Image sensor test system and test method

Abstract

The invention provides an image sensor test system and method, and the system comprises a test main system which comprises a test machine and a test load board, and is configured to receive a control instruction of a main control computer and transmit a test signal to a test subsystem; the main control computer is connected with the image acquisition and processing unit and the test main system and is configured to send the control instruction to the test main system; the test subsystem is connected with the image acquisition and processing unit, comprises a bright and dark field test module and is configured to perform bright and dark field test on the to-be-tested sensor through the bright and dark field test module; the image acquisition and processing unit comprises an image acquisition card, and the image acquisition card is configured to perform image data acquisition and calculation on the test subsystem and transmit a calculation result to the main control computer; and the switch control module is connected with the test subsystem and the image acquisition and processing unit and is used for providing a power supply and a test signal for the test subsystem and the image acquisition and processing unit.

Description

Technical Field

[0001] The present application relates to the field of semiconductor testing technology, and in particular to an image sensor testing system and testing method. Background Art

[0002] CMOS image sensor is a typical solid-state imaging device based on complementary metal-oxide-semiconductor (CMOS) technology. It has the advantages of low power consumption, high integration, and high reading speed. Therefore, it is widely used in smart phones, security monitoring, space exploration, automotive electronics and other fields. Among them, the imaging quality and optoelectronic performance of CMOS image sensors are the key indicators of CMOS image sensors and the performance that users focus on. Therefore, testing CMOS image sensors has become an important condition to ensure the quality of CMOS image sensors.

[0003] However, existing test systems have problems such as low test efficiency, insufficient test accuracy, and low applicability and cannot meet the complex and diverse test requirements of components. Summary of the invention

[0004] In view of this, the purpose of the present application is to provide an image sensor testing system and testing method.

[0005] Based on the above objectives, the present application provides an image sensor testing system, comprising:

[0006] The test main system, including a test machine and a test load board, is configured to receive control instructions from a main control computer and send test signals to the test subsystem;

[0007] A main control computer, connected to the image acquisition processing unit and the test main system, and configured to send the control instruction to the test main system;

[0008] A test subsystem, connected to the image acquisition processing unit, includes a bright and dark field test module, and is configured to perform a bright and dark field test on the sensor to be tested through the bright and dark field test module;

[0009] An image acquisition processing unit, comprising an image acquisition card, wherein the image acquisition card is configured to acquire and calculate image data for the test subsystem and transmit the calculation results to the main control computer;

[0010] The switch control module is connected to the test subsystem and the image acquisition processing unit, and is used to provide power and test signals to the test subsystem and the image acquisition processing unit.

[0011] Optionally, the test machine includes: a test board;

[0012] The test machine is also configured to receive communication instructions and control instructions from the main control computer, and provide power and send control signals to the test board according to the control instructions;

[0013] The test board is configured to receive power and control signals sent by the test machine, and send test information to the test load board according to the control signal.

[0014] Optionally, the test board includes: an IO board and a DPS board;

[0015] The IO board is configured to provide I / O control, clock signal, I 2 C protocol support and test vectors to ensure testing of the chip under test;

[0016] The DPS board is configured to provide a high-precision power supply for the sensor to be tested.

[0017] Optionally, the test module includes: a light source board and a darkroom;

[0018] Perform illumination tests of different intensities and different wavebands by using the light source panel;

[0019] The test was performed without illumination in the dark room.

[0020] Optionally, the test subsystem further includes: a socket board;

[0021] The socket board is connected to the test module, and is configured to fix the device under test, provide power and control signals for the device under test, and receive response signals from the device under test to ensure stable connection between the device under test and the system.

[0022] Optionally, the image acquisition card is further configured to acquire image data of the test subsystem and transmit the image data to the main control computer.

[0023] Optionally, the image acquisition and processing unit further includes: a slave computer;

[0024] The slave computer is connected to the image acquisition card and the master computer, and is configured to receive image data from the image acquisition card, calculate photoelectric performance parameters for the image data, and transmit the calculation results of the photoelectric performance parameters to the master computer.

[0025] Optionally, the switch control module includes: a relay board;

[0026] The relay board is connected to the light source board, the socket board and the image acquisition card, and is configured to automatically switch power and control signals and allocate resources to the test subsystem and the image acquisition processor through an FPGA module.

[0027] Optionally, the main control computer is connected to the test main system;

[0028] The master computer is also configured to receive the calculation results of the photoelectric performance parameters of the slave computer, analyze the calculation results of the photoelectric performance parameters, determine the test results, and generate a test report based on the test results.

[0029] Based on the same inventive concept, the embodiment of the present application further provides an image sensor testing method, including:

[0030] The test main system receives the test instruction from the main control computer and sends the test information to the switch control module according to the test instruction; wherein the test instruction includes a communication instruction and a control instruction;

[0031] A switch control module receives the test information and provides test resources and power to the test subsystem and the image acquisition processing unit through the FPGA according to the test information;

[0032] The test subsystem performs a light and dark field test on the sensor to be tested through a light and dark field test module according to the test resource to determine image information; wherein the image information is an image signal;

[0033] The image acquisition processing unit receives the image information, calculates the photoelectric performance parameters according to the image information, and sends the calculation results to the main control computer;

[0034] The main control computer receives the calculation result and analyzes the calculation result.

[0035] As can be seen from the above, the image sensor test system and test method provided by the present application adopt modular design, and the power supply and signal on / off are automatically controlled by the switch control module, so as to realize the dynamic allocation and rapid switching of test resources, and significantly improve the test efficiency; the coordination of the test main system, the switch control module and the image acquisition processing unit ensures the stable transmission of various signals, and improves the accuracy of image data acquisition through the decoding, caching and data processing functions of the image acquisition card; the light and dark field test module provides the test conditions under different temperature and light intensity environments for the sensor to be tested, which is suitable for testing the photoelectric performance of the image sensor under various temperature and light conditions, and improves the applicability of the test system. And it has the advantages of strong test compatibility and strong versatility. The present application adopts modular and integrated design, which can adapt to the test requirements of various models of CMOS image sensors, and only needs to replace a simple socket board and modify the test program, while the traditional test scheme needs to re-change the drive evaluation board, which has a long cycle and is difficult. The components of this system operate independently and cooperate with each other, with low maintenance cost and strong scalability, which is not only conducive to the installation and maintenance of the system, but also can quickly adjust the system when the demand changes or the technology is upgraded to meet the new test requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the present application or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0037] Figure 1 This is a schematic diagram of the structure of an image sensor testing system according to an embodiment of the present application;

[0038] Figure 2 Schematic diagram of the image sensor testing method according to an embodiment of the present application.

[0039] 1. Test main system; 101. Test machine; 1011. Test board; 102. Test load board; 2. Switch control module; 201. Relay board; 3. Test subsystem; 301. Darkroom; 3011. Light source board; 3012. Device to be tested (i.e. sensor to be tested); 3013. Socket board; 4. Image acquisition processing unit; 401. Image card (i.e. image acquisition card); 402. Slave computer; 5. Main control computer; 501. Host computer. DETAILED DESCRIPTION

[0040] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0041] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be the usual meanings understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0042] CMOS image sensor is a typical solid-state imaging device based on complementary metal-oxide-semiconductor (CMOS) technology. It has the advantages of low power consumption, high integration, and high reading speed. Therefore, it is widely used in smart phones, security monitoring, space exploration, automotive electronics and other fields. Among them, the imaging quality and optoelectronic performance of CMOS image sensors are the key indicators of CMOS image sensors and the performance that users focus on. Therefore, testing CMOS image sensors has become an important condition to ensure the quality of CMOS image sensors.

[0043] However, existing test systems have problems such as low test efficiency, insufficient test accuracy, and low applicability and cannot meet the complex and diverse test requirements of components.

[0044] Specifically, the existing traditional manual test methods are cumbersome, and the test accuracy is easily affected by human factors. The upgraded version of the automated test method still has serious deficiencies in the flexibility of signal switching, control and resource allocation. Therefore, the existing technology is difficult to meet the needs of efficient and high-precision testing; secondly, the traditional test methods and systems are basically based on large-diameter integrating sphere light sources and large darkrooms to provide lighting environments, and the device drive and image data acquisition are realized through targeted development of test boards. The test software and hardware are not universal and it is difficult to flexibly adapt to the test requirements of devices of different types and specifications, resulting in high upgrade and maintenance costs of the test system and poor universality. Thirdly, the data acquisition and processing of the existing traditional test methods are relatively complicated, and usually require step-by-step acquisition, transmission, storage, and processing, resulting in a slow and cumbersome data processing process. In this process, signal instability or distortion is prone to occur, affecting the accuracy of photoelectric parameters. At the same time, the traditional method cannot realize the simultaneous measurement of static DC parameters and dynamic photoelectric parameters, and usually requires two test boards, which increases the test cost and complexity.

[0045] In addition, it is difficult to integrate the temperature control system into the existing traditional test system to perform high and low temperature tests on the device. The traditional test methods and systems are basically based on large-diameter integrating sphere light sources and large darkrooms to provide the lighting environment. The light source system is large in size and high in cost, and it is basically impossible to integrate the temperature control system. It is difficult to test under temperature changes and can only rely on test fixtures for temperature control. Obviously, it cannot meet the needs of wide range and high-precision temperature regulation.

[0046] In view of this, the present application proposes an image sensor testing system, wherein a test main system includes a testing machine and a test load board, and is configured to receive control instructions from a main control computer and send test signals to a test subsystem; a main control computer is connected to an image acquisition processing unit and the test main system, and is configured to send the control instructions to the test main system; a test subsystem is connected to the image acquisition processing unit, and includes a light and dark field test module, and is configured to perform light and dark field tests on a sensor to be tested through the light and dark field test module; the image acquisition processing unit includes an image acquisition card, and the image acquisition card is configured to acquire and calculate image data for the test subsystem, and transmit the calculation results to the main control computer; a switch control module is connected to the test subsystem and the image acquisition processing unit, and is used to provide power and test signals to the test subsystem and the image acquisition processing unit.

[0047] In order to facilitate understanding of the technical solutions of the present disclosure, some technical terms involved in the present disclosure are introduced below.

[0048] Slave Computer: A computer device that plays a secondary or auxiliary role relative to the host computer, working together with the host computer to achieve the overall function of the system. Slave computers are usually used to respond to requests from the host computer to perform specific tasks or provide services. They can be servers, workstations, or other types of computer devices, depending on the architecture and needs of the network or system.

[0049] FPGA (Field-Programmable Gate Array) is a semi-customized integrated circuit that can change its internal logic structure and function through programming. Compared with ASIC (Application Specific Integrated Circuit), FPGA has higher flexibility and programmability, and can quickly adjust and upgrade functions as needed.

[0050] Image acquisition card (image card): It has multiple functions such as signal conversion, image acquisition and storage, image preprocessing, interface and transmission, and support for multi-camera testing. It is an indispensable and important part of the test system and is of great significance to ensure the accuracy and reliability of the test results.

[0051] In order to make the technical solution of the present disclosure clearer and easier to understand, the image sensor testing system provided by the embodiment of the present disclosure is described in detail below with reference to the accompanying drawings.

[0052] like Figure 1 As shown, the image sensor testing system comprises:

[0053] The test main system 1, including the test machine 101 and the test load board 102, is configured to receive control instructions from the main control computer 5 and send test signals to the test subsystem 3;

[0054] A main control computer 5, connected to the image acquisition processing unit 4 and the test main system 1, and configured to send the control instruction to the test main system 1;

[0055] The test subsystem 3 is connected to the image acquisition processing unit, and includes a bright and dark field test module, and is configured to perform a bright and dark field test on the sensor to be tested through the bright and dark field test module;

[0056] The image acquisition processing unit 4 includes an image acquisition card 401, wherein the image acquisition card 401 is configured to acquire and calculate image data of the test subsystem 3, and transmit the calculation result to the main control computer 5;

[0057] The switch control module 2 is connected to the test subsystem 3 and the image acquisition processing unit 4, and is used to provide power and test signals to the test subsystem 3 and the image acquisition processing unit 4.

[0058] In some embodiments, the test main system 1 is composed of a test machine 101 and a test load board 102. The test machine 101 is responsible for receiving control instructions from the main control computer 5 and performing corresponding operations according to these instructions, such as starting or stopping the test, adjusting the test parameters, etc. The test load board 102 is used to simulate various load conditions in the actual use environment to ensure that the image sensor to be tested can obtain accurate test results under different working conditions. In some embodiments, the test main system 1 can not only receive control instructions from the main control computer 5, but also send test signals and test instructions to the test subsystem 3 through the switch control module 2, so that the test subsystem 3 performs specific test tasks.

[0059] In some embodiments, the main control computer 5, as a key module of the test main system 1, issues control instructions through a preset software interface. The control instructions issued by the main control computer 5 may be to start a test program, set test parameters, or retrieve historical test records. In addition, the main control computer 5 is also responsible for receiving the data sent back from the image acquisition and processing unit 4, analyzing and processing it, and finally generating a detailed test report for engineers to refer to and make decisions.

[0060] In some embodiments, the test subsystem 3 is used to perform functional testing of the image sensor, specifically by evaluating the performance of the sensor under different lighting conditions through the built-in light and dark field test module. The light and dark field test module can simulate various lighting environments from extremely bright to extremely dark, so as to comprehensively detect key performance indicators such as the dynamic range, signal-to-noise ratio, and linearity of the sensor. Specifically, during the test process, the test subsystem 3 will automatically switch the light source state according to the received test signal to ensure that each test item can be performed under the most suitable conditions. Among them, the light and dark field test module is specifically as follows Figure 1 The darkroom 301 shown in the figure includes a light source board 3011 , a device to be tested (ie, a sensor to be tested) 3012 and a socket board 3013 .

[0061] In some embodiments, the image acquisition processing unit 4 acquires the image data generated by the test subsystem 3 in real time through the image acquisition card, and performs data processing through the built-in PFGA module. After completing the data processing, the image acquisition processing unit 4 feeds back the results to the main control computer 5 through the slave computer 402 for further data analysis and result display. The efficient operation of the image acquisition card is crucial to ensure the accuracy of the test results, which not only meets the high-speed data transmission capability, but also guarantees the image processing requirements.

[0062] In some embodiments, the switch control module 2 plays the role of energy manager in the entire system, is directly connected to the test subsystem 3 and the image acquisition processing unit 4, and provides stable and reliable power support for the test subsystem 3 and the image acquisition processing unit 4. Through intelligent control, the switch control module 2 can automatically turn on or off the power of related equipment at different test stages, which not only ensures the continuity and safety of the test process, but also effectively saves power consumption.

[0063] In some embodiments, the switch control module 2 is composed of a relay board 201, and the FPGA module on the relay board 201 realizes the automatic switching and resource allocation functions of power supply and control signals. This module plays a key control role in the test process, and is respectively connected to the test main system 1, the test subsystem 3 and the image acquisition processing unit 4 through connectors, receives the power supply and control signals from the test main system 1 and transmits them to the test subsystem 3 and the image acquisition processing unit 4, and realizes flexible switching and allocation of system signals. Therefore, the switch control module 2 also realizes flexible switching and allocation of system signals.

[0064] In some optional embodiments, when the night shooting capability of the image sensor is tested, first, the main control computer 5 sets the test parameters, such as exposure time, gain value, etc., through the dedicated software, and sends the command to start the test to the test main system 1. After receiving the command, the test main system 1 powers and initializes the image sensor through the test load board 102. Subsequently, the test main system 1 sends a test signal to the test subsystem 3, instructing it to turn on the dark field test mode in the light and dark field test module. At this time, the test subsystem 3 will reduce the ambient light intensity to an extremely low level to simulate the night scene. The image acquisition processing unit 4 starts to collect the image data output by the sensor, and uses the built-in algorithm to perform noise analysis, dynamic range measurement, etc. After the calculation is completed, the image acquisition processing unit 4 uploads the results to the main control computer 5. The experimenter can view the detailed test report through the software on the main control computer 5 to understand the performance of the sensor under low light conditions, thereby realizing the test of the night shooting capability of the image sensor. At the same time, during the entire test process, the switch control module 2 powers each component in a timely manner as needed to ensure that the test proceeds smoothly.

[0065] In some implementations, the test main system 1 comprehensively evaluates the performance parameters of the device under test by precisely controlling the test conditions. The system includes: a test machine 101 , a test board 102 , and a test load board 102 .

[0066] Among them, the test machine 101 is used to receive communication instructions and control instructions from the main control computer 5. Including the start and end of the test, the setting of test parameters, data recording and analysis, etc. The test machine 101 is externally connected to a 220V power supply, and is internally configured with a plurality of efficient and stable power supply modules, which are used to provide accurate voltage output for the test board 101 according to the test requirements, and ensure the stability of the power supply during the test process. In addition, a bus system is also provided inside the test machine 101, which is used to communicate with the test board 101 at a high speed and reliably, and realize accurate control of the test board 101. Through the connection with the main control computer 5, the test machine 101 can receive control instructions in real time and feedback the test results, thereby ensuring the automation and intelligence of the test process.

[0067] The test board 101 includes an IO board and a DPS board. The IO board is designed with 384 channels, which enables it to handle the test requirements of multiple devices under test at the same time, greatly improving the test efficiency. The main functions of the IO board are to provide I / O control, clock signal, I 2 C protocol support and test vectors. I / O control allows read and write operations on the chip under test, and the clock signal ensures the accuracy of the test timing. 2 The I2C protocol support is used to communicate with chips with an I2C interface, while the test vectors are pre-set according to the test requirements and are used to simulate the signal input in the actual working scenario to evaluate the response of the chip under test in different states.

[0068] DPS board, the DPS board is equipped with 64 high-precision power supply channels, which are specially designed to meet the high-precision test requirements of CMOS image sensors. The high-precision power supply channel can provide a stable and adjustable power supply voltage, with the characteristics of high power supply stability and strong load capacity, ensuring the accuracy of the performance test results of the chip under test at different operating voltages.

[0069] In some embodiments, the test subsystem 3 is connected to the image acquisition processing unit 4 to jointly construct an efficient and accurate test platform. By setting up the light and dark field test modules, a test environment for the sensor to be tested is constructed to ensure that the performance of the sensor under various lighting conditions can be accurately evaluated.

[0070] Specifically, the test subsystem 3 includes a socket board 3013, a device under test (i.e., a sensor), a light source board 3011, and a darkroom 301. The socket board 3013 uses a customized SOCKET 754 lever-pressed detachable test socket, which is specially designed for connecting and stabilizing the device under test. It is not only highly safe and convenient, and can easily handle 153-pin PGA package chips, effectively avoiding physical damage caused by manual plugging and unplugging, but also is fixed on the PCB board and closely connected to the relay board 201, ensuring the reliable transmission of the signal and power supply of the device under test, and improving the accuracy and stability of the test.

[0071] In some embodiments, the socket board 3013 is used to fix the device under test, provide power and control signals, and receive response signals. Among them, fixing the device under test includes ensuring that the device under test will not loosen or fall off during the test process. Providing power and control signals includes providing the required power and control signals to the device under test through connection with the relay board 201. Receiving response signals includes collecting the response signals of the device under test and transmitting them back to the test system to ensure the integrity and accuracy of the test data.

[0072] In some embodiments, the sensor to be tested is a GSENSE2020BSI image sensor, which has the characteristics of high sensitivity and high resolution. The power supply of the GSENSE2020BSI image sensor needs to include 12 power supplies in total, including 1 analog power supply, 2 digital power supplies and 9 pixel power supplies, with a voltage range of 0 to 3.5V and a maximum current of 227mA. These complex power supply requirements require the test subsystem 3 to have highly accurate power management and allocation capabilities to ensure that the sensor can work stably and reflect performance during the test process.

[0073] In some embodiments, the darkroom 301 is made of special materials and structural design to effectively isolate the interference of external light sources, providing a dark field environment without light interference for the sensor to be tested. The highly light-absorbing coating inside the darkroom 301 further reduces the influence of reflected light, so that the sensor is only stimulated by the light of the light source board 3011 during the test, thereby ensuring the authenticity of the test results and improving the accuracy of the test.

[0074] Furthermore, a light source board 3011 is also provided in the darkroom 301. The light source board 3011 adopts an SMD 3528LED light source. By precisely controlling the brightness and wavelength of the light source, it provides multi-level light intensity stimulation for the sensor to be tested, simulating various lighting environments in practical applications. This helps to evaluate the imaging quality of the sensor under different lighting conditions, and further deeply analyze its photoelectric performance parameters, such as sensitivity, signal-to-noise ratio, etc. The use of the light source board 3011 in conjunction with the darkroom 301 reduces the interference of the test environment and ensures the accuracy and reliability of the test results.

[0075] In some embodiments, the specific test process includes: first, the socket board 3013 connects the device under test to the test system to ensure the stable transmission of power and control signals. And further receives the response signal of the device under test, and transmits the response signal to the image acquisition processing unit 4 for subsequent processing. The light source board 3011 provides light stimulation of different intensities and wavelengths to the device under test in the darkroom 301 according to the test requirements, and monitors the brightness and stability of the light source in real time. The darkroom 301 provides a test environment without light interference for the device under test through its special material and structural design, ensuring the accuracy of the test results. Finally, the image acquisition processing unit 4 receives and processes the response signal from the device under test, and obtains the photoelectric performance parameters of the sensor through algorithm analysis, providing data support for subsequent evaluation and improvement.

[0076] In some embodiments, the image acquisition card is used for data acquisition, including receiving image data from the device under test in the test subsystem 3. The image acquisition card has built-in complex computing logic, which can perform preliminary processing and calculation on the image data. Specifically, the image acquisition card receives a high-speed image data stream from the CMOS image sensor through its high-speed interface (such as LVDS interface). These raw image data undergo a series of sophisticated processing processes on the acquisition card, including but not limited to image decoding, signal amplification, noise suppression, etc., to ensure the accuracy and integrity of the data.

[0077] Furthermore, the image acquisition card uses Altera's high-performance Stratix III series FPGA - EP3SL200F1152. Among them, the FPGA has about 200,000 logic units and 1,152 I / O pins, with high-density FBGA packaging and high operating frequency. The operating frequency is 500MHz, which enables the image acquisition card to flexibly respond to various complex image data processing requirements. The programmability of FPGA provides great flexibility for the image acquisition card. It can quickly adjust the data processing process and algorithm according to different test scenarios and application requirements, thereby realizing accurate control and processing of image data.

[0078] In some implementations, to ensure the power supply stability of the FPGA and its peripheral circuits, the image acquisition card is also equipped with a TPS54531 power converter. The TPS54531 power converter can efficiently convert the input 15V voltage into multiple stable power supplies such as 2.5V, 1.1V, 5V and 3.3V required by the FPGA, providing stable and reliable energy guarantee for the entire image acquisition card.

[0079] In addition, in terms of data processing and storage, the image acquisition card integrates Micron's MT41J256M16HA-093DDR3 SDRAM memory, which makes the image acquisition card have large capacity and high-speed access characteristics, and ensures the integrity and efficiency of image data during processing. The close cooperation between DDR3 memory and FPGA enables the image acquisition card to maintain efficient and stable operation in a high-frequency data processing environment.

[0080] In some optional embodiments, the slave computer 402 is used to provide processing and analysis functions for the image acquisition processing unit 4. Specifically, the slave computer 402 is connected to the image acquisition card through a high-speed interface (such as PCIe) to receive image data and preliminary processing results from the acquisition card. After receiving these data, the slave computer 402 further analyzes the image data in depth to determine the optoelectronic performance parameters of the device.

[0081] The photoelectric performance parameters include but are not limited to sensitivity, signal-to-noise ratio, dynamic range, etc., which are used to evaluate the performance of the image sensor. The slave computer 402 calculates the photoelectric parameters according to the EMVA1288 standard to ensure the accuracy and comparability of the test results. The test results obtained through software analysis can not only be used to evaluate the performance level of the device under test, but also provide reference information for device optimization and product design.

[0082] Furthermore, after completing the calculation of the optoelectronic performance parameters, the slave computer 402 transmits the test results back to the master computer 5 through the network. The master computer 5, as the control center of the entire test system, is responsible for receiving data and results from each test unit, performing comprehensive analysis and generating a final test report. This distributed data processing architecture not only improves the overall efficiency of the test system, but also enables the system to flexibly respond to various complex test requirements.

[0083] In some embodiments, the switch control module 2 includes: a relay card 201; the relay card 201 is connected to the light source board 3011, the socket board 3013 and the image acquisition card, and is configured to automatically switch the power supply and control signals and allocate resources to the test subsystem 3 and the image acquisition processor through the FPGA module. The relay card 201 is respectively connected to the test main system 1, the test subsystem 3 and the image acquisition processing unit 4 through connectors, receives the power supply and control signals from the test main system 1 and transmits them to other modules, so as to realize flexible switching and allocation of system signals.

[0084] In some optional embodiments, the relay board integrates an FPGA chip and a power converter to support efficient test resource management and switching control. The relay board is connected to the test load board 102 via a connector 9985S-100Y-901. The connector can ensure efficient transmission of signals and power between boards, ensuring the compatibility and reliability of different modules in the system.

[0085] In some optional embodiments, the relay board uses an EP2S30F484 FPGA chip. The FPGA (field programmable gate array) chip is highly programmable and can flexibly configure its internal logic circuit. Through programming, the EP2S30F484 can support the logic control requirements of the switch control module 2 and is suitable for switching control in a variety of electronic applications, such as digital signal processing, communication, and image processing. In this test system, the FPGA controls the on and off of the power supply and signal to achieve power management of each board and stable transmission of the signal channel.

[0086] In some optional embodiments, the power supply of the electrical board uses a TPS54531 power converter, which can convert a 15V input voltage into 3.3V, 1.2V, and 5V voltages to provide a stable power supply for the FPGA and other components, ensuring the normal operation of the relay board in various operating states.

[0087] In some embodiments, during the test process, the main control computer 5 sends a control instruction to the test main system 1, provides power and timing drive signals for the device under test, and controls the light source board 3011 to output light sources of different intensities to illuminate the device under test, so as to test the performance parameters of the device under different light intensity conditions. The device under test transmits the image data to the image acquisition card via LVDS, and the slave computer 402 receives and calculates the data. The processed data is fed back to the main control computer 5 via the network to complete the evaluation of the device performance. For the test parameters, the image acquisition processing unit 4 realizes the calculation of the dynamic optoelectronic performance parameters of the device, and the test main system 1 realizes the static DC parameter test of the device, and the test results are fed back to the main control computer 5. For high and low temperature testing, the test subsystem 3 only needs to be placed in a temperature control environment such as a heat flow hood to realize the photoelectric parameter test under high and low temperature, which solves the problem that the photoelectric parameter test under high and low temperature cannot be realized in traditional testing.

[0088] The test system can adapt to the testing of different types of devices. It only needs to replace the test board 101 and recompile the test program to adjust the timing signal and DPS power output according to the requirements of different types of devices, so as to achieve compatible testing of multiple types of devices. This design reduces the difficulty of system debugging and improves the test flexibility.

[0089] In a specific embodiment, the present application provides an application example, and describes the test main system 11, the switch control module 22, the test subsystem 33, the image acquisition processing unit 44 and the main control computer 55 one by one in a modular manner.

[0090] Specifically, for the test machine 101 in the test main system 1, the test machine 101 is connected to an external 220V power supply, and multiple built-in power modules are used to provide stable power supply for the test board 101. The test machine 101 includes the test board 101, and communicates with the test board 101 through a built-in bus to achieve precise control of the test board 101. At the same time, the test machine 101 is connected to the main control computer 5 through the bus, receives control instructions from the main control computer 5 and performs data exchange, ensuring the stability and efficiency of the test process.

[0091] As for the test board 101, the test board 101 includes two parts: an IO board and a DPS board. The IO board contains 384 channels, and the DPS board contains 64 channels, to meet the testing requirements of most CMOS image sensors on the market. The IO board is responsible for providing I / O control, clock signal, I2C protocol support and required test vectors for the chip under test, ensuring the accurate response of the chip under test in different states; the DPS board provides high-precision power supply for the chip under test, with the advantages of high power stability and strong load capacity, and can meet the performance test requirements of the chip under test at different working voltages. It is divided into an IO board and a DPS board.

[0092] As for the test load board 102, the test load board 102 serves as a bridge of the signal transmission channel and has the function of an adapter board. It is connected to the test board 101 through a 176-pin connector to ensure the stable transmission of signals and power, reduce interference in signal transmission, and further improve the accuracy and reliability of the test system.

[0093] As can be seen from the above, the image sensor test system and test method provided by the present application adopt modular design, and the power supply and signal on / off are automatically controlled by the switch control module, so as to realize the dynamic allocation and rapid switching of test resources, and significantly improve the test efficiency; the coordination of the test main system, the switch control module and the image acquisition processing unit ensures the stable transmission of various signals, and improves the accuracy of image data acquisition through the decoding, caching and data processing functions of the image acquisition card; the light and dark field test module provides the test conditions under different temperature and light intensity environments for the sensor to be tested, which is suitable for testing the photoelectric performance of the image sensor under various temperature and light conditions, and improves the applicability of the test system. And it has the advantages of strong test compatibility and strong versatility. The present application adopts modular and integrated design, which can adapt to the test requirements of various models of CMOS image sensors, and only needs to replace a simple socket board and modify the test program, while the traditional test scheme needs to re-change the drive evaluation board, which has a long cycle and is difficult. The components of this system operate independently and cooperate with each other, with low maintenance cost and strong scalability, which is not only conducive to the installation and maintenance of the system, but also can quickly adjust the system when the demand changes or the technology is upgraded to meet the new test requirements.

[0094] Based on the same inventive concept, corresponding to any of the above-mentioned embodiment methods, the present application also provides an image sensor testing method.

[0095] refer to Figure 2 , the image sensor testing method comprises:

[0096] The test main system receives the test instruction from the main control computer and sends the test information to the switch control module according to the test instruction; wherein the test instruction includes a communication instruction and a control instruction;

[0097] A switch control module receives the test information and provides test resources and power to the test subsystem and the image acquisition processing unit through the FPGA according to the test information;

[0098] The test subsystem performs a light and dark field test on the sensor to be tested through a light and dark field test module according to the test resource to determine image information; wherein the image information is an image signal;

[0099] The image acquisition processing unit receives the image information, calculates the photoelectric performance parameters according to the image information, and sends the calculation results to the main control computer;

[0100] The main control computer receives the calculation result and analyzes the calculation result.

[0101] It should be noted that the method of the embodiment of the present application can be performed by a single device, such as a computer or server. The method of this embodiment can also be applied to a distributed scenario and completed by multiple devices cooperating with each other. In the case of such a distributed scenario, one of the multiple devices can only perform one or more steps in the method of the embodiment of the present application, and the multiple devices will interact with each other to complete the described method.

[0102] It should be noted that the above describes some embodiments of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the above embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0103] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application (including the claims) is limited to these examples. In line with the concept of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0104] In addition, to simplify the description and discussion, and in order not to make the embodiments of the present application difficult to understand, the known power supply / ground connection with the integrated circuit (IC) chip and other components may or may not be shown in the provided drawings. In addition, the device can be shown in the form of a block diagram to avoid making the embodiments of the present application difficult to understand, and this also takes into account the fact that the details of the implementation of these block diagram devices are highly dependent on the platform to be implemented in the embodiments of the present application (that is, these details should be fully within the scope of understanding of those skilled in the art). In the case of elaborating specific details (e.g., circuits) to describe exemplary embodiments of the present application, it is obvious to those skilled in the art that the embodiments of the present application can be implemented without these specific details or when these specific details are changed. Therefore, these descriptions should be considered to be illustrative rather than restrictive.

[0105] Although the present application has been described in conjunction with specific embodiments of the present application, many replacements, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may use the embodiments discussed.

[0106] The embodiments of the present application are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the scope of protection of the present application.

Claims

1. An image sensor testing system, characterized in that: include: The test main system, including a test machine and a test load board, is configured to receive control instructions from a main control computer and send test signals to the test subsystem; A main control computer, connected to the image acquisition processing unit and the test main system, and configured to send the control instruction to the test main system; A test subsystem, connected to the image acquisition processing unit, includes a light and dark field test module, and is configured to perform a light and dark field test on the sensor to be tested through the light and dark field test module; An image acquisition processing unit, comprising an image acquisition card, wherein the image acquisition card is configured to acquire and calculate image data for the test subsystem and transmit the calculation results to the main control computer; The switch control module is connected to the test subsystem and the image acquisition processing unit, and is used to provide power and test signals to the test subsystem and the image acquisition processing unit.

2. The system according to claim 1, characterized in that The test machine comprises: a test board; The test machine is also configured to receive communication instructions and control instructions from the main control computer, and provide power and send control signals to the test board according to the control instructions; The test board is configured to receive power and control signals sent by the test machine, and send test information to the test load board according to the control signal, so that the test load board sets test conditions according to the test information; wherein the test information includes: test voltage, test current, test clock signal, test interface protocol and test configuration.

3. The system according to claim 1, characterized in that The test board includes: an IO board and a DPS board; The IO board is configured to provide I / O control, clock signal, I 2 C protocol support and test vectors to ensure testing of the chip under test; The DPS board is configured to provide a high-precision power supply for the sensor to be tested.

4. The system according to claim 1, characterized in that The test module includes: a light source board and a darkroom; Perform illumination tests of different intensities and different wavebands by using the light source panel; The test was performed without illumination in the dark room.

5. The system according to claim 1, characterized in that The test subsystem further includes: a socket board; The socket board is connected to the test module, and is configured to fix the device under test, provide power and control signals for the device under test, and receive response signals from the device under test to ensure stable connection between the device under test and the system.

6. The system according to claim 1, characterized in that The image acquisition card is also configured to acquire image data of the test subsystem and transmit the image data to the main control computer.

7. The system according to claim 6, characterized in that The image acquisition and processing unit also includes: a slave computer; The slave computer is connected to the image acquisition card and the master computer, and is configured to receive image data from the image acquisition card, calculate photoelectric performance parameters for the image data, and transmit the calculation results of the photoelectric performance parameters to the master computer.

8. The system according to any one of claims 1 and 4-5, characterized in that The switch control module includes: a relay board; The relay board is connected to the light source board, the socket board and the image acquisition card, and is configured to automatically switch power and control signals and allocate resources to the test subsystem and the image acquisition processor through an FPGA module.

9. The system according to any one of claims 1 and 6-7, characterized in that The main control computer is connected to the test main system; The master computer is also configured to receive the calculation results of the photoelectric performance parameters of the slave computer, analyze the calculation results of the photoelectric performance parameters, determine the test results, and generate a test report based on the test results.

10. An image sensor testing method, characterized in that: The image sensor testing system according to any one of claims 1 to 9 comprises: The test main system receives the test instruction from the main control computer and sends the test information to the switch control module according to the test instruction; wherein the test instruction includes a communication instruction and a control instruction; A switch control module receives the test information and provides test resources and power to the test subsystem and the image acquisition processing unit through the FPGA according to the test information; The test subsystem performs a light and dark field test on the sensor to be tested through a light and dark field test module according to the test resource to determine image information; wherein the image information is an image signal; The image acquisition processing unit receives the image information, calculates the photoelectric performance parameters according to the image information, and sends the calculation results to the main control computer; The main control computer receives the calculation result and analyzes the calculation result.

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