Automatic overturning and transporting method and system for silicon wafers

Abstract

The invention provides an automatic silicon wafer overturning and transporting method which comprises the steps that a first transmission platform of a preceding-stage transmission mechanism collects a carrier plate from preceding-stage working equipment, and silicon wafers are borne on the carrier plate; a first lifting unit on the preceding stage transmission mechanism lifts the carrier plate on the first transmission platform to a first preset height, so that a turnover mechanism performs vacuum suction on the silicon wafer on the carrier plate, and then the turnover mechanism performs 180-degree turnover on the sucked silicon wafer; and the transferring mechanism sucks and transfers the overturned silicon wafer to a post-stage working device. According to the automatic overturning system capable of rotating the silicon wafers by 180 degrees, the discharging mechanism of the preceding-stage working equipment and the feeding mechanism of the backward-stage working equipment are removed and replaced with the automatic overturning system capable of rotating the silicon wafers by 180 degrees, the silicon wafers discharged by the preceding-stage working equipment are overturned and then conveyed to the backward-stage working equipment, manual work is replaced with an automatic mode, and the automatic overturning system is more stable, higher in efficiency and capable of saving cost.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer processing, and in particular to a method and system for automatically turning over and transporting silicon wafers. Background Art

[0002] At present, solar cells as a renewable and environmentally friendly energy source have attracted more and more attention. In the processing and production of crystalline silicon solar cells, with the continuous improvement of silicon wafer processing technology, the double-sided processing technology of silicon wafers has become more and more mature. At present, some processes are to process both sides of the silicon wafer step by step, which requires the silicon wafer that has been processed on one side to be turned over and processed again. Most of the existing silicon wafer coating equipment uses a feeding mechanism to collect the silicon wafer with one side coated from the carrier of one device (which can be called device A) into a basket, and then flip it with a mechanical arm or manually flip it and transport it to the feeding mechanism of another device (which can be called device B), and then send the silicon wafer from the basket back to the carrier for coating on the other side.

[0003] The existing technology uses loading and unloading mechanisms and mechanical arms to flip and transport, which is costly. The manual flip and transport method is prone to causing fragments due to human error, and has low efficiency. Summary of the invention

[0004] In order to overcome the above technical defects, the object of the present invention is to provide a method and system for automatic flipping and transportation of silicon wafers with high flipping efficiency and freeing from manual labor.

[0005] The present invention discloses a method for automatically flipping and transporting silicon wafers, comprising the following steps: a first transmission platform of a front-stage transmission mechanism collects a carrier plate from a front-stage working device, the carrier plate carrying silicon wafers; a first lifting unit on the front-stage transmission mechanism lifts the carrier plate on the first transmission platform to a first preset height, so that a flipping mechanism vacuum-absorbs the silicon wafer on the carrier plate, and then the flipping mechanism flips the absorbed silicon wafer by 180 degrees; a transfer mechanism absorbs the flipped silicon wafer and transfers it to a rear-stage working device.

[0006] Preferably, the first lifting unit on the front-stage transmission mechanism lifts the carrier to a first preset height so that the flipping mechanism performs vacuum suction on the silicon wafers on the carrier, and then further comprises: the first lifting unit descends to place the carrier back on the first transmission platform for collecting the next batch of carriers on the front-stage working equipment.

[0007] Preferably, the transfer mechanism sucks the flipped silicon wafer and transfers it to the subsequent working equipment, including: the transfer mechanism moves to one side of the flipping mechanism, and then vacuum sucks the flipped silicon wafer on the flipping mechanism; the vacuum suction function of the flipping mechanism is turned off; the transfer mechanism moves to one side of the subsequent working equipment, and turns off the vacuum suction function, thereby transferring the flipped silicon wafer to the subsequent working equipment.

[0008] Preferably, the transfer mechanism moves to one side of the flipping mechanism, and then vacuum absorbs the flipped silicon wafer on the flipping mechanism, and then further comprises: the second lifting unit of the transfer mechanism is lifted and lowered to be positioned to a second preset height; then the transfer mechanism moves to one side of the subsequent working equipment, and the vacuum absorption function is turned off, thereby transferring the flipped silicon wafer to the subsequent working equipment.

[0009] Preferably, the distance between the second preset height and the flipping mechanism is greater than or equal to the rotation radius of the flipping mechanism.

[0010] Preferably, the transfer mechanism moves to one side of the subsequent working equipment and turns off the vacuum suction function, thereby transferring the flipped silicon wafer to the subsequent working equipment, including: the transfer mechanism moves to one side of the subsequent working equipment and turns off the vacuum suction function, thereby transferring the flipped silicon wafer to the carrier of the subsequent transmission mechanism; the third lifting unit of the subsequent transmission mechanism lowers the carrier onto the second transmission platform, and the second transmission platform transports the carrier to the subsequent working equipment.

[0011] Preferably, the transfer mechanism moves to one side of the subsequent working equipment and turns off the vacuum suction function, thereby transferring the flipped silicon wafer to the carrier of the subsequent transmission mechanism, including: after the transfer mechanism moves to one side of the subsequent working equipment, the sensor is used to identify whether a carrier is provided on the subsequent transmission mechanism, and whether the position of the carrier corresponds to the position of the silicon wafer; if there is a carrier and the position of the carrier corresponds to the position of the silicon wafer, the vacuum suction function is turned off, thereby transferring the flipped silicon wafer to the carrier of the subsequent transmission mechanism.

[0012] The present invention discloses an automatic silicon wafer flipping system, which is applied to the above-mentioned automatic silicon wafer flipping and transportation method, comprising a bracket, a front-stage transmission mechanism, a flipping mechanism, a transfer mechanism and a rear-stage transmission mechanism arranged on the bracket, wherein the front-stage transmission mechanism comprises a first transmission platform and a first lifting unit, and the first lifting unit is lifted and lowered relative to the first transmission platform; the rear-stage transmission mechanism comprises a second transmission platform and a third lifting unit, and the third lifting unit is lifted and lowered relative to the second transmission platform; the flipping mechanism and the transfer mechanism are arranged between the front-stage transmission mechanism and the rear-stage transmission mechanism; the flipping mechanism comprises a flip plate that is rotatably arranged on the bracket and a plurality of suction cups arranged on the flip plate; the first transmission platform of the front-stage transmission mechanism collects the carrier carrying the silicon wafers from the front-stage working equipment; the first lifting unit on the front-stage transmission mechanism lifts the carrier on the first transmission platform to a first preset height, so that the flip mechanism vacuum absorbs the silicon wafers on the carrier, and then the flip mechanism flips the sucked silicon wafers 180 degrees; the transfer mechanism absorbs the flipped silicon wafers and transfers them to the carrier of the rear-stage transmission mechanism; the third lifting unit of the rear-stage transmission mechanism lowers the carrier onto the second transmission platform, and the second transmission platform transports the carrier to the rear-stage working equipment.

[0013] Preferably, the front-stage transmission mechanism includes a first support frame fixedly arranged on the bracket and a conveyor belt rotatably arranged on both sides of the first support frame, and a limit baffle is arranged at one end of the first support frame, wherein the limit baffle is suitable for limiting the moving stroke of the carrier; guide wheels are also arranged on both sides of the first support frame, and the guide wheels are arranged in close contact with the carrier.

[0014] Preferably, the first transmission platform includes two driving wheels rotatably arranged on both sides of the first support frame and a conveyor belt rotatably arranged on the driving wheels, wherein the height of the conveyor belt is higher than the height of the first support frame so that the conveyor belt is suitable for conveying the carrier plate on the first support frame; the first support frame is also fixedly provided with a motor 1, and the motor 1 is transmission connected to one of the driving wheels.

[0015] Compared with the prior art, the above technical solution has the following beneficial effects:

[0016] 1. The present invention utilizes an automatic flipping system to flip the silicon wafer directly from the carrier of the preceding working equipment and transport it to the carrier of the succeeding working equipment, which is more convenient and conducive to improving production capacity, and saves the cost of loading and unloading mechanisms and mechanical arms, and also avoids the fragmentation caused by manual operation, and has strong stability;

[0017] 2. By setting up the bracket, the bracket structure is simple and reliable, and the front-stage transmission mechanism and the rear-stage transmission mechanism can be stably set up, providing a good working environment for the carrier flipping mechanism of the present invention; the carrier is placed on the front-stage transmission mechanism, and the front-stage transmission mechanism drives the carrier to be transported to the bottom of the flipping mechanism. The several suction cups on the flipping mechanism can adsorb the carrier at multiple points, and the rotation of the flipping mechanism drives the suction cups to flip, thereby driving the carrier to rotate smoothly, thereby improving processing efficiency and stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A flow chart of the method for automatic flipping and transporting silicon wafers provided by the present invention;

[0019] Figure 2 A schematic diagram of the silicon wafer automatic flipping and transportation system provided by the present invention;

[0020] Figure 3 A schematic diagram of the structure of the front-stage transmission mechanism provided by the present invention;

[0021] Figure 4 This is a schematic structural diagram of the transfer mechanism provided by the present invention.

[0022] Among them: 1-first transmission platform, 110-first support frame, 120-conveyor belt, 121-driving wheel, 130-limit baffle, 140-guide wheel, 150-motor one; 2-first lifting unit, 3-turning mechanism, 310-turning plate, 320-suction cup, 330-bearing seat, 340-bearing, 350-rotating shaft, 360-pulley one; 4-transfer mechanism, 410-second support frame, 420-slider, 430-guide rail, 440-second lifting unit, 5-bracket, 6-second transmission platform, 7-third lifting unit, 8-motor two, 9-belt two. DETAILED DESCRIPTION

[0023] The advantages of the present invention are further described below in conjunction with the accompanying drawings and specific embodiments.

[0024] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0025] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. The singular forms of "a", "said" and "the" used in this disclosure and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0026] It should be understood that although the terms first, second, third, etc. may be used in the present disclosure to describe various information, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present disclosure, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0027] In the description of the present invention, it is necessary to understand that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0028] In the description of the present invention, unless otherwise specified and limited, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal connection between two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0029] In the following description, the suffixes such as "module", "component" or "unit" used to represent elements are only used to facilitate the description of the present invention, and have no specific meanings. Therefore, "module" and "component" can be used interchangeably.

[0030] See attached Figure 1 The present invention discloses a method for automatically flipping and transporting silicon wafers, comprising a first process of collecting silicon wafers from a front-stage working device, a second process of flipping the silicon wafers 180 degrees, and a third process of transferring the flipped silicon wafers to a back-stage working device, the steps are as follows:

[0031] S100, first process: the first transmission platform 1 of the front-stage transmission mechanism receives a carrier plate carrying a silicon wafer from the front-stage working device;

[0032] S200, second process: the first lifting unit 2 on the front-stage transmission mechanism lifts the carrier on the first transmission platform 1 to a first preset height, so that the flipping mechanism 3 vacuum-absorbs the silicon wafer on the carrier, and then the flipping mechanism 3 flips the absorbed silicon wafer 180 degrees;

[0033] S300, third process: the transfer mechanism 4 absorbs the flipped silicon wafer and transfers it to the subsequent working equipment.

[0034] Furthermore, the first lifting unit 2 on the front-stage transmission mechanism of step S200 lifts the carrier to a first preset height, so that the flipping mechanism 3 vacuum-sucks the silicon wafers on the carrier. Then, the first lifting unit 2 descends and places the carrier back on the first transmission platform 1 for collecting the next batch of carriers on the front-stage working equipment, thereby realizing the self-circulation of the carrier.

[0035] Further, the transfer mechanism 4 in step S300 sucks the flipped silicon wafer and transfers it to the subsequent working equipment, specifically including: the transfer mechanism 4 first moves to one side of the flip mechanism 3, which is the lower wafer position of the flip mechanism 3, that is, the transfer mechanism 4 can smoothly receive the silicon wafer on the flip mechanism 3 from this side (this position). The transfer mechanism 4 sucks the flipped silicon wafer on the flip mechanism 3 by vacuum suction. When all the silicon wafers are sucked by the transfer mechanism 4, the vacuum suction function of the flip mechanism 3 is turned off. It should be noted here that the suction force of the vacuum suction function of the transfer mechanism 4 should be greater than the suction force of the flip mechanism 3, so that the silicon wafer can be sucked from the flip mechanism 3 during the period when the flip mechanism 3 sucks the silicon wafer. After the transfer mechanism 4 sucks the silicon wafer, it moves to one side of the subsequent working equipment, similarly, this side is the upper wafer position of the subsequent working equipment, that is, the transfer mechanism 4 can smoothly transfer the flipped silicon wafer to the subsequent working equipment from this side (this position). After the transfer mechanism 4 transfers all the silicon wafers to the subsequent working equipment, the transfer mechanism 4 turns off the vacuum suction function, thereby sucking and transferring the flipped silicon wafers to the subsequent working equipment.

[0036] Furthermore, the transfer mechanism 4 in the aforementioned step moves to one side of the flip mechanism 3, and then vacuum absorbs the flipped silicon wafer on the flip mechanism 3, and the second lifting unit 440 of the transfer mechanism 4 is also lifted to be positioned to the second preset height, which can be understood as a safe position, at which the various components of the transfer mechanism 4 and the various components of the flip mechanism 3 can be guaranteed not to interfere. Preferably, the distance between the second preset height (safe position) and the flip mechanism 3 is greater than or equal to the rotation radius of the flip mechanism 3, so that the flip mechanism 3 can be avoided. After the transfer mechanism 4 is positioned at the second preset height, the transfer mechanism 4 is moved to one side of the subsequent working equipment, and the vacuum absorption function is turned off, so that the flipped silicon wafer is transferred to the subsequent working equipment.

[0037] The transfer mechanism 4 in the above steps moves to one side of the subsequent working equipment, turns off the vacuum suction function, and transfers the flipped silicon wafer to the subsequent working equipment, and can be further transferred to the subsequent transmission mechanism, and then transmitted to the subsequent working equipment by the subsequent transmission mechanism. Specifically: the transfer mechanism 4 moves to one side of the subsequent working equipment, turns off the vacuum suction function, and transfers the flipped silicon wafer to the carrier of the subsequent transmission mechanism, and then the third lifting unit 7 of the subsequent transmission mechanism lowers the carrier to the second transmission platform 6 of the subsequent transmission mechanism, and the second transmission platform 6 transports the carrier to one side of the subsequent working equipment, and the subsequent working equipment grabs the flipped silicon wafer from the carrier, and then transmits the empty carrier back to the second transmission platform 6, so as to realize the self-circulation of the carrier.

[0038] Furthermore, in order to ensure the accuracy of the silicon wafer transfer process of the transfer mechanism 4, the present invention also provides a sensor sensing function for sensing the position of the empty carrier plate that receives the silicon wafer. Only when there is a carrier plate on the subsequent transmission mechanism and the position of the carrier plate is accurate, the flipped silicon wafer is released to the subsequent transmission mechanism. Specifically: After the transfer mechanism 4 moves to one side of the subsequent working equipment, the sensor identifies whether there is a carrier plate on the subsequent transmission mechanism, and checks whether the position of the carrier plate corresponds to the position of the silicon wafer; if there is a carrier plate and the position of the carrier plate corresponds to the position of the silicon wafer, the vacuum suction function is turned off, so that the flipped silicon wafer is transferred to the carrier plate of the subsequent transmission mechanism.

[0039] The present invention removes the unloading mechanism of the preceding working equipment and the loading mechanism of the succeeding working equipment of the prior art, and replaces them with the automatic flipping system of the present invention that can rotate the silicon wafer 180°. The silicon wafer unloaded by the preceding working equipment is flipped and then transferred to the succeeding working equipment, thereby replacing manual labor with an automated method, which is more stable, more efficient, and saves costs.

[0040] See attached Figure 2The present invention also discloses a silicon wafer automatic flipping system, which is applied to the above-mentioned silicon wafer automatic flipping and transportation method, and includes a bracket 5, a front-stage transmission mechanism arranged on the bracket 5, a flipping mechanism 3, a transfer mechanism 4 and a rear-stage transmission mechanism. The front-stage transmission mechanism includes a first transmission platform 1 and a first lifting unit 2, and the first lifting unit 2 is lifted relative to the first transmission platform 1; the rear-stage transmission mechanism includes a second transmission platform 6 and a third lifting unit 7, and the third lifting unit 7 is lifted relative to the second transmission platform 6. The flipping mechanism 3 and the transfer mechanism 4 are arranged between the front-stage transmission mechanism and the rear-stage transmission mechanism. The flipping mechanism 3 includes a flipping plate rotatably arranged on the bracket 5 and a plurality of suction cups arranged on the flipping plate. The bracket 5 has a simple and reliable structure, and can stably set up the front-stage transmission mechanism and the rear-stage transmission mechanism, providing a good working environment for the carrier flipping mechanism of the present invention. The carrier is placed on the front-stage transmission mechanism, and the front-stage transmission mechanism drives the carrier to be transported to the bottom of the flipping mechanism 3. The plurality of suction cups on the flipping mechanism 3 can adsorb the carrier at multiple points. The flipping mechanism 3 rotates to drive the suction cup to flip, thereby driving the carrier to rotate smoothly, thereby improving the processing efficiency and stability.

[0041] The silicon wafer automatic flipping system is used to realize the first process of collecting silicon wafers from the front-stage working equipment, the second process of flipping the silicon wafers 180 degrees, and the third process of transferring the flipped silicon wafers to the back-stage working equipment.

[0042] In the first process, the first transport platform 1 of the front-stage transport mechanism collects the carrier board carrying the silicon wafer from the front-stage working equipment.

[0043] In the second process, the first lifting unit 2 on the front-stage transmission mechanism raises the carrier on the first transmission platform 1 to a first preset height, so that the flip mechanism 3 vacuum-absorbs the silicon wafers on the carrier. Then the first lifting unit 2 descends and puts the carrier back on the first transmission platform 1 to collect the carriers on the next batch of front-stage working equipment. Then the flip mechanism 3 flips the absorbed silicon wafers 180 degrees.

[0044] The transfer mechanism 4 moves to one side of the flip mechanism 3, and then vacuum absorbs the flipped silicon wafer on the flip mechanism 3. Then the second lifting unit 440 of the transfer mechanism 4 is lifted to be positioned at a second preset height, and the distance between the second preset height and the flip mechanism 3 is greater than or equal to the rotation radius of the flip mechanism 3. Then the vacuum absorption function of the flip mechanism 3 is turned off.

[0045] In the third process, the transfer mechanism 4 moves to one side of the subsequent working equipment, and uses the sensor to identify whether there is a carrier on the subsequent transmission mechanism, and check whether the position of the carrier corresponds to the position of the silicon wafer; if there is a carrier and the position of the carrier corresponds to the position of the silicon wafer, the vacuum suction function is turned off, so that the flipped silicon wafer is transferred to the carrier of the subsequent transmission mechanism. The third lifting unit 7 of the subsequent transmission mechanism lowers the carrier onto the second transmission platform 6, and the second transmission platform 6 transports the carrier to the subsequent working equipment.

[0046] For details, see the attached Figure 3-4 The front-stage transmission mechanism includes a first support frame 110 fixedly arranged on the bracket 5 and a conveyor belt 120 rotatably arranged on both sides of the first support frame 110. The first support frame 110 can make the conveyor belt 120 rotate smoothly. A limit baffle 130 is arranged at one end of the first support frame 110, wherein the limit baffle 130 is suitable for limiting the moving stroke of the carrier.

[0047] Guide wheels 140 are also provided on both sides of the first support frame 110. The guide wheels 140 are arranged in close contact with the carrier. The guide wheels 140 are arranged on both sides of the first support frame 110 and can fit the carrier, which can make the carrier slide more smoothly during transportation and improve the efficiency of transporting the carrier.

[0048] The first transmission platform includes two driving wheels 121 rotatably disposed on both sides of the first support frame 110 and a conveyor belt 120 rotatably disposed on the driving wheels 121, wherein the height of the conveyor belt 120 is higher than the height of the first support frame 110, so that the conveyor belt 120 is suitable for conveying the carrier on the first support frame 110. The driving wheels 121 rotate to drive the conveyor belt 120 to rotate, and the conveyor belt 120 rotates to drive the carrier to slide smoothly and then be conveyed to the bottom of the flip mechanism.

[0049] The first support frame 110 is also fixedly provided with a motor 150, and the motor 150 is drivingly connected to one of the driving wheels 121, and the output shaft of the motor 150 is connected to the driving wheel 121 to drive the driving wheel 121 to rotate, thereby rotating the conveyor belt 120.

[0050] The transfer mechanism includes a second support frame 410 fixedly mounted on the bracket 5 and a slider 420 slidably mounted on the second support frame 410, wherein the slider 420 is provided with a plurality of suction cups 320 to adsorb the carrier. The second support frame 410 can stably mount the slider 420, and the slider 420 can drive the suction cups 320 to slide to the position of adsorbing the carrier to adsorb the carrier.

[0051] A guide rail 430 is fixedly provided on the bracket 5 , and the slider 420 is slidably provided on the guide rail 430 . The guide rail 430 enables the slider 420 to slide smoothly, thereby driving the suction cup 320 to slide.

[0052] The flip part further includes a bearing 340 seat 330 fixedly arranged on the bracket 5, a bearing 340 rotatably arranged in the bearing 340 seat 330, and a rotating shaft 350 fixedly connected to the inner ring of the bearing 340, and the outer ring of the bearing 340 is fixedly connected to the bearing 340 seat 330, wherein the rotating shaft 350 is fixedly connected to the flip plate 310. The bearing 340 seat 330 can stably mount the bearing 340, and the bearing 340 can make the rotating shaft 350 rotate more smoothly, and when the rotating shaft 350 rotates, it drives the flip plate 310 to rotate.

[0053] A pulley 1 360 is fixedly connected to one of the rotating shafts 350, and a motor 2 8 is also fixedly arranged on the bracket 5. A pulley 2 9 is fixedly arranged on the output shaft of the motor 2 8, wherein the pulley 1 360 and the pulley 2 9 are connected via a belt transmission. The output shaft of the motor 2 8 drives the pulley 2 9 to rotate, and the pulley 2 9 drives the pulley 1 360 to rotate through the belt, thereby driving the rotating shaft 350 to rotate.

[0054] It should be noted that the embodiments of the present invention have better practicability and do not impose any form of limitation on the present invention. Any technician familiar with the field may use the technical content disclosed above to change or modify it into an equivalent effective embodiment. However, any modification or equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A method for automatically flipping and transporting silicon wafers, characterized in that: The steps include: The first transmission platform of the front-stage transmission mechanism receives a carrier plate from the front-stage working device, wherein the carrier plate carries a silicon wafer; The first lifting unit on the front-stage transmission mechanism lifts the carrier on the first transmission platform to a first preset height, so that the flipping mechanism vacuum-absorbs the silicon wafer on the carrier, and then the flipping mechanism flips the absorbed silicon wafer 180 degrees; The transfer mechanism absorbs the flipped silicon wafer and transfers it to the subsequent working equipment.

2. The method for automatically flipping and transporting silicon wafers according to claim 1, characterized in that: The first lifting unit on the front-stage transmission mechanism lifts the carrier to a first preset height so that the flip mechanism vacuum-suctions the silicon wafer on the carrier, and further comprises: The first lifting unit descends and places the carrier plates back onto the first transmission platform for collecting the next batch of carrier plates on the previous working equipment.

3. The method for automatically flipping and transporting silicon wafers according to claim 1, characterized in that: The transfer mechanism sucks the flipped silicon wafer and transfers it to the subsequent working equipment, including: The transfer mechanism moves to one side of the flipping mechanism, and then vacuum absorbs the flipped silicon wafer on the flipping mechanism; The vacuum suction function of the flipping mechanism is turned off; The transfer mechanism moves to one side of the subsequent working equipment and turns off the vacuum suction function, thereby transferring the flipped silicon wafer to the subsequent working equipment.

4. The method for automatically flipping and transporting silicon wafers according to claim 3, characterized in that: The transfer mechanism moves to one side of the flip mechanism, and then vacuum absorbs the flipped silicon wafer on the flip mechanism, and further comprises: The second lifting unit of the transfer mechanism is lifted and lowered to be positioned at a second preset height; Then the transfer mechanism moves to one side of the subsequent working equipment, and turns off the vacuum suction function, thereby transferring the flipped silicon wafer to the subsequent working equipment.

5. The method for automatically turning over and transporting silicon wafers according to claim 4, characterized in that: The distance between the second preset height and the flipping mechanism is greater than or equal to the rotation radius of the flipping mechanism.

6. The method for automatically turning over and transporting silicon wafers according to claim 3 or 4, characterized in that: The transfer mechanism is moved to one side of the subsequent working equipment, and the vacuum suction function is turned off, so as to transfer the flipped silicon wafer to the subsequent working equipment, including: The transfer mechanism moves to one side of the subsequent working device and turns off the vacuum suction function, thereby transferring the flipped silicon wafer to the carrier of the subsequent transmission mechanism; The third lifting unit of the subsequent transmission mechanism lowers the carrier onto the second transmission platform, and the second transmission platform transports the carrier to the subsequent working equipment.

7. The method for automatically turning over and transporting silicon wafers according to claim 6, characterized in that: The transfer mechanism moves to one side of the subsequent working equipment, turns off the vacuum suction function, and transfers the flipped silicon wafer to the carrier of the subsequent transmission mechanism, including: After the transfer mechanism moves to one side of the subsequent working equipment, the sensor is used to identify whether a carrier is provided on the subsequent transmission mechanism, and to check whether the position of the carrier corresponds to the position of the silicon wafer; If there is a carrier and the position of the carrier corresponds to the position of the silicon wafer, the vacuum suction function is turned off, so that the flipped silicon wafer is transferred to the carrier of the subsequent transmission mechanism.

8. A silicon wafer automatic flipping system, characterized in that: The method for automatically flipping and transporting silicon wafers applied to any one of claims 1 to 7 above comprises a support, a front-stage transmission mechanism, a flipping mechanism, a transfer mechanism and a rear-stage transmission mechanism arranged on the support, the front-stage transmission mechanism comprises a first transmission platform and a first lifting unit, the first lifting unit is lifted relative to the first transmission platform; the rear-stage transmission mechanism comprises a second transmission platform and a third lifting unit, the third lifting unit is lifted relative to the second transmission platform; The flipping mechanism and the transfer mechanism are arranged between the front-stage transmission mechanism and the rear-stage transmission mechanism; The flipping mechanism comprises a flipping plate rotatably arranged on the bracket and a plurality of suction cups arranged on the flipping plate; The first transmission platform of the front-stage transmission mechanism collects the carrier board carrying the silicon wafer from the front-stage working equipment; The first lifting unit on the front-stage transmission mechanism lifts the carrier on the first transmission platform to a first preset height, so that the flipping mechanism vacuum-absorbs the silicon wafer on the carrier, and then the flipping mechanism flips the absorbed silicon wafer 180 degrees; The transfer mechanism sucks the flipped silicon wafer and transfers it to the carrier of the subsequent transmission mechanism; the third lifting unit of the subsequent transmission mechanism lowers the carrier onto the second transmission platform, and the second transmission platform transports the carrier to the subsequent working equipment.

9. The automatic silicon wafer flipping system according to claim 8, characterized in that: The front-stage transmission mechanism comprises a first support frame fixedly arranged on the bracket and a conveyor belt rotatably arranged on both sides of the first support frame, and a limit baffle is arranged at one end of the first support frame, wherein the limit baffle is suitable for limiting the moving stroke of the carrier plate; Guide wheels are also arranged on both sides of the first support frame, and the guide wheels are arranged in close contact with the carrier plate.

10. The automatic silicon wafer flipping system according to claim 8, characterized in that: The first transmission platform includes two driving wheels rotatably arranged on both sides of the first support frame and a conveyor belt rotatably arranged on the driving wheels, wherein: The height of the conveyor belt is higher than that of the first support frame, so that the conveyor belt is suitable for conveying the carrier plate on the first support frame; The first support frame is also fixedly provided with a motor 1, and the motor 1 is drivingly connected to one of the driving wheels.

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