Wafer testing system

Abstract

The invention discloses a wafer testing system which comprises a wafer testing box, a bearing table and testing equipment. The wafer test box is provided with a first magnetic piece. The bearing table is provided with a second magnetic piece, and the wafer test box is fixed on the bearing table through magnetic attraction force generated between the first magnetic piece and the second magnetic piece. The test equipment is provided with a test host and a test cabinet, the test cabinet comprises a test space for accommodating a wafer test box and a bearing table, and the test host is electrically connected with the wafer test box.

Description

Technical Field

[0001] The invention relates to a wafer testing system, in particular to a wafer testing system with a wafer testing box fixed with a magnetic attraction structure. Background Art

[0002] When the wafer completes the design of the integrated circuit, the wafer needs to undergo a burn-in test and an electrical test. Traditionally, the wafer burn-in and reliability test is performed by testing each wafer separately through a test host and a probe card. Each wafer is placed on a carrier and electrically contacted with the probe of the probe card to complete the test. Therefore, when the amount of wafers is large, more test hosts and probe cards are required, and the test process generates greater time and equipment costs.

[0003] In the prior art, in order to improve the efficiency of the burn-in test, a composite test unit system has been developed, which can perform burn-in tests on multiple wafers at the same time. The aforementioned system has multiple test unit arrays in one test device, each wafer is respectively configured in each test unit array, and each test unit has at least one chuck to fix the wafer, and the wafer is connected to the test host for burn-in test or electrical test.

[0004] On the other hand, a wafer test box has been developed recently, which pre-positions the probe card and wafer and places them in the wafer test box. The wafer test box is directly electrically connected to the test host, and the wafer test box is placed in the test unit to perform a burn-in test or an electrical test. The upper and lower shells of the existing wafer test box are combined in a snap-on or vacuum-type manner. The snap-on type has limited effect on the combination and fixation of the upper and lower shells, and there are problems of uneven force and deformation.

[0005] Therefore, how to improve the efficiency of the test system through structural design improvements to overcome the above-mentioned defects has become one of the important issues that this business wants to solve. Summary of the invention

[0006] The technical problem to be solved by the present invention is that, in view of the shortcomings of the prior art, a test system with a magnetic fixing structure is provided, including: a wafer test box and a test device. The wafer test box has a first magnetic component. The wafer test box has a first magnetic component and at least one first electrical contact point. The test equipment includes: a test host and at least one test cabinet. The test cabinet includes a test space and a second electrical contact point. The carrier has a second magnetic component, and the carrier is arranged at a test position in the test space. The test space is used to accommodate the wafer test box. The second electrical contact point of the test cabinet is used to electrically connect the first electrical contact point of the wafer test box, so that the test host is electrically connected to the wafer test box. The wafer test box is fixed on the carrier by the magnetic attraction generated between the first magnetic component and the second magnetic component.

[0007] According to a feasible implementation scheme, the electrical connection between the test host and the wafer test box occurs at the same time, before or after the magnetic attraction force is generated.

[0008] According to a feasible implementation scheme, the supporting platform includes a magnetic blocking component configured to reduce or release the magnetic attraction force.

[0009] According to a feasible implementation, the wafer testing box includes an extension portion, and the first electrical contact point is located in the extension portion.

[0010] According to a feasible implementation scheme, the test cabinet further includes a slide rail assembly connected to the carrying platform, and the slide rail assembly can drive the carrying platform to move toward or outside the test space.

[0011] According to a feasible implementation scheme, the carrying platform is a slide rail assembly, which is located on both sides of the bottom of the wafer testing box and carries the wafer testing box.

[0012] According to a feasible implementation scheme, the wafer testing box has at least one first positioning structure, and the carrier has at least one second positioning structure corresponding to the at least one first positioning structure, and the at least one second positioning structure is used to dock with the first positioning structure.

[0013] According to a feasible implementation scheme, the wafer testing box includes a first shell and a second shell, and the first shell and the second shell are tightly combined.

[0014] The present invention also provides a test system, including: a wafer test box and a test device. The wafer test box has a first magnetic component and at least one first electrical contact point. The test device includes: a test host and at least one test cabinet. The test cabinet includes a test space and a second electrical contact point. The test space is used to accommodate the wafer test box, and the test space is defined by a top plate, a bottom plate and a side wall. The test space is provided with a second magnetic component, and the second magnetic component is arranged on the bottom plate or the side wall. The wafer test box is fixed in the test space by a magnetic attraction generated between the first magnetic component and the second magnetic component. The second electrical contact point of the test cabinet is used to electrically connect the first electrical contact point of the wafer test box, so that the wafer test box is electrically connected to the test host.

[0015] According to a feasible implementation scheme, the wafer testing box has at least one first positioning structure, and at least one of the top plate, the bottom plate and the side wall has at least one second positioning structure corresponding to the at least one first positioning structure, and the at least one second positioning structure is used to dock with the first positioning structure.

[0016] According to a feasible implementation, the first electrical contact point and the second electrical contact point of the wafer testing box are connected in a magnetic attraction manner.

[0017] One of the beneficial effects of the present invention is that the test system provided by the present invention can effectively improve the wafer test efficiency. The magnetic structure is used to connect the test equipment and the wafer test box, and the test environment is effectively controlled.

[0018] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 FIG. 1 is a schematic diagram of a testing system according to an embodiment of the present invention.

[0020] Figure 2 yes Figure 1 A schematic diagram of a test cabinet of the illustrated embodiment.

[0021] Figure 3 yes Figure 1 A schematic diagram of a wafer testing box according to the embodiment is shown.

[0022] Figure 4 FIG. 4 is a schematic diagram of a wafer testing box according to an embodiment of the present invention.

[0023] Figure 5 FIG. 4 is a schematic diagram of a wafer testing box according to an embodiment of the present invention.

[0024] Figure 6 FIG. 1 is a schematic diagram of a testing system according to an embodiment of the present invention.

[0025] Figure 7 It is a schematic diagram of the relationship between a wafer testing box and a testing space according to an embodiment of the present invention. DETAILED DESCRIPTION

[0026] The following is an explanation of the implementation methods of the "test system with a magnetic structure" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention. In addition, the term "or" used in this article may include any one or more combinations of the associated listed items depending on the actual situation.

[0027] See also Figures 1 to 3 , Figure 1FIG. 1 is a schematic diagram of a testing system according to an embodiment of the present invention. Figure 2 yes Figure 1 A schematic diagram of a test cabinet of the illustrated embodiment. Figure 3 yes Figure 1 A schematic diagram of a wafer testing box according to the embodiment is shown.

[0028] In this embodiment, the test system SYS1 at least includes a wafer test box 1A, a carrier SB, and a test device TE1. The wafer test box 1A is movably arranged on the carrier SB. A probe card 112 is arranged in the wafer test box 1A. The probe card 112 includes one or more probes 1121. When executing the test program, the probe 1121 abuts against the pad 131 of the wafer 13, so that the probe 1121 is in electrical contact with the pad of the wafer 13.

[0029] See also Figure 1 as well as Figure 2 In this embodiment, the test equipment TE1 has a test host TE11 and a test cabinet TE12. The test cabinet TE12 includes a plurality of test spaces TS (TS1-TS25). Each test space TS is used to accommodate a wafer test box 1A. The carrier SB is located at a test position of the test space TS.

[0030] In this embodiment, the wafer test box 1A includes a first shell 11 and a second shell 12. In some embodiments, the first shell 11 and the second shell 12 can be tightly combined by a snap-fit ​​or vacuum method; in some embodiments, the first shell 11 and the second shell 12 can be tightly combined by magnetic attraction, as described below.

[0031] The wafer test box 1A is movably disposed on the carrier SB. The wafer test box 1A has a first magnetic component 111, which can be disposed on the first shell 11 or the second shell 12. In this embodiment, the first magnetic component 111 is disposed on the first shell 11. The carrier SB has a second magnetic component SB-P, and the wafer test box 1A is fixed on the carrier SB by the magnetic attraction generated between the first magnetic component 111 and the second magnetic component SB-P. The carrier SB and the wafer test box 1A are located in the test space TS to perform the test procedure. The first magnetic component 111 and the second magnetic component SB-P can be, but are not limited to, permanent magnets. According to some embodiments, one of the first magnetic component 111 and the second magnetic component SB-P is a magnetically conductive material, and the other is a paramagnetic element (electromagnet or permanent magnet).

[0032] The wafer test box 1A has a first electrical contact point 118, which can be electrically connected to the second electrical contact point SEP of the test cabinet TE12, so that the test host TE11 is electrically connected to the wafer test box 1A. According to this embodiment, the first electrical contact point 118 is located in the second shell 12. According to some other embodiments, the first electrical contact point 118 is located in the first shell 11, and the present invention is not limited. When the wafer test box 1A is located in the test space TS, the first electrical contact point 118 of the first shell 11 or the second shell 12 is electrically connected to the second electrical contact point SEP of the test equipment TE1. In this way, the test equipment TE1 performs a test procedure on the wafer 13 in the wafer test box. In this embodiment, the first electrical contact point 118 can be set on the extension 12E of the second shell 12 to make electrical contact with the second electrical contact point SEP.

[0033] According to some embodiments, the electrical connection between the test host TE11 and the wafer test box 1A occurs at the same time, before or after the magnetic attraction force is generated.

[0034] According to some embodiments, the first shell 11 and the second shell 12 are in a tightly combined state. For example, one of the first shell 11 and the second shell 12 is provided with a first magnetic member 111, and the other is provided with a third magnetic member 121. When the first shell 11 and the second shell 12 are close to each other, the first magnetic member 111 and the third magnetic member 121 can generate an attractive magnetic force to achieve tight combination. In this embodiment, the wafer test box 1A includes two sets of first magnetic members 111 and third magnetic members 121. When the first shell 11 and the second shell 12 are close to each other, the wafer test box 1A can be tightly combined and fixed by the attractive magnetic force generated by the first magnetic member 111 and the third magnetic member 121.

[0035] According to some embodiments, the first magnetic member 111 and the third magnetic member 121 can be paramagnetic objects, such as permanent magnets, non-permanent magnets or non-magnetic conductive objects. Non-magnetic conductive objects include, but are not limited to, iron, cobalt or nickel. In this embodiment, the non-permanent magnet is an electromagnet.

[0036] According to some embodiments, the carrier SB includes a magnetic barrier component SB-B, which is configured to reduce or release the magnetic attraction between the first magnetic member and the second magnetic member. Since when the wafer test box 1A is close to the carrier SB, if the aforementioned magnetic attraction always exists between the two, the force used to place the wafer test box 1A on the carrier SB is difficult to control, which may damage the wafer or probe card in the wafer test box 1A. Therefore, a magnetic barrier component is provided to eliminate or reduce the magnetic attraction, so that the wafer test box 1A is placed on the carrier SB, and then the wafer test box 1A is further fixed on the carrier SB through the magnetic attraction.

[0037] like Figure 3As shown, in this embodiment, the magnetic barrier component SB-B is a movable shielding object, which blocks the second magnetic part SB-P to eliminate or reduce the magnetic attraction between the second magnetic part SB-P and the first magnetic part 111. After the wafer test box 1A is placed on the carrier SB, the magnetic barrier component SB-B is separated from the second magnetic part SB-P, and a magnetic attraction is generated or enhanced between the second magnetic part SB-P and the first magnetic part 111, so that the wafer test box 1A is fixed on the carrier SB. According to some other embodiments, the second magnetic part SB-P is movable, and the second magnetic part SB-P is a magnetically conductive material, such as iron, nickel, cobalt, or a permanent magnet. Before the wafer test box 1A is placed on the carrier table SB, the second magnetic component SB-P moves to the magnetic barrier component SB-B and is shielded by the magnetic barrier component SB-B. When the wafer test box 1A is placed on the carrier table SB, no magnetic attraction is generated between the first magnetic component 111 and the second magnetic component SB-P. After the wafer test box 1A is placed on the carrier table SB, the second magnetic component SB-P and the magnetic barrier component SB-B are separated. The second magnetic component SB-P is not shielded by the magnetic barrier component SB-B, and a magnetic attraction is generated between the second magnetic component SB-P and the first magnetic component 111, thereby locking the wafer test box 1A on the carrier table SB.

[0038] See also Figure 4 , is a schematic diagram of a wafer test box 1B according to an embodiment of the present invention. In this embodiment, the first electrical contact point 118 and the second electrical contact point SEP of the wafer test box 1B are connected by magnetic attraction. For example, the test cabinet TE12 includes a magnetic object ME, which is arranged on one side of the second electrical contact point SEP, corresponding to the third magnetic member 121. The magnetic object ME can be a paramagnetic element or have a polarity opposite to the third magnetic member 121. In this way, the first electrical contact point 118 can be electrically contacted with the second electrical contact point SEP through the magnetic attraction between the magnetic object ME and the third magnetic member 121. However, the present invention is not limited to this, and two magnetic elements that can attract each other can also be arranged, respectively, on one side of the first electrical contact point 118 (inside the wafer test box) and on one side of the second electrical contact point SEP (on the test cabinet), and the purpose of electrically connecting the first electrical contact point 118 with the second electrical contact point SEP can be achieved by the mutual magnetic attraction between the two.

[0039] See also Figure 5, is a schematic diagram of a wafer test box 1C according to an embodiment of the present invention. According to some embodiments, the second magnetic part SB-P is an electromagnet having a magnetic region, and the magnetic barrier assembly SB-B includes a power source P and a switch, which is connected to the electromagnet SB-P. When the wafer test box 1C is placed on the carrier SB, the switch is turned on, and the magnetic region of the electromagnet SB-P generates a magnetic force to magnetically attract the first magnetic part and the third magnetic part 121, so as to magnetically lock the wafer test box 1C and the carrier SB. The switch can be controlled to open and close via the control circuit CRT.

[0040] In some embodiments, the test cabinet TE12 further includes a slide rail assembly (not shown) connected to the carrier SB, and the slide rail assembly can drive the carrier SB to move in or out of the test space TS. According to some embodiments, the test system can place the wafer test box on the carrier SB by manual operation, and the design of the slide rail assembly can make manual operation more convenient (for example, the wafer test box is accurately aligned with the carrier SB) and then placed. However, the present invention is not limited to this, and according to some embodiments, the test system can also be automated.

[0041] In some embodiments, the carrier SB is a slide rail assembly, which includes two slide rail bearing parts (not shown), respectively located on both sides of the bottom of the wafer test box. The two slide rail bearing parts support the wafer test box and suspend the wafer test box in the test space, that is, there is a gap between the wafer test box and the bottom (bottom wall) of the test space.

[0042] Please refer to Figure 3 According to some embodiments, the wafer test box has a first positioning structure 11P, and the carrier SB has a second positioning structure SB-F corresponding to the first positioning structure 11P, and the second positioning structure SB-F is used to dock with the first positioning structure 11P. Figure 3 As shown, the first shell 11 includes a first positioning structure 11P (such as a groove) of a concave structure. The carrier SB includes a second positioning structure SB-F (a convex structure similar to a convex rib) protruding upward. The first positioning structure 11P of the concave structure and the convex structure SB-F can be docked with each other to achieve the mutual positioning of the wafer test box 1A and the carrier SB. In addition, in this embodiment, the first shell 11 has a first convex structure 11F, and the second shell 12 has a second convex structure 12F. The first convex structure 11F and the second convex structure 12F are correspondingly arranged. Through the design of the first convex structure 11F and the second convex structure 12F, it can be ensured that the first shell 11 and the second shell 12 can be accurately aligned when combined, and through the aforementioned magnetic attraction, the first shell 11 and the second shell 12 are further tightly combined.

[0043] See also Figure 6The present invention also provides a test system, including: a wafer test box 1D and a test device TE2. The wafer test box 1D has a first magnetic component 111. The test device TE2 has a test host TE21 and a test cabinet TE22. The test cabinet TE22 includes a test space TS for accommodating the wafer test box 1D. The test space TS is defined by a top plate 21, a bottom plate 23 and a side wall 22. The test space is provided with a second magnetic component SB-P. The second magnetic component SB-P is arranged on the bottom plate 23 or the side wall 22. In this embodiment, the second magnetic component SB-P is arranged on the bottom plate 23. The wafer test box is fixed in the test space TS by the magnetic attraction generated between the first magnetic component 111 and the second magnetic component SB-P. The wafer test box 1C is also electrically connected to the test host TE21.

[0044] In this embodiment, the wafer test box 1D has a first electrical contact point 118, which can be electrically connected to the second electrical contact point SEP of the test cabinet TE22. According to this embodiment, the first electrical contact point 118 is located at the extension portion 12P of the second shell 12. When the wafer test box 1D is located in the test space TS, the first electrical contact point 118 is electrically connected to the second electrical contact point SEP of the test equipment TE2. In this way, the test equipment TE2 performs a test procedure on the wafer 13 in the wafer test box 1D.

[0045] See also Figure 7 , is a schematic diagram of a wafer test box 1E according to an embodiment of the present invention. In this embodiment, the first electrical contact point 118 and the second electrical contact point SEP of the wafer test box 1E are connected by magnetic attraction. For example, the test cabinet TE22 includes a magnetic object ME, which is arranged on the side wall 22 and is located on one side of the second electrical contact point SEP. The magnetic object ME corresponds to the third magnetic part 121. The magnetic object ME can be a paramagnetic element or have the opposite polarity to the third magnetic part 121. In this way, the first electrical contact point 118 can be electrically contacted with the second electrical contact point SEP through the magnetic attraction between the magnetic object ME and the third magnetic part 121. However, the present invention is not limited to this. Two magnetic elements that can attract each other can also be set, one is set on one side of the first electrical contact point 118 (inside the wafer test box), and the other is set on the top plate 21, the side wall 22 or the bottom plate 23, located on one side of the second electrical contact point SEP. In this way, the purpose of electrically connecting the first electrical contact point 118 and the second electrical contact point SEP is achieved by mutual magnetic attraction between the two.

[0046] The quantity and position of the first magnetic component 111, the second magnetic component SB-P and the third magnetic component 121 can be adjusted according to actual needs and are not limited in the present invention.

[0047] [Beneficial Effects of Embodiments]

[0048] One of the beneficial effects of the present invention is that the test system and wafer test method provided by the present invention can effectively improve the wafer test efficiency. The magnetic structure is used to connect the test equipment and the wafer test box, and the test environment is effectively controlled.

[0049] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention's specification and drawings are included in the claims of the present invention.

Claims

1. A wafer testing system, characterized in that: The wafer testing system comprises: A wafer testing box having a first magnetic component and at least one first electrical contact point; and Test equipment, including: Test host; At least one test cabinet, the test cabinet comprising a test space and a second electrical contact point; and a carrier having a second magnetic member, the carrier being disposed at a test position of the test space; Wherein, the test space is used to accommodate the wafer test box; Wherein, the second electrical contact point is used to electrically connect to the first electrical contact point, so that the test host is electrically connected to the wafer test box; and Wherein, the wafer testing box is fixed on the supporting platform through the magnetic attraction force generated between the first magnetic component and the second magnetic component.

2. The wafer testing system according to claim 1, wherein: The electrical connection between the test host and the wafer test box occurs at the same time, before or after the magnetic attraction force is generated.

3. The wafer testing system according to claim 1, wherein: The carrier or the wafer testing box includes a magnetic barrier component, and the magnetic barrier component is configured to reduce or release the magnetic attraction.

4. The wafer testing system according to claim 1, wherein: The wafer testing box includes an extension portion, and the first electrical contact point is located at the extension portion.

5. The wafer testing system according to claim 1, wherein: The first electrical contact point is connected to the second electrical contact point by magnetic attraction.

6. The wafer testing system according to claim 1, wherein: The test cabinet further includes a slide rail assembly connected to the carrying platform, and the slide rail assembly can drive the carrying platform to move toward or outside the test space.

7. The wafer testing system according to claim 1, wherein: The carrying platform is a slide rail assembly, which is located on both sides of the bottom of the wafer test box and carries the wafer test box.

8. The wafer testing system according to claim 1, wherein: The wafer testing box has at least one first positioning structure, and the carrying platform has at least one second positioning structure corresponding to the at least one first positioning structure, and the at least one second positioning structure is used for docking with the first positioning structure.

9. The wafer testing system according to claim 1, wherein: The wafer testing box includes a first shell and a second shell, and the first shell and the second shell are tightly combined.

10. A wafer testing system, characterized in that: The wafer testing system comprises: A wafer testing box having a first magnetic component and at least one first electrical contact point; and Test equipment, including: Test hosts; and At least one test cabinet, each of the test cabinets comprising a test space and a second electrical contact point; The test space is used to accommodate the wafer test box, the test space is defined by a top plate, a bottom plate and side walls, the test space is provided with a second magnetic component, the second magnetic component is arranged on the bottom plate or the side wall, and the wafer test box is fixed in the test space by the magnetic attraction generated between the first magnetic component and the second magnetic component; and The second electrical contact point of the test cabinet is used to electrically connect to the first electrical contact point of the wafer test box, so that the wafer test box is electrically connected to the test host.

11. The wafer testing system according to claim 10, wherein: The electrical connection between the test host and the wafer test box occurs at the same time, before or after the magnetic attraction is generated.

12. The wafer testing system according to claim 10, wherein: The wafer testing box or the testing space is also provided with a magnetic blocking component, which is configured to reduce or release the magnetic attraction.

13. The wafer testing system according to claim 10, wherein: The wafer testing box includes an extension portion, and the first electrical contact point is located at the extension portion.

14. The wafer testing system according to claim 10, wherein: The first electrical contact point is connected to the second electrical contact point by magnetic attraction.

15. The wafer testing system according to claim 10, wherein: The wafer testing box has at least one first positioning structure, and at least one of the top plate, the bottom plate and the side wall has at least one second positioning structure corresponding to the at least one first positioning structure, and the at least one second positioning structure is used to dock with the first positioning structure.

16. The wafer testing system according to claim 10, wherein: The wafer testing box includes a first shell and a second shell, and the first shell and the second shell are tightly combined.

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