Semiconductor chip welding method and device

Through thermal field scanning and pulsed reflow heating treatment, combined with real-time melt state detection, atmosphere switching and dynamic cooling, the problem of 'non-complete reflow' of solder joints in multi-layer stacked packaging is solved, and the welding quality and packaging reliability are improved.

CN119650482AInactive Publication Date: 2025-03-18CHINASOL TECH SHENZHEN CO LTD
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Patent Information

Application Number
CN202510173105.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-02-17
Publication Date
2025-03-18
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

The existing multi-layer stacked packaging reflow soldering process is difficult to accurately perform melt monitoring and partitioning temperature control for different chip layers, resulting in "non-complete reflow" of local solder joints and subsequent failure.

Method used

By performing thermal field scanning on the multi-layer stacked package, a thermal field partition diagram is generated, pulse reflux heating is used, and the melting state of the solder joint is monitored in real time, atmosphere switching and local reheating are performed, and the cooling rate of the solder joint is finally controlled through dynamic cooling.

Benefits of technology

The fine control of solder joints of multi-layer stacked packaging is achieved, which reduces micro voids and stress concentration, and improves welding quality and packaging reliability.

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Abstract

The invention discloses a semiconductor chip welding method and device, and the method comprises the steps: carrying out the thermal field scanning of a multi-layer stacked package, obtaining the overall thermal imaging data, and generating a thermal field partition diagram containing a plurality of independent thermal control partitions; performing pulse type backflow heating treatment on each independent thermal control subarea to obtain real-time temperature data; carrying out real-time molten state detection to obtain surface topography data and temperature distribution data; performing atmosphere switching treatment on the independent thermal control subareas in the cooling stage to generate atmosphere switching subareas; performing micro-cycle steady-state detection on the atmosphere switching subareas, and performing local reheating treatment on the abnormal atmosphere switching subareas to generate reheating subareas; and carrying out dynamic cooling treatment on the reheating subarea. According to the technical scheme provided by the invention, through combination of partitioned pulse backflow and real-time monitoring, the welding spot melting state in multi-layer stacked packaging is accurately controlled, and the incomplete backflow defect is effectively prevented.
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