Wafer scheduling system

Abstract

The invention discloses a wafer scheduling system, and the system comprises an Event taking scheduling module which is used for carrying out round-robin scanning, judging whether a wafer stored on an Event needs to be processed or not and whether a PM cavity which can be used for processing exists or not, and judging whether to control a manipulator to carry out the operation of taking the wafer from the Event or not according to a judgment result; the PM cavity wafer placement scheduling module is used for finding a PM cavity conforming to the wafer processing technology according to different processing technologies required by the wafer on the manipulator, setting the ID of the PM cavity according to the ID of the wafer on the manipulator, and controlling the manipulator to execute the operation of placing the wafer into the PM cavity; the PM cavity wafer taking scheduling module is used for controlling the manipulator to execute wafer taking operation from the PM cavity according to a wafer taking rule according to the time when the PM cavity is machined; and the Event wafer placement scheduling module is used for judging whether the manipulator is controlled to execute wafer placement operation on the Event according to the processing progress of the wafer on the manipulator. According to the invention, the processing of the wafer is scheduled through the above modules, so that the wafer can be processed by different processes by using the same one module, the processing process is ensured to be carried out smoothly, the production efficiency is improved, and the production cost is reduced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a wafer scheduling system. Background Art

[0002] The wafer processing process usually involves multiple process links, so it is usually necessary to set up multiple machines with different processes to process the wafers. The wafers need to be scheduled between different machines according to the process recipe, but the cost of multiple machines will increase. At the same time, multiple machines occupy a large space. When there is no need to batch produce a large number of wafers, the use of multiple machines for processing will not only increase production costs, but also reduce production efficiency due to process switching between different machines. Therefore, consider setting up a processing machine with multiple mixed processes, that is, using only one machine to realize all the processing processes of the wafer. However, how to set up the wafer to perform multiple process scheduling on one machine is an urgent problem to be solved. Summary of the invention

[0003] The present invention provides a wafer scheduling system to overcome the technical problem that when batch production of a large number of wafers is not required, the mode of using multiple processing machines not only increases production costs, but also reduces production efficiency due to process switching between different machines.

[0004] In order to achieve the above object, the technical solution of the present invention is:

[0005] A wafer scheduling system, comprising:

[0006] The Elevator wafer fetching scheduling module is used to scan and judge whether the wafer stored on the Elevator needs to be processed and whether there is a PM cavity that can be used for processing, and whether to control the robot to execute the operation of fetching the wafer from the Elevator according to the judgment result;

[0007] The PM cavity placement scheduling module is used to find the PM cavity that meets the wafer processing technology according to the different processing technologies required by the wafers on the robot, set the ID of the PM cavity according to the ID of the wafer on the robot, and control the robot to perform the operation of placing the wafer into the PM cavity;

[0008] The PM cavity wafer taking scheduling module is used to control the manipulator to perform the wafer taking operation from the PM cavity according to the wafer taking rules according to the time when the PM cavity processing is completed;

[0009] The Elevator wafer placement scheduling module is used to determine whether to control the robot to place the wafer on the Elevator according to the processing progress of the wafer on the robot.

[0010] Furthermore, the scheduling process of the Elevator film fetching scheduling module includes:

[0011] S11: Determine whether there is no wafer on the robot, and whether the robot has reached the specified position and the elevator is in working state. If so, go to S12, otherwise go to S111;

[0012] S111: re-execute S11 at the next operation time node;

[0013] S12: Determine whether all PM cavities are in working state. If so, execute S11, otherwise, enter S13;

[0014] S13: Determine whether the TM cavity is in a vacuum state or an atmospheric state. If it is in a vacuum state, proceed to S14; if it is in an atmospheric state, proceed to S15;

[0015] S14: Determine whether there is a PM chamber without a wafer and the process is ready. If yes, go to S141; otherwise, go to S11;

[0016] S15: traverse each storage layer in the Elevator, and determine in turn whether each storage layer meets the conditions that a wafer is stored and the processing technology of the wafer has been completed. If so, control the robot to take out the wafer from the storage layer that meets the conditions; otherwise, execute S11;

[0017] S141: traverse each storage layer in the Elevator, and determine in turn whether each storage layer satisfies any of the following three conditions: no wafers are stored / wafers are stored and the processing has been completed / process sequence recipe SeqRcp is empty. If so, execute S1411, otherwise execute S142;

[0018] S1411: re-execute S141 at the next operation time node;

[0019] S142: Determine whether the next process path in the process sequence recipe SeqRcp of the wafer in the storage layer is not empty, if so, execute S143, otherwise execute S141;

[0020] S143: traverse the process chamber corresponding to the next process path, and determine whether the process chamber is not empty and does not need to be cleaned. If so, execute S144, otherwise execute S1431;

[0021] S1431: re-execute S143 at the next operation time node;

[0022] S144: Determine whether the process chamber is used for the first time, if so, execute S145, otherwise execute S146;

[0023] S145: Determine whether the pretreatment process PreRcp of the wafer in this storage layer is not empty and has not been performed. If so, set the pretreatment requirement tag of the process chamber, set the SeqRcp, PreRcp and CleanRcp of the process chamber according to the SeqRcp, PreRcp and CleanRcp of the wafer in this storage layer, and execute S143; otherwise, execute S1451;

[0024] S1451: setting the cleaning interval, SeqRcp, PreRcp and CleanRcp of the process chamber according to the cleaning interval, SeqRcp, PreRcp and CleanRcp of the wafer in the storage layer, and controlling the robot to take out the wafer from the storage layer that meets the conditions;

[0025] S146: Determine whether the optional PreRcp and Clean Rcp of the process chamber are both not empty, and the process chamber has not received a preprocessing request, and the last performed PreRcp is different from the PreRcp of the wafer in this storage layer. If so, execute S147; otherwise, execute S145;

[0026] S147: Set the cleaning interval, PreRcp and CleanRcp of the process chamber according to the cleaning interval, PreRcp and CleanRcp of the wafers in this storage layer, and determine whether the optional Clean Rcp of the process chamber is not empty. If so, set the re-cleaning label and the cleaning label of the process chamber and execute S143; otherwise, execute S145.

[0027] Furthermore, the scheduling process of the PM cavity wafer placement scheduling module is as follows:

[0028] S21: Determine whether there is a wafer on the robot, and the robot has reached the specified position and the processing technology of the PM cavity corresponding to the wafer ID on the robot has been set. If yes, execute S22, otherwise execute S211;

[0029] S211: re-execute S21 at the next operation time node;

[0030] S22: Determine whether there is a wafer on the robot and the corresponding next process position is this PM cavity. If so, execute S23, otherwise execute S21;

[0031] S23: Determine whether the isolation gates Slit between the transmission cavity and each PM cavity are all closed. If so, execute S24; otherwise, execute S21;

[0032] S24: Determine whether the number of unprocessed wafers is not 0, if so, execute S25, otherwise execute S21;

[0033] S25: Find a PM cavity that meets all the following conditions, that is, the processing technology of the PM cavity has been set, vacuum transfer can be performed, no wafer is placed, and the processing technology of the PM cavity is the same as the processing technology required for the wafer on the robot, and determine whether the IDs set according to the wafers between the PM cavities that meet the above processing conditions are different. If so, execute S26; otherwise, execute S21;

[0034] S26: sort all PM cavities from the latest to the earliest according to the time when the wafer was last placed in the PM cavity, select the PM cavity with the latest time of last placing the wafer, and determine whether the selected PM cavity is not empty. If so, execute S27; otherwise, execute S28;

[0035] S27: Eliminate the process chambers that are not empty in S26, and re-execute S26;

[0036] S28: setting the ID of the selected PM cavity according to the ID of the wafer to be placed, and controlling the robot to place the wafer into the PM cavity.

[0037] Furthermore, the scheduling process of the PM cavity wafer taking scheduling module is as follows:

[0038] S31: Determine whether there is no wafer on the robot and whether the robot has reached the specified position. If yes, execute S32; otherwise, execute S311;

[0039] S311: re-execute S31 at the next operation time node;

[0040] S32: traverse the PM cavities to determine whether the number of PM cavities that simultaneously meet the three conditions of being in a vacuum state, having wafers placed therein, and having processed the placed wafers is greater than 0. If so, execute S33; otherwise, execute S31;

[0041] S33: sort all PM cavities from early to late according to the processing completion time, and execute S34;

[0042] S34: traverse the sorted PM cavities, and determine in turn whether the next process path in SeqRcp of the PM cavity is not empty. If so, execute S35, otherwise execute S341;

[0043] S341: re-execute S34 at the next operation time node;

[0044] S35: Control the robot to take the wafer from the corresponding PM cavity and execute S36;

[0045] S36: Select Clean Rcp in SeqRcp, and determine whether the selected Clean Rcp is not empty. If so, execute S37, otherwise execute S31;

[0046] S37: Determine whether the selected Clean Rcp interval times are greater than 0 and the PM chamber process times are greater than the interval times. If so, set the cleaning process requirement tag and execute S38. Otherwise, execute S38 directly.

[0047] S38: Determine whether all wafers except the wafer in the PM cavity have completed the processing process. If so, execute S39; otherwise, execute S31;

[0048] S39: traverse the process chambers that meet the conditions and determine whether the final end work has been completed. If so, execute S391. Otherwise, perform the final processing label setting operation and the cleaning process requirement label setting operation on the PM chambers that have not completed the final end work, and execute S31.

[0049] S391: re-execute S39 at the next operation time node.

[0050] Furthermore, the scheduling process of the Elevator wafer placement scheduling module is as follows:

[0051] S41: Determine whether the robot has reached the designated position and whether the Elevator is in a state where wafers can be stored. If so, execute S42; otherwise, execute S411;

[0052] S411: re-execute S41 at the next operation time node;

[0053] S42: Determine whether the robot has a wafer and the Elevator has an empty storage layer. If so, execute S43; otherwise, execute S41;

[0054] S43: Determine whether the TM cavity is in a vacuum state or an atmospheric state. If it is in a vacuum state, execute S44; if it is in an atmospheric state, execute S45;

[0055] S44: Determine whether the processing of the wafer on the robot is completed. If so, control the robot to place the wafer on the Elevator; otherwise, execute S41;

[0056] S45: Determine whether the processing technology of the wafer on the robot is completed. If so, execute S41, otherwise control the robot to place the wafer to the Elevator.

[0057] Furthermore, it also includes a pre-processing process scheduling module for pre-processing scheduling of the PM chamber, and the process of the pre-processing scheduling is:

[0058] S51: Scan the available PM cavity and determine whether the PM cavity is in place, in a vacuum state and no wafer is placed. If so, execute S52; otherwise, execute S511;

[0059] S511: re-execute S51 at the next operation time node;

[0060] S52: Determine whether the pre-processing label of the PM chamber is set, and the number of processes performed on the wafer by the PM chamber after cleaning is 0. If so, execute S53; otherwise, execute S54;

[0061] S53: Select the PreRcp in the current Seq Rcp of the PM cavity, and determine whether the selected Pre Rcp is not empty. If so, perform the pretreatment process, otherwise perform S51;

[0062] S54: Determine whether the PM chamber sets the pre-processing label after the process is completed. If so, execute S55, otherwise execute S51;

[0063] S55: Determine whether the Seq Rcp processed last time in the PM cavity exists. If so, select the Pre Rcp in the Seq Rcp processed last time and execute S56; otherwise, select the Pre Rcp processed this time and execute S56;

[0064] S56: Determine whether the selected Pre Rcp is not empty, if so, execute the pre-processing process, otherwise execute S51.

[0065] Furthermore, it also includes a process setting module for starting the process flow of the PM chamber, and the specific process is:

[0066] S61: Scan the available PM cavity to determine whether the available PM cavity is in place, in a vacuum state, and has a wafer to be processed placed therein. If so, execute S62; otherwise, execute S611;

[0067] S611: re-execute S61 at the next operation time node;

[0068] S62: Determine whether the wafer Pre Rcp in the PM chamber is not empty and passes the verification. If so, start the processing process of the PM chamber, reset the ID mark of the PM chamber, and record the ID of the current processing process. Otherwise, execute S61.

[0069] Furthermore, it also includes a PM cavity cleaning process scheduling module, which is used for PM cavity cleaning scheduling, and the process is:

[0070] S71: Scan the available PM cavity to determine whether the PM cavity is in place, in a vacuum state and without a wafer. If so, execute S72, otherwise execute S711;

[0071] S711: re-execute S71 at the next operation time node;

[0072] S72: Determine whether the PM chamber cleaning process interval is not 0, if so, execute S73; otherwise, execute S71;

[0073] S73: Determine whether the number of PM chamber process times reaches the set condition for triggering the cleaning process. If yes, set the cleaning requirement tag and execute S75. Otherwise, directly execute S75.

[0074] S75: Determine whether all other processes have set the cleaning requirement tag. If so, after the cleaning process is completed, set the cleaning requirement tag and enter S76. Otherwise, execute S71.

[0075] S76: Determine whether it is necessary to reset the cleaning requirement tag, if so, execute S761, otherwise clean the current Clean Rcp ID, and then execute S762;

[0076] S761: Determine whether the currently selected Pre Rcp ID is empty. If so, clean the current Clean Rcp ID, reset the re-cleaning requirement tag, and execute S762; otherwise, execute S7611;

[0077] S7611: Determine whether the Seq Rcp ID of the last operation of the PM chamber is not empty. If so, use the Clean Rcp ID of the last Seq Rcp as the current Clean Rcp ID and execute S7612. Otherwise, execute S7613.

[0078] S7612: Determine whether the selected CleanRcp ID is empty. If so, execute S7614; otherwise, execute S762;

[0079] S7614: Determine whether the optional Clean RCP ID recorded in the PM cavity is not empty. If so, select the Clean RCP ID from the optional Clean RCP ID recorded in the PM cavity and execute S762; otherwise, execute S7613;

[0080] S7613: Clear all Clean Rcp IDs of the last run, reset the re-cleaning requirement tag and the clean requirement tag, and execute S71;

[0081] S762: Determine whether the selected CleanRCP ID is not empty. If so, execute S763; otherwise, execute S71;

[0082] S763: Determine whether the CleanRCP ID can be parsed successfully. If so, perform the cleaning process and execute S764; otherwise, set the re-cleaning requirement tag and the cleaning requirement tag, and execute S71;

[0083] S764: reset the cleaning requirement tag, update the last CleanRCP ID of the PM cavity to the current CleanRCPID, and execute S765;

[0084] S765: Determine whether the optional Pre RCP ID of the PM chamber is not empty. If so, set the preprocessing process requirement tag and execute S766. Otherwise, reset the preprocessing process requirement tag and execute S766.

[0085] S766: Determine whether the re-cleaning requirement tag is set. If so, reset the re-cleaning requirement tag and execute S71; otherwise, update the last SeqRcpID of the PM cavity to the optional SeqRcpID and execute S71.

[0086] Beneficial effects: The present invention sets an Elevator wafer taking scheduling module, which is used to scan and judge whether the wafer stored on the Elevator needs to be processed and whether there is a PM cavity that can be used for processing, and judge whether to control the robot to perform the operation of taking the wafer from the Elevator according to the judgment result; the PM cavity wafer placing scheduling module is used to find the PM cavity that meets the wafer processing technology according to the different processing technologies required for the wafer on the robot, and set the ID of the PM cavity according to the ID of the wafer on the robot, and control the robot to perform the operation of placing the wafer into the PM cavity; the PM cavity wafer taking scheduling module is used to control the robot to perform the operation of taking the wafer from the PM cavity according to the wafer taking rules according to the time when the PM cavity processing is completed; the Elevator wafer placing scheduling module is used to judge whether to control the robot to perform the operation of placing the wafer into the Elevator according to the processing progress of the wafer on the robot; the present invention schedules the processing of the wafer through the above modules, so that the same few machines can be used to realize the processing of different processes of the wafer, and ensure the smooth progress of the processing process, thereby improving the production efficiency and reducing the production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0087] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0088] Figure 1 The figure is a flow chart of a wafer scheduling system in the present invention. DETAILED DESCRIPTION

[0089] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0090] This embodiment provides a wafer scheduling system, such as Figure 1 As shown, including:

[0091] The Elevator wafer fetching scheduling module is used to scan and judge whether the wafer stored on the Elevator needs to be processed and whether there is a PM cavity that can be used for processing, and whether to control the robot to execute the operation of fetching the wafer from the Elevator according to the judgment result;

[0092] The PM cavity placement scheduling module is used to find the PM cavity that meets the wafer processing technology according to the different processing technologies required by the wafers on the robot, set the ID of the PM cavity according to the ID of the wafer on the robot, and control the robot to perform the operation of placing the wafer into the PM cavity;

[0093] Specifically, in this embodiment, a unique identification string, i.e., a wafer ID, is set for each wafer, and a corresponding process recipe to be processed is set in advance for each wafer, thereby forming a mapping relationship between the wafer ID and the process ID. The process ID of the wafer can be found according to the wafer ID, and each PM cavity corresponds to a different process required by the wafer. At this time, the PM cavity is traversed based on the process ID of the wafer to find out which PM cavity's process ID matches the process ID required by the wafer. If a matching PM cavity is found, the ID of the PM cavity is set according to the ID of the wafer on the robot. If multiple matching PM cavities are found, the ID of the first matching PM cavity found is marked as the ID of the wafer.

[0094] The PM cavity wafer taking scheduling module is used to control the manipulator to perform the wafer taking operation from the PM cavity according to the wafer taking rules according to the time when the PM cavity processing is completed;

[0095] The Elevator wafer placement scheduling module is used to determine whether to control the robot to place the wafer on the Elevator according to the processing progress of the wafer on the robot.

[0096] In a specific embodiment, the scheduling process of the Elevator film fetching scheduling module includes:

[0097] S11: Determine whether there is no wafer on the robot, and whether the robot has reached the specified position and the elevator is in working state. If so, go to S12, otherwise go to S111;

[0098] S111: re-execute S11 at the next operation time node;

[0099] S12: Determine whether all PM cavities are in working state. If so, execute S11, otherwise, enter S13;

[0100] S13: Determine whether the transmission cavity, i.e., the TM cavity, is in a vacuum state or an atmospheric state. If it is in a vacuum state, proceed to S14; if it is in an atmospheric state, proceed to S15;

[0101] S14: Determine whether there is a PM chamber without a wafer and the process is ready. If yes, go to S141; otherwise, go to S11;

[0102] S15: traverse each storage layer in the Elevator, and determine in turn whether each storage layer meets the conditions that a wafer is stored and the processing technology of the wafer has been completed. If so, control the robot to take out the wafer from the storage layer that meets the conditions; otherwise, execute S11;

[0103] S141: traverse each storage layer in the Elevator, and determine in turn whether each storage layer satisfies any of the following three conditions: no wafers are stored / there are wafers and the processing has been completed / the process sequence recipe SeqRcp is empty. If so, execute S1411, otherwise execute S142;

[0104] S1411: re-execute S141 at the next operation time node;

[0105] S142: Determine whether the next process path in the process sequence recipe SeqRcp of the wafer in the storage layer is not empty, if so, execute S143, otherwise execute S141;

[0106] S143: traverse the process chamber corresponding to the next process path, and determine whether the process chamber is not empty and does not need to be cleaned. If so, execute S144, otherwise execute S1431;

[0107] S1431: re-execute S143 at the next operation time node;

[0108] S144: Determine whether the process chamber is used for the first time, if so, execute S145, otherwise execute S146;

[0109] S145: Determine whether the pretreatment process PreRcp of the wafer in this storage layer is not empty and has not been performed. If so, set the pretreatment requirement tag of the process chamber, set the SeqRcp, PreRcp and CleanRcp of the process chamber according to the SeqRcp, PreRcp and CleanRcp of the wafer in this storage layer, and execute S143; otherwise, execute S1451;

[0110] S1451: setting the cleaning interval, SeqRcp, PreRcp and CleanRcp of the process chamber according to the cleaning interval, SeqRcp, PreRcp and CleanRcp of the wafer in the storage layer, and controlling the robot to take out the wafer from the storage layer that meets the conditions;

[0111] S146: Determine whether the optional PreRcp and Clean Rcp of the process chamber are both not empty, and the process chamber has not received a preprocessing request, and the last performed PreRcp is different from the PreRcp of the wafer in this storage layer. If so, execute S147; otherwise, execute S145;

[0112] S147: Set the cleaning interval, PreRcp and CleanRcp of the process chamber according to the cleaning interval, PreRcp and CleanRcp of the wafers in this storage layer, and determine whether the optional Clean Rcp of the process chamber is not empty. If so, set the re-cleaning label and the cleaning label of the process chamber and execute S143; otherwise, execute S145.

[0113] Specifically, in this embodiment, Seq Rcp stands for Sequence Recipe, which is the sequence process recipe for wafer processing, including a pre-processing process recipe Pre Recipe, a process recipe Process Recipe, and a cleaning recipe Clean Recipe.

[0114] In a specific embodiment, the scheduling process of the PM cavity wafer placement wafer scheduling module is:

[0115] The scheduling process of the PM cavity wafer placement scheduling module is as follows:

[0116] S21: Determine whether there is a wafer on the robot, and the robot has reached the specified position and the processing technology of the PM cavity corresponding to the wafer ID on the robot has been set. If yes, execute S22, otherwise execute S211;

[0117] S211: re-execute S21 at the next operation time node;

[0118] S22: Determine whether there is a wafer on the robot and the corresponding next process position is this PM cavity. If so, execute S23, otherwise execute S21;

[0119] S23: Determine whether the isolation gates Slit between the transmission cavity and each PM cavity are all closed. If so, execute S24; otherwise, execute S21;

[0120] S24: Determine whether the number of unprocessed wafers is not 0, if so, execute S25, otherwise execute S21;

[0121] S25: Find a PM cavity that meets all the following conditions, that is, the processing technology of the PM cavity has been set, vacuum transfer can be performed, no wafer is placed, and the processing technology of the PM cavity is the same as the processing technology required for the wafer on the robot, and determine whether the IDs set according to the wafers between the PM cavities that meet the above processing conditions are different. If so, execute S26; otherwise, execute S21;

[0122] S26: sort all PM cavities from the latest to the earliest according to the time when the wafer was last placed in the PM cavity, select the PM cavity with the latest time of last placing the wafer, and determine whether the selected PM cavity is not empty. If so, execute S27; otherwise, execute S28;

[0123] Specifically, the PM cavities are sorted according to time, so as to select the PM cavity in which the last wafer is placed the latest. This setting can avoid the problem that some PM cavities are reused while some PM cavities have low utilization rates, and ensure balanced use of process cavities.

[0124] S27: Eliminate the process chambers that are not empty in S26, and re-execute S26;

[0125] S28: setting the ID of the selected PM cavity according to the ID of the wafer to be placed, and controlling the robot to place the wafer into the PM cavity.

[0126] In a specific embodiment, the scheduling process of the PM cavity wafer taking wafer scheduling module is:

[0127] The scheduling process of the PM cavity wafer taking scheduling module is as follows:

[0128] S31: Determine whether there is no wafer on the robot and whether the robot has reached the specified position. If yes, execute S32; otherwise, execute S311;

[0129] S311: re-execute S31 at the next operation time node;

[0130] S32: traverse the PM cavities to determine whether the number of PM cavities that simultaneously meet the three conditions of being in a vacuum state, having wafers placed therein, and having processed the placed wafers is greater than 0. If so, execute S33; otherwise, execute S31;

[0131] S33: sort all PM cavities from early to late according to the processing completion time, and execute S34;

[0132] S34: traverse the sorted PM cavities, and determine in turn whether the next process path in SeqRcp of the PM cavity is not empty. If so, execute S35, otherwise execute S341;

[0133] S341: re-execute S34 at the next operation time node;

[0134] S35: Control the robot to take the wafer from the corresponding PM cavity and execute S36;

[0135] S36: Select Clean Rcp in SeqRcp, and determine whether the selected Clean Rcp is not empty. If so, execute S37, otherwise execute S31;

[0136] S37: Determine whether the selected Clean Rcp interval times are greater than 0 and the PM chamber process times are greater than the interval times. If so, set the cleaning process requirement tag and execute S38. Otherwise, execute S38 directly.

[0137] S38: Determine whether all wafers except the wafer in the PM chamber (including the process chamber of this process) have completed the processing process. If so, execute S39; otherwise, execute S31;

[0138] S39: traverse the process chambers that meet the conditions and determine whether the final end work has been completed. If so, execute S391. Otherwise, perform the final processing label setting operation and the cleaning process requirement label setting operation on the PM chambers that have not completed the final end work, and execute S31.

[0139] S391: re-execute S39 at the next operation time node.

[0140] In a specific embodiment, the scheduling process of the Elevator wafer placement scheduling module is as follows:

[0141] The scheduling process of the Elevator wafer placement scheduling module is as follows:

[0142] S41: Determine whether the robot has reached the designated position and whether the Elevator is in a state where wafers can be stored. If so, execute S42; otherwise, execute S411;

[0143] S411: re-execute S41 at the next operation time node;

[0144] S42: Determine whether the robot has a wafer and the Elevator has an empty storage layer. If so, execute S43; otherwise, execute S41;

[0145] S43: Determine whether the TM cavity is in a vacuum state or an atmospheric state. If it is in a vacuum state, execute S44; if it is in an atmospheric state, execute S45;

[0146] S44: Determine whether the processing of the wafer on the robot is completed. If so, control the robot to place the wafer on the Elevator; otherwise, execute S41;

[0147] S45: Determine whether the processing technology of the wafer on the robot is completed. If so, execute S41, otherwise control the robot to place the wafer to the Elevator.

[0148] In a specific embodiment, a pre-processing process scheduling module is also included, which is used for pre-processing scheduling of the PM chamber. The process of the pre-processing scheduling is:

[0149] S51: Scan the available PM cavity and determine whether the PM cavity is in place, in a vacuum state and no wafer is placed. If so, execute S52; otherwise, execute S511;

[0150] S511: re-execute S51 at the next operation time node;

[0151] S52: Determine whether the pre-processing label of the PM chamber is set, and the number of processes performed on the wafer by the PM chamber after cleaning is 0. If so, execute S53; otherwise, execute S54;

[0152] S53: Select the PreRcp in the current Seq Rcp of the PM cavity, and determine whether the selected Pre Rcp is not empty. If so, perform the pretreatment process, otherwise perform S51;

[0153] S54: Determine whether the PM chamber sets the pre-processing label after the process is completed. If so, execute S55, otherwise execute S51;

[0154] S55: Determine whether the Seq Rcp processed last time in the PM cavity exists. If so, select the Pre Rcp in the Seq Rcp processed last time and execute S56; otherwise, select the Pre Rcp processed this time and execute S56;

[0155] S56: Determine whether the selected Pre Rcp is not empty, if so, execute the pre-processing process, otherwise execute S51.

[0156] Specifically, in this embodiment, when the current process is finished, if the previous Seq Rcp exists, the process operation is performed according to the previous PreRcp by default.

[0157] In a specific embodiment, the wafer scheduling system further includes a process setting module for starting the process flow of the PM chamber. The specific process is:

[0158] S61: Scan the available PM cavity to determine whether the available PM cavity is in place, in a vacuum state, and has a wafer to be processed placed therein. If so, execute S62; otherwise, execute S611;

[0159] S611: re-execute S61 at the next operation time node;

[0160] S62: Determine whether the wafer Pre Rcp in the PM chamber is not empty and passes the verification. If so, start the processing process of the PM chamber, reset the ID mark of the PM chamber, and record the ID of the current processing process. Otherwise, execute S61.

[0161] Specifically, each batch of wafers processed by Cassette has a processing ID, namely JobID. The system can determine which batch the Sequence recipe of this wafer is in by running which JobID. Because when the final Clean process is being done, the process of the next batch with a different JobID has already begun. The different JobIDs can accurately determine whether this wafer has completed the final processing step of the previous batch, thereby avoiding starting the next processing before the previous processing is completed, ensuring the smooth progress of the processing process.

[0162] In a specific embodiment, a PM cavity cleaning process scheduling module is also included, which is used for PM cavity cleaning scheduling, and the process is:

[0163] S71: Scan the available PM cavity to determine whether the PM cavity is in place, in a vacuum state and without a wafer. If so, execute S72, otherwise execute S711;

[0164] S711: re-execute S71 at the next operation time node;

[0165] S72: Determine whether the PM chamber cleaning process interval is not 0, if so, execute S73; otherwise, execute S71;

[0166] S73: Determine whether the number of PM chamber process times reaches the set condition for triggering the cleaning process. If yes, set the cleaning requirement tag and execute S75. Otherwise, directly execute S75.

[0167] S75: Determine whether all other processes have set the cleaning requirement tag. If so, after the cleaning process is completed, set the cleaning requirement tag and enter S76. Otherwise, execute S71.

[0168] S76: Determine whether it is necessary to reset the cleaning requirement tag, if so, execute S761, otherwise clean the current Clean Rcp ID, and then execute S762;

[0169] S761: Determine whether the currently selected Pre Rcp ID is empty. If so, clean the current Clean Rcp ID, reset the re-cleaning requirement tag, and execute S762; otherwise, execute S7611;

[0170] Specifically, because there is a SeqRcp that does not include PreRcp and CleanRcp, the current cleaning process selects the current CleanRcpID.

[0171] S7611: Determine whether the Seq Rcp ID of the last operation of the PM chamber is not empty. If so, use the Clean Rcp ID of the last Seq Rcp as the current Clean Rcp ID and execute S7612. Otherwise, execute S7613.

[0172] S7612: Determine whether the selected CleanRcp ID is empty. If so, execute S7614; otherwise, execute S762;

[0173] S7614: Determine whether the optional Clean RCP ID recorded in the PM cavity is not empty. If so, select the Clean RCP ID from the optional Clean RCP ID recorded in the PM cavity and execute S762; otherwise, execute S7613;

[0174] S7613: Clear all Clean Rcp IDs of the last run, reset the re-cleaning requirement tag and the clean requirement tag, and execute S71;

[0175] S762: Determine whether the selected CleanRCP ID is not empty. If so, execute S763; otherwise, execute S71;

[0176] S763: Determine whether the CleanRCP ID can be parsed successfully. If so, perform the cleaning process and execute S764; otherwise, set the re-cleaning requirement tag and the cleaning requirement tag, and execute S71;

[0177] Specifically, the specific execution content is parsed through the CleanRCP ID. If the specific content is obtained through the parsing and is correct, it indicates that the parsing is successful.

[0178] S764: reset the cleaning requirement tag, update the last CleanRCP ID of the PM cavity to the current CleanRCPID, and execute S765;

[0179] S765: Determine whether the optional Pre RCP ID of the PM chamber is not empty. If so, set the preprocessing process requirement tag and execute S766. Otherwise, reset the preprocessing process requirement tag and execute S766.

[0180] S766: Determine whether the re-cleaning requirement tag is set. If so, reset the re-cleaning requirement tag and execute S71; otherwise, update the last SeqRcpID of the PM cavity to the optional SeqRcpID and execute S71.

[0181] In a specific embodiment, the wafer scheduling system further includes a wafer scheduling module for taking wafers from the Cassette box and a wafer scheduling module for putting wafers into the Cassette box;

[0182] The scheduling process of the wafer scheduling module of the Cassette box wafer placement is as follows:

[0183] S81: Determine whether the robot has reached the specified position and is not in the atmospheric state. If so, execute S82; otherwise, execute S811;

[0184] S811: re-execute S81 at the next operation time node;

[0185] S82: Determine whether all the isolation airlock doors SlitValve of the PM chamber and the transfer chamber are closed, and a wafer is placed on the robot. If so, execute S83, otherwise execute S81;

[0186] S83: Determine whether the Cassette box is in place, if so, execute S84, otherwise execute S81;

[0187] S84: Determine whether all wafers stored on the elevator have completed the processing process. If so, control the robot to put the wafers into the Cassette box, otherwise execute S81;

[0188] The scheduling process of the Cassette box wafer taking scheduling module is as follows:

[0189] S91: Determine whether the robot has reached the specified position and is not in the atmospheric state. If so, execute S92; otherwise, execute S911;

[0190] S911: re-execute S91 at the next operation time node;

[0191] S92: Determine whether the SlitValve of all PM cavities is closed and no wafer is placed on the robot. If so, execute S93; otherwise, execute S91;

[0192] S93: Determine whether there is a vacant storage layer on the Elevator and whether the wafers placed on the storage layer are all wafers that have not undergone processing. If so, control the robot to take the wafers from the Cassette box; otherwise, execute S91.

[0193] In a specific embodiment, the wafer scheduling system also includes a Cassette box switching task module. There are two Cassette boxes for storing wafers in the actual equipment. When the work of one of the Cassette boxes has been completed and the other Cassette box is about to perform the work, the position of the two Cassette boxes is switched by controlling the switching of the Cassette box task module, so that the Cassette box in the execution of the work corresponds to the Elevator.

[0194] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer scheduling system, characterized in that: include: The Elevator wafer fetching scheduling module is used to scan and judge whether the wafer stored on the Elevator needs to be processed and whether there is a PM cavity that can be used for processing, and whether to control the robot to execute the operation of fetching the wafer from the Elevator according to the judgment result; The PM cavity placement scheduling module is used to find the PM cavity that meets the wafer processing technology according to the different processing technologies required by the wafers on the robot, set the ID of the PM cavity according to the ID of the wafer on the robot, and control the robot to perform the operation of placing the wafer into the PM cavity; The PM cavity wafer taking scheduling module is used to control the manipulator to perform the wafer taking operation from the PM cavity according to the wafer taking rules according to the time when the PM cavity processing is completed; The Elevator wafer placement scheduling module is used to determine whether to control the robot to place the wafer on the Elevator according to the processing progress of the wafer on the robot.

2. The wafer scheduling system according to claim 1, characterized in that: The scheduling process of the Elevator film fetching scheduling module includes: S11: Determine whether there is no wafer on the robot, and whether the robot has reached the specified position and the elevator is in working state. If so, go to S12, otherwise go to S111; S111: re-execute S11 at the next operation time node; S12: Determine whether all PM cavities are in working state. If so, execute S11, otherwise, enter S13; S13: Determine whether the TM cavity is in a vacuum state or an atmospheric state. If it is in a vacuum state, proceed to S14; if it is in an atmospheric state, proceed to S15; S14: Determine whether there is a PM chamber without a wafer and the process is ready. If yes, go to S141; otherwise, go to S11; S15: traverse each storage layer in the Elevator, and determine in turn whether each storage layer meets the conditions that a wafer is stored and the processing technology of the wafer has been completed. If so, control the robot to take out the wafer from the storage layer that meets the conditions; otherwise, execute S11; S141: traverse each storage layer in the Elevator, and determine in turn whether each storage layer satisfies any of the following three conditions: no wafers are stored / wafers are stored and the processing has been completed / process sequence recipe SeqRcp is empty. If so, execute S1411, otherwise execute S142; S1411: re-execute S141 at the next operation time node; S142: Determine whether the next process path in the process sequence recipe SeqRcp of the wafer in the storage layer is not empty, if so, execute S143, otherwise execute S141; S143: traverse the process chamber corresponding to the next process path, and determine whether the process chamber is not empty and does not need to be cleaned. If so, execute S144, otherwise execute S1431; S1431: re-execute S143 at the next operation time node; S144: Determine whether the process chamber is used for the first time, if so, execute S145, otherwise execute S146; S145: Determine whether the pretreatment process PreRcp of the wafer in this storage layer is not empty and has not been performed. If so, set the pretreatment requirement tag of the process chamber, set the SeqRcp, PreRcp and CleanRcp of the process chamber according to the SeqRcp, PreRcp and CleanRcp of the wafer in this storage layer, and execute S143; otherwise, execute S1451; S1451: setting the cleaning interval, SeqRcp, PreRcp and CleanRcp of the process chamber according to the cleaning interval, SeqRcp, PreRcp and CleanRcp of the wafer in the storage layer, and controlling the robot to take out the wafer from the storage layer that meets the conditions; S146: Determine whether the optional PreRcp and Clean Rcp of the process chamber are both not empty, and the process chamber has not received a preprocessing request, and the last performed PreRcp is different from the PreRcp of the wafer in this storage layer. If so, execute S147; otherwise, execute S145; S147: Set the cleaning interval, PreRcp and CleanRcp of the process chamber according to the cleaning interval, PreRcp and CleanRcp of the wafers in this storage layer, and determine whether the optional Clean Rcp of the process chamber is not empty. If so, set the re-cleaning label and the cleaning label of the process chamber and execute S143; otherwise, execute S145.

3. The wafer scheduling system according to claim 2, characterized in that: The scheduling process of the PM cavity wafer placement scheduling module is as follows: S21: Determine whether there is a wafer on the robot, and the robot has reached the specified position and the processing technology of the PM cavity corresponding to the wafer ID on the robot has been set. If yes, execute S22, otherwise execute S211; S211: re-execute S21 at the next operation time node; S22: Determine whether there is a wafer on the robot and the corresponding next process position is this PM cavity. If so, execute S23, otherwise execute S21; S23: Determine whether the isolation gates Slit between the transmission cavity and each PM cavity are all closed. If so, execute S24; otherwise, execute S21; S24: Determine whether the number of unprocessed wafers is not 0, if so, execute S25, otherwise execute S21; S25: Find a PM cavity that meets all the following conditions, that is, the processing technology of the PM cavity has been set, vacuum transfer can be performed, no wafer is placed, and the processing technology of the PM cavity is the same as the processing technology required for the wafer on the robot, and determine whether the IDs set according to the wafers between the PM cavities that meet the above processing conditions are different. If so, execute S26; otherwise, execute S21; S26: sort all PM cavities from the latest to the earliest according to the time when the wafer was last placed in the PM cavity, select the PM cavity with the latest time of last placing the wafer, and determine whether the selected PM cavity is not empty. If so, execute S27; otherwise, execute S28; S27: Eliminate the process chambers that are not empty in S26, and re-execute S26; S28: setting the ID of the selected PM cavity according to the ID of the wafer to be placed, and controlling the robot to place the wafer into the PM cavity.

4. The wafer scheduling system according to claim 3, characterized in that: The scheduling process of the PM cavity wafer taking scheduling module is as follows: S31: Determine whether there is no wafer on the robot and whether the robot has reached the specified position. If yes, execute S32; otherwise, execute S311; S311: re-execute S31 at the next operation time node; S32: traverse the PM cavities to determine whether the number of PM cavities that simultaneously meet the three conditions of being in a vacuum state, having wafers placed therein, and having processed the placed wafers is greater than 0. If so, execute S33; otherwise, execute S31; S33: sort all PM cavities from early to late according to the processing completion time, and execute S34; S34: traverse the sorted PM cavities, and determine in turn whether the next process path in SeqRcp of the PM cavity is not empty. If so, execute S35, otherwise execute S341; S341: re-execute S34 at the next operation time node; S35: Control the robot to take the wafer from the corresponding PM cavity and execute S36; S36: Select Clean Rcp in SeqRcp and determine whether the selected Clean Rcp is not empty. If so, execute S37, otherwise execute S31; S37: Determine whether the selected Clean Rcp interval times are greater than 0 and the PM chamber process times are greater than the interval times. If so, set the cleaning process requirement tag and execute S38. Otherwise, execute S38 directly. S38: Determine whether all wafers except the wafer in the PM cavity have completed the processing process. If so, execute S39; otherwise, execute S31; S39: traverse the process chambers that meet the conditions and determine whether the final end work has been completed. If so, execute S391. Otherwise, perform the final processing label setting operation and the cleaning process requirement label setting operation on the PM chambers that have not completed the final end work, and execute S31. S391: Re-execute S39 at the next operation time node.

5. The wafer scheduling system according to claim 4, characterized in that: The scheduling process of the Elevator wafer placement scheduling module is as follows: S41: Determine whether the robot has reached the designated position and whether the Elevator is in a state where wafers can be stored. If so, execute S42; otherwise, execute S411; S411: re-execute S41 at the next operation time node; S42: Determine whether the robot has a wafer and the Elevator has an empty storage layer. If so, execute S43; otherwise, execute S41; S43: Determine whether the TM cavity is in a vacuum state or an atmospheric state. If it is in a vacuum state, execute S44; if it is in an atmospheric state, execute S45; S44: Determine whether the processing of the wafer on the robot is completed. If so, control the robot to place the wafer on the Elevator; otherwise, execute S41; S45: Determine whether the processing technology of the wafer on the robot is completed. If so, execute S41, otherwise control the robot to place the wafer to the Elevator.

6. The wafer scheduling system according to claim 5, characterized in that: It also includes a pre-processing process scheduling module, which is used for pre-processing scheduling of the PM chamber. The process of the pre-processing scheduling is as follows: S51: Scan the available PM cavity and determine whether the PM cavity is in place, in a vacuum state and no wafer is placed. If so, execute S52; otherwise, execute S511; S511: re-execute S51 at the next operation time node; S52: Determine whether the pre-processing label of the PM chamber is set, and the number of processes performed on the wafer by the PM chamber after cleaning is 0. If so, execute S53; otherwise, execute S54; S53: Select the PreRcp in the current Seq Rcp of the PM cavity, and determine whether the selected Pre Rcp is not empty. If so, perform the pretreatment process, otherwise perform S51; S54: Determine whether the PM chamber sets the pre-processing label after the process is completed. If so, execute S55, otherwise execute S51; S55: Determine whether the Seq Rcp processed last time in the PM cavity exists. If so, select the Pre Rcp in the Seq Rcp processed last time and execute S56; otherwise, select the Pre Rcp processed this time and execute S56; S56: Determine whether the selected Pre Rcp is not empty, if so, execute the pre-processing process, otherwise execute S51.

7. The wafer scheduling system according to claim 6, characterized in that: It also includes a process setting module, which is used to start the process flow of the PM chamber. The specific process is as follows: S61: Scan the available PM cavity to determine whether the available PM cavity is in place, in a vacuum state, and has a wafer to be processed placed therein. If so, execute S62; otherwise, execute S611; S611: re-execute S61 at the next operation time node; S62: Determine whether the wafer Pre Rcp in the PM chamber is not empty and passes the verification. If so, start the processing process of the PM chamber, reset the ID mark of the PM chamber, and record the ID of the current processing process. Otherwise, execute S61.

8. The wafer scheduling system according to claim 2, characterized in that: It also includes a PM cavity cleaning process scheduling module, which is used for PM cavity cleaning scheduling. The process is: S71: Scan the available PM cavity to determine whether the PM cavity is in place, in a vacuum state and without a wafer. If so, execute S72, otherwise execute S711; S711: re-execute S71 at the next operation time node; S72: Determine whether the PM chamber cleaning process interval is not 0, if so, execute S73; otherwise, execute S71; S73: Determine whether the number of PM chamber process times reaches the set condition for triggering the cleaning process. If yes, set the cleaning requirement tag and execute S75. Otherwise, directly execute S75. S75: Determine whether all other processes have set the cleaning requirement tag. If so, after the cleaning process is completed, set the cleaning requirement tag and enter S76. Otherwise, execute S71. S76: Determine whether it is necessary to reset the cleaning requirement tag, if so, execute S761, otherwise clean the current CleanRcp ID, and then execute S762; S761: Determine whether the currently selected Pre Rcp ID is empty. If so, clean the current Clean Rcp ID, reset the re-cleaning requirement tag, and execute S762; Otherwise, execute S7611; S7611: Determine whether the Seq RcpID of the last operation of the PM chamber is not empty. If so, use the Clean Rcp ID of the last SeqRcp as the Clean Rcp ID of this time and execute S7612. Otherwise, execute S7613. S7612: Determine whether the selected CleanRcp ID is empty. If so, execute S7614; otherwise, execute S762; S7614: Determine whether the optional Clean RCPID recorded in the PM cavity is not empty. If so, select the Clean RCPID from the optional Clean RCPID recorded in the PM cavity and execute S762; otherwise, execute S7613; S7613: Clear all Clean Rcp IDs of the last run, reset the re-cleaning requirement tag and the clean requirement tag, and execute S71; S762: Determine whether the selected CleanRCP ID is not empty. If so, execute S763; otherwise, execute S71; S763: Determine whether the CleanRCP ID can be parsed successfully. If so, perform the cleaning process and execute S764; otherwise, set the re-cleaning requirement tag and the cleaning requirement tag, and execute S71; S764: reset the cleaning requirement tag, update the last CleanRCP ID of the PM cavity to the current CleanRCPID, and execute S765; S765: Determine whether the optional Pre RCP ID of the PM chamber is not empty. If so, set the preprocessing process requirement tag and execute S766. Otherwise, reset the preprocessing process requirement tag and execute S766. S766: Determine whether the re-cleaning requirement tag is set. If so, reset the re-cleaning requirement tag and execute S71; otherwise, update the last SeqRcpID of the PM cavity to the optional SeqRcpID and execute S71.

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