Light emitting device, electronic apparatus, and sealing device

Abstract

Provided is a light-emitting device capable of suppressing penetration of water. The light-emitting device includes a plurality of light-emitting elements disposed in a display area, a Si-containing layer covering the plurality of light-emitting elements, a metal oxide layer disposed on the Si-containing layer, and a sealing portion disposed outside the display area and including an organic resin. The Si-containing layer has an exposed portion exposed outside the display area without being covered by the metal oxide layer, and the sealing portion is in contact with the exposed portion.

Description

Technical Field

[0001] The present disclosure relates to a light emitting device, and electronic equipment and a sealing device respectively including the light emitting device. Background Art

[0002] A light-emitting device in which a plurality of organic light-emitting diode (OLED) elements are arranged two-dimensionally is widely used. In the light-emitting device, various sealing structures have been studied to prevent moisture from entering from the outside. For example, Patent Document 1 discloses an organic electronic device sealing film, which includes: a metal layer; and a sealing layer, which is arranged on a first surface of the metal layer and is located on the inner side of an end of the first surface, so that an end of a local area forms a gap with an end of the first surface, and the sealing layer includes a pressure-sensitive adhesive layer and an adhesive layer.

[0003] Reference List

[0004] Patent Literature

[0005] Patent document 1: Japanese Patent Application Laid-Open No. 2020-143295. Summary of the invention

[0006] Problems to be solved by the present invention

[0007] However, in conventional sealing configurations, moisture intrusion cannot be sufficiently prevented, and there is room for improvement.

[0008] The present disclosure aims to provide a light emitting device capable of preventing moisture from entering, and an electronic device and a sealing device respectively including the light emitting device.

[0009] Solution to the problem

[0010] In order to solve the above problems, a first light emitting device according to the present disclosure includes:

[0011] A plurality of light emitting elements are arranged in the display area;

[0012] A Si-containing layer covering a plurality of light-emitting elements;

[0013] a metal oxide layer disposed on the Si-containing layer; and

[0014] The sealing portion is disposed outside the display area and includes an organic resin, wherein

[0015] The Si-containing layer has an exposed portion which is not covered by the metal oxide layer and is exposed outside the display area, and

[0016] The sealing portion contacts the exposed portion.

[0017] The second light emitting device according to the present disclosure comprises:

[0018] A plurality of light emitting elements are arranged in the display area;

[0019] a first Si-containing layer covering the plurality of light-emitting elements;

[0020] a metal oxide layer disposed on the first Si-containing layer;

[0021] a second Si-containing layer disposed on the metal oxide layer; and

[0022] The sealing portion is disposed outside the display area and includes an organic resin, wherein

[0023] The sealing portion is in contact with the second Si-containing layer outside the display region.

[0024] A first sealing device according to the present disclosure comprises:

[0025] A plurality of elements are disposed in an element forming region;

[0026] Contains Si layer, covering multiple components;

[0027] a metal oxide layer disposed on the Si-containing layer; and

[0028] a sealing portion, which is provided outside the element forming region and contains an organic resin, wherein

[0029] The Si-containing layer has an exposed portion which is not covered by the metal oxide layer and is exposed outside the element forming region, and

[0030] The sealing portion contacts the exposed portion.

[0031] The second sealing device according to the present disclosure comprises:

[0032] A plurality of elements are disposed in an element forming region;

[0033] a first Si-containing layer covering the plurality of components;

[0034] a metal oxide layer disposed on the first Si-containing layer;

[0035] a second Si-containing layer disposed on the metal oxide layer; and

[0036] a sealing portion, which is provided outside the element forming region and contains an organic resin, wherein

[0037] The sealing portion is in contact with the second Si-containing layer outside the element forming region.

[0038] A first electronic device according to the present disclosure includes a first light emitting device or a second light emitting device.

[0039] The second electronic device according to the present disclosure includes a first sealing device or a second sealing device. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 It is a cross-sectional view for explaining the outline of the present disclosure.

[0041] Figure 2 is a plan view showing an example of the appearance of the display device according to the first embodiment.

[0042] Figure 3 It is along Figure 2 A cross-sectional view taken along line III-III defined in FIG.

[0043] Figure 4 A is a plan view showing an example of a Si-containing layer and a metal oxide layer. Figure 4 B is along Figure 4 A cross-sectional view taken along the line IVB-IVB defined in FIG.

[0044] Figure 5 A and Figure 5 B are diagrams each for explaining a mechanism for increasing adhesion.

[0045] Figure 6 A and Figure 6 B are diagrams each for explaining a mechanism for increasing adhesion.

[0046] Figure 7 is a cross-sectional view illustrating an example configuration of a display device according to Modification 1.

[0047] Figure 8 A is a plan view showing an example of a Si-containing layer and a metal oxide layer provided in a display device according to Modification 2. Figure 8 B is along Figure 8 A cross-sectional view taken along line VIIIB-VIIIB defined in FIG.

[0048] Fig. 9 A is a plan view showing an example of a Si-containing layer and a metal oxide layer provided in a display device according to Modification 3. Fig. 9 B is along Fig. 9 A cross-sectional view taken along the line IXB-IXB defined in FIG.

[0049] Fig.10 A is a plan view showing an example of a Si-containing layer and a metal oxide layer provided in a display device according to Modification 4. Fig.10 B is along Fig.10 A cross-sectional view taken along the line XB-XB defined in FIG.

[0050] Fig.11A is a plan view showing an example of a Si-containing layer and a metal oxide layer provided in a display device according to Modification 5. Fig.11 B is along Fig.11 A cross-sectional view taken along the line XIB-XIB defined in FIG.

[0051] Fig.12 is a cross-sectional view showing an example configuration of a display device according to a second embodiment.

[0052] Fig.13 A is a plan view showing an example of a Si-containing layer and a metal oxide layer provided in a display device according to Modification 1. Fig.13 B is along Fig.13 A cross-sectional view taken along the line XIIIB-XIIIB defined in FIG.

[0053] Fig.14 A is a plan view showing an example of a Si-containing layer and a metal oxide layer provided in a display device according to Modification 2. Fig.14 B is along Fig.14 A cross-sectional view taken along the line XIVB-XIVB defined in FIG.

[0054] Fig.15 A is a front view showing an example of the appearance of a digital camera. Fig.15 B is a rear view showing an example of the appearance of the digital camera.

[0055] Fig.16 is a perspective view showing an appearance example of a head mounted display.

[0056] Fig.17 is a perspective view showing an example of the appearance of a television device.

[0057] Fig.18 is a perspective view showing an example of the appearance of a see-through head mounted display.

[0058] Fig.19 is a perspective view showing an example of the appearance of a smartphone.

[0059] Fig. 20 A is a diagram showing an example of the interior state of the vehicle viewed from the rear to the front of the vehicle. Fig. 20 B is a diagram showing an example of the interior state of the vehicle viewed from diagonally rearward to diagonally forward of the vehicle. DETAILED DESCRIPTION

[0060] The embodiments of the present disclosure will be described in the following order with reference to the drawings. Note that in all drawings of the embodiments described below, the same or corresponding parts are denoted by the same reference numerals.

[0061] 1. Overview

[0062] 2. First Embodiment (Example of Display Device)

[0063] 3. Second Embodiment (Example of Display Device)

[0064] 4. Modifications

[0065] 5. Example Application (Example of Electronic Device)

[0066] <1. Overview>

[0067] like Figure 1 As shown, when the sealing portion 18 is provided on the metal oxide layer 14, the adhesion of the sealing portion 18 to the metal oxide layer 14 is low, and therefore, moisture easily enters the inside from the outside of the display device 100. The entry of moisture into the display device 100 causes a reduction in the reliability of the display device 100. Specifically, the intrusion of moisture occurring in the process described below may become a major cause of the reduction in the reliability of the display device 100.

[0068] (1) In the process of manufacturing the display device 100 (specifically, in the process of forming an organic layer or a metal layer), the particles 1 adhere thereto.

[0069] (2) The coverage (covering characteristics) of the protective layer (Si-containing layer 13 and metal oxide layer 14) formed later is deteriorated due to the particles, and a leakage path is formed.

[0070] (3) Moisture enters the interior of the display device 100 via a leakage path starting from peeling of the seal portion 18 or the like, and adversely affects the reliability of the display device 100 . Figure 1 The arrows in illustrative figures indicate the paths through which moisture enters the display device 100 .

[0071] The present inventors have extensively conducted research for improving the adhesion between the sealing portion 18 and the underlying layer based on the above-mentioned mechanism of reduced reliability. As a result, the present inventors have found that the adhesion between the sealing portion 18 and the underlying layer can be improved by removing all or part of the portion of the metal oxide layer 14 located below the sealing portion 18 and bringing the Si-containing layer 13 and the metal oxide layer 14 into direct contact with each other.

[0072] <2. First Embodiment>

[0073] [Configuration of Display Device 10]

[0074] Figure 2 is a plan view showing an example of the appearance of the display device 10 according to the first embodiment. Figure 3is a cross-sectional view taken along line III-III defined in FIG. 2 . The display device 10 includes a display area R1 and a sealing area R2. The display area R1 is an element formation area in which a plurality of light emitting elements 20 are formed. The display area R1 has a quadrilateral shape in a plan view, for example. Examples of quadrilateral shapes include a rectangular shape and a parallelogram shape, but other quadrilateral shapes may be used. In the present specification, a rectangular shape also includes a square shape. Note that the shape of the display area R1 is not necessarily a quadrilateral shape, and may be any appropriately selected shape. For example, the shape may be a polygon other than a quadrilateral shape, a circle, an ellipse, or the like. The sealing area R2 is an area in which a sealing portion 18 is provided. The sealing area R2 is located outside the display area R1. In a plan view, the sealing area R2 is in the form of a closed loop surrounding the display area R1. Although Figure 2 An example is shown in which the sealing region R2 is adjacent to the display region R1 , but a space may be maintained between the sealing region R2 and the display region R1 , and the two regions may be separated from each other.

[0075] The display device 10 is an example of a light emitting device. The display device 10 is a top emission type OLED display device. The display device 10 may be a micro display. The display device 10 may be provided in a virtual reality (VR) device, a mixed reality (MR) device, an augmented reality (AR) device, an electronic viewfinder (EVF), a small projector, etc.

[0076] The display device 10 includes a circuit board 11 , a plurality of light emitting elements 20 , an insulating layer 12 , a Si-containing layer 13 , a metal oxide layer 14 , a color filter 15 , a filling resin layer 16 , a contact portion 17 , a sealing portion 18 , and an opposing substrate 19 .

[0077] The display device 10 may further include a pad portion (not shown). A flexible printed circuit (FPC) may be connected to the pad portion. Note that in the case where the display device 10 includes the pad portion, the sealing region R2 may be provided inside the pad portion.

[0078] The display device 10 may include a plurality of dummy electrodes 121 and an insulating layer 122. The dummy electrodes 121 are disposed on a first surface of the sealing region R2 of the circuit board 11. The insulating layer 122 covers the plurality of dummy electrodes 121.

[0079] In this specification, in each layer constituting the display device 10, the surface on the top side (display surface side) of the display device 10 is referred to as a first surface, and the surface on the bottom side (the side opposite to the display surface) of the display device 10 is referred to as a second surface. In addition, in this specification, a plan view refers to a plan view when an object is observed from a direction perpendicular to the first surface.

[0080] (Circuit Board 11)

[0081] The circuit board 11 is a so-called backplane, and drives the plurality of light emitting elements 20. The circuit board 11 includes a substrate. A plurality of wirings, a driving circuit for driving the plurality of light emitting elements 20, a power supply circuit for supplying power to the plurality of light emitting elements 20, etc. (all not shown) are provided on a first surface of the substrate. An insulating layer covers the first surface of the substrate and flattens the first surface of the substrate.

[0082] For example, the substrate may be formed of an easily formed semiconductor (such as a transistor), or may be formed of glass or resin having low moisture permeability and oxygen permeability. Specifically, the substrate may be a semiconductor substrate, a glass substrate, a resin substrate, etc. The semiconductor substrate may include, for example, amorphous silicon, polycrystalline silicon, single crystal silicon, etc. The glass substrate may include, for example, high strain point glass, soda glass, borosilicate glass, forsterite, lead glass, quartz glass, etc. The resin substrate may include, for example, at least one selected from the group consisting of polymethyl methacrylate, polyvinyl alcohol, polyvinyl phenol, polyether sulfone, polyimide, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, etc.

[0083] (Light emitting element 20)

[0084] The light emitting element 20 is a white OLED element and can emit white light under the control of a driving circuit or the like. The white OLED element can be a white micro OLED (MOLED) element. A plurality of light emitting elements 20 are two-dimensionally arranged on the first surface of the circuit board 11 in a prescribed layout pattern. Each of the light emitting elements 20 includes a first electrode 21, an OLED layer 22, and a second electrode 23 in sequence on the first surface of the circuit board 11.

[0085] (First Electrode 21)

[0086] The first electrode 21 is an anode. When a voltage is applied between the first electrode 21 and the second electrode 23, holes are injected from the first electrode 21 into the OLED layer 22. The first electrode 21 has a planar shape perpendicular to the thickness direction of the light emitting element 20. The first electrode 21 is divided between adjacent light emitting elements 20 and is separately provided for a plurality of light emitting elements 20. The plurality of first electrodes 21 are two-dimensionally arranged on the first surface of the circuit board 11 in a layout pattern similar to the plurality of light emitting elements 20.

[0087] For example, the first electrode 21 may be formed with a metal layer also used as a reflective layer, or may be formed with a metal layer and a transparent conductive oxide layer. In the case where the first electrode 21 is formed with a metal layer and a transparent conductive oxide layer, the transparent conductive oxide layer is preferably provided on the OLED layer 22 side to place a high work function layer at a position adjacent to the OLED layer 22.

[0088] The metal layer also has a function of a reflective layer that reflects light emitted from the OLED layer 22. The metal layer contains, for example, at least one metal selected from the group consisting of chromium (Cr), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), molybdenum (Mo), titanium (Ti), tantalum (Ta), aluminum (Al), magnesium (Mg), iron (Fe), tungsten (W) and silver (Ag). The metal layer may contain at least one of the above metals as a constituent element of an alloy. Specific examples of the alloy include aluminum alloys and silver alloys. Specific examples of the aluminum alloy include, for example, AlNd and AlCu.

[0089] A bottom layer (not shown) may be disposed adjacent to the second surface side of the metal layer. The bottom layer may improve the crystal orientation of the metal layer when the metal layer is formed. The bottom layer may include at least one metal selected from the group consisting of titanium (Ti) and tantalum (Ta). The bottom layer may include the above-mentioned at least one metal as a constituent material of the alloy.

[0090] The transparent conductive oxide layer includes a transparent conductive oxide. The transparent conductive oxide includes, for example, at least one selected from the group consisting of an indium-containing transparent conductive oxide (hereinafter, referred to as "indium-based transparent conductive oxide"), a tin-containing transparent conductive oxide (hereinafter, referred to as "tin-based transparent conductive oxide"), and a zinc-containing transparent conductive oxide (hereinafter, referred to as "zinc-based transparent conductive oxide").

[0091] Indium-based transparent conductive oxides include, for example, indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium oxide (IGO), indium gallium zinc oxide (IGZO), and fluorine-doped indium oxide (IFO). Among these transparent conductive oxides, indium tin oxide (ITO) is particularly preferred. This is because indium tin oxide (ITO) has a particularly low barrier for hole injection into OLED layer 22 in terms of work function, and therefore, the driving voltage for display device 10 can be particularly reduced. For example, tin-based transparent conductive oxides include tin oxide, antimony-doped tin oxide (ATO), and fluorine-doped tin oxide (FTO). Zinc-based transparent conductive oxides include, for example, zinc oxide, aluminum-doped zinc oxide (AZO), boron-doped zinc oxide, and gallium-doped zinc oxide (GZO).

[0092] (OLED layer 22)

[0093] The OLED layer 22 is an example of an organic layer including a light emitting layer, and may emit white light through recombination of holes injected from the first electrode 21 and electrons injected from the second electrode 23 .

[0094] The OLED layer 22 is disposed on the plurality of first electrodes 21. The OLED layer 22 is connected between adjacent light emitting elements 20 in the display region R1, and is shared by the plurality of light emitting elements 20 in the display region R1.

[0095] The OLED layer 22 may be an OLED layer including a single-layer light-emitting unit, an OLED layer including two-layer light-emitting units (tandem structure), or an OLED layer having a structure different from these. The OLED layer including a single-layer light-emitting unit has a configuration in which a hole injection layer, a hole transport layer, a red light-emitting layer, a light-emitting separation layer, a blue light-emitting layer, a green light-emitting layer, an electron transport layer, and an electron injection layer are sequentially stacked in a direction from the first electrode 21 toward the second electrode 23. The OLED layer including two-layer light-emitting units has a configuration in which a hole injection layer, a hole transport layer, a blue light-emitting layer, an electron transport layer, a charge generation layer, a hole transport layer, a yellow light-emitting layer, an electron transport layer, and an electron injection layer are sequentially stacked in a direction from the first electrode 21 toward the second electrode 23.

[0096] The hole injection layer can improve the efficiency of hole injection into each light-emitting layer and suppress leakage. The hole transport layer can improve the efficiency of hole transport to each light-emitting layer. The electron injection layer can improve the efficiency of electron injection into each light-emitting layer. The electron transport layer can improve the efficiency of electron transport to each light-emitting layer. The luminescence separation layer is a layer that can adjust the carrier injection into each light-emitting layer, and adjusts the luminescence balance of each color by injecting electrons or holes into each light-emitting layer through the luminescence separation layer. The charge generation layer can provide electrons and holes to the two light-emitting layers sandwiched between the charge generation layers, respectively.

[0097] In response to applying an electric field to each of the red light emission layer, the green light emission layer, the blue light emission layer, and the yellow light emission layer, recombination occurs between holes injected from the first electrode 21 or the charge generation layer and electrons injected from the second electrode 23 or the charge generation layer, and red light, green light, blue light, and yellow light can be emitted.

[0098] (Second Electrode 23)

[0099] The second electrode 23 is a cathode. When a voltage is applied between the first electrode 21 and the second electrode 23, electrons are injected from the second electrode 23 into the OLED layer 22. The second electrode 23 is a transparent electrode having transparency to visible light. In this specification, visible light refers to light with a wavelength range of 360nm to 830nm. The second electrode 23 is disposed on the first surface of the OLED layer 22. The second electrode 23 is connected between adjacent light-emitting elements 20 in the display region R1 and is shared by a plurality of light-emitting elements 20 in the display region R1.

[0100] The second electrode 23 is preferably formed of a material having as high a transmittance as possible and a small work function to improve the luminous efficiency. The second electrode 23 is formed, for example, of at least one of a metal layer and a transparent conductive oxide layer. More specifically, the second electrode 23 is formed of a single-layer film of a metal layer or a transparent conductive oxide layer or a film stack of a metal layer and a transparent conductive oxide layer. In the case where the second electrode 23 is formed of a film stack, the metal layer may be disposed on the OLED layer 22 side, or the transparent conductive oxide layer may be disposed on the OLED layer 22 side. However, in order to place the low work function layer at a position adjacent to the OLED layer 22, the metal layer is preferably disposed on the OLED layer 22 side.

[0101] The metal layer, for example, includes at least one metal selected from the group consisting of magnesium (Mg), aluminum (Al), silver (Ag), calcium (Ca) and sodium (Na). The metal layer may include at least one of the above metals as a constituent element of an alloy. Specific examples of alloys include MgAg alloys, MgAl alloys, AlLi alloys, and the like. The transparent conductive oxide layer includes a transparent conductive oxide. A material similar to the transparent conductive oxide of the above-mentioned first electrode 21 may be used as an example of the transparent conductive oxide.

[0102] (Insulation layer 12)

[0103] The insulating layer 12 insulates the adjacent first electrodes 21 from each other. The insulating layer 12 is provided in a portion between the separated first electrodes 21 on the first surface of the circuit board 11. The insulating layer 12 has a plurality of openings 12A. Each of the plurality of openings 12A is provided for each corresponding light emitting element 20. More specifically, each of the plurality of openings 12A is provided on the first surface (the surface on the OLED layer 22 side) of each corresponding first electrode 21. The first electrode 21 and the OLED layer 22 are in contact with each other through the openings 12A.

[0104] The insulating layer 12 may be an organic insulating layer, an inorganic insulating layer, or a stacked structure formed of these layers. The organic insulating layer, for example, includes at least one resin selected from the group consisting of polyimide resin, acrylic resin, novolac resin, etc. The inorganic insulating layer, for example, includes a silicon oxide (SiO x ), Silicon Nitride (SiN x ), silicon oxynitride (SiO x N y ) and the like.

[0105] (Containing Si layer 13 and metal oxide layer 14)

[0106] The Si-containing layer 13 is a first protective layer that protects the plurality of light-emitting elements 20. The Si-containing layer 13 has transparency to visible light. The Si-containing layer 13 is disposed on the first surface of the second electrode 23 and covers the plurality of light-emitting elements 20. The Si-containing layer 13 can prevent moisture from entering the plurality of light-emitting elements 20 from the external environment.

[0107] For example, the Si-containing layer 13 contains silicon (Si) and nitrogen (N), or contains silicon (Si), oxygen (O), and nitrogen (N). Specifically, the Si-containing layer 13 contains, for example, silicon nitride (SiN x ) or silicon oxynitride (SiO x N y ). The Si-containing layer 13 may contain silicon (Si) and oxygen (O) in the surface (interface) bonded to the sealing portion 18. In this case, oxygen (O) may not be a main component of the Si-containing layer 13.

[0108] The metal oxide layer 14 is a second protective layer that protects the plurality of light emitting elements 20. The metal oxide layer 14 is transparent to visible light. The metal oxide layer 14 is disposed on the Si-containing layer 13 and covers the plurality of light emitting elements 20. The Si-containing layer 13 can prevent moisture from entering the plurality of light emitting elements 20 from the external environment.

[0109] The metal oxide layer 14 is preferably formed as a single-layer deposit. When the metal oxide layer 14 is formed as a single-layer deposit, the effect of the metal oxide layer 14 in suppressing the entry of moisture can be improved. For example, the metal oxide layer 14 includes aluminum oxide (AlO x ) or titanium oxide (TiO x ). The metal oxide layer 14 may be an ALD layer.

[0110] Figure 4 A is a plan view showing an example of the Si-containing layer 13 and the metal oxide layer 14 . Figure 4 B is along Figure 4 A is a cross-sectional view taken along the line IVB-IVB defined in FIG. The peripheral edge of the metal oxide layer 14 is recessed relative to the peripheral edge of the Si-containing layer 13. Thus, the peripheral edge portion of the first surface of the Si-containing layer 13 is not covered by the metal oxide layer 14 and is exposed, and an exposed portion 13A is formed. In this specification, the peripheral edge portion of the first surface refers to a region having a predetermined width in a direction from the peripheral edge of the first surface toward the inside.

[0111] The exposed portion 13A is located in the sealing region R2. The exposed portion 13A is preferably in the shape of a closed loop surrounding the display region R1 in a plan view. Substantially the entire sealing region R2 may be the exposed portion 13A. That is, the width of the sealing region R2 may be substantially the same as the width of the exposed portion 13A.

[0112] The thickness T1 of the Si-containing layer 13 is preferably 10 μm or less, or more preferably 5 μm or less. When the thickness T1 of the Si-containing layer 13 is 10 μm or less, the increase in the distance between the light emitting element 20 and the color filter 15 can be reduced, and thus the degradation of the viewing angle characteristics can be reduced.

[0113] The thickness T2 of the metal oxide layer 14 is preferably 200 nm or less. In the case where the thickness T2 of the metal oxide layer 14 is 200 nm or less, the reduction in productivity due to the film formation time of the metal oxide layer 14 can be reduced. The lower limit value of the thickness T2 of the metal oxide layer 14 is preferably 5 nm or more. In the case where the thickness T2 of the metal oxide layer 14 is 5 nm or more, the degradation of the function of the metal oxide layer 14 as a protective layer can be reduced.

[0114] In order to narrow the frame of the display device 10, the width W of the exposed portion 13A is preferably 5 mm or less, and more preferably 2 mm or less.

[0115] (Color filter 15)

[0116] The color filter 15 is disposed on the first surface of the metal oxide layer 14. The color filter 15 is an on-chip color filter (OCCF) and includes a plurality of red color filter sections 15R, a plurality of green color filter sections 15G, and a plurality of blue color filter sections 15B.

[0117] A plurality of color filter portions 15R, 15G, and 15B are two-dimensionally arranged on the first surface of the metal oxide layer 14 in a predetermined layout pattern similar to the plurality of light emitting elements 20. The respective color filter portions 15R, 15G, and 15B are disposed above the light emitting element 20. The light emitting element 20 and the red color filter portion 15R disposed above the light emitting element 20 constitute a red sub-pixel. The light emitting element 20 and the green color filter portion 15G disposed above the light emitting element 20 constitute a green sub-pixel. The light emitting element 20 and the blue color filter portion 15B disposed above the light emitting element 20 constitute a blue sub-pixel.

[0118] The red filter portion 15R transmits red light in the white light emitted from the light emitting element 20, and absorbs light other than the red light. The green filter portion 15G transmits green light in the white light emitted from the light emitting element 20, and absorbs light other than the green light. The blue filter portion 15B transmits blue light in the white light emitted from the light emitting element 20, and absorbs light other than the blue light.

[0119] The red color filter portion 15R includes, for example, a red resist. The green color filter portion 15G includes, for example, a green resist. The blue color filter portion 15B includes, for example, a blue resist.

[0120] (Filling resin layer 16)

[0121] The filling resin layer 16 is provided between the color filter 15 and the counter substrate 19. The filling resin layer 16 may function as an adhesive layer for bonding the color filter 15 and the counter substrate 19. The filling resin layer 16 contains, for example, at least one resin selected from the group consisting of a thermosetting resin, an ultraviolet curing resin, and the like.

[0122] (Contact portion 17)

[0123] The contact portion 17 is an auxiliary electrode that connects the second electrode 23 and the underlying wiring, etc. (not shown). The first surface of the contact portion 17 is connected to the peripheral edge portion of the second surface of the second electrode 23. At the same time, the second surface of the contact portion 17 is connected to the underlying wiring, etc. via a contact plug. In this specification, the peripheral edge portion of the second surface refers to a region having a predetermined width in a direction from the peripheral edge of the second surface toward the inside.

[0124] The contact portion 17 is disposed on the first surface of the circuit board 11 in the sealing region R2. The contact portion 17 may have a closed loop shape surrounding the display region R1 in a plan view.

[0125] The contact portion 17 may be formed of a metal layer, or may be formed of a metal layer and a transparent conductive oxide layer. As constituent materials of the metal layer and the transparent conductive oxide layer, materials similar to those of the metal layer and the transparent conductive oxide layer of the first electrode 21 may be used as examples. The contact portion 17 may have the same configuration as the first electrode 21.

[0126] (Sealing portion 18)

[0127] The sealing portion 18 joins the exposed portion 13A of the Si-containing layer 13 to the peripheral edge portion of the second surface of the counter substrate 19. The sealing portion 18 is provided between the exposed portion 13A of the Si-containing layer 13 and the peripheral edge portion of the second surface of the counter substrate 19, and is in direct contact with the exposed portion 13A of the Si-containing layer 13 in the sealing region R2. The sealing portion 18 has a closed loop shape in a plan view.

[0128] The sealing portion 18 contains an organic resin. The organic resin may contain carbon (C) and hydrogen (O) as main components. The organic resin, for example, contains at least one resin selected from the group consisting of a thermosetting resin, an ultraviolet curing resin, and the like. More specifically, the organic resin, for example, contains at least one resin selected from the group consisting of an epoxy resin, an acrylic resin, and the like. Note that the organic resin is not limited to a thermosetting resin and an ultraviolet curing resin, and may contain some other kind of curing resin that is neither a thermosetting resin nor an ultraviolet curing resin.

[0129] like Figure 5B, the bonding interface between the Si-containing layer 13 and the sealing portion 18 preferably contains Si-O bonds. Since the Si-containing layer 13 and the sealing portion 18 are bonded to each other via the Si-O bonds, the adhesion between the Si-containing layer 13 and the sealing portion 18 can be improved.

[0130] The sealing portion 18 preferably contains a silane coupling agent. Since the sealing portion 18 contains the silane coupling agent, Si—O bonds can be formed at the bonding interface between the Si-containing layer 13 and the sealing portion 18 .

[0131] The silane coupling agent may contain two reactive group sites X and an alkoxy site OR in the molecule. The silane coupling agent may be an alkoxysilane compound represented by the general formula X-Si(OR)3, but any silane coupling agent that can be synthesized and contains a reactive group site X and an alkoxy site OR in the molecule may be used.

[0132] R of the silane coupling agent is an alkyl group or a derivative thereof. Examples of the alkyl group include methyl, ethyl, butyl, isopropyl, and the like.

[0133] The reactive group site X of the silane coupling agent has a structure including at least one reactive group selected from the group consisting of amino, vinyl, epoxy, methacrylic, mercapto, sulfide, isocyanate, urea, chloropropyl, hydroxyl and the like, for example.

[0134] (Countering Substrate 19)

[0135] The counter substrate 19 seals each member provided on the first surface of the circuit board 11. The counter substrate 19 has transparency to visible light, for example. The counter substrate 19 is provided on the first surface of the filling resin layer 16 and the first surface of the sealing portion 18, and faces the circuit board 11. The counter substrate 19 is, for example, a glass substrate.

[0136] [Method for Manufacturing Display Device 10]

[0137] In the following description, an example of a method of manufacturing the display device 10 according to the first embodiment is explained.

[0138] (Step of Forming First Electrode 21)

[0139] First, for example, a metal layer and a transparent conductive oxide layer are sequentially formed on the first surface of the circuit board 11 by sputtering, and then, for example, the metal layer and the transparent conductive oxide layer are patterned using photolithography and etching techniques. Thus, a plurality of first electrodes 21 are formed on the first surface of the circuit board 11.

[0140] (Step of Forming Insulating Layer 12)

[0141] Next, the insulating layer 12 is formed on the first surface of the circuit board 11 by, for example, a chemical vapor deposition (CVD) method so as to cover the plurality of first electrodes 21. Next, openings 12A are formed in portions of the insulating layer 12 located on the first surfaces of the corresponding first electrodes 21 by, for example, a photolithography technique and a dry etching technique.

[0142] (Step of Forming OLED Layer 22)

[0143] Next, for example, by vapor deposition, a hole transport layer, a red light emitting layer, a luminescence separation layer, a blue light emitting layer, a green light emitting layer, an electron transport layer and an electron injection layer are sequentially stacked on the first surface of the multiple first electrodes 21 and the first surface of the insulating layer 12 to form an OLED layer 22.

[0144] (Step of Forming Second Electrode 23)

[0145] Next, the second electrode 23 is formed on the first surface of the OLED layer 22 by, for example, a vapor deposition method or a sputtering method. As a result, a plurality of light emitting elements 20 are formed on the first surface of the circuit board 11.

[0146] (Step of Forming Si-Containing Layer 13)

[0147] Next, the Si-containing layer 13 is formed on the first surface of the second electrode 23 by, for example, a CVD method.

[0148] (Step of Forming Metal Oxide Layer 14)

[0149] Next, for example, a metal oxide layer 14 is formed on the first surface of the Si-containing layer 13 by atomic layer deposition (ALD). Next, for example, all or part of the portion of the metal oxide layer 14 corresponding to the sealing region R2 is removed by photolithography and dry etching techniques. As a result, a closed loop exposed portion 13A surrounding the display region R1 is formed.

[0150] (Step of Forming Color Filter 15)

[0151] Next, a coloring composition for forming a green filter portion is applied on the first surface of the metal oxide layer 14, and after pattern exposure is performed by ultraviolet irradiation through a photomask, development is performed to form a green filter portion 15G. Next, a coloring composition for forming a red filter portion is applied on the first surface of the metal oxide layer 14, and after pattern exposure is performed by ultraviolet irradiation through a photomask, development is performed to form a red filter portion 15R. Next, a coloring composition for forming a blue filter portion is applied on the first surface of the metal oxide layer 14, and after pattern exposure is performed by ultraviolet irradiation through a photomask, development is performed to form a blue filter portion 15B. Thus, the color filter 15 is formed on the first surface of the metal oxide layer 14.

[0152] (Sealing Step)

[0153] Next, a sealant is applied to the exposed portion 13A in a closed loop shape surrounding the display region R1 to form a frame, and then a filling resin is applied to the inside of the frame. Next, the counter substrate 19 is placed on the filling resin and the sealant. Next, the sealant and the filling resin are cured by, for example, at least one of a heat treatment and an ultraviolet irradiation treatment. As a result, the counter substrate 19 and the exposed portion 13A are bonded to each other through the sealing portion 18, and the filling resin layer 16 is formed inside the sealing portion 18. As described above, the Figure 2 and Figure 3 The display device 10 shown in FIG. 1 is a diagram showing a method for curing the filling resin and the sealant. Note that the method for curing the filling resin and the sealant is not limited to the heat treatment and the ultraviolet irradiation treatment, but may be a curing method that is neither the heat treatment nor the ultraviolet irradiation treatment.

[0154] [Mechanism of improved adhesion]

[0155] In the case where the sealing portion 18 contains a silane coupling agent, it is assumed that the adhesion of the sealing portion 18 is increased by the following mechanism.

[0156] In the sealing step, as Figure 5 As shown in FIG. 1A , a sealant 18A containing a silane coupling agent is applied to the exposed portion 13A. After the application, as shown in FIG. Figure 5 As shown in FIG. 2B, when the sealant 18A is heat-treated or irradiated with ultraviolet rays, the silane coupling agent contained in the sealant 18A and the material (for example, silicon nitride (SiN x )) is accelerated, and Si-O bonds are formed at the bonding interface between the Si-containing layer 13 and the sealant 18A. Therefore, the adhesion of the bonding interface between the Si-containing layer 13 and the sealant 18A is improved.

[0157] On the other hand, in the case where the sealant 18A containing a silane coupling agent is applied onto the metal oxide layer 14, as shown in FIG. Figure 6 As shown in FIG. 1A , even if the sealant 18A is heat-treated or irradiated with ultraviolet rays, the silane coupling agent contained in the sealant 18A and the material contained in the metal oxide layer 14 (for example, aluminum oxide (AlO x )) is unlikely to be accelerated, e.g. Figure 6 B. For this reason, Si—O bonds are hardly formed at the bonding interface between the metal oxide layer 14 and the sealant 18A, and the adhesion at the bonding interface between the metal oxide layer 14 and the sealant 18A becomes lower.

[0158] [Functions and effects]

[0159] In the display device 10 according to the first embodiment, the Si-containing layer 13 has an exposed portion 13A that is not covered by the metal oxide layer 14 and is exposed in the sealing region R2, and the sealing portion 18 is provided on the exposed portion 13A and is in direct contact with the exposed portion 13A. As a result, the adhesion between the sealing portion 18 and the bottom layer can be increased. Therefore, it is possible to prevent moisture from entering from the outside of the display device 10. Therefore, the reliability of the display device 10 can be improved.

[0160] Furthermore, since it is possible to prevent moisture from entering from the outside of the display device 10 , even in a case where the particles 1 adhere to the display device 10 during the manufacturing process, the reliability of the display device 10 can be maintained.

[0161] [Revise]

[0162] (Edit 1)

[0163] Although the example in which substantially the entire sealing region R2 is the exposed portion 13A has been described in the first embodiment, at least a portion of the sealing region R2 may be the exposed portion 13A. Figure 3 As shown, the width of the sealing area R2 may be the same as the width of the exposed portion 13A, or, as shown in FIG. Figure 7 As shown, the width of the sealing region R2 may be greater than the width of the exposed portion 13A. Alternatively, the width of the sealing region R2 may be less than the width of the exposed portion 13A. Note that the width of the sealing region R2 is equal to the width of the sealing portion 18.

[0164] When the width of sealing region R2 is greater than that of exposed portion 13A, the inner periphery of exposed portion 13A may be located outside the inner periphery of sealing region R2. In this case, sealing portion 18 may be provided on both exposed portion 13A and the peripheral edge portion of the first surface of metal oxide layer 14.

[0165] (Edit 2)

[0166] like Figure 8 A and Figure 8 B, the Si-containing layer 13 may have a protruding portion 13B on the first surface. The protruding portion 13B protrudes toward the sealing portion 18. The top of the protruding portion 13B forms an exposed portion 13A that is not covered by the metal oxide layer 14 and is exposed, and is in direct contact with the sealing portion 18. The shape of the top of the protruding portion 13B is not limited to any specific shape, but may be, for example, a planar shape, a shape of an inclined surface, a shape of a curved surface, etc. The protruding portion 13B is preferably in a closed loop shape surrounding the display region R1 in a plan view.

[0167] The protruding portion 13B is disposed in the sealing region R2. The protruding portion 13B may be disposed at the peripheral edge portion of the first surface of the Si-containing layer 13. The metal oxide layer 14 is disposed on the inner side of the protruding portion 13B. The width of the sealing region R2 may be the same as the width W of the protruding portion 13B, or the width of the sealing region R2 may be greater than the width W of the protruding portion 13B. That is, the sealing portion 18 may be disposed only on the protruding portion 13B, or may be disposed on both the protruding portion 13B and the peripheral edge portion of the first surface of the metal oxide layer 14. The height of the first surface of the metal oxide layer 14 may be the same as the height H of the protruding portion 13B, and the first surface of the metal oxide layer 14 and the top of the protruding portion 13B may be in the same plane.

[0168] The height H of the protruding portion 13B is preferably 5 nm or more and 200 nm or less. The width W of the protruding portion 13B is preferably 5 mm or less, or more preferably 2 mm or less, to make the frame of the display device 10 smaller. The protruding portion 13B can be formed of a material similar to that of the Si-containing layer 13.

[0169] (Edit 3)

[0170] In Modification 2, an example has been described in which the height H of the first surface of the metal oxide layer 14 is the same as the height H of the protruding portion 13B. Fig. 9 A and Fig. 9 As shown in FIG. 1B , the height H of the protruding portion 13B may be greater than the height of the first surface of the metal oxide layer 14 . Alternatively, the height H of the protruding portion 13B may be less than the height of the first surface of the metal oxide layer 14 .

[0171] (Edit 4)

[0172] like Fig.10 A and Fig.10As shown in FIG. 1B , a distal end portion of the protrusion portion 13B may protrude toward the center of the display region R1 and cover a peripheral portion of the first surface of the metal oxide layer 14. A cross section of the protrusion portion 13B may have an L shape.

[0173] (Edit 5)

[0174] like Fig.11 A and Fig.11 As shown in FIG. 1B , the metal oxide layer 14 may have an opening 14A in the sealing region R2 outside the display region R1. A portion of the first surface of the Si-containing layer 13 may be exposed through the opening 14A to form an exposed portion 13A. A portion of the sealing portion 18 fills the opening 14A, and the sealing portion 18 is in direct contact with the exposed portion 13A via the opening 14A. The opening 14A preferably has a closed loop shape surrounding the display region R1 in a plan view.

[0175] The opening 14A is provided in the sealing region R2. The opening 14A may be provided along the peripheral edge of the metal oxide layer 14. The width of the sealing region R2 may be the same as the width of the opening 14A, or the width of the sealing region R2 may be greater than the width of the opening 14A. The depth D of the opening 14A is preferably not less than 5 nm and not more than 200 nm. The width W of the opening 14A is preferably 5 mm or less, or more preferably 2 mm or less, so as to make the frame of the display device 10 narrower.

[0176] <3. Second Embodiment>

[0177] [Configuration of Display Device 10A]

[0178] Fig.12 1 is a cross-sectional view showing an example configuration of a display device 10A according to the second embodiment. The display device 10A is different from the display device 10 according to the first embodiment in that a Si-containing layer 31 is further provided on the first surface of the metal oxide layer 14, and the positions of the side surfaces of the Si-containing layer 13, the metal oxide layer 14, and the Si-containing layer 31 are substantially consistent. The Si-containing layer 13 and the Si-containing layer 31 are examples of a first Si-containing layer and a second Si-containing layer, respectively.

[0179] The Si-containing layer 31 is a third protective layer that protects the plurality of light-emitting elements 20. The Si-containing layer 31 has transparency to visible light. The Si-containing layer 31 is disposed on the first surface of the metal oxide layer 14 and substantially covers the entire first surface of the metal oxide layer 14. The Si-containing layer 31 can prevent moisture from entering the plurality of light-emitting elements 20 from the external environment.

[0180] A material similar to that of the Si-containing layer 13 may be adopted as an example as the material of the Si-containing layer 31. The Si-containing layer 31 and the Si-containing layer 13 may be formed of the same material, or may be formed of different materials.

[0181] The sealing portion 18 is in direct contact with the first surface of the Si-containing layer 31 in the sealing region R2 outside the display region R1. The bonding interface between the Si-containing layer 31 and the sealing portion 18 preferably contains Si-O bonds. Since the Si-containing layer 31 and the sealing portion 18 are bonded to each other via the Si-O bonds, the adhesion between the Si-containing layer 31 and the sealing portion 18 can be increased.

[0182] [Functions and effects]

[0183] In the second embodiment, the Si-containing layer 31 is provided on the first surface of the metal oxide layer 14, and the sealing portion 18 is in direct contact with the first surface of the Si-containing layer 31 in the sealing region R2 outside the display region R1. As a result, the adhesion between the sealing portion 18 and the underlying layer can be improved. Therefore, it is possible to prevent moisture from entering from the outside of the display device 10A. Therefore, the reliability of the display device 10A can be improved.

[0184] [Revise]

[0185] (Edit 1)

[0186] like Fig.13 A and Fig.13 B, a side wall 32 covering the side surface of the metal oxide layer 14 may be provided. The side wall 32 is provided in the sealing region R2 outside the display region R1. The side wall 32 may have a closed loop shape surrounding the side surface of the metal oxide layer 14 in a plan view. The peripheral edge portion of the first surface of the Si-containing layer 13 and the peripheral edge portion of the second surface of the Si-containing layer 31 may be connected by the side wall 32. That is, the metal oxide layer 14 may be provided in a protective layer. The side wall 32 may be formed of a material similar to that of the Si-containing layer 13 and / or the Si-containing layer 31.

[0187] (Edit 2)

[0188] like Fig.14 A and Fig.14B, the Si-containing layer 31 may be provided only in the sealing region R2 outside the display region R1. At least a portion of the sealing portion 18 is in contact with the first surface of the Si-containing layer 31. The width of the sealing region R2 may be the same as the width W of the Si-containing layer 31, or the width of the sealing region R2 may be greater than the width W of the Si-containing layer 31. That is, the sealing portion 18 may be provided only on the first surface of the Si-containing layer 31, or may be provided on both the first surface of the Si-containing layer 31 and the first surface of the metal oxide layer 14. The Si-containing layer 31 preferably has a closed loop shape surrounding the display region R1 in a plan view. The width W of the Si-containing layer 31 is preferably 5 mm or less, or more preferably 2 mm or less, so as to make the frame of the display device 10A narrower.

[0189] <4. Modification>

[0190] Although the first and second embodiments of the present disclosure and their modifications have been specifically described above, the present disclosure is not limited to the above-described first and second embodiments and their modifications, and various modifications may be made based on the technical concept of the present disclosure.

[0191] For example, the configurations, methods, steps, shapes, materials, numerical values, etc. mentioned in the above-mentioned first and second embodiments and their modifications are merely examples, and configurations, methods, steps, shapes, materials, numerical values, etc. different from these may be used as needed.

[0192] For example, the configurations, methods, steps, shapes, materials, numerical values, etc. of the above-described first and second embodiments and their modifications may be combined with one another without departing from the gist of the present disclosure.

[0193] For example, unless otherwise specified, each material exemplified in the above-described first and second embodiments and modifications thereof may be used alone, or two or more materials may be combined.

[0194] In the first embodiment, the second embodiment and the modification thereof, an example in which the light emitting element is an OLED element has been described. However, the light emitting element is not limited to these examples and may be a light emitting diode, a semiconductor laser, etc. In addition, two or more OLED elements, light emitting diodes, semiconductor lasers, etc. may be combined.

[0195] In the first embodiment, the second embodiment and the modifications thereof, an example has been described in which the light emitting device is a display device. However, the light emitting device does not have to be a display device and may be a lighting device, etc. The lighting device may include one light emitting element, or may include a plurality of light emitting elements.

[0196] In the first embodiment, the second embodiment and its modifications, an example in which the sealing device is a light emitting device (specifically, a display device) has been described. However, the sealing device does not have to be a light emitting device and may be a light receiving device including one or more light receiving elements.

[0197] For example, the light receiving element may be a photodiode, a solar cell, or a CMOS image sensor.

[0198] In the first embodiment, the second embodiment and the modifications thereof, an example has been described in which the seal portion has a closed loop shape in a plan view. However, the seal portion may be divided at one position or at two or more positions.

[0199] Furthermore, the present disclosure may also adopt the following configurations. (1)

[0201] A light emitting device, comprising:

[0202] A plurality of light emitting elements are arranged in the display area;

[0203] A Si-containing layer covering a plurality of light-emitting elements;

[0204] a metal oxide layer disposed on the Si-containing layer; and

[0205] The sealing portion is disposed outside the display area and includes an organic resin, wherein

[0206] The Si-containing layer has an exposed portion which is not covered by the metal oxide layer and is exposed outside the display region, and the sealing portion is in contact with the exposed portion. (2)

[0208] The light emitting device according to (1), wherein:

[0209] The sealing portion is disposed on the exposed portion, or on both the exposed portion and the metal oxide layer. (3)

[0211] The light emitting device according to (1) or (2), wherein:

[0212] The exposed portion is formed by receding the peripheral edge of the metal oxide layer relative to the peripheral edge of the Si-containing layer. (4)

[0214] The light emitting device according to (1) or (2), wherein:

[0215] The Si-containing layer has a protruding portion protruding toward the sealing portion on the outer side of the display region, and

[0216] The protruding portion forms an exposed portion. (5)

[0218] The light emitting device according to (4), wherein:

[0219] The distal end portion of the protruding portion covers the peripheral edge portion of the upper surface of the metal oxide layer. (6)

[0221] The light emitting device according to (1) or (2), wherein:

[0222] The metal oxide layer has an opening outside the display area, and

[0223] The exposed portion is formed by exposing the Si-containing layer through the opening. (7)

[0225] The light emitting device according to any one of (1) to (6), wherein:

[0226] The thickness of the Si-containing layer is not more than 10 μm, and

[0227] The thickness of the metal oxide layer is not less than 5 nm and not more than 200 nm. (8)

[0229] The light emitting device according to any one of (1) to (7), wherein:

[0230] The width of the exposed part shall not exceed 5mm. (9)

[0232] The light emitting device according to any one of (1) to (8), wherein:

[0233] The Si-containing layer contains silicon (Si) and nitrogen (N), or contains silicon (Si), oxygen (O), and nitrogen (N). (10)

[0235] The light emitting device according to any one of (1) to (9), wherein:

[0236] The metal oxide layer comprises a single layer. (11)

[0238] The light emitting device according to any one of (1) to (10), wherein an interface between the Si-containing layer and the sealing portion includes Si—O bonds. (12)

[0240] The light emitting device according to any one of (1) to (11), wherein the sealing portion contains a silane coupling agent. (13)

[0242] The light emitting device according to any one of (1) to (12), wherein the sealing portion contains at least one of an ultraviolet curing resin and a thermosetting resin. (14)

[0244] A light emitting device according to any one of (1) to (13), wherein the sealing portion has a closed loop shape in a plan view. (15)

[0246] A light emitting device, comprising:

[0247] A plurality of light emitting elements are arranged in the display area;

[0248] a first Si-containing layer covering the plurality of light-emitting elements;

[0249] a metal oxide layer disposed on the first Si-containing layer;

[0250] a second Si-containing layer disposed on the metal oxide layer; and

[0251] The sealing portion is disposed outside the display region and includes an organic resin, wherein the sealing portion is in contact with the second Si-containing layer outside the display region. (16)

[0253] The light emitting device according to (15), wherein:

[0254] The second Si-containing layer has a closed loop shape in a plan view. (17)

[0256] The light emitting device according to (15), further comprising:

[0257] The side wall portion covers the side surface of the metal oxide layer. (18)

[0259] An electronic device comprises the light emitting device according to any one of (1) to (17). (19)

[0261] A sealing device, comprising:

[0262] A plurality of elements are disposed in an element forming region;

[0263] Contains Si layer, covering multiple components;

[0264] a metal oxide layer disposed on the Si-containing layer; and

[0265] a sealing portion, which is provided outside the element forming region and contains an organic resin, wherein

[0266] The Si-containing layer has an exposed portion which is not covered by the metal oxide layer and is exposed outside the element formation region, and the sealing portion is in contact with the exposed portion. (20)

[0268] A sealing device, comprising:

[0269] A plurality of elements are disposed in an element forming region;

[0270] a first Si-containing layer covering the plurality of components;

[0271] a metal oxide layer disposed on the first Si-containing layer;

[0272] a second Si-containing layer disposed on the metal oxide layer; and

[0273] a sealing portion, which is provided outside the element forming region and contains an organic resin, wherein

[0274] The sealing portion is in contact with the second Si-containing layer outside the element forming region.

[0275] <5. Sample Application>

[0276] (Electronic equipment)

[0277] The display devices 10 and 10A according to the above-described embodiments and their modifications (hereinafter, referred to as "display devices 10, etc.") can be provided in various electronic devices. The display devices 10, etc. are particularly suitable for electronic viewfinders, head-mounted displays, etc. of cameras or single-lens reflex cameras that require high resolution, and are used near the eyes in an enlarged manner.

[0278] (Specific example 1)

[0279] Fig.15 A and Fig.15 B shows an example of the appearance of a digital camera 310. The digital camera 310 is a single-lens reflex type with interchangeable lenses, and includes an interchangeable imaging lens unit (interchangeable lens) 312 located approximately in the center of the front surface of a camera body (camera body portion) 311 and a grip portion 313 to be held by a photographer on the front left side.

[0280] The monitor 314 is provided at a position offset to the left from the center of the rear surface of the camera body 311. An electronic viewfinder (eyepiece window) 315 is provided above the monitor 314. By looking at the electronic viewfinder 315, the photographer can visually recognize the optical image of the subject guided from the imaging lens unit 312 and determine the picture composition. The electronic viewfinder 315 includes any one of the above-mentioned display device 10 and the like.

[0281] (Specific Example 2)

[0282] Fig.16 An example of the appearance of the head-mounted display 320 is shown. For example, the head-mounted display 320 includes ear hook portions 322 for the user to wear the head-mounted display 320 on the head on both sides of a display unit 321 in the shape of glasses. The display unit 321 includes any of the above-mentioned display devices 10 and the like.

[0283] (Specific example 3)

[0284] Fig.17 An example of the appearance of a television apparatus 330 is shown. The television apparatus 330 includes a video display screen unit 331 including a front panel 332 and a filter glass 333, and the video display screen unit 331 includes, for example, any of the above-described display devices 10 and the like.

[0285] (Specific example 4)

[0286] Fig.18 An example of the appearance of a see-through head-mounted display 340 is shown. The see-through head-mounted display 340 includes a main body 341 , an arm 342 , and a lens barrel 343 .

[0287] The body 341 is connected to the arm 342 and the glasses 350. Specifically, the end of the body 341 in the long side direction is coupled to the arm 342, and one side of the side surface of the body 341 is coupled to the glasses 350 via a connecting member. Note that the body 341 may be directly mounted on the head of a human body.

[0288] The main body 341 includes a control panel and a display unit for controlling the operation of the see-through head mounted display 340. The arm 342 connects the main body 341 and the lens barrel 343, and supports the lens barrel 343. Specifically, the arm 342 is coupled to the end of the main body 341 and the end of the lens barrel 343, and fixes the lens barrel 343. In addition, the arm 342 includes a signal line for communicating data related to an image to be provided from the main body 341 to the lens barrel 343.

[0289] The lens barrel 343 projects image light supplied from the main body 341 through the arm 342 toward the eyes of the user wearing the see-through head-mounted display 340 through the lens 351. In this see-through head-mounted display 340, the display unit of the main body 341 includes one of the above-described display devices 10 and the like.

[0290] (Specific Example 5)

[0291] Fig.19 An example of the appearance of a smartphone 360 ​​is shown. The smartphone 360 ​​includes a display unit 361 that displays various information, an operation unit 362 formed with buttons for receiving operation inputs from a user, etc. The display unit 361 includes any of the above-described display devices 10 and the like.

[0292] (Specific Example 6)

[0293] The above-mentioned display device 10 and the like may be provided in various displays provided in a vehicle.

[0294] Fig. 20 A and Fig. 20 B is a diagram showing an example of the interior configuration of a vehicle 500 provided with various displays. Specifically, Fig. 20 A is a diagram of an example of the interior state of the vehicle 500 viewed from the rear to the front of the vehicle 500, and Fig. 20 B is a diagram of an example of the interior state of the vehicle 500 viewed from the oblique rear to the oblique front of the vehicle 500 .

[0295] The vehicle 500 includes a central display 501, a console display 502, a head-up display 503, a digital rearview mirror 504, a steering wheel display 505, and a rear entertainment display 506. At least one of these displays includes any one of the above-mentioned display devices 10, etc. For example, all of these displays may include one of the above-mentioned display devices 10, etc.

[0296] The central display 501 is provided at a position of the instrument panel facing the driver's seat 508 and the passenger seat 509 . Fig. 20 A and Fig. 20 B shows an example of a central display 501 having a horizontally elongated shape extending from the driver's seat 508 side to the passenger seat 509 side, but the screen size and placement position of the central display 501 are appropriately selected. The central display 501 can display information sensed by various sensors. As a specific example, the central display 501 can display an image captured by an image sensor, an image of the distance to obstacles in front of or to the side of the vehicle 500 measured by a ToF sensor, the body temperature of a passenger detected by an infrared sensor, etc. The central display 501 can be used to display at least one piece of information, including safety-related information, operation-related information, life log, health-related information, authentication / identification-related information, and entertainment-related information.

[0297] Safety related information is information about drowsiness sensing, outward looking sensing, sensing of mischief of children riding together, presence or absence of wearing of seat belts, sensing of departure of passengers, etc., and is information sensed by, for example, a sensor set to overlap with the rear surface side of the central display 501. Operation related information detects gestures related to the operation of the passenger by using a sensor. The gesture to be sensed may include the operation of various devices in the vehicle 500. For example, the operation of air conditioning equipment, navigation devices, audio-visual (AV) devices, lighting devices, etc. is detected. The life log includes the life logs of all passengers. For example, the life log includes a record of the actions of each passenger in the vehicle. By acquiring and storing the life log, the state of each passenger at the time of the accident can be checked. Health related information uses a sensor such as a temperature sensor to sense the body temperature of the passenger, and estimates the health status of the passenger based on the sensed body temperature. Alternatively, the face portion of the passenger can be imaged by using an image sensor, and the health status of the passenger can be estimated based on the imaged facial expression. In addition, an automatic voice dialogue can be conducted with the passenger, and the health status of the passenger can be estimated based on the content of the response from the passenger. Authentication / identification related information includes a keyless entry function that uses a sensor to perform facial authentication, and a function that automatically adjusts seat height and position through facial recognition. Entertainment related information includes a function that uses a sensor to detect operating information about an AV device used by a passenger, and a function that uses a sensor to recognize a passenger's face and provides content suitable for the passenger through the AV device.

[0298] For example, the console display 502 may be used to display life log information. The console display 502 is provided near a shift lever 511 of a center console 510 between a driver's seat 508 and a passenger seat 509. The console display 502 may also display information detected by various sensors. In addition, the console display 502 may display an image of the vehicle's surroundings captured with an image sensor, or may display an image of the distance to obstacles present in the vehicle's surroundings.

[0299] The head-up display 503 is virtually displayed behind the windshield 512 in front of the driver's seat 508. For example, the head-up display 503 can be used to display at least one of safety-related information, operation-related information, life log, health-related information, authentication / identification-related information, and entertainment-related information. In many cases, the head-up display 503 is virtually set in front of the driver's seat 508 and is suitable for displaying information directly related to the operation of the vehicle 500, such as the speed of the vehicle 500, the remaining amount of fuel (battery), etc.

[0300] The digital rearview mirror 504 can display not only the rear of the vehicle 500 but also the status of rear seat passengers, and therefore, for example, can be used to display life log information by arranging sensors on the rear surface side of the digital rearview mirror 504 in an overlapping manner.

[0301] The steering wheel display 505 is disposed near the center of the steering wheel 513 of the vehicle 500. The steering wheel display 505 can be used, for example, to display at least one piece of information, including safety-related information, operation-related information, life-saving log, health-related information, authentication / identification-related information, and entertainment-related information. Specifically, the steering wheel display 505 is located near the driver's hand and is suitable for displaying life log information such as the driver's body temperature, or is suitable for displaying information about the operation of AV devices, air conditioning equipment, etc.

[0302] The rear entertainment display 506 is installed on the rear surface side of the driver's seat 508 and the front passenger seat 509, and is provided for the rear passengers to enjoy watching / listening. The rear entertainment display 506 can be used to display at least one piece of information, including safety-related information, operation-related information, life log, health-related information, authentication / identification-related information, and entertainment-related information. Specifically, since the rear entertainment display 506 is located in front of the passengers in the rear seats, information related to the passengers in the rear seats is displayed. For example, information about the operation of an AV device or an air-conditioning device can be displayed, or the measurement results of the body temperature of a passenger in a rear seat with a temperature sensor can be displayed, etc.

[0303] The sensor can be arranged on the rear surface side of the display device 10 in an overlapping manner, so that the distance to the object existing in the surrounding can be measured. Optical distance measurement methods are roughly divided into passive and active types. By the passive method, the distance measurement is performed by receiving the light from the object without projecting the light from the sensor onto the object. The passive method includes a lens focusing method, a stereo method and a monocular vision method. The active method includes a distance measurement performed by projecting light onto the object and receiving the reflected light from the object with the sensor to measure the distance. The active method includes an optical radar method, an active stereo method, an illumination difference stereo method, a moiré morphology method and an interference method. Any of the above-mentioned display devices 10, etc. can be used for distance measurement by any of these methods. By setting the sensor on the rear surface side of the above-mentioned display device 10, etc. in an overlapping manner, the above-mentioned passive or active distance measurement can be performed.

[0304] Reference Mark List

[0305] 10.10A Display device

[0306] 11 Circuit Board

[0307] 12 Insulation layer

[0308] 12A Opening

[0309] 13, 31 Si-containing layer

[0310] 13A Exposed part

[0311] 14 Metal oxide layer

[0312] 15 Color Filters

[0313] 15R Red filter section

[0314] 15G Green filter section

[0315] 15B Blue filter section

[0316] 16 Filling resin layer

[0317] 17 Contact part

[0318] 18 Sealing part

[0319] 19 Counter substrate

[0320] 20 Light-emitting element

[0321] 21. First electrode

[0322] 22 OLED layer

[0323] 23. Second electrode

[0324] R1 Display area

[0325] R2 Sealing area

[0326] 310 Digital Camera

[0327] 320 Head-mounted display

[0328] 330 TV equipment

[0329] 340 See-through Head-Mounted Display

[0330] 360 Smartphone

[0331] 500 vehicles.

Claims

1. A light emitting device, comprising: A plurality of light emitting elements are arranged in the display area; a Si-containing layer covering the plurality of light-emitting elements; a metal oxide layer disposed on the Si-containing layer; as well as A sealing portion is disposed outside the display area and includes an organic resin, wherein: The Si-containing layer has an exposed portion which is not covered by the metal oxide layer and is exposed outside the display region, and the sealing portion is in contact with the exposed portion.

2. The light emitting device according to claim 1, wherein: The sealing portion is disposed on the exposed portion, or on both the exposed portion and the metal oxide layer.

3. The light emitting device according to claim 1, wherein: The exposed portion is formed by receding a peripheral edge of the metal oxide layer relative to a peripheral edge of the Si-containing layer.

4. The light emitting device according to claim 1, wherein: The Si-containing layer has a protruding portion protruding toward the sealing portion at the outer side of the display region, and The protruding portion forms the exposed portion.

5. The light emitting device according to claim 4, wherein: A distal end portion of the protruding portion covers a peripheral edge portion of an upper surface of the metal oxide layer.

6. The light emitting device according to claim 1, wherein: The metal oxide layer has an opening outside the display area, and The exposed portion is formed by exposing the Si-containing layer through the opening.

7. The light emitting device according to claim 1, wherein: The thickness of the Si-containing layer is not greater than 10 μm, and The thickness of the metal oxide layer is not less than 5 nm and not more than 200 nm.

8. The light emitting device according to claim 1, wherein: The width of the exposed portion is no greater than 5 mm.

9. The light emitting device according to claim 1, wherein: The Si-containing layer contains silicon (Si) and nitrogen (N), or contains silicon (Si), oxygen (O), and nitrogen (N).

10. The light emitting device according to claim 1, wherein: The metal oxide layer comprises a single layer.

11. The light emitting device according to claim 1, wherein: An interface between the Si-containing layer and the sealing portion includes Si—O bonds.

12. The light emitting device according to claim 1, wherein: The sealing portion includes a silane coupling agent.

13. The light emitting device according to claim 1, wherein: The sealing portion contains at least one of an ultraviolet curable resin and a thermosetting resin.

14. The light emitting device according to claim 1, wherein: The sealing portion has a closed loop shape in a plan view.

15. A light emitting device, comprising: A plurality of light emitting elements are arranged in the display area; a first Si-containing layer covering the plurality of light-emitting elements; a metal oxide layer disposed on the first Si-containing layer; a second Si-containing layer disposed on the metal oxide layer; and The sealing portion is disposed outside the display area and includes an organic resin, wherein: The sealing portion is in contact with the second Si-containing layer outside the display region.

16. The light emitting device according to claim 15, wherein: The second Si-containing layer has a closed loop shape in a plan view.

17. The light emitting device according to claim 15, further comprising: The side wall portion covers the side surface of the metal oxide layer.

18. An electronic device comprising the light emitting device according to claim 1.

19. A sealing device comprising: A plurality of elements are disposed in an element forming region; a Si-containing layer covering the plurality of elements; a metal oxide layer disposed on the Si-containing layer; as well as a sealing portion, which is provided outside the element forming region and contains an organic resin, wherein The Si-containing layer has an exposed portion which is not covered by the metal oxide layer and is exposed outside the element forming region, and the sealing portion is in contact with the exposed portion.

20. A sealing device, comprising: A plurality of elements are disposed in an element forming region; a first Si-containing layer covering the plurality of elements; a metal oxide layer disposed on the first Si-containing layer; a second Si-containing layer disposed on the metal oxide layer; as well as a sealing portion, which is provided outside the element forming region and contains an organic resin, wherein The sealing portion is in contact with the second Si-containing layer outside the element forming region.

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