Load Port Device, Front-End Loading Device, Wafer Processing Equipment, and Detection Method

Abstract

The present application provides a loading port device, a front-end loading device, a wafer processing apparatus, and a detection method. The loading port device includes: a main body; a loading table horizontally protruding from the main body, the loading table being configured to place a wafer cassette, the wafer cassette being configured to stack wafers at intervals in a vertical direction; and a detection mechanism movably mounted to the main body and vertically movable to sequentially detect wafers in the wafer cassette, the detection mechanism including a warp detector and an analyzer communicatively connected to the warp detector; the warp detector is configured to send a warp detection signal to the analyzer, the warp detection signal increasing as the horizontal distance from the warp detector to the wafer decreases; the analyzer is configured to determine the warp information of the wafer based on the warp detection signal and the vertical displacement of the warp detector. According to the technical solution of the present application, the warp condition of the wafer can be quickly and accurately judged, providing accurate wafer information for subsequent wafer transfer and processing processes.

Description

Technical Field

[0001] The present application relates to the technical field of wafer processing, and specifically, to a load port device, a front-end loading device, a wafer processing apparatus, and a detection method. Background Art

[0002] A load port device is an essential device in semiconductor equipment, which provides an interactive carrier for the transfer of wafers between different machines. A manipulator transfers the wafers in the wafer cassette on the load port device to the processing unit of the processing machine. However, during actual wafer processing, the wafers may warp due to internal stress or other reasons, or the bonding wafers formed after bonding two wafers may warp, resulting in the misalignment between the pose of the wafers in the wafer cassette and the wafer picking points of the front-end manipulator. When the front-end manipulator picks up the wafers, it may collide with the wafers, or the clamping may be unstable during the transfer after picking up the wafers, leading to wafer breakage. At this time, the wafer processing equipment needs to be stopped for cleaning, and the manipulator needs to be repositioned, etc., which affects the effective operation time of the equipment, reduces the processing efficiency of the equipment, and increases the equipment maintenance cost. Summary of the Invention

[0003] The present application provides a load port device, a front-end loading device, a wafer processing apparatus, and a detection method to solve or alleviate at least some of the above-mentioned problems.

[0004] According to one aspect of the present application, a load port device for a wafer processing apparatus is provided. The load port device includes: a main body; a loading table horizontally protruding from the main body, the loading table being configured to place a wafer cassette, the wafer cassette being configured to stack wafers at intervals in the vertical direction; and a detection mechanism movably mounted to the main body and vertically movable to sequentially detect the wafers in the wafer cassette. The detection mechanism includes a warp detector and an analyzer communicatively connected to the warp detector. The warp detector is configured to send a warp detection signal to the analyzer, and the warp detection signal increases as the horizontal distance from the warp detector to the wafer decreases. The analyzer is configured to determine the warp information of the wafer based on the warp detection signal and the vertical displacement of the warp detector.

[0005] Optionally or alternatively, the analyzer is capable of generating a waveform image of the change of the warp detection signal with the vertical displacement of the warp detector, and determining the warp information of the wafer based on the shape of the waveform image.

[0006] Optionally or alternatively, the warp information includes a warp degree and / or a warp direction.

[0007] Optionally or alternatively, the analyzer determines that the corresponding wafer is a non-warped wafer based on the protruding rectangular wave in the waveform image.

[0008] Optionally or alternatively, the analyzer determines that the corresponding wafer is a warped wafer based on that the protruding waveform in the waveform image has a plateau region and a curved region continuous with the plateau region.

[0009] Optionally or alternatively, the analyzer determines that the warping direction of the corresponding wafer is opposite to the vertical displacement direction of the warping detector based on that the curved region is downstream of the plateau region in the vertical displacement direction of the warping detector and the curved region gradually descends.

[0010] Optionally or alternatively, the analyzer determines that the warping direction of the corresponding wafer is the same as the vertical displacement direction of the warping detector based on that the curved region is upstream of the plateau region in the vertical displacement direction of the warping detector and the curved region gradually ascends.

[0011] Optionally or alternatively, the analyzer determines the warping degree of the corresponding wafer based on the total width of the plateau region and the curved region continuous therewith in the vertical displacement direction of the warping detector. When the warping direction is downward warping, the absolute value of the warping degree output by the analyzer based on the value of the same total width is lower than that when upward warping.

[0012] Optionally or alternatively, the analyzer is further configured to determine the warping smoothness of the wafer based on the curvature of the curved region, determine the warping smoothness as smooth when the curvature of the curved region is the same or continuously changes, and determine the warping smoothness as unsmooth when there is a sudden change in the curvature of the curved region.

[0013] Optionally or alternatively, the analyzer is further configured to determine the thickness of the wafer based on the width of the plateau region of the protruding waveform in the waveform image.

[0014] Optionally or alternatively, the analyzer is further configured to determine the placement state of the wafer based on the shape of the waveform image, and the placement state includes a single-wafer state, a stacked-wafer state, and a cross-slot state.

[0015] Optionally or alternatively, the wafer cassette has a plurality of horizontal slots arranged in the vertical direction for placing wafers, and a preset interval matching the vertical dimension of the horizontal slots is provided in the analyzer; the analyzer determines that the placement state is a single-wafer state based on that the width of the protruding waveform in the waveform image is less than the preset interval, and the width of the platform area of the protruding waveform in the waveform image is less than or equal to the wafer thickness threshold; and / or the analyzer determines that the placement state is a stacked-wafer state based on that the width of the protruding waveform in the waveform image is less than the preset interval, and the width of the platform area of the protruding waveform in the waveform image is greater than the wafer thickness threshold; and / or the analyzer determines that the placement state is a cross-slot state based on that the width of the protruding waveform in the waveform image exceeds the preset interval.

[0016] Optionally or alternatively, the detection mechanism includes two or more of the warpage detectors arranged at intervals, and the analyzer determines the warpage information of the wafer in the arrangement direction of the two or more warpage detectors and in the direction perpendicular to the arrangement direction by analyzing the waveform images of the two or more warpage detectors.

[0017] Optionally or alternatively, the warpage detector is an infrared sensor.

[0018] Optionally or alternatively, the wafer cassette has a plurality of horizontal slots arranged in the vertical direction for placing wafers; the detection mechanism further includes a state detector configured to detect the placement state of the wafers in the horizontal slots, and the placement state includes a single-wafer state, a stacked-wafer state, and a cross-slot state.

[0019] Optionally or alternatively, the state detector is a transmissive sensor, and the transmissive sensor includes a transmitter and a receiver arranged horizontally at an interval, and the receiver receives the transmissive light emitted by the transmitter; when performing wafer detection, the state detector at least partially extends into the wafer cassette so that when the detection mechanism moves in the vertical direction, the wafers in the wafer cassette pass between the transmitter and the receiver to block the transmissive light, and the transmissive sensor determines the placement state based on the time when the receiver does not receive the transmissive light or the distance moved when the receiver does not receive the transmissive light.

[0020] Optionally or alternatively, the load port device further includes a display communicatively connected to the detection mechanism, and the display is configured to receive and display the warpage information and the placement state information of the wafers.

[0021] Optionally or alternatively, the wafer cassette has a plurality of horizontal slots arranged in the vertical direction for placing wafers, and the horizontal slots extend from the side wall of the wafer cassette towards the inside of the wafer cassette; the detection mechanism further includes a vision detector, and the vision detector is arranged towards the side wall of the wafer cassette; the vision detector is configured to detect the edge of the wafer at the horizontal slot and identify the horizontal distance between the edge of the wafer and the side wall of the wafer cassette to determine the warpage information of the wafer.

[0022] Optionally or alternatively, identifying the horizontal distance between the edge of the wafer and the side wall of the wafer cassette includes: the vision detector constructs a first virtual scale in its detection field of view starting from the inner surface of the side wall of the wafer cassette and extending horizontally inwards, and reads the scale corresponding to the edge of the wafer to determine the horizontal distance; the vision detector is configured to determine that the corresponding wafer is a warped wafer when the horizontal distance is greater than a first distance threshold.

[0023] Optionally or alternatively, the vision detector is further configured to identify the vertical distance between the edge of the wafer and the horizontal slot, including: the vision detector constructs a second virtual scale in its detection field of view starting from the upper surface of the horizontal slot and extending vertically upwards, and reads the scale corresponding to the edge of the wafer to determine the vertical distance; the vision detector is configured to: determine that the warping direction of the corresponding wafer is warping upwards when the horizontal distance is greater than the first distance threshold and the vertical distance is greater than a second distance threshold; determine that the warping direction of the corresponding wafer is warping downwards when the horizontal distance is greater than the first distance threshold and the vertical distance is not greater than the second distance threshold.

[0024] Optionally or alternatively, identifying the horizontal distance between the edge of the wafer and the side wall of the wafer cassette includes: the vision detector identifies whether there is a wafer present at a horizontal distance of a first distance threshold from the inner surface of the side wall of the wafer cassette. If no wafer is present, it is determined that the horizontal distance between the wafer and the inner surface of the side wall of the wafer cassette exceeds the first distance threshold, and thus the corresponding wafer is determined to be a warped wafer.

[0025] Optionally or alternatively, the main body is configured with a window, and the detection mechanism detects the wafers in the wafer cassette through the window; the loading port device further includes an opener mounted to the main body, and the opener is configured to open the movable door of the wafer cassette facing the window and move the movable door to expose the wafers in the wafer cassette towards the loading port device.

[0026] According to another aspect of the present application, there is provided a front-end loading device for a wafer processing apparatus, the front-end loading device including: a loading port device according to the foregoing aspect; a wafer cassette movably placed on a loading stage of the loading port device, the wafer cassette being configured to stack wafers at intervals in a vertical direction; and a front-end robot configured to pick up wafers from the wafer cassette or place wafers into the wafer cassette.

[0027] According to another aspect of the present application, there is provided a front-end loading device for a wafer processing apparatus, the wafer processing apparatus including: a front-end loading device according to the foregoing aspect; a wafer processing unit; and a wafer transfer device configured to transfer wafers from the front-end loading device to the wafer processing unit for wafer processing.

[0028] According to another aspect of the present application, there is provided a wafer inspection method for a loading port device according to the foregoing aspect, the method including: opening a movable door of a wafer cassette to expose wafers in the wafer cassette to a detection mechanism; controlling the detection mechanism to move in a vertical direction to sequentially inspect the wafers in the wafer cassette; and outputting inspected wafer information.

[0029] Optionally or alternatively, controlling the detection mechanism to move in a vertical direction to sequentially inspect the wafers in the wafer cassette includes: detecting warpage information of the wafers via a warpage detector.

[0030] Optionally or alternatively, controlling the detection mechanism to move in a vertical direction to sequentially inspect the wafers in the wafer cassette includes: detecting the placement state of the wafers via a warpage detector and / or detecting the placement state of the wafers via a state detector.

[0031] Optionally or alternatively, adjusting a wafer picking position of a front-end robot for picking up wafers from the wafer cassette based on the warpage information of the wafers.

[0032] According to another aspect of the present application, there is provided a computer storage medium having a computer program stored thereon, the program, when executed by a processor, implementing the method according to the foregoing aspect.

[0033] The loading port device, front-end loading device, wafer processing equipment and detection method according to the present application achieve automatic detection of wafer warpage by setting up a detection mechanism, avoiding the error of human eye detection, being able to quickly and accurately judge the warpage situation of the wafer, providing accurate wafer information for the subsequent wafer transfer process and wafer processing process, so as to facilitate timely adaptive adjustment of the corresponding working parameters of the wafer transfer unit and wafer processing unit, or timely unloading of wafers that do not meet the processing requirements such as excessive warpage, avoiding wafer breakage or damage to the wafer processing equipment during the processing, improving the processing efficiency of the wafer processing equipment, and improving the yield rate and service life of the wafer processing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in the embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings.

[0035] Figure 1 Schematic diagram of a wafer processing equipment according to an embodiment of the present application;

[0036] Figure 2 For Figure 1 Schematic diagram of the loading port device in , showing the wafer cassette in the figure;

[0037] Figure 3 For Figure 1 Schematic diagram of the loading port device in , with the wafer cassette not shown in the figure;

[0038] Figure 4 For Figure 3 Schematic diagram of another angle of the loading port device in ;

[0039] Figure 5 Showing a wafer cassette according to an embodiment of the present application, which has been opened;

[0040] Figure 6 Showing Figure 5 Another angle view of the wafer cassette in , showing the detection mechanism of the loading port device in ; Figure 2 in the figure;

[0041] Figure 7 Showing a top view schematic diagram when performing wafer detection;

[0042] Figure 8 For Figure 6 Another angle schematic diagram of the wafer cassette and the detection mechanism in ;

[0043] Figure 9 ForFigure 5 Cross-sectional view of the wafer cassette at A-A;

[0044] Figure 10 Schematic diagram of the wafer detection process;

[0045] Figure 11 Schematic diagram showing a waveform image generated by an analyzer according to an embodiment of the present application;

[0046] Figure 12 Schematic diagram showing another waveform image generated by an analyzer according to an embodiment of the present application;

[0047] Figure 13 Schematic diagram showing yet another waveform image generated by an analyzer according to an embodiment of the present application;

[0048] Figure 14 Shows Figure 5 Schematic diagram of another angle of the wafer cassette in;

[0049] Figure 15 Shows Figure 14 Enlarged view of D in;

[0050] Figure 16 Flowchart showing a wafer detection method according to an embodiment of the present application;

[0051] Figure 17 Shows the execution of Figure 16 Flow block diagram of an information processing when performing the wafer detection method.

[0052] Reference numerals:

[0053] Wafer processing equipment 1; Front-end loading device 10; Front-end manipulator 101; Polishing unit 20; Thinning unit 30; Wafer transfer unit 40; Loading port device 100; Main body 110; Window 111; Door opener 112; Loading table 120; Detection mechanism 130; Horizontal rod 131a; Vertical rod 131b; Wafer cassette 200; Horizontal slot 210; Warpage detector 132; State detector 133; Vision detector 134; Display 140; Controller 150; Waveform 50; Platform area 51; Curve area 52; First position P1; Second position P2; First virtual scale R1; Second virtual scale R2; Wafer W. Detailed description of the invention

[0054] To enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the following will clearly and completely describe the technical solutions in the embodiments of the present application in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application should fall within the scope of protection of the embodiments of the present application.

[0055] In the description of the present application, it should be understood that the orientation or positional relationships indicated by the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0056] In addition, in the description of the present application, unless otherwise specified and limited, it should be noted that the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the communication inside two elements. It can be directly connected, or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0057] Figure 1 FIG. is a schematic diagram of a wafer processing apparatus 1 according to an embodiment of the present application. The wafer processing apparatus 1 includes a front-end loading device 10, a wafer processing unit, and a wafer transfer unit 40 for transferring a wafer W (see Figure 5 ) between the front-end loading device 10 and the wafer processing unit. Among them, the wafer processing unit may include a thinning unit 30 for grinding and thinning the wafer W and a polishing unit 20 for surface polishing and cleaning of the wafer W. It should be understood that in other embodiments, the wafer processing unit may only include one of the thinning unit 30 or the polishing unit 20, or may include a processing unit for implementing other processing processes, such as a wafer edge polishing unit or a wafer edge cutting unit, etc.

[0058] As Figures 1-4 shown, the front-end loading device 10 may include a loading port device 100, a wafer cassette 200 movably placed on a loading table 120 of the loading port device 100, and a front-end robot 101 for taking the wafer W from the wafer cassette 200 or placing the wafer W into the wafer cassette 200. The wafer cassette 200 may be a FOUP (Front Open Unified Pod). Specifically, as Figures 2-4, the load port device 100 mainly includes a main body 110, a loading table 120 horizontally protruding from the main body 110, and a detection mechanism 130 movably mounted to the main body 110 (see Figure 4 ). Among them, the loading table 120 is used to place the wafer cassette 200. The main body 110 extends vertically and is configured with a window 111. In the vertical direction, the window 111 is located above the loading table 120, and the opening size of the window 111 matches the size of the wafer cassette 200. The detection mechanism 130 can detect the wafer W in the wafer cassette 200 through the window 111, and the front end manipulator 101 can enter the wafer cassette 200 through the window 111 to pick up and place the wafer. "Movably placed" means that the wafer cassette 200 can be placed on the loading table 120 of the load port device 100, for example, to supply the wafer W to be processed to the wafer processing unit; it can also be removed from the loading table 120 of the load port device 100, for example, to remove the processed wafer W received from the wafer processing unit.

[0059] Figure 5 Fig. shows a wafer cassette 200 according to an embodiment of the present application. The wafer cassette 200 is opened, and for clarity, only one wafer W is shown. The wafer cassette 200 has a size suitable for accommodating the wafer W, and a plurality of horizontal slots 210 are arranged vertically in its cavity for stacking the wafers W at intervals in the vertical direction. Figure 5 Fig. shows the horizontal slots 210 formed in the form of partitions, that is, a plurality of partitions are symmetrically arranged on the inner walls on both sides of the wafer cassette 200, and horizontal slots 210 are formed between two adjacent partitions in the vertical direction. The wafer cassette 200 has a detachable movable door (not shown). When the wafer cassette 200 is placed on the loading table 120 of the load port device 100, the movable door faces the load port device 100, that is, faces Figure 1 the left side in Fig. The load port device 100 may have an opener 112 mounted to its main body 110 (see Figure 3 ), and the opener 112 can open the movable door of the wafer cassette 200 and move the movable door to avoid blocking the wafer W, so that the wafer W is exposed towards the load port device 100, facilitating the detection of the wafer W in the wafer cassette 200 by the detection mechanism 130 or facilitating the front end manipulator 101 to pick up and place the wafer W.

[0060] In a specific embodiment, the detection mechanism 130 can be movably mounted to the main body 110 and movable in the vertical direction to sequentially detect the wafers W in the wafer cassette 200. As Figure 4 and Figures 6 to 8 shown, the detection mechanism 130 may include a gantry-shaped detection frame, specifically as Figure 6, the detection frame has a horizontally extending horizontal rod 131a and vertical rods 131b vertically extending downward from both ends of the horizontal rod 131a. The detection frame can be movably mounted to the main body 110 via a vertically extending guide rail (not shown). A detector can be provided on the detection frame. After the wafer cassette 200 is placed on the loading table 120 and the movable door of the wafer cassette 200 is opened, the detection frame can move vertically along the guide rail, for example, move from the top of the window 111 to the bottom of the window 111, so that the detector scans the wafers W in the wafer cassette 200 from top to bottom in sequence, thereby detecting the placement state or warpage state of the wafers W. It should be understood that the width of the detection frame (i.e., the length of the horizontal rod 131a) can be longer or shorter than the width of the window 111, as long as the detector thereon can detect the wafers W.

[0061] In a specific embodiment, as Figure 6 , the detection mechanism 130 can include a warpage detector 132 and an analyzer (not shown) communicatively connected to the warpage detector 132. The warpage detector 132 can be provided in the middle of the horizontal rod 131a of the detection frame. The warpage detector 132 is configured to send a warpage detection signal to the analyzer, and the magnitude of the warpage detection signal is related to the horizontal distance between the warpage detector 132 and the wafer W, that is, the smaller the horizontal distance between the warpage detector 132 and the wafer W, the larger the warpage detection signal. For example, the warpage detector 132 can be an infrared sensor that emits infrared light toward the wafer W and receives the infrared light reflected by the wafer W, and then converts the received infrared light into an electrical signal to obtain the warpage detection signal. The smaller the horizontal distance between the infrared sensor and the wafer W, the stronger the reflected infrared light, and thus the larger the warpage detection signal. In an alternative embodiment, the warpage detector 132 can also use other detectors with a similar relationship between distance and signal strength, such as an ultrasonic detector, etc.

[0062] As Figure 9 shows Figure 5 a cross-sectional view of the wafer cassette 200 at A-A, which shows a warped wafer W. As Figure 10 shows the detection process of the warped wafer W, which shows Figure 9The partial wafer cassette 200 and the wafer W intercepted at the dashed box B. During the vertical movement of the warp detector 132 along with the detection frame, for example, from top to bottom as indicated by the arrow, the horizontal distance between the warp detector 132 and the wafer W changes, thereby causing a change in the strength of the warp detection signal. For example, the warp detection signal increases as the horizontal distance from the warp detector to the wafer decreases. The analyzer is configured to determine the warp information of the wafer W based on the warp detection signal and the vertical displacement of the warp detector 132. Specifically, the analyzer can generate a waveform image showing how the warp detection signal changes with the vertical displacement of the warp detector 132, and determine the warp information of the wafer W based on the shape of the waveform image. The warp information of the wafer W may include the warp degree and / or the warp direction, etc.

[0063] Figures 11-13 The schematic diagrams of three waveform images generated by an analyzer according to an embodiment of the present application are shown. The horizontal axis is the vertical displacement of the warp detector 132, such as the vertical displacement when moving from top to bottom, and the origin can correspond to the top position of the wafer cassette 200; the vertical axis represents the magnitude of the warp detection signal. In each figure, three spaced-out protruding waveforms 50 are shown, indicating that three vertically spaced stacked wafers W are continuously measured.

[0064] Figure 11 In [a certain situation], the waveform image has a protruding rectangular wave. That is, when the warp detector 132 passes over the wafer W, the horizontal distance between the wafer W and the warp detector 132 remains the same, and the magnitude of the warp detection signal is the same. Therefore, it can be determined that this wafer W is a non-warped wafer W with a warp degree of 0. The thickness of the wafer W can be determined according to the width of the rectangular wave, that is, the width of the flat region 51 of the rectangular wave.

[0065] Figure 12 and Figure 13 In [other situations], the protruding waveform 50 in the waveform image has a flat region 51 and a curved region 52 continuous with the flat region 51. That is, when the warp detector 132 passes over the wafer W, the horizontal distance between the wafer W and the warp detector 132 changes, and the magnitude of the warp detection signal changes. From this, it can be determined that the corresponding wafer W is a warped wafer. Among them, the flat region 51 represents the situation when the warp detector 132 passes over the outer peripheral end face of the wafer W, the width of the flat region 51 can represent the thickness of the wafer W, the curved region 52 represents the curved surface part of the warped wafer W detected by the warp detector 132, and the total width of the flat region 51 and the continuously connected curved region 52 in the horizontal axis direction can represent the warp degree of the wafer W, that is, the maximum distance that the wafer W extends throughout in the axial direction (thickness direction) of the wafer W. For example, it is the maximum distance that the edge of the wafer W deviates from the center of the wafer W in the axial direction of the wafer W.

[0066] More specifically, Figure 12 One waveform 50 in [a certain situation] and Figure 10When the warpage detector 132 moves from the first position P1 to the second position P2, the detection results between the two dashed lines are roughly the same. In the vertical displacement direction of the warpage detector 132, the curve region 52 is located downstream of the platform region 51 and the curve region 52 gradually descends. From this, it can be determined that the warpage direction of the corresponding wafer W is opposite to the vertical displacement direction of the warpage detector 132. For example, when the warpage detector 132 moves downward, the wafer W warps upward, that is, the middle part of the wafer W is concave, as Figure 9 shown in the warpage state, for example, it is called bowl-shaped or smiley-face-shaped. And in Figure 13 , in the vertical displacement direction of the warpage detector 132, the curve region 52 is located upstream of the platform region 51 and the curve region 52 gradually rises. From this, it can be determined that the warpage direction of the corresponding wafer W is the same as the vertical displacement direction of the warpage detector 132. For example, when the warpage detector 132 moves downward, the wafer W warps downward, that is, the middle part of the wafer W is convex, which is opposite to the warpage state as Figure 9 shown, for example, it is called inverted bowl-shaped or crying-face-shaped. In other embodiments, for wafers warped in other shapes (such as saddle-shaped, irregular bowl-shaped or inverted bowl-shaped), the warpage can also be judged by the specific shape of the waveform image.

[0067] Furthermore, since the wafer W has a certain elasticity and there may be certain stress on the surface of the warped wafer, vibrations will be generated during the engagement process between the wafer cassette 200 and the main body 110 or during the opening process of the movable door of the wafer cassette 200, and the gravity acting on the wafer may cause the warpage state of the wafer W to change. When the warpage state of the wafer W is crying-face-shaped, the warpage information (warpage degree) of the wafer W output by the analyzer is calculated and output as 100% - n% of the actually detected warpage degree. Among them, according to information such as the material and thickness of the wafer W, n can be calibrated from 0 to 2; in other words, when the warpage direction is downward warpage, the absolute value of the warpage degree output by the analyzer based on the total width value of the same curve region 52 and platform region 51 is lower than that when the warpage direction is upward warpage. When the analyzer determines that the warpage direction is downward crying-face-shaped, it performs an amplification process on the calculated warpage degree to increase the safety redundancy of setting the pick-up position of the front-end manipulator 101.

[0068] In a preferred embodiment, the smoothness of the warpage can be judged by the curvature of the curve region 52. For example, Figure 12 and Figure 13 the curvatures of the curve regions 52 in are relatively consistent and basically the same, or in other embodiments, the curvature changes continuously and there is no sudden change in curvature, then it can be determined that the warpage of the wafer is relatively smooth, such as smooth and regular bowl-shaped or inverted bowl-shaped; if there is a sudden change in the curvature of the curve region 52, it can be determined that the warpage is relatively uneven, and there may be wavy warpage or bent regions.

[0069] Figure 6 and Figure 7Only one warpage detector 132 facing a diameter of the wafer is shown, so the warpage information in the vertical direction on this diameter ( Figure 7 in ) can be detected. In a preferred embodiment, the detection mechanism may include two or more warpage detectors 132 arranged at intervals, for example, arranged at equal intervals along the horizontal rod 131a. By analyzing and comparing the waveform images of the two or more warpage detectors 132, the analyzer can determine the warpage information of the wafer in the arrangement direction of the two or more warpage detectors ( Figure 7 the left-right direction in ) and in the direction perpendicular to the arrangement direction ( Figure 7 the vertical direction in ), so as to obtain more accurate and comprehensive wafer warpage information, reduce detection errors, and provide more accurate and effective information for subsequent transmission and processing.

[0070] According to an embodiment of the present application, the warpage detector 132 and the analyzer are simply arranged and realize automatic detection, avoiding the errors of human eye detection, and can quickly and accurately judge the warpage information of the wafer W, providing accurate wafer information for the subsequent wafer transmission process and wafer processing process, so as to facilitate timely adaptive adjustment of the corresponding working parameters of the wafer transmission unit 40 and the wafer processing unit (such as the wafer picking position of the front-end manipulator 101), effectively prevent wafer collision and fragmentation, and can facilitate timely unloading of wafers that do not meet the processing requirements such as excessive warpage, avoid wafer breakage or damage to the wafer processing equipment during the processing process, improve the processing efficiency of the wafer processing equipment, and improve the yield rate and service life of the wafer processing equipment.

[0071] When the warpage degree of the wafer W output by the warpage detector 132 is the original value without being processed, the wafer picking position of the front-end manipulator 101 should consider the vibration generated during the engagement process between the wafer cassette 200 and the main body 110 or the opening process of the movable door of the wafer cassette 200 and the change in the warpage state of the wafer due to the action of gravity. Especially when the warpage state of the wafer W is a "crying face", the wafer picking position of the front-end manipulator 101 should be lower than the actual position of the wafer W after engagement rather than just lower than the position information obtained during detection.

[0072] For example, when it is detected that the warpage state of the wafer W is a "crying face", the wafer picking position of the front-end manipulator 101 should consider the warpage degree as X*(1 + n)%, where X is the actually detected warpage degree. According to information such as the material and thickness of the wafer W, n can be calibrated from 0 to 2.

[0073] In a preferred embodiment, the analyzer can also determine the placement state of the wafer W based on the waveform image. The placement states include single-wafer state, stacked-wafer state, and cross-slot state. A wafer thickness threshold can be set in the analyzer. For example, the actual wafer thickness may be 775 microns, 750 microns, 725 microns, etc. The wafer thickness threshold can be slightly greater than these thicknesses, such as 780 microns, 755 microns, 730 microns, etc. Or for bonded wafers, the thickness is twice these values. And a preset interval matching the vertical dimension of the horizontal slot 210 (i.e., the opening size of the horizontal slot 210 in the vertical direction) can be set in the analyzer. The method for judging the placement state is as follows:

[0074] Based on the fact that the width of the protruding waveform 50 in the waveform image is less than the preset interval, and the width of the platform area 51 of the protruding waveform 50 in the waveform image is less than or equal to the wafer thickness threshold, that is, the wafer W is in one horizontal slot 210 and only the thickness of one wafer W is recognized. Thus, it can be determined that the placement state is the single-wafer state;

[0075] Based on the fact that the width of the protruding waveform 50 in the waveform image is less than the preset interval, and the width of the platform area 51 of the protruding waveform 50 in the waveform image is greater than the wafer thickness threshold, that is, the wafer is in one horizontal slot 210 and the thickness of more than one wafer is recognized. Thus, it can be determined that the placement state is the stacked-wafer state, that is, two or more wafers are placed in one horizontal slot;

[0076] Based on the fact that the width of the protruding waveform 50 in the waveform image exceeds the preset interval, that is, the wafer W straddles at least two horizontal slots 210. Thus, it can be determined that the placement state is the cross-slot state.

[0077] According to the embodiment of the present application, by integrating the detection of the placement state in the analyzer, the detection function of the detection mechanism 130 is further increased, the effectiveness of detecting the abnormal state of the wafer is improved, further preventing the abnormal wafer W from entering the subsequent processing process, and improving the effectiveness and yield of wafer processing.

[0078] In addition, the analyzer can also detect the presence or absence of the wafer according to the waveform image. For example, if no protruding waveform 50 is displayed in the waveform image within the range of the preset interval, it can be determined that no wafer is placed in the corresponding horizontal slot 210.

[0079] In a preferred embodiment, as Figure 6 、 Figure 7As shown, the detection mechanism 130 may further include a status detector 133 disposed on the horizontal rod 131a, which is configured to detect the placement status of the wafer in the horizontal slot 210. By adding the status detector 133, both the warpage detector 132 and the status detector 133 can detect the placement status, thereby forming a dual detection and reducing the error rate of the detection results. The status detector 133 may have a separate analyzer for data analysis, or may share an analyzer with the warpage detector 132.

[0080] In Figure 6 and Figure 7 In the illustrated embodiment, the status detector 133 is a through-beam sensor. The through-beam sensor may include a transmitter and a receiver disposed at a horizontal interval, and the receiver receives the through-beam light emitted by the transmitter. The warpage detector 132 may be disposed between the transmitter and the receiver. When performing wafer detection, the detection frame of the detection mechanism 130 may move a distance through the window 111 towards the wafer cassette 200, so that the status detector 133 at least partially extends into the wafer cassette 200 (such as Figure 7 ), so that when the detection mechanism 130 moves in the vertical direction, the wafer W in the wafer cassette 200 passes between the transmitter and the receiver to block the through-beam light, and the through-beam sensor determines the placement status of the wafer W based on the time when the receiver does not receive the through-beam light or the distance moved when the through-beam light is not received. The judgment method of the through-beam sensor is, for example:

[0081] If the distance moved by the through-beam sensor based on the non-reception of the through-beam light exceeds a preset interval, the placement status can be determined to be a cross-slot status;

[0082] If the distance moved by the through-beam sensor based on the non-reception of the through-beam light is less than or equal to the wafer thickness threshold, the placement status can be determined to be a single-wafer status;

[0083] If the distance moved by the through-beam sensor based on the non-reception of the through-beam light is greater than the wafer thickness threshold and less than the preset interval, the placement status can be determined to be a stacked-wafer status. It should be understood that for a through-beam sensor without a wafer warpage detection function, when the wafer warpage degree is small and close to the wafer thickness in the case of stacked wafers, it may be difficult for the through-beam sensor to determine whether "the distance moved based on the non-reception of the through-beam light is greater than the wafer thickness threshold and less than the preset interval" is caused by wafer stacking or wafer warpage, and it may uniformly determine it as a stacked-wafer status. In this case, the through-beam sensor can be used as a preliminary judgment of the wafer placement status, and can cooperate with the warpage detector 132 for accurate judgment in the further judgment process.

[0084] Since the relationship between time and moving distance is proportional, this judgment method based on the time when the receiver does not receive the through-beam light is similar to the above, and will not be elaborated here.

[0085] In addition, in an alternative embodiment, the status detector 133 may be in the form of other sensors, such as a vision sensor, which can accurately judge the wafer placement status through vision image detection. In this case, it can accurately distinguish the stacked wafer state and wafer warping, and can accurately distinguish the single wafer state without warping and the single wafer state with warping.

[0086] In terms of the execution steps, the detection of the wafer placement status by the status detector 133 can be performed prior to the warping detection by the warping detector 132, so as to perform the warping detection after at least excluding one of the abnormal states of cross-slot or stacking, thereby improving the detection efficiency. And in the case of abnormal placement status, it can timely feedback abnormal information or an abnormal alarm to remind the operator to take timely and appropriate countermeasures to prevent damage to the processing equipment or personnel. In addition, in an alternative embodiment, the detection of the wafer placement status by the status detector 133 can be performed synchronously with the warping detection and / or the placement status detection of the warping detector 132 to perform dual detection synchronously, improve the detection accuracy, and reduce false alarms.

[0087] By setting the status detector 133 and the warping detector 132, the two can complement each other, perform dual detection and judgment on the wafer placement status, reduce the detection error, and improve the detection accuracy.

[0088] In a preferred embodiment, the loading port device 100 further includes a display 140 (see Figure 17 ) communicatively connected to the detection mechanism 130. The display 140 is configured to receive and display the warping information of the wafer and the wafer placement status information, so as to provide corresponding information to the operator, or to warn of the abnormality of the wafer W in the wafer cassette 200 with a prominent graphic identifier, such as wafer stacking, cross-slot, or excessive warping degree, etc. Optionally, the display 140 may be equipped with a sound output device to prompt the abnormality of the wafer in the wafer cassette 200 in the form of an alarm sound.

[0089] In a further embodiment, the detection mechanism 130 may further include a vision detector 134. The vision detector 134 is disposed facing the sidewall of the wafer cassette 200 such that its detection field of view can at least include the sidewall of the wafer cassette 200 and at least one horizontal slot 210 at the sidewall. As Figure 6 shown, the vision detector 134 may be disposed at a corner of the detection frame, that is, one end of the horizontal rod 131a or the top end of the vertical rod 131b, or at any suitable position on the vertical rod 131b. The vision detector 134 may be configured to detect the edge of the wafer W at the horizontal slot 210 of the wafer cassette 200 and identify the horizontal distance between the edge of the wafer W and the sidewall of the wafer cassette 200 to determine the warping information of the wafer. As Figure 14 shows from Figure 5A simplified schematic diagram of the wafer cassette 200 as viewed in the direction of arrow C, where the dashed box D indicates the detection field of view of the vision detector 134. It should be understood that in an alternative embodiment, the detection field of view can be larger or smaller.

[0090] Figure 15 An enlarged view at the dashed box D is shown. The vision detector 134 can construct a first virtual scale ruler R1 in its detection field of view that starts from the inner surface of the side wall of the wafer cassette and extends horizontally inward, and reads the scale corresponding to the edge of the wafer to determine the horizontal distance. Since the warped wafer is farther from the side wall of the wafer cassette 200 than the non-warped wafer, the vision detector 134 can be configured to determine that the corresponding wafer is a warped wafer when the horizontal distance is greater than a preset first distance threshold, and then can transmit information about the wafer warping to the controller 150 to guide the front-end manipulator 101 to adjust the wafer picking position (such as the height of the front-end manipulator 101 when picking up the wafer). Wherein, the first distance threshold can be approximately the horizontal distance between the non-warped wafer and the side wall of the wafer cassette 200.

[0091] Furthermore, the vision detector 134 is also configured to identify the vertical distance between the edge of the wafer and the horizontal slot 210. Specifically, the vision detector 134 constructs a second virtual scale ruler R2 in its detection field of view that starts from the upper surface of the horizontal slot 210 and extends vertically upward, and reads the scale corresponding to the edge of the wafer W to determine the vertical distance. When the wafer warps upward, i.e., in a bowl-shaped or smiling face-shaped warp, the edge of the wafer W will move away from the horizontal slot 210; when the wafer warps downward, i.e., in an inverted bowl-shaped or crying face-shaped warp, the edge of the wafer W will be close to the horizontal slot 210. Thus, the vision detector is configured to: determine that the warping direction of the corresponding wafer is upward warping when the horizontal distance is greater than the first distance threshold and the vertical distance is greater than a preset second distance threshold; determine that the warping direction of the corresponding wafer is downward warping when the horizontal distance is greater than the first distance threshold and the vertical distance is not greater than the second distance threshold. Wherein, the second distance threshold can be approximately the vertical distance between the non-warped wafer and the horizontal slot 210, and the second distance threshold can be a smaller value adapted to the slight warping of the wafer allowed when the front-end manipulator 101 picks up the wafer.

[0092] The greater the horizontal distance between the wafer and the side wall of the wafer cassette 200, the greater the degree of wafer warping; the greater the vertical distance between the wafer and the horizontal slot 210, the greater the degree of wafer warping. Therefore, the degree of wafer warping can be judged based on the horizontal distance and / or the vertical distance. When it is determined that the degree of warping is large and exceeds the picking position tolerance of the front-end manipulator 101, the picking position of the front-end manipulator 101 can be adjusted so that the front-end manipulator 101 can pick up the wafer accurately and stably, preventing risks such as hitting the wafer and causing wafer fragments.

[0093] By setting up the vision detector 134, warpage detection can be performed at the edge of the wafer, and the warpage information can be obtained conveniently and quickly by reading the scale. The vision detector 134 can cooperate with the aforementioned warpage detector 132 to perform double detection and verification of the warpage information, reducing misjudgment. Moreover, for wafers with metals in the device area that are vulnerable to photolithography, the vision detector 134 detects the edge of the wafer without strong light irradiation on the device area in the middle of the wafer, so the device area will not be optically damaged, thereby reducing the damage rate of the wafer.

[0094] In an alternative embodiment, in addition to setting the virtual scale, the vision detector 134 can be configured to identify whether there is a wafer at a first spacing threshold horizontally away from the inner surface of the side wall of the wafer cassette 200. If no wafer is present, it is determined that the horizontal distance between the wafer and the inner surface of the side wall of the wafer cassette exceeds the first spacing threshold, and then the corresponding wafer is determined to be a warped wafer; if a wafer is identified as present, it can be determined that the horizontal distance between the wafer and the inner surface of the side wall of the wafer cassette does not exceed the first spacing threshold, and then the corresponding wafer can be determined to be a non-warped wafer. This identification method is simple and convenient, and can improve the wafer detection efficiency.

[0095] In a preferred embodiment, two vision detectors 134 can be provided, which respectively perform wafer detection at two opposite side walls of the wafer cassette 200, thereby improving the detection accuracy and reducing misjudgment caused by horizontal displacement of the wafer. Or more than two vision detectors 134 can be provided.

[0096] Figure 16 The flowchart of a wafer detection method according to an embodiment of the present application is shown. The method includes:

[0097] S1: Open the movable door of the wafer cassette 200 to expose the wafer W in the wafer cassette 200 to the detection mechanism 130;

[0098] S2: Control the detection mechanism 130 to move in the vertical direction to sequentially detect the wafers W in the wafer cassette 200;

[0099] S3: Output the detected wafer information.

[0100] Specifically, step S2 may include: detecting the warpage information of the wafer W via the warpage detector 132. Alternatively, step S2 may further include: detecting the placement state of the wafer W via the warpage detector 132 and / or detecting the placement state of the wafer W via the state detector 133.

[0101] In one embodiment, the method may further include: adjusting the wafer pick-up position of the front-end robot 101 for picking up wafers from the cassette 200 based on the warpage information of the wafer. For example, if the wafer is warped upward (with the middle part concave), the pick-up height of the front-end robot 101 is reduced; or if the wafer is warped downward (with the middle part convex), the pick-up height of the front-end robot 101 is increased. The specific adjustment value of the pick-up height can be further determined based on the wafer warpage degree. Thereby, the front-end robot 101 can be prevented from hitting the warped wafer, reducing the risk of wafer breakage.

[0102] In addition, in a preferred embodiment, step S3 may include outputting the detected wafer W information to the controller 150 (see Figure 17 ), and controlling the display 140 via the controller 150 to output an alarm prompt signal in the form of a graphic identifier or an alarm sound.

[0103] Figure 17 shows a flowchart of an information processing when performing Figure 16 the wafer detection method. First, information is collected while the detection mechanism 130 moves in the vertical direction, and then the placement state of the wafer W is judged. In the case where the judged state is the stacked state or the cross-slot state, a signal can be transmitted to the controller 150 and further transmitted to the display 140; in the case where the judged state is the single-wafer state, the warpage information can be further detected, and the warpage information is transmitted to the controller 150 and further transmitted to the display 140. Among them, the detection of the warpage information can be performed by the warpage detector 132, and the detection of the placement state can be performed by both the warpage detector 132 and the state detector 133 or either one of them. And Figure 17 the information processing sequence shown in

[0104] The present application also provides a computer storage medium, on which a computer program is stored. When the program is executed by a processor, the foregoing wafer detection method is implemented. Specifically, a system or device equipped with a storage medium can be provided, on which software program code for implementing the functions of any one of the above embodiments is stored, and the computer (or CPU or MPU) of the system or device is caused to read and execute the program code stored in the storage medium. In this case, the program code read from the storage medium itself can implement the functions of any one of the above embodiments, so the program code and the storage medium storing the program code constitute a part of the present application. Embodiments of the storage medium for providing the program code include floppy disks, hard disks, magneto-optical disks, optical disks (such as CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-RAM, DVD-RW, DVD+RW), magnetic tapes, non-volatile memory cards, and ROMs. Optionally, the program code can be downloaded from a server computer via a communication network.

[0105] The above embodiments are only used to illustrate the embodiments of the present application, rather than to limit the embodiments of the present application. Those of ordinary skill in the relevant technical field can also make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application. The patent protection scope of the embodiments of the present application shall be defined by the claims.

Claims

1. A loading port device for wafer processing equipment, characterized in that: The loadport device comprises: main body; A loading platform protruding horizontally from the main body, the loading platform is used to place a wafer box, the wafer box is used to stack wafers at intervals along the vertical direction, the wafer box has a plurality of horizontal slots arranged along the vertical direction, the horizontal slots extend from the side wall of the wafer box to the inside of the wafer box; and a detection mechanism movably mounted to the main body and movable in a vertical direction to sequentially detect wafers in the wafer box, the detection mechanism comprising a warpage detector, an analyzer communicatively connected to the warpage detector, and a visual detector disposed toward the side wall; The warp detector is configured to send a warp detection signal to the analyzer, wherein the warp detection signal increases as the horizontal distance from the warp detector to the wafer decreases; the analyzer is configured to determine the warp information of the wafer based on the warp detection signal and the vertical displacement of the warp detector; The visual detector is configured to: construct a first virtual scale in its detection field of view, which takes the inner surface of the side wall as a starting point and extends horizontally inward, and read the scale corresponding to the edge of the wafer to determine the horizontal spacing between the edge of the wafer and the side wall; and construct a second virtual scale in its detection field of view, which takes the upper surface of the horizontal slot as a starting point and extends vertically upward, and read the scale corresponding to the edge of the wafer to determine the vertical spacing between the edge of the wafer and the horizontal slot; when the horizontal spacing is greater than a first spacing threshold and the vertical spacing is greater than a second spacing threshold, determine that the warping direction of the corresponding wafer is upward warping, and when the horizontal spacing is greater than the first spacing threshold and the vertical spacing is not greater than the second spacing threshold, determine that the warping direction of the corresponding wafer is downward warping.

2. The load port device according to claim 1, characterized in that The analyzer is capable of generating a waveform image of the warpage detection signal as it changes with a vertical displacement of the warpage detector, and determining the warpage information of the wafer based on a shape of the waveform image.

3. The load port device according to claim 2, characterized in that The warping information includes a warping degree and / or a warping direction.

4. The load port device according to claim 2, characterized in that The analyzer determines that the corresponding wafer is a non-warped wafer based on the convex rectangular wave in the waveform image.

5. The load port device according to claim 2, characterized in that The analyzer determines that the corresponding wafer is a warped wafer based on the fact that a convex waveform in the waveform image has a plateau region and a curved region continuous with the plateau region.

6. The load port device according to claim 5, characterized in that The analyzer determines that the warpage direction of the corresponding wafer is opposite to the vertical displacement direction of the warpage detector based on the fact that the curve area is located downstream of the platform area in the vertical displacement direction of the warpage detector and the curve area gradually descends.

7. The load port device according to claim 5, characterized in that The analyzer determines that the warpage direction of the corresponding wafer is the same as the vertical displacement direction of the warpage detector based on the fact that the curved area is located upstream of the platform area in the vertical displacement direction of the warpage detector and the curved area gradually rises.

8. The load port device according to claim 5, characterized in that The analyzer determines the warpage of the corresponding wafer based on the total width of the platform area and the curved area connected thereto in the vertical displacement direction of the warpage detector. When the warpage direction is downward warpage, the absolute value of the warpage output by the analyzer based on the same total width value is lower than that of upward warpage.

9. The load port device according to claim 5, characterized in that The analyzer is also configured to determine the warpage smoothness of the wafer based on the curvature of the curve area, determine the warpage smoothness as smooth when the curvature of the curve area is the same or changes continuously, and determine the warpage smoothness as uneven when there is a sudden change in the curvature of the curve area.

10. The load port device according to claim 2, characterized in that The analyzer is also configured to determine a thickness of the wafer based on a width of a plateau region of a convex waveform in the waveform image.

11. The load port device according to any one of claims 2 to 10, characterized in that: The analyzer is further configured to determine a placement state of the wafer based on a shape of the waveform image, the placement state including a single-wafer state, a stacked-wafer state, and a cross-slot state.

12. The loadport device according to claim 11, characterized in that The wafer box has a plurality of horizontal slots arranged in a vertical direction for placing wafers, and the analyzer is provided with preset intervals matching the vertical dimensions of the horizontal slots; The analyzer determines that the placement state is a single-chip state based on the width of the protruding waveform in the waveform image being less than the preset interval, and the width of the platform area of ​​the protruding waveform in the waveform image being less than or equal to a wafer thickness threshold; and / or The analyzer determines that the placement state is a stacking state based on the fact that the width of the waveform protruding in the waveform image is less than the preset interval, and the width of the platform area of ​​the waveform protruding in the waveform image is greater than a wafer thickness threshold; and / or The analyzer determines that the placement state is a slot-crossing state based on that a width of a protruding waveform in the waveform image exceeds the preset interval.

13. The load port device according to any one of claims 2 to 10, characterized in that: The detection mechanism includes two or more warp detectors arranged at intervals, and the analyzer determines the warp information of the wafer in the arrangement direction of the two or more warp detectors and in the direction perpendicular to the arrangement direction by analyzing the waveform images of the two or more warp detectors.

14. The load port device according to any one of claims 1 to 10, characterized in that: The warpage detector is an infrared sensor.

15. The load port device according to any one of claims 1 to 10, characterized in that: The wafer box has a plurality of horizontal slots arranged along the vertical direction for placing wafers; the detection mechanism also includes a state detector, which is configured to detect the placement state of the wafers in the horizontal slots, and the placement state includes a single-wafer state, a stacked-wafer state and a cross-slot state.

16. The loadport device according to claim 15, characterized in that The state detector is a through-beam sensor, which includes a transmitter and a receiver arranged horizontally at intervals, and the receiver receives the through-beam light emitted by the transmitter. When performing wafer detection, the state detector at least partially extends into the wafer box so that when the detection mechanism moves in the vertical direction, the wafers in the wafer box pass between the transmitter and the receiver to block the through-beam light. The through-beam sensor determines the placement state based on the time when the receiver does not receive the through-beam light or the distance moved when the receiver does not receive the through-beam light.

17. The loadport device according to claim 15, characterized in that The load port device further includes a display communicatively connected to the detection mechanism, wherein the display is configured to receive and display the warpage information and placement status information of the wafer.

18. The loadport device according to claim 1, characterized in that The visual detector is configured to identify the horizontal distance between the edge of the wafer and the side wall of the wafer box to determine the warping information of the wafer, including: the visual detector identifies whether there is a wafer at a first spacing threshold horizontally away from the inner surface of the side wall of the wafer box; if no wafer exists, it is determined that the horizontal distance between the wafer and the inner surface of the side wall of the wafer box exceeds the first spacing threshold, and then the corresponding wafer is determined to be a warped wafer.

19. The load port device according to any one of claims 1 to 10, characterized in that: The main body is configured with a window, and the detection mechanism detects the wafers in the wafer box through the window; the loading port device also includes a door opener installed to the main body, and the door opener is configured to open a movable door of the wafer box toward the window and move the movable door to expose the wafers in the wafer box toward the loading port device.

20. A front-end loading device for wafer processing equipment, characterized in that: The front loading device comprises: The load port device according to any one of claims 1 to 19; A wafer box, which is movably placed on a loading platform of the load port device, and the wafer box is configured to stack wafers at intervals in a vertical direction; A front-end robot is configured to take a wafer from the wafer box or place a wafer into the wafer box.

21. A wafer processing equipment, characterized in that: The wafer processing equipment comprises: The front loading device according to claim 20; Wafer processing units; and A wafer transfer device is configured to transfer wafers from the front end loading device to the wafer processing unit for wafer processing.

22. A wafer inspection method, used in the load port device according to any one of claims 1 to 19, characterized in that: The method comprises: Opening a movable door of a wafer box so that the wafers in the wafer box are exposed toward the detection mechanism; Controlling the detection mechanism to move in a vertical direction to detect the wafers in the wafer box in sequence; Outputs the detected wafer information.

23. The wafer detection method according to claim 22, characterized in that: Controlling the detection mechanism to move in a vertical direction to sequentially detect the wafers in the wafer box comprises: The warpage information of the wafer is detected by a warpage detector.

24. The wafer detection method according to claim 23, characterized in that: Controlling the detection mechanism to move in a vertical direction to sequentially detect the wafers in the wafer box comprises: The placement state of the wafer is detected via a warpage detector and / or the placement state of the wafer is detected via a state detector.

25. The wafer inspection method according to claim 23, characterized in that: The method further comprises: The wafer taking position of a front-end robot for taking wafers from the wafer box is adjusted based on the warpage information of the wafer.

26. A computer storage medium, characterized in that The computer storage medium stores a computer program, which, when executed by a processor, implements the wafer detection method as described in any one of claims 22 to 25.

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