Component carrier having signal conducting element and shielding conducting structure

Abstract

There is provided a carrier assembly (100) comprising (i) a component carrier (101); (ii) a component (110) located in or on the component carrier (101); (iii) a signal conducting element (120) arranged on a component surface (111) of the component (110); and (iv) a shielding conductive structure 130 which is at least partially embedded in the component carrier (101) and which at least partially surrounds the signal conducting element (120).

Description

Technical Field

[0001] The present invention generally relates to the technical field of component carriers, which serve as mechanical support structures for electronic components and are used to make electrical contact with the electronic components. In particular, the present invention relates to a carrier assembly comprising a component carrier and a component having signal transmission and / or signal processing capabilities. Background Art

[0002] The design of printed circuit boards (PCBs) and the components mounted on or embedded in them is becoming increasingly smaller and better suited to faster signal transmission and processing. Especially for high-frequency signals in the GHz range, controlled impedance of traces plays a crucial role in signal integrity and, therefore, the overall performance of the PCB. This is particularly important in areas such as telecommunications, 5G and 6G applications, or analog video processing.

[0003] For example, embedding a radio frequency (RF) chip within a printed circuit board requires impedance-controlled lines to connect the chip. The chip's RF output, connected to the impedance-controlled lines, radiates. This can cause unwanted coupling between the output and the RF chip and / or chip inputs, or between the RF chip and / or chip inputs and outputs. This coupling often leads to instability in the RF chip.

[0004] Therefore, a carrier assembly including signal processing components may be required to provide improved signal quality. Summary of the Invention

[0005] This need is met by the subject matter according to the independent claim. Advantageous embodiments of the invention are described by the dependent claims.

[0006] According to one aspect of the present invention, a carrier assembly is provided, comprising (i) a component carrier, (ii) a component, in particular an RF component, located in or on the component carrier, (iii) a signal-conducting element arranged on a component surface, preferably a major surface, of the component, and (iv) a shielding conductive structure at least partially embedded in the component carrier and at least partially surrounding or encircling the signal-conducting element.

[0007] In the context of this application, the term "carrier assembly" may particularly denote any structure or arrangement comprising a component carrier and a component. Components may be mounted on a component carrier and / or embedded in a component carrier. A carrier assembly may comprise more than one element and / or more than one component carrier.

[0008] In the context of the present application, the term "component carrier" may particularly denote any supporting structure that is capable of accommodating one or more components on and / or in the component carrier to provide mechanical support and / or electrical connection. In other words, the component carrier may be configured as a mechanical and / or electronic carrier for the components. In particular, the component carrier may be one of the following: a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. The component carrier may also be a hybrid board that combines different types of component carriers of the above-mentioned types. The component carrier may include one or more components mounted on or embedded in the component carrier.

[0009] The component carrier may comprise a "stack" of at least one electrically insulating layer structure and / or at least one electrically conductive layer structure. For example, the component carrier may be a laminate of the electrically insulating layer structure(s) and the electrically conductive layer structure(s), in particular a laminate formed by applying mechanical pressure and / or heat. This stack may provide a plate-like component carrier that can provide a large mounting surface for other components and is very thin and compact.

[0010] The term "layer structure" may refer to a continuous layer, a patterned layer, or a plurality of discontinuous islands in a common plane. Different layer structures are stacked one on top of another along a "stacking direction." The stacking direction of a component carrier or stack is parallel to the surface normal of the layer structure main surface and / or the main surface of the stack. The "main surface" of a layer, layer structure, or stack can be either of these two surfaces, the two surfaces having the largest extension compared to the other surfaces. The main surface can be defined as the surface perpendicular to the stacking direction. The "side surface" of a layer, layer structure, or stack can be any external surface that is not a main surface. The side surface can be any external surface that is perpendicular to the main surface and / or extends along the stacking direction. Relative to a given stack, the "vertical direction" can be defined as parallel to the stacking direction. Relative to a given stack, the "horizontal direction" can be defined as any direction perpendicular to the stacking direction.

[0011] A “component” may be an electronic component, which may be any physical entity forming part of an electronic system. An electronic component may have one or more electrical terminals or leads configured to make electrical contact with the electronic component. A component may include one or more electronic circuits, which may be configured to implement a specific function or sub-function of the component, particularly in the context of an electronic system. A component may itself include one or more sub-components, which are themselves components. A component may include a carrier for mechanically stabilizing the component, serving as a support structure for different parts of the component and / or for electrically connecting different parts of the component. A component may include a housing and / or an enclosure to protect the component from external influences, such as mechanical or electromagnetic influences. A component may be an active component, a passive component or an electromechanical component.

[0012] The components can be surface mounted to the stack, for example, at the top or bottom surface of the stack relative to the stacking direction, or at the side surfaces of the stack relative to the stacking direction. The components can be at least partially, and in particular completely, embedded in the component carrier. The components can be arranged in a recess or cavity of the component carrier. When the components are embedded, the entire surface of the component can be in contact with the stack, or at least part of the surface of the component can be free from contact with the stack. The components can be separated from the stack by a gap, which can be defined by the cavity or recess in which the components are arranged.

[0013] In the context of the present application, the term "RF component" may particularly denote any component configured to receive, transmit and / or process radio frequency (RF) signals. Alternatively, high frequency (HF) signals may be received, transmitted and / or processed. Radio frequency may refer to the oscillation rate of electromagnetic radio waves in the range of approximately 3 kHz to 300 GHz, as well as the alternating current that carries such radio signals. RF components may be configured to receive radio signals, convert radio signals, analyze radio signals and / or transmit radio signals, in particular radio signals having a frequency greater than 100 MHz, in particular greater than 1 GHz.

[0014] In the context of this application, the term "signal-conducting element" may particularly refer to any object or structure capable of transmitting a signal from one location to another, different location. The signal may be transmitted via a carrier such as an electric current and / or electromagnetic waves via the signal-conducting element. The electric current may be direct current and / or alternating current. The signal-conducting element may be electrically conductive, but need not be. For example, the signal-conducting element may comprise or consist of copper. Alternatively, the signal-conducting element may comprise a dielectric material. The signal-conducting element may form part of a component and / or a component carrier. The signal-conducting element may also be formed separately. The signal-conducting element may form part of an antenna and / or may constitute an antenna. The shape of the signal-conducting element is not limited to any particular shape. In one example, the shape of the signal-conducting element may include an edge portion, such as a triangle or a rectangle. In a different example, the signal-conducting element may include an annular shape, such as a circle. The signal-conducting element may be configured to connect to an impedance-controlled line. The carrier assembly may include one, two, three, four, five, more than five, more than ten, or even more than one hundred signal-conducting elements.

[0015] In the context of the present application, the term "shielding conductive structure" may particularly denote a structure arranged to shield a portion or region of a carrier assembly from another portion or region of the carrier assembly. For example, the shielding conductive structure may be arranged to shield different portions of the carrier assembly from interference influences or disturbances originating from other portions, for example to shield different portions of the carrier assembly from electromagnetic interference originating from other portions. The shielding structure may shield an RF signal input port from an RF signal output port and / or shield an RF signal output port from an RF signal input port. The shielding conductive structure may comprise a plurality of shielding conductive elements, which are formed independently. The shielding conductive structure may be electrically conductive, but need not be electrically conductive. For example, the shielding conductive structure may comprise or consist of copper. At least a portion of the shielding conductive structure, in particular the entire shielding conductive structure, may be connected to a reference potential, in particular at least a portion of the shielding conductive structure may be grounded, in particular the entire shielding conductive structure may be grounded. The shielding conductive structure may be directly connected to a ground structure of the component, in particular to ensure a complete shielding path from the component through the component carrier to the outside of the component carrier. The conductive structure for shielding may form part of the component and / or the component carrier.The conductive structure for shielding may also be formed separately.

[0016] The shielding conductive structure can be arranged symmetrically around the signal-conducting element, for example, with point symmetry and / or mirror symmetry about one or more axes of symmetry. The distance between the signal-conducting element and the shielding conductive structure can vary, in particular by up to 25%, in particular by up to 10%, or the distance between the signal-conducting element and the shielding conductive structure can remain constant. Furthermore, the shielding conductive structure can comprise an electrically conductive material, in particular copper.

[0017] The signal-conducting element may have an "extension direction" along which the signal may be conducted. The signal-conducting element may be in direct and / or indirect contact with the component, in particular with the surface of the component on which the signal-conducting element is provided. The extension direction may be, but need not be, orthogonal to the surface. The shielding conductive structure may also extend along the extension direction, for example by having substantially the same cross-section along the extension direction. The shielding conductive structure may be arranged on the same surface as the signal-conducting element. The shielding conductive structure may be in direct and / or indirect contact with the component, in particular with the surface of the component on which the shielding conductive structure is provided. The signal-conducting element and / or the shielding conductive structure may be connected to corresponding electrical contacts of the component.

[0018] A "component surface" provided with a signal-conducting element and / or a conductive shielding structure may be any external surface of a component. A component surface may be any surface of a component that is in direct contact with a component carrier. A component surface may be a main surface of a component or a side surface of a component. Additionally or alternatively, a component surface may include at least one protruding (electrically conductive) connecting element, in particular a columnar portion, which may be configured to connect the component to a signal-conducting element. Different signal-conducting elements may be provided on different surfaces of a component.

[0019] The statement that the shielding conductive structure is "at least partially embedded" in the component carrier can particularly mean that at least a portion of the shielding conductive structure is in direct contact with an inner portion of the component carrier, i.e., not only with the outer surface of the component carrier. This statement can also mean that at least a portion of the shielding conductive structure is in direct contact with an inner layer structure of the component carrier, i.e., a layer structure that does not form an outer layer structure in the stacking direction. The shielding conductive structure can be completely embedded. For example, the shielding conductive structure can be completely surrounded by the carrier assembly. All outer surfaces of the shielding conductive structure can be in direct contact with the carrier assembly.

[0020] The statement that the shielding conductive structure "at least partially surrounds" the signal-conducting element may specifically mean that the shielding conductive structure at least partially surrounds the signal-conducting element in a plane perpendicular to the direction of extension. The shielding conductive structure may at least partially surround the signal-conducting element in all such planes along the direction of extension. The shielding structure may cover an angle of at least 10 degrees, particularly 25 degrees, particularly 90 degrees, and particularly 180 degrees, as viewed from the signal-conducting element. Individual gaps in the shielding structure may cover an angle of less than 120 degrees, particularly less than 90 degrees, and particularly less than 60 degrees. The angle may be defined relative to a plane perpendicular to the direction of extension. The shielding conductive structure may cover a line of sight between the signal-conducting element and a portion or region of the component carrier that is shielded relative to the signal-conducting element, or between a portion or region of the component carrier that is shielded relative to the signal-conducting element and the signal-conducting element.

[0021] An advantage of the carrier assembly described above is that the signal-conducting elements are at least partially shielded, thereby reducing or even completely eliminating interference effects or disturbances emanating from the signal-conducting elements, particularly interference effects or disturbances due to electromagnetic radiation. Conversely, the signal-conducting elements themselves can shield interference effects or disturbances emanating from other parts of the carrier assembly. The shielding conductive structure can, for example, shield particularly sensitive portions of the component and / or component carrier, such as signal-conducting portions carrying signals with frequencies greater than 100 MHz or greater than 1 GHz. This can allow sensitive portions of the component and / or carrier, such as RF signal-conducting elements such as RF ports and / or RF conductors, to be placed closer together, thereby providing more efficient and flexible design options for the carrier assembly. For example, dedicated shielding structures on the chip can reduce or even eliminate radiation from chip outputs and / or chip inputs. Furthermore, the shielding structure can be applied to chip inputs, where it can improve the signal-to-noise ratio of the input signal. Consequently, the overall signal quality of the carrier assembly can be improved.

[0022] The carrier assembly described above utilizes a coaxial structure to provide excellent impedance control for the chip's signal inputs and outputs. The effective shielding achieved by the coaxial structure can be combined with impedance-controlled lines to shield the inputs and outputs of RF semiconductors. Another advantage is excellent shielding of the RF semiconductor chip's inputs and / or outputs to prevent radiation. This product is particularly useful for applications in the GHz range that require impedance-controlled lines.

[0023] According to one embodiment of the present invention, the component includes a first main surface and a second main surface, one of the first main surface and the second main surface being a component surface on which the signal conducting element is disposed.

[0024] According to another embodiment of the present invention, the shielding conductive structure comprises at least one shielding conductive element, in particular a plurality of shielding conductive elements, which surround the signal-conducting element. At least one of the shielding conductive elements can be connected to a component surface, in particular to one of the first main surface or the second main surface of the component. The shielding conductive structure can be connected directly or indirectly, i.e., the shielding conductive structure is connected via an intermediate material, such as solder or sintering paste, the solder being in particular a soldering paste. At least one of the shielding conductive elements can be electrically connected to the component surface, in particular to an electrical contact on the component surface. All the shielding conductive elements can be formed spatially separated from each other, or at least two of the shielding conductive elements can be connected, in particular all the shielding conductive elements can be connected.

[0025] The plurality of shielding conductive elements may comprise two, three, four, five, more than five, more than ten or even more than one hundred shielding conductive elements. The shielding conductive elements may be arranged in a circle around the signal conducting element. The shielding conductive elements may all be arranged at a similar distance from the signal conducting element, in particular at the same distance from the signal conducting element. The distances may deviate by less than 50 percent, in particular by less than 10 percent, in particular by less than 5 percent. Alternatively or additionally, the shielding conductive elements may be arranged such that adjacent elements are at similar distances from one another, in particular by the same distance. Some or all of the shielding conductive elements may be formed as walls, and / or some or all of the shielding conductive elements may have a circular cross-section, in particular in a plane parallel to the component surface. At least one of the shielding conductive elements may be perpendicular to the component surface, in particular all of the shielding conductive elements may extend perpendicular to the component surface.

[0026] The above embodiment can be advantageous because the plurality of shielding conductive elements can be more easily manufactured using standard techniques, such as standard techniques for forming vias, than a single continuous shielding conductive structure. At the same time, the plurality of shielding conductive elements can achieve shielding as well or nearly as well as a single continuous shielding conductive structure.

[0027] According to another embodiment of the present invention, the shielding conductive structure comprises a shielding conductive wall that at least partially surrounds or encircles the signal conducting element. The shielding conductive wall may correspond to the shielding conductive element. The shielding conductive wall, in particular the height of the shielding conductive wall, may extend in the stacking direction of the component carrier and / or in the thickness direction of the component carrier. The shielding conductive wall may be arranged perpendicular to the component surface. The shielding conductive wall may be a transverse wall and / or a vertical wall. The shielding conductive wall may be curved, in particular forming part of a circle or an ellipse, or the shielding conductive wall may be straight. The wall may be solid, without any holes, or the wall may have one or more holes, for example forming a mesh portion. The shielding conductive wall may be electrically conductive. The shielding conductive wall may comprise or consist of copper. The shielding conductive structure may comprise a plurality of shielding conductive walls.

[0028] The above-described shielding conductive wall can be advantageous because it can provide particularly good shielding, for example, compared to shielding conductive elements that are arranged separately from each other with gaps between the elements. The shielding conductive wall can electrically connect the different shielding conductive elements, thereby facilitating grounding of the entire shielding conductive structure.

[0029] According to another embodiment of the invention, the shielding conductive wall is connected to at least one other shielding conductive element, in particular the shielding conductive wall is connected to one or more shielding conductive elements having a circular cross section.

[0030] According to another embodiment of the present invention, the shielding conductive structure completely surrounds the signal-conducting element, in particular surrounds the signal-conducting element.

[0031] The expression "completely surrounding" may particularly mean that the shielding conductive structure completely surrounds the signal-conducting element at a point along its extension, in particular completely surrounds the signal-conducting element along its entire extension. A gap may be present, in particular a gap of less than 120 degrees, in particular a gap of less than 90 degrees, in particular a gap of less than 60 degrees, in particular a gap of less than 30 degrees, in particular a gap of less than 10 degrees. The angle may be defined in a plane parallel to the component surface and / or orthogonal to the extension direction. Alternatively, there may be no gap.

[0032] The above embodiment may be advantageous because the shielding structure may shield the signal conducting element in all directions, in particular in all directions perpendicular to the signal propagation direction along the signal conducting element.

[0033] According to another embodiment of the present invention, the vertical extension or height of the signal-conducting element is greater than the vertical extension or height of the shielding conductive structure. Alternatively, the vertical extension or height of the signal-conducting element may be smaller. The vertical extension or height of the signal-conducting element and the vertical extension or height of the shielding conductive structure may also be equal.

[0034] According to another embodiment of the present invention, at least a portion of the shielding conductive structure is connected to a reference potential, in particular ground. One of the shielding conductive elements may be connected to the reference potential. All shielding structures may be connected to the reference potential, in particular all shielding conductive elements may be connected to the reference potential.

[0035] Such an embodiment may be advantageous in effectively shielding the signal conducting structure from electromagnetic influences, such as signal conducting structures comparable to coaxial cables.

[0036] According to a further embodiment of the invention, the component carrier comprises a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure.

[0037] According to another embodiment of the present invention, the signal-conducting element comprises a conductive interconnection connected to a component surface, in particular to an electrical contact on the component surface, and to an electrically conductive layer structure of a component carrier, in particular to an antenna pad formed at least partially from portions of the electrically conductive layer structure. The electrically conductive layer structure may form part of a stack of components of the component carrier. The conductive interconnection may be electrically conductive and / or signal conductive, i.e., capable of transmitting signals such as electromagnetic waves. The antenna pad may be configured to transmit and / or receive signals transmitted by the signal-conducting element.

[0038] According to another embodiment of the present invention, the signal conducting element and / or the shielding conductive structure, in particular at least one of the shielding conductive elements, comprises a plurality of stacked elements stacked one above the other. For example, all shielding conductive elements comprise a plurality of stacked elements stacked one above the other, each stacked element comprising at least one of a via, a plated through-hole, a columnar portion, and a nanowire. Each stacked element can connect adjacent conductive layer structures. The stacked elements can be stacked vertically. At least two consecutive stacked elements can be offset relative to each other, or none of the stacked elements can be offset relative to each other. In an example, the plurality of stacked elements can comprise a cylindrical shape. In another example, the plurality of stacked elements can comprise a truncated cone shape.

[0039] The above-described embodiment may be advantageous because conventional techniques used in the production of component carriers, such as conventional techniques for via formation or pillar formation, may be used to form the signal conducting elements and / or the shielding conductive structures. This may be particularly efficient and cost-effective.

[0040] According to another embodiment of the present invention, at least a portion of the shielding conductive structure is configured as a dome, the dome at least partially covering the signal-conducting element. The dome may extend from the component surface. To form the dome, the shielding conductive structure may be connected to the electrically conductive layer structure of the layer stack so that a portion of the electrically conductive layer structure extends into an inner region surrounded by the shielding conductive structure. The inner region may be completely covered by the electrically conductive layer structure, or at least one hole may be present, in particular, above the signal-conducting element. The signal-conducting element may not reach the top of the dome, i.e., may terminate below the top of the dome.

[0041] The above embodiment is advantageous for shaping the signals transmitted and / or received by the signal-conducting element, particularly focusing the direction of signal transmission and / or reception. The dome-shaped portion can function as a slit resonator. This embodiment can further reduce interference between the signal-conducting element and other parts of the carrier assembly.

[0042] According to another embodiment of the present invention, at least a portion of the shielding conductive structure is configured as a funnel, which extends, in particular, to a carrier surface of a component carrier. The funnel can be formed from a plurality of stacked elements that are horizontally offset relative to one another. The carrier surface can be an outer surface of the component carrier. The carrier surface can be located above the component surface and / or can be parallel to the component surface.

[0043] The above-described embodiments facilitate guiding signals transmitted and / or received by a signal conducting element, for example, increasing the intensity and / or focus of the transmitted and / or received signals.

[0044] According to a further embodiment, the dome-shaped portion and / or the funnel-shaped portion is configured as a heat distribution structure, in particular to conduct or dissipate heat to a surface of the component carrier.

[0045] According to another embodiment of the present invention, the shielding conductive structure, in particular at least one shielding conductive element and / or shielding conductive wall, is connected to the electrically conductive layer structure of the component carrier at the location where the signal-conducting element is arranged, and the signal-conducting element is arranged between the main surface of the component and the electrically conductive layer structure in the stacking direction and / or in the thickness direction of the stack, in particular, is arranged only between the main surface of the component and the electrically conductive layer structure in the stacking direction and / or in the thickness direction of the stack.

[0046] Such an embodiment may be advantageous because the combination of the shielding conductive structure and the electrically conductive layer structure may form a resonator, in particular a slot resonator. Furthermore, this embodiment may be an effective way to form a dome-like structure above a signal conducting element as described above.

[0047] According to another embodiment of the present invention, the carrier assembly includes at least one of the following features: (i) the component is at least partially covered by an external conductive shield, in particular on the surface of the component opposite to the component surface on which the signal-conducting element is arranged and / or on the corresponding lateral surface of the component; and (ii) the component includes an internal conductive shield, which covers a part of the component surface on which the signal-conducting element is arranged within the component. The lateral surface may refer to a surface extending in the stacking direction of the component carrier and / or a surface orthogonal to the component surface and / or a surface opposite to the component surface. The internal conductive shield may be embedded in the component, in particular completely embedded in the component. The shielding conductive structure may include an external conductive shield and / or an internal conductive shield.

[0048] The outer conductive shield and / or the inner conductive shield may further shield the signal conducting element in directions where (other portions of) the shielding conductive structure cannot effectively shield the signal conducting element.

[0049] According to another embodiment of the present invention, an additional element is provided on the surface of the component on which the signal-conducting element is provided. Preferably, the additional element is a power amplifier, and the additional element includes an additional shielding conductive structure that at least partially surrounds and / or covers the additional element. The additional shielding conductive structure may completely surround and / or cover the additional component. The space defined by the additional shielding conductive structure may contain air and / or dielectric material, in particular, the space between the additional component and the additional shielding conductive structure may contain air and / or dielectric material.

[0050] Additional components, such as power amplifiers, may be needed to convert the signal so that the component can process it. These additional components may be sources of interference and / or may themselves be susceptible to interference. Therefore, additional shielding conductive structures for these additional components can increase the flexibility of positioning the additional components on the primary surface.

[0051] According to another embodiment of the present invention, two signal-conducting elements are connected to a component surface, the at least one additional component is arranged between the two signal-conducting elements, and the additional shielding conductive structure is configured to at least partially shield the additional component from the two signal-conducting elements. The two signal-conducting elements may correspond to an input port and an output port, respectively. The additional component may include at least two connecting portions, each connecting portion connecting the additional component to a corresponding signal-conducting element. Connections to the two signal-conducting elements may be established via the input port and the output port, respectively. One or more additional components having the additional shielding conductive structure may be positioned between the two signal-conducting elements, in particular two power amplifiers. This embodiment facilitates further shielding of the two signal-conducting elements from each other while also shielding the additional components of the carrier assembly.

[0052] According to another embodiment of the present invention, the signal-conducting element includes a conductive vertical structure that is connected to a conductive surface portion of the component, in particular to an electrical contact provided on the component surface. The conductive surface portion may be electrically conductive. The conductive vertical structure may be connected directly or indirectly, i.e., via an intermediate material, such as solder, in particular solder paste.

[0053] According to another embodiment of the present invention, the shielding conductive structure is connected to the component surface. The shielding conductive structure can be connected directly or indirectly, ie via an intermediate material such as solder or sintering paste, solder being in particular soldering paste.

[0054] According to another embodiment of the present invention, the signal conducting element is configured as at least one of the following: a blind via, a through via, a plated through hole, a pillar, an interconnection between component carriers, a nanowire, a sputtered material, a solder, and an electrically conductive adhesive.

[0055] According to a further embodiment of the invention, the components are embedded in a stack of component carriers.

[0056] According to another embodiment of the present invention, the signal conducting element extends away from the component surface along an extension direction, and the shielding conductive structure is configured and positioned to extend at least partially along the extension direction.

[0057] According to another embodiment of the present invention, the shielding conductive structure surrounds or covers the signal conducting element along the stacking direction and / or the thickness direction of the stack.

[0058] According to another embodiment of the present invention, a plurality of signal conducting elements are surrounded by the same shielding conductive structure. Such an embodiment providing a common shielding conductive structure allows simplifying the electrical structure of the carrier assembly.

[0059] According to another embodiment of the present invention, the shielding conductive structure has a partial or complete circular shape, a partial or complete elliptical shape, or a partial or complete polygonal shape.

[0060] According to another embodiment of the present invention, the shielding conductive structure includes an electrically conductive column, in particular a vertical copper column. The electrically conductive column may be covered by an electrically conductive plane, in particular a copper plane. The electrically conductive plane may have an opening, which may be configured to connect the impedance control line to the signal conducting element. The signal conducting element may include a columnar portion, in particular a copper columnar portion. The columnar portion may be arranged in a central portion of the electrically conductive column. The columnar portion may provide a contact portion, in particular a contact portion for the impedance control line.

[0061] According to another embodiment of the present invention, the shielding conductive structure and the signal conductive element form a vertical coaxial structure.

[0062] According to another embodiment of the present invention, the shielding conductive structure includes a separating conductive wall, the separating conductive wall being provided on one of the first main surface or the second main surface of the component, and the separating conductive wall being configured to divide the first main surface or the second main surface of the component into at least two sub-regions, wherein at least one signal-conducting element is provided in each of at least two of the corresponding sub-regions. Such an embodiment allows for an alternative structure for shielding signal-conducting elements by appropriately separating the sub-regions through a conductive structure (wall).

[0063] The following additional considerations may be relevant to at least some embodiments of the present invention:

[0064] In an embodiment, the stack includes at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier can be a laminate including the aforementioned one or more electrically insulating layer structures and one or more electrically conductive layer structures, in particular a laminate formed by applying mechanical pressure and / or thermal energy. The aforementioned stack can provide a plate-like component carrier that can provide a large mounting surface for additional components while still being very thin and compact.

[0065] In one embodiment, the component carrier is formed as a plate. This facilitates a compact design, while still providing a large base for components mounted thereon. In particular, bare dies, as an example of embedded electronic components, can be conveniently embedded in thin boards such as printed circuit boards due to their small thickness.

[0066] In one embodiment, the component carrier is configured as one of a printed circuit board, a substrate (in particular an IC substrate) and an interposer.

[0067] In the context of this application, the term "printed circuit board (PCB)" may particularly denote a plate-like component carrier formed by laminating a plurality of electrically conductive layer structures with a plurality of electrically insulating layer structures, for example by applying pressure and / or by supplying heat. As a preferred material for PCB technology, the electrically conductive layer structures are made of copper, while the electrically insulating layer structures may comprise resin and / or fiberglass, so-called prepregs, or FR4 materials. The individual electrically conductive layer structures can be connected to one another in the desired manner by forming holes through the laminate, for example by laser drilling or mechanical drilling, and by partially or completely filling these holes with an electrically conductive material, in particular copper, thereby forming vias or any other through-hole connections. The filled holes connect the entire stack (i.e., through-hole connections extending through multiple layers or the entire stack), or the filled holes connect at least two electrically conductive layers, so-called vias. Similarly, optical interconnects can be formed through the various layers of the stack to receive an electro-optical circuit board (EOCB). In addition to one or more components that can be embedded in the printed circuit board, the printed circuit board is generally configured to accommodate one or more components on one surface or two opposite surfaces of the plate-shaped printed circuit board. The one or more components can be connected to the corresponding main surface by soldering. The dielectric portion of the PCB may include a resin with reinforcing fibers (e.g., glass fiber).

[0068] In the context of this application, the term "substrate" can particularly refer to a small component carrier. Relative to a PCB, a substrate can be a relatively small component carrier on which one or more components can be mounted, and the substrate can be used as a connection medium between one or more chips and another PCB. For example, the substrate can have approximately the same size as the components (particularly electronic components) to be mounted on the substrate (for example, in the case of a chip scale package (CSP)). In another embodiment, the substrate can be larger than the specified components (for example, in a flip chip ball grid array, FCBGA configuration). More specifically, a substrate can be understood as a component carrier for electrical connection or electrical network and a component carrier for connectors that are comparable to a printed circuit board (PCB) but have a relatively high density of lateral and / or vertical arrangements. Lateral connectors are, for example, conductive paths, while vertical connectors can be, for example, drilled holes. These lateral connectors and / or vertical connectors are arranged in the substrate and can be used to provide electrical, thermal, and / or mechanical connections between accommodated components or unaccommodated components (such as bare wafers), particularly IC chips and printed circuit boards or intermediate printed circuit boards. Therefore, the term “substrate” also includes “IC substrate.” The dielectric part of the substrate may consist of a resin with reinforcement particles, such as reinforcement balls, in particular glass balls.

[0069] The substrate or interposer may include or be composed of a layer of at least one of the following: glass; silicon (Si) and / or a photoimageable or dry-etchable organic material, such as an epoxy-based stack material (e.g., an epoxy-based stack film); or a polymer compound (the polymer compound may or may not include photosensitive and / or heat-sensitive molecules), such as polyimide or polybenzoxazole.

[0070] In one embodiment, at least one electrically insulating layer structure comprises at least one of the following: a resin or polymer, such as an epoxy resin, a cyanate resin, a benzocyclobutene resin, a bismaleimide triazine resin, a polyphenylene derivative (e.g., based on polyphenylene ether, PPE), a polyimide (PI), a polyamide (PA), a liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), and / or combinations thereof. Reinforcement structures, such as meshes, fibers, spheres, or other types of filler particles, made of, for example, glass (multilayer glass) to form a composite, may also be used. Semi-cured resins combined with reinforcing agents, such as fibers impregnated with the above resins, are referred to as prepregs. These prepregs are typically named after their properties, such as FR4 or FR5, to describe their flame retardant properties. While prepregs, particularly FR4, are generally preferred for rigid PCBs, other materials, particularly epoxy-based stacking materials (e.g., stacking films) or photoimageable dielectric materials, may also be used. For high-frequency applications, high-frequency materials such as polytetrafluoroethylene, liquid crystal polymers, and / or cyanate resins may be preferred. In addition to these polymers, low-temperature co-fired ceramics (LTCC) or other low-DK materials, relatively low-DK materials or ultra-low-DK materials can be used as electrically insulating structures in the component carrier.

[0071] In one embodiment, the at least one electrically conductive layer structure comprises at least one of copper, aluminum, nickel, silver, gold, palladium, tungsten and magnesium, carbon, (particularly doped) silicon, titanium and platinum. Although copper is generally preferred, other materials or types of coatings thereof are also possible, in particular coated with a superconducting material, or a conductive polymer, such as graphene or poly (3,4-ethylenedioxythiophene) (PEDOT).

[0072] At least one additional component can be embedded in the stack and / or surface-mounted on the stack. The component and / or at least one additional component can be selected from at least one of the following: a non-electrically conductive inlay, an electrically conductive inlay (such as a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (e.g., a heat pipe), an optical element (e.g., an optical waveguide or optical conductor connector), an electronic component, or a combination thereof. The inlay can be, for example, a metal block with or without a coating of insulating material (IMS-inlay), which can be embedded or surface-mounted to promote heat dissipation. Suitable materials are defined by their thermal conductivity, which should be at least 2 W / mK. Such materials are typically based on, but not limited to, metals, metal oxides, and / or ceramics, such as copper, aluminum oxide (Al2O3), or aluminum nitride (AlN). Other geometries with increased surface area are also often used to increase heat exchange capacity. Furthermore, the component may be an active electronic component (implemented with at least one pn junction), a passive electronic component such as a resistor, an inductor, or a capacitor, an electronic chip, a memory device (e.g., a DRAM or other data memory), a filter, an integrated circuit (e.g., a field programmable gate array (FPGA), a programmable array logic (PAL), a general array logic (GAL), and a complex programmable logic device (CPLD)), a signal processing component, a power management component (e.g., a field effect transistor (FET), a metal oxide semiconductor field effect transistor (MOSFET), a complementary metal oxide semiconductor (CMOS), a junction field effect transistor (JFET), or an insulated gate field effect transistor (IGFETs), all of which are based on semiconductor materials such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga2O3), indium gallium arsenide (InGaAs), indium phosphide (InP) and / or any other suitable inorganic compound), optoelectronic interface elements, light emitting diodes, optocouplers, voltage converters (e.g., DC / DC converters or AC / DC converters), cryptographic components, transmitters and / or receivers, electromechanical transducers, sensors, actuators, microelectromechanical systems (MEMS), microprocessors, capacitors, resistors, inductors, batteries, switches, cameras, antennas, logic chips and energy harvesting units. However, other components may also be embedded in the component carrier. For example, a magnetic element may be used as a component. Such a magnetic element may be a permanent magnetic element (e.g., a ferromagnetic element, an antiferromagnetic element, a multiferroic element or a ferrimagnetic element, such as a ferrite core) or may be a paramagnetic element. However, the component may also be an IC substrate, an interposer, or another component carrier, for example in a board-in-board configuration. The component can be surface-mounted on the component carrier and / or embedded in the interior of the component carrier.Furthermore, other components may be used as components, in particular components which generate and emit electromagnetic radiation and / or are sensitive to electromagnetic radiation propagating from the environment.

[0073] In one embodiment, the component carrier is a laminated component carrier. In this embodiment, the component carrier is a composite of a plurality of layer structures that are stacked and connected together by applying pressure and / or heat.

[0074] After the internal layer structure of the component carrier has been treated, one or both main surfaces of the treated layer structure can be covered symmetrically or asymmetrically with one or more further electrically insulating and / or electrically conductive layer structures (in particular, by lamination). In other words, the stacking can be continued until the desired number of layers is obtained.

[0075] After the formation of the stack having the electrically insulating layer structure and the electrically conductive layer structure has been completed, the resulting layer structure or component carrier can be subjected to a surface treatment.

[0076] In particular, in terms of surface treatment, an electrically insulating solder resist can be applied to one or both of the opposing main surfaces of a laminate or component carrier. For example, such a solder resist can be formed over the entire main surface and the solder resist layer can then be patterned to expose one or more electrically conductive surface portions that will be used to electrically connect the component carrier to an electronic peripheral. The surface portions of the component carrier that remain covered with the solder resist can be effectively protected from oxidation or corrosion, in particular surface portions containing copper.

[0077] In terms of surface treatment, a surface finish can also be selectively applied to the exposed electrically conductive surface portions of the component carrier. Such a surface finish can be an electrically conductive covering material on the exposed electrically conductive layer structures (e.g., pads, conductive traces, etc., particularly comprising or consisting of copper) on the surface of the component carrier. If such exposed electrically conductive layer structures are not protected, the exposed electrically conductive component carrier material (particularly copper) will oxidize, resulting in lower reliability of the component carrier. The surface finish can then be formed as, for example, a joint between a surface mounted component and the component carrier. The surface finish has the function of protecting the exposed electrically conductive layer structures (particularly copper circuits) and enables the surface finish to be joined to one or more components, for example, by soldering. Examples of suitable materials for the surface finish are organic solderability preservatives (OSP), electroless nickel immersion gold (ENIG), electroless nickel immersion palladium immersion gold (ENIPIG), gold (particularly hard gold), chemical tin (chemical and electroplated), nickel gold, nickel palladium, etc. In addition, nickel-free materials can be used for surface finishing, especially for high-speed applications. Examples are ISIG (Immersion Silver + Gold) and EPAG (Electroless Palladium + Autocatalytic Gold).

[0078] Some embodiments have been described with reference to apparatus type claims, while other embodiments have been described with reference to method type claims. However, one skilled in the art will appreciate from the foregoing and following descriptions that, unless otherwise stated, this document discloses any combination of features associated with method type claims and features associated with apparatus type claims, relating to both apparatus and methods.

[0079] The aspects defined above and further aspects of the invention are apparent from and will be explained with reference to the examples of embodiment described hereinafter. BRIEF DESCRIPTION OF THE DRAWINGS

[0080] Figure 1 A carrier assembly including a signal conducting element and a shielding conductive structure according to an exemplary embodiment of the present invention is shown.

[0081] Figure 2 A top view and a cross-sectional side view are shown of a signal conducting element and a shielding conductive structure according to an exemplary embodiment of the present invention.

[0082] Figure 3 A top view of a signal conducting element surrounded by a shielding conducting element is shown according to an exemplary embodiment of the present invention.

[0083] Figure 4 A cross-sectional side view of a component including an outer conductive shield and an inner conductive shield is shown according to an exemplary embodiment of the present invention.

[0084] Figure 5 A component surface according to an exemplary embodiment of the present invention is shown, on which two signal-conducting elements, corresponding conductive structures for shielding, and two power amplifiers are arranged.

[0085] Figure 6 Shown is a top view of an alternative embodiment having one or more signal conducting elements surrounded by a common conductive shield.

[0086] Figure 7 Shown is a top view of a component having multiple signal conducting elements and a conductive wall acting as a conductive shield. DETAILED DESCRIPTION

[0087] The contents shown in the figures are schematic. In different figures, similar or identical elements are provided with the same reference numerals. For the sake of clarity, reference numerals of features that have already been provided with reference numerals in previous figures are sometimes omitted.

[0088] Figure 1 PCB level high frequency (HF) path shielding is shown. Figure 1 A carrier assembly 100 is shown. The carrier assembly 100 comprises (i) a component carrier 101, (ii) a component 110 embedded in the component carrier 101, (iii) a signal-conducting element 120 arranged on a component surface 111 of the component 110, and (iv) a shielding conductive structure 130, which is at least partially embedded in the component carrier 101 and at least partially surrounds the signal-conducting element 120.

[0089] Component carrier 101 includes a stack 102 comprising a plurality of electrically conductive layers 103 and a plurality of electrically insulating layers 104. Further electrically conductive and insulating layers can be added below so that component 110 is completely embedded. Following the stacked vias 105, signal-conducting elements 120 and shielding conductive structures 130 are formed (without horizontal displacement in the underlying layer structure). Both signal-conducting elements 120 and shielding conductive structures 130 are connected to surface 111 of component carrier 101. Electrical contacts are located at corresponding connection points for contacting component 110. Signal-conducting elements 120 do not reach the outer surface of component carrier 101, but instead terminate at an inner electrically conductive layer 103 of the plurality of electrically conductive layers 103. Shielding conductive structures 130 form a dome-shaped portion 131 above signal-conducting elements 120, with the covering portion of dome-shaped portion 131 formed by inner electrically conductive layer structure 103. The covering portion of the dome-shaped portion 131 has an opening above the signal-conducting structure 120. The remaining portion of the shielding conductive structure 130 forms a funnel-shaped portion 132 that extends to an outer surface of the component carrier 101 opposite and parallel to the component surface 111. The dome-shaped portion 131 and the funnel-shaped portion 132 are at least partially formed by overlapping plated through-holes and / or vias. At least a portion of the surface area of ​​the component carrier 101 may include a surface finish, such as ENIPIG or solder resist (not shown).

[0090] Figure 2 The chip-level shielding wall structure is shown. Figure 2 The upper portion shows a top view of the signal-conducting element 120 and the shielding conductive structure 130, and the lower portion shows a cross-sectional side view of the signal-conducting element 120 and the shielding conductive structure 130. The shielding conductive structure 130 includes a solid shielding wall 238 that completely surrounds the signal-conducting element 120. Both the shielding conductive structure 130 and the signal-conducting element 120 extend along an extension direction 221 that is perpendicular to the component surface 111 on which the signal-conducting element 120 and the shielding conductive structure 130 are arranged. Both the signal-conducting element 120 and the shielding conductive structure 130 are connected to the electrical contact 212 of the component 110.

[0091] Figure 3 A top view of a signal conducting element 120 is shown, which is surrounded by a shielding conductive structure 130 formed of a plurality of shielding conductive elements 334. The shielding conductive elements 334 are all located at the same distance from the signal conducting element 120. Furthermore, adjacent conductive elements 334 are all at the same distance from each other.

[0092] Figure 4A cross-sectional side view of a component 110 is shown, wherein a signal-conducting element 120 is connected to a component surface 111 of the component 110. The component 110 includes an outer conductive shield 435 that covers all surfaces of the component 110 except the surface 111 on which the signal-conducting element 120 is arranged. In addition, the component 110 includes an inner conductive shield 436 that covers the portion of the component surface 111 on which the signal-conducting element 120 is arranged.

[0093] Figure 5 The chip-level regional shielding structure is shown. Figure 5 Component surface 111 is shown, on which two signal-conducting elements 120 and corresponding shielding conductive structures 130 are arranged, as well as two additional components 940, here power amplifiers (PAs). Each additional component 940 is surrounded by a corresponding additional shielding conductive structure 941. Additional components 940 are arranged between two signal-conducting elements 120, thereby providing additional shielding for the signal-conducting elements 120. Each of the signal-conducting elements 120 is connected to a corresponding additional component 940, and the additional components 940 are connected to each other.

[0094] Figure 6 ,in particular Figure 6 B. Figure 6 C. Figure 6 D, shows an alternative embodiment in which a plurality of signal conducting elements 120, 120', 120", 120'" are surrounded by the same (common) shielding conductive structure 130. Specifically, in contrast to the previous figures and Figure 6 Unlike the embodiment shown in A, the common shielding conductive structure preferably has a (complete or partial) circular shape, a (complete or partial) elliptical shape or a (complete or partial) polygonal shape, and the dimensions of the common shielding conductive structure are designed to define an area where a plurality of signal conducting elements can be arranged. Figure 6 In the embodiment B, the shielding conductive structure 130 may have an elliptical shape and / or may define an area including two or more signal conducting elements 120', 120", which preferably have different functions, such as a positive connector 120' and a negative connector 120". Figure 6 In the embodiment of C, three signal conducting elements 120', 120", and 120'" are provided in the area defined by the shielding conductive structure 130. Preferably, each signal conducting element has a different function from each other, for example, one signal conducting element serves as a positive electrode connector 120', one signal conducting element serves as a grounding connector 120'", and another signal conducting element serves as a negative electrode connector 120". Figure 6D shows an embodiment with two signal conducting structures 120 ′, 120 ″′, Figure 6 The embodiment of D is the same as that of Figure 6 The embodiment in B is the same: the configuration of the shielding conductive structure 130 is different, thereby defining the shielding conductive structure 130 into two separate areas, wherein at least one (only one in the illustrated embodiment) signal conductive structure is provided in each of the areas; preferably, the shielding conductive structure 130 has a symmetrical configuration and / or an "8" shape.

[0095] Figure 7 An alternative embodiment is shown, in which a plurality of signal-conducting elements 120 are distributed on a main surface of a carrier component, preferably, all or part of the plurality of signal-conducting elements 120 are arranged on the (main) surface of the component; according to said embodiment, the shielding conductive structure comprises a separating conductive wall, in particular a plurality of separating conductive walls 510, 520, 530, said separating conductive walls 510, 520, 530 being (at least partially) arranged on one main surface of the component, and said separating conductive walls 510, 520, 530 being configured to divide the main surface into at least two sub-areas, in particular into Figure 7 The six sub-areas shown are provided with a vertical conductive wall 510 and two horizontal (perpendicular or inclined relative to the vertical conductive wall 510) conductive walls 520 and 530. Preferably, at least one signal conducting element 120 is provided on each of the sub-areas.

[0096] It should be noted that the word "comprising" does not exclude other elements or steps, and the use of the article "a" or "an" does not exclude a plurality. Furthermore, elements described in connection with different embodiments may be combined. It should also be noted that reference signs in the claims should not be construed as limiting the scope of the claims.

[0097] List of reference numerals:

[0098] 100 bearing components

[0099] 101 component carriers

[0100] 102 stacked pieces

[0101] 103 Electrically conductive layer structure

[0102] 104 electrical insulation layer structure

[0103] 105 vias

[0104] 110 parts

[0105] 111 component surface

[0106] 120 signal transduction elements

[0107] 130 shielding conductive structure

[0108] 131 dome-shaped part

[0109] 132 Funnel

[0110] 133 antenna pad

[0111] 212 electrical contact

[0112] 221 extension direction

[0113] 238 Conductive wall for shielding

[0114] 334 shielding conductive elements

[0115] 435 external conductive shield

[0116] 436 internal conductive shield

[0117] 940 additional parts

[0118] 941 Additional conductive structure for shielding.

Claims

1. A bearing assembly (100), wherein: The bearing component assembly (100) comprises: A component carrier (101); A component (110), the component (110) being located in or on the component carrier (101); a signal conducting element (120) arranged on a component surface (111) of the component (110); and A shielding conductive structure (130) is at least partially embedded in the component carrier (101) and at least partially surrounds the signal conducting element (120).

2. The carrier assembly (100) according to claim 1, wherein: The shielding conductive structure (130) includes a plurality of shielding conductive elements (334) surrounding the signal conductive element (120).

3. The carrier assembly (100) according to any one of claims 1 to 2, wherein: The shielding conductive structure (130) includes a shielding conductive wall (238) at least partially surrounding the signal conducting element (120).

4. The carrier assembly (100) according to any one of claims 1 to 3, wherein: The shielding conductive structure (130) completely surrounds the signal conductive element (120).

5. The carrier assembly (100) according to any one of claims 1 to 4, wherein: At least a portion of the shielding conductive structure (130) is connected to a reference potential, in particular, at least a portion of the shielding conductive structure (130) is grounded.

6. The carrier assembly (100) according to any one of claims 1 to 5, wherein: The signal conducting element (120) comprises a conducting interconnection connected to the component surface (111) and to an electrically conductive layer structure (103) of the component carrier (101), in particular to an antenna pad (133) formed by a portion of the electrically conductive layer structure (103).

7. The carrier assembly (100) according to any one of claims 1 to 6, wherein: The signal conducting element (120) and / or the shielding conducting structure (130) comprises a plurality of stacked elements (105) stacked one on top of the other, each stacked element (105) comprising at least one of the following: a via, a plated through hole, a columnar portion and a nanowire.

8. The carrier assembly (100) according to any one of claims 1 to 7, wherein: At least a portion of the shielding conductive structure (130) is configured as a dome-shaped portion (131), and the dome-shaped portion (131) at least partially covers the signal conductive element (120).

9. The carrier assembly (100) according to any one of claims 1 to 8, wherein: In a state where the signal conducting element (120) is arranged between the component surface (111) and the electrically conductive layer structure (131) along the thickness direction of the stack, the shielding conductive structure (130) is connected to the electrically conductive layer structure (131) of the component carrier (101). In particular, in a state where the signal conducting element (120) is only arranged between the component surface (111) and the electrically conductive layer structure (131) along the thickness direction of the stack, the shielding conductive structure (130) is connected to the electrically conductive layer structure (131) of the component carrier (101).

10. The carrier assembly (100) according to any one of claims 1 to 9, wherein: The component (110) is at least partially covered by an external conductive shield (435), in particular, on a surface of the component (110) opposite to the component surface (111) on which the signal conducting element (120) is arranged, and / or on a corresponding lateral surface of the component (110), the component (110) is at least partially covered by the external conductive shield (435).

11. The carrier assembly (100) according to any one of claims 1 to 10, wherein: The component (110) includes an internal conductive shield (436) covering a portion of the component surface (111) within the component (110) where the signal conducting element (120) is disposed.

12. The carrier assembly (100) according to any one of claims 1 to 11, wherein: An additional component (940) is arranged on the component surface (111) on which the signal conducting element (120) is arranged. Preferably, the additional component (940) is a power amplifier. The additional component (940) includes an additional shielding conductive structure (941). The additional shielding conductive structure (941) at least partially surrounds the additional component and / or covers the additional component (940).

13. The carrier assembly (100) according to claim 12, wherein: Two signal conducting elements (120) are connected to the component surface (111), at least one additional component (940) is arranged between the two signal conducting elements (120), and the additional shielding conductive structure (941) is configured to at least partially shield the additional component (940) relative to the two signal conducting elements (120).

14. The carrier assembly (100) according to any one of claims 1 to 13, wherein: A plurality of signal conducting elements (120) are surrounded by the same shielding conducting structure (130).

15. The carrier assembly (100) according to any one of claims 1 to 14, wherein: The shielding conductive structure comprises a partitioning conductive wall (510, 520), which is arranged on one of the first main surface or the second main surface of the component, and the partitioning conductive wall is configured to divide the first main surface or the second main surface of the component into at least two sub-areas, wherein at least one signal conducting element (120) is arranged on each of at least two of the corresponding sub-areas.

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