Stack type high-voltage-resistant piezoelectric ceramic and manufacturing method thereof

Abstract

The invention relates to the technical field of piezoelectric material preparation, and discloses stacked high-voltage-resistant piezoelectric ceramic and a manufacturing method thereof. The stack type high-voltage-resistant piezoelectric ceramic comprises an insulating sheet, a piezoelectric ceramic sheet, an electrode, an electric lead and an insulating layer. The piezoelectric ceramic pieces are stacked between the two insulating pieces, and the positive electrode faces and the negative electrode faces of every two adjacent piezoelectric ceramic pieces are arranged in opposite directions. The electrodes include a positive electrode and a negative electrode. The electrode plates are connected in series through the connecting beams. The electrodes and the piezoelectric ceramic pieces are alternately stacked and bonded. And the two electric leads are respectively connected with the positive electrode and the negative electrode. The insulating layer wraps the insulating sheets, the piezoelectric ceramic sheets and the electrodes and fills the arc-shaped cavities connected with the cross beams. The invention has the advantages of same volume, low electrostatic capacity, better dynamic performance under the condition of preloading force and high voltage resistance, so that the invention can be normally used in special environments such as high voltage, high humidity and the like. The manufacturing process is simple, the efficiency is high, and the product has the characteristics of stability and high pressure resistance.

Description

Technical Field

[0001] The present invention belongs to the technical field of piezoelectric material preparation, and in particular, relates to a stacked high-voltage resistant piezoelectric ceramic and a preparation method thereof. Background Art

[0002] As an important functional material, piezoelectric ceramics are widely used in many fields, such as ultrasonic transducers, sensors, drivers, etc. With the development of modern technology, the demand for piezoelectric ceramics that can work stably under high-voltage environments is increasing.

[0003] However, existing piezoelectric ceramics often have some shortcomings when facing high-voltage working conditions. Co-fired piezoelectric ceramics have deficiencies in high-voltage resistance, and it is difficult to balance piezoelectric performance and high-voltage resistance. For example, the structural design of traditional co-fired piezoelectric ceramics makes it easy for them to have uneven internal electric field distribution when subjected to higher voltages, which in turn leads to excessive or insufficient local polarization, affecting the performance of their piezoelectric performance and may even cause damage to the ceramic body. In addition, the co-fired piezoelectric ceramic process makes it difficult to effectively improve the high-voltage resistance while ensuring that the piezoelectric ceramics have good piezoelectric properties, which greatly limits the use of piezoelectric ceramics in some special application scenarios with high requirements such as high voltage and high humidity.

[0004] Based on the above, the present invention provides a stacked high-voltage resistant piezoelectric ceramic to meet the urgent demand for high-voltage resistant piezoelectric ceramics in related fields. Summary of the invention

[0005] The purpose of the present invention is to provide a stacked high-voltage resistant piezoelectric ceramic, aiming to solve the problem in the prior art that piezoelectric ceramics are not resistant to high voltage, are easily damaged when used under special conditions such as high pressure and high humidity, and have poor product reliability.

[0006] The present invention is implemented as follows: a stacked high-voltage resistant piezoelectric ceramic, characterized in that it comprises:

[0007] An insulating sheet, comprising at least two insulating sheets;

[0008] A piezoelectric ceramic sheet, wherein the piezoelectric ceramic sheet comprises a positive electrode surface and a negative electrode surface after polarization, and a plurality of piezoelectric ceramic sheets are stacked between two of the insulating sheets, and the positive electrode surfaces and negative electrode surfaces of two adjacent piezoelectric ceramic sheets are arranged in opposite directions;

[0009] An electrode, comprising a positive electrode and a negative electrode, wherein the positive electrode and the negative electrode respectively comprise an electrode sheet and a connecting crossbeam, and a plurality of the electrode sheets are connected in series via a plurality of connecting crossbeams; the electrodes and the piezoelectric ceramic sheets are alternately stacked and bonded; the top and bottom electrode sheets are respectively bonded to the two insulating sheets; the electrode sheet of the positive electrode is sequentially connected to the positive electrode surface of the piezoelectric ceramic sheet, and the electrode sheet of the negative electrode is sequentially connected to the negative electrode surface of the piezoelectric ceramic sheet; the connecting crossbeam is bent to have a hollow arc-shaped cavity and extends to the outside of the piezoelectric ceramic sheet;

[0010] Two electrical leads are provided, and the two electrical leads are respectively connected to the positive electrode and the negative electrode for external power supply;

[0011] The insulating layer at least covers the insulating sheet, the piezoelectric ceramic sheet and the electrode, and fills the arc-shaped cavity of the connecting beam.

[0012] Furthermore, it also includes a plurality of metal wires for connecting the positive electrode in series or the negative electrode in series, wherein the metal wires are connected to a plurality of connecting beams of the positive electrode or to a plurality of connecting beams of the negative electrode; and the insulating layer covers the metal wires.

[0013] Furthermore, the electrode sheet is bonded to the positive electrode surface or the negative electrode surface by glue, and the electrode sheet is provided with a plurality of through holes for releasing the glue stress.

[0014] Furthermore, the piezoelectric ceramic sheet and the electrode sheet have similar shapes and sizes, and the cross-sections of the piezoelectric ceramic sheet and the electrode sheet are rectangular, circular, or hollow circular or rectangular rings.

[0015] Furthermore, the plurality of connecting beams of the positive electrodes are arranged in two groups opposite to each other on the outside of the piezoelectric ceramic sheet, and the plurality of connecting beams of the negative electrodes are arranged in two groups opposite to each other on the outside of the piezoelectric ceramic sheet; the connecting line of the two groups of connecting beams of the positive electrodes and the connecting line of the two groups of connecting beams of the negative electrodes form an angle greater than 0 degrees.

[0016] A method for manufacturing the stacked high-voltage resistant piezoelectric ceramic of the present invention comprises the following steps:

[0017] S1. Screening and grinding of piezoelectric ceramic sheets;

[0018] Screen the piezoelectric ceramic sheets that have no damage on the appearance, have been polarized, and have parallelism that meets the requirements or have parallelism that meets the requirements after grinding;

[0019] Bending and bonding of electrodes;

[0020] The electrode is composed of a plurality of electrode sheets connected in series through a plurality of connecting beams; the electrode includes a positive electrode and a negative electrode; an insulating sheet is placed at the bottom of the pressing mechanism, and then glue is applied on the insulating sheet, and the first electrode sheet of the positive electrode is glued to the insulating sheet;

[0021] Apply glue on the top of the first electrode sheet of the positive electrode, and then glue the positive electrode surface of the first piezoelectric ceramic sheet to the first electrode sheet of the positive electrode;

[0022] Apply glue on the negative electrode surface of the first piezoelectric ceramic sheet, and then glue the first electrode sheet of the negative electrode to the negative electrode surface of the first piezoelectric ceramic sheet;

[0023] Apply glue on the first electrode sheet of the negative electrode, and then glue the negative electrode surface of the second piezoelectric ceramic sheet to the first electrode sheet of the negative electrode;

[0024] Apply glue on the positive electrode surface of the second piezoelectric ceramic sheet, bend the connecting crossbeam of the positive electrode, and make the second electrode sheet of the positive electrode adhere to the positive electrode surface of the second piezoelectric ceramic sheet;

[0025] Bonding of the positive electrode, negative electrode and piezoelectric ceramic sheet Repeat the above steps S2.2-S2.5 to stack the piezoelectric ceramic sheets to the required height, then apply glue on the last electrode sheet of the positive electrode, and then bond another insulating sheet to the last electrode sheet of the positive electrode;

[0026] Using a pressing mechanism to press the insulating sheets at both ends of the stacked piezoelectric ceramic sheets;

[0027] Drying the adhesive layer; placing the pressing mechanism with the stacked piezoelectric ceramic sheets pressed thereon into a drying box, and removing the stacked piezoelectric ceramic sheets after drying;

[0028] Welding wires; welding conductive leads on the connecting beams of the positive electrode and the negative electrode respectively;

[0029] Sealing the insulating adhesive layer; dipping the stacked piezoelectric ceramic sheets into the insulating adhesive, and after curing, the insulating adhesive layer at least covers the insulating sheets, the piezoelectric ceramic sheets and the electrodes, and fills the hollow arc cavity formed by bending the connecting beams.

[0030] Furthermore, step S4 also includes: welding a plurality of connecting beams of the positive electrode and a plurality of connecting beams of the negative electrode to metal wires that are connected in series to the positive electrode and the negative electrode, respectively.

[0031] Furthermore, step S2.6 also includes: a number of connecting beams of the positive electrodes are arranged into two opposite groups along the stacking direction of the piezoelectric ceramic sheets, and a number of connecting beams of the negative electrodes are arranged into two opposite groups along the stacking direction of the piezoelectric ceramic sheets; the connecting lines of the two groups of positive electrodes and the connecting lines of the two groups of negative electrodes form an angle greater than 0 degrees.

[0032] Furthermore, the angle range is 60-90 degrees.

[0033] The stacked high-voltage resistant piezoelectric ceramic of the present invention has a structure in which piezoelectric ceramic sheets and electrodes are alternately stacked and bonded. Compared with the piezoelectric ceramics in the prior art, it has the same volume, lower electrostatic capacitance, better dynamic performance under preload conditions, and the advantages of high-voltage resistance.

[0034] The electrode of the present invention is an integrally cut electrode sheet and a connecting beam, and a hollow arc-shaped cavity is formed after the connecting beam is bent. The structure is stable and reliable. The metal wires that weld the connecting beams of the positive electrode and the negative electrode together further ensure the reliability of the connection, improve the reliability of the stacked high-voltage resistant piezoelectric ceramics, and extend the service life of the product. The insulating adhesive layer insulates the outer surface of the stacked high-voltage resistant piezoelectric ceramics, and also plays a role in physical collision prevention, thereby improving the overall product quality. In addition, the insulating adhesive layer fills the arc-shaped cavity at the bend of the connecting beam, effectively preventing high-voltage electrical breakdown. The present invention can be used normally under non-standard atmospheric pressure or in special environments such as high relative humidity, and has a wide range of applications.

[0035] The manufacturing method of the stacked high-voltage resistant piezoelectric ceramic of the present invention has a simple manufacturing process, high efficiency and high product yield. The present invention optimizes the structure and shape of the piezoelectric ceramic sheet from the manufacturing process, ensures the consistency and stability of the bonding between each layer of the piezoelectric ceramic sheet and the electrode, makes the internal polarization electric field evenly distributed under high voltage, makes the product have the characteristics of stable high-voltage resistance, and takes into account both piezoelectricity and high-voltage resistance. The sealing insulating glue layer process further increases the structural integrity, strength, moisture resistance and reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a schematic diagram of the three-dimensional structure of the stacked high-voltage resistant piezoelectric ceramic provided by the present invention;

[0037] Figure 2 Partial exploded view of the stacked high-voltage resistant piezoelectric ceramic provided by the present invention;

[0038] Figure 3 A front view of a stacked high-voltage resistant piezoelectric ceramic provided by the present invention;

[0039] Figure 4 The present invention provides Figure 3 A partial enlarged view of

[0040] Figure 5 is a top view of the electrode provided by the present invention;

[0041] Figure 6 is a top view of the stacked high-voltage resistant piezoelectric ceramic provided by the present invention;

[0042] Figure 7It is a process roadmap of the method for manufacturing the stacked high-voltage resistant piezoelectric ceramic provided by the present invention;

[0043] In the figure: 1-insulating sheet; 2-piezoelectric ceramic sheet; 3-electrode; 31-positive electrode; 32-negative electrode; 301-electrode sheet; 302-connecting beam; 303-through hole; 304-arc cavity; 4-electrical lead; 5-metal wire; 6-insulating layer. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0045] The implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0046] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0047] Reference Figure 1-7 The figure shows a preferred embodiment of the present invention.

[0048] A stacked high-voltage resistant piezoelectric ceramic comprising an insulating sheet 1, a piezoelectric ceramic sheet 2, an electrode 3, an electrical lead 4 and an insulating layer 6, referring to Figure 1-2 . The insulating sheet 1 includes at least two insulating sheets 1, which are respectively arranged at the top and the bottom. The insulating sheet 1 can be an unpolarized insulating ceramic sheet. A number of piezoelectric ceramic sheets 2 and electrodes 3 are stacked alternately between the two insulating sheets 1. Each piezoelectric ceramic sheet 2 is polarized to include a positive electrode surface and a negative electrode surface that are opposite to each other. The positive electrode surface and the negative electrode surface of two adjacent piezoelectric ceramic sheets 2 are set in opposite directions. For example, the positive electrode surface of the first piezoelectric ceramic sheet 2 stacked in sequence faces up and the negative electrode surface faces down, the negative electrode surface of the second piezoelectric ceramic sheet 2 faces up and the positive electrode surface faces down, the positive electrode surface of the third piezoelectric ceramic sheet 2 faces up and the negative electrode surface faces down..., and they are stacked in sequence according to the above. The structure of the present invention is formed by alternately stacking and bonding piezoelectric ceramic sheets 2 and electrodes 3. Compared with the piezoelectric ceramics in the prior art, it has the same volume, low electrostatic capacitance, better dynamic performance under preload conditions, and high voltage resistance.

[0049] The electrode 3 includes a positive electrode 31 and a negative electrode 32. Figure 2-3 In the unfolded state, the electrode 3 is in strip shape, with one positive electrode 31 and one negative electrode 32. Each electrode 3 includes an electrode sheet 301 and a connecting beam 302. Figure 5 . Several electrode sheets 301 are connected in series through several connecting beams 302 to form strips, and the electrode sheets 301 and the connecting beams 302 are cut as one piece. When bonding with the piezoelectric ceramic sheet 2, it is necessary to bend the connecting beams 302 so that the center of the electrode sheet 301 is on an axis as much as possible, and the axis direction is the stacking direction of the piezoelectric ceramic sheet 2. The connecting beams 302 are arranged in two groups in a curved arc, and the two groups are symmetrically distributed on both sides of the electrode sheet 301. The electrode 3 is preferably a copper electrode. Preferably, the electrode sheet 301 is provided with several through holes 303 for releasing glue stress. The piezoelectric ceramic sheet 2 is comparable to the electrode sheet 301 in shape and size, and the cross-sections of the piezoelectric ceramic sheet 2 and the electrode sheet 301 are rectangular, circular, or hollow circular rings or rectangular rings to meet the needs of different application scenarios.

[0050] The electrodes 3 and the piezoelectric ceramic sheets 2 are alternately stacked and bonded, that is, a layer of positive electrode 31, a layer of piezoelectric ceramic sheet 2, a layer of negative electrode 32, etc. are alternately stacked in sequence. The top and bottom electrode sheets 301 are bonded to two insulating sheets 1 respectively. The electrode sheet 301 of the positive electrode 31 is sequentially connected to the positive electrode surface of the piezoelectric ceramic sheet 2, and the electrode sheet 301 of the negative electrode 32 is sequentially connected to the negative electrode surface of the piezoelectric ceramic sheet 2. The connecting beam 302 is bent to have a hollow arc cavity 304. The electrode sheet 301 is bonded between the piezoelectric ceramic sheets 2, and the connecting beam 302 is bent and arranged on the outside of the four sides of the piezoelectric ceramic sheet 2. The connecting beam 302 can be used to connect the electrical lead 4 and the metal wire 5. Further, a plurality of connecting beams 302 of the positive electrode 31 are arranged in two groups opposite to each other on the outside of the piezoelectric ceramic sheet 2, and a plurality of connecting beams 302 of the negative electrode 32 are arranged in two groups opposite to each other on the outside of the piezoelectric ceramic sheet 2. In the top view of the stack of piezoelectric ceramic sheets 2, the connecting line of the connecting beams 302 of the two groups of positive electrodes 31 and the connecting line of the connecting beams 302 of the two groups of negative electrodes 32 form an angle α greater than 0 degrees, and the angle α is preferably in the range of 60-90 degrees. Figure 6 The electrode 3 of the present invention is an electrode sheet 301 and a connecting beam 302 cut in one piece. The connecting beam 302 is bent to form a hollow arc cavity 304. The structure is stable and reliable, and the high-temperature electrode 3 is not easy to fall off. The metal wire 5 that welds the connecting beams 302 of the positive electrode 31 and the negative electrode 32 together further ensures the reliability of the connection, improves the reliability of the stacked high-voltage resistant piezoelectric ceramic, and prolongs the service life of the product.

[0051] The electric lead 4 is used for external power supply. Two electric leads 4 are provided. The two electric leads 4 are connected to the positive electrode 31 and the negative electrode 32 respectively. The electric lead 4 can be a ceramic wire. Preferably, one ceramic wire is welded to the bottom of the positive electrode 31 and the negative electrode 32 respectively, and the two ceramic wires are red and black ceramic wires respectively, and the diameter of the ceramic wire is selected according to the needs.

[0052] In order to insulate the stacked high-voltage resistant piezoelectric ceramics, the insulating layer 6 is used to prevent collisions, thereby increasing the overall product quality. The insulating layer 6 is coated on the outside of the insulating sheet 1, the piezoelectric ceramic sheet 2, the electrode 3, and the outside of the welding point between the electrical lead 4 and the electrode 3. After the piezoelectric ceramic is encapsulated by the insulating layer 6, the high-voltage resistance and anti-breakdown performance of the piezoelectric ceramic product are increased, and it can be used under non-standard atmospheric pressure environments or in environments with high relative humidity. Furthermore, the insulating layer 6 fills the arc cavity 304 connecting the cross beam 302, referring to Figure 4 , it can be used under non-standard atmospheric pressure or in an environment with high relative humidity, and can effectively prevent high-voltage electrical breakdown.

[0053] Furthermore, it also includes a plurality of metal wires 5 for welding the positive electrode 31 and the negative electrode 32 together, respectively, to ensure that the circuit will not be unable to be used normally due to partial damage of the electrode 3, and further ensure the stability of the circuit. The metal wires 5 are connected to a plurality of connecting cross-links 302 of the positive electrode 31 or to a plurality of connecting cross-beams 302 of the negative electrode 32. At the same time, the metal wires 5 are coated with the insulating layer 6 to play the role of insulation and physical protection.

[0054] A method for manufacturing a stacked high-voltage resistant piezoelectric ceramic according to the present invention, referring to Figure 7 , including the following steps:

[0055] S1, screening and grinding of the piezoelectric ceramic sheet 2.

[0056] The piezoelectric ceramic sheets 2 are screened for those that are not damaged in appearance, have been polarized, and have parallelism that meets the requirements or have parallelism that meets the requirements after grinding. The screening and grinding ensure that the quality of the piezoelectric ceramic sheets 2 is consistent and stable.

[0057] Bending and bonding of electrode 3.

[0058] The electrode 3 is composed of a plurality of electrode sheets 301 connected in series through a plurality of connecting beams 302. The electrode 3 includes a positive electrode 31 and a negative electrode 32. The insulating sheet 1 is placed at the bottom of the pressing mechanism, and then glue is applied on the insulating sheet 1, and the first electrode sheet 301 of the positive electrode 31 is concentrically glued to the insulating sheet 1.

[0059] Glue is applied on the top of the first electrode sheet 301 of the positive electrode 31 , and then the positive electrode surface of the first piezoelectric ceramic sheet 2 is concentrically glued to the first electrode sheet 301 of the positive electrode 31 .

[0060] Glue is applied on the negative electrode surface of the first piezoelectric ceramic sheet 2 , and then the first electrode sheet 301 of the negative electrode 32 is concentrically glued to the negative electrode surface of the first piezoelectric ceramic sheet 2 .

[0061] Apply glue on the first electrode sheet 301 of the negative electrode 32, and then glue the negative electrode surface of the second piezoelectric ceramic sheet 2 concentrically to the first electrode sheet 301 of the negative electrode 32;

[0062] Glue is applied on the positive electrode surface of the second piezoelectric ceramic sheet 2 , and the connecting crossbeam 302 of the positive electrode 31 is bent so that the second electrode sheet 301 of the positive electrode 31 is concentrically bonded to the positive electrode surface of the second piezoelectric ceramic sheet 2 .

[0063] S2.6, bonding of positive electrode 31, negative electrode 32 and piezoelectric ceramic sheet 2 Repeat the above steps S2.2-S2.5, that is, continue to apply glue on the second electrode sheet 301 of the positive electrode 31, and then concentrically glue the positive electrode surface of the third piezoelectric ceramic sheet 2 to the second electrode sheet 301 of the positive electrode 31. Apply glue on the negative electrode surface of the third piezoelectric ceramic sheet 2, bend the connecting beam 302 of the negative electrode 32, and concentrically glue the second electrode sheet 301 of the negative electrode 32 to the negative electrode surface of the third piezoelectric ceramic sheet 2. Apply glue on the second electrode sheet 301 of the negative electrode 32, and then concentrically glue the negative electrode surface of the fourth piezoelectric ceramic sheet 2 to the second electrode sheet 301 of the negative electrode 32. Apply glue on the positive electrode surface of the fourth piezoelectric ceramic sheet 2, bend the connecting beam 302 of the positive electrode 31, and concentrically glue the third electrode sheet 301 of the positive electrode 31 to the positive electrode surface of the fourth piezoelectric ceramic sheet 2...

[0064] The piezoelectric ceramic sheets 2 are stacked to a desired height, and then glue is applied to the last electrode sheet 301 of the positive electrode 31, and then another insulating sheet 1 is bonded to the last electrode sheet 301 of the positive electrode 31. This process is simple and efficient to manufacture, and the bonding of the piezoelectric ceramic sheets 2 and the motor 3 is consistent and stable, so that the entire structure is stable, the internal polarization is uniform under high pressure, and the piezoelectric ceramic forms a stable high-voltage resistance characteristic.

[0065] S2.7. Use a pressing mechanism to press the insulating sheets 1 at both ends of the stacked piezoelectric ceramic sheets 2.

[0066] S3, drying the adhesive layer. Put the pressing mechanism with the stacked piezoelectric ceramic sheets 2 pressed into a drying box, and remove the stacked piezoelectric ceramic sheets 2 after drying.

[0067] S4, welding wires. Conductive leads 4 are welded to the connecting beams 302 at the bottom of the positive electrode 31 and the negative electrode 32. The conductive leads 4 are used to connect to an external power source.

[0068] S5, sealing the insulating adhesive layer 6. Dip the stacked piezoelectric ceramic sheets 2 into the insulating adhesive. After curing, the insulating adhesive layer 6 at least covers the insulating sheet 1, the piezoelectric ceramic sheet 2 and the electrode, and fills the hollow arc cavity 304 formed by bending the connecting beam 302. The insulating adhesive layer 6 partially or completely fills the arc cavity 304, which can effectively prevent electrical breakdown when used in high voltage, high humidity and other environments.

[0069] The manufacturing method of the stacked high-voltage resistant piezoelectric ceramic of the present invention has a simple manufacturing process, high efficiency and high product yield. The present invention optimizes the structure and shape of the piezoelectric ceramic sheet from the manufacturing process, ensures the consistency and stability of the bonding between each layer of the piezoelectric ceramic sheet 2 and the electrode 3, makes the internal polarization electric field evenly distributed under high voltage, makes the product have the characteristics of stable high-voltage resistance, and takes into account the piezoelectricity and high-voltage resistance. The sealing insulating glue layer 6 process further increases the structural integrity, strength, moisture resistance and reliability.

[0070] In the optimized embodiment, in step S4, several connecting beams 302 of the positive electrode 31 and several connecting beams 302 of the negative electrode 32 are respectively welded to the metal wires 5 which connect the positive electrode 31 and the negative electrode 32 in series. The metal wires 5 can effectively prevent partial damage to the electrode 3 and affect the electrical connection of the circuit, thereby ensuring the reliability of the stacked high-voltage resistant piezoelectric ceramics.

[0071] In step S2.6, the plurality of connecting beams 302 of the positive electrode 31 are arranged in two opposite groups along the stacking direction of the piezoelectric ceramic sheets 2, and the plurality of connecting beams 302 of the negative electrode 32 are arranged in two opposite groups along the stacking direction of the piezoelectric ceramic sheets 2. In the top view direction of the stacking of the piezoelectric ceramic sheets 2, the connecting lines of the two groups of connecting beams 302 of the positive electrodes 31 and the connecting lines of the two groups of connecting beams 302 of the negative electrodes 32 form an angle greater than 0 degrees, and the angle is preferably 60-90 degrees, so as to ensure that the plurality of connecting beams 302 of the positive electrode 31 and the plurality of connecting beams 302 of the negative electrode 32 are as far away as possible from each other and do not touch each other.

[0072] The present invention is not limited thereto; any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A stacked high-voltage resistant piezoelectric ceramic, characterized in that: include: An insulating sheet (1), comprising at least two insulating sheets (1); A piezoelectric ceramic sheet (2), wherein the piezoelectric ceramic sheet (2) comprises a positive electrode surface and a negative electrode surface after polarization, and a plurality of piezoelectric ceramic sheets (2) are stacked between two insulating sheets (1), and the positive electrode surfaces and negative electrode surfaces of two adjacent piezoelectric ceramic sheets (2) are arranged in opposite directions; An electrode (3), comprising a positive electrode (31) and a negative electrode (32), wherein the positive electrode (31) and the negative electrode (32) respectively comprise an electrode sheet (301) and a connecting crossbeam (302), wherein a plurality of the electrode sheets (301) are connected in series via a plurality of connecting crossbeams (302); the electrode (3) and the piezoelectric ceramic sheet (2) are alternately stacked and bonded; the top and bottom electrode sheets (301) are respectively bonded to two insulating sheets (1); the electrode sheet (301) of the positive electrode (31) is sequentially connected to the positive electrode surface of the piezoelectric ceramic sheet (2), and the electrode sheet (301) of the negative electrode (32) is sequentially connected to the negative electrode surface of the piezoelectric ceramic sheet (2); the connecting crossbeam (302) is bent to have a hollow arc-shaped cavity (304) and extends to the outside of the piezoelectric ceramic sheet (2); Two electrical leads (4) are provided, and the two electrical leads (4) are respectively connected to the positive electrode (31) and the negative electrode (32) for connecting to an external power source; An insulating layer (6) at least covers the insulating sheet (1), the piezoelectric ceramic sheet (2) and the electrode (3), and fills the arc-shaped cavity (304) of the connecting beam (302).

2. The stacked high-voltage resistant piezoelectric ceramic according to claim 1, characterized in that: It also includes a plurality of metal wires (5) for connecting the positive electrode (31) in series or the negative electrode (32) in series, wherein the metal wires (5) are connected to a plurality of connecting beams (302) of the positive electrode (31) or to a plurality of connecting beams (302) of the negative electrode (32); and the insulating layer (6) covers the metal wires (5).

3. The stacked high-voltage resistant piezoelectric ceramic according to claim 1, characterized in that: The electrode sheet (301) is bonded to the positive electrode surface or the negative electrode surface by glue, and the electrode sheet (301) is provided with a plurality of through holes (303) for releasing glue stress.

4. The stacked high-voltage resistant piezoelectric ceramic according to claim 1, characterized in that: The shape and size of the piezoelectric ceramic sheet (2) and the electrode sheet (301) are comparable, and the cross-sections of the piezoelectric ceramic sheet (2) and the electrode sheet (301) are rectangular, circular, or hollow circular or rectangular rings.

5. The stacked high-voltage resistant piezoelectric ceramic according to claim 1, characterized in that: The plurality of connecting beams (302) of the positive electrode (31) are arranged in two groups opposite to each other on the outside of the piezoelectric ceramic sheet (2), and the plurality of connecting beams (302) of the negative electrode (32) are arranged in two groups opposite to each other on the outside of the piezoelectric ceramic sheet (2); the connecting line of the connecting beams (302) of the two groups of positive electrodes (31) and the connecting line of the connecting beams (302) of the two groups of negative electrodes (32) form an angle greater than 0 degrees.

6. A method for manufacturing a stacked high-voltage resistant piezoelectric ceramic, characterized in that: The manufacturing method is used to manufacture the stacked high-voltage resistant piezoelectric ceramic according to any one of claims 1 to 5, comprising the following steps: S1, screening and grinding of piezoelectric ceramic sheets (2); Screening piezoelectric ceramic sheets (2) that have no damage on the outside, have been polarized, and have parallelism that meets the requirements or have parallelism that meets the requirements after grinding; S2, bending and bonding of electrodes (3); S2.1, the electrode (3) is formed by connecting a plurality of electrode sheets (301) in series via a plurality of connecting cross beams (302); the electrode (3) comprises a positive electrode (31) and a negative electrode (32); the insulating sheet (1) is placed at the bottom of the pressing mechanism, and then glue is applied on the insulating sheet (1), and the first electrode sheet (301) of the positive electrode (31) is glued to the insulating sheet (1); S2.2, applying glue on the top of the first electrode sheet (301) of the positive electrode (31), and then gluing the positive electrode surface of the first piezoelectric ceramic sheet (2) to the first electrode sheet (301) of the positive electrode (31); S2.3, applying glue on the negative electrode surface of the first piezoelectric ceramic sheet (2), and then gluing the first electrode sheet (301) of the negative electrode (32) to the negative electrode surface of the first piezoelectric ceramic sheet (2); S2.4, applying glue to the first electrode sheet (301) of the negative electrode (32), and then gluing the negative electrode surface of the second piezoelectric ceramic sheet (2) to the first electrode sheet (301) of the negative electrode (32); S2.5, applying glue on the positive electrode surface of the second piezoelectric ceramic sheet (2), bending the connecting beam (302) of the positive electrode (31), so that the second electrode sheet (301) of the positive electrode (31) is bonded to the positive electrode surface of the second piezoelectric ceramic sheet (2); S2.

6. Bonding of the positive electrode (31), the negative electrode (32) and the piezoelectric ceramic sheet (2). Repeat the operations of the above steps S2.2 to S2.5 to stack the piezoelectric ceramic sheets (2) to a desired height, then apply glue to the last electrode sheet (301) of the positive electrode (31), and then bond another insulating sheet (1) to the last electrode sheet (301) of the positive electrode (31); S2.7, using a pressing mechanism to press the insulating sheets (1) at both ends of the stacked piezoelectric ceramic sheets (2); S3, drying the adhesive layer; placing the pressing mechanism with the stacked piezoelectric ceramic sheets (2) pressed thereon into a drying box, and removing the stacked piezoelectric ceramic sheets (2) after drying; S4, welding wires; welding conductive leads (4) to the connecting crossbeams (302) of the positive electrode (31) and the negative electrode (32), respectively; S5, sealing the insulating adhesive layer (6); dipping the stacked piezoelectric ceramic sheets (2) in insulating adhesive, and after curing, the insulating adhesive layer (6) at least covers the insulating sheet (1), the piezoelectric ceramic sheet (2) and the electrode (3), and fills the hollow arc cavity (304) formed by bending the connecting beam (302).

7. The method for manufacturing a stacked high-voltage resistant piezoelectric ceramic according to claim 6, characterized in that: Step S4 also includes: welding a plurality of connecting crossbeams (302) of the positive electrode (31) and a plurality of connecting crossbeams (302) of the negative electrode (32) to respectively connect in series the metal wires (5) of the positive electrode (31) and the negative electrode (32).

8. The method for manufacturing stacked high-voltage resistant piezoelectric ceramics according to claim 6, characterized in that: Step S2.6 also includes: a plurality of connecting beams (302) of the positive electrode (31) are arranged into two opposite groups along the stacking direction of the piezoelectric ceramic sheets (2), and a plurality of connecting beams (302) of the negative electrode (32) are arranged into two opposite groups along the stacking direction of the piezoelectric ceramic sheets (2); and a connecting line of the connecting beams (302) of the two groups of positive electrodes (31) and a connecting line of the connecting beams (302) of the two groups of negative electrodes (32) form an angle greater than 0 degrees.

9. The method for manufacturing stacked high-voltage resistant piezoelectric ceramics according to claim 8, characterized in that: The angle range is 60-90 degrees.

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