Coil component

Abstract

The invention provides a coil assembly. The coil component includes: a body including a first surface and a second surface opposite to each other in a first direction; a coil disposed in the main body and including a plurality of coil layers; an insulating layer disposed in each of regions between the plurality of coil layers; an external electrode disposed on the first surface of the body; and a connection portion provided in the main body, connecting one of the plurality of coil layers to the external electrode, and having one surface in contact with the one of the plurality of coil layers and another surface in contact with the external electrode. The connection portion includes a welding portion provided at an end portion of the connection portion to contact the one of the plurality of coil layers.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0123907 filed in the Korean Intellectual Property Office on September 18, 2023, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] The present disclosure relates to a coil assembly. Background Art

[0003] An inductor, a type of coil component, may be a representative passive electronic component used in electronic devices along with a resistor and a capacitor.

[0004] As electronic devices have been designed to have high performance and reduced size, the number of electronic components used in the electronic devices has increased and the sizes thereof have decreased.

[0005] In a coil component provided in a limited mounting area in a circuit board, a multi-layer coil structure may be advantageous in increasing the number of turns of a coil, and a coil component having the multi-layer coil structure and securing a volume of a magnetic material has been required. Summary of the invention

[0006] An aspect of the present disclosure is to increase the number of turns of a coil within a coil component of a limited size by removing a multi-layer coil structure of a support substrate from the multi-layer coil structure.

[0007] Another aspect of the present disclosure is to maximize the effective volume in a coil component having a limited size through a structure in which a coil and an external electrode are connected to each other in a body, thereby improving inductance characteristics and saturation current (I sat )characteristic.

[0008] According to one aspect of the present disclosure, a coil component includes: a main body including a first surface and a second surface opposite to each other in a first direction; a coil disposed in the main body and including a plurality of coil layers; an insulating layer disposed in each of the regions between the plurality of coil layers; an external electrode disposed on the first surface of the main body; and a connecting portion disposed in the main body, connecting one of the plurality of coil layers to the external electrode and having one surface in contact with the one of the plurality of coil layers and another surface in contact with the external electrode. The connecting portion includes a fusion portion disposed at an end of the connecting portion to contact the one of the plurality of coil layers. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 is a perspective view showing a coil component according to a first embodiment of the present disclosure; Figure 2 It is shown Figure 1 An exploded perspective view of a portion of the coil assembly shown in ; Figure 3 is along Figure 1 A cross-sectional view taken along line II' in FIG. Figure 4 It is shown Figure 3 An enlarged view of area A in FIG. Figure 5 is along Figure 1 A cross-sectional view taken along line II-II'; Figure 6 is shown corresponding to Figure 3 A diagram of a coil component according to a second embodiment of the present disclosure; and Figures 7 to 10 are diagrams showing a process of manufacturing the coil component of the first embodiment of the present disclosure. DETAILED DESCRIPTION

[0010] Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings.

[0011] However, the present disclosure can be illustrated in many different forms and should not be construed as being limited to the specific embodiments set forth herein. Unless there is a significantly different meaning in the context, the expression used in the singular encompasses the expression of the plural. The terms "comprise", "include", "be constructed as", etc. of the specification are used to indicate the presence of features, quantities, steps, operations, elements, parts, or combinations thereof, and do not exclude the possibility of the presence or addition of one or more features, quantities, steps, operations, elements, parts, or combinations thereof. In addition, the expression that the element is set "on..." may indicate that the element may be set above or below the target portion, and does not necessarily indicate that the element is set above the target portion in the direction of gravity.

[0012] It should be understood that when an element is “coupled” or “connected” to another element, the element can be directly coupled to / connected to the other element, and there can be intervening elements between the element and the other element. In contrast, it should be understood that when an element is “directly coupled” to or “directly connected to” another element, there are no intervening elements between the element and the other element.

[0013] The structures, shapes, and sizes described as examples in the embodiments in the present disclosure may be implemented in another exemplary embodiment without departing from the spirit and scope of the present disclosure.

[0014] In the drawings, a T direction may be defined as a first direction or a thickness direction, an L direction may be defined as a second direction or a length direction, and a W direction may be defined as a third direction or a width direction.

[0015] In the accompanying drawings, the same elements will be denoted by the same reference numerals. In addition, repeated descriptions and detailed descriptions of known functions and elements that may unnecessarily obscure the gist of the present disclosure will not be provided.

[0016] Various types of electronic components are used in electronic devices, and various types of coil components may be appropriately used between these electronic components for the purpose of removing noise.

[0017] That is, in electronic devices, coil components can be used as power inductors, high-frequency inductors, ordinary magnetic beads, high-frequency magnetic beads (for example, magnetic beads suitable for GHz bands), common mode filters, etc.

[0018] First embodiment Figure 1 is a perspective view showing a coil component according to a first embodiment. Figure 2 It is shown Figure 1 An exploded perspective view of a portion of the coil assembly shown in FIG. Figure 3 is along Figure 1 A cross-sectional view taken along line II' in FIG. Figure 4 It is shown Figure 3 Magnified view of area A in FIG. Figure 5 It is along Figure 1 A cross-sectional view taken along line II-II'.

[0019] exist Figure 1 In the embodiment, the outer insulating layer 600 on the body 100 , which may be applied to the embodiment, may not be provided to clearly show the connection between the components.

[0020] The coil component 1000 according to the embodiment may not include a substrate therein, and may include a plurality of coil layers 310 , 320 , 330 , and 340 sequentially stacked and insulating layers 210 , 220 , and 230 disposed between the coil layers.

[0021] The coil component 1000 according to the embodiment can improve the inductance characteristics by increasing the number of turns of the coil by the multi-layer coil structure, and more magnetic material of a volume corresponding to the volume occupied by the substrate can be provided in the body 100, and as the effective volume increases, the inductance characteristics and the saturation current characteristics (I sat ).

[0022] In addition, according to the embodiment, the coil component 1000 may include connecting parts 410 and 420 in the main body 100, and the connecting parts 410 and 420 respectively connect the coil 300 to the external electrodes 510 and 520, and the connecting parts 410 and 420 may be pre-formed and may be fused with the coil 300, and magnetic sheets may be stacked to form the main body 100.

[0023] The coil component 1000 according to the embodiment may realize an electrode structure in which the external electrodes 510 and 520 may be disposed on the lower surface (ie, the first surface 101) of the body 100, so that as the effective volume of the coil component 1000 increases, the inductance characteristics may be improved and the saturation current characteristics (I sat ).

[0024] Furthermore, a process for realizing the lower surface electrode may be simplified, and the height of the connection parts 410 and 420 may be controlled compared to an example in which the connection parts 410 and 420 may be plated from the coil 300 toward the external electrodes 510 and 520 .

[0025] In addition, since the welded portions 410W and 420W are formed by welding between the coil 300 and the connection portions 410 and 420 , physical coupling force and connection reliability between the coil 300 and the connection portions 410 and 420 may be improved.

[0026] In the following description, main components included in the coil component 1000 according to the embodiment will be described in more detail.

[0027] Reference Figures 1 to 5 , the coil component 1000 according to the first embodiment may include: a body 100; insulating layers 210, 220 and 230; a coil 300; external electrodes 510 and 520; and connecting parts 410 and 420 connecting the coil 300 to the external electrodes 510 and 520, respectively.

[0028] The body 100 may form an appearance of the coil component 1000 in the embodiment, and the coil 300 may be disposed in the body 100. The coil 300 may be supported by the insulating layers 210, 220, and 230.

[0029] The body 100 may have a hexahedral shape.

[0030] The body 100 may include a first surface 101 and a second surface 102 opposite to each other in a thickness direction T, a third surface 103 and a fourth surface 104 opposite to each other in a length direction L, and a fifth surface 105 and a sixth surface 106 opposite to each other in a width direction W. Each of the third surface 103, the fourth surface 104, the fifth surface 105, and the sixth surface 106 of the body 100 may be a wall surface of the body 100 connecting the first surface 101 and the second surface 102 of the body 100.

[0031] The body 100 may be formed so that the coil component formed with the external electrodes 510 and 520 may have a length of 2.5 mm, a width of 2.0 mm, and a thickness of 0.8 mm, a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.6 mm, a length of 1.6 mm, a width of 0.8 mm, and a thickness of 0.6 mm, a length of 1.6 mm, a width of 0.8 mm, and a thickness of 0.4 mm, a length of 1.4 mm, a width of 1.2 mm, and a thickness of 0.65 mm, a length of 1.0 mm, a width of 0.7 mm, and a thickness of 0.65 mm, a length of 0.8 mm, a width of 0.4 mm, and a thickness of 0.65 mm, or a length of 0.8 mm, a width of 0.4 mm, and a thickness of 0.5 mm, but embodiments thereof are not limited thereto. Since the above exemplary dimensions of the length, width, and thickness of the coil component 1000 may refer to dimensions that do not reflect process errors, dimensions within a range identified as process errors may be within the scope of the present disclosure.

[0032] The length of the coil component 1000 may be: relative to an optical microscope image or a scanning electron microscope (SEM) image obtained from a cross section of the coil component 1000 in the length direction L-thickness direction T taken from the central portion of the coil component 1000 in the width direction W, the maximum value of the sizes of the multiple line segments connecting the two outermost boundary lines of the coil component 1000 opposite to each other in the length direction L and parallel to the length direction L. Optionally, the length of the coil component 1000 may refer to the minimum value of the sizes of the multiple line segments. Optionally, the length of the coil component 1000 may refer to the arithmetic mean of at least three of the sizes of the multiple line segments. Here, the multiple line segments parallel to the length direction L may be spaced apart from each other by equal distances in the thickness direction T, but embodiments thereof are not limited thereto.

[0033] The thickness of the coil component 1000 is the maximum value of the dimensions of the plurality of line segments that connect the two outermost boundary lines of the coil component 1000 that are opposite to each other in the thickness direction T and are parallel to the thickness direction T, relative to an optical microscope image or a scanning electron microscope (SEM) image obtained from a cross section of the coil component 1000 in the length direction L-thickness direction T taken from the central portion of the coil component 1000 in the width direction W. Optionally, the thickness of the coil component 1000 may refer to the minimum value of the dimensions of the plurality of line segments. Optionally, the thickness of the coil component 1000 may refer to the arithmetic mean of at least three of the dimensions of the plurality of line segments. Here, the plurality of line segments parallel to the thickness direction T may be spaced apart from each other by equal distances in the length direction L, but embodiments thereof are not limited thereto.

[0034] The width of the coil component 1000 may be: relative to an optical microscope image or a scanning electron microscope (SEM) image obtained from a cross section of the coil component 1000 in the length direction L-width direction W taken from the central portion of the coil component 1000 in the thickness direction T, the maximum value of the sizes of multiple line segments connecting the two outermost boundary lines of the coil component 1000 opposite to each other in the width direction W and parallel to the width direction W. Optionally, the width of the coil component 1000 may refer to the minimum value of the sizes of the multiple line segments. Optionally, the width of the coil component 1000 may refer to the arithmetic mean of at least three of the sizes of the multiple line segments. Here, the multiple line segments parallel to the width direction W may be spaced apart from each other by equal distances in the length direction L, but embodiments thereof are not limited thereto.

[0035] Optionally, each of the length, width and thickness of the coil component 1000 can be measured by a micrometer measurement method. The micrometer measurement method can be measured using a micrometer with metrological repeatability and reproducibility (R&R) by the following method: setting a zero point, inserting the coil component 1000 in the embodiment between the tips of the micrometer, and rotating the measuring rod of the micrometer. When measuring the length of the coil component 1000 by the micrometer measurement method, the length of the coil component 1000 may refer to a value measured once, or may refer to an arithmetic mean of values ​​measured multiple times, which may also be applicable to the measurement of the width and thickness of the coil component 1000.

[0036] The body 100 may include a magnetic material and a resin. Specifically, the body 100 may be formed by laminating one or more magnetic composite sheets in which a magnetic material is dispersed in an insulating resin. The magnetic material may be ferrite or magnetic metal particles.

[0037] The ferrite may be, for example, at least one of spinel ferrite (such as Mg-Zn-based ferrite, Mn-Zn-based ferrite, Mn-Mg-based ferrite, Cu-Zn-based ferrite, Mg-Mn-Sr-based ferrite, Ni-Zn-based ferrite), hexagonal ferrite (such as Ba-Zn-based ferrite, Ba-Mg-based ferrite, Ba-Ni-based ferrite, Ba-Co-based ferrite, Ba-Ni-Co-based ferrite), garnet-type ferrite (such as Y-type ferrite) and Li-based ferrite.

[0038] The magnetic metal particles may include one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the magnetic metal particles may be at least one of pure iron particles, Fe-Si alloy particles, Fe-Si-Al alloy particles, Fe-Ni alloy particles, Fe-Ni-Mo alloy particles, Fe-Ni-Mo-Cu alloy particles, Fe-Co alloy particles, Fe-Ni-Co alloy particles, Fe-Cr alloy particles, Fe-Cr-Si alloy particles, Fe-Si-Cu-Nb alloy particles, Fe-Ni-Cr-based alloy particles, and Fe-Cr-Al alloy particles.

[0039] The magnetic metal particles may be amorphous or crystalline. For example, the magnetic metal particles may be Fe-Si-B-Cr amorphous alloy particles, but the embodiment is not limited thereto.

[0040] The ferrite and the magnetic metal particles may have an average diameter of about 0.1 μm to about 30 μm, but the embodiment is not limited thereto.

[0041] The body 100 may include different types (eg, two or more types) of magnetic materials dispersed in a resin. Here, different types of magnetic materials may refer to magnetic materials dispersed in a resin that can be distinguished from each other by one of average diameter, composition, crystallinity, and shape.

[0042] Hereinafter, description will be made on the premise that the magnetic material is magnetic metal particles, but the present disclosure is not limited to the body 100 having only a structure in which the magnetic metal particles are dispersed in the insulating resin.

[0043] The insulating resin may include epoxy resin, polyimide, liquid crystal polymer, etc., alone or in combination, but the embodiment is not limited thereto.

[0044] Reference Figure 3 and Figure 5 , the body 100 may include a core 110 penetrating the insulating layers 210, 220, and 230 and the coil 300. The core 110 may be disposed in a central region of an innermost turn of the coil 300 (ie, in a central region of a winding of the coil 300).

[0045] The core 110 may be formed by filling a through hole penetrating the center of the coil 300 and the centers of the insulating layers 210 , 220 , and 230 with a magnetic composite sheet including a magnetic material, but the embodiment is not limited thereto.

[0046] Reference Figure 3 and Figure 5 , the coil component 1000 according to the embodiment may include a body interface surface BI formed in the body 100 and perpendicular to the first direction T.

[0047] A height Hb of the body interface surface BI relative to the first surface 101 of the body 100 (eg, a distance between the body interface surface BI and the first surface 101 in the first direction T) may be less than or equal to a distance Hc between the first coil layer 310 and the first surface 101 of the body 100 .

[0048] Here, the height Hb of the body interface surface BI may refer to: relative to an optical microscope image or a scanning electron microscope (SEM) image obtained from a cross section in the length direction L-thickness direction T of the coil component 1000 intercepted from the center of the coil component 1000 in the third direction W, the arithmetic mean of at least three dimensions of dimensions of a plurality of line segments connecting the body interface surface BI shown in the cross-sectional image to the first surface 101 of the body 100 in the thickness direction T and parallel to the thickness direction T. Here, the plurality of line segments parallel to the thickness direction T may be spaced apart from each other by equal distances in the length direction (longitudinal direction) L, but embodiments thereof are not limited thereto.

[0049] In addition, the distance Hc between the first coil layer 310 and the first surface 101 of the body 100 may refer to: the arithmetic mean of at least three dimensions of the dimensions of a plurality of line segments connecting the lower surface of the first coil pattern 311 shown in the image of the cross section with the first surface 101 of the body 100 in the thickness direction T and parallel to the thickness direction T. Here, the plurality of line segments parallel to the thickness direction T may be spaced apart from each other by equal distances in the longitudinal direction L, but embodiments thereof are not limited thereto.

[0050] The body interface surface BI in the embodiment may be formed in a region between the first coil layer 310 and the first surface 101 of the body 100 and may be caused by performing a process of forming the body 100 in two stages. The detailed process sequence will be described later.

[0051] The coil 300 may be disposed in the body 100 and may exhibit characteristics of the coil component 1000. For example, when the coil component 1000 in the embodiment may be used as a power inductor, the coil 300 may store an electric field as a magnetic field and maintain an output voltage, thereby stabilizing power supply of an electronic device.

[0052] The coil 300 of the coil component 1000 according to the embodiment may have a structure of four or more layers, and may include a first coil layer 310, a second coil layer 320, a third coil layer 330, and a fourth coil layer 340 stacked in sequence. Each of the coil layers 310, 320, 330, and 340 may have at least one turn wound around the core 110.

[0053] Reference Figures 1 to 3 as well as Figure 5, the first coil layer 310 in the embodiment may include a first coil pattern 311 having at least one turn, a first lead-out portion 310L extending from the first coil pattern 311 and contacting the first connection portion 410 , and a first sub-lead-out portion 310S spaced apart from the first coil pattern 311 .

[0054] Here, the first lead out portion 310L may be a component electrically connecting the first coil pattern 311 to the first external electrode 510 , and the first sub lead out portion 310S may be configured as an electrical connection path between the second lead out portion 340L and the second external electrode 520 .

[0055] In addition, the second coil layer 320 in the embodiment is arranged on the first coil layer 310, and may include a second coil pattern 321 having at least one turn, a second sub-lead-out portion 320S spaced apart from the second coil pattern 321, and may also include a first dummy pattern 320D spaced apart from the second coil pattern 321.

[0056] Here, the second sub lead-out portion 320S may be configured as an electrical connection path between the second lead-out portion 340L and the second external electrode 520 , and the first dummy pattern 320D is not associated with the electrical connection.

[0057] Since the second coil layer 320 includes the first dummy pattern 320D, the shapes of the coil layers 310, 320, 330 and 340 can become similar, thereby improving the efficiency of the process of forming the coil 300, and the area of ​​the coil 300 adjacent to the third surface 103 of the main body 100 and the area of ​​the coil 300 adjacent to the fourth surface 104 of the main body 100 can have a symmetrical shape relative to a plane in the first direction T and the third direction W passing through the center of the main body 100 in the second direction L, thereby preventing appearance defects of the coil component 1000.

[0058] In addition, the third coil layer 330 in the embodiment is arranged on the second coil layer 320, and may include a third coil pattern 331 having at least one turn and a third sub-lead-out portion 330S spaced apart from the third coil pattern 331, and may also include a second dummy pattern 330D spaced apart from the third coil pattern 331.

[0059] Here, the third sub lead out portion 330S may be configured as an electrical connection path between the second lead out portion 340L and the second external electrode 520 , and the second dummy pattern 330D is not associated with the electrical connection.

[0060] Since the third coil layer 330 includes the second dummy pattern 330D, the shapes of the coil layers 310, 320, 330 and 340 can become similar, thereby improving the efficiency of the process of forming the coil 300, and the area of ​​the coil 300 adjacent to the third surface 103 of the main body 100 and the area of ​​the coil 300 adjacent to the fourth surface 104 of the main body 100 can have a symmetrical shape relative to a plane in the first direction T and the third direction W passing through the center of the main body 100 in the second direction L, thereby preventing appearance defects of the coil component 1000.

[0061] In addition, the fourth coil layer 340 in the embodiment is arranged on the third coil layer 330, and may include a fourth coil pattern 341 having at least one turn, a second lead-out portion 340L extending from the fourth coil pattern 341 and electrically connected to the second external electrode 520, and may also include a third dummy pattern 340D spaced apart from the fourth coil pattern 341.

[0062] Here, the second lead out portion 340L may be electrically connected to the second external electrode 520 through the sub vias SV1 , SV2 , and SV3 , the sub lead out portions 310S, 320S, and 330S, and the second connection portion 420 , and the third dummy pattern 340D is not associated with the electrical connection.

[0063] Since the fourth coil layer 340 includes the third dummy pattern 340D, the shapes of the coil layers 310, 320, 330 and 340 can become similar, thereby improving the efficiency of the process of forming the coil 300, and the area of ​​the coil 300 adjacent to the third surface 103 of the main body 100 and the area of ​​the coil 300 adjacent to the fourth surface 104 of the main body 100 can have a symmetrical shape relative to a plane in the first direction T and the third direction W passing through the center of the main body 100 in the second direction L, thereby preventing appearance defects of the coil component 1000.

[0064] Reference Figure 2 and Figure 5 , the coil layers 310 , 320 , 330 , and 340 in the embodiment may be connected to each other through vias V1 , V2 , and V3 .

[0065] Specifically, the coil 300 in the embodiment may include a first via V1 connecting the inner end of the first coil pattern 311 and the inner end of the second coil pattern 321 to each other, a second via V2 connecting the outer end of the second coil pattern 321 and the outer end of the third coil pattern 331 to each other, and a third via V3 connecting the inner end of the third coil pattern 331 and the inner end of the fourth coil pattern 341 to each other.

[0066] Relative to Figure 5In the direction of the first coil pattern 311, a lower surface of the first via hole V1 may be connected to an end of the innermost turn of the first coil pattern 311, and an upper surface of the first via hole V1 may be connected to an end of the innermost turn of the second coil pattern 321. The first via hole V1 may penetrate the first insulating layer 210, and when the first via hole V1 is formed by irradiating a laser downward, the first via hole V1 may have a tapered shape whose lower surface has a relatively narrow width.

[0067] In addition, a lower surface of the second via hole V2 may be connected to an end of an outermost turn of the second coil pattern 321, and an upper surface of the second via hole V2 may be connected to an end of an outermost turn of the third coil pattern 331. The second via hole V2 may penetrate the second insulating layer 220, and when the second via hole V2 is formed by irradiating a laser downward, the second via hole V2 may have a tapered shape whose lower surface has a relatively narrow width.

[0068] In addition, a lower surface of the third via hole V3 may be connected to an end of the innermost turn of the third coil pattern 331, and an upper surface of the third via hole V3 may be connected to an end of the innermost turn of the fourth coil pattern 341. The third via hole V3 may penetrate the third insulating layer 230, and when the third via hole V3 is formed by irradiating laser downward, the third via hole V3 may have a tapered shape whose lower surface has a relatively narrow width.

[0069] Reference Figure 2 and Figure 3 , the second lead-out portion 340L and the sub-lead-out portions 310S, 320S, and 330S in the embodiment may be connected to each other through the sub-vias SV1 , SV2 , and SV3 .

[0070] Specifically, the coil 300 in the embodiment may include a first sub-via SV1 connecting the first sub-lead-out portion 310S and the second sub-lead-out portion 320S to each other, a second sub-via SV2 connecting the second sub-lead-out portion 320S and the third sub-lead-out portion 330S to each other, and a third sub-via SV3 connecting the third sub-lead-out portion 330S to the second lead-out portion 340L.

[0071] Relative to Figure 3 In the direction of the first sub via hole SV1, a lower surface of the first sub via hole SV1 may be connected to the first sub lead-out portion 310S, and an upper surface of the first sub via hole SV1 may be connected to the second sub lead-out portion 320S. The first sub via hole SV1 may penetrate the first insulating layer 210, and when the first sub via hole SV1 is formed by irradiating laser downward, the first sub via hole SV1 may have a tapered shape whose lower surface has a relatively narrow width.

[0072] In addition, a lower surface of the second sub-via hole SV2 may be connected to the second sub-lead-out portion 320S, and an upper surface of the second sub-via hole SV2 may be connected to the third sub-lead-out portion 330S. The second sub-via hole SV2 may penetrate the second insulating layer 220, and when the second sub-via hole SV2 is formed by irradiating laser downward, the second sub-via hole SV2 may have a tapered shape whose lower surface has a relatively narrow width.

[0073] In addition, a lower surface of the third sub-via hole SV3 may be connected to the third sub-lead-out portion 330S, and an upper surface of the third sub-via hole SV3 may be connected to the second lead-out portion 340L. The third sub-via hole SV3 may penetrate the third insulating layer 230, and when the third sub-via hole SV3 is formed by irradiating laser downward, the third sub-via hole SV3 may have a tapered shape whose lower surface has a relatively narrow width.

[0074] However, the shape of each of the first via hole V1, the second via hole V2, and the third via hole V3 and the first sub-via hole SV1, the second sub-via hole SV2, and the third sub-via hole SV3 is not limited to a tapered shape having a relatively narrow lower surface, and the area of ​​a cross-section (e.g., a cross-section perpendicular to the thickness direction T) of each of the first via hole V1, the second via hole V2, and the third via hole V3 and the first sub-via hole SV1, the second sub-via hole SV2, and the third sub-via hole SV3 may have the same shape in the thickness direction T according to the thickness of the insulating layers 210, 220, and 230 and the laser intensity.

[0075] Reference Figure 2 , for example, when the coil component 1000 is mounted on a circuit board and a signal is input to the first external electrode 510 , the input signal may be applied to the coil 300 through the first connection portion 410 , and may be output to the second external electrode 520 through the second connection portion 420 .

[0076] More specifically, the signal input to the first external electrode 510 can be output to the second external electrode 520 by passing through the first connecting portion 410, the first lead-out portion 310L, the first coil pattern 311, the first via V1, the second coil pattern 321, the second via V2, the third coil pattern 331, the third via V3, the fourth coil pattern 341, the second lead-out portion 340L, the third sub-via SV3, the third sub-lead-out portion 330S, the second sub-via SV2, the second sub-lead-out portion 320S, the first sub-via SV1, the first sub-lead-out portion 310S and the second connecting portion 420 in sequence.

[0077] Therefore, the coil 300 may be used as a coil between the first connection portion 410 and the second connection portion 420 .

[0078] Reference Figure 3 and Figure 5, each of the second coil layer 320, the third coil layer 330, and the fourth coil layer 340 may include a seed layer SL. That is, the first coil layer 310 in the embodiment may not include the seed layer SL, the seed layer SL may be related to a process described later, and the first coil layer 310 may be formed on a copper-clad laminate, and the copper-clad laminate may be removed after the second coil layer 320, the third coil layer 330, and the fourth coil layer 340 are sequentially formed, so that the first coil layer 310 may not include the seed layer SL, but the embodiment is not limited thereto.

[0079] The side surface of the seed layer SL in the embodiment may be in contact with the body 100. In other words, both side surfaces of the seed layer SL may be exposed toward the inner region of the body 100, and both side surfaces of the seed layer SL may not be covered by the plating layer other than the seed layer SL in each of the second coil layer 320, the third coil layer 330, and the fourth coil layer 340.

[0080] At least one of the coil patterns 311 , 321 , 331 , and 341 , the vias V1 , V2 , and V3 , the lead-out portions 310L and 340L, the sub lead-out portions 310S, 320S, and 330S, the sub vias SV1 , SV2 , and SV3 , and the dummy patterns 320D, 330D, and 340D may include at least one conductive layer.

[0081] As an example, when the second coil pattern 321, the first via V1, the second sub-lead-out portion 320S, the first sub-via SV1 and the first dummy pattern 320D are formed by plating, each of the second coil pattern 321, the first via V1, the second sub-lead-out portion 320S, the first sub-via SV1 and the first dummy pattern 320D may include a seed layer SL and a plating layer.

[0082] Here, the electroplating layer may have a single-layer structure or a multi-layer structure. The electroplating layer having a multi-layer structure may be formed into a conformal film structure in which one electroplating layer is covered by another electroplating layer, or may be formed into a shape in which another electroplating layer is stacked only on one surface of one electroplating layer. The seed layer SL may be formed by electroless plating or a vapor deposition method such as sputtering.

[0083] The seed layer SL of each of the second coil pattern 321, the first via hole V1, the second sub lead-out portion 320S, the first sub via hole SV1, and the first dummy pattern 320D may be integrally formed so that no boundary may be formed therebetween, but embodiments are not limited thereto. The plating layer of each of the second coil pattern 321, the first via hole V1, the second sub lead-out portion 320S, the first sub via hole SV1, and the first dummy pattern 320D may be integrally formed so that no boundary may be formed therebetween, but embodiments are not limited thereto.

[0084] The coil patterns 311, 321, 331 and 341, the vias V1, V2 and V3, the lead-out portions 310L and 340L, the sub-lead-out portions 310S, 320S and 330S, the sub-vias SV1, SV2 and SV3 and the dummy patterns 320D, 330D and 340D may be formed using a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), chromium (Cr), titanium (Ti) or alloys thereof, but embodiments thereof are not limited thereto.

[0085] Reference Figure 3 and Figure 5 , the coil component 1000 according to the embodiment may include insulating layers 210 , 220 , and 230 respectively disposed in regions between the first coil layer 310 , the second coil layer 320 , the third coil layer 330 , and the fourth coil layer 340 .

[0086] The insulating layers 210 , 220 , and 230 may be configured to insulate the coil layers 310 , 320 , 330 , and 340 from one another.

[0087] Specifically, the insulating layers 210 , 220 , and 230 may include a first insulating layer 210 disposed between the first coil layer 310 and the second coil layer 320 , a second insulating layer 220 disposed between the second coil layer 320 and the third coil layer 330 , and a third insulating layer 230 disposed between the third coil layer 330 and the fourth coil layer 340 .

[0088] The seed layer SL may be disposed on the insulating layers 210 , 220 , and 230 , and the insulating layers 210 , 220 , and 230 may be penetrated by the via holes V1 , V2 , and V3 and the sub via holes SV1 , SV2 , and SV3 .

[0089] The insulating layers 210 , 220 , and 230 may be formed using a thermosetting insulating resin such as epoxy resin, a thermoplastic insulating resin such as polyimide, an insulating material including a photosensitive insulating resin, or an insulating material prepared by impregnating a reinforcing material in an insulating resin.

[0090] For example, the insulating layers 210, 220, and 230 may be formed using a film-type insulating material such as a prepreg, an Ajinomoto built-up film (ABF), and a photosensitive dielectric (PID) film, but the embodiment is not limited thereto. The insulating layers 210, 220, and 230 may be formed by coating a liquid insulating resin and curing the insulating resin.

[0091] As another example, the insulating layers 210 , 220 , and 230 may include a commonly used insulating material such as parylene, and may be formed by a method such as vapor deposition.

[0092] Reference Figures 1 to 4, the coil component 1000 according to the embodiment may include connection parts 410 and 420 connecting the first and second external electrodes 510 and 520 to the coil 300 , respectively.

[0093] The connection parts 410 and 420 may be provided in the body 100, and may be configured to electrically connect the coil 300 to the external electrodes 510 and 520. Compared with the L-shaped electrodes provided on the third surface 103 and the fourth surface 104 of the body 100 and extending to the first surface 101, the path along which the current flows between the external electrodes 510 and 520 on the first surface 101 of the body 100 and the coil 300 is shortened, so that the DC resistance component (R dc ) can be reduced.

[0094] The first connection portion 410 may include one surface contacting the first coil layer 310 and another surface contacting the first external electrode 510 , and the second connection portion 420 may include one surface contacting the first coil layer 310 and another surface contacting the second external electrode 520 .

[0095] In addition, the connecting parts 410 and 420 may each include a side surface connecting one surface to the other surface, and may have a cylindrical shape. However, embodiments thereof are not limited thereto, and the connecting parts 410 and 420 may have various shapes, such as a tapered shape with a cross-sectional area gradually widening downward, a tapered shape with a cross-sectional area gradually narrowing downward, or a prism shape.

[0096] The connection parts 410 and 420 in the embodiment may be formed by electroplating and may include a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), chromium (Cr), titanium (Ti) and / or alloys thereof, but the embodiment is not limited thereto.

[0097] In the coil component 1000 according to the embodiment, the connection parts 410 and 420 connecting the external electrodes 510 and 520 in the first direction T may be formed separately from the coil 300 , and the first coil layer 310 and the connection parts 410 and 420 may be welded to each other.

[0098] Therefore, the connection parts 410 and 420 in the embodiment may include welding parts 410W and 420W, which are formed at the ends of the connection parts 410 and 420 and contact the first coil layer 310. Here, the welding parts 410W and 420W may correspond to the areas formed by welding between the connection parts 410 and 420 and the first coil layer 310 by resistance welding, laser welding or ultrasonic welding. For ease of description, Figure 4 The dotted lines in φ represent the boundary lines of the welded portions 410W and 420W within the connection portions 410 and 420 .

[0099] Reference Figure 3 The first connection portion 410 may connect the first external electrode 510 to the first lead-out portion 310L in the body 100 , and the first connection portion 410 may include a first welding portion 410W formed at an end of the first connection portion 410 and contacting the first lead-out portion 310L.

[0100] In addition, the second connection portion 420 may connect the second external electrode 520 to the first sub lead out portion 310S in the body 100 , and may include a second welding portion 420W formed at an end of the second connection portion 420 and contacting the first sub lead out portion 310S.

[0101] When welded with the first coil layer 310 by resistance welding, laser welding, or ultrasonic welding, the welded portions 410W and 420W in the embodiment may have a partially deformed shape due to heat and pressure.

[0102] Figure 4 It is shown Figure 3 Magnified view of area A in FIG.

[0103] Reference Figure 3 and Figure 4 , the first connection portion 410 may include a first fusion portion 410W contacting the first lead-out portion 310L, and at least a portion of the first fusion portion 410W may be embedded (eg, embedded inwardly) in the first lead-out portion 310L.

[0104] Similarly, the second connection portion 420 may include a second fusion portion 420W contacting the first sub lead-out portion 310S, and at least a portion of the second fusion portion 420W may be embedded (eg, inwardly embedded) in the first sub lead-out portion 310S.

[0105] For example, when the first welding portion 410W and the first lead-out portion 310L and the second welding portion 420W and the first sub-lead-out portion 310S are welded to each other by resistance welding, at least a portion of the first welding portion 410W and the second welding portion 420W may be embedded in the first lead-out portion 310L and the first sub-lead-out portion 310S, respectively, due to heat generated according to the current and pressure in the first direction T.

[0106] Reference Figure 4 , the first welding portion 410W may have a shape in which a portion of an upper surface is widened by pressure in the first direction T, and thus, at least a portion of the first welding portion 410W may protrude toward the body 100 .

[0107] Similarly, the second welding portion 420W may also have a shape in which at least a portion protrudes toward the body 100 .

[0108] Therefore, relative to an optical microscope image or a scanning electron microscope (SEM) image obtained from a cross section of the coil component 1000 in the length direction L-thickness direction T taken from the center of the coil component 1000 in the third direction W, at least a portion of the weld portions 410W and 420W may protrude toward the body 100 in the second direction L.

[0109] For example, when the welded portions 410W and 420W and the first coil layer 310 are welded to each other by resistance welding, at least a portion of the welded portions 410W and 420W may protrude toward the body 100 due to heat generated according to current and pressure in the first direction T.

[0110] Reference Figure 3 and Figure 4 , an interface surface may be formed between the welding parts 410W and 420W and the first coil layer 310. Specifically, an interface surface may be formed between the first welding part 410W and the first lead-out part 310L, and an interface surface may be formed between the second welding part 420W and the first sub-lead-out part 310S.

[0111] Traces of changes in crystal structure due to the metal particles being melted by heat may be observed on the interface surface between the welded parts 410W and 420W and the first coil layer 310 .

[0112] Furthermore, in the embodiment, an uneven surface US may be included in the interface surface between the fusion parts 410W and 420W and the first coil layer 310 .

[0113] Reference Figure 4 , the interface surface of the first welding portion 410W in contact with the first lead portion 310L may include an irregular uneven surface US. For example, when the first welding portion 410W and the first lead portion 310L are welded to each other by resistance welding, the heat generated by the current and the pressure in the first direction T may form an irregular uneven surface US on the interface surface between the first welding portion 410W and the first lead portion 310L. On the other hand, another portion of the surface of the first lead portion 310L that is not in contact with the first welding portion 410W and surrounds the interface surface between the first lead portion 310L and the first welding portion 410W may not have the irregular uneven surface US. Even if another portion of the surface of the first lead portion 310L that is not in contact with the first welding portion 410W and surrounds the interface surface between the first lead portion 310L and the first welding portion 410W may have some irregular uneven surfaces, the degree of unevenness of such irregular uneven surfaces may be less than the degree of unevenness of the irregular uneven surface US.

[0114] In the coil component 1000 according to the embodiment, the contact area between the welding parts 410W and 420W and the first coil layer 310 can be increased due to the uneven surface US, so that the physical bonding force and the electrical connection reliability can be increased, and the DC resistance component R dc It can also be reduced.

[0115] Reference Figures 1 to 3 , the first and second external electrodes 510 and 520 may be spaced apart from each other on the first surface 101 of the body 100 , and may be connected to the coil 300 through the first and second connection portions 410 and 420 , respectively.

[0116] Reference Figure 3 , the external electrodes 510 and 520 may be formed in a multi-layer structure.

[0117] As an example, the first external electrode 510 may include a first layer 511 disposed on the main body 100, and a second layer 512 disposed on the first layer 511, and may also include a third layer 513 disposed on the second layer 512, and the second external electrode 520 may include a first layer 521 disposed on the main body 100, and a second layer 522 disposed on the first layer 521, and may also include a third layer 523 disposed on the second layer 522.

[0118] At least one of the second layer 512 and the third layer 513 may be formed in a shape covering the first layer 511 , and at least one of the second layer 522 and the third layer 523 may be formed in a shape covering the first layer 521 , but the embodiment is not limited thereto.

[0119] The first layers 511 and 521 may be copper (Cu) plated layers or conductive resin layers including conductive particles and insulating resin, the conductive particles including at least one of copper (Cu) and silver (Ag).

[0120] The second layers 512 and 522 may be plated layers including nickel (Ni), and the third layers 513 and 523 may be plated layers including tin (Sn), but embodiments thereof are not limited thereto, and the second layer 512 and the third layer 513 may be integrally formed in the form of an alloy of nickel (Ni) and tin (Sn), and the second layer 522 and the third layer 523 may be integrally formed in the form of an alloy of nickel (Ni) and tin (Sn).

[0121] The first and second external electrodes 510 and 520 may be formed by a vapor deposition method such as sputtering and / or a plating method, but the embodiment is not limited thereto.

[0122] The first and second external electrodes 510 and 520 may be formed using a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), chromium (Cr), titanium (Ti), or alloys thereof, but embodiments are not limited thereto.

[0123] Reference Figure 3 and Figure 5 , the coil component 1000 according to the embodiment may further include an outer insulating layer 600 covering the surface of the body 100 and exposing the external electrodes 510 and 520 .

[0124] Specifically, the external insulating layer 600 in the embodiment may cover at least a portion of the first surface 101 of the body 100 and may expose the first external electrode 510 and the second external electrode 520, and may extend to cover at least a portion of the second surface 102, the third surface 103, the fourth surface 104, the fifth surface 105 and the sixth surface 106 of the body 100.

[0125] In an embodiment, each of the external insulating layers 600 disposed on the first surface 101, the second surface 102, the third surface 103, the fourth surface 104, the fifth surface 105 and the sixth surface 106 of the body 100 may be formed in the same process and may have a shape without a boundary therebetween, but embodiments thereof are not limited thereto, and the external insulating layers 600 may be formed in different processes and boundaries may be formed between the external insulating layers 600 on each surface.

[0126] The outer insulating layer 600 may be formed by a printing method, a vapor deposition method, a spraying method, or a film stacking method, but embodiments thereof are not limited thereto.

[0127] The outer insulating layer 600 may include a thermoplastic resin (such as polystyrene resin, vinyl acetate resin, polyester resin, polyethylene resin, polypropylene resin, polyamide resin, rubber resin, and acrylic resin), a thermosetting resin (such as phenolic resin, epoxy resin, polyurethane resin, melamine resin, alkyd resin, etc.), a photosensitive resin, polyparaxylene, SiO x or SiN x The outer insulating layer 600 may further include an insulating filler such as an inorganic filler, but the embodiment is not limited thereto.

[0128] Second embodiment Figure 6 is shown with Figure 3 Corresponding figure of a coil assembly according to a second embodiment.

[0129] Figure 6 and Figure 3The difference between the two is that the second coil layer 320, the third coil layer 330 and the fourth coil layer 340 in the coil component 2000 according to the second embodiment do not include the dummy patterns 320D, 330D and 340D, and the body 100 in the coil component 2000 is formed integrally and does not form the body interface surface BI. That is, referring to Figure 6 , because the coil 300 can be different in the area adjacent to the third surface 103 of the body 100 and the area adjacent to the fourth surface 104 of the body 100, the coil 300 can have an asymmetric shape, and the inner area of ​​the body 100 can be integrally formed without the body interface surface BI.

[0130] Therefore, when describing the embodiment, only the shape of the body 100 and the region of the coil 300 adjacent to the third surface 103 of the body 100 that are different from those of the first embodiment will be described. The description in the first embodiment may be applicable to other components in the embodiment.

[0131] Reference Figure 6 , only the first lead-out portion 310L of the first coil layer 310 may be disposed in an area of ​​the coil 300 adjacent to the third surface 103 of the body 100, and the dummy patterns 320D, 330D, and 340D may not be disposed on the second coil layer 320, the third coil layer 330, and the fourth coil layer 340, respectively.

[0132] Therefore, the shape of each of the second coil layer 320 , the third coil layer 330 , and the fourth coil layer 340 may be formed differently from the shape of the first coil layer 310 .

[0133] In the coil component 2000 according to the embodiment, the dummy patterns 320D, 330D and 340D that do not affect the electrical connection can be removed, so that a magnetic material arrangement space equal to the volume occupied by the dummy patterns 320D, 330D and 340D can be ensured, and thus the effective volume can be increased, so that the improvement effect of inductance can be increased.

[0134] Figure 6 The structure after the first dummy pattern 320D of the second coil layer 320, the second dummy pattern 330D of the third coil layer 330 and the third dummy pattern 340D of the fourth coil layer 340 are removed is shown, but the embodiments thereof are not limited thereto, and at least one of the first dummy pattern 320D of the second coil layer 320, the second dummy pattern 330D of the third coil layer 330 and the third dummy pattern 340D of the fourth coil layer 340 may be removed and the other components may be retained.

[0135] For example, the first dummy pattern 320D of the second coil layer 320 may remain, and only the second dummy pattern 330D of the third coil layer 330 and the third dummy pattern 340D of the fourth coil layer 340 may be removed.

[0136] In addition, refer to Figure 6 In an embodiment, the body interface surface BI may not be formed in the body 100, which may be because forming the body 100 by laminating magnetic sheets can be performed in a single process, so that in an embodiment, the process stage can be shortened and the production efficiency can be improved.

[0137] Process for Manufacturing the Coil Component According to the First Embodiment Figures 7 to 10 are diagrams showing a process of manufacturing the coil component according to the first embodiment.

[0138] Reference Figure 7 , a first copper clad laminate CCL for forming the first coil layer 310 may be prepared. In the copper clad laminate CCL, the copper clad layer may be attached to both surfaces or one surface of an insulator such as fiberglass (FR-4). In an embodiment, it may be sufficient that the copper clad layer may be attached to only one surface of the insulator on which the first coil layer 310 is disposed.

[0139] Thereafter, a plating resist R may be disposed on one surface of the copper clad laminate CCL. The plating resist R may be formed using a material including a photosensitive organic material or a photosensitive resin, and may be a general dry film resist (DFR), but embodiments thereof are not limited thereto.

[0140] Thereafter, the plating resist R may be patterned by exposure and development, and the first coil layer 310 (including the first coil pattern 311 , the first lead-out portion 310L, and the first sub-lead-out portion 310S) may be formed by electrolytic plating.

[0141] Thereafter, the first insulating layer 210 may be integrally provided on the first coil layer 310 and the plating resist R. In this case, by performing mechanical processing or chemical processing on the upper surface of the first coil layer 310, the height of the upper surface of the first coil layer 310 may be realized to be the same as the height of the upper surface of the plating resist R.

[0142] Afterwards, refer to Figure 8 , the seed layer SL may be patterned according to the shape of the second coil layer 320 on the first insulating layer 210 , and a via hole Vh penetrating the first insulating layer 210 may be formed in a position corresponding to the first sub via hole SV1 .

[0143] In an embodiment, the seed layer SL may be disposed only on an upper surface of the via hole Vh, but the embodiment is not limited thereto, and the seed layer SL may extend to a side surface of the via hole Vh according to a process sequence.

[0144] Thereafter, similar to the process of forming the first coil layer 310, after providing the plating resist R, the second coil layer 320 (including the second coil pattern 321, the first dummy pattern 320D, and the second sub-lead-out portion 320S) may be formed by patterning and electrolytic plating. In this case, the first sub-via SV1 may be formed in the via hole Vh so that the first sub-lead-out portion 310S of the first coil layer 310 and the second sub-lead-out portion 320S of the second coil layer 320 may be connected to each other.

[0145] Thereafter, the second insulating layer 220, the third coil layer 330 (including the third coil pattern 331, the second dummy pattern 330D and the third sub lead-out portion 330S), the third insulating layer 230 and the fourth coil layer 340 (including the fourth coil pattern 341, the third dummy pattern 330D and the second lead-out portion 340L) may be sequentially stacked by repeating the above process. In this case, the second sub lead-out portion 320S of the second coil layer 320 and the third sub lead-out portion 330S of the third coil layer 330 may be connected to each other through the second sub via SV2, and the third sub lead-out portion 330S of the third coil layer 330 and the second lead-out portion 340L of the fourth coil layer 340 may be connected to each other through the third sub via SV3.

[0146] Thereafter, a portion of the region of the plating resist R and the insulating layers 210, 220, and 230 may be removed by a cavity process. Thus, a through hole H in which a magnetic material is to be disposed may be formed in a central portion of the coil 300, and a space may be formed between adjacent turns of the coil patterns 311, 321, 331, and 341.

[0147] Afterwards, refer to Fig. 9 , a portion of the body 100 may be formed by laminating a magnetic sheet on the coil 300 disposed on the copper clad laminate CCL and curing it.

[0148] Thereafter, the lower surface of the first coil layer 310 may be exposed by removing the copper clad laminate CCL disposed on the lower portion of the body 100. In particular, the lower surface of the first lead-out portion 310L and the lower surface of the first sub lead-out portion 310S may be exposed.

[0149] Thereafter, unlike the coil 300, the first layers 511 and 521 of the external electrodes 510 and 520 and the connection parts 410 and 420 may be formed on the upper surface of the support member SM by electrolytic plating. The first layers 511 and 521 of the external electrodes 510 and 520 and the connection parts 410 and 420 may include copper (Cu), but embodiments thereof are not limited thereto.

[0150] The separately formed connection portions 410 and 420 may be combined with exposed surfaces of the first lead-out portion 310L and the first sub lead-out portion 310S of the first coil layer 310 .

[0151] Reference Fig.10 , the first lead-out portion 310L and the first connection portion 410 and the first sub-lead-out portion 310S and the second connection portion 420 may be fused to each other using resistance welding, laser welding, or ultrasonic welding.

[0152] The first welding portion 410W whose shape can be partially deformed by heat and pressure may be formed in the upper end region of the first connection portion 410 in contact with the first lead-out portion 310L. Similarly, the second welding portion 420W whose shape can be partially deformed by heat and pressure may be formed in the upper end region of the second connection portion 420 in contact with the first sub-lead-out portion 310S.

[0153] Thereafter, a portion of the body 100 disposed below the first coil layer 310 may be formed by laminating magnetic material sheets. In this case, the body interface surface BI may be formed between regions of the body 100 formed by different processes, but embodiments thereof are not limited thereto. When the body interface surface BI is formed, the height of the body interface surface BI may be formed to be less than the distance between the first coil layer 310 and the lower surface of the body 100.

[0154] Thereafter, an outer insulating layer 600 that integrally covers the body 100 , the first layers 511 and 521 of the external electrodes 510 and 520 , and the support member SM may be provided, which may be advantageous in terms of process efficiency compared to providing the outer insulating layer 600 by region in a separate manner.

[0155] Finally, the support member SM and the external insulating layer 600 disposed on the support member SM can be removed together, so that part of the surface of the first layers 511 and 521 of the external electrodes 510 and 520 (for example, the lower surface of the first layer 511 and the side surface adjacent to the third surface 103 and the lower surface of the first layer 521 and the side surface adjacent to the fourth surface 104) can be exposed, and the second layers 512 and 522 and the third layers 513 and 523 can be sequentially disposed on the exposed surfaces of the first layers 511 and 521 of the external electrodes 510 and 520 by electrolytic plating, thereby realizing the coil component 1000 according to the first embodiment.

[0156] According to the aforementioned embodiments, the number of turns of the coil can be increased within a coil component of a limited size by removing the multi-layer coil structure from the multi-layer coil structure.

[0157] According to another aspect, the structure in which the coil and the external electrode are connected to each other in the body increases the effective volume within the coil component having a limited size, thereby improving the inductance characteristics and the saturation current (I sat )characteristic.

[0158] While embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A coil assembly, comprising: a body including a first surface and a second surface opposite to each other in a first direction; a coil disposed in the body and comprising a plurality of coil layers; an insulating layer disposed in each of the regions between the plurality of coil layers; an external electrode disposed on the first surface of the body; as well as a connecting portion, which is provided in the body, connects one of the plurality of coil layers to the external electrode and has one surface in contact with the one of the plurality of coil layers and another surface in contact with the external electrode, The connection portion includes a welding portion, and the welding portion is provided at an end of the connection portion to contact the one coil layer among the plurality of coil layers.

2. The coil assembly according to claim 1, wherein: The plurality of coil layers include a first coil layer, a second coil layer, a third coil layer and a fourth coil layer stacked in sequence, wherein the first coil layer is the one coil layer among the plurality of coil layers, The insulating layer includes a first insulating layer disposed between the first coil layer and the second coil layer, a second insulating layer disposed between the second coil layer and the third coil layer, and a third insulating layer disposed between the third coil layer and the fourth coil layer.

3. The coil assembly according to claim 2, wherein: The first coil layer includes a first coil pattern having at least one turn, a first lead-out portion extending from the first coil pattern and contacting the connection portion, and a first sub lead-out portion spaced apart from the first coil pattern.

4. The coil assembly according to claim 3, in, The external electrodes include a first external electrode and a second external electrode connected to the first coil layer and spaced apart from each other, The connection portion includes a first connection portion connecting the first lead portion to the first external electrode and a second connection portion connecting the first sub-lead portion to the second external electrode.

5. The coil assembly according to claim 3, wherein: The second coil layer includes a second coil pattern disposed on the first coil layer and having at least one turn, and a second sub lead-out portion spaced apart from the second coil pattern.

6. The coil assembly according to claim 5, wherein: The second coil layer further includes a first dummy pattern spaced apart from the second coil pattern.

7. The coil assembly according to claim 5, wherein: The third coil layer includes a third coil pattern, which is disposed on the second coil layer and has at least one turn, and a third sub lead-out portion, which is spaced apart from the third coil pattern.

8. The coil assembly according to claim 7, wherein: The third coil layer further includes a second dummy pattern spaced apart from the third coil pattern.

9. The coil assembly according to claim 7, wherein: The fourth coil layer includes a fourth coil pattern disposed on the third coil layer and having at least one turn, and a second lead-out portion extending from the fourth coil pattern.

10. The coil assembly according to claim 9, wherein: The fourth coil layer further includes a third dummy pattern spaced apart from the fourth coil pattern.

11. The coil assembly according to claim 9, wherein: The coil also includes a first via hole, a second via hole, and a third via hole, wherein the first via hole connects the inner end of the first coil pattern and the inner end of the second coil pattern to each other, the second via hole connects the outer end of the second coil pattern and the outer end of the third coil pattern to each other, and the third via hole connects the inner end of the third coil pattern and the inner end of the fourth coil pattern to each other.

12. The coil assembly according to claim 11, wherein: The first via hole, the second via hole, and the third via hole penetrate the first insulating layer, the second insulating layer, and the third insulating layer, respectively.

13. The coil assembly according to claim 9, wherein: The coil also includes a first sub-via, a second sub-via, and a third sub-via, the first sub-via connecting the first sub-lead-out portion and the second sub-lead-out portion to each other, the second sub-via connecting the second sub-lead-out portion and the third sub-lead-out portion to each other, and the third sub-via connecting the third sub-lead-out portion and the second lead-out portion to each other.

14. The coil assembly according to claim 13, wherein: The first sub-via hole, the second sub-via hole, and the third sub-via hole penetrate the first insulating layer, the second insulating layer, and the third insulating layer, respectively.

15. The coil assembly according to claim 1, in, Each of the plurality of coil layers except the one of the plurality of coil layers includes a seed layer, and Wherein, a side surface of the seed layer is in contact with the main body.

16. The coil assembly according to claim 1, wherein: At least a portion of the fusion bond is embedded inwardly in the one coil layer among the plurality of coil layers.

17. The coil assembly according to claim 1, wherein: At least a portion of the weld portion protrudes toward the body.

18. The coil assembly according to claim 1, wherein: The weld portion and the one coil layer of the plurality of coil layers have an interface surface therebetween.

19. The coil assembly according to claim 18, wherein: The interface surface includes an uneven surface.

20. The coil assembly according to claim 1, wherein The body includes a body interface surface perpendicular to the first direction.

21. The coil assembly according to claim 20, wherein: A distance between the body interface surface and the first surface in the first direction is less than or equal to a distance between the one coil layer of the plurality of coil layers and the first surface.

22. The coil assembly according to claim 1, wherein The external electrode includes a first layer disposed on the body and a second layer disposed on the first layer.

23. The coil assembly according to claim 22, wherein: The external electrode further includes a third layer disposed on the second layer.

24. The coil assembly according to claim 1, further comprising: An outer insulating layer covers a surface of the body and exposes the outer electrodes.

25. The coil assembly according to claim 2, wherein: The second coil layer includes a second coil pattern, a second sub lead-out portion, and a first dummy pattern, wherein the second coil pattern is disposed on the first coil layer and has at least one turn, the second sub lead-out portion is spaced apart from the second coil pattern, and the first dummy pattern is spaced apart from the second coil pattern. The third coil layer includes a third coil pattern, a third sub-lead-out portion, and a second dummy pattern, wherein the third coil pattern is disposed on the second coil layer and has at least one turn, the third sub-lead-out portion is spaced apart from the third coil pattern, and the second dummy pattern is spaced apart from the third coil pattern, The fourth coil layer includes a fourth coil pattern, a second lead-out portion, and a third dummy pattern, the fourth coil pattern being disposed on the third coil layer and having at least one turn, the second lead-out portion extending from the fourth coil pattern, the third dummy pattern being spaced apart from the fourth coil pattern, and Wherein, the main body also includes a third surface and a fourth surface opposite to each other in a second direction perpendicular to the first direction, and the area of ​​the coil adjacent to the third surface of the main body and the area of ​​the coil adjacent to the fourth surface of the main body have a symmetrical shape relative to the plane of the main body in the first direction and the third direction, and the plane passes through the center of the main body in the second direction, and the first direction, the second direction and the third direction are perpendicular to each other.

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