Material defect detection method and device and storage medium

Abstract

The invention provides a material defect detection method and device and a storage medium. The method comprises the following steps: displaying a defect image to be rechecked on a rechecking interface; when it is monitored that the multi-Pcs scrap button is triggered, displaying a multi-Pcs judgment changing page; wherein the Pcs outline panorama of the to-be-detected material is displayed in the multi-Pcs judgment changing page, and the outline of the Pcs to which the current defect image belongs is selected by default; when it is monitored that a confirmation button of the multi-Pcs judgment changing page is triggered, it is confirmed that the Pcs detection results of all the selected contours are scrapped. According to the technical scheme provided by the invention, when a plurality of Pcs need to be scrapped, the Pcs contour panorama of the to-be-detected material is displayed on the multi-Pcs judgment changing page, all Pcs which really need to be scrapped are scrapped quickly and accurately, the probability of false scrapping and missing scrapping is greatly reduced, and the detection efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of defect detection, and in particular to a material defect detection method, device and storage medium. Background Art

[0002] Printed Circuit Board (PCB), also often referred to as printed circuit board, is an important electronic component that provides electrical connection and physical support for electronic components. Visual inspection technology has been widely used in the yield inspection of circuit boards to detect defects on circuit boards and output images containing defects. The defect review system is used to review defective images to determine the scrapped individual units (PCs) on the material or to determine the scrapped entire strip.

[0003] However, the inventors found that in the application scenario of re-judging PCB defects, the defective images are bound one-to-one to the PCs, and some defects may cause multiple PCs to be scrapped. The defective images are bound one-to-one to the PCs, which may lead to missed scrapping or erroneous scrapping. In view of this, a material defect detection method is urgently needed. Summary of the invention

[0004] In view of this, the present application provides a material defect detection method, device and storage medium to solve the technical problem of missed or wrong scrapping in PCB detection in the prior art.

[0005] In a first aspect, the present application provides a material defect detection method, the method comprising:

[0006] Display defect images to be re-inspected on the re-inspection interface;

[0007] When the multi-PCS scrap button is triggered, the multi-PCS re-judgment page is displayed; the multi-PCS re-judgment page displays a panoramic view of the PCS contour of the material to be tested, and the contour of the PCS to which the current defect image belongs is selected by default;

[0008] When the confirmation button of the multi-PCS re-judgment page is monitored to be triggered, it is confirmed that the detection results of all PCs of the selected contours are scrapped.

[0009] Preferably, before displaying the defect image to be reviewed on the review interface, the process includes:

[0010] Obtain a set of defect images to be re-inspected, and determine whether the defect image is a boundary type according to the coordinate information; wherein the defect image carries the coordinate information and the Pcs information to which it belongs;

[0011] Based on the first priority of the boundary type and the second priority of the corresponding Pcs sorting, the defect images in the defect image set to be reviewed are sorted to be displayed on the review interface.

[0012] Preferably, all defective images corresponding to PCs whose inspection results have been confirmed to be scrapped are removed from the sorted image sequence and are no longer displayed on the re-inspection interface.

[0013] Preferably, monitoring the additional selection event triggered by the multi-Pcs re-judgment page;

[0014] Based on the type of the selected event and the contour of the PCS to which the current defect image belongs, the target PCS contour is selected.

[0015] Preferably, the types of the additional selection events include: up, down, left, right, upper left, upper right, lower left, and lower right;

[0016] The shortcut keys triggered by each type of the additional selection event are: 2, 8, 4, 6, 1, 3, 7, 9.

[0017] Preferably, a search box is provided on the multi-Pcs re-judgment page, the Pcs number is searched according to the horizontal coordinate and the vertical coordinate of the input Pcs, and the contour corresponding to the searched Pcs number is set to a selected state.

[0018] Preferably, on the multi-Pcs re-judgment page, the outlines of all Pcs whose detection results are scrapped are marked.

[0019] In a second aspect, the present application provides a material defect detection device, the device comprising:

[0020] A display module, used to display the defect image to be re-inspected on the re-inspection interface;

[0021] The multi-selection module is used to display the multi-PCS re-judgment page when the multi-PCS scrap button is triggered; the multi-PCS re-judgment page displays a panoramic view of the PCS contour of the material to be tested, and the contour of the PCS to which the current defect image belongs is selected by default;

[0022] The scrapping module is used to confirm that the detection results of all PCs of the selected contours are scrapped after monitoring the triggering of the confirmation button of the multi-PCs re-judgment page.

[0023] In a third aspect, the present application provides a computer device, comprising: a memory and a processor, the memory and the processor being communicatively connected to each other, the memory storing computer instructions, and the processor implementing the material defect detection method described in the first aspect by executing the computer instructions.

[0024] In a fourth aspect, the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer instructions, and when the computer instructions are executed by a processor, the material defect detection method described in the first aspect is implemented.

[0025] The material defect detection method, device and storage medium provided in this application have at least the following beneficial effects:

[0026] The technical solution provided by the present application can display a panoramic view of the PCS profile of the material to be inspected on the multi-PCS re-judgment page after monitoring the triggering of the multi-PCS scrap button, which can fully present all PCS situations that may be affected by the current defective image, so that the re-inspection personnel can clearly see the various PCs related to the current defect, so that after accurate judgment, all PCs that really need to be scrapped can be quickly and accurately scrapped, greatly reducing the probability of mis-scrapping and missed scrapping. It ensures that defective products can be completely screened out and improves the accuracy of product quality control. The multi-PCS scrap button and the corresponding multi-PCS re-judgment page are set in the re-inspection system, and the operation logic is clear. When it is found that there may be a multi-PCS scrap situation, you only need to trigger the multi-PCS scrap button to enter the special re-judgment page for further processing, which simplifies the operation steps for handling complex scrap situations, so that the re-inspection personnel can complete the re-inspection work more efficiently, saving time and cost, and improving the detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the specific implementation methods or the prior art descriptions. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings without creative work. It should be noted that the drawings described below are schematic and should not be understood as any limitation to the present application. In the drawings:

[0028] Figure 1 A schematic diagram showing a material defect detection method in one embodiment of the present application is shown;

[0029] Figure 2 A schematic diagram showing a defect and Pcs location;

[0030] Figure 3 A partial schematic diagram of a re-examination interface in one embodiment of the present application is shown;

[0031] Figure 4 A schematic diagram of a multi-Pcs re-judgment page in one embodiment of the present application is shown;

[0032] Figure 5 Another schematic diagram of a multi-PCS re-judgment page in one embodiment of the present application is shown;

[0033] Figure 6 Another schematic diagram of a multi-PCS re-judgment page in one embodiment of the present application is shown;

[0034] Figure 7 A schematic diagram of a material defect detection device in one embodiment of the present application is shown;

[0035] Figure 8 A schematic diagram of a computer device in one embodiment of the present application is shown. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0037] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0038] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, it can also be the internal connection of two components, it can be a wireless connection, or it can be a wired connection. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0039] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0040] Although the processes described below include multiple operations that appear in a specific order, it should be clearly understood that these processes may also include more or fewer operations, and these operations may be performed sequentially or in parallel.

[0041] Example 1

[0042] The material defect detection method provided in this application can be applied to the application scenario of PCB visual defect detection. In this scenario, multiple units (Pcs) are printed on the entire PCB material. The defects on the entire PCB material are identified by visual inspection technology, and the corresponding Pcs are determined to be scrapped by binding the defect image to the Pcs. However, some defects may cause multiple Pcs to be scrapped, such as Figure 2 As shown in the figure, if the defect is at position A, Pcs2 and Pcs4 will be scrapped; if the defect is at position B, Pcs1, Pcs2, Pcs3 and Pcs4 will be scrapped; if the defect is at position C, Pcs1 and Pcs2 will be scrapped. In the existing defect re-inspection system, the defect image and Pcs are bound one-to-one, which will lead to the omission or wrong scrapping of the corresponding Pcs. The defect re-inspection system needs to add the function of scrapping multiple Pcs with a single defect image.

[0043] In view of this, a defect detection method based on the fracture zone is urgently needed to solve the problems of missed detection and false detection.

[0044] See also Figure 1 A material defect detection method provided in one embodiment of the present application may include the following steps.

[0045] S101. Displaying defect images to be re-inspected on a re-inspection interface.

[0046] Specifically, this workstation is a re-inspection system. The defect image is the output of the first inspection system. The re-inspection system re-inspects the defect image to determine the specific scrapped PCs on the PCB.

[0047] S102. When the triggering of the multiple Pcs scrap button is detected, the multiple Pcs re-judgment page is displayed; wherein the multiple Pcs re-judgment page displays a panoramic view of the Pcs contour of the material to be inspected, and the contour of the Pcs to which the current defect image belongs is selected by default.

[0048] Specifically, when the displayed Figure 2 When any type of defect image is found in the positions A, B, and C shown in the figure, the re-inspector presses the multi-PCS scrap button and the multi-PCS scrap button trigger can be monitored. Figure 3 The displayed multi-PCS re-judgment page can be found in Figure 4 As shown. The PCS outline panorama of the material is a panorama with only the PCS outline. Figure 4The default selected Pcs contour of the current defect image is the Pcs contour of "X:4,Y:2".

[0049] S103: after monitoring the triggering of the confirmation button of the multi-PCS re-judgment page, confirm that the detection results of all PCs of the selected contours are scrapped.

[0050] Specifically, only after the re-inspection personnel confirm, the corresponding PCs to be scrapped will be manually selected, such as Figure 5 The outline of the PCs of "X:5,Y:2" is shown. After selection, the reviewer presses the confirmation button. Figure 5 As shown, the confirmation button is triggered, and all selected PCs are confirmed to be scrapped.

[0051] In this embodiment, after monitoring the triggering of the multi-PCS scrap button, the PCS profile panorama of the material to be inspected can be displayed on the multi-PCS re-judgment page, which can fully present all PCS situations that may be affected by the current defect image, so that the re-inspection personnel can clearly see the various PCs related to the current defect, so that after accurate judgment, all PCs that really need to be scrapped can be quickly and accurately scrapped, greatly reducing the probability of mis-scrapping and missed scrapping. It ensures that defective products can be completely screened out and improves the accuracy of product quality control. The multi-PCS scrap button and the corresponding multi-PCS re-judgment page are set in the re-inspection system, and the operation logic is clear. When it is found that there may be a multi-PCS scrap situation, it only needs to trigger the multi-PCS scrap button to enter the special re-judgment page for further processing, which simplifies the operation steps for handling complex scrap situations, so that the re-inspection personnel can complete the re-inspection work more efficiently, saving time and cost, and improving the detection efficiency.

[0052] In this embodiment, the multi-PCS re-judgment page displays a panoramic view of the PCS profile of the material to be inspected. Compared with the traditional system that only relies on a single defect image and PCS binding information, the re-inspection personnel can fully understand the relative position of the defect and the relationship between each PCS from the perspective of the panoramic view, which makes it easier to make accurate judgments. Especially in the face of complex situations where multiple PCS may be affected by the same defect, the advantages of visualization are more prominent, which can effectively assist the re-inspection personnel to quickly and accurately complete the judgment of the PCS scrapping situation. Through the multi-PCS re-judgment page and related operation functions, it is possible to flexibly respond to the multi-PCS scrapping caused by defects in different locations and different impact ranges, so that the entire defect re-inspection system can operate effectively when facing various complex defect problems that may occur in actual production, and improve the system's adaptability to diversified production situations. The multi-PCS scrapping processing architecture and related page display and operation logic built in this embodiment have laid a good foundation for further expansion of system functions in the future. For example, we can further develop statistical analysis functions for multiple PCs scrapping based on this, so as to better understand the frequency and regularity of multiple PCs scrapping caused by different defect types, or add intelligent prompt functions to assist re-inspection personnel to make accurate judgments more quickly. Its flexible design mode is conducive to the continuous functional upgrade and improvement of the system as production needs change.

[0053] Preferably, before displaying the defect image to be reviewed on the review interface, the process includes:

[0054] Obtain a set of defect images to be re-inspected, and determine whether the defect image is a boundary type according to the coordinate information; wherein the defect image carries the coordinate information and the Pcs information to which it belongs;

[0055] Based on the first priority of the boundary type and the second priority of the corresponding Pcs sorting, the defect images in the defect image set to be reviewed are sorted to be displayed on the review interface.

[0056] Preferably, all defective images corresponding to PCs whose inspection results have been confirmed to be scrapped are removed from the sorted image sequence and are no longer displayed on the re-inspection interface.

[0057] In this embodiment, in simple terms, it is first determined whether the defect is a boundary type according to the position of the defect image. The boundary type includes: Figure 2 The three situations shown are shown. The first priority is to display the defect images belonging to the boundary type first, and then display the defect images on the Pcs. The Pcs sorting is the second priority, that is, display in the order of the Pcs sorting, for example, after displaying all the defect images of the first Pcs, the defect images of the next Pcs are displayed.

[0058] In this embodiment, by determining whether the defective image is a boundary type according to the coordinate information, those defective images that require multiple PCs to be scrapped can be accurately identified. The corresponding PCs can be scrapped based on these defective images first, and the defective images corresponding to the scrapped PCs are removed and no longer displayed, avoiding missed inspections and eliminating the need for repeated re-inspections, which greatly improves the efficiency of re-inspection.

[0059] Preferably, monitoring the additional selection event triggered by the multi-Pcs re-judgment page;

[0060] Based on the type of the selected event and the contour of the PCS to which the current defect image belongs, the target PCS contour is selected.

[0061] Preferably, the types of the additional selection events include: up, down, left, right, upper left, upper right, lower left, and lower right;

[0062] The shortcut keys triggered by each type of the additional selection event are: 2, 8, 4, 6, 1, 3, 7, 9.

[0063] In this embodiment, a panoramic view of the PCS contours of the material to be inspected is displayed in the multi-PCS re-judgment page, and the re-inspection personnel quickly select the corresponding PCS contour to be scrapped in the panoramic view of the PCS contours according to the current defect image and the default selected contour.

[0064] Preferably, the up, down, left, and right buttons can be used to quickly select the corresponding PCS contour that needs to be scrapped. The PCS contour that needs to be scrapped can also be quickly selected by the mouse.

[0065] In this embodiment, the additional selection event triggered by the multi-PCS re-judgment page is monitored to ensure that the system can promptly perceive the operation intention of the re-inspection personnel. Once an additional selection event occurs, it can respond quickly based on established rules (combined with event type and PCS profile, etc.) to select the corresponding target PCS profile. This real-time response mechanism greatly shortens the time interval from user operation to system execution of corresponding actions, making the entire data processing process smoother and reducing the time wasted due to waiting for system response, thereby effectively improving the data processing efficiency in the multi-PCS re-judgment scenario and further improving the defect detection efficiency.

[0066] Preferably, a search box is provided on the multi-Pcs re-judgment page, the Pcs number is searched according to the horizontal coordinate and the vertical coordinate of the input Pcs, and the contour corresponding to the searched Pcs number is set to a selected state.

[0067] In this embodiment, see Figure 3As shown in the figure, a special search box is set on the multi-PCS re-judgment page, and the re-inspection personnel can enter the horizontal and vertical coordinate information of the PCS in the search box. The system will search and match in the relevant data sets based on the input coordinate data to find the corresponding PCS number. Once the matching PCS number is searched, the system will automatically set the contour corresponding to the PCS number to the selected state, thereby highlighting the PCS on the page so that the user can perform subsequent related operations such as scrapping. By entering specific horizontal and vertical coordinates to search for the PCS number, high-precision positioning of specific PCS can be achieved. In the scenario where there are a large number of PCS and a specific PCS needs to be quickly found for re-judgment, this coordinate-based search method can accurately lock the target PCS, avoiding the trouble of blindly searching among many PCS, greatly improving the efficiency and accuracy of locating the target PCS, and further improving the efficiency of defect detection.

[0068] Preferably, on the multi-Pcs re-judgment page, the outlines of all Pcs whose detection results are scrapped are marked.

[0069] Specifically, see, for example Figure 6 As shown, "X:4, Y:2", "X:5, Y:2" are the scrapped PCs contours, "X:3, Y:5", "X:4, Y:5", "X:3, Y:6", "X:4, Y:7" are the selected PCs contours. In this embodiment, such marking operation is performed on the multi-PCs re-judgment page, the main purpose of which is to be able to intuitively and clearly distinguish on the page those PCs that are judged to be scrapped after inspection. This helps the relevant re-inspection personnel to quickly focus on and distinguish these scrapped PCs when viewing the page, which facilitates the subsequent corresponding processing arrangements for the scrapped PCs, and further improves the efficiency of defect detection.

[0070] Example 2

[0071] This embodiment provides a material defect detection device, which is applied to the material defect detection method provided in the above embodiment 1 for illustration. Figure 7 As shown, a material defect detection device provided in one embodiment of the present application may include the following multiple modules.

[0072] A display module, used to display the defect image to be re-inspected on the re-inspection interface;

[0073] The multi-selection module is used to display the multi-PCS re-judgment page when the multi-PCS scrap button is triggered; the multi-PCS re-judgment page displays a panoramic view of the PCS contour of the material to be tested, and the contour of the PCS to which the current defect image belongs is selected by default;

[0074] The scrapping module is used to confirm that the detection results of all PCs of the selected contours are scrapped after monitoring the triggering of the confirmation button of the multi-PCs re-judgment page.

[0075] The material defect detection device provided in the embodiment of the present application can be applied to the material defect detection method provided in the above-mentioned embodiment 1. For relevant details, refer to the above-mentioned method embodiment. The implementation principle and technical effect are similar and will not be repeated here.

[0076] It should be noted that: when the material defect detection device provided in the embodiment of the present application performs material defect detection, only the division of the above-mentioned functional modules / functional units is used as an example. In actual applications, the above-mentioned functions can be assigned to different functional modules / functional units as needed, that is, the internal structure of the material defect detection device is divided into different functional modules / functional units to complete all or part of the functions described above. In addition, the implementation method of the material defect detection method provided in the above-mentioned method embodiment 1 and the implementation method of the material defect detection device provided in this embodiment 2 belong to the same concept. The specific implementation process of the material defect detection device provided in this embodiment 2 is detailed in the above-mentioned method embodiment 1, and will not be repeated here.

[0077] Example 3

[0078] See also Figure 8 As shown, one embodiment of the present application also provides a computer device, which can be a computer device such as a desktop computer, a laptop computer, a handheld computer, and a cloud server. The computer device can include, but is not limited to, a processor and a memory. The processor and the memory are connected via a bus or other means.

[0079] The processor may be a central processing unit (CPU). The processor may also be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, graphics processing units (GPU), embedded neural network processors (NPU) or other dedicated deep learning coprocessors, discrete gate or transistor logic devices, discrete hardware components, or a combination of the above chips.

[0080] As a non-transitory computer-readable storage medium, the memory can be used to store non-transitory software programs, non-transitory computer executable programs and modules, such as program instructions / modules corresponding to the methods in the above-mentioned embodiments of the present application. The processor executes various functional applications and data processing of the processor by running the non-transitory software programs, instructions and modules stored in the memory, that is, implementing the methods in the above-mentioned method embodiments.

[0081] The memory may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created by the processor, etc. In addition, the memory may include a high-speed random access memory, and may also include a non-transitory memory, such as at least one disk storage device, a flash memory device, or other non-transitory solid-state storage device. In some embodiments, the memory may optionally include a memory remotely disposed relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0082] One embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium is used to store a computer program. When the computer program is executed by a processor, the method in the above method embodiment is implemented.

[0083] Those skilled in the art can understand that the implementation of all or part of the processes in the above-mentioned implementation methods of the present application can be completed by instructing the relevant hardware through a computer program, and the program can be stored in a computer-readable storage medium, and when the program is executed, it can include the processes of the implementation methods of the above-mentioned methods. Among them, the storage medium can be a disk, an optical disk, a read-only memory (ROM), a random access memory (RAM), a flash memory, a hard disk (HDD) or a solid-state drive (SSD), etc.; the storage medium can also include a combination of the above-mentioned types of memory.

[0084] The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0085] Although the embodiments of the present application are described in conjunction with the accompanying drawings, they cannot be understood as limiting the scope of the patent application. It should be pointed out that for ordinary technicians in this field, other different forms of changes or modifications can be made on the basis of the above description without departing from the concept of the present application. It is not necessary and impossible to list all the embodiments here. The obvious changes or modifications derived from this are still within the scope of protection created by the present application. Therefore, the scope of protection of the patent application shall be based on the attached claims.

Claims

1. A material defect detection method, characterized in that: The method comprises: Display defect images to be re-inspected on the re-inspection interface; When the multi-PCS scrap button is triggered, the multi-PCS re-judgment page is displayed; the multi-PCS re-judgment page displays a panoramic view of the PCS contour of the material to be tested, and the contour of the PCS to which the current defect image belongs is selected by default; When the confirmation button of the multi-PCS re-judgment page is monitored to be triggered, it is confirmed that the detection results of all PCs of the selected contours are scrapped.

2. The material defect detection method according to claim 1, characterized in that: Before displaying the defect image to be re-inspected on the re-inspection interface, the method includes: Obtain a set of defect images to be re-inspected, and determine whether the defect image is a boundary type according to the coordinate information; wherein the defect image carries the coordinate information and the Pcs information to which it belongs; Based on the first priority of the boundary type and the second priority of the corresponding Pcs sorting, the defect images in the defect image set to be reviewed are sorted to be displayed on the review interface.

3. The material defect detection method according to claim 2, characterized in that: Also includes: All defective images corresponding to the PCs whose inspection results have been confirmed to be scrapped are removed from the sorted image sequence and are no longer displayed in the re-inspection interface.

4. The material defect detection method according to claim 3, characterized in that: Also includes: Listening to the additional selection event triggered by the multi-Pcs re-judgment page; Based on the type of the selected event and the contour of the PCS to which the current defect image belongs, the target PCS contour is selected.

5. The material defect detection method according to claim 4, characterized in that: The types of the co-selected events include: up, down, left, right, upper left, upper right, lower left, and lower right; The shortcut keys triggered by each type of the additional selection event are: 2, 8, 4, 6, 1, 3, 7, 9.

6. The material defect detection method according to claim 5, characterized in that: Also includes: A search box is provided on the multi-Pcs re-judgment page, and the Pcs number is searched according to the horizontal coordinate and the vertical coordinate of the input Pcs, and the contour corresponding to the searched Pcs number is set to a selected state.

7. The material defect detection method according to claim 6, characterized in that: Also includes: On the multi-PCs re-judgment page, the outlines of all PCs whose detection results are scrapped are marked.

8. A material defect detection device, characterized in that: The device comprises: A display module, used to display the defect image to be re-inspected on the re-inspection interface; The multi-selection module is used to display the multi-PCS re-judgment page when the multi-PCS scrap button is triggered; the multi-PCS re-judgment page displays a panoramic view of the PCS contour of the material to be tested, and the contour of the PCS to which the current defect image belongs is selected by default; The scrapping module is used to confirm that the detection results of all PCs of the selected contours are scrapped after monitoring the triggering of the confirmation button of the multi-PCs re-judgment page.

9. A computer device, characterized in that: include: A memory and a processor, wherein the memory and the processor are communicatively connected to each other, the memory stores computer instructions, and the processor implements the material defect detection method according to any one of claims 1 to 7 by executing the computer instructions.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and when the computer instructions are executed by a processor, the material defect detection method according to any one of claims 1 to 7 is implemented.

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