Micro-nano level wafer processing and detection precision motion platform

Abstract

The invention relates to the technical field of micro-nano precision motion, and particularly discloses a micro-nano wafer processing and detection precision motion platform, which comprises a base, a rotating module and a plurality of lifting leveling modules, the lifting leveling module comprises a horizontal driver, a first wedge block, a second wedge block and a spherical bearing; the first wedge block is slidably connected with the base in the horizontal direction. The horizontal driver is arranged on the base and is connected with the first wedge block; the second wedge block is slidably connected with the base in the vertical direction and is in wedge fit with the first wedge block. The spherical bearing is arranged on the second wedge block; the rotating module comprises a carrier plate, a wafer washing disc and a linear driver; the carrier plate is arranged on the plurality of lifting leveling module spherical bearings; the wafer washing disc is rotatably arranged on the carrier plate; the linear driver is arranged on the carrier plate, connected with the wafer washing disc and used for driving the wafer washing disc to rotate through linear motion. The motion platform provided by the scheme can realize high-precision leveling and deviation correction operation in wafer processing, detection and repair.

Description

Technical Field

[0001] The present application relates to the field of micro-nano precision motion technology, and in particular to a micro-nano wafer processing and detection precision motion platform. Background Art

[0002] As electronic products develop towards miniaturization, flexibility and 3D integration, the characteristics of high chip density (>104 / mm2) and thinness are becoming more and more prominent. However, the existing semiconductor manufacturing method of increasing integration by reducing feature size (<7nm) is gradually approaching its physical limit.

[0003] In display semiconductor chips such as Mini / Micro LED, there are a large number of micro-nano chip processing, detection, and repair processes. In order to meet the precision requirements in the above processes, laser mass processing technology is commonly used.

[0004] During the process of mass laser transfer and welding packaging of chips, there will be a certain degree of offset, tilt and misalignment between the dense Mini / Micro LED chip array in the upper board and the display panel circuit below, resulting in transfer failure and chip interconnection failure, which directly affects the product performance.

[0005] In order to reduce the offset between the chip array and the display panel circuit, traditional positioning platforms generally use built-in capacitive sensors for position closed-loop feedback. However, the detection distance of capacitive displacement sensors is limited (<400μm), and the object to be detected must be metal, which has limitations in use. Summary of the invention

[0006] In view of this, the purpose of this application is to provide a micro-nano wafer processing and detection precision motion platform to solve the problem that the existing method of reducing the offset between the chip array and the display panel circuit has large limitations and poor accuracy.

[0007] In order to achieve the above technical objectives, the present application provides a micro-nano wafer processing and detection precision motion platform, including: a base, a rotation module and a plurality of lifting and leveling modules;

[0008] The lifting and leveling module comprises: a horizontal driver, a first wedge block, a second wedge block and a spherical bearing;

[0009] The first wedge block is slidably connected to the base in a horizontal direction;

[0010] The horizontal driver is disposed on the base and connected to the first wedge block, and is used to push the first wedge block to slide;

[0011] The second wedge block is slidably connected to the base in a vertical direction and is wedge-matched with the first wedge block;

[0012] The spherical bearing is arranged on the second wedge;

[0013] The rotating module includes: a carrier plate, a wafer washing plate and a linear drive;

[0014] The carrier plate is arranged on the spherical bearings of the plurality of lifting and leveling modules;

[0015] The wafer washing plate can be rotatably disposed on the carrier plate;

[0016] The linear driver is disposed on the carrier plate and connected to the wafer washing plate, and is used for driving the wafer washing plate to rotate through linear motion.

[0017] Furthermore, the spherical bearings in the plurality of lifting and leveling modules are evenly distributed around the carrier plate in a circumference.

[0018] Furthermore, the lifting and leveling modules include three.

[0019] Furthermore, the rotating module further comprises a spring pre-compression mechanism;

[0020] The spring preload mechanism is disposed on the carrier plate and abuts against the wafer washing plate, and is used for applying an elastic force opposite to the rotation direction to the wafer washing plate when the wafer washing plate rotates.

[0021] Furthermore, the lifting and leveling module further comprises: a flexible support sheet;

[0022] The flexible support sheet is slidably disposed on the first wedge block along the inclined direction of the inclined surface of the first wedge block, and is elastically connected to the first wedge block;

[0023] The second wedge block is arranged on the flexible supporting sheet.

[0024] Furthermore, two sides of the flexible support sheet are connected to the first wedge block via two springs respectively to form a dual parallel flexible structure.

[0025] Furthermore, the flexible support sheet is provided with a guide rail for the second wedge to be slidably placed.

[0026] Furthermore, the linear drive is a voice coil motor.

[0027] Furthermore, the rotating module further comprises: an air bearing;

[0028] The air bearing is arranged on the carrier plate;

[0029] The wafer washing plate is arranged on the air bearing.

[0030] Furthermore, the rotating module further comprises: a backing plate and a rotating plate;

[0031] The rotating plate is arranged on the air bearing;

[0032] The backing plate is arranged on the rotating plate;

[0033] The wafer washing plate is arranged on the pad.

[0034] It can be seen from the above technical scheme that the present application provides a micro-nano wafer processing and detection precision motion platform, including: a base, a rotation module and multiple lifting and leveling modules; the lifting and leveling module includes: a horizontal driver, a first wedge, a second wedge and a spherical bearing; the first wedge is slidably connected to the base in a horizontal direction; the horizontal driver is arranged on the base and connected to the first wedge, used to push the first wedge to slide; the second wedge is slidably connected to the base in a vertical direction, and cooperates with the first wedge oblique wedge; the spherical bearing is arranged on the second wedge; the rotation module includes: a carrier plate, a wafer washing disk and a linear driver; the carrier plate is arranged on the spherical bearings of the multiple lifting and leveling modules; the wafer washing disk is rotatably arranged on the carrier plate; the linear driver is arranged on the carrier plate and connected to the wafer washing disk, used to drive the wafer washing disk to rotate through linear motion.

[0035] The lifting and leveling module can convert the horizontal motion of the horizontal drive into vertical motion to achieve the leveling of the carrier in the vertical direction; the linear drive can drive the wafer washing plate to rotate to achieve the rotation of the wafer washing plate in the vertical direction. The micro-nano wafer processing and detection precision motion platform provided by this solution can achieve high-precision leveling and deviation correction operations in wafer processing, detection and repair, reduce linear coupling phenomena, and is not limited by the detection distance and the material of the detection object. It can effectively solve the problem that the existing method of reducing the offset between the chip array and the display panel circuit is limited and has poor accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0037] Figure 1 A schematic diagram of the overall structure of a micro-nano wafer processing and detection precision motion platform provided in an embodiment of the present application;

[0038] Figure 2A schematic diagram of a micro-nano wafer processing and detection precision motion platform provided in an embodiment of the present application with a rotation module removed;

[0039] Figure 3 A schematic diagram of a lifting and leveling module in a micro-nano wafer processing and detection precision motion platform provided in an embodiment of the present application;

[0040] Figure 4 Another schematic diagram of a lifting and leveling module in a micro-nano wafer processing and detection precision motion platform provided in an embodiment of the present application;

[0041] Figure 5 A schematic diagram of a first wedge in a micro-nano wafer processing and detection precision motion platform provided in an embodiment of the present application;

[0042] Figure 6 A schematic diagram of a rotation module of a micro-nano wafer processing and detection precision motion platform provided in an embodiment of the present application;

[0043] Figure 7 A schematic diagram of the connection structure between a wafer washing plate and a rotary plate of a micro-nano wafer processing and detection precision motion platform provided in an embodiment of the present application;

[0044] Figure 8 A schematic diagram of a carrier plate of a micro-nano wafer processing and detection precision motion platform provided in an embodiment of the present application. DETAILED DESCRIPTION

[0045] The technical solutions of the embodiments of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the specification of the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection requested by the present application.

[0046] In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0047] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a replaceable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0048] See also Figures 1 to 4 A micro-nano wafer processing and detection precision motion platform provided in an embodiment of the present application includes: a base 10, a rotation module 30 and a plurality of lifting and leveling modules 20; the lifting and leveling module 20 includes: a horizontal driver 21, a first wedge 22, a second wedge 23 and a spherical bearing 24; the first wedge 22 is slidably connected to the base 10 in a horizontal direction; the horizontal driver 21 is arranged on the base 10 and connected to the first wedge 22, used to push the first wedge 22 to slide; the second wedge 23 is slidably connected to the base 10 in a vertical direction, and is wedge-matched with the first wedge 22; the spherical bearing 24 is arranged on the second wedge 23; the rotation module 30 includes: a carrier plate 31, a wafer washing plate 32 and a linear driver 33; the carrier plate 31 is arranged on the spherical bearings 24 of the plurality of lifting and leveling modules 20; the wafer washing plate 32 is rotatably arranged on the carrier plate 31; the linear driver 33 is arranged on the carrier plate 31 and connected to the wafer washing plate 32, used to drive the wafer washing plate 32 to rotate through linear motion.

[0049] Specifically, the lifting and leveling module 20 further includes a bottom plate 28 and a vertical plate 29; the bottom plate 28 is fixed on the base 10; the vertical plate 29 is fixed on the bottom plate 28 and is perpendicular to the bottom plate 28. The bottom plate 28 and the vertical plate 29 may both be provided with guide rails 27; the first wedge block 22 may be slidably provided on the guide rails 27 on the bottom plate 28; and the second wedge block 23 may be slidably provided on the guide rails 27 on the vertical plate 29.

[0050] The horizontal driver 21 may be a stepper motor, and is connected to the first wedge 22 via a screw rod. In this solution, the base 10 is horizontally placed for illustration, and the vertical direction is the Z-axis direction, and correspondingly, the X and Y directions are directions on the horizontal plane.

[0051] In application, the linear drive 33 can be a voice coil motor. The lifting and leveling module 20 in this embodiment can drive the carrier 31 to move vertically along the Z-axis direction and to offset relative to the horizontal plane; the rotating module 30 can drive the wafer washing plate 32 to rotate. Multiple lifting and leveling modules 20 can adjust the relative position of the carrier 31 and the base 10 from multiple directions. In conjunction with the rotating module 30, a multi-degree-of-freedom leveling and correction device can be used to drive the wafer on the wafer washing plate 32 to translate in the Z direction, deflect around X and Y rotations, and rotate around Z. At the same time, in this embodiment, the above-mentioned correction movement is completed by the horizontal drive 21 and the linear drive 33, which can effectively reduce the linear coupling phenomenon and meet the requirements of large stroke and high precision.

[0052] It should be noted that, in this embodiment, a spherical bearing 24 is also used to connect the second wedge block 32 and the carrier plate 31, which can increase the degree of freedom and leveling accuracy during the leveling process.

[0053] In practical applications, the plurality of lifting and leveling modules 20 may be distributed on the base 10 in a matrix, an isosceles triangle, or the like.

[0054] In this embodiment, in order to ensure that the carrier plate 32 is subjected to uniform force at all angles, the spherical bearings 24 in the plurality of lifting and leveling modules 20 are evenly distributed around the carrier plate 31 in a circumferential manner.

[0055] Taking the case where there are three lifting and leveling modules 20 as an example, the three lifting and leveling modules 20 are distributed in an equilateral triangle.

[0056] Correspondingly, see Figure 8 The carrier plate 31 may be provided with three extension plates for the three spherical bearings 24 to connect.

[0057] In one embodiment, see Figure 5 The lifting and leveling module 20 also includes: a flexible support sheet 25; the flexible support sheet 25 is slidably disposed on the first wedge block 22 along the inclined direction of the inclined surface of the first wedge block 22, and is elastically connected to the first wedge block 22; the second wedge block 23 is disposed on the flexible support sheet 25.

[0058] The flexible support sheet 25 is driven by the piezoelectric ceramic 210 on the first wedge block 22. It has a certain degree of flexibility and can move linearly along the driving direction of the piezoelectric ceramic 210, that is, the inclined direction of the first wedge block 22. The flexible support sheet 25 can improve the overall motion accuracy of the precision motion platform and provide a flexible guide for the second wedge block 23.

[0059] In a further improved embodiment, the two sides of the flexible support sheet 25 are connected to the first wedge block 22 via two springs 26 to form a dual-parallel flexible structure, which can ensure uniform force on both sides of the flexible support sheet 25 during linear movement.

[0060] At the same time, the flexible support sheet 25 may also be provided with a guide rail 27 for the second wedge block 23 to be slidably placed.

[0061] In another embodiment, see Figures 6 to 8 The rotating module 30 also includes a spring preload mechanism 34 ; the spring preload mechanism 34 is disposed on the carrier plate 31 and abuts against the wafer washing plate 32 , and is used to apply an elastic force opposite to the rotation direction to the wafer washing plate 32 when the wafer washing plate 32 rotates.

[0062] by Figure 8 Taking the direction shown as an example, the linear drive 33 is used to push the wafer washing plate 32 to rotate clockwise; during the clockwise rotation of the wafer washing plate 32, the spring preload mechanism 34 is compressed. When the wafer washing plate 32 needs to rotate counterclockwise, the linear drive 33 retracts, and the spring preload mechanism 34 applies a thrust to the carrier plate 31 to rotate counterclockwise, thereby controlling the wafer washing plate 32 to rotate around the z-axis with high precision Theta.

[0063] The rotating module 30 may further include: an air bearing 35 ; the air bearing 35 is disposed on the carrier plate 31 ; and the wafer washing plate 32 is disposed on the air bearing 35 .

[0064] That is, the carrier plate 31 is rotatably connected to the wafer washing plate 32 via the air bearing 35 .

[0065] Furthermore, the rotating module 30 further includes: a pad 36 and a rotating plate 37 ; the rotating plate 37 is disposed on the air bearing 35 ; the pad 36 is disposed on the rotating plate 37 ; and the wafer washing plate 32 is disposed on the pad 36 .

[0066] Specifically, the rotating plate 37 is used to cooperate with the air bearing 35; and the pad 36 is used to play a buffering role.

[0067] A linear encoder 41 connected to the second wedge block 23 may be provided on the vertical plate 29 ; and an arc encoder 42 connected to the wafer washing plate 32 may be provided on the air bearing 35 .

[0068] In an embodiment including three lifting and leveling modules 20, the motion platform includes three linear encoders 41, three piezoelectric ceramics 210, three horizontal drivers 21, a linear driver 33 and an arc encoder 42, which together constitute a seven-axis motion control system; wherein, the three linear encoders 41 are used to detect the lifting distance of the three second wedge blocks 23; the arc encoder 42 is used to detect the rotation distance of the wafer washing plate 32 relative to the carrier 31; the three linear encoders 41 and the arc encoder 42 jointly detect the rotation distance of the wafer washing plate 32 around the X, Y and Z axes and the translation distance along the Z axis, and then feed back the detection results to the control end, and the control end receives the feedback to control the three horizontal drivers 21 and the linear driver 33 to start motion compensation, and finally realizes a closed-loop travel motion, realizes a seven-axis control system based on grating feedback for micro-nano wafer processing, detection and repair precision operations, and realizes high-precision detection and alignment operations.

[0069] The above are only preferred embodiments of the present application and are not intended to limit the present invention. Although the present application has been described in detail with reference to the examples, those skilled in the art can still modify the technical solutions recorded in the aforementioned examples or make equivalent substitutions for some of the technical features therein. However, any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A micro-nano wafer processing and detection precision motion platform, characterized in that: include: A base (10), a rotating module (30), and a plurality of lifting and leveling modules (20); The lifting and leveling module (20) comprises: a horizontal driver (21), a first wedge block (22), a second wedge block (23) and a spherical bearing (24); The first wedge (22) is slidably connected to the base (10) in a horizontal direction; The horizontal driver (21) is disposed on the base (10) and connected to the first wedge block (22), and is used to push the first wedge block (22) to slide; The second wedge block (23) is slidably connected to the base (10) in a vertical direction and is in oblique wedge cooperation with the first wedge block (22); The spherical bearing (24) is arranged on the second wedge block (23); The rotating module (30) comprises: a carrier plate (31), a wafer washing plate (32) and a linear drive (33); The carrier plate (31) is arranged on the spherical bearings (24) of the plurality of lifting and leveling modules (20); The wafer washing plate (32) is rotatably arranged on the carrier plate (31); The linear drive (33) is arranged on the carrier plate (31) and is connected to the wafer washing plate (32) and is used to drive the wafer washing plate (32) to rotate through linear motion.

2. The micro-nano wafer processing and detection precision motion platform according to claim 1, characterized in that: The spherical bearings (24) in the plurality of lifting and leveling modules (20) are evenly distributed around the carrier plate (31) in a circumferential manner.

3. The micro-nano wafer processing and detection precision motion platform according to claim 2, characterized in that: The lifting and leveling modules (20) include three.

4. The micro-nano wafer processing and detection precision motion platform according to claim 1, characterized in that: The rotating module (30) further comprises a spring pre-compression mechanism (34); The spring preload mechanism (34) is arranged on the carrier plate (31) and abuts against the wafer washing plate (32), and is used for applying an elastic force opposite to the rotation direction to the wafer washing plate (32) when the wafer washing plate (32) rotates.

5. The micro-nano wafer processing and detection precision motion platform according to claim 1, characterized in that: The lifting and leveling module (20) further comprises: a flexible support sheet (25); The flexible support sheet (25) is slidably disposed on the first wedge block (22) along the inclined direction of the inclined surface of the first wedge block (22), and is elastically connected to the first wedge block (22); The second wedge block (23) is arranged on the flexible support sheet (25).

6. The micro-nano wafer processing and detection precision motion platform according to claim 5, characterized in that: The two sides of the flexible support sheet (25) are connected to the first wedge block (22) via two spring sheets (26) respectively, so as to form a dual parallel flexible structure.

7. The micro-nano wafer processing and detection precision motion platform according to claim 6, characterized in that: The flexible support sheet (25) is provided with a guide rail (27) into which the second wedge block (23) can be slidably placed.

8. The micro-nano wafer processing and detection precision motion platform according to claim 1, characterized in that: The linear drive (33) is a voice coil motor.

9. The micro-nano wafer processing and detection precision motion platform according to claim 1, characterized in that: The rotating module (30) further comprises: an air bearing (35); The air bearing (35) is arranged on the carrier plate (31); The wafer washing plate (32) is arranged on the air bearing (35).

10. The micro-nano wafer processing and detection precision motion platform according to claim 9, characterized in that: The rotating module (30) further comprises: a backing plate (36) and a rotating plate (37); The rotating plate (37) is arranged on the air bearing (35); The backing plate (36) is arranged on the rotating plate (37); The wafer washing plate (32) is arranged on the pad (36).

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