Polishing processing management method and system for multi-size semiconductor silicon wafers

Abstract

The embodiment of the invention relates to the technical field of semiconductors, and discloses a polishing processing management method and system for multi-size semiconductor silicon wafers. The method comprises the steps of obtaining information of a plurality of processing brushes in real time; a received processing task is obtained, and the processing task at least comprises the size and the target specification of the silicon wafer to be processed; the processing task and the information of the multiple processing brushes are substituted into the processing management model, a processing scheme matched with the processing task is generated, and the processing scheme at least comprises a processing route, the processing duration of each processing brush and the estimated processing condition of each processing brush; and performing polishing processing on the processing task based on the processing scheme matched with the processing task. The technical problems that in the existing polishing technology, fine polishing cloth needs to be frequently and manually replaced, production operation is complex, the overall production efficiency is reduced, and even a large amount of waste is generated due to frequent replacement of the polishing cloth, and negative influences are caused to the environment are solved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, specifically to the field of semiconductor silicon wafer polishing technology, and in particular to a polishing processing management method and system for semiconductor silicon wafers of multiple sizes. Background Art

[0002] In the manufacturing process of semiconductor devices, the polishing of silicon wafers is a key process. Its surface quality and flatness directly affect the quality of subsequent processes and the performance of the final product. In the traditional polishing process, when switching to silicon wafers of different sizes, it is usually necessary to stop the machine and replace the corresponding polishing cloth, which not only increases the operation steps, but also affects the production efficiency and the consistency of polishing quality.

[0003] However, in the existing polishing technology for silicon wafers, the fine polishing cloth needs to be frequently replaced manually, which not only complicates the production operation, but also reduces the overall production efficiency. Frequent replacement of polishing cloth even generates a large amount of waste, which has a negative impact on the environment. At the same time, it reduces the flexibility of production, making it not suitable for a multi-variety, small-batch production model.

[0004] Accordingly, the art needs a new polishing process management solution for multi-sized semiconductor silicon wafers to solve the above problems. Summary of the invention

[0005] One purpose of the present application is to provide a polishing processing management method and system for semiconductor silicon wafers of multiple sizes, at least to solve the technical problem that in the existing polishing technology for silicon wafers, frequent manual replacement of fine polishing cloth is required, which not only complicates the production operation, but also reduces the overall production efficiency. Frequent replacement of polishing cloth even generates a large amount of waste, which has a negative impact on the environment. At the same time, it reduces the flexibility of production, making it not suitable for a multi-variety, small-batch production model.

[0006] To achieve the above objectives, some embodiments of the present application provide the following aspects:

[0007] In a first aspect, some embodiments of the present application provide a polishing process management method for semiconductor silicon wafers of multiple sizes, the method comprising:

[0008] Acquire information of multiple processing brushes in real time, wherein the information includes processing specifications and processing status of each processing brush;

[0009] Acquire the received processing task, wherein the processing task at least includes the size and target specifications of the silicon wafer to be processed;

[0010] Substituting the processing task and the information of the plurality of processing brushes into the processing management model, and generating a processing plan matching the processing task, wherein the processing plan at least includes a processing route, a processing time of each processing brush, and an estimated processing status of each processing brush;

[0011] Based on the processing scheme matched with the processing task, a polishing process for the processing task is performed.

[0012] Furthermore, the real-time acquisition of information of multiple processing brushes includes:

[0013] Obtain the specification data, material data, and usage time of each processing brush in real time;

[0014] Determine the processing condition of each processing brush based on the usage time and material data of each processing brush, wherein the processing condition at least includes the degree of wear of the processing brush;

[0015] Based on the specification data of each processing brush and the processing situation, the processing specification of each processing brush is determined.

[0016] Furthermore, before obtaining the received processing task, the method further includes:

[0017] Based on the information of the plurality of processing brushes, determining the range of a plurality of processable specifications of the production line, wherein the types of the plurality of processable specifications at least include a plurality of processable sizes of silicon wafers, a processable time for each processable size, and a plurality of processable polishing qualities;

[0018] The range of multiple processable specifications of the production line is fed back to the process management model.

[0019] Further, the determining of the range of multiple processable specifications of the production line based on the information of the multiple processing brushes includes:

[0020] Based on the information of the plurality of processing brushes, determining the current state of each processing brush, wherein the current state at least includes an effective processing area, a remaining time to be replaced, and processing data per unit time;

[0021] Based on the current status of each processing brush, the range of multiple processable specifications on the production line is determined.

[0022] Further, the determining of the range of multiple processable specifications on the production line based on the current state of each processing brush includes:

[0023] Determining a range of a plurality of processable sizes of the production line based on an effective processing area in a current state of each processing brush;

[0024] Determine the processing time of each processable size of the production line based on the remaining time required to be replaced in the current state of each process brush;

[0025] Based on the remaining time required to replace each processing brush in the current state and the processing data per unit time, determine the range of polishing quality that can be processed corresponding to each processing brush position of the production line;

[0026] To obtain a range of multiple processable specifications on the production line.

[0027] Furthermore, the step of substituting the processing task and the information of the plurality of processing brushes into the processing management model to generate a processing solution matching the processing task includes:

[0028] Based on the information of the multiple processing brushes and the processing tasks, multiple groups of processing schemes to be executed are generated, wherein the processing schemes to be executed include processing routes and processing time of each processing brush;

[0029] Based on the information of the plurality of processing brushes, selectively updating the range of the plurality of processable specifications on the production line and the current state of each processing brush in the processing management model;

[0030] Based on the processing tasks, the current state of each processing brush, the multiple groups of processing plans to be executed, and the ranges of multiple processable specifications of the latest production line, the multiple groups of processing plans to be executed are screened to obtain the reserved multiple groups of processing plans to be executed and the temporarily reserved multiple groups of processing plans to be executed;

[0031] Based on the number of the reserved multiple groups of processing schemes to be executed, selectively generate adjustment schemes for the temporarily reserved multiple groups of processing schemes to be executed, wherein the adjustment scheme at least includes increasing the processing time of any one or more processing brushes, adjusting the processing order of multiple processing brushes, and enabling a temporary processing line;

[0032] Based on the screened multiple groups of processing solutions to be executed and the selectively generated adjustment plans of the multiple groups of processing solutions to be executed that are temporarily reserved, a group of processing solutions to be executed is selected;

[0033] The estimated processing status of each processing brush in the processing scheme to be executed is obtained to obtain a processing scheme matching the processing task.

[0034] Further, based on the processing tasks, the current state of each processing brush, the multiple groups of processing solutions to be executed, and the range of multiple processable specifications of the latest production line, the multiple groups of processing solutions to be executed are screened to obtain the multiple groups of processing solutions to be executed that are retained and the multiple groups of processing solutions to be executed that are temporarily retained, including:

[0035] Based on the processing task, determine whether the processing task meets the range of multiple processable specifications of the latest production line:

[0036] If the judgment is yes, then based on the multiple groups of processing schemes to be executed and the current state of each processing brush, it is judged whether each group of processing schemes to be executed needs to replace the processing brush, and at least one processing brush that needs to be replaced in the processing schemes to be executed is selectively marked;

[0037] Based on the two judgment results, the multiple groups of processing solutions to be executed are screened to obtain the multiple groups of processing solutions to be executed that are retained and the multiple groups of processing solutions to be executed that are temporarily retained.

[0038] Furthermore, the generating of adjustment schemes of the temporarily reserved multiple groups of processing schemes to be executed based on the temporarily reserved multiple groups of processing schemes to be executed includes:

[0039] If there is at least one marked processing brush in the temporarily reserved processing scheme to be executed, the adjustment scheme corresponding to the temporarily reserved processing scheme to be executed includes enabling a temporary processing line;

[0040] Based on the information of each marked processing brush, determining the information of the temporary brushes in assembling the temporary processing line;

[0041] Based on the information of the temporary brush and the temporarily reserved processing scheme to be executed, determining the temporary processing duration corresponding to the temporary brush and the temporary processing position of the temporary brush in the processing route;

[0042] or,

[0043] If at least one marked processing brush does not exist in the temporarily reserved processing scheme to be executed, generating a plurality of adjustment schemes corresponding to the temporarily reserved processing scheme to be executed based on the temporarily reserved processing scheme to be executed;

[0044] Generate multiple groups of adjustment processing solutions based on the multiple groups of adjustment solutions corresponding to the temporarily reserved processing solutions to be executed;

[0045] Based on the processing task, the current state of each processing brush, the multiple groups of adjustment processing schemes and the range of multiple processable specifications of the latest production line, the multiple groups of adjustment processing schemes are screened to obtain the screened multiple groups of adjustment processing schemes;

[0046] Based on the screened multiple groups of adjustment processing schemes, determine multiple groups of adjustment schemes corresponding to the temporarily reserved processing schemes to be executed;

[0047] In order to obtain the adjustment schemes corresponding to the multiple groups of processing schemes to be executed that are temporarily reserved.

[0048] Furthermore, the selection of a group of processing solutions to be executed based on the screened multiple groups of processing solutions to be executed and the selectively generated adjustment solutions of the multiple groups of processing solutions to be executed temporarily reserved includes:

[0049] Based on the selectively generated adjustment schemes of the multiple groups of temporarily reserved processing schemes to be executed, an adjusted processing scheme to be executed corresponding to each group of temporarily reserved processing schemes to be executed is obtained;

[0050] Simulating each group of the screened processing schemes to be executed and each group of the adjusted processing schemes to be executed to obtain simulation data, wherein the simulation data at least includes product simulation specifications, product simulation dimensions, and polishing processing time;

[0051] A group of processing schemes to be executed is selected based on the simulation data of each group of processing schemes to be executed or the simulation data of each group of adjusted processing schemes to be executed.

[0052] On the second aspect, some embodiments of the present application also provide a polishing processing management system for semiconductor silicon wafers of multiple sizes, the system comprising a communication module, a processing management model and a control device, the communication module being used to realize communication connection between the system and polishing equipment components and a management terminal, the processing management model being used to automatically generate a processing plan matching the processing task based on the processing task and information of multiple processing brushes, the control device comprising: one or more processing modules; and a storage module storing a program code, wherein the program code, when executed, enables the processor to execute the steps of the method described above.

[0053] Compared with the related art, in the solution provided in the embodiment of the present application, the information of multiple processing brushes obtained in real time and the received processing tasks are substituted into the processing management model to generate a processing plan matching the processing task, and the processing plan is executed to realize polishing processing on the processing task, thereby realizing automatic generation of a processing plan matching the processing task, simplifying the operating process, improving production efficiency, saving labor costs, and reducing environmental pollution risks, thereby improving equipment utilization and production flexibility, and avoiding the need for frequent manual replacement of fine polishing cloths in the existing polishing technology for silicon wafers, which not only complicates production operations, but also reduces overall production efficiency. Frequent replacement of polishing cloths even generates a large amount of waste, which has a negative impact on the environment, and reduces production flexibility, making it unsuitable for the technical problem of multi-variety and small-batch production modes. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0055] Figure 1 This is a schematic diagram of an exemplary process of a polishing process management method for semiconductor silicon wafers of multiple sizes provided according to the first embodiment of the present application;

[0056] Figure 2 A schematic structural diagram of a polishing process management system for semiconductor silicon wafers of multiple sizes provided according to a second embodiment of the present application;

[0057] Figure 3 An exemplary structural diagram of the electronic device is disclosed.

[0058] List of reference numerals:

[0059] 200: polishing process management system; 201: control device; 2011: processing module; 2012: storage module; 2013: program code; 202: process management model; 203: communication module;

[0060] 1101: processor; 1102: memory; 1103: input device; 1104: output device. DETAILED DESCRIPTION

[0061] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0062] First embodiment

[0063] The first embodiment of the present application relates to a polishing management method for semiconductor silicon wafers of multiple sizes. Figure 1 As shown, the method may include the following steps:

[0064] Step S101: acquiring information of multiple processing brushes in real time, wherein the information includes processing specifications and processing status of each processing brush;

[0065] Specifically, the real-time acquisition of information of multiple processing brushes includes:

[0066] Obtain the specification data, material data, and usage time of each processing brush in real time;

[0067] Determine the processing condition of each processing brush based on the usage time and material data of each processing brush, wherein the processing condition at least includes the degree of wear of the processing brush;

[0068] Based on the specification data of each processing brush and the processing situation, the processing specification of each processing brush is determined.

[0069] Specifically, the processing brush can be a nylon brush or a polishing cloth. The selection of the processing brush here is only an exemplary description. In actual testing, those skilled in the art can make a selection according to actual needs, which will not be repeated here.

[0070] Specifically, the degree of wear of the processing brush can be expressed by the percentage of the unworn part of the original processing brush, or by the percentage of the lost part of the original processing brush. The choice of the method of expressing the degree of wear of the processing brush here is only an exemplary description. In actual testing, technical personnel in this field can make a choice according to actual needs, which will not be repeated here.

[0071] Specifically, the method for determining the processing status of each processing brush can adopt the simulation technology in the prior art, or it can be a trained neural network model. The selection of the determination method here is only an exemplary explanation. In actual testing, technical personnel in this field can make a selection according to actual needs. As long as the processing status of each processing brush can be determined based on the usage time and material data of each processing brush, it will not be repeated here.

[0072] In the above embodiment, by acquiring the specification data, material data and usage time of each processing brush in real time, the processing status of each processing brush is determined, real-time monitoring of multiple processing brushes is achieved, and the current wear state of each processing brush is accurately determined, thereby improving the stability and reliability of the polishing process.

[0073] Step S102: Acquire the received processing task, wherein the processing task at least includes the size and target specification of the silicon wafer to be processed;

[0074] Furthermore, before obtaining the received processing task, the method further includes:

[0075] Based on the information of the plurality of processing brushes, determining the range of a plurality of processable specifications of the production line, wherein the types of the plurality of processable specifications at least include a plurality of processable sizes of silicon wafers, a processable time for each processable size, and a plurality of processable polishing qualities;

[0076] The range of multiple processable specifications of the production line is fed back to the process management model.

[0077] Specifically, the determining of the ranges of multiple processable specifications of the production line based on the information of the multiple processing brushes includes:

[0078] Based on the information of the plurality of processing brushes, determining the current state of each processing brush, wherein the current state at least includes an effective processing area, a remaining time to be replaced, and processing data per unit time;

[0079] Based on the current status of each processing brush, the range of multiple processable specifications on the production line is determined.

[0080] Specifically, the determining of the range of multiple processable specifications on the production line based on the current state of each processing brush includes:

[0081] Determining a range of a plurality of processable sizes of the production line based on an effective processing area in a current state of each processing brush;

[0082] Determine the processing time of each processable size of the production line based on the remaining time required to be replaced in the current state of each process brush;

[0083] Based on the remaining time required to replace each processing brush in the current state and the processing data per unit time, determine the range of polishing quality that can be processed corresponding to each processing brush position of the production line;

[0084] To obtain a range of multiple processable specifications on the production line.

[0085] Specifically, the numerical values ​​within the range of the multiple processable specifications can be continuous or discrete. The selection of numerical values ​​within the range of the multiple processable specifications here is only an exemplary description. In actual testing, technical personnel in this field can make a selection according to actual needs, which will not be repeated here.

[0086] In the above embodiment, the range of multiple processable specifications on the production line is determined through the information of each processing brush, and the range is fed back to the processing management model to verify whether the processing task meets the range of multiple processable specifications on the production line, thereby facilitating adaptive adjustment of the processing plan for the processing task, thereby improving the matching degree between the processing plan and the processing task.

[0087] Step S103: Substituting the processing task and the information of the multiple processing brushes into the processing management model, generating a processing plan matching the processing task, wherein the processing plan at least includes a processing route, a processing time of each processing brush, and an estimated processing status of each processing brush;

[0088] Specifically, the step of substituting the processing task and the information of the plurality of processing brushes into the processing management model to generate a processing solution matching the processing task includes:

[0089] Based on the information of the multiple processing brushes and the processing tasks, multiple groups of processing schemes to be executed are generated, wherein the processing schemes to be executed include processing routes and processing time of each processing brush;

[0090] Based on the information of the plurality of processing brushes, selectively updating the range of the plurality of processable specifications on the production line and the current state of each processing brush in the processing management model;

[0091] Based on the processing tasks, the current state of each processing brush, the multiple groups of processing plans to be executed, and the ranges of multiple processable specifications of the latest production line, the multiple groups of processing plans to be executed are screened to obtain the reserved multiple groups of processing plans to be executed and the temporarily reserved multiple groups of processing plans to be executed;

[0092] Based on the number of the reserved multiple groups of processing schemes to be executed, selectively generate adjustment schemes for the temporarily reserved multiple groups of processing schemes to be executed, wherein the adjustment scheme at least includes increasing the processing time of any one or more processing brushes, adjusting the processing order of multiple processing brushes, and enabling a temporary processing line;

[0093] Based on the screened multiple groups of processing solutions to be executed and the selectively generated adjustment plans of the multiple groups of processing solutions to be executed that are temporarily reserved, a group of processing solutions to be executed is selected;

[0094] The estimated processing status of each processing brush in the processing scheme to be executed is obtained to obtain a processing scheme matching the processing task.

[0095] Specifically, the method for generating multiple groups of processing solutions to be executed can be obtained by using a trained neural network model, or by using an artificial intelligence learning model. The selection of the method for generating multiple groups of processing solutions to be executed here is only an exemplary description. In actual testing, technical personnel in this field can make a selection based on actual needs, as long as it is possible to generate multiple groups of processing solutions to be executed based on the information of multiple processing brushes and processing tasks, and no further details will be given here.

[0096] Specifically, selectively updating the ranges of multiple processable specifications on the production line in the processing management model based on the information of the multiple processing brushes includes:

[0097] According to the information of the plurality of processing brushes, a plurality of processable specification ranges of the production line matching the plurality of processing brushes are generated;

[0098] According to the ranges of the multiple processable specifications of the production line matched with the multiple processing brushes, the ranges of the multiple processable specifications on the production line in the process management model are selectively updated.

[0099] Specifically, the selectively updating the ranges of multiple processable specifications on the production line in the processing management model according to the ranges of multiple processable specifications of the production line matching the multiple processing brushes includes:

[0100] If the ranges of the multiple processable specifications of the production line matched with the multiple processing brushes are inconsistent with the ranges of the multiple processable specifications on the production line stored in the processing management model, the ranges of the multiple processable specifications on the production line in the processing management model are updated based on the ranges of the multiple processable specifications of the production line matched with the multiple processing brushes, and the current state of each processing brush is updated based on the information of the multiple processing brushes;

[0101] Otherwise, the updating of the range of the plurality of processable specifications on the production line in the process management model and the updating of the current status of each process brush are not performed.

[0102] Specifically, based on the processing tasks, the current state of each processing brush, the multiple groups of processing solutions to be executed, and the range of multiple processable specifications of the latest production line, the multiple groups of processing solutions to be executed are screened to obtain the reserved multiple groups of processing solutions to be executed and the temporarily reserved multiple groups of processing solutions to be executed, including:

[0103] Based on the processing task, determine whether the processing task meets the range of multiple processable specifications of the latest production line:

[0104] If the judgment is yes, then based on the multiple groups of processing schemes to be executed and the current state of each processing brush, it is judged whether each group of processing schemes to be executed needs to replace the processing brush, and at least one processing brush that needs to be replaced in the processing schemes to be executed is selectively marked;

[0105] Based on the two judgment results, the multiple groups of processing solutions to be executed are screened to obtain the multiple groups of processing solutions to be executed that are retained and the multiple groups of processing solutions to be executed that are temporarily retained.

[0106] Specifically, based on the processing task, determining whether the processing task meets the range of multiple processable specifications of the latest production line includes:

[0107] If the size of the silicon wafer to be processed in the processing task does not meet the range of multiple processable sizes of the production line, or the processable polishing quality corresponding to each processing brush position of the production line does not meet the range of target specifications of the silicon wafer to be processed in the processing task, it is determined that the processing task does not meet the range of multiple processable specifications of the production line;

[0108] Otherwise, it is determined that the processing task satisfies a range of multiple processable specifications of the production line.

[0109] Specifically, judging whether each group of processing schemes to be executed needs to replace the processing brush based on the multiple groups of processing schemes to be executed and the current state of each processing brush includes:

[0110] If any difference between the remaining time required to be replaced in the latest current state of the processing brush and the total processing time of each processing brush in the processing scheme to be executed is lower than a preset remaining time threshold, it is determined that the processing brush in the scheme to be executed needs to be replaced, and at least one processing brush in the scheme to be executed that needs to be replaced is marked;

[0111] Otherwise, it is determined that the solution to be executed does not require replacement of the processing brush.

[0112] Specifically, based on the processing tasks, the current state of each processing brush, multiple groups of processing solutions to be executed, and the ranges of multiple processable specifications of the latest production line, multiple groups of processing solutions to be executed are screened, and the retained multiple groups of processing solutions to be executed and the temporarily retained multiple groups of processing solutions to be executed include:

[0113] If both judgment results are yes, then the pending processing plan is determined to be a temporarily reserved pending processing plan;

[0114] If the first judgment result is yes, and the second judgment result is no, then the processing schemes to be executed are determined to be the reserved multiple groups of processing schemes to be executed;

[0115] If the first judgment result is no, and the second judgment result is yes, then the processing scheme to be executed is determined to be a temporarily reserved processing scheme to be executed;

[0116] If the results of both judgments are negative, the processing scheme to be executed is eliminated;

[0117] In this way, multiple groups of processing solutions to be executed that are reserved and multiple groups of processing solutions to be executed that are temporarily reserved are obtained.

[0118] Specifically, the selectively generating adjustment schemes for the temporarily reserved multiple groups of processing schemes to be executed based on the number of the reserved multiple groups of processing schemes to be executed includes:

[0119] If the number of the reserved multiple groups of processing solutions to be executed is lower than a preset reserved number threshold, then based on the temporarily reserved multiple groups of processing solutions to be executed, an adjustment plan for the temporarily reserved multiple groups of processing solutions to be executed is generated;

[0120] Otherwise, the adjustment plan for generating the temporarily reserved multiple groups of processing plans to be executed will not be executed.

[0121] Specifically, the preset retention quantity threshold may be 3 or 2. The setting of the preset retention quantity threshold here is only an exemplary description. In actual testing, those skilled in the art may set it according to actual needs, which will not be elaborated here.

[0122] Specifically, the generating of the adjustment schemes of the temporarily reserved multiple groups of processing schemes to be executed based on the temporarily reserved multiple groups of processing schemes to be executed includes:

[0123] If there is at least one marked processing brush in the temporarily reserved processing scheme to be executed, the adjustment scheme corresponding to the temporarily reserved processing scheme to be executed includes enabling a temporary processing line;

[0124] Based on the information of each marked processing brush, determining the information of the temporary brushes in assembling the temporary processing line;

[0125] Based on the information of the temporary brush and the temporarily reserved processing scheme to be executed, determining the temporary processing duration corresponding to the temporary brush and the temporary processing position of the temporary brush in the processing route;

[0126] or,

[0127] If at least one marked processing brush does not exist in the temporarily reserved processing scheme to be executed, generating a plurality of adjustment schemes corresponding to the temporarily reserved processing scheme to be executed based on the temporarily reserved processing scheme to be executed;

[0128] Generate multiple groups of adjustment processing solutions based on the multiple groups of adjustment solutions corresponding to the temporarily reserved processing solutions to be executed;

[0129] Based on the processing task, the current state of each processing brush, the multiple groups of adjustment processing schemes and the range of multiple processable specifications of the latest production line, the multiple groups of adjustment processing schemes are screened to obtain the screened multiple groups of adjustment processing schemes;

[0130] Based on the screened multiple groups of adjustment processing schemes, determine multiple groups of adjustment schemes corresponding to the temporarily reserved processing schemes to be executed;

[0131] In order to obtain the adjustment schemes corresponding to the multiple groups of processing schemes to be executed that are temporarily reserved.

[0132] Specifically, the temporary brush may be a nylon brush. The selection of the temporary brush here is only an exemplary description. In actual testing, those skilled in the art may select the temporary brush according to actual needs, and it will not be described in detail here.

[0133] Specifically, the screening method for screening multiple groups of adjustment processing solutions is the same as the screening method for screening multiple groups of processing solutions to be executed, and in the screening of the multiple groups of adjustment processing solutions, only the retained multiple groups of adjustment processing solutions are used as the screened multiple groups of adjustment processing solutions.

[0134] Specifically, the selection of a group of processing solutions to be executed based on the screened multiple groups of processing solutions to be executed and the selectively generated adjustment solutions of the multiple groups of processing solutions to be executed temporarily reserved includes:

[0135] Based on the selectively generated adjustment schemes of the multiple groups of temporarily reserved processing schemes to be executed, an adjusted processing scheme to be executed corresponding to each group of temporarily reserved processing schemes to be executed is obtained;

[0136] Simulating each group of the screened processing schemes to be executed and each group of the adjusted processing schemes to be executed to obtain simulation data, wherein the simulation data at least includes product simulation specifications, product simulation dimensions, and polishing processing time;

[0137] A group of processing schemes to be executed is selected based on the simulation data of each group of processing schemes to be executed or the simulation data of each group of adjusted processing schemes to be executed.

[0138] Specifically, based on the simulation data of each group of processing solutions to be executed or the simulation data of each group of adjusted processing solutions to be executed, a group of processing solutions to be executed is selected, including:

[0139] Determine the specification accuracy and the size accuracy of each group of processing solutions to be executed or each group of adjusted processing solutions to be executed based on the processing tasks, the simulation data of each group of processing solutions to be executed or the simulation data of each group of adjusted processing solutions to be executed;

[0140] Based on the specification accuracy and size accuracy of each group of processing schemes to be executed or each group of adjusted processing schemes to be executed, each group of processing schemes to be executed or each group of adjusted processing schemes to be executed is sorted into different types, wherein the different types at least include the specification accuracy, the size accuracy and the polishing processing time;

[0141] Based on the arrangement order of different types, a group of processing schemes to be executed with the highest specification accuracy, the highest size accuracy and the shortest polishing time are selected as the processing schemes to be executed.

[0142] Specifically, if there are three processing schemes to be executed with the highest specification accuracy, the highest size accuracy and the shortest polishing time, then the processing scores of the three processing schemes to be executed are determined according to the specification accuracy, size accuracy and polishing time of the three processing schemes to be executed;

[0143] Select a group of processing solutions to be executed with the highest processing scores as the selected processing solutions to be executed;

[0144] If the processing scheme with the highest specification accuracy and the highest size accuracy is the same, and the processing scheme with the shortest polishing time is another, the processing scheme with the highest specification accuracy and the highest size accuracy is selected as the processing scheme to be executed;

[0145] If the processing scheme with the highest specification accuracy and the shortest polishing time is the same, and the processing scheme with the highest size accuracy is another, the processing scheme with the highest specification accuracy and the shortest polishing time is selected as the processing scheme to be executed;

[0146] If the processing scheme with the highest dimensional accuracy and the shortest polishing time is the same, and the processing scheme with the highest specification accuracy is another, the processing scheme with the highest dimensional accuracy and the shortest polishing time will be selected as the processing scheme to be executed.

[0147] Specifically, the simulation data corresponding to the processing scheme to be executed also includes simulation loss data of each processing brush in the processing scheme to be executed;

[0148] The obtaining of the estimated processing status of each processing brush in the processing scheme to be executed to obtain a processing scheme matching the processing task includes:

[0149] Determine an estimated processing condition of each processing brush in the processing scheme to be executed based on the processing time of each processing brush in the processing scheme to be executed and the simulation data corresponding to the processing scheme to be executed, wherein the estimated processing condition at least includes an estimated degree of wear of the processing brush;

[0150] The estimated processing status of each processing brush in the processing plan to be executed and the processing plan to be executed are used to form a processing plan that matches the processing task.

[0151] In the above embodiment, in the model processing, multiple groups of processing schemes to be executed are generated through the information and processing tasks of multiple processing brushes, and the automatic generation of multiple groups of processing schemes to be executed is realized. Then, through the information of multiple processing brushes, the ranges of multiple processable specifications and the current status of each processing brush are selectively updated, and the accurate confirmation of the range of processable specifications of the production line and the current status of each processing brush is realized. Then, combined with the above data, the multiple groups of processing schemes to be executed are screened to obtain the reserved and temporarily reserved multiple groups of processing schemes to be executed, and self-checking of the multiple groups of processing schemes to be executed is realized, and the temporarily reserved multiple groups of processing schemes to be executed are screened out, so that when the number of the reserved multiple groups of processing schemes to be executed is too low, the temporarily reserved multiple groups of processing schemes to be executed can be adjusted. and selectively generate adjustment plans for the temporarily reserved multiple groups of processing plans to be executed according to the number of the reserved multiple groups of processing plans to be executed, and select a group of processing plans to be executed according to the reserved multiple groups of processing plans to be executed and the selectively generated multiple groups of adjustment plans to ensure further screening of the multiple groups of processing plans to be executed, and obtain the estimated processing status of each processing brush in the processing plan to be executed to obtain a processing plan that matches the processing task, so as to ensure that the processing plan matches the processing task, and to facilitate timely replacement of the processing brush through the estimated processing status of each processing brush, so as to avoid the situation where the processing brush needs to be replaced, resulting in too long or too short processing time, which in turn leads to steps on the wafer surface, or excessive wear of the processing brush resulting in poor polishing surface quality.

[0152] Step S104: Based on the processing scheme matching the processing task, perform a polishing process on the processing task.

[0153] It is not difficult to find that compared with the related art, in the solution provided in the embodiment of the present application, the information of multiple processing brushes obtained in real time and the received processing tasks are substituted into the processing management model to generate a processing plan matching the processing task, and the processing plan is executed to realize polishing processing for the processing task, thereby realizing automatic generation of a processing plan matching the processing task, simplifying the operation process, improving production efficiency, saving labor costs, and reducing environmental pollution risks, thereby improving equipment utilization and production flexibility, and avoiding the need for frequent manual replacement of fine polishing cloths in the existing polishing technology for silicon wafers, which not only complicates production operations, but also reduces overall production efficiency. Frequent replacement of polishing cloths even generates a large amount of waste, which has a negative impact on the environment, and reduces production flexibility, making it unsuitable for multi-variety, small-batch production modes.

[0154] It should be pointed out that although the various steps in the above embodiments are described in a specific order, those skilled in the art can understand that in order to achieve the effects of the present invention, different steps do not have to be performed in such an order. They can be performed simultaneously (in parallel) or in other orders. These changes are within the scope of protection of the present invention.

[0155] The step division of the above methods is only for clear description. When implemented, they can be combined into one step or some steps can be split and decomposed into multiple steps. As long as they include the same logical relationship, they are all within the protection scope of this application; adding insignificant modifications to the algorithm or process or introducing insignificant designs without changing the core design of the algorithm and process are all within the protection scope of this patent.

[0156] Second embodiment

[0157] The second embodiment of the present application relates to a polishing management system for semiconductor silicon wafers of multiple sizes. Figure 2 As shown, the polishing process management system 200 includes a communication module 203, a process management model 202 and a control device 201. The communication module 203 is used to realize the communication connection between the system and the polishing equipment components and the management terminal. The process management model 202 is used to automatically generate a processing plan that matches the processing task based on the processing task and the information of multiple processing brushes. The control device 201 includes: one or more processing modules 2011; and a storage module 2012 storing a program code 2013. When the program code 2013 is executed, the processing module 2011 executes the steps of the method provided in any one or more of the above-mentioned embodiments.

[0158] Specifically, the communication device 202 can be connected via wifi, Bluetooth, etc., or can be connected by wire. The selection of the communication device 202 here is only an exemplary description. In actual testing, those skilled in the art can select it according to actual needs, as long as the communication device 202 can be used to realize the communication connection between the system and the polishing equipment components and the management terminal, and no further details will be given here.

[0159] It is not difficult to find that this embodiment is a system embodiment corresponding to the first embodiment, and this embodiment can be implemented in conjunction with the first embodiment. The relevant technical details mentioned in the first embodiment are still valid in this embodiment, and in order to reduce repetition, they are not repeated here. Accordingly, the relevant technical details mentioned in this embodiment can also be applied in the first embodiment.

[0160] It is worth mentioning that all modules involved in this embodiment are logic modules. In practical applications, a logic unit can be a physical unit, a part of a physical unit, or a combination of multiple physical units. In addition, in order to highlight the innovative part of this application, this embodiment does not introduce units that are not closely related to solving the technical problems proposed by this application, but this does not mean that there are no other units in this embodiment.

[0161] In addition, the polishing management system 200 of some embodiments of the present application also includes an electronic device. The electronic device can be various forms of digital computers, such as laptop computers, desktop computers, workbenches, personal digital assistants, servers, blade servers, mainframe computers, etc. The electronic device can also be various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices and other similar computing devices.

[0162] Figure 3 An exemplary structural diagram of the electronic device is disclosed. Figure 3 As shown, the electronic device includes: one or more processors 1101, memory 1102, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. The various components are connected to each other using different buses, and can be installed on a common mainboard or installed in other ways as needed. The processor can process instructions executed in the electronic device, including instructions stored in or on the memory to display the graphical information of the GUI on an external input / output device (such as a display device coupled to the interface). In some other embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Similarly, multiple electronic devices can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Among them, the components shown in this article, their connections and relationships, and their functions are only used as examples, and are not intended to limit the implementation of the present application described and / or required herein.

[0163] The electronic device may further include: an input device 1103 and an output device 1104. The processor 1101, the memory 1102, the input device 1103 and the output device 1104 may be connected via a bus or other means. Figure 3 The example of connecting through bus is taken in the following.

[0164] The input device 1103 can receive input digital or character information, and generate key signal input related to the user settings and function control of the electronic device, such as a touch screen, a keypad, a mouse, a track pad, a touch pad, an indicator bar, one or more mouse buttons, a trackball, a joystick and other input devices. The output device 1104 may include a display device, an auxiliary lighting device (e.g., an LED) and a tactile feedback device (e.g., a vibration motor), etc. The display device may include, but is not limited to, a liquid crystal display (LCD), a light emitting diode (LED) display and a plasma display. In some embodiments, the display device may be a touch screen.

[0165] To provide interaction with a user, the electronic device may be a computer. The computer has: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or a trackball), through which the user can provide input to the computer. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0166] In the embodiments of the present application, a computer program / instruction is stored on a computer-readable medium, and when the computer program / instruction is executed by a processor, the steps of the method provided by any one or more of the above embodiments are implemented. The computer-readable medium may be included in the electronic device described in the above embodiments; or it may exist independently without being assembled into the device. The above computer-readable medium carries one or more computer-readable instructions.

[0167] The memory 1102 can be used as a non-transient computer-readable storage medium, which can be used to store non-transient software programs, non-transient computer executable programs and modules. The processor 1101 executes various functional applications and data processing of the server by running the non-transient software programs, instructions and modules stored in the memory 1102, so as to implement the program instructions / modules corresponding to the method provided by any one or more embodiments in the embodiments of the present application.

[0168] The memory 1102 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created according to the use of the electronic device, etc. In addition, the memory 1102 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory 1102 may optionally include a memory remotely arranged relative to the processor 1101, and these remote memories may be connected to the electronic device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0169] It should be noted that the computer-readable medium described in the present application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared or semiconductor system, device or device, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system, device or device.

[0170] Computer readable media include permanent and non-permanent, removable and non-removable media, and can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, modules of programs or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, read-only compact disk (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape disk storage or other magnetic storage devices or any other non-transmission medium that can be used to store information that can be accessed by a computing device.

[0171] Computer program code for performing the operations of the present application may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages, such as Java, Smalltalk, C++, and conventional procedural programming languages, such as "C" language or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as an independent software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., using an Internet service provider to connect via the Internet).

[0172] In the above-described embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. For example, it can be implemented by using an application specific integrated circuit (ASIC), a general-purpose computer or any other similar hardware device. In certain embodiments, the software program of the present application can be executed by a processor to implement the above steps or functions. Similarly, the software program of the present application (including relevant data structures) can be stored in a computer-readable recording medium, for example, a RAM memory, a magnetic or optical drive or a floppy disk and similar devices. In addition, some steps or functions of the present application can be implemented by hardware, for example, as a circuit that cooperates with a processor to perform each step or function.

[0173] The computer program product provided in the embodiment of the present application includes one or more computer programs / instructions, and when the computer program / instructions are executed by the processor, the process or function described in the embodiment of the present application is generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions may be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions may be transmitted from a website site, a computer, a server or a data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, server or data center. The computer-readable storage medium may be any available medium that a computer can access or a data storage device such as a server or a data center that includes one or more available media integrations. The available medium may be a magnetic medium, (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid-state drive so lid state di sk (SSD)), etc.

[0174] The flow chart or block diagram in the accompanying drawings shows the possible architecture, function and operation of the equipment, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented with a dedicated system for hardware that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0175] The scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the present application. Any figure mark in the claims should not be regarded as limiting the claims involved. In addition, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or devices stated in the device claim may also be implemented by one unit or device through software or hardware. The words "first", "second", etc. are only used to distinguish the description, and do not indicate any particular order, nor can they be understood as indicating or implying relative importance.

[0176] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily mention changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims, and the above embodiments should be regarded as exemplary and non-restrictive.

Claims

1. A polishing management method for semiconductor silicon wafers of multiple sizes, characterized in that: The method comprises: Acquire information of multiple processing brushes in real time, wherein the information includes processing specifications and processing status of each processing brush; Acquire the received processing task, wherein the processing task at least includes the size and target specifications of the silicon wafer to be processed; Substituting the processing task and the information of the plurality of processing brushes into the processing management model, and generating a processing plan matching the processing task, wherein the processing plan at least includes a processing route, a processing time of each processing brush, and an estimated processing status of each processing brush; Based on the processing scheme matched with the processing task, a polishing process for the processing task is performed.

2. The method according to claim 1, characterized in that The real-time acquisition of information of multiple processing brushes includes: Obtain the specification data, material data, and usage time of each processing brush in real time; Determine the processing condition of each processing brush based on the usage time and material data of each processing brush, wherein the processing condition at least includes the degree of wear of the processing brush; Based on the specification data of each processing brush and the processing situation, the processing specification of each processing brush is determined.

3. The method according to claim 2, characterized in that Before obtaining the received processing task, the method further includes: Based on the information of the plurality of processing brushes, determining the range of a plurality of processable specifications of the production line, wherein the types of the plurality of processable specifications at least include a plurality of processable sizes of silicon wafers, a processable time for each processable size, and a plurality of processable polishing qualities; The range of multiple processable specifications of the production line is fed back to the process management model.

4. The method according to claim 3, characterized in that The step of determining the range of multiple processable specifications of the production line based on the information of the multiple processing brushes comprises: Based on the information of the plurality of processing brushes, determining the current state of each processing brush, wherein the current state at least includes an effective processing area, a remaining time to be replaced, and processing data per unit time; Based on the current status of each processing brush, the range of multiple processable specifications on the production line is determined.

5. The method according to claim 4, characterized in that The method of determining the range of multiple processable specifications on the production line based on the current state of each processing brush includes: Determining a range of a plurality of processable sizes of the production line based on an effective processing area in a current state of each processing brush; Determine the processing time of each processable size of the production line based on the remaining time required to be replaced in the current state of each process brush; Based on the remaining time required to replace each processing brush in the current state and the processing data per unit time, determine the range of polishing quality that can be processed corresponding to each processing brush position of the production line; To obtain a range of multiple processable specifications on the production line.

6. The method according to claim 5, characterized in that Substituting the processing task and the information of the plurality of processing brushes into the processing management model to generate a processing solution matching the processing task includes: Based on the information of the multiple processing brushes and the processing tasks, multiple groups of processing schemes to be executed are generated, wherein the processing schemes to be executed include processing routes and processing time of each processing brush; Based on the information of the plurality of processing brushes, selectively updating the range of the plurality of processable specifications on the production line and the current state of each processing brush in the processing management model; Based on the processing tasks, the current state of each processing brush, the multiple groups of processing plans to be executed, and the ranges of multiple processable specifications of the latest production line, the multiple groups of processing plans to be executed are screened to obtain the reserved multiple groups of processing plans to be executed and the temporarily reserved multiple groups of processing plans to be executed; Based on the number of the reserved multiple groups of processing schemes to be executed, selectively generate adjustment schemes for the temporarily reserved multiple groups of processing schemes to be executed, wherein the adjustment scheme at least includes increasing the processing time of any one or more processing brushes, adjusting the processing order of multiple processing brushes, and enabling a temporary processing line; Based on the screened multiple groups of processing solutions to be executed and the selectively generated adjustment plans of the multiple groups of processing solutions to be executed that are temporarily reserved, a group of processing solutions to be executed is selected; The estimated processing status of each processing brush in the processing scheme to be executed is obtained to obtain a processing scheme matching the processing task.

7. The method according to claim 6, characterized in that The method of screening the multiple groups of processing schemes to be executed based on the processing tasks, the current state of each processing brush, the multiple groups of processing schemes to be executed, and the range of multiple processable specifications of the latest production line to obtain the multiple groups of processing schemes to be executed and the multiple groups of processing schemes to be executed temporarily reserved include: Based on the processing task, determine whether the processing task meets the range of multiple processable specifications of the latest production line: If the judgment is yes, then based on the multiple groups of processing schemes to be executed and the current state of each processing brush, it is judged whether each group of processing schemes to be executed needs to replace the processing brush, and at least one processing brush that needs to be replaced in the processing schemes to be executed is selectively marked; Based on the two judgment results, the multiple groups of processing solutions to be executed are screened to obtain the multiple groups of processing solutions to be executed that are retained and the multiple groups of processing solutions to be executed that are temporarily retained.

8. The method according to claim 7, characterized in that The generating of the adjustment scheme of the temporarily reserved multiple groups of processing schemes to be executed based on the temporarily reserved multiple groups of processing schemes to be executed includes: If there is at least one marked processing brush in the temporarily reserved processing scheme to be executed, the adjustment scheme corresponding to the temporarily reserved processing scheme to be executed includes enabling a temporary processing line; Based on the information of each marked processing brush, determining the information of the temporary brushes in assembling the temporary processing line; Based on the information of the temporary brush and the temporarily reserved processing scheme to be executed, determining the temporary processing duration corresponding to the temporary brush and the temporary processing position of the temporary brush in the processing route; or, If at least one marked processing brush does not exist in the temporarily reserved processing scheme to be executed, generating a plurality of adjustment schemes corresponding to the temporarily reserved processing scheme to be executed based on the temporarily reserved processing scheme to be executed; Generate multiple groups of adjustment processing solutions based on the multiple groups of adjustment solutions corresponding to the temporarily reserved processing solutions to be executed; Based on the processing task, the current state of each processing brush, the multiple groups of adjustment processing schemes and the range of multiple processable specifications of the latest production line, the multiple groups of adjustment processing schemes are screened to obtain the screened multiple groups of adjustment processing schemes; Based on the screened multiple groups of adjustment processing schemes, determine multiple groups of adjustment schemes corresponding to the temporarily reserved processing schemes to be executed; In order to obtain the adjustment schemes corresponding to the multiple groups of processing schemes to be executed that are temporarily reserved.

9. The method according to claim 8, characterized in that The selection of a group of processing solutions to be executed based on the screened multiple groups of processing solutions to be executed and the selectively generated adjustment schemes of the multiple groups of processing solutions to be executed temporarily reserved comprises: Based on the selectively generated adjustment schemes of the multiple groups of temporarily reserved processing schemes to be executed, an adjusted processing scheme to be executed corresponding to each group of temporarily reserved processing schemes to be executed is obtained; Simulating each group of the screened processing schemes to be executed and each group of the adjusted processing schemes to be executed to obtain simulation data, wherein the simulation data at least includes product simulation specifications, product simulation dimensions, and polishing processing time; A group of processing schemes to be executed is selected based on the simulation data of each group of processing schemes to be executed or the simulation data of each group of adjusted processing schemes to be executed.

10. A polishing management system for semiconductor silicon wafers of multiple sizes, characterized in that: The system includes a communication module, a processing management model and a control device. The communication module is used to realize the communication connection between the system and the polishing equipment components and the management terminal. The processing management model is used to automatically generate a processing plan matching the processing task based on the processing task and the information of multiple processing brushes. The control device includes: one or more processing modules; and a storage module storing program code, and when the program code is executed, the processing module executes the steps of the method as described in any one of claims 1 to 9.

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