Cooling device of stamping die and stamping die

Abstract

The invention relates to the technical field of stamping, in particular to a cooling device of a stamping die and the stamping die. The cooling assembly comprises a first header, a second header, a third header, a fourth header, a butt joint, a butt joint pipe, a backflow hose, a first water pump, a water tank and a refrigeration mechanism; the male die moves downwards, a workpiece in the female die is subjected to punch forming, the butt joint pipe moves downwards and is inserted into the butt joint for communication, the first water pump, the first header, the first cooling flow channels, the second header, the butt joint, the butt joint pipe, the third header, the second cooling flow channels, the fourth header, the backflow hose and the water tank form a complete cooling water circulation channel, and under the action of the first water pump, the workpiece in the female die is subjected to punch forming. The cooling water circularly flows, cools the female die when passing through the multiple first cooling flow channels, and cools the male die when passing through the multiple second cooling flow channels, so that the problem that the service life of the stamping die is affected due to heating in the stamping process is solved.

Description

Technical Field

[0001] The invention relates to the field of stamping technology, and in particular to a cooling device for a stamping die and the stamping die. Background Art

[0002] Stamping dies are key tools for forming and processing metal sheets. They apply external force to plastically deform or separate metal sheets to produce parts or products with specific shapes, sizes and properties. Stamping dies are usually installed on a press and use the force provided by the press to complete the stamping operation.

[0003] During the stamping process of the workpiece in the stamping die, heat will be generated, causing the temperature of the stamping die to rise, which will accelerate the wear and softening of the die material and cause thermal fatigue cracks, thereby shortening the service life of the die. Summary of the invention

[0004] The purpose of the present invention is to provide a stamping die cooling device and a stamping die, aiming to solve the problem that the stamping die generates heat during the stamping process and affects its service life.

[0005] To achieve the above-mentioned object, in a first aspect, the present invention provides a cooling device for a stamping die, which is applied to a concave die and a convex die; and comprises a cooling assembly; The cooling assembly includes a first header, a second header, a third header, a fourth header, a docking joint, a docking tube, a return hose, a first water pump, a water tank and a refrigeration mechanism; A plurality of first cooling channels are arranged inside the die; a plurality of second cooling channels are arranged inside the punch; the first manifold is fixedly arranged on one side of the die and is communicated with the plurality of first cooling channels respectively; the second manifold is fixedly arranged on the side of the die away from the first manifold and is communicated with the plurality of first cooling channels respectively; the third manifold is fixedly arranged on one side of the punch and is communicated with the plurality of second cooling channels respectively; the fourth manifold is fixedly arranged on the side of the punch away from the third manifold and is communicated with the plurality of second cooling channels respectively; the docking joint is communicated on the top of the second manifold; the docking tube is communicated on the bottom of the third manifold; the return hose is communicated on one side of the fourth manifold; the first water pump is communicated on one side of the first manifold; the water tank is communicated with the return hose and the first water pump, and is located on one side of the first water pump; the refrigeration mechanism is arranged on the water tank.

[0006] Wherein, the docking head comprises a transfer shell, a sleeve, a sliding cylinder, a sealing cover, a docking cylinder, a mounting ring and a spring; The transfer shell is connected and arranged at the top of the second collecting pipe; the sleeve is connected and arranged at the top of the transfer shell; the sliding cylinder is slidably arranged in the sleeve; a plurality of water inlets are arranged on the side of the sliding cylinder; the sealing cover is fixedly arranged at the bottom of the sliding cylinder and is located in the transfer shell; the docking cylinder is connected and arranged at the top of the sliding cylinder; the mounting ring is fixedly arranged on the sliding cylinder; the spring is sleeved on the sleeve and is located between the mounting ring and the transfer shell.

[0007] Wherein, the butt joint further comprises a first sealing ring, a second sealing ring and a third sealing ring; The first sealing ring is fixedly arranged on the top of the sealing cover; the second sealing ring is fixedly arranged in the docking tube; and the third sealing ring is fixedly arranged on the bottom of the mounting ring.

[0008] Wherein, the water tank comprises a box body, a heat conducting plate, a water inlet valve and a water outlet valve; The box body is connected to the return hose and the first water pump, and is located on one side of the first water pump; the heat conduction plate is fixedly arranged on the side of the box body; the water inlet valve is connected and arranged on the top of the box body; the water outlet valve is connected and arranged on the bottom of the box body.

[0009] Wherein, the refrigeration mechanism includes a plurality of semiconductor refrigeration sheets, a fin heat sink and a cooling fan; The plurality of semiconductor cooling fins are respectively fixedly arranged on the heat conducting plate; the fin heat sink is fixedly arranged on the plurality of semiconductor cooling fins; the cooling fan is fixedly arranged on the box body and is located on the side of the fin heat sink.

[0010] Wherein, the cooling assembly further comprises a water collecting cylinder; The water collecting cylinder is fixedly arranged on the top of the mounting ring.

[0011] Wherein, the cooling assembly further comprises a collecting hose, a collecting box, a second water pump and a return pipe; The collecting hose is connected to the water collecting cylinder and is located on one side of the water collecting cylinder; the collecting box is connected to the collecting hose and is located on one side of the collecting hose; the second water pump is connected and arranged on one side of the collecting box; one end of the return pipe is connected to the second water pump, and the other end of the return pipe is connected to the box.

[0012] In a second aspect, the present invention further provides a stamping die, including the cooling device for the stamping die.

[0013] A cooling device and a stamping die of the present invention, wherein cooling water is filled in the water tank, and the refrigeration mechanism is used to cool the water tank so that the cooling water in the water tank is kept at a low temperature; the first header, the second header, the third header and the fourth header are all consistent in structure, and are all composed of a main pipe and a plurality of branch pipes, the plurality of branch pipes of the first header are respectively communicated with the plurality of first cooling channels, the plurality of branch pipes of the second header are respectively communicated with the plurality of first cooling channels, the plurality of branch pipes of the third header are respectively communicated with the plurality of second cooling channels, and the plurality of branch pipes of the fourth header are respectively communicated with the plurality of second cooling channels, when the concave mold and the convex mold are closed, the butt joint is inserted into the butt joint and connected, at this time, the first water pump, the first header, the plurality of the first cooling channels, the second header, the butt joint, the butt joint, the third header, the plurality of the second cooling channels, the fourth header, the return hose and the water tank form a complete cooling water circulation channel, The cooling water circulates under the action of the first water pump; when the punch moves up and away from the die, the docking tube is pulled out from the docking joint, and the docking joint is automatically sealed; when in use, the workpiece is placed in the die, the punch moves down, and after the workpiece is stamped and formed, the mold is closed for a period of time, at which time the docking tube moves down and is inserted into the docking joint for communication, and the first water pump, the first header, multiple first cooling channels, the second header, the docking joint, the docking tube, the third header, multiple second cooling channels, the fourth header, the return hose and the water tank form a complete cooling water circulation channel. Under the action of the first water pump, the cooling water circulates in this cooling water circulation channel. When the cooling water passes through multiple first cooling channels, the die is cooled down, and when the cooling water passes through multiple second cooling channels, the punch is cooled down, thereby solving the problem that the stamping die generates heat during the stamping process and affects its service life; after absorbing the heat of the die and the punch, the cooling water returns to the water tank and is cooled down by the refrigeration mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0015] Figure 1 It is a schematic structural diagram of the first embodiment of the present invention.

[0016] Figure 2 It is a schematic structural diagram of another angle of the first embodiment of the present invention.

[0017] Figure 3 yes Figure 2 A partial enlargement of detail A.

[0018] Figure 4It is a schematic structural diagram of another angle of the first embodiment of the present invention.

[0019] Figure 5 is a cross-sectional view of the first embodiment of the present invention.

[0020] Figure 6 yes Figure 5 A partial enlargement of detail B.

[0021] 1-die, 2-punch, 3-first header, 4-second header, 5-third header, 6-fourth header, 7-joint, 8-joint tube, 9-return hose, 10-first water pump, 11-water tank, 12-refrigeration mechanism, 13-water collection cylinder, 14-collection hose, 15-collection box, 16-second water pump, 17-return pipe, 101-first cooling channel, 201-second cooling channel, 701-transfer shell, 702 -sleeve, 703-sliding cylinder, 704-sealing cover, 705-docking cylinder, 706-mounting ring, 707-spring, 708-first sealing ring, 709-second sealing ring, 710-third sealing ring, 7031-water inlet, 1101-box, 1102-heat conduction plate, 1103-water inlet valve, 1104-water outlet valve, 1201-semiconductor cooling plate, 1202-fin radiator, 1203-cooling fan. DETAILED DESCRIPTION

[0022] The first embodiment of the present application is: See also Figure 1-Figure 6 ,in, Figure 1 It is a schematic structural diagram of the first embodiment of the present invention. Figure 2 It is a schematic structural diagram of another angle of the first embodiment of the present invention. Figure 3 yes Figure 2 A partial enlargement of detail A. Figure 4 It is a schematic structural diagram of another angle of the first embodiment of the present invention. Figure 5 is a cross-sectional view of the first embodiment of the present invention. Figure 6 yes Figure 5 A partial enlargement of detail B.

[0023] The present invention provides a cooling device for a stamping die, which is applied to a die 1 and a punch 2; a plurality of first cooling channels 101 are arranged inside the die 1; a plurality of second cooling channels 201 are arranged inside the punch 2; a cooling assembly is included; the cooling assembly includes a first header 3, a second header 4, a third header 5, a fourth header 6, a butt joint 7, a butt joint 8, a return hose 9, a first water pump 10, a water tank 11 and a refrigeration mechanism 12; the butt joint 7 includes a transfer shell 701, a sleeve 702, a sliding cylinder 703, a sealing cover 704, a butt joint 705, a mounting ring 706 and a spring 707; the sliding cylinder 703 is provided with a side There are multiple water inlets 7031; the docking joint 7 also includes a first sealing ring 708, a second sealing ring 709 and a third sealing ring 710; the water tank 11 includes a box body 1101, a heat conduction plate 1102, an inlet valve 1103 and an outlet valve 1104; the refrigeration mechanism 12 includes multiple semiconductor refrigeration plates 1201, a fin heat sink 1202 and a cooling fan 1203; the cooling component also includes a water collecting tube 13; the cooling component also includes a collecting hose 14, a collecting box 15, a second water pump 16 and a return pipe 17; the above-mentioned solution solves the problem that the stamping die generates heat during the stamping process and affects its service life.

[0024] Furthermore, a plurality of first cooling channels 101 are arranged inside the die 1; a plurality of second cooling channels 201 are arranged inside the punch 2; the first manifold 3 is fixedly arranged on one side of the die 1 and is respectively communicated with the plurality of first cooling channels 101; the second manifold 4 is fixedly arranged on the side of the die 1 away from the first manifold 3 and is respectively communicated with the plurality of first cooling channels 101; the third manifold 5 is fixedly arranged on one side of the punch 2 and is respectively communicated with the plurality of second cooling channels 201; the fourth manifold 6 is fixedly arranged on the side of the punch 2 away from the third manifold 5 and is respectively communicated with the plurality of second cooling channels 201; the docking head 7 is communicated and arranged on the top of the second manifold 4; the docking tube 8 is communicated and arranged on the bottom of the third manifold 5; the return hose 9 is communicated and arranged on one side of the fourth manifold 6; the first water pump 10 is communicated and arranged on one side of the first manifold 3; the water tank 11 is communicated with the return hose 9, and is communicated with the first water pump 10, and is located on one side of the first water pump 10; the refrigeration mechanism 12 is arranged on the water tank 11.

[0025] In this embodiment, the water tank 11 is filled with cooling water, and the refrigeration mechanism 12 is used to cool the water tank 11 so that the cooling water in the water tank 11 is kept at a low temperature; the first header 3, the second header 4, the third header 5 and the fourth header 6 have the same structure and are composed of a main pipe and a plurality of branch pipes. The plurality of branch pipes of the first header 3 are respectively connected to the plurality of first cooling channels 101, the plurality of branch pipes of the second header 4 are respectively connected to the plurality of first cooling channels 101, and the plurality of branch pipes of the third header 5 are respectively connected to the plurality of The first water pump 10, the first header 3, the first cooling channels 101, the second header 4, the butt joint 7, the butt joint 8, the third header 5, the second cooling channels 201, the fourth header 6, the return hose 9 and the water tank 11 form a complete cooling water circulation channel. The cooling water is in the The first water pump 10 circulates the water; when the punch 2 moves upward and away from the die 1, the butt joint 8 is pulled out of the butt joint 7, and the butt joint 7 is automatically sealed; when in use, the workpiece is placed in the die 1, the punch 2 moves downward, and after the workpiece is stamped and formed, the mold is closed for a period of time, at which time the butt joint 8 moves downward and is inserted into the butt joint 7 for communication, the first water pump 10, the first header 3, the first cooling channels 101, the second header 4, the butt joint 7, the butt joint 8, the third header 5, the second cooling channels 201, The fourth header 6, the return hose 9 and the water tank 11 form a complete cooling water circulation channel. Under the action of the first water pump 10, the cooling water circulates in this cooling water circulation channel. When the cooling water passes through multiple first cooling channels 101, the die 1 is cooled. When the cooling water passes through multiple second cooling channels 201, the punch 2 is cooled, thereby solving the problem of heat generation during the stamping process affecting the service life of the stamping die. After absorbing the heat of the die 1 and the punch 2, the cooling water returns to the water tank 11 and is cooled by the refrigeration mechanism 12.

[0026] Furthermore, the transfer shell 701 is connected and arranged at the top of the second collecting pipe 4; the sleeve 702 is connected and arranged at the top of the transfer shell 701; the sliding cylinder 703 is slidably arranged in the sleeve 702; a plurality of water inlets 7031 are arranged on the side of the sliding cylinder 703; the sealing cover 704 is fixedly arranged at the bottom of the sliding cylinder 703 and is located in the transfer shell 701; the docking cylinder 705 is connected and arranged at the top of the sliding cylinder 703; the mounting ring 706 is fixedly arranged on the sliding cylinder 703; the spring 707 is sleeved on the sleeve 702 and is located between the mounting ring 706 and the transfer shell 701.

[0027] In this embodiment, the intermediate shell 701 is connected with the second header 4, and the sliding cylinder 703 can slide in the sleeve 702. There is a water inlet 7031 at the bottom of the sliding cylinder 703, front, back, left and right. When the punch 2 moves down, it will drive the docking tube 8 to move down. The docking tube 8 is first inserted into the docking cylinder 705. The punch 2 drives the docking tube 8 to move down continuously. The docking tube 8 presses down the sliding cylinder 703. At this time, the spring 707 is gradually compressed, and the sliding cylinder 703 slides down, which will drive the sealing cover 704 to move down gradually. The water inlet 7031 also gradually enters into the intermediate shell 701, and the cooling water enters into the sliding cylinder 703 from the multiple water inlets 7031, and then enters into the docking tube 8 from the sliding cylinder 703 to achieve connection. When the punch 2 moves upward, the docking tube 8 moves upward accordingly, and gradually loosens the spring 707. The spring 707 pushes the mounting ring 706, and drives the sliding cylinder 703 to move upward. The multiple water inlets 7031 gradually move upward and move out of the intermediate shell 701, and the sealing cover 704 gradually moves upward and closes to the intermediate shell 701 to achieve sealing.

[0028] Furthermore, the first sealing ring 708 is fixedly arranged on the top of the sealing cover 704 ; the second sealing ring 709 is fixedly arranged in the docking tube 705 ; and the third sealing ring 710 is fixedly arranged on the bottom of the mounting ring 706 .

[0029] In this embodiment, the first sealing ring 708 is arranged between the sealing cover 704 and the intermediate shell 701. When the docking tube 8 is not inserted into the docking tube 705, under the action of the spring 707, the sealing cover 704 drives the first sealing ring 708 to press against the intermediate shell 701 as much as possible, thereby sealing the gap between the sealing cover 704 and the intermediate shell 701, preventing the infiltration of cooling water, and achieving better sealing; when the docking tube 8 moves downward and is inserted into the docking tube 705, the second sealing ring 709 is used to better seal the gap between the docking tube 8 and the docking tube 705; when the docking tube 8 moves downward to the lowest position, the mounting ring 706 drives the third sealing ring 710 to press down on the top of the sleeve 702, thereby sealing the gap between the mounting ring 706 and the top of the sleeve 702, thereby preventing cooling water from infiltrating from the gap between the sliding tube 703 and the sleeve 702.

[0030] Furthermore, the box body 1101 is connected to the return hose 9, and is connected to the first water pump 10, and is located on one side of the first water pump 10; the heat conduction plate 1102 is fixedly arranged on the side of the box body 1101; the water inlet valve 1103 is connected and arranged on the top of the box body 1101; the water outlet valve 1104 is connected and arranged on the bottom of the box body 1101.

[0031] In this embodiment, the right side of the box body 1101 is open, and the heat conducting plate 1102 is installed. One end of the heat conducting plate 1102 is in direct contact with the cooling water in the box body 1101, and the other end is in contact with the cold end of the semiconductor refrigeration plate 1201. The water inlet valve 1103 is used to facilitate the addition of cooling water into the box body 1101, and the water outlet valve 1104 is used to facilitate the discharge of the cooling water in the box body 1101 for easy cleaning.

[0032] Furthermore, the plurality of semiconductor cooling sheets 1201 are respectively fixedly arranged on the heat conducting plate 1102 ; the fin heat sink 1202 is fixedly arranged on the plurality of semiconductor cooling sheets 1201 ; the cooling fan 1203 is fixedly arranged on the box body 1101 and is located on the side of the fin heat sink 1202 .

[0033] In this embodiment, the cold ends of the multiple semiconductor refrigeration plates 1201 are in contact with the heat conduction plate 1102, which are used to cool the cooling water in the box 1101, and the hot ends of the multiple semiconductor refrigeration plates 1201 are in contact with the fin heat sink 1202, and the heat is dissipated with the assistance of the cooling fan 1203.

[0034] Furthermore, the water collecting cylinder 13 is fixedly arranged on the top of the mounting ring 706 .

[0035] In this embodiment, after the docking tube 8 is connected with the docking head 7, cooling water circulates for a period of time to cool down the die 1 and the punch 2. After the cooling is completed, when the docking tube 8 moves up and separates from the docking head 7, the cooling water in the docking tube 8 and the third collecting pipe 5 and part of the cooling water in the plurality of second cooling channels 201 will flow out of the docking tube 8. Therefore, the water collecting tube 13 is provided to catch the cooling water flowing down.

[0036] Furthermore, the collecting hose 14 is connected to the water collecting cylinder 13 and is located on one side of the water collecting cylinder 13; the collecting box 15 is connected to the collecting hose 14 and is located on one side of the collecting hose 14; the second water pump 16 is connected and arranged on one side of the collecting box 15; one end of the return pipe 17 is connected to the second water pump 16, and the other end of the return pipe 17 is connected to the box body 1101.

[0037] In this embodiment, the cooling water collected by the water collecting cylinder 13 flows from the collecting hose 14 into the collecting box 15 , and then flows back into the box body 1101 from the return pipe 17 under the action of the second water pump 16 .

[0038] In the cooling device of a stamping die described in this embodiment, the water tank 11 is filled with cooling water, and the refrigeration mechanism 12 is used to cool the water tank 11 so that the cooling water in the water tank 11 is kept at a low temperature; the first header 3, the second header 4, the third header 5 and the fourth header 6 have the same structure and are composed of a main pipe and a plurality of branch pipes, the plurality of branch pipes of the first header 3 are respectively connected to the plurality of first cooling channels 101, the plurality of branch pipes of the second header 4 are respectively connected to the plurality of first cooling channels 101, the plurality of The branch pipes are respectively connected to the plurality of second cooling channels 201, and the plurality of branch pipes of the fourth header 6 are respectively connected to the plurality of second cooling channels 201. When the female mold 1 and the male mold 2 are molded together, the butt joint 8 is inserted into the butt joint 7 and connected. At this time, the first water pump 10, the first header 3, the plurality of first cooling channels 101, the second header 4, the butt joint 7, the butt joint 8, the third header 5, the plurality of second cooling channels 201, the fourth header 6, the return hose 9 and the water tank 11 form a complete cooling water circulation channel , the cooling water circulates under the action of the first water pump 10; when the punch 2 moves up and away from the die 1, the butt joint 8 is pulled out from the butt joint 7, and the butt joint 7 is automatically sealed; when in use, the workpiece is placed in the die 1, the punch 2 moves down, and after the workpiece is stamped and formed, the mold is closed for a period of time, at which time the butt joint 8 moves down and is inserted into the butt joint 7 for communication, the first water pump 10, the first header 3, the first cooling channels 101, the second header 4, the butt joint 7, the butt joint 8, the third header 5, the second cooling channels 2 01. The fourth manifold 6, the return hose 9 and the water tank 11 form a complete cooling water circulation channel. Under the action of the first water pump 10, the cooling water circulates in this cooling water circulation channel. When the cooling water passes through multiple first cooling channels 101, the die 1 is cooled. When the cooling water passes through multiple second cooling channels 201, the punch 2 is cooled, thereby solving the problem of heat generation during the stamping process that affects the service life of the stamping die. After absorbing the heat of the die 1 and the punch 2, the cooling water returns to the water tank 11 and is cooled by the refrigeration mechanism 12.

[0039] The second embodiment of the present application is: The present invention provides a stamping die, comprising the cooling device of the stamping die.

[0040] What is disclosed above is only one or more preferred embodiments of the present application, and cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiments and equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. A stamping die cooling device, applied to a die and a punch; characterized in that: including a cooling assembly; The cooling assembly includes a first header, a second header, a third header, a fourth header, a docking joint, a docking tube, a return hose, a first water pump, a water tank and a refrigeration mechanism; A plurality of first cooling channels are arranged inside the die; a plurality of second cooling channels are arranged inside the punch; the first manifold is fixedly arranged on one side of the die and is communicated with the plurality of first cooling channels respectively; the second manifold is fixedly arranged on the side of the die away from the first manifold and is communicated with the plurality of first cooling channels respectively; the third manifold is fixedly arranged on one side of the punch and is communicated with the plurality of second cooling channels respectively; the fourth manifold is fixedly arranged on the side of the punch away from the third manifold and is communicated with the plurality of second cooling channels respectively; the docking joint is communicated on the top of the second manifold; the docking tube is communicated on the bottom of the third manifold; the return hose is communicated on one side of the fourth manifold; the first water pump is communicated on one side of the first manifold; the water tank is communicated with the return hose and the first water pump, and is located on one side of the first water pump; the refrigeration mechanism is arranged on the water tank.

2. A stamping die cooling device as claimed in claim 1, characterized in that: The docking joint comprises a transfer shell, a sleeve, a sliding cylinder, a sealing cover, a docking cylinder, a mounting ring and a spring; The transfer shell is connected and arranged at the top of the second collecting pipe; the sleeve is connected and arranged at the top of the transfer shell; the sliding cylinder is slidably arranged in the sleeve; a plurality of water inlets are arranged on the side of the sliding cylinder; the sealing cover is fixedly arranged at the bottom of the sliding cylinder and is located in the transfer shell; the docking cylinder is connected and arranged at the top of the sliding cylinder; the mounting ring is fixedly arranged on the sliding cylinder; the spring is sleeved on the sleeve and is located between the mounting ring and the transfer shell.

3. A stamping die cooling device as claimed in claim 2, characterized in that: The docking joint further comprises a first sealing ring, a second sealing ring and a third sealing ring; The first sealing ring is fixedly arranged on the top of the sealing cover; the second sealing ring is fixedly arranged in the docking tube; and the third sealing ring is fixedly arranged on the bottom of the mounting ring.

4. A stamping die cooling device as claimed in claim 3, characterized in that: The water tank comprises a tank body, a heat conducting plate, a water inlet valve and a water outlet valve; The box body is connected to the return hose and the first water pump, and is located on one side of the first water pump; the heat conduction plate is fixedly arranged on the side of the box body; the water inlet valve is connected and arranged on the top of the box body; the water outlet valve is connected and arranged on the bottom of the box body.

5. A stamping die cooling device as claimed in claim 4, characterized in that: The refrigeration mechanism includes a plurality of semiconductor refrigeration sheets, a fin heat sink and a cooling fan; The plurality of semiconductor cooling fins are respectively fixedly arranged on the heat conducting plate; the fin heat sink is fixedly arranged on the plurality of semiconductor cooling fins; the cooling fan is fixedly arranged on the box body and is located on the side of the fin heat sink.

6. A stamping die cooling device as claimed in claim 5, characterized in that: The cooling assembly also includes a water collecting cylinder; The water collecting cylinder is fixedly arranged on the top of the mounting ring.

7. A stamping die cooling device as claimed in claim 6, characterized in that: The cooling assembly also includes a collection hose, a collection box, a second water pump and a return pipe; The collecting hose is connected to the water collecting cylinder and is located on one side of the water collecting cylinder; the collecting box is connected to the collecting hose and is located on one side of the collecting hose; the second water pump is connected and arranged on one side of the collecting box; one end of the return pipe is connected to the second water pump, and the other end of the return pipe is connected to the box.

8. A stamping die, characterized in that: A cooling device for a stamping die comprising the cooling device as described in any one of claims 1 to 7.

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