Novel roller removing mechanism for silicon wafer production

Abstract

The invention relates to a novel roller rejecting mechanism for silicon wafer production, which comprises a bottom plate, a plurality of groups of upright posts are arranged on the upper side of the bottom plate, connecting shafts are arranged on the upright posts, the connecting shafts are rotatably connected with a supporting plate, a placement frame is arranged on the upper side of the supporting plate, and a plurality of connecting shafts are rotatably connected to the placement frame. Rolling wheels are arranged at the two ends of the connecting shaft respectively, and the supporting plate is further provided with an auxiliary mechanism; a cavity is milled in the middle of the bottom of the supporting plate, the movable end of the air cylinder extends into the cavity, and the top end of the stand column extends into the cavity of the supporting plate. Due to the fact that the cavity is milled in the middle of the bottom of the supporting plate, the air cylinder is installed between the motor and the stand column, the stand column is of an integrated structure, and when the supporting plate inclines downwards, the stand column partially enters the cavity of the supporting plate, installation of the air cylinder is facilitated, the weight reduction effect is achieved, the assembling efficiency is greatly improved, adjustment in the assembling process is facilitated, and the assembling efficiency is improved. The space utilization rate of the whole mechanism is improved, and the cost is reduced.

Description

Technical Field

[0001] The invention belongs to the field of silicon wafer production, and in particular relates to a novel roller rejecting mechanism for silicon wafer production. Background Art

[0002] After visual inspection by the main machine, the solar silicon wafer is transported to the roller rejection conveyor, and the synchronous pulley is driven by a stepper motor to rotate, and then the flat belt is connected to the driven wheel to rotate it, thereby driving the roller to rotate and transport the silicon wafer; if the silicon wafer is detected to be normal, the cylinder remains extended; if the silicon wafer is detected to be abnormal, the roller rejection conveyor is driven down by the ultra-thin cylinder, so that the abnormal silicon wafer slides into the wafer box. There are some shortcomings. The split support plate and support rod are used as the support of the entire mechanism, which is cumbersome to install and not easy to disassemble and repair later; the stepper motor is installed between the cylinder and the support plate, resulting in waste of space in the middle, and the cylinder stroke is also long, which increases the cost; the prior art is provided with a groove on the column composed of the side plate and the support rod, and the engineering drawing dimensional tolerance of the groove is not easy to control, or improper processing of the support rod during the processing may cause the driven shaft to move in series, thereby proposing a new roller rejection mechanism for silicon wafer production. Summary of the invention

[0003] The purpose of this section is to summarize some aspects of embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and the invention title of this application to avoid blurring the purpose of this section, the specification abstract and the invention title, and such simplifications or omissions cannot be used to limit the scope of the present invention.

[0004] In view of the following technical problems in the prior art: the split support plate and support rod serve as the support of the entire mechanism, which are cumbersome to install and not easy to disassemble and repair later; the stepper motor is installed between the cylinder and the support plate, resulting in waste of space in the middle, and the cylinder stroke is also longer, increasing costs; the groove at the connection between the side plate and the support rod, improper control of the dimensional tolerance of the engineering drawing, or improper processing of the support rod during the processing may cause the driven shaft to move in series.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions: a novel roller rejection mechanism for silicon wafer production, comprising a bottom plate, a plurality of columns are arranged on the upper side of the bottom plate, a connecting shaft is arranged on the columns, the connecting shaft is rotatably connected to a support plate, a placement frame is arranged on the upper side of the support plate, a plurality of connecting shafts are rotatably connected to the placement frame, rollers are arranged at both ends of the connecting shaft, and the support plate is also provided with an auxiliary mechanism;

[0006] The middle part of the bottom of the support plate is milled into a cavity, the movable end of the cylinder extends into the cavity, and the top end of the column extends into the cavity of the support plate.

[0007] The auxiliary mechanism includes a movable groove, a transmission belt, a nozzle, an elastic seat, cleaning bristles and a rubber block. A movable groove is respectively opened on both sides of the support plate, and a transmission belt is movably connected in each movable groove. The upper side of the transmission belt is arc-shaped, and a spraying groove is opened in the middle of the top of the transmission belt. A nozzle is arranged on the inner side of the spraying groove, and a scraping unit is respectively arranged on both sides of the top of the transmission belt;

[0008] The scraping unit comprises an elastic seat, cleaning bristles and a rubber block. The top of the elastic seat is provided with cleaning bristles and a rubber block, and the rubber block is distributed near the middle of the transmission belt.

[0009] As an optimal technical solution for a new roller rejection mechanism for silicon wafer production, a photoelectric sensor is arranged on the support plate, and the model of the photoelectric sensor is OS10-AKL150CN6.

[0010] As a preferred technical solution of a new roller rejection mechanism for silicon wafer production, one of the connecting shafts is connected to a driving assembly, the driving assembly is arranged on a support plate, the roller arranged on the connecting shaft connected to the driving assembly is movably connected to an auxiliary mechanism, the driving assembly comprises a motor, a small pulley, a large pulley and a transmission belt, a large pulley is arranged at the power output end of the motor, a small pulley is arranged on one of the connecting shafts, and a transmission belt is connected between the large pulley and the small pulley;

[0011] The motor controls the rotation of the large pulley, which drives the small pulley to rotate through the transmission belt, and the small pulley drives the roller to rotate through the connecting shaft. The roller can drive the silicon wafer placed on the upper side of the roller to move.

[0012] As a preferred technical solution of a new roller rejection mechanism for silicon wafer production, a plurality of cylinders are arranged on the bottom plate, the fixed ends of the cylinders are hinged to the bottom plate, the movable ends of the cylinders extend into the inner side of the corresponding support plates, the movable ends of the cylinders are hinged to a connecting block, and the top end of the connecting block is fixedly connected to the placement frame;

[0013] The roller rotates to transport the silicon wafer; if the photoelectric sensor detects that there is no abnormality in the silicon wafer, the cylinder remains extended; if the photoelectric sensor detects that there is an abnormality in the silicon wafer, the cylinder drives the support plate to tilt, causing the silicon wafer with the abnormality to slide off the roller, thereby removing the abnormal silicon wafer.

[0014] The novel roller rejection mechanism for silicon wafer production of the present invention has the following beneficial effects: since the middle of the bottom of the support plate is milled into a cavity, the cylinder is installed between the motor and the column, and the column is an integrated structure. When the support plate is tilted downward, the column part enters the cavity of the support plate, which is convenient for the installation of the cylinder and also plays a role in weight reduction, greatly improving the efficiency of assembly and facilitating adjustment during the assembly process. The stroke of the cylinder is also reduced by half, and the space utilization rate of the entire mechanism is improved, thereby reducing costs.

[0015] By using a spray trough, a nozzle, an elastic seat, cleaning brush bristles and a rubber block, a water pump is used to draw water from a water tank and spray the water onto the roller through a nozzle, so that the periphery of the roller is moistened, thereby increasing the friction of the roller in transporting silicon wafers. The rubber block scrapes off excess water, and the cleaning brush bristles are frictionally connected to the outside of the roller to scrape off dust on the outside of the roller. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0018] Figure 2 It is a structural schematic diagram of the side surface of the present invention;

[0019] Figure 3 It is a schematic cross-sectional structural diagram of the side of the present invention;

[0020] Figure 4 For the present invention Figure 2 Schematic diagram of the partial structure of part A.

[0021] Figure numerals: 1, base plate; 2, column; 3, support plate; 4, mounting frame; 5, roller; 6, connecting shaft; 7, cylinder; 8, motor; 9, photoelectric sensor; 10, connecting shaft; 11, connecting block; 12, small pulley; 13, large pulley; 14, transmission belt; 15, spraying trough; 16, nozzle; 17, elastic seat; 18, cleaning brush bristles; 19, rubber block; 20, movable groove. DETAILED DESCRIPTION

[0022] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0023] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0024] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0025] Secondly, the present invention is described in detail with reference to the schematic diagram. When describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0026] like Figures 1 to 4 As shown, the present invention proposes a novel roller rejection mechanism for silicon wafer production, comprising a bottom plate 1, a plurality of columns 2 are arranged on the upper side of the bottom plate 1, a connecting shaft 10 is arranged on the column 2, the connecting shaft 10 is rotatably connected to a support plate 3, a placement frame 4 is arranged on the upper side of the support plate 3, a plurality of connecting shafts 6 are rotatably connected to the placement frame 4, rollers 5 are arranged at both ends of the connecting shaft 6, and the support plate 3 is also provided with an auxiliary mechanism;

[0027] The middle part of the bottom of the support plate 3 is milled into a cavity, the movable end of the cylinder 7 extends into the cavity, and the top end of the column 2 extends into the cavity of the support plate 3.

[0028] The auxiliary mechanism includes a movable groove 20, a transmission belt 14, a nozzle 16, an elastic seat 17, a cleaning brush 18 and a rubber block 19. A movable groove 20 is respectively provided on both sides of the support plate 3. A transmission belt 14 is movably connected in each movable groove 20. The upper side of the transmission belt 14 is arc-shaped. A spraying groove 15 is provided in the middle of the top of the transmission belt 14. A nozzle 16 is provided on the inner side of the spraying groove 15. A scraping unit is respectively provided on both sides of the top of the transmission belt 14.

[0029] The scraping unit includes an elastic seat 17 , cleaning bristles 18 and a rubber block 19 . The top of the elastic seat 17 is provided with cleaning bristles 18 and a rubber block 19 . The rubber block 19 is distributed near the middle of the transmission belt 14 .

[0030] As an optimal technical solution for a new roller rejection mechanism for silicon wafer production, a photoelectric sensor 9 is provided on the support plate 3, and the model of the photoelectric sensor 9 is OS10-AKL150CN6.

[0031] As a preferred technical solution of a new roller rejection mechanism for silicon wafer production, one of the connecting shafts 6 is connected to a driving assembly, the driving assembly is arranged on the support plate 3, the roller 5 arranged on the connecting shaft 6 connected to the driving assembly is movably connected to the auxiliary mechanism, the driving assembly includes a motor 8, a small pulley 12, a large pulley 13 and a transmission belt 14, the power output end of the motor 8 is provided with a large pulley 13, one of the connecting shafts 6 is provided with a small pulley 12, and a transmission belt 14 is connected between the large pulley 13 and the small pulley 12;

[0032] The motor 8 controls the rotation of the large pulley 13, and the large pulley 13 rotates with the small pulley 12 through the transmission belt 14. The small pulley 12 rotates with the roller 5 through the connecting shaft 6, and the roller 5 can drive the silicon wafer placed on the upper side of the roller 5 to move.

[0033] As a preferred technical solution of a new roller rejection mechanism for silicon wafer production, a plurality of cylinders 7 are arranged on the bottom plate 1, the fixed ends of the cylinders 7 are hinged to the bottom plate 1, the movable ends of the cylinders 7 extend into the inner side of the corresponding support plate 3, the movable ends of the cylinders 7 are hinged to a connecting block 11, and the top end of the connecting block 11 is fixedly connected to the placement frame 4;

[0034] The roller 5 rotates to transport the silicon wafer; if the photoelectric sensor 9 detects that there is no abnormality in the silicon wafer, the cylinder 7 remains in the extended state; if the photoelectric sensor 9 detects that the silicon wafer is abnormal, the cylinder 7 drives the support plate 3 to tilt, so that the abnormal silicon wafer on the support plate 3 slides off the roller 5, so that the abnormal silicon wafer is removed.

[0035] The nozzle 16 is connected to a water pump, and the water pump is connected to a water tank, and the water tank contains water.

[0036] The specific implementation method is as follows: the motor 8 controls the large pulley 13 to rotate, the large pulley 13 rotates with the small pulley 12 through the transmission belt 14, the small pulley 12 rotates with the roller 5 through the connecting shaft 6, and the roller 5 can drive the silicon wafer placed on the upper side of the roller 5 to move, the water pump draws water from the water tank and sprays the water on the roller 5 through the nozzle 16, so that the periphery of the roller 5 is moistened, and the friction of the roller 5 transporting the silicon wafer is increased, the rubber block 19 scrapes off the excess water, and the cleaning bristles 18 are frictionally connected to the outer side of the roller 5 to scrape off the dust on the outer side of the roller 5.

[0037] It will be appreciated that in the development of any actual implementation, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort may be complex and time-consuming, but will be a routine task of design, fabrication, and production for those of ordinary skill having the benefit of this disclosure without undue experimentation.

[0038] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A new roller rejection mechanism for silicon wafer production, characterized in that: The invention comprises a bottom plate (1), a plurality of columns (2) are arranged on the upper side of the bottom plate (1), a connecting shaft (10) is arranged on the column (2), the connecting shaft (10) is rotatably connected to a support plate (3), a placement frame (4) is arranged on the upper side of the support plate (3), a plurality of connecting shafts (6) are rotatably connected to the placement frame (4), rollers (5) are arranged at both ends of the connecting shafts (6), and the support plate (3) is also provided with an auxiliary mechanism; The auxiliary mechanism comprises a movable groove (20), a transmission belt (14), a nozzle (16) and a rubber block (19); a movable groove (20) is respectively provided on both sides of the support plate (3); a transmission belt (14) is movably connected in each movable groove (20); the upper side of the transmission belt (14) is arc-shaped; a spraying groove (15) is provided in the middle of the top of the transmission belt (14); a nozzle (16) is provided inside the spraying groove (15); and a scraping unit is respectively provided on both sides of the top of the transmission belt (14); The scraping unit comprises an elastic seat (17), cleaning bristles (18) and a rubber block (19); the top of the elastic seat (17) is provided with cleaning bristles (18) and a rubber block (19); the rubber block (19) is distributed near the middle of the transmission belt (14).

2. The novel roller rejection mechanism for silicon wafer production according to claim 1 is characterized in that: A photoelectric sensor (9) is provided on the support plate (3).

3. The novel roller rejection mechanism for silicon wafer production according to claim 1 is characterized in that: One of the connecting shafts (6) is connected to a driving assembly, and the driving assembly is arranged on the support plate (3).

4. The novel roller rejection mechanism for silicon wafer production according to claim 3 is characterized in that: A roller (5) arranged on a connecting shaft (6) connected to the driving assembly is movably connected to the auxiliary mechanism.

5. The novel roller rejection mechanism for silicon wafer production according to claim 4 is characterized in that: The driving assembly comprises a motor (8), a small pulley (12), a large pulley (13) and a transmission belt (14); the power output end of the motor (8) is provided with a large pulley (13); a small pulley (12) is provided on one of the connecting shafts (6); and a transmission belt (14) is connected between the large pulley (13) and the small pulley (12).

6. The novel roller rejection mechanism for silicon wafer production according to claim 1 is characterized in that: A plurality of cylinders (7) are arranged on the base plate (1), the fixed ends of the cylinders (7) are hinged to the base plate (1), the movable ends of the cylinders (7) extend into the inner side of the corresponding support plates (3), the movable ends of the cylinders (7) are hinged to connecting blocks (11), and the top ends of the connecting blocks (11) are fixedly connected to the mounting frame (4).

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