Waste gas treatment equipment and method

Abstract

The invention provides waste gas treatment equipment and method.The waste gas treatment equipment comprises a reaction cavity, an overflow cavity and a passive rotating turbulent flow device, the passive rotating turbulent flow device comprises a conical spoiler, a spoiler support, a hollow base and base fins, the conical spoiler is used for generating turbulent flow or eddy flow when waste gas passes through the reaction cavity, and the base fins are arranged in the reaction cavity; the base fins are used for controlling the rotating speed of the whole passive rotating turbulent flow device through self rotation, so that the passive rotating turbulent flow device rotates in the reaction cavity. The rotating speed of the whole passive rotating turbulent flow device is controlled through rotation of the base fins, so that rotation of the passive rotating turbulent flow device in the reaction cavity is achieved, gas turbulence is enhanced, waste gas rotating flowing is promoted, temperature distribution is improved, the temperature difference is reduced, and therefore the treatment efficiency is improved. In addition, dust is not easy to accumulate in gas on the inner wall surface of the reaction cavity, so that regular scraper removal is not needed, and the service life of equipment is prolonged.

Description

Technical Field

[0001] The present application relates to the technical field of waste gas treatment, and in particular, to a waste gas treatment device and method. Background Art

[0002] In the industrial production process, waste gas treatment equipment is widely used to reduce harmful gas emissions.

[0003] Currently, in the semiconductor industry, waste gas treatment equipment treats waste gas generated by wafer processing through chemical reactions to reduce the emission of harmful gases.

[0004] However, in the reaction chamber of the waste gas treatment equipment, the waste gas may not fully react or decompose due to the rapid and straight passage through the high-temperature heat source, resulting in low treatment efficiency. At the same time, the stable and fast airflow in the chamber causes uneven temperature distribution and large temperature differences. In addition, the slow gas velocity on the wall of the reaction chamber is prone to dust accumulation, which needs to be regularly removed with a scraper to extend the life of the equipment. Summary of the invention

[0005] In view of this, the purpose of the present application is to provide an exhaust gas treatment device and method, by introducing a passive rotating spoiler device into the reaction chamber and the connected overflow chamber in the exhaust gas treatment device, and controlling the rotation speed of the entire passive rotating spoiler device by rotating the base fins, so as to realize the rotation of the passive rotating spoiler device in the reaction chamber, enhance gas turbulence, promote the rotating flow of exhaust gas, improve temperature distribution, reduce temperature difference, and thus improve treatment efficiency. In addition, dust is not easy to accumulate on the wall gas in the reaction chamber, so there is no need to use a scraper to remove it regularly, which increases the life of the equipment.

[0006] In a first aspect, an embodiment of the present application provides an exhaust gas treatment method, wherein the exhaust gas treatment device comprises a reaction chamber, an overflow chamber and a passive rotating spoiler device; the passive rotating spoiler device comprises a conical spoiler, a spoiler bracket, a hollow base and a base fin;

[0007] The overflow chamber is connected to the reaction chamber; the conical spoiler and the spoiler bracket are placed in the reaction chamber, and the hollow base and the base fin are placed in the overflow chamber; the conical spoiler is connected to the hollow base through the support of the spoiler bracket; the base fin is arranged on the hollow base;

[0008] The conical spoiler is used to generate turbulence or eddy flow when the exhaust gas passes through the reaction chamber;

[0009] The base fin is used to control the rotation speed of the entire passive rotating spoiler device through its own rotation, so as to realize the rotation of the passive rotating spoiler device in the reaction chamber.

[0010] In a possible implementation, the overflow chamber has an overflow chamber water tank;

[0011] The base fin and the hollow base float in the overflow chamber water tank of the overflow chamber; the passive rotating spoiler is placed and floats in the overflow chamber water tank of the overflow chamber;

[0012] The overflow chamber water tank is used to ensure that the passive rotating spoiler device floats in the reaction chamber and overflow chamber of the exhaust gas treatment equipment.

[0013] In a possible implementation manner, the hollow base is a hollow swimming ring-shaped base with fins; the conical spoiler is a porous conical panel; wherein the porous holes are irregular holes.

[0014] In a possible implementation, the overflow chamber water tank is an annular water tank; the overflow chamber water tank is provided with a plurality of water inlets tangential to the edge of the water tank;

[0015] The overflow chamber water tank is used for water to enter the overflow chamber water tank through the water inlet, so as to impact the base fins through the overflow chamber water tank to make the base fins rotate, so as to control the rotation speed of the passive rotating spoiler device.

[0016] In a possible implementation, the upper end of the reaction chamber is provided with a plurality of gas inlets; the lower end of the overflow chamber is provided with a gas outlet; the exhaust gas treatment device includes a control device;

[0017] The control device is used to monitor the gas temperature of the exhaust gas at the gas outlet of the overflow chamber, and adjust the rotation speed of the passive rotating spoiler device based on the gas temperature of the exhaust gas at the gas outlet.

[0018] In a possible implementation manner, monitoring the gas temperature of the exhaust gas at the gas outlet of the overflow chamber includes:

[0019] Acquiring the gas temperature of the exhaust gas at the gas outlet within a preset time;

[0020] Based on the gas temperature of the exhaust gas at the gas outlet within the preset time, the historical temperature distribution uniformity of the exhaust gas within the preset time is obtained.

[0021] In a possible implementation manner, adjusting the rotation speed of the passive rotating spoiler based on the gas temperature of the exhaust gas at the gas outlet includes:

[0022] Acquiring a corresponding current temperature distribution uniformity based on the gas temperature of the exhaust gas at the gas outlet;

[0023] In response to the gas temperature at the gas outlet decreasing and the current temperature distribution uniformity becoming worse than the historical temperature distribution uniformity, increasing the water inlet speed of the water inlet;

[0024] Based on the increased water inlet speed of the water inlet, the rotation speed of the passive rotating spoiler is increased.

[0025] In a possible embodiment, the control device is also used to set a corresponding reasonable gas temperature range for the gas temperature of the exhaust gas at the gas outlet; and adjust the gas temperature of the exhaust gas at the gas outlet to within the reasonable gas temperature range based on the increased water inlet rate of the water inlet.

[0026] In a possible embodiment, the control device is also used to obtain the intake amount of exhaust gas at the gas inlet; in response to the increase in the intake amount of exhaust gas at the gas inlet, the water inlet speed of the water inlet of the overflow chamber is increased to increase the rotation speed of the passive rotating spoiler device.

[0027] In a second aspect, the embodiment of the present application further provides an exhaust gas treatment method, which is applied to the exhaust gas treatment device described in the embodiment of the first aspect; the exhaust gas treatment device includes a reaction chamber, an overflow chamber and a passive rotating spoiler; the passive rotating spoiler includes a conical spoiler, a spoiler bracket, a hollow base and a base fin; the method includes:

[0028] The conical spoiler generates turbulence or eddy flow when the exhaust gas passes through the reaction chamber;

[0029] The base fin controls the rotation speed of the entire passive rotating flow spoiler device through its own rotation, thereby realizing the rotation of the passive rotating flow spoiler device in the reaction chamber.

[0030] An embodiment of the present application provides an exhaust gas treatment device and method, which includes a reaction chamber, an overflow chamber and a passive rotating spoiler device, the passive rotating spoiler device includes a conical spoiler, a spoiler bracket, a hollow base and base fins, the overflow chamber is connected to the reaction chamber; the conical spoiler and the spoiler bracket are placed in the reaction chamber, the hollow base and the base fins are placed in the overflow chamber; the conical spoiler is connected to the hollow base through the support of the spoiler bracket; the base fins are arranged on the hollow base; the conical spoiler is used to generate turbulence or eddy current when the exhaust gas passes through the reaction chamber, and the base fins are used to control the rotation speed of the entire passive rotating spoiler device through its own rotation, so as to realize the rotation of the passive rotating spoiler device in the reaction chamber. The present application introduces a passive rotating spoiler device into the reaction chamber and the connected overflow chamber in the waste gas treatment equipment, and controls the rotation speed of the entire passive rotating spoiler device by rotating the base fins, so as to realize the rotation of the passive rotating spoiler device in the reaction chamber, enhance gas turbulence, promote the rotating flow of waste gas, improve temperature distribution, reduce temperature difference, and thus improve treatment efficiency. In addition, dust is not easy to accumulate on the wall gas in the reaction chamber, so there is no need to use a scraper to remove it regularly, which increases the life of the equipment.

[0031] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0033] Figure 1 is a flow chart of an exhaust gas treatment device provided according to an embodiment of the present application;

[0034] Figure 2 is a side view schematic diagram of the passive rotating spoiler structure;

[0035] Figure 3 is a three-dimensional schematic diagram of the structure of a passive rotating spoiler device;

[0036] Figure 4 It is a schematic diagram of the overall structure of the exhaust gas treatment equipment;

[0037] Figure 5 is a schematic diagram of the water inlet in the overflow chamber;

[0038] Figure 6 It is a schematic diagram of the exhaust gas treatment process;

[0039] Figure 7 It is a flow chart of the exhaust gas treatment method provided according to an embodiment of the present application. DETAILED DESCRIPTION

[0040] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the drawings in the present application only serve the purpose of explanation and description and are not used to limit the scope of protection of the present application. In addition, it should be understood that the schematic drawings are not drawn in real proportion. The flowchart used in this application shows the operations implemented according to some embodiments of the present application. It should be understood that the operations of the flowchart can be implemented out of sequence, and the steps without logical context can be reversed in order or implemented simultaneously. In addition, those skilled in the art can add one or more other operations to the flowchart under the guidance of the content of the present application, or remove one or more operations from the flowchart.

[0041] In addition, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.

[0042] It should be noted that the term "comprising" will be used in the embodiments of the present application to indicate the existence of the features declared thereafter, but does not exclude the addition of other features.

[0043] Considering the industrial production process, in order to reduce the emission of harmful gases, waste gas treatment equipment is widely used. In the semiconductor industry, as a treatment equipment for waste gas generated by wafer processing, it reduces the emission of harmful gases through chemical reactions. The amount of waste gas treated per unit time is a key factor in evaluating the quality of a waste gas treatment equipment. The factors affecting the amount of waste gas treated per unit time are reflected in the residence time of the waste gas in the reaction chamber, whether the reaction is sufficient, and whether the equipment is stable.

[0044] Currently, in the semiconductor industry, waste gas treatment equipment treats waste gas generated by wafer processing through chemical reactions to reduce the emission of harmful gases.

[0045] However, in the reaction chamber of the waste gas treatment equipment, the waste gas may not fully react or decompose due to the rapid and straight passage through the high-temperature heat source, resulting in low treatment efficiency. At the same time, the stable and fast airflow in the chamber causes uneven temperature distribution and large temperature differences. In addition, the slow gas velocity on the wall of the reaction chamber is prone to dust accumulation, which needs to be regularly removed with a scraper to extend the life of the equipment.

[0046] To address this problem, the present application provides an exhaust gas treatment device and method, the exhaust gas treatment device includes a reaction chamber, an overflow chamber and a passive rotating spoiler device, the passive rotating spoiler device includes a conical spoiler, a spoiler bracket, a hollow base and base fins, the overflow chamber is connected to the reaction chamber; the conical spoiler and the spoiler bracket are placed in the reaction chamber, the hollow base and the base fins are placed in the overflow chamber; the conical spoiler is connected to the hollow base through the support of the spoiler bracket; the base fins are arranged on the hollow base; the conical spoiler is used to generate turbulence or eddy current when the exhaust gas passes through the reaction chamber, and the base fins are used to control the rotation speed of the entire passive rotating spoiler device through its own rotation, thereby realizing the rotation of the passive rotating spoiler device in the reaction chamber. The present application introduces a passive rotating spoiler device into the reaction chamber and the connected overflow chamber in the waste gas treatment equipment, and controls the rotation speed of the entire passive rotating spoiler device by rotating the base fins, so as to realize the rotation of the passive rotating spoiler device in the reaction chamber, enhance gas turbulence, promote the rotating flow of waste gas, improve temperature distribution, reduce temperature difference, and thus improve treatment efficiency. In addition, dust is not easy to accumulate on the wall gas in the reaction chamber, so there is no need to use a scraper to remove it regularly, which increases the life of the equipment.

[0047] Figure 1 is a structural block diagram of an exhaust gas treatment device according to an embodiment of the present application. Figure 1 As shown, the exhaust gas treatment device 100 includes a reaction chamber 1, an overflow chamber 2 and a passive rotating spoiler 3; the passive rotating spoiler 3 includes a conical spoiler 31, a spoiler bracket 32, a hollow base 33 and a base fin 34. For example, the side view of the passive rotating spoiler 3 is as shown in Figure 2 As shown, the three-dimensional diagram of the passive rotating spoiler device 3 is as shown in Figure 3 As shown, in Figure 2 and Figure 3 In the figure, the conical spoiler 31, the spoiler bracket 32, the hollow base 33 and the base fins 34 are arranged as shown in the figure.

[0048] The overflow chamber 2 is connected to the reaction chamber 1; the conical spoiler 31 and the spoiler bracket 32 ​​are placed in the reaction chamber 1, and the hollow base 33 and the base fins 34 are placed in the overflow chamber 2; the conical spoiler 31 is connected to the hollow base 33 through the support of the spoiler bracket 32, in other words, the hollow base 33 has a conical spoiler extending into the upper reaction chamber 1; the base fins 34 are arranged on the hollow base 33. For example, Figure 4As shown, the arrangement of the reaction chamber 1, the overflow chamber 2 and the passive rotating spoiler device 3 is as shown in the figure.

[0049] It should be noted that the functions of the reaction chamber 1 and the overflow chamber 2 are known to those skilled in the art. For example, the reaction chamber 1 is used to convert pollutants in the exhaust gas into harmless substances through a specific chemical reaction to treat the exhaust gas; the overflow chamber 2 is used to treat byproducts or waste liquids generated during the exhaust gas treatment process and to protect the inner wall of the reaction chamber 1. This application will not go into detail on this.

[0050] The conical spoiler 31 is used to generate turbulence or eddy flow when the exhaust gas passes through the reaction chamber 1 .

[0051] The base fin 34 is used to control the rotation speed of the entire passive rotating spoiler device 3 by rotating itself, so as to realize the rotation of the passive rotating spoiler device 3 in the reaction chamber 1 .

[0052] The waste gas treatment equipment 100 of the present application includes a reaction chamber 1, an overflow chamber 2 and a passive rotating spoiler device 3, wherein the passive rotating spoiler device 3 includes a conical spoiler 31, a spoiler bracket 32, a hollow base 33 and a base fin 34, and the overflow chamber 2 is connected to the reaction chamber 1; the conical spoiler 31 and the spoiler bracket 32 ​​are placed in the reaction chamber 1, and the hollow base 33 and the base fin 34 are placed in the overflow chamber 2; the conical spoiler 31 is connected to the hollow base 33 through the support of the spoiler bracket 32; the base fin 34 is arranged on the hollow base 33; the conical spoiler 31 is used to generate turbulence or eddy current when the waste gas passes through the reaction chamber 1, and the base fin 34 is used to control the rotation speed of the entire passive rotating spoiler device 3 through its own rotation, so as to realize the rotation of the passive rotating spoiler device 3 in the reaction chamber 1. In the present application, a passive rotating spoiler device 3 is introduced into the waste gas treatment equipment 100 in the reaction chamber 1 and the connected overflow chamber 2, and the rotation speed of the entire passive rotating spoiler device 3 is controlled by the rotation of the base fin 34, so as to realize the rotation of the passive rotating spoiler device 3 in the reaction chamber 1, enhance gas turbulence, promote the rotating flow of waste gas, improve temperature distribution, reduce temperature difference, and thus improve treatment efficiency. In addition, dust is not easily accumulated on the wall gas of the reaction chamber 1, so there is no need to use a scraper to remove it regularly, which improves the life of the equipment.

[0053] Furthermore, the overflow chamber 2 has a water tank. Figure 4 shown.

[0054] Among them, the base fins 34 and the hollow base 33 float in the overflow chamber water tank of the overflow chamber 2; the passive rotating spoiler device 3 is placed and floats in the overflow chamber water tank of the overflow chamber 2.

[0055] It should be noted that the overflow chamber water tank is used to ensure that the passive rotating spoiler device 3 floats in the reaction chamber 1 and the overflow chamber 2 of the exhaust gas treatment device 100. In addition, the water level of the overflow chamber 2 can also be kept stable, etc., which will not be described in detail here. Figure 4 As shown, the device can float in the reaction chamber 1 and the overflow chamber 2 of the exhaust gas treatment device 100 through the overflow water tank on the overflow chamber 2.

[0056] Furthermore, the hollow base 33 is a hollow swimming ring-shaped base with fins; the conical spoiler 31 is a porous conical panel. The porous holes are special-shaped holes. For example, Figure 4 As shown, the overflow chamber water tank on the overflow chamber 2 is used to place a hollow swimming ring-shaped base with fins, and the base is provided with a porous (heterotropic) conical panel (conical spoiler 31) extending into the upper reaction chamber 1, and the base is connected to the conical panel by a bracket.

[0057] Furthermore, the overflow cavity water tank is an annular water tank; the cavity water tank is provided with a plurality of water inlets tangential to the water tank edge. The overflow cavity water tank is provided with a plurality of water inlets tangential to the water tank edge. For example, Figure 5 As shown, it is a schematic diagram of the water inlet in the overflow chamber 2.

[0058] The overflow chamber water tank is used for the water to enter the overflow chamber water tank through the water inlet, so as to impact the base fin 34 through the overflow chamber water tank to make the base fin 34 rotate, so as to control the rotation speed of the passive rotating spoiler 3. For example, Figure 4 As shown, the overflow chamber water tank is provided with a plurality of water inlets tangential to the edge of the annular water tank, so that the water in the water tank rotates and flows, and the water flow impacts the fins on the base of the spoiler device to realize the rotational movement of the spoiler device.

[0059] Furthermore, the upper end of the reaction chamber 1 is provided with a plurality of gas inlets; the lower end of the overflow chamber 2 is provided with a gas outlet; and the waste gas treatment device includes a control device. Figure 4 As shown, it includes multiple gas inlets and a gas outlet, and the control device is not shown in the figure.

[0060] The control device is used to monitor the gas temperature of the exhaust gas at the gas outlet of the overflow chamber 2, and adjust the rotation speed of the passive rotating spoiler 3 based on the gas temperature of the exhaust gas at the gas outlet.

[0061] Optionally, the gas temperature of the exhaust gas at the gas outlet within a preset time is obtained; based on the gas temperature of the exhaust gas at the gas outlet within the preset time, the historical temperature distribution uniformity of the exhaust gas within the preset time is obtained. Optionally, based on the gas temperature of the exhaust gas at the gas outlet, the corresponding current temperature distribution uniformity is obtained; in response to the gas temperature at the gas outlet decreasing, and the current temperature distribution uniformity is worse than the historical temperature distribution uniformity, the water inlet speed of the water inlet is increased; based on the increased water inlet speed of the water inlet, the speed of the passive rotating spoiler 3 is increased. For example, Figure 6 shown.

[0062] When the water inlet speed of the water inlet is increased, the speed of the exhaust gas is increased, so that the water inlet speed of the water inlet is increased based on the increased speed of the exhaust gas.

[0063] Furthermore, the control device is also used to set a corresponding reasonable gas temperature range for the gas temperature of the exhaust gas at the gas outlet; and adjust the gas temperature of the exhaust gas at the gas outlet to within the reasonable gas temperature range based on the increased water inlet speed of the water inlet. Figure 6 shown.

[0064] Furthermore, the control device is also used to control the device, and is also used to obtain the intake amount of the exhaust gas of the gas inlet; in response to the increase in the intake amount of the exhaust gas of the gas inlet, the water inlet speed of the water inlet of the overflow chamber 2 is increased to increase the rotation speed of the passive rotating spoiler 3. For example, Figure 6 shown.

[0065] Specifically, if Figure 6 As shown, by monitoring the gas temperature at the lower end of the overflow chamber 2, the water flow rate at the water inlet entering the overflow chamber 2 is controlled. When the air flow temperature decreases and the temperature distribution uniformity deteriorates, the water inlet speed is increased to accelerate the rotation of the passive rotating spoiler 3.

[0066] It should be noted that by accelerating the rotation of the passive rotating spoiler device 3, the turbulent kinetic energy of the gas is increased, the rotational flow of the exhaust gas in the reaction chamber 1 is realized, the temperature distribution inside the reaction chamber 1 is improved, the temperature difference is reduced, the mixing degree of the gas in the reaction chamber 1 is increased, and the gas in the furnace time is increased, thereby improving the processing efficiency. It can be understood by those skilled in the art that when the increase in gas volume is not particularly large, by increasing the in-furnace time without increasing the heat source power, the processing efficiency can be guaranteed, thereby achieving the purpose of saving energy.

[0067] Therefore, in the present application, a passive rotating flow disturbance device 3 floating in the overflow chamber water tank is placed in the reaction chamber 1 of the waste gas treatment equipment 100 and the overflow chamber 2 connected to the reaction chamber 1. The flow disturbance device is rotated in the reaction chamber 1 through the impact of the water flow in the overflow chamber water tank, the turbulent kinetic energy of the gas is increased, the rotation flow of the waste gas in the reaction chamber 1 is realized, the temperature distribution inside the reaction chamber 1 is improved, the temperature difference is reduced, and the treatment efficiency is improved. At the same time, the Reynolds number is increased, and the dust brought (or generated) by the waste gas inside the reaction chamber 1 is less likely to accumulate on the inner wall of the reaction chamber 1.

[0068] It is understood by those skilled in the art that the waste gas treatment volume per unit time is a key factor in evaluating the quality of a waste gas treatment device. The factors affecting the waste gas treatment volume per unit time are reflected in the waste gas residence time in the reaction chamber, whether the reaction is sufficient, and whether the equipment is stable. However, in the reaction chamber of the current waste gas treatment equipment, after the waste gas contacts the high-temperature heat source in the reaction chamber, it passes directly and quickly in a straight line, so that the waste gas that does not come into contact with the high-temperature heat source may not undergo a chemical reaction, cannot be reacted or decomposed, resulting in a decrease in treatment efficiency; since the airflow inside the reaction chamber is stable and the speed is relatively fast, the temperature distribution inside the reaction chamber is uneven, and affected by the exhaust gas inlet temperature and flow rate, the temperature change gradient in the reaction chamber is too large, that is, a temperature drop of 300-500°C occurs within a short distance (2-5mm), which requires that the heat source in the reaction chamber must have sufficient power and a large coverage range to make the waste gas temperature reach the temperature value for the chemical reaction of the waste gas in the reaction chamber, resulting in energy waste; because the airflow inside the reaction chamber is stable, according to the fluid boundary layer theory, simulation results, and actual conditions, the gas speed on the wall of the reaction chamber is slow, resulting in dust accumulation, which needs to be removed with a scraper inside the reaction chamber to reduce the impact on the service life of the equipment.

[0069] Specifically, the present application, through the waste gas treatment equipment 100 including the passive rotating spoiler 3, can improve the degree of turbulence of the flow field inside the reaction chamber 1, increase internal heat exchange, reduce the uneven temperature distribution, and reduce the temperature difference; improve the degree of turbulence of the flow field inside the reaction chamber 1, increase the velocity of the fluid passing through the wall of the reaction chamber 1, reduce dust adhesion, and extend the service life of the equipment; the temperature inside the reaction chamber 1 is uniform, and the temperature at which the waste gas undergoes a chemical reaction can be reached at the upper part of the reaction chamber 1, thereby increasing the area where the chemical reaction occurs, improving the reaction efficiency, and saving energy; by monitoring the uniformity of the temperature distribution at the outlet of the overflow chamber 2, controlling the water inlet speed of the overflow chamber 2, and then adjusting the rotation speed of the spoiler, the degree of turbulence of the air flow inside the reaction chamber 1 is changed, the gas in the furnace time is changed, and the waste gas treatment efficiency of the equipment is ensured; when the waste gas intake of the equipment increases, the water inlet speed of the overflow chamber 2 is increased, the rotation speed of the spoiler is increased, and the gas in the furnace time is increased. When the amount of gas increased is not particularly large, the treatment efficiency is ensured by increasing the time in the furnace without increasing the heat source power, thereby achieving the purpose of saving energy.

[0070] Figure 7 : is a flow chart of the waste gas treatment method provided according to an embodiment of the present application. The waste gas treatment device 100 applied in the above embodiment; the waste gas treatment device 100 includes a reaction chamber 1, an overflow chamber 2 and a passive rotating spoiler 3; the passive rotating spoiler 3 includes a conical spoiler 31, a spoiler bracket 32, a hollow base 33 and a base fin 34. For example, Figure 2-Figure 4 shown.

[0071] like Figure 7 As shown, the exhaust gas treatment method of the embodiment of the present application may specifically include:

[0072] S701. The conical spoiler generates turbulence or eddy current when the exhaust gas passes through the reaction chamber.

[0073] S702. The base fin controls the rotation speed of the entire passive rotating spoiler device by rotating itself, thereby realizing the rotation of the passive rotating spoiler device in the reaction chamber.

[0074] In the embodiment of the present application, the base fin 34 drives the rotation of the passive rotating spoiler device 3 and adjusts the rotation speed of the passive rotating spoiler device 3 by rotating itself.

[0075] It should be noted that the functions of the reaction chamber 1 and the overflow chamber 2 are known to those skilled in the art. For example, the reaction chamber 1 converts pollutants in the exhaust gas into harmless substances through a specific chemical reaction to treat the exhaust gas; the overflow chamber 2 treats the by-products or waste liquids generated during the exhaust gas treatment process. This application does not go into detail on this.

[0076] The exhaust gas treatment method of the present application is applied to an exhaust gas treatment device 100, which includes a reaction chamber 1, an overflow chamber 2 and a passive rotating spoiler 3, wherein the passive rotating spoiler 3 includes a conical spoiler 31, a spoiler bracket 32, a hollow base 33 and a base fin 34, and the overflow chamber 2 is connected to the reaction chamber 1; the conical spoiler 31 and the spoiler bracket 32 ​​are placed in the reaction chamber 1, and the hollow base 33 and the base fin 34 are placed in the overflow chamber 2; the conical spoiler 31 is connected to the hollow base 33 through the support of the spoiler bracket 32; the base fin 34 is arranged on the hollow base 33; the conical spoiler 31 is used to generate turbulence or eddy current when the exhaust gas passes through the reaction chamber 1, and the base fin 34 is used to control the rotation speed of the entire passive rotating spoiler device 3 through its own rotation, so as to realize the rotation of the passive rotating spoiler device 3 in the reaction chamber 1. In the present application, a passive rotating spoiler device 3 is introduced into the waste gas treatment equipment 100 in the reaction chamber 1 and the connected overflow chamber 2, and the rotation speed of the entire passive rotating spoiler device 3 is controlled by the rotation of the base fin 34, so as to realize the rotation of the passive rotating spoiler device 3 in the reaction chamber 1, enhance gas turbulence, promote the rotating flow of waste gas, improve temperature distribution, reduce temperature difference, and thus improve treatment efficiency. In addition, dust is not easily accumulated on the wall gas of the reaction chamber 1, so there is no need to use a scraper to remove it regularly, which improves the life of the equipment.

[0077] It should be noted here that the explanations and descriptions of the above-mentioned embodiments are also applicable to the waste gas treatment method of the embodiments of the present application, and the specific process will not be repeated here.

[0078] Those skilled in the art can clearly understand that, for the convenience and simplicity of description, the specific working process of the system and device described above can refer to the corresponding process in the method embodiment, and will not be repeated in this application. In the several embodiments provided in this application, it should be understood that the disclosed system, device and method can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the modules is only a logical function division. There may be other division methods in actual implementation. For example, multiple modules or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, indirect coupling or communication connection of devices or modules, which can be electrical, mechanical or other forms.

[0079] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0080] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0081] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a non-volatile computer-readable storage medium that is executable by a processor. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, server, or network device, etc.) to perform all or part of the steps of the deployment method described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as USB flash drives, mobile hard drives, ROM, RAM, magnetic disks, or optical disks.

[0082] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A waste gas treatment device, characterized in that: The exhaust gas treatment equipment comprises a reaction chamber, an overflow chamber and a passive rotating spoiler; the passive rotating spoiler comprises a conical spoiler, a spoiler bracket, a hollow base and a base fin; The overflow chamber is connected to the reaction chamber; the conical spoiler and the spoiler bracket are placed in the reaction chamber, and the hollow base and the base fin are placed in the overflow chamber; The conical spoiler is connected to the hollow base through the support of the spoiler bracket; the base fin is arranged on the hollow base; The conical spoiler is used to generate turbulence or eddy flow when the exhaust gas passes through the reaction chamber; The base fin is used to control the rotation speed of the entire passive rotating spoiler device through its own rotation, so as to realize the rotation of the passive rotating spoiler device in the reaction chamber.

2. The device according to claim 1, characterized in that The overflow chamber has an overflow chamber water tank; The base fin and the hollow base float in the overflow chamber water tank of the overflow chamber; The passive rotating spoiler device is placed and floated in the overflow chamber water tank of the overflow chamber; The overflow chamber water tank is used to ensure that the passive rotating spoiler device floats in the reaction chamber and overflow chamber of the exhaust gas treatment equipment.

3. The device according to claim 2, characterized in that The hollow base is a hollow swimming ring-shaped base with fins; the conical spoiler is a porous conical panel; wherein the porous holes are special-shaped holes.

4. The device according to claim 3, characterized in that The overflow chamber water tank is an annular water tank; the overflow chamber water tank is provided with a plurality of water inlets tangential to the edge of the water tank; The overflow chamber water tank is used for water to enter the overflow chamber water tank through the water inlet, so as to impact the base fins through the overflow chamber water tank to make the base fins rotate, so as to control the rotation speed of the passive rotating spoiler device.

5. The device according to claim 4, characterized in that The upper end of the reaction chamber is provided with a plurality of gas inlets; the lower end of the overflow chamber is provided with a gas outlet; the exhaust gas treatment device includes a control device; The control device is used to monitor the gas temperature of the exhaust gas at the gas outlet of the overflow chamber, and adjust the rotation speed of the passive rotating spoiler device based on the gas temperature of the exhaust gas at the gas outlet.

6. The device according to claim 5, characterized in that The step of monitoring the gas temperature of the exhaust gas at the gas outlet of the overflow chamber comprises: Acquiring the gas temperature of the exhaust gas at the gas outlet within a preset time; Based on the gas temperature of the exhaust gas at the gas outlet within the preset time, the historical temperature distribution uniformity of the exhaust gas within the preset time is obtained.

7. The device according to claim 6, characterized in that The method of adjusting the rotation speed of the passive rotating spoiler device based on the gas temperature of the exhaust gas at the gas outlet comprises: Acquiring a corresponding current temperature distribution uniformity based on the gas temperature of the exhaust gas at the gas outlet; In response to the gas temperature at the gas outlet decreasing and the current temperature distribution uniformity becoming worse than the historical temperature distribution uniformity, increasing the water inlet speed of the water inlet; Based on the increased water inlet speed of the water inlet, the rotation speed of the passive rotating spoiler is increased.

8. The device according to claim 7, characterized in that The control device is also used to set a corresponding reasonable gas temperature range for the gas temperature of the exhaust gas at the gas outlet; and adjust the gas temperature of the exhaust gas at the gas outlet to within the reasonable gas temperature range based on the increased water inlet speed of the water inlet.

9. The device according to claim 8, characterized in that The control device is also used for obtaining the intake volume of the exhaust gas at the gas inlet; in response to the increase in the intake volume of the exhaust gas at the gas inlet, the water inlet speed of the water inlet of the overflow chamber is increased to increase the rotation speed of the passive rotating spoiler.

10. A method for treating waste gas, characterized in that: An exhaust gas treatment device applied to any one of claims 1 to 9; the exhaust gas treatment device comprises a reaction chamber, an overflow chamber and a passive rotating spoiler; the passive rotating spoiler comprises a conical spoiler, a spoiler bracket, a hollow base and a base fin; The conical spoiler generates turbulence or eddy flow when the exhaust gas passes through the reaction chamber; The base fin controls the rotation speed of the entire passive rotating flow spoiler device through its own rotation, thereby realizing the rotation of the passive rotating flow spoiler device in the reaction chamber.

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