Rigid-flex circuit board bonding tool and rigid-flex circuit board batch bonding method

Abstract

The invention provides a rigid-flex circuit board bonding tool and a rigid-flex circuit board batch bonding method. The rigid-flex circuit board bonding tool comprises a base, a connecting assembly, a fixing assembly and a plurality of jacking assemblies. A fixed area is formed at the top of the base; the connecting assembly is arranged on the base and is respectively connected with the core body unit and the base; the fixing assembly comprises a plurality of pressing plates, the pressing plates are arranged on the periphery of the bonding prefabricated part, and a plurality of jacking openings are formed in the pressing plates; and each jacking assembly comprises a plurality of jacking pieces, the jacking pieces are in threaded connection with the corresponding jacking openings, and the inner ends of the jacking pieces abut against a first circuit board on the bonding prefabricated part. According to the rigid-flex circuit board bonding tool provided by the invention, the jacking part applies acting force to the first circuit board in each direction of the bonding prefabricated part, the first circuit board is fixed and does not deviate in the bonding process, and the curing uniformity after bonding and fixing can be realized.

Description

Technical Field

[0001] The invention belongs to the technical field of sensor circuit unit assembly, and in particular relates to a rigid-flexible circuit board bonding tool and a rigid-flexible circuit board batch bonding method. Background Art

[0002] In the field of sensor circuit assembly, it usually involves the fixation and interconnection between multiple circuit units in a single sensor. The traditional high-temperature wire interconnection method has the problems of large number, difficult operation, poor consistency, and difficult cleaning, which seriously affects the assembly efficiency and reliability of the sensor. The circuit board rigid-flex technology has the characteristics of saving space, simple assembly, good consistency, and no cleaning, and has broad application prospects.

[0003] In order to adapt to the spatial conditions of different products, rigid-flexible circuit boards are usually designed with flexible lines to interconnect circuit boards at different positions. Glue is pre-applied around the core unit before bonding, and then multiple rigid-flexible boards are assembled to the corresponding positions of the core unit for fixation, and then cured according to the glue curing conditions. The current method of uniformly fixing multiple rigid-flexible boards is to use high-temperature tape to wrap the circuit board and the core unit, but there is great uncertainty in the operation when operating the tape, and there is no external force to press and fix the circuit board, which can easily cause the circuit board to shift during the glue curing process, affecting the molding quality; when the circuit unit assembly position is on multiple surfaces, it is impossible to complete the fixation of all circuit boards at a time, resulting in repeated curing multiple times, a long operation time, and cannot meet mass production needs. Summary of the invention

[0004] The embodiments of the present invention provide a rigid-flexible circuit board bonding tool and a rigid-flexible circuit board batch bonding method, aiming to solve the technical problems in the prior art that high-temperature tape winding and fixing of rigid-flexible circuit boards is unstable, the curing frequency is high, and the production efficiency is affected.

[0005] To achieve the above object, the technical solution adopted by the present invention is: In a first aspect, a rigid-flexible circuit board bonding tool is provided, which is used to pressurize a bonding preform formed by bonding a core unit and a circuit board, wherein the bonding preform has a plurality of first circuit boards surrounding the core unit and a second circuit board conductively connected to one of the first circuit boards, and is characterized in that it includes: A base, the top of which forms a fixing area for fixing and bonding the preform, and a side of the base is provided with a receiving groove, and the receiving groove is used to fix the second circuit board; A connecting assembly is disposed on the base and respectively connects the core unit and the base; A fixing assembly, comprising a plurality of pressing plates, each of which is disposed on the outer periphery of the bonding preform, and each of which is provided with a plurality of tightening openings; and Multiple tightening assemblies correspond to the multiple pressure plates one by one, and each of the tightening assemblies includes a plurality of tightening parts, which are screwed to the corresponding tightening openings, and the inner ends of the tightening parts abut against the first circuit board on the bonding preform to apply different degrees of pressure to the first circuit board.

[0006] In combination with the first aspect, in a possible implementation, a plurality of plug-in slots are provided on the top of the fixing area, and the connecting assembly includes a plurality of connecting columns, and the plurality of connecting columns respectively penetrate the corners of the core unit, and the bottom ends of the connecting columns are plugged and fixed to the plug-in slots.

[0007] In combination with the first aspect, in a possible implementation, the fixing assembly also includes a stud and a plurality of fasteners, wherein the stud is arranged at the top of the connecting column, and a connecting hole is provided on the pressure plate located above the core unit, and the corresponding fasteners pass through the connecting hole and are connected to the stud to fix the pressure plate and the core unit located on the top of the core unit.

[0008] In combination with the first aspect, in a possible implementation, the pressure plate is divided into a side pressure plate and a top pressure plate, and the side pressure plates correspond to the sides of the core unit respectively; the top pressure plate is an L-shaped plate, and the top pressure plate is covered on the top and one side of the core unit. The top pressure plate and the side pressure plates enclose a fixed space with an opening at the bottom, and the top pressure plate is provided with weight reduction holes.

[0009] In combination with the first aspect, in a possible implementation, two pressing members are provided in each of the pressing assemblies, the two pressing members are respectively inserted into the pressing openings on the corresponding pressure plates, and the two pressing members are diagonally arranged.

[0010] In combination with the first aspect, in a possible implementation manner, the base includes: Base plate; A support plate is disposed directly above the bottom plate, the support plate forms the fixing area, the support plate is provided with a plurality of top holes extending vertically therethrough, and force application rods are provided in the top holes; and The side plate has upper and lower ends connected to the bottom plate and the support plate respectively, and the side plate is arranged on the same side of the bottom plate and the support plate, and the outer side surface of the side plate forms the fixing groove.

[0011] In combination with the first aspect, in a possible implementation, the rigid-flexible circuit board bonding tool further includes two magnetic parts, a mounting hole is provided on the side of the support plate, the two magnetic parts are respectively installed in the mounting hole and on the pressing plate, and the two magnetic parts are magnetically connected; The side of the support plate is also provided with a guide column, and the pressing plate is provided with a guide groove corresponding to the guide column, and the guide column is plugged and matched with the guide groove to limit the displacement of the pressing plate in the up and down directions.

[0012] Compared with the prior art, the rigid-flexible circuit board bonding tool provided by the present application provides a fixing tool, which uses a connecting component to fix the bonding preform on a base, and uses a pressure plate to provide support for the pressing member. The pressing member applies force to the first circuit board in various directions of the bonding preform. Multiple first circuit boards are stably fixed, which improves the molding quality of the first circuit boards and the core unit, realizes a stable bonding combination of multiple first circuit boards and the core unit, improves the bonding quality, and the first circuit board is fixed and will not shift during the bonding process, which can achieve curing uniformity after bonding and fixing, and ensure the planar effect of the circuit board structure and the glue void rate.

[0013] In a second aspect, a method for batch bonding of rigid-flexible circuit boards is provided, which is implemented based on a rigid-flexible circuit board bonding tooling as in any of the possible implementations described above, and is characterized in that it includes the following steps: S1: dispensing glue on the core unit, and placing a plurality of first circuit boards on the core unit respectively to form a bonding preform; S2: Screw the top fastener into the corresponding pressing plate; S3: attaching a plurality of pressing plates to the bonding preforms respectively, and pressing the pressing members to the corresponding first circuit boards; S4: placing the rigid-flexible circuit board bonding tool and the bonding preform 6 into an oven for curing.

[0014] In combination with the second aspect, in a possible implementation, S2 specifically includes: screwing the tensioning member to the pressing plate, and adjusting the distance that the tensioning member passes through the pressing plate.

[0015] In combination with the second aspect, in a possible implementation manner, after S3, the step further includes: fixing the second circuit board in the receiving groove.

[0016] The method for batch bonding of rigid-flexible circuit boards provided by the present invention provides a fixing tool, compared with the prior art, wherein a bonding preform is fixed on a base by using a connecting assembly, a pressing plate is used to provide support for a pressing member, and the pressing member applies a force to the first circuit board in various directions of the bonding preform, so that multiple first circuit boards are stably fixed, thereby improving the molding quality of the first circuit boards and the core unit, realizing a stable bonding combination of multiple first circuit boards and the core unit, and improving the bonding quality; the first circuit board is fixed and will not deviate during the bonding process, and can achieve uniform curing after bonding and fixing, thereby ensuring the planar effect and glue void rate of the circuit board structure; the core unit and the first circuit board are first pre-bonded, and then pressure is applied in the direction corresponding to the first circuit board by the pressing member to ensure uniform filling of the glue, thereby improving the bonding quality of the core unit and the first circuit board; the method is simple to operate, one tool can quickly fix one bonding preform, batch operation is not difficult, and can meet the needs of batch bonding. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0018] Figure 1 A schematic diagram of the structure of a rigid-flex circuit board bonding tool provided in an embodiment of the present invention; Figure 2 Another structural schematic diagram of a rigid-flex circuit board bonding tool provided by an embodiment of the present invention; Figure 3 for Figure 1 The main view of Figure 4 for Figure 1 Schematic diagram of assembly of the base and bonding prefabricated parts used in; Figure 5 for Figure 1 Schematic diagram of the assembly of the core unit and the connecting column used in the embodiment; Figure 6 for Figure 1 A schematic diagram of the structure of the core unit used in; Figure 7 for Figure 1 A schematic diagram of the structure of the pressing plate used in the embodiment; Figure 8 for Figure 1 A schematic diagram of connection between the first circuit board and the second circuit board; Fig. 9 for Figure 1Schematic diagram of the structure of the base used in.

[0019] Description of reference numerals: 1. base; 11. bottom plate; 12. support plate; 121. plug-in slot; 122. mounting hole; 123. guide column; 13. side plate; 14. force rod; 2. Connecting assembly; 21. Connecting column; 3. Fixing assembly; 31. Pressing plate; 311. Side pressing plate; 312. Top pressing plate; 3121. Horizontal plate; 3122. Vertical plate; 313. Top tightening opening; 314. Weight reduction hole; 315. Guide groove; 32. Stud; 33. Fastener; 4. Tightening assembly; 41. Tightening member; 5. Magnetic parts; 6. Bonding preforms; 61. Core unit; 62. First circuit board; 63. Second circuit body. DETAILED DESCRIPTION

[0020] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0021] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present application and its application or use. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0022] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0023] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the application. Meanwhile, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to actual proportional relationships. The technology, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0024] It should be noted that the terms "length", "width", "height", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "head", "tail" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the invention. The directional terms "inside" and "outside" refer to the inside and outside relative to the outline of each component itself.

[0025] It should also be noted that, unless otherwise clearly specified and limited, the terms such as "install", "connect", "connect", "fix", "set" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" may include both "above" and "below". The device may also be positioned in other different ways, and the spatially relative descriptions used here are interpreted accordingly.

[0027] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In addition, the meaning of "multiple" and "several" is two or more, unless otherwise clearly and specifically defined.

[0028] Please also read Figures 1 to 9 The method for bonding rigid-flexible circuit boards in batches provided by the present invention is now described. A rigid-flexible circuit board bonding tool is used to apply pressure to a bonding preform 6 formed by bonding a core unit 61 to a circuit board. The bonding preform 6 has a plurality of first circuit boards 62 surrounding the core unit 61 and a second circuit board 63 conductively connected to one of the first circuit boards 62. The flexible circuit board bonding tool comprises a base 1, a connecting component 2, a fixing component 3, and a plurality of tightening components 4. A fixing area for fixing the bonding preform 6 is formed on the top of the base 1, and a receiving groove is provided on the side of the base 1, which is used to fix the second circuit board 63; the connecting component 2 is arranged on the base 1, and respectively connects the core unit 61 and the base 1; the fixing component 3 includes a plurality of pressing plates 31, and the plurality of pressing plates 31 are respectively arranged on the outer periphery of the bonding preform 6, and a plurality of tightening openings 313 are opened on the pressing plates 31; the plurality of tightening components 4 correspond to the plurality of pressing plates 31 one by one, and each tightening component 4 includes a plurality of tightening members 41, which are screwed to the corresponding tightening openings 313, and the inner end of the tightening member 41 abuts against the first circuit board 62 on the bonding preform 6 to apply different degrees of pressure to the first circuit board 62.

[0029] It should be noted that in the circuit board structure of the tooling application, there are seven circuit boards in total, including six first circuit boards 62 that need to enclose the core unit 61, and one second circuit board 63. The six first circuit boards 62 are respectively bonded to different surfaces of the core unit 61 and interconnected by flexible wires, such as Figure 8 As shown, six first circuit boards 61 are bonded and fixed to the core unit 2 .

[0030] It should be noted that the pressing member 41 is a pressing bolt, which is screwed to the pressing opening 313, and the pressure of the pressing member 41 on the first circuit board 62 can be controlled by rotating the pressing member 41, thereby ensuring the uniformity of the glue under the first circuit board 62. The operation is convenient and the adjustment is convenient for employees.

[0031] Compared with the prior art, the rigid-flexible circuit board bonding tool provided in this embodiment provides a fixing tool, which uses the connecting component 2 to fix the bonding preform 6 on the base 1, and uses the pressure plate 31 to provide support for the pressing member 41. The pressing member 41 applies force to the first circuit board 62 in various directions of the bonding preform 6. Multiple first circuit boards 62 are stably fixed, which improves the molding quality of the first circuit boards 62 and the core unit 61, and realizes a stable bonding combination of multiple first circuit boards 62 and the core unit 61, improving the bonding quality. The first circuit board 62 is fixed and will not shift during the bonding process, which can achieve curing uniformity after bonding and fixing, and ensure the planar effect of the circuit board structure and the glue void rate.

[0032] In some embodiments, see Figure 1 , Figure 4 and Figure 5 , a plurality of plug-in slots 121 are provided at the top of the fixing area, and the connection component 2 includes a plurality of connection columns 21, and the plurality of connection columns 21 respectively penetrate the corners of the core unit 61, and the bottom ends of the connection columns 21 are plugged and fixed with the plug-in slots 121. This embodiment provides an embodiment of the limit component 2, and the core unit 61 is fixed to the fixing area by the connection columns 22, so as to ensure the position stability of the core unit 61, so that the core unit 61 will not deviate during the pressure application process, and the first circuit board 62 can be stably supported.

[0033] In some embodiments, see Figure 1 and Figure 2The fixing assembly 3 further includes a stud 32 and a plurality of fasteners 33. The stud 32 is disposed at the top of the connecting column 21. A connecting hole is provided on the pressing plate 31 located above the core unit 61. The corresponding fastener 33 passes through the connecting hole and is connected to the stud 32 to fix the pressing plate 31 located at the top of the core unit 61 and the core unit 61. The stud 32 is disposed at the top of the connecting column 21 and is connected to the pressing plate 31 at the top. The stud 32 defines the distance between the top pressing plate 31 and the core unit 61, ensuring that the pressing plate 31 at the top can be stably fixed. The fastener 33 can connect the pressing plate 31 and the core unit 61, so that the top fastener 41 located on the top pressing plate 31 can stably apply pressure to the corresponding first circuit board 62.

[0034] It should be noted that the connection holes on the pressure plate 31 are located away from the area in contact with the first circuit board 61 and correspond to the core unit 61 . The fasteners 33 pass through the connection holes and connect with the studs 32 to fix the pressure plate 31 on the core unit 61 .

[0035] Optionally, the fastener 33 is a bolt with a nut, and the bolt passes through the connection hole and is screwed to the top of the stud 32 to achieve a fixed connection between the top pressure plate 31 and the core unit 61.

[0036] In some embodiments, see Figure 1 and Figure 2 The pressure plate 31 includes a side pressure plate 311 and a top pressure plate 312. The side pressure plates 311 correspond to the sides of the core unit 61. The top pressure plate 312 is an L-shaped plate. The top pressure plate 312 covers the top and one side of the core unit 61. The top pressure plate 312 and the side pressure plates 311 enclose a fixed space with an opening at the bottom. The top pressure plate 312 is provided with a weight-reducing hole 314. The top pressure plate 312 is L-shaped. During installation, one side of the core unit 61 can be pressed accordingly, which reduces the number of side pressure plates 311, saves processing costs, and speeds up assembly efficiency.

[0037] During specific implementation, the top pressure plate 312 includes a horizontal plate 3121 and a vertical plate 3122. The horizontal plate 3121 is fixed to the top of the core unit 61 by a fastener 33. The horizontal plate 3121 is connected to the vertical plate 3122. The vertical plate 3122 fits one side of the core unit 61. Only three side pressure plates 311 are needed to cooperate with the top pressure plate 312 to enclose the core unit 61.

[0038] In some embodiments, see Figures 1 to 3There are two pressing members 41 in each pressing assembly 4, and the two pressing members 41 are respectively inserted into the pressing openings 313 on the corresponding pressing plates 31, and the two pressing members 41 are arranged diagonally. The two pressing members 41 are arranged diagonally, which can evenly and effectively cover the pressing plates 31 on the core unit 61, ensuring the uniformity of glue dispensing. Only two pressing members 41 are required, which reduces the number of pressing members 41 and improves assembly efficiency.

[0039] In some embodiments, see Figure 1 and Fig. 9 The base 1 includes a bottom plate 11, a support plate 12 and a side plate 13. The support plate 12 is arranged directly above the bottom plate 11, and the support plate 12 forms a fixed area. The support plate 12 is provided with a plurality of top holes that penetrate from top to bottom, and a force rod 14 is provided in the top hole; the upper and lower ends of the side plate 13 are respectively connected to the bottom plate 11 and the support plate 12, and the side plate 13 is arranged on the same side of the bottom plate 11 and the support plate 12, and the outer side surface of the side plate 13 forms a fixing groove. The base 1 is composed of a bottom plate 11, a support plate 12 and a side plate 13. The setting of the side plate 13 can greatly reduce the overall weight of the base 1 and improve the flexibility of use. The support plate 12 increases the contact area between the base 1 and the working platform at the bottom to improve the support stability.

[0040] It should be noted that the force-applying rod 14 applies pressure upward to the circuit board on the top of the support plate 12 , and the force-applying rod 14 and the tightening member 41 are both tightening screws.

[0041] During specific implementation, the circuit body 61 is installed in the fixing groove.

[0042] In some embodiments, see Figure 1 , Figure 4 and Fig. 9 The rigid-flexible circuit board bonding tooling also includes two magnetic parts 5. The side of the support plate 12 is provided with a mounting hole 122. The two magnetic parts 5 are respectively installed in the mounting hole 122 and on the pressure plate 31, and the two magnetic parts 5 are connected by magnetic attraction. The side of the support plate 12 is also provided with a guide column 123. The pressure plate 31 is provided with a guide groove 315 corresponding to the guide column 123. The guide column 123 and the guide groove 315 are plugged and matched to limit the displacement of the pressure plate 31 in the up and down directions. The two magnetic parts 5 can attract each other to fix the pressure plate 31 on the outer periphery of the support plate 12. The pressure plate 31 is affected by the magnetic parts 5 and is pressed against the support plate 12, which increases the convenience of installation. The setting of the guide column 123 and the guide groove 315 guides the pressure plate 31 to move toward the core unit 21 to prevent the pressure plate 31 from deviating on the adsorption surface after the magnetic part 5 and the pressure plate 31 are adsorbed and fixed.

[0043] In specific implementation, one of the magnetic members 5 is embedded on the pressing plate 31. The other magnetic member 5 is fixed in the mounting hole 122. The magnetic member 5 can be a magnet.

[0044] Based on the same inventive concept, the present application also provides a method for batch bonding of rigid-flexible circuit boards, which is implemented based on a rigid-flexible circuit board bonding tooling as in any one of the above-mentioned embodiments, and is characterized in that it includes the following steps: S1: dispensing glue on the core unit 61, and placing a plurality of first circuit boards 62 on the core unit 61 respectively to form a bonding preform 6; S2: screwing the top clamp 41 with the corresponding pressing plate 31; S3: respectively attaching a plurality of pressing plates 31 to the bonding preform 6, and tightening the top clamp 41 with the corresponding first circuit board 62; S4: placing the rigid-flexible circuit board bonding tooling and the bonding preform 6 in an oven for curing.

[0045] Compared with the prior art, the batch bonding method of rigid-flexible circuit boards provided in the present embodiment provides a fixing tool, uses the connection component 2 to fix the bonding preform 6 on the base 1, uses the pressure plate 31 to provide support for the pressing member 41, and the pressing member 41 applies a force to the first circuit board 62 in various directions of the bonding preform 6, so that multiple first circuit boards 62 are stably fixed, the molding quality of the first circuit boards 62 and the core unit 61 is improved, and a stable bonding combination of multiple first circuit boards 62 and the core unit 61 is achieved, and the bonding quality is improved. The first circuit board 62 is fixed and will not deviate during the bonding process, and the curing uniformity after bonding and fixing can be achieved, and the plane effect and glue void rate of the circuit board structure are guaranteed; the core unit 61 and the first circuit board 62 are pre-bonded first, and then the pressing member 41 applies pressure in the direction corresponding to the first circuit board 62 to ensure uniform filling of the glue, thereby improving the bonding quality of the core unit 61 and the first circuit board 62. The method is simple to operate, one tool can quickly fix one bonding preform 6, and there is no difficulty in batch operation, which can meet the needs of batch bonding.

[0046] In some embodiments, S2 specifically includes screwing the tension member 41 to the pressing plate 31, and adjusting the distance that the tension member 41 passes through the pressing plate 31. By adjusting the screwing distance between the tension member 41 and the pressing plate 31, the force applied to the first circuit board 62 can be adjusted.

[0047] In some embodiments, after S3, the process further includes: fixing the second circuit board 62 in the receiving groove. The second circuit board 62 is fixed in the receiving groove of the base 1 to ensure that the second circuit board 62 does not move when the glue is fixed, and the second circuit board 62 is fixed, thereby improving the connection quality between the circuit board and the core unit 61.

[0048] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A rigid-flexible circuit board bonding tool, used for applying pressure to a bonding preform formed by bonding a core unit and a circuit board, the bonding preform having a plurality of first circuit boards surrounding the core unit and a second circuit board conductively connected to one of the first circuit boards, characterized in that: include: A base, the top of which forms a fixing area for fixing and bonding the preform, and a side of the base is provided with a receiving groove, and the receiving groove is used to fix the second circuit board; A connecting assembly is disposed on the base and respectively connects the core unit and the base; The fixing assembly comprises a plurality of pressing plates, wherein the plurality of pressing plates are respectively arranged on the outer periphery of the bonding prefabricated parts, and the pressing plates are provided with a plurality of tightening openings; as well as Multiple tightening assemblies correspond to the multiple pressure plates one by one, and each of the tightening assemblies includes a plurality of tightening parts, which are screwed to the corresponding tightening openings, and the inner ends of the tightening parts abut against the first circuit board on the bonding preform to apply different degrees of pressure to the first circuit board.

2. The rigid-flex circuit board bonding tool as claimed in claim 1, characterized in that: A plurality of plug-in slots are provided on the top of the fixing area, and the connecting assembly includes a plurality of connecting columns, which respectively penetrate the corners of the core unit, and the bottom ends of the connecting columns are plugged and fixed with the plug-in slots.

3. The rigid-flex circuit board bonding tool as claimed in claim 2, characterized in that: The fixing assembly also includes a stud and a plurality of fasteners, wherein the stud is arranged at the top of the connecting column, and a connecting hole is opened on the pressure plate located above the core unit. The corresponding fasteners pass through the connecting hole and are connected to the stud to fix the pressure plate and the core unit located at the top of the core unit.

4. The rigid-flex circuit board bonding tool as claimed in claim 1, characterized in that: The pressure plate is divided into a side pressure plate and a top pressure plate, and the side pressure plates correspond to the sides of the core unit respectively; the top pressure plate is an L-shaped plate, and the top pressure plate is covered on the top and one side of the core unit. The top pressure plate and the side pressure plates enclose a fixed space with an opening at the bottom, and the top pressure plate is provided with weight reduction holes.

5. The rigid-flex circuit board bonding tool as claimed in claim 1, characterized in that: There are two pressing members in each of the pressing assemblies. The two pressing members are respectively inserted into the pressing openings on the corresponding pressing plates, and the two pressing members are diagonally arranged.

6. The rigid-flex circuit board bonding tool as claimed in claim 1, characterized in that: The base comprises: Base plate; A support plate is disposed directly above the bottom plate, the support plate forms the fixing area, the support plate is provided with a plurality of top holes extending vertically therethrough, and a force application rod is disposed in each of the top holes; and The side plate has upper and lower ends connected to the bottom plate and the support plate respectively, and the side plate is arranged on the same side of the bottom plate and the support plate, and the outer side surface of the side plate forms the fixing groove.

7. The rigid-flex circuit board bonding tool as claimed in claim 6, characterized in that: The rigid-flex circuit board bonding tool further includes two magnetic parts, a mounting hole is provided on the side of the support plate, the two magnetic parts are respectively mounted in the mounting hole and on the pressing plate, and the two magnetic parts are connected by magnetic attraction; The side of the support plate is also provided with a guide column, and the pressing plate is provided with a guide groove corresponding to the guide column, and the guide column is plugged and matched with the guide groove to limit the displacement of the pressing plate in the up and down directions.

8. A method for batch bonding of rigid-flexible circuit boards, based on the rigid-flexible circuit board bonding tooling according to any one of claims 1 to 7, characterized in that: The following steps are involved: S1: dispensing glue on the core unit, and placing a plurality of first circuit boards on the core unit respectively to form a bonding preform; S2: Screw the top fastener into the corresponding pressing plate; S3: attaching a plurality of pressing plates to the bonding preforms respectively, and pressing the pressing members to the corresponding first circuit boards; S4: placing the rigid-flexible circuit board bonding tool and the bonding preform 6 into an oven for curing.

9. The method for batch bonding of rigid-flexible circuit boards according to claim 8, characterized in that: The step S2 specifically includes: screwing the pressing member to the pressing plate, and adjusting the distance that the pressing member passes through the pressing plate.

10. The method for batch bonding of rigid-flexible circuit boards according to claim 8, characterized in that: After S3, the method further includes: fixing the second circuit board in the receiving groove.

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