Method and device for testing residual resistivity of copper coating of composite material

Abstract

The invention relates to the technical field of material detection, and provides a method and a device for testing the residual resistivity of a copper coating of a composite material. The method comprises the following steps: carrying out microstructure scanning treatment on a composite material to obtain a microstructure image of the composite material, and inputting the microstructure image into a preset copper coating extraction model to obtain a three-dimensional model of a copper coating of the composite material; performing finite element segmentation processing on the three-dimensional model to obtain a finite element model; for each finite element unit of the finite element model, carrying out residual resistivity test on the finite element unit to obtain an initial residual resistivity corresponding to the finite element unit; and determining a target residual resistivity of the copper plating layer based on each initial residual resistivity. The method overcomes the defect that a traditional method for testing the residual resistivity of the copper coating of the composite material is easily interfered by a base material, so that the measurement error is large.

Description

Technical Field

[0001] The present application relates to the technical field of material detection, and in particular to a method and device for testing the residual resistivity of a composite material copper plating layer. Background Art

[0002] With the development of modern industry, composite materials are widely used in aerospace, electronics, automobile manufacturing and other fields due to their advantages of light weight, high strength and corrosion resistance. In order to improve the conductivity and anti-electromagnetic interference ability of composite materials, metal plating is often performed on their surface.

[0003] In practical applications, understanding the residual resistivity of copper coatings is of great significance for evaluating the conductivity, reliability and service life of composite materials. Residual resistivity refers to the ratio of the resistance of a material at room temperature to that at 4.2K, and is a key parameter that reflects the influence of microscopic factors such as internal defects, impurities and grain boundaries on conductivity.

[0004] Traditional methods for testing the residual resistivity of copper coatings on composite materials include the four-probe method, the Hall effect method, and the AC impedance method, etc. However, these methods are easily interfered by the matrix material during testing, resulting in large measurement errors. Summary of the invention

[0005] The present application provides a method and device for testing the residual resistivity of a composite copper coating, in order to solve the problems raised by the above-mentioned background technology.

[0006] In a first aspect, the present application provides a method for testing the residual resistivity of a composite copper plating layer, comprising: Performing microstructure scanning on the composite material to obtain a microstructure image of the composite material, and inputting the microstructure image into a preset copper plating layer extraction model to obtain a three-dimensional model of the copper plating layer of the composite material; wherein the copper plating layer extraction model is a pre-trained convolutional neural network; Performing finite element segmentation processing on the three-dimensional model to obtain a finite element model; For each finite element unit of the finite element model, a residual resistivity test is performed on the finite element unit to obtain an initial residual resistivity corresponding to the finite element unit; A target residual resistivity of the copper plating layer is determined based on each of the initial residual resistivities.

[0007] In a possible implementation, performing a residual resistivity test on the finite element unit to obtain an initial residual resistivity corresponding to the finite element unit includes: extracting the finite element unit in the finite element model; Performing a multi-point residual resistivity test on the finite element unit to obtain a plurality of residual resistivities corresponding to the finite element unit; An initial residual resistivity of the finite element unit is determined based on a plurality of residual resistivities corresponding to the finite element unit.

[0008] In a possible implementation, performing a multi-point residual resistivity test on the finite element unit to obtain a plurality of residual resistivities corresponding to the finite element unit includes: Determine a first point pair on the surface of the finite element unit; the two points of the first point pair are the two points on the finite element unit that are farthest apart; Based on a preset distance decreasing index, the distance between the two points of the first point pair is decreased to obtain a plurality of target distances; For each of the target distances, determining a second point pair corresponding to the target distance on the surface of the finite element unit; wherein the distance between two points in the second point pair is the target distance; The residual resistivity corresponding to each of the point pairs is tested respectively to obtain a plurality of residual resistivities corresponding to the finite element unit.

[0009] In a possible implementation, respectively testing the residual resistivity corresponding to each of the point pairs to obtain a plurality of residual resistivities corresponding to the finite element unit includes: For each of the point pairs, a virtual current lead and a virtual voltage sensor are set at two points of the point pair, and the residual resistivity corresponding to the point pair is obtained based on the virtual current lead and the virtual voltage sensor; Wherein, the acquiring the residual resistivity corresponding to the point pair based on the virtual current lead and the virtual voltage sensor comprises: At room temperature, a virtual constant current source is used to pass current through the virtual current leads. 1A current, and obtain the two ends of the point pair through the virtual voltage sensor A first voltage value corresponding to the 1A condition, and an average of the absolute values ​​of the two first voltage values ​​as the first target voltage; At 4.2K low temperature, a virtual constant current source is used to pass current through the virtual current leads. 1A current, and obtain the two ends of the point pair through the virtual voltage sensor A second voltage value corresponding to the 1A condition, and an average of the absolute values ​​of the two second voltage values ​​as the second target voltage; The ratio of the first target voltage to the second target voltage is used as the residual resistivity corresponding to the point pair.

[0010] In a possible implementation, determining the target residual resistivity of the copper plating layer based on each of the initial residual resistivities includes: Obtaining a standard deviation between each of the initial residual resistivities, and comparing the standard deviation with a preset standard deviation; If the standard deviation is less than the preset standard deviation, taking the average value of each of the initial residual resistivities as the target residual resistivity; If the standard deviation is not less than the preset standard deviation, determining the median of each of the initial residual resistivities; For each of the initial residual resistivities, calculating the difference between the initial residual resistivity and the median, and comparing the absolute value of the difference with a preset absolute value, and if the absolute value of the difference is less than the preset absolute value, determining that the initial residual resistivity is a target initial residual resistivity; The average value of the target initial residual resistivities is taken as the target residual resistivity.

[0011] In a possible implementation, the method further includes: The microstructure image is bound to the target residual resistivity to obtain a binding result, and the binding result is stored in a preset database.

[0012] In a possible implementation manner, binding the microstructure image with the target residual resistivity to obtain a binding result includes: Performing matrix coding on the microstructure based on a preset matrix coding method to obtain a coding matrix; wherein each row vector of the coding matrix includes letters and numbers; A geometric sequence is constructed with the numerical value corresponding to the target residual resistivity as the first term; the number of numerical values ​​in the geometric sequence is consistent with the number of row vectors in the encoding matrix; For each row vector of the coding matrix, determine a target value corresponding to the row vector in the geometric progression, and multiply the target value by the row vector to obtain a target row vector corresponding to the row vector; wherein the value corresponding to the row number corresponding to the row vector in the coding matrix is ​​consistent with the value corresponding to the sequence corresponding to the target value in the geometric progression; The target row vectors are arranged in order from top to bottom based on the positions of the row vectors corresponding to the target row vectors in the encoding matrix to obtain a target encoding matrix; the target encoding matrix is ​​the binding result.

[0013] In a second aspect, the present application provides a testing device for residual resistivity of a composite copper coating, comprising: An extraction module is used to perform microstructure scanning on the composite material to obtain a microstructure image of the composite material, and input the microstructure image into a preset copper plating layer extraction model to obtain a three-dimensional model of the copper plating layer of the composite material; wherein the copper plating layer extraction model is a pre-trained convolutional neural network; A segmentation processing module, used for performing finite element segmentation processing on the three-dimensional model to obtain a finite element model; A testing module, for performing a residual resistivity test on each finite element unit of the finite element model to obtain an initial residual resistivity corresponding to the finite element unit; A determination module is used to determine a target residual resistivity of the copper plating layer based on each of the initial residual resistivities.

[0014] The present application provides a method and device for testing the residual resistivity of a copper coating of a composite material. The method comprises: performing microstructure scanning processing on a composite material to obtain a microstructure image of the composite material, and inputting the microstructure image into a preset copper coating extraction model to obtain a three-dimensional model of the copper coating of the composite material; wherein the copper coating extraction model is a pre-trained convolutional neural network; performing finite element segmentation processing on the three-dimensional model to obtain a finite element model; for each finite element unit of the finite element model, performing a residual resistivity test on the finite element unit to obtain an initial residual resistivity corresponding to the finite element unit; and determining a target residual resistivity of the copper coating based on each of the initial residual resistivities. This method, on the one hand, overcomes the defect that the traditional residual resistivity test method of the copper coating of a composite material is easily interfered by the matrix material, resulting in a large measurement error, and helps to improve the accuracy of the test results. On the other hand, it realizes non-contact measurement and can protect the integrity of the material. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0016] Figure 1 A schematic flow chart of a method for testing the residual resistivity of a composite copper coating provided in an embodiment of the present application; Figure 2 A schematic block diagram of the structure of a testing device for residual resistivity of a composite copper coating provided in an embodiment of the present application; Figure 3 A schematic block diagram of the structure of a terminal device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] The flowcharts shown in the accompanying drawings are only examples and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps may also be decomposed, combined or partially merged, so the actual execution order may change according to actual conditions.

[0019] It should also be understood that the terms used in this application specification are only for the purpose of describing specific embodiments and are not intended to limit the application. As used in this application specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0020] It should be further understood that the term “and / or” used in the specification and appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0021] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0022] See also Figure 1 , Figure 1 A schematic diagram of a test method for residual resistivity of a composite copper coating provided in an embodiment of the present application is shown in FIG. Figure 1 As shown, the method for testing the residual resistivity of the composite material copper plating layer provided in the embodiment of the present application includes steps S1 to S4.

[0023] Step S1, performing microstructure scanning processing on the composite material to obtain a microstructure image of the composite material, and inputting the microstructure image into a preset copper plating layer extraction model to obtain a three-dimensional model of the copper plating layer of the composite material; wherein the copper plating layer extraction model is a pre-trained convolutional neural network.

[0024] Specifically, a synchrotron radiation X-ray microscope or a focused ion beam scanning electron microscope is used to perform a global scan on the composite material to obtain the microstructure image.

[0025] Step S2: performing finite element segmentation processing on the three-dimensional model to obtain a finite element model.

[0026] Specifically, a preset adaptive meshing algorithm is used to perform finite element segmentation processing on the three-dimensional model to obtain a finite element model.

[0027] Step S3: for each finite element unit of the finite element model, perform a residual resistivity test on the finite element unit to obtain an initial residual resistivity corresponding to the finite element unit.

[0028] Specifically, the performing of a residual resistivity test on the finite element unit to obtain an initial residual resistivity corresponding to the finite element unit comprises the following steps: extracting the finite element unit in the finite element model; Performing a multi-point residual resistivity test on the finite element unit to obtain a plurality of residual resistivities corresponding to the finite element unit; The initial residual resistivity of the finite element unit is determined based on the multiple residual resistivities corresponding to the finite element unit. Specifically, the average value of the multiple residual resistivities corresponding to the finite element unit is determined as the residual resistivity of the finite element unit.

[0029] The method of performing a multi-point residual resistivity test on the finite element unit to obtain a plurality of residual resistivities corresponding to the finite element unit comprises the following steps: Determine a first point pair on the surface of the finite element unit; the two points of the first point pair are the two points on the finite element unit that are farthest apart; The distance between the two points of the first point pair is decreased based on a preset distance decreasing index to obtain a plurality of target distances; for example, if the distance between the two points of the first point pair is 10 μm and the distance decreasing index is 2 μm, the target distances include 8 μm, 6 μm, 4 μm and 2 micrometers; For each of the target distances, determining a second point pair corresponding to the target distance on the surface of the finite element unit; wherein the distance between two points in the second point pair is the target distance; The residual resistivity corresponding to each of the point pairs is tested respectively to obtain a plurality of residual resistivities corresponding to the finite element unit; it can be understood that the point pairs include the above-mentioned first point pair and each second point pair.

[0030] The step of respectively testing the residual resistivity corresponding to each of the point pairs to obtain a plurality of residual resistivities corresponding to the finite element unit comprises the following steps: For each of the point pairs, a virtual current lead and a virtual voltage sensor are set at two points of the point pair, and the residual resistivity corresponding to the point pair is obtained based on the virtual current lead and the virtual voltage sensor; Wherein, the acquiring the residual resistivity corresponding to the point pair based on the virtual current lead and the virtual voltage sensor comprises: At room temperature, a virtual constant current source is used to pass current through the virtual current leads. 1A current, and obtain the two ends of the point pair through the virtual voltage sensor A first voltage value corresponding to the 1A condition, and an average of the absolute values ​​of the two first voltage values ​​as the first target voltage; At 4.2K low temperature, a virtual constant current source is used to pass current through the virtual current leads. 1A current, and obtain the two ends of the point pair through the virtual voltage sensor A second voltage value corresponding to the 1A condition, and an average of the absolute values ​​of the two second voltage values ​​as the second target voltage; The ratio of the first target voltage to the second target voltage is used as the residual resistivity corresponding to the point pair.

[0031] It can be understood that step S3 helps to improve the test accuracy and the reliability of the test results by determining multiple point pairs on the finite element unit and performing residual resistivity tests on each of the point pairs.

[0032] Step S4: determining a target residual resistivity of the copper plating layer based on each of the initial residual resistivities.

[0033] Specifically, step S4 includes the following steps: Obtaining a standard deviation between each of the initial residual resistivities, and comparing the standard deviation with a preset standard deviation; If the standard deviation is less than the preset standard deviation, taking the average value of each of the initial residual resistivities as the target residual resistivity; If the standard deviation is not less than the preset standard deviation, determining the median of each of the initial residual resistivities; For each of the initial residual resistivities, calculating the difference between the initial residual resistivity and the median, and comparing the absolute value of the difference with a preset absolute value, and if the absolute value of the difference is less than the preset absolute value, determining that the initial residual resistivity is a target initial residual resistivity; The average value of the target initial residual resistivities is taken as the target residual resistivity.

[0034] It can be understood that step S4 can effectively eliminate the influence of abnormal values ​​and improve the accuracy of the target residual resistivity.

[0035] The method provided in this embodiment, on the one hand, overcomes the defect that the traditional composite copper plating residual resistivity test method is easily interfered by the base material, resulting in large measurement errors, which helps to improve the accuracy of the test results. On the other hand, it realizes non-contact measurement and can protect the integrity of the material.

[0036] In some embodiments, the method further comprises the following steps: The microstructure image is bound to the target residual resistivity to obtain a binding result, and the binding result is stored in a preset database.

[0037] The step of binding the microstructure image with the target residual resistivity to obtain a binding result comprises the following steps: Performing matrix coding on the microstructure based on a preset matrix coding method to obtain a coding matrix; wherein each row vector of the coding matrix includes letters and numbers; A geometric sequence is constructed with the numerical value corresponding to the target residual resistivity as the first term; the number of numerical values ​​in the geometric sequence is consistent with the number of row vectors in the encoding matrix; For each row vector of the coding matrix, determine a target value corresponding to the row vector in the geometric progression, and multiply the target value by the row vector to obtain a target row vector corresponding to the row vector; wherein the value corresponding to the row number corresponding to the row vector in the coding matrix is ​​consistent with the value corresponding to the sequence corresponding to the target value in the geometric progression; The target row vectors are arranged in order from top to bottom based on the positions of the row vectors corresponding to the target row vectors in the encoding matrix to obtain a target encoding matrix; the target encoding matrix is ​​the binding result.

[0038] The method provided in this embodiment, on the one hand, facilitates data management and traceability by storing the binding relationship in a preset database, and provides a theoretical basis for automating the test method of the residual resistivity of the composite material copper plating layer; on the other hand, when binding the microstructure image with the target residual resistivity, automatic encryption of the microstructure image and the target residual resistivity is achieved, thereby improving data security.

[0039] See also Figure 2 , Figure 2 The structure schematic block diagram of the test device 100 for the residual resistivity of the composite copper coating provided in the embodiment of the present application is as follows: Figure 2As shown, the test device 100 for the residual resistivity of the composite copper plating layer provided in the embodiment of the present application includes: The extraction module 110 is used to perform microstructure scanning processing on the composite material to obtain a microstructure image of the composite material, and input the microstructure image into a preset copper plating extraction model to obtain a three-dimensional model of the copper plating of the composite material; wherein the copper plating extraction model is a pre-trained convolutional neural network.

[0040] The segmentation processing module 120 is used to perform finite element segmentation processing on the three-dimensional model to obtain a finite element model.

[0041] The testing module 130 is used to perform a residual resistivity test on each finite element unit of the finite element model to obtain an initial residual resistivity corresponding to the finite element unit.

[0042] The determination module 140 is configured to determine a target residual resistivity of the copper plating layer based on each of the initial residual resistivities.

[0043] It should be noted that technicians in the relevant technical field can clearly understand that for the convenience and simplicity of description, the specific working process of the above-described device and each module can refer to the corresponding process in the aforementioned embodiment of the test method for the residual resistivity of the composite material copper plating layer, and will not be repeated here.

[0044] The test device 100 for the residual resistivity of the composite copper coating provided in the above embodiment can be implemented in the form of a computer program. The computer program can be used in Figure 3 The system is run on the terminal device 200 shown.

[0045] See also Figure 3 , Figure 3 The present invention provides a schematic block diagram of the structure of a terminal device 200 according to an embodiment of the present application. The terminal device 200 includes a processor 201 and a memory 202. The processor 201 and the memory 202 are connected via a device bus 203, wherein the memory 202 may include a non-volatile storage medium and an internal memory.

[0046] The non-volatile storage medium can store a computer program. The computer program includes program instructions, and when the program instructions are executed by the processor 201, the processor 201 can execute any of the above-mentioned methods for testing the residual resistivity of the copper plating layer of the composite material.

[0047] The processor 201 is used to provide computing and control capabilities to support the operation of the entire terminal device 200.

[0048] The internal memory provides an environment for the operation of the computer program in the non-volatile storage medium. When the computer program is executed by the processor 201, the processor 201 can execute any of the above-mentioned methods for testing the residual resistivity of the copper plating layer of the composite material.

[0049] Those skilled in the art will understand that Figure 3 The structure shown in the figure is only a block diagram of a partial structure related to the scheme of the present application, and does not constitute a limitation on the terminal device 200 involved in the scheme of the present application. The specific terminal device 200 may include more or fewer components than shown in the figure, or combine certain components, or have a different component arrangement.

[0050] It should be understood that the processor 201 may be a central processing unit (CPU), and the processor 201 may also be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Among them, the general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0051] In some embodiments, the processor 201 is used to run a computer program stored in the memory to implement the following steps: Performing microstructure scanning on the composite material to obtain a microstructure image of the composite material, and inputting the microstructure image into a preset copper plating layer extraction model to obtain a three-dimensional model of the copper plating layer of the composite material; wherein the copper plating layer extraction model is a pre-trained convolutional neural network; Performing finite element segmentation processing on the three-dimensional model to obtain a finite element model; For each finite element unit of the finite element model, a residual resistivity test is performed on the finite element unit to obtain an initial residual resistivity corresponding to the finite element unit; A target residual resistivity of the copper plating layer is determined based on each of the initial residual resistivities.

[0052] It should be noted that technicians in the relevant field can clearly understand that for the convenience and simplicity of description, the specific working process of the terminal device 200 described above can refer to the corresponding process of the aforementioned test method for the residual resistivity of the composite material copper plating layer, and will not be repeated here.

[0053] An embodiment of the present application also provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by one or more processors, the one or more processors implement a method for testing the residual resistivity of a composite material copper plating layer as provided in an embodiment of the present application.

[0054] The computer-readable storage medium may be an internal storage unit of the terminal device 200 in the aforementioned embodiment, such as a hard disk or memory of the terminal device 200. The computer-readable storage medium may also be an external storage device of the terminal device 200, such as a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. equipped with the terminal device 200.

[0055] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A method for testing the residual resistivity of a composite copper coating, characterized in that: include: Performing microstructure scanning on the composite material to obtain a microstructure image of the composite material, and inputting the microstructure image into a preset copper plating layer extraction model to obtain a three-dimensional model of the copper plating layer of the composite material; wherein the copper plating layer extraction model is a pre-trained convolutional neural network; Performing finite element segmentation processing on the three-dimensional model to obtain a finite element model; For each finite element unit of the finite element model, a residual resistivity test is performed on the finite element unit to obtain an initial residual resistivity corresponding to the finite element unit; A target residual resistivity of the copper plating layer is determined based on each of the initial residual resistivities.

2. The method for testing the residual resistivity of a composite copper coating according to claim 1, characterized in that: The performing a residual resistivity test on the finite element unit to obtain an initial residual resistivity corresponding to the finite element unit includes: extracting the finite element unit in the finite element model; Performing a multi-point residual resistivity test on the finite element unit to obtain a plurality of residual resistivities corresponding to the finite element unit; An initial residual resistivity of the finite element unit is determined based on a plurality of residual resistivities corresponding to the finite element unit.

3. The method for testing the residual resistivity of a composite copper coating according to claim 2, characterized in that: The performing of a multi-point residual resistivity test on the finite element unit to obtain a plurality of residual resistivities corresponding to the finite element unit includes: Determine a first point pair on the surface of the finite element unit; the two points of the first point pair are the two points on the finite element unit that are farthest apart; Based on a preset distance decreasing index, the distance between the two points of the first point pair is decreased to obtain a plurality of target distances; For each of the target distances, determining a second point pair corresponding to the target distance on the surface of the finite element unit; wherein the distance between two points in the second point pair is the target distance; The residual resistivity corresponding to each of the point pairs is tested respectively to obtain a plurality of residual resistivities corresponding to the finite element unit.

4. The method for testing the residual resistivity of a composite copper coating according to claim 3, characterized in that: The step of respectively testing the residual resistivity corresponding to each of the point pairs to obtain a plurality of residual resistivities corresponding to the finite element unit comprises: For each of the point pairs, a virtual current lead and a virtual voltage sensor are set at two points of the point pair, and the residual resistivity corresponding to the point pair is obtained based on the virtual current lead and the virtual voltage sensor; Wherein, the acquiring the residual resistivity corresponding to the point pair based on the virtual current lead and the virtual voltage sensor comprises: At room temperature, a virtual constant current source is used to pass current through the virtual current leads. 1A current, and obtain the two ends of the point pair through the virtual voltage sensor A first voltage value corresponding to the 1A condition, and an average of the absolute values ​​of the two first voltage values ​​as the first target voltage; At 4.2K low temperature, a virtual constant current source is used to pass current through the virtual current leads. 1A current, and obtain the two ends of the point pair through the virtual voltage sensor A second voltage value corresponding to the 1A condition, and an average of the absolute values ​​of the two second voltage values ​​as the second target voltage; The ratio of the first target voltage to the second target voltage is used as the residual resistivity corresponding to the point pair.

5. The method for testing the residual resistivity of a composite copper coating according to claim 1, characterized in that: The step of determining a target residual resistivity of the copper plating layer based on each of the initial residual resistivities comprises: Obtaining a standard deviation between each of the initial residual resistivities, and comparing the standard deviation with a preset standard deviation; If the standard deviation is less than the preset standard deviation, taking the average value of each of the initial residual resistivities as the target residual resistivity; If the standard deviation is not less than the preset standard deviation, determining the median of each of the initial residual resistivities; For each of the initial residual resistivities, calculating the difference between the initial residual resistivity and the median, and comparing the absolute value of the difference with a preset absolute value, and if the absolute value of the difference is less than the preset absolute value, determining that the initial residual resistivity is a target initial residual resistivity; The average value of the target initial residual resistivities is taken as the target residual resistivity.

6. The method for testing the residual resistivity of a composite copper coating according to claim 1, characterized in that: The method further comprises: The microstructure image is bound to the target residual resistivity to obtain a binding result, and the binding result is stored in a preset database.

7. The method for testing the residual resistivity of a composite copper coating according to claim 6, characterized in that: The step of binding the microstructure image with the target residual resistivity to obtain a binding result includes: Performing matrix coding on the microstructure based on a preset matrix coding method to obtain a coding matrix; wherein each row vector of the coding matrix includes letters and numbers; A geometric sequence is constructed with the numerical value corresponding to the target residual resistivity as the first term; the number of numerical values ​​in the geometric sequence is consistent with the number of row vectors in the encoding matrix; For each row vector of the coding matrix, determine a target value corresponding to the row vector in the geometric progression, and multiply the target value by the row vector to obtain a target row vector corresponding to the row vector; wherein the value corresponding to the row number corresponding to the row vector in the coding matrix is ​​consistent with the value corresponding to the sequence corresponding to the target value in the geometric progression; The target row vectors are arranged in order from top to bottom based on the positions of the row vectors corresponding to the target row vectors in the encoding matrix to obtain a target encoding matrix; the target encoding matrix is ​​the binding result.

8. A test device for residual resistivity of composite copper coating, characterized in that: include: An extraction module is used to perform microstructure scanning on the composite material to obtain a microstructure image of the composite material, and input the microstructure image into a preset copper plating layer extraction model to obtain a three-dimensional model of the copper plating layer of the composite material; wherein the copper plating layer extraction model is a pre-trained convolutional neural network; A segmentation processing module, used for performing finite element segmentation processing on the three-dimensional model to obtain a finite element model; A testing module, for performing a residual resistivity test on each finite element unit of the finite element model to obtain an initial residual resistivity corresponding to the finite element unit; A determination module is used to determine a target residual resistivity of the copper plating layer based on each of the initial residual resistivities.

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