and pushes the wafer 01 to rise, which is convenient for workers to take it away, the robot to transfer it, and the positioning of the positioning mechanism 7.

[0033] Combined with Figure 7 and attached Fig. 9As shown, a protection mechanism 5 is provided on the rotating table 21, and the protection mechanism 5 includes a piston 51 and a positioning platform 52. A sliding cavity 27 is provided in the negative pressure ring cavity 24. The piston 51 and the positioning platform 52 are slidably arranged in the sliding cavity 27. A threaded column 511 is provided at the bottom of the piston 51, and a threaded hole matching the threaded column 511 is provided at the top of the positioning platform 52. A retaining ring 521 is provided on the outer side of the bottom of the positioning platform 52, and the retaining ring 521 is clamped with the groove on the inner side of the sliding cavity 27. A ventilation groove 522 is provided on the side of the positioning platform 52, and a ventilation hole 28 that passes through the rotating table 21 is provided at the bottom of the sliding cavity 27.

[0034] Working principle of protection mechanism 5: In order to avoid excessive negative pressure in the negative pressure ring cavity 24 and damage to wafer 01, protection mechanism 5 needs to adjust the preset negative pressure value and the negative pressure protection when the negative pressure exceeds the critical value. According to the size and model of wafer 01, before installing wafer 01, the position of piston 51 in sliding cavity 27 is adjusted by rotating piston 51. Since the descending amount of arc plate 32 is fixed, the negative pressure space size is adjusted by adjusting the height of piston 51. When piston 51 is at a high position, the negative pressure space is small and the negative pressure generated becomes smaller, otherwise it becomes larger. Through the ventilation groove 522 and the ventilation hole 28, an air pressure difference is generated on the upper and lower sides of piston 51, and protection mechanism 5 is subjected to an upward force. After the negative pressure exceeds the critical value, the retaining ring 521 disengages from the inner groove of sliding cavity 27, thereby causing piston 51 to rise, reducing the negative pressure space, thereby reducing the negative pressure value and protecting wafer 01.

[0035] Combined with Figure 3 , Attachment Fig.10 , Attachment Fig.11 and attached Fig.12 As shown, the lifting mechanism 6 includes a cylinder 61 and a lifting ring platform 62. The output end of the cylinder 61 is connected to the lifting ring platform 62. The lifting ring platform 62 is slidably arranged on the outside of the rotating table 21. A connecting platform 621 is provided at the bottom of the lifting ring platform 62. A limit plate 622 is provided on the outside of the connecting platform 621. A limit groove 11 matching the limit plate 622 is provided on the inside of the shell 1. A transmission plate 63 is provided on the inside of the connecting platform 621. A wing plate 631 connected to the connecting platform 621 is provided on the outside of the transmission plate 63. A push platform 632 is provided on the top of the transmission plate 63. The push platform 632 contacts and cooperates with the bottom of the mounting plate 31. A pull plate 633 is provided on the top of the lifting ring platform 62. The pull plate 633 contacts and cooperates with the groove at the top of the mounting plate 31.

[0036] Working principle of the lifting mechanism 6: the cylinder 61 pushes the lifting ring table 62 to rise and fall, and the transmission plate 63 moves with the lifting ring table 62. When the transmission plate 63 rises, it will cooperate with the limit mechanism 4 through the transmission plate 63 to unlock the limit mechanism 4. Then the push platform 632 pushes the mounting plate 31 and the arc plate 32 to rise, so that the arc plate 32 lifts the wafer 01. When the lifting ring table 62 descends, the pulling plate 633 cooperates with the groove on the top of the mounting plate 31 to pull the mounting plate 31 down.

[0037] Combined with Fig.11 , Attachment Fig.12 , Attachment Fig.13 and attached Fig.14 As shown, the positioning mechanism 7 includes a second motor 71, a rotating ring 72 and a clamp 73. The second motor 71 is arranged in the lifting ring platform 62. The rotating ring 72 rotates in the rotating groove 623 inside the lifting ring platform 62. The output end of the second motor 71 is provided with a second gear 711. The bottom of the rotating ring 72 is provided with a gear ring 722 meshing with the second gear 711. The clamp 73 slides radially on the lifting ring platform 62. The lifting ring platform 62 drives the clamp 73 to move radially. The outer side of the lifting ring platform 62 is provided with a gear connected to the rotating groove 623. A liquid discharge hole 624 is connected, and a liquid blocking boss is provided inside the rotating groove 623 near the gear two 711. The clamper 73 includes a moving platform 731, a spiral groove 721 is provided on the top of the rotating ring 72, a driving platform 732 matched with the spiral groove 721 is provided at the bottom of the moving platform 731, a clamping plate 733 is provided on the front side of the moving platform 731, a sliding rod 734 is provided on the rear side of the clamping plate 733, the sliding rod 734 is slidably matched with the through hole on the moving platform 731, and a spring three 735 is provided on the outer side of the moving platform 731.

[0038] Working principle of positioning mechanism 7: after the lifting ring table 62 rises to a certain position, wafer 01 is lifted up by arc plate 32 and does not contact with rotating table 21. During positioning, motor 2 71 drives gear 2 711 to rotate, and gear 2 711 is meshed with gear ring 722 to rotate rotating ring 72, and cooperates with driving table 732 through vortex groove 721 to make moving table 731 move radially. When moving table 731 approaches wafer 01, clamping plate 733 contacts the edge of wafer 01, pushing wafer 01 to move on ball bearing 321 at the top of arc plate 32 until wafer contacts multiple clamping plates 733, so that the axis of wafer 01 coincides with the axis of rotating table 21. After positioning, positioning mechanism 7 is reset and descends with lifting ring table 62. At least 4 groups of clamps 73 are provided to avoid the influence of positioning and trimming of wafer 01 on positioning.

[0039] Combined with Figure 2 and attached Figure 4 As shown, a rotating shaft 22 is provided at the bottom of the rotating table 21, a limiting ring 221 is provided on the rotating shaft 22, a retaining table 12 which is rotatably matched with the limiting ring 221 is provided on the inner side of the shell 1, a gear 23 is provided at the bottom of the rotating shaft 22, the output end of the motor 8 is matched with the gear 23 through a gear set, a gear 3 81 is provided at the output end of the motor 8, and a coaxially connected gear 4 82 and a gear 5 83 are rotatably provided in the shell 1, the gear 3 81 is meshed with the gear 4 82, and the gear 5 83 is meshed with the gear 23.

[0040] The working principle of rotation of the rotating table 21 is as follows: the motor 1 8 drives the gear 3 81 to rotate, and the gear 3 81 is meshed with the gear 4 82 to make the gear 4 82 rotate, driving the gear 5 83 coaxially connected with the gear 4 82 to rotate, and the gear 5 83 is meshed with the gear 1 23 to make the rotating shaft 22 rotate, driving the rotating table 21 to rotate, and the negative pressure generating mechanism 3, the limiting mechanism 4 and the protection mechanism 5 rotate with the rotating table 21.

[0041] During the specific implementation of the present invention, during the wafer 01 installation stage, the lifting ring table 62 rises, and the negative pressure generating mechanism 3 rises accordingly, and the wafer 01 is placed on the arc plate 32, and the wafer is positioned by the positioning mechanism 7. After the positioning is completed, the positioning mechanism 7 and the lifting mechanism 6 are reset. During the descent of the lifting ring table 62, the negative pressure generating mechanism 3 is driven to descend, so that the wafer 01 falls on the rotating table 21 and the negative pressure ring cavity 24 generates negative pressure, and the wafer 01 is fixed on the rotating table 21. During this process, the wafer 01 is protected by the protection mechanism 5 to prevent excessive negative pressure from damaging the wafer 01. The mounting plate 31 is fixed by the limiting mechanism 4, and then the lifting ring table 62 rises a distance again, so that the transmission plate 63 does not contact the mounting plate 31, and then the motor 8 drives the rotating table 21 to rotate, driving the wafer 01 to rotate, and the wafer 01 is processed; This device can be installed separately in deposition equipment, cleaning equipment, polishing equipment to replace the rotating mechanism of the equipment, or installed on a multi-axis manipulator. In an integrated processing space, the device can be clamped by the manipulator to transfer wafer 01 for processing in multiple devices. This device can also adopt a split process to set fixed points, positioning points and power contacts on the outside of the shell 1, and use this device as a transfer mechanism, rotation mechanism and positioning mechanism.

[0042] The present invention and its embodiments are described above, which is not restrictive. The drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. In short, if ordinary technicians in the field are inspired by it and do not deviate from the purpose of the invention, they can creatively design a structure and embodiment similar to the technical solution, which should fall within the protection scope of the present invention.

Claims

1. A wafer rotation processing device, comprising a housing (1), a rotating mechanism (2) for driving a wafer (01) to rotate is disposed on the housing (1), and a motor (8) for driving the rotating mechanism (2) to rotate is disposed in the housing (1), characterized in that: The rotating mechanism (2) comprises a rotating table (21), a top of the rotating table (21) is provided with a plurality of negative pressure annular cavities (24), the negative pressure annular cavities (24) are connected to each other via a connecting groove (25), a bottom of the rotating table (21) is provided with a negative pressure generating mechanism (3) that can be raised and lowered, the negative pressure generating mechanism (3) comprises a mounting plate (31), a top of the mounting plate (31) is evenly provided with a plurality of arc-shaped plates (32), and a sliding cavity (26) that slidably cooperates with the arc-shaped plates (32) is provided in the negative pressure annular cavity (24); A lifting mechanism (6) is provided in the shell (1), and the lifting mechanism (6) comprises a cylinder (61) and a lifting ring platform (62). The output end of the cylinder (61) is connected to the lifting ring platform (62), and the lifting ring platform (62) is slidably arranged outside the rotating table (21). The lifting ring platform (62) drives the negative pressure generating mechanism (3) to complete the lifting action. A positioning mechanism (7) is provided on the top of the lifting ring platform (62), and the positioning mechanism (7) clamps the wafer (01) in a radial direction through the axis so that the axis of the wafer (01) coincides with the axis of the rotating table (21).

2. The wafer rotation processing device according to claim 1, characterized in that: A limiting mechanism (4) is provided inside the mounting plate (31), the limiting mechanism (4) comprising an insert rod (41) and an unlocking platform (43), the insert rod (41) being slidably disposed in a first slide groove (311) radially disposed inside the mounting plate (31), the front end of the insert rod (41) being plugged into a slot (29) on the inner side of the bottom of the rotating platform (21), the rear end of the insert rod (41) being provided with a first spring (42), the unlocking platform (43) being slidably disposed in a second slide groove (312) axially disposed inside the mounting plate (31), the inclined surface on the unlocking platform (43) being slidably engaged with the inclined surface at the middle through hole of the insert rod (41).

3. The wafer rotation processing device according to claim 1, characterized in that: The rotating table (21) is provided with a protection mechanism (5), the protection mechanism (5) comprising a piston (51) and a positioning platform (52), a second sliding chamber (27) is provided in the negative pressure ring chamber (24), the piston (51) and the positioning platform (52) are slidably arranged in the second sliding chamber (27), a threaded column (511) is provided at the bottom of the piston (51), a threaded hole matching the threaded column (511) is provided at the top of the positioning platform (52), a clamping ring (521) is provided at the outside of the bottom of the positioning platform (52), the clamping ring (521) is clamped with a groove on the inner side of the second sliding chamber (27), a ventilation groove (522) is provided on the side of the positioning platform (52), and a ventilation hole (28) penetrating the rotating table (21) is provided at the bottom of the second sliding chamber (27).

4. The wafer rotation processing device according to claim 2, characterized in that: The bottom of the lifting ring platform (62) is provided with a connecting platform (621), the inner side of the connecting platform (621) is provided with a transmission plate (63), the outer side of the transmission plate (63) is provided with a wing plate (631) connected to the connecting platform (621), the top of the transmission plate (63) is provided with a push platform (632), the push platform (632) is in contact with the bottom of the mounting plate (31), and the top of the lifting ring platform (62) is provided with a pull plate (633), the pull plate (633) is in contact with a groove at the top of the mounting plate (31).

5. The wafer rotation processing device according to claim 4, characterized in that: A stop plate (44) is provided at the bottom of the unlocking platform (43), and a second spring (45) is provided between the stop plate (44) and the bottom of the mounting plate (31). The stop plate (44) is in contact with the top of the lifting ring platform (62), and after the insertion rod (41) is separated from the slot (29), the push platform (632) is in contact with the bottom of the mounting plate (31).

6. The wafer rotation processing device according to claim 1, characterized in that: The positioning mechanism (7) comprises a second motor (71), a rotating ring (72) and a clamp (73); the second motor (71) is arranged in the lifting ring platform (62); the rotating ring (72) rotates in a rotating groove (623) arranged inside the lifting ring platform (62); a second gear (711) is arranged at the output end of the second motor (71); a gear ring (722) meshing with the second gear (711) is arranged at the bottom of the rotating ring (72); the clamp (73) radially slides on the lifting ring platform (62); and the lifting ring platform (62) drives the clamp (73) to move radially.

7. The wafer rotation processing device according to claim 6, characterized in that: The clamp (73) comprises a moving platform (731), a vortex groove (721) is provided on the top of the rotating ring (72), a driving platform (732) matched with the vortex groove (721) is provided on the bottom of the moving platform (731), a clamping plate (733) is provided on the front side of the moving platform (731), a sliding rod (734) is provided on the rear side of the clamping plate (733), the sliding rod (734) is slidably matched with a through hole on the moving platform (731), and a spring three (735) is provided on the outer side of the moving platform (731).

8. The wafer rotation processing device according to claim 1, characterized in that: A rotating shaft (22) is provided at the bottom of the rotating platform (21), a limiting ring (221) is provided on the rotating shaft (22), a retaining platform (12) rotatably matched with the limiting ring (221) is provided on the inner side of the housing (1), a gear one (23) is provided at the bottom of the rotating shaft (22), and an output end of the motor one (8) is transmission-matched with the gear one (23) via a gear set.

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