Electrode structure, surface-mounted electronic component and electronic equipment

Abstract

The invention discloses an electrode structure, a surface-mounted electronic component and electronic equipment. The electrode structure comprises an electrode body and a welding part, the welding part is arranged on and protrudes out of the end face of the electrode body, and the surface of the side, away from the end face, of the welding part is a first cambered surface. The first cambered surface protrudes towards the direction away from the end face and is used for being in contact with a circuit board. In the thickness direction of the welding part, the first cambered surface is provided with a contact point, and the minimum distance h between the end face and the contact point is larger than 0 mm and smaller than or equal to 0.15 mm. According to the electrode structure disclosed by the invention, the first cambered surface is utilized, so that bubbles in soldering tin can be reduced when the electrode structure is welded with the circuit board, and the welding strength of the electrode structure and the circuit board is improved. Moreover, as the overall thickness of the welding part is small, the influence of the first cambered surface of the welding part on the stability of the electronic component placed on the circuit board is small, and the electronic component can be stably placed on the circuit board during welding.

Description

Technical Field

[0001] The present application relates to the technical field of electronic components, and in particular to an electrode structure, a surface-mount electronic component and an electronic device. Background Art

[0002] In the related art, reflow soldering is usually used for soldering of SMD electronic components. During the reflow soldering process, the solder at the connection between the electrode of the SMD electronic component and the circuit board melts, shrinks inside and forms bubbles. If the bubbles cannot be eliminated, the bubbles will remain in the solder after the solder cools down, forming welding bubbles. This may affect the mechanical strength and welding reliability of the electrode and circuit board, greatly increasing the risk of SMD electronic components falling off the circuit board. Summary of the invention

[0003] The embodiments of the present application disclose an electrode structure, a surface-mount electronic component and an electronic device, which are used to improve the welding stability of the surface-mount electronic component on a circuit board.

[0004] In order to achieve the above objectives, in a first aspect, the present application discloses an electrode structure, comprising:

[0005] an electrode body having an end surface;

[0006] A soldering portion, the soldering portion is disposed on the end surface and protrudes from the end surface, a surface of the soldering portion on one side away from the end surface is formed as a first arc surface, the first arc surface protrudes in a direction away from the end surface, and the first arc surface is configured to contact the circuit board;

[0007] Wherein, in the thickness direction of the welding portion, the first arc surface has a contact point for contacting the circuit board, and there is a minimum distance between the end surface and the contact point, and the minimum distance is h, wherein the following relationship is satisfied: 0mm<h≤0.15mm.

[0008] As an optional implementation, the first arc surface is connected to the end surface.

[0009] As an optional implementation, the intersection point of the first arc surface and the end surface forms a connecting line with the contact point, and an angle θ is formed between the connecting line and the end surface, wherein 0°<θ≤10°.

[0010] As an optional implementation, the end surface includes a plane, and the welding portion is formed on the plane by one of electroplating, coating, and vapor deposition.

[0011] As an optional implementation, the end surface includes a second arc surface, and the welding portion covers the second arc surface, so that the welding portion forms the first arc surface.

[0012] As an optional implementation, the second arc surface is integrally formed with the end surface.

[0013] As an optional implementation, the end surface has an edge side, and at least a portion of the edge side is provided with the welding portion.

[0014] In a second aspect, the present application also discloses a surface mount electronic component, comprising:

[0015] The component body; and

[0016] According to the electrode structure of the first aspect, the electrode structure includes at least two electrode structures, both of which are connected to the component body and are spaced apart on the component body.

[0017] As an optional embodiment, the electrode structure protrudes from the component body, and / or the chip-type electronic component also includes an electrode coil, which is arranged in the component body, and part of the electrode coil extends into the electrode structure and is connected to the electrode structure.

[0018] In a third aspect, the present application further discloses an electronic device, comprising:

[0019] Circuit boards;

[0020] According to the chip-type electronic component of the second aspect, the chip-type electronic component is connected to the circuit board.

[0021] Compared with the prior art, the beneficial effects of this application are:

[0022] The present application discloses an electrode structure, a surface-mount electronic component and an electronic device. The electrode structure includes an electrode body and a welding part, the welding part is arranged on and protrudes from the end face of the electrode body, and the side surface of the welding part away from the end face is a first arc surface. The first arc surface protrudes in the direction away from the end face, and the first arc surface is used to contact with the circuit board. In the thickness direction of the welding part, the first arc surface has a contact point, and there is a minimum distance h between the end face and the contact point, which satisfies 0mm<h≤0.15mm. When the electrode structure disclosed in the present application is welded with the circuit board, the solder located between the electrode structure and the circuit board is attached to the first arc surface shape of the welding part. When the solder is not solidified, due to the low density of bubbles therein, the bubbles float in the solder and contact the first arc surface, and finally the bubbles are discharged outward along the first arc surface. In this way, it is beneficial to improve the welding strength between the electrode structure and the circuit board. Moreover, due to the small overall thickness of the welding part, the first arc surface of the welding part has little effect on the stability of the electronic component placed on the circuit board, which is beneficial to the electronic component being placed on the circuit board stably during welding. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 This is a schematic diagram of the first structure of the electrode structure disclosed in the embodiment of the present application;

[0025] Figure 2 This is a schematic diagram of the application of the electrode structure disclosed in the embodiment of the present application;

[0026] Figure 3 A second structural schematic diagram of the electrode structure disclosed in the embodiment of the present application;

[0027] Figure 4 A third structural schematic diagram of the electrode structure disclosed in the embodiment of the present application;

[0028] Figure 5 A bottom view of the surface-mount electronic component disclosed in the embodiment of the present application;

[0029] Figure 6 A schematic diagram of the structure of a surface-mount electronic component disclosed in an embodiment of the present application;

[0030] Figure 7 A schematic diagram of a portion of the structure of an electronic device disclosed in an embodiment of the present application.

[0031] Description of reference numerals:

[0032] 1. Electrode structure; 1a. Connection line; 11. Electrode body; 111. End surface; 111a. Second arc surface; 12. Welding part; 12a. First arc surface; 13. Plating layer;

[0033] 10. SMD electronic components; 101. component body; 102. electrode coil;

[0034] 20. Circuit board; 30. Solder. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0036] In this application, the terms "upper", "lower", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0037] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0038] In addition, the terms "installed", "set", "provided with", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0039] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0040] In the related art, electronic components are usually soldered on the circuit board by direct insertion or patch. In order to prevent the patch electronic components from falling off the circuit board, there are requirements for the adhesion of the patch electronic components on the circuit board during the soldering process of the patch electronic components. However, in the related art, bubbles will form in the solder at the connection between the electrode of the patch electronic component and the circuit board, and the bubbles will affect the mechanical strength of the solder at the connection between the electrode and the circuit board, thereby affecting the welding reliability of the patch electronic components on the circuit board, resulting in poor adhesion of the patch electronic components on the circuit board, which in turn causes the patch electronic components to fall off easily, affecting their use.

[0041] Based on this, the present application discloses an electrode structure, a surface-mount electronic component, and an electronic device. The present application sets the contact surface between the electrode structure and the circuit board as a first curved surface, which can help reduce bubbles generated when the electrode structure and the circuit board are welded, thereby improving the welding strength of the connection between the electrode and the circuit board to meet the adhesion requirements of the electronic component on the circuit board.

[0042] The technical solution of the present application will be further described below in conjunction with embodiments and drawings.

[0043] First, see Figure 1 and Figure 2 , the present application discloses an electrode structure 1, comprising an electrode body 11 and a welding portion 12. The welding portion 12 is provided on an end face 111 of the electrode body 11, and a surface of the welding portion 12 on one side away from the end face 111 is a first curved surface 12a. The first curved surface 12a protrudes in the direction of the end face 111. When the electrode structure 1 is welded to a circuit board 20, the first curved surface 12a is configured to contact the circuit board 20. Among them, in the thickness direction of the welding portion 12, the first curved surface 12a has a contact point, and there is a minimum distance h between the end face 111 and the contact point, wherein h satisfies: 0mm<h≤0.15m. When the welding portion 12 contacts the circuit board 20, the first curved surface 12a protrudes downward in the thickness direction, and the contact point is the lowest point of the first curved surface 12a in the thickness direction (the side away from the electrode body 11 is the lowest side).

[0044] The present application discloses an electrode structure 1, in which a welding portion 12 is arranged on an end surface 111 of an electrode body 11, so that the surface where the welding portion 12 contacts the circuit board 20 forms a first arc surface 12a. When the first arc surface 12a contacts the circuit board 20, the first arc surface 12a protrudes toward the circuit board 20. When the solder 30 is arranged between the first arc surface 12a and the circuit board 20, the solder 30 is distributed along the first arc surface 12a, and the bubbles generated inside the solder 30 during the welding process will float along the first arc surface 12a. Due to the low density of bubbles, the bubbles will move toward the edge of the first arc surface 12a when floating on the first arc surface 12a. Finally, the bubbles can be discharged from the edge of the first arc surface 12a. In this way, the residual bubbles in the solder 30 are reduced, which is conducive to improving the structural strength of the solder 30 when solidifying, and is conducive to the solder 30 assisting the electrode structure 1 to better adhere to the circuit board 20.

[0045] Exemplarily, h may be 0.01mm-0.03mm, 0.03mm-0.05mm, 0.05mm-0.07mm, 0.07mm-0.09mm, 0.09mm-0.11mm, 0.11mm-0.13mm, 0.13mm-0.15mm, etc., for example, 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.10mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm, etc. In order to avoid the problem of electronic components being soldered unsteadily on the circuit board 20, the thickness of the soldering portion 12 is set between 0.01 mm and 0.15 mm, so that the overall thickness of the soldering portion 12 is relatively small, so that the first arc surface is relatively gentle, that is, the radius of curvature of the first arc surface is relatively large, so that the first arc surface 12a is conducive to maintaining the stability of the electronic components placed on the circuit board 20, so as to facilitate soldering. At the same time, the first arc surface 12a still maintains an effective curvature, so that the electrode structure 1 can be stably placed on the circuit board 20, and the curvature of the first arc surface 12a can be used to discharge bubbles in the solder 30 during the soldering process.

[0046] In some embodiments, the first curved surface 12a is connected to the end surface 111 so that the first curved surface 12a forms an intersection between the end surfaces 111. That is, when the welding portion 12 is disposed on the end surface 111, the first curved surface 12a can be directly connected to the end surface 111, that is, the welding portion 12 is an arc as a whole. Since the overall thickness of the welding portion 12 is relatively small, the arc of the welding portion 12 is relatively gentle. In this way, when the electrode structure 1 is placed on the circuit board 20, it is conducive to maintaining the stability of the electrode structure 1.

[0047] Optionally, the first curved surface 12a may be a circular arc surface, so that when the first curved surface 12a is connected to the end face 111, the cross-sectional shape of the welding portion 12 may be approximately a convex arc, and the cross-section of the first curved surface 12a is an arc line, and the arc line and the end face 111 of the electrode body 11 form two intersection points, and along the thickness direction of the welding portion 12, the two intersection points are both located on the end face.

[0048] Optionally, the intersection and the contact point of the arc surface form a line 1a, and the line 1a and the end surface 111 have an angle of θ, wherein 0°<θ≤10°. Exemplarily, θ may be 1°-3°, 2°-4°, 3°-5°, 4°-6°, 5°-7°, 6°-8°, 7°-9°, 8°-10°, etc. For example, θ may be 1°, 2°, 3°, 4°, 5°, 6°, 7°, 8°, 9°, 10°, etc. The present application sets θ in the range of 0°-10°, which is conducive to making the first arc surface 12a relatively gentle. Exemplarily, when the electrode structure 1 is located on the circuit board 20, the line 1a and the surface of the circuit board 20 also have θ, that is, the first arc surface 12a is relatively gentle compared to the surface of the circuit board 20 and the end surface 111, which is conducive to the electrode structure 1 being placed smoothly on the circuit board 20.

[0049] See also Figure 1 In some embodiments, the end surface 111 includes a plane, and the welding portion 12 can be formed on the plane by electroplating and / or coating. When the welding portion 12 is provided in the present application, the surface of the welding portion 12 is formed with a first arc surface 12a by electroplating and coating, which is conducive to controlling the thickness and θ angle of the welding portion 12, so that the electrode structure 1 can be stably placed on the circuit board 20, and the arc of the first arc surface 12a can be used to discharge bubbles in the solder 30 during the welding process.

[0050] Optionally, the welding part 12 can also be formed on a plane by, for example, physical vapor deposition. By depositing the metal material on a plane by physical vapor deposition, the welding part 12 forms a denser structure on the plane, which is beneficial to improving the welding performance and anti-oxidation performance of the welding part 12.

[0051] Optionally, the welding portion 12 may be formed of metal materials such as silver, nickel, tin, and copper. The welding portion 12 may include one or more metal materials among silver, nickel, tin, and copper. One or more layers of metal materials may be provided on the end surface 111 by electroplating, coating, or physical vapor deposition to form the welding portion 12. The present application provides one or more layers of metal materials on the electrode body 11, which is conducive to improving the connectivity between the welding portion 12 and the electrode body 11, the oxidation resistance of the welding portion 12 itself, and the weldability between the welding portion 12 and the circuit board 20.

[0052] See also Figure 3In other embodiments, the end face 111 includes a second curved surface 111a, and the welding portion 12 covers the second curved surface 111a, so that the welding portion 12 is formed with the first curved surface 12a. In other words, when the welding portion 12 is provided on the end face 111, the welding portion 12 can be formed according to the shape of the second curved surface 111a, so that the surface of the welding portion 12 naturally forms the first curved surface 12a. Exemplarily, the end face 111 on the electrode body 11 is formed with the second curved surface 111a by processing, and then the welding portion 12 is provided on the second curved surface 111a, so that the welding portion 12 passively follows the shape of the second curved surface 111a to form the first curved surface 12a, and there is no need to adjust the shape and parameters of the welding portion 12. In this way, it is helpful to reduce the processing difficulty of the first curved surface 12a of the welding portion 12.

[0053] Optionally, the second curved surface 111a can be formed by a mold and / or grinding so that the end face 111 and the second curved surface 111a are integrally arranged. In one example, the electrode body 11 can be placed in a mold, and a portion of the electrode body 11 is protruded from the end face 111 along the shape of the mold, and then a convex portion having the second curved surface 111a is formed. In another example, the second curved surface 111a can be directly formed on the end face 111 by grinding, cutting, etc. In this way, the second curved surface 111a is formed conveniently and quickly, easy to operate, and is conducive to improving the processing efficiency of the electrode structure 1.

[0054] See also Figure 4 In some embodiments, the first arc surface of the welding portion 12 is further plated with a coating 13. In the present application, one or more layers of coating 13 are plated on the outside of the welding portion 12, which is beneficial to improving the oxidation resistance and welding performance of the welding portion 12.

[0055] Optionally, the material of the coating 13 may be a metal coating, such as nickel, tin, etc., which is not specifically limited in the present application.

[0056] Optionally, the coating 13 may be disposed on the first curved surface 12 a by electroplating, physical vapor deposition, or the like, which is not specifically limited in the present application.

[0057] It is understandable that the shape of the coating is compatible with the first curved surface, that is, the shape of the coating is also curved and has an angle θ.

[0058] It is understandable that when the welding portion 12 is formed on the end surface 111 of the electrode body 11 by silver paste coating, the coating can be plated on the welding portion 12. Plating the coating to protect the silver paste-coated welding portion 12 is beneficial to improving welding performance, anti-oxidation performance, etc.

[0059] See also Figure 5In some embodiments, the end face 111 has an edge side, and at least part of the edge side is provided with a welding portion 12. In one example, taking the end face 111 as a square surface as an example, the end face may have four edge sides, and the welding portion 12 may be provided on at least one of the edge sides, or on two edge sides, three edge sides, or four edge sides. In another example, taking the end face 111 as a circular surface as an example, the welding portion 12 may be provided on part of the circular edge side, or on the entire edge side. The present application provides a welding portion 12 on the edge side of the end face 111 to reduce the influence of the first arc surface 12a of the welding portion 12 on the stability of the end face 111, and at the same time, it can also reduce the residual bubbles in the solder 30 during welding.

[0060] It can be understood that when a plurality of welding portions 12 are provided on the edge side, the plurality of welding portions 12 may be provided at intervals.

[0061] Optionally, the end face 111 also has a middle part, the edge side surrounds the middle part, and the welding part 12 is arranged in the middle part. In one example, the welding part 12 can be arranged only in the middle part, so that the middle part forms a first curved surface 12a. In another example, the welding part 12 can be arranged in the middle part and the edge side, so that the first curved surface 12a covers the entire end face 111. The present application can arrange the welding part 12 on the edge side and / or the middle part, so that the first curved surface 12a covers the end face 111 from the front. During welding, the entire surface of the first curved surface 12a contacts the circuit board 20, which is conducive to the discharge of bubbles in the solder 30 from the entire surface, thereby improving the adhesion of the electrode structure 1 on the circuit board 20.

[0062] Second, see Figure 5 and Figure 6 The present application also discloses a surface-mount electronic component 10, comprising a component body 101 and the electrode structure 1 in the first aspect, wherein the electrode structure 1 comprises at least two, both of which are connected to the component body 101 and are spaced apart on the component body 101. It can be understood that one of the two electrode structures 1 can be connected to the positive pole of the power supply, and the other can be connected to the negative pole of the power supply.

[0063] The chip-type electronic component 10 in the present application is provided with the electrode structure 1 disclosed in the first aspect, so that when the chip-type electronic component 10 is soldered on the circuit board 20, the soldering portion 12 of the electrode structure 1 of the chip-type electronic component 10 can reduce bubbles in the solder 30 during soldering, and effectively improve the adhesion between the chip-type electronic component 10 and the circuit board 20. Moreover, the overall thickness of the soldering portion 12 of the electrode structure 1 is relatively small. When the chip-type electronic component 10 is set on the circuit board 20, the soldering portion 12 has a relatively small effect on the overall stability of the chip-type electronic component 10 on the circuit board 20, which is beneficial to the stability of the electronic component placed on the circuit board 20 during the patching process, and facilitates the soldering of the chip-type electronic component 10 and the circuit board 20.

[0064] Optionally, the electrode structure 1 may include multiple electrode structures 1, two of which are respectively connected to the positive and negative poles of the power supply, one of which can be grounded, and the other electrode structures 1 can be connected to the circuit of the circuit board 20, which is not specifically limited in this application.

[0065] In some embodiments, the electrode structure 1 protrudes from the component body 101. The present application takes into account that the electrode structure 1 of the SMD electronic component 10 can be effectively connected to the circuit board 20. Exemplarily, during the packaging process of the SMD electronic component 10, part of the electrode structure 1 protrudes from the component body 101, wherein part of the electrode structure 1 provided with the welding portion 12 protrudes from the component body 101, so as to facilitate welding of the electrode structure 1 and the circuit board 20.

[0066] Optionally, the SMD electronic component 10 further includes an electrode coil 102 (eg Figure 7 ), the electrode coil 102 is disposed in the component body 101, and part of the electrode coil 102 extends into the electrode structure 1. Specifically, when the chip-type electronic component 10 is packaged, the electrode structure 1 is led out of the component body 101, and the electrode coil 102 located in the component body 101 is led out together with the electrode structure 1, so that part of the electrode coil 102 is located in the electrode structure 1 protruding from the component body 101. In this way, when the chip-type electronic component 10 is welded to the circuit board 20, the electrode structure 1 can be electrically conductive with the circuit board 20 and the component body 101.

[0067] Third, see Figure 7The present application also discloses an electronic device, including the SMD electronic component 10 and the circuit board 20 disclosed in the second aspect. The SMD electronic component 10 is connected to the circuit board 20 by welding. Exemplarily, after the SMD electronic component 10 is welded, the solder 30 between the SMD electronic component 10 and the circuit board 20 can discharge the bubbles inside through the first arc surface 12a on the electrode structure 1 of the SMD electronic component 10, thereby improving the adhesion between the SMD electronic component 10 and the circuit board 20, which is beneficial to prevent the electronic component from falling off.

[0068] Optionally, the electronic device may be, but is not limited to, a mobile phone, a smart watch, a television, a laptop computer, etc., and this application does not make any specific limitations here.

[0069] In order to facilitate further understanding of the solution of the present application, the manufacturing process of surface mount electronic components will be described as an example below.

[0070] In the first example, the production process includes:

[0071] 301. Place the surface-mount electronic components in the mold;

[0072] 302. Lead the electrode body located in the component body out of the component body, and lead the electrode coil located in the component body into the electrode body located outside the component body;

[0073] 303. According to the shape of the mold, the end surface of the electrode body outside the component body is made into a second arc surface, the second arc surface is convex relative to the end surface, and the second arc surface has an angle θ, and the angle θ is 4.3°;

[0074] 304. A metal layer is provided on the second arc surface by electroplating to form a welding portion, and the welding portion forms a first arc surface according to the shape of the second arc surface. There is a minimum distance h between the arc top of the first arc surface and the end face of the electrode body, and h is 0.06 mm.

[0075] The electrode structure of the final SMD electronic component can be found in Figure 3 .

[0076] The surface mount electronic components manufactured in the first example (hereinafter referred to as the present embodiment) were compared with the surface mount electronic components in the related art (comparative example), and the following Table 1 was obtained:

[0077] Table 1

[0078] SMD electronic components Adhesion / N Bubble area This embodiment 65 0％ Comparative Example 47 17％

[0079] It can be seen from Table 1 that after the SMD electronic components of this embodiment are welded, the adhesion of the electronic components to the circuit board is significantly improved, and the amount of solder is greatly reduced, or even almost eliminated. In other words, the welding strength between the SMD electronic components and the circuit board is effectively improved, which is conducive to preventing welding failure between the SMD electronic components and the circuit board, and further helps to improve the yield rate of electronic equipment.

[0080] In the second example, the production process includes:

[0081] 301. Exposing the electrode body and the electrode coil located in the component body, and making the surface of the electrode body into a flat surface to facilitate the attachment of metal materials;

[0082] 302. Apply silver paste on the surface of the electrode body so that the silver paste is connected to the electrode body and the electrode coil in the component body;

[0083] 303. After the silver paste solidifies, a welding portion is formed. The thixotropy of the silver paste and the surface tension of the silver paste are used to form a first arc surface on the surface of the solidified welding portion, and the thickness h of the welding portion is 0.06 mm, and the angle θ of the first arc surface is 4.3°;

[0084] 304. A metal coating is plated on the first arc surface by electroplating.

[0085] The electrode structure of the final SMD electronic component can be found in Figure 4 .

[0086] The SMD electronic components manufactured in the second example (hereinafter referred to as the present embodiment) were compared with the SMD electronic components in the related art (comparative example), and the following Table 2 was obtained:

[0087] Table 2

[0088] SMD electronic components Adhesion / N Bubble area This embodiment 69 0.578％ Comparative Example 47 17％

[0089] In the above Table 2, after the SMD electronic components of this embodiment are welded, the adhesion of the electronic components to the circuit board is significantly improved, and the bubbles in the solder are greatly reduced, or even almost free of bubbles. In other words, the welding strength between the SMD electronic components and the circuit board is effectively improved, which is conducive to preventing welding failure between the SMD electronic components and the circuit board, and further helps to improve the yield rate of electronic equipment.

[0090] In the third example, the production process includes:

[0091] 301. Exposing the electrode structure and the electrode coil in the component body, and leading the electrode structure and the electrode coil in the component body out of the component body;

[0092] 302. The electrode structure outside the component body is made into a plane, and the thickness of the electrode structure outside the component body is controlled to be 0.06 mm;

[0093] 303. Grind the plane so that the plane forms a second arc surface, and the angle θ between the second arc surface and the plane is 4.3°;

[0094] 304. Dispose a metal layer on the second arc surface to form a welding portion, and the welding portion forms a first arc surface according to the shape of the second arc surface.

[0095] The electrode structure of the final SMD electronic component can be found in Figure 3 .

[0096] The SMD electronic components manufactured in the third example (hereinafter referred to as the present embodiment) were compared with the SMD electronic components in the related art (comparative example), and the following Table 3 was obtained:

[0097] Table 3

[0098] SMD electronic components Adhesion / N Bubble area This embodiment 63 0％ Comparative Example 47 17％

[0099] In the above Table 3, after the SMD electronic components of this embodiment are welded, the adhesion of the electronic components to the circuit board is significantly improved, and the bubbles in the solder are also greatly reduced, or even almost free of bubbles. In other words, the welding strength between the SMD electronic components and the circuit board is effectively improved, which is conducive to preventing welding failure between the SMD electronic components and the circuit board, and further helps to improve the yield rate of electronic equipment.

[0100] The electrode structure, chip-type electronic components and electronic devices disclosed in the embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the electrode structure, chip-type electronic components and electronic devices of the present application and their core ideas; at the same time, for general technicians in this field, according to the ideas of the present application, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. An electrode structure, characterized in that: include: an electrode body having an end surface; A soldering portion, the soldering portion is disposed on the end surface and protrudes from the end surface, a surface of the soldering portion on one side away from the end surface is formed as a first arc surface, the first arc surface protrudes in a direction away from the end surface, and the first arc surface is configured to contact the circuit board; Wherein, in the thickness direction of the welding portion, the first arc surface has a contact point for contacting the circuit board, and there is a minimum distance between the end surface and the contact point, and the minimum distance is h, wherein the following relationship is satisfied: 0mm<h≤0.15mm.

2. The electrode structure according to claim 1, characterized in that: The first arc surface is connected to the end surface.

3. The electrode structure according to claim 2, characterized in that: The intersection point of the first arc surface and the end surface forms a connecting line with the contact point, and an angle θ is formed between the connecting line and the end surface, wherein 0°<θ≤10°.

4. The electrode structure according to claim 1, characterized in that: The end surface includes a plane, and the welding portion is formed on the plane by one of electroplating, coating, and vapor deposition.

5. The electrode structure according to claim 1, characterized in that: The end surface includes a second arc surface, and the welding portion covers the second arc surface, so that the welding portion is formed with the first arc surface.

6. The electrode structure according to claim 5, characterized in that: The second arc surface is integrally arranged with the end surface.

7. The electrode structure according to any one of claims 1 to 6, characterized in that: The end surface has an edge side, and at least a portion of the edge side is provided with the welding portion.

8. A surface-mount electronic component, characterized in that: include: Component body; as well as According to the electrode structure according to any one of claims 1 to 7, the electrode structure comprises at least two electrode structures, both of which are connected to the component body and are spaced apart on the component body.

9. The surface-mount electronic component according to claim 8, characterized in that: The electrode structure protrudes from the component body, and / or the surface-mount electronic component further includes an electrode coil, which is disposed in the component body, and part of the electrode coil extends into the electrode structure and is connected to the electrode structure.

10. An electronic device, characterized in that: include: Circuit boards; According to the surface-mount electronic component according to claim 8 or 9, the surface-mount electronic component is connected to the circuit board.

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