Heat dissipation protection shell and electronic equipment assembly

Abstract

The invention provides a heat dissipation protection shell and an electronic equipment assembly. The heat dissipation protection shell comprises a shell body, a fluid diaphragm, a semiconductor refrigerator and a heat dissipation device. A containing groove used for containing electronic equipment is formed in the shell, a first surface of the fluid diaphragm is attached to the interior of the containing groove, a second surface opposite to the first surface is used for being attached to the electronic equipment arranged in the containing groove, one side of the semiconductor cooler is attached to the first surface of the fluid diaphragm, and the other side of the semiconductor cooler is attached to the second surface of the fluid diaphragm. And the other side of the LED lamp is attached to the radiator. According to the heat dissipation protective shell provided by the embodiment of the invention, a heat dissipation protective shell structure in which the liquid cooling diaphragm is matched with the semiconductor cooler is designed, and the heat dissipation protective shell has the characteristics of being strong in heat dissipation effect, light, free from falling off hands, small, free from delaying game operation and the like.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment accessories, and in particular to a heat dissipation protective shell and an electronic equipment component. Background Art

[0002] With the increasing diversity of mobile phone usage, mobile terminal companies and APP application development companies are launching various multi-functional applications, such as the interpolation function of the Genshin Impact game, the super-resolution function, the beauty function of the Tik Tok live broadcast, etc. The diversity of these functions will lead to increased power consumption, and the ease of play and fun of the APP lead users to use their mobile phones for a long time, which in turn causes the phone to heat up seriously. In fact, the phone will exit the application due to heat, resulting in the interruption of the user's live broadcast, etc. Therefore, many users will wear a heat dissipation back clip when solving the problem of mobile phone heating. However, the heat dissipation effect of the heat dissipation back clip in conventional technical solutions is poor and cannot meet the increasingly high heat dissipation requirements. Summary of the invention

[0003] A first aspect of an embodiment of the present application provides a heat dissipation protective shell, which includes: a shell, a fluid diaphragm, a semiconductor refrigerator and a radiator; the shell is formed with a receiving groove for accommodating an electronic device, a first surface of the fluid diaphragm is attached to the receiving groove, and a second surface opposite to the first surface is used to fit with the electronic device arranged in the receiving groove, one side of the semiconductor refrigerator is attached to the first surface of the fluid diaphragm, and the other side is attached to the radiator.

[0004] In a second aspect, an embodiment of the present application provides an electronic device assembly, which includes an electronic device and the heat dissipation protective shell described in the above embodiment, wherein the shell of the heat dissipation protective shell is connected to the electronic device, and the heat dissipation protective shell is used to dissipate heat for the electronic device.

[0005] The heat dissipation protective shell provided in the embodiment of the present application is designed with a heat dissipation protective shell structure that cooperates with a liquid cooling diaphragm and a semiconductor refrigerator, which has the characteristics of strong heat dissipation effect, light weight and does not fall in the hand, and small size that does not delay game operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0007] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the heat dissipation protective shell of the present application;

[0008] Figure 2yes Figure 1 A schematic diagram of the disassembled structure of the heat dissipation protective shell in the embodiment;

[0009] Figure 3 This is a schematic diagram of the cross-sectional structure of an embodiment of the heat dissipation protective shell of the present application;

[0010] Figure 4 It is a structural schematic diagram of an embodiment of an electronic device assembly of the present application;

[0011] Figure 5 It is a schematic diagram of the structure of a back-clip radiator and an electronic device in a conventional technical solution;

[0012] Figure 6 This is a schematic diagram of the structure of the heat dissipation protective shell and the electronic device in this embodiment;

[0013] Figure 7 is a schematic cross-sectional structural diagram of another embodiment of the heat dissipation protective shell of the present application;

[0014] Figure 8 This is a schematic diagram of the structure of the heat dissipation protective shell from the inner side of the present application;

[0015] Fig. 9 This is a structural schematic diagram of another embodiment of the heat dissipation protective shell of the present application;

[0016] Fig.10 It is a schematic diagram of the structural composition block diagram of an embodiment of the electronic device of the present application. DETAILED DESCRIPTION

[0017] The present application is further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present application, but are not intended to limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application rather than all embodiments, and all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0018] The terms "first", "second", and "third" in the embodiments of the present application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", and "third" can expressly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of the present application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. The terms "including" and "having" in the embodiments of the present application and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or components inherent to these processes, methods, products, or devices.

[0019] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0020] As used herein, "electronic devices" (or simply "terminals") include, but are not limited to, devices configured to receive / send communication signals via a wireline connection (e.g., via a public switched telephone network (PSTN), a digital subscriber line (DSL), a digital cable, a direct cable connection, and / or another data connection / network) and / or via a wireless interface (e.g., for a cellular network, a wireless local area network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and / or another communication terminal). Communication terminals configured to communicate via a wireless interface may be referred to as "wireless communication terminals", "wireless terminals" or "mobile terminals". Examples of mobile terminals include, but are not limited to, satellite or cellular phones; personal communication system (PCS) terminals that may combine cellular radiotelephones with data processing, fax, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / intranet access, web browsers, organizers, calendars, and / or global positioning system (GPS) receivers; and conventional laptop and / or palmtop receivers or other electronic devices that include radiotelephone transceivers. A mobile phone is an electronic device equipped with a cellular communication module.

[0021] Please also read Figures 1 to 3 , Figure 1 This is a schematic diagram of the overall structure of an embodiment of the heat dissipation protective shell of the present application; Figure 2 yes Figure 1 A schematic diagram of the disassembled structure of the heat dissipation protective shell in the embodiment; Figure 3 1 is a schematic diagram of the cross-sectional structure of an embodiment of the heat dissipation protective shell of the present application. It should be noted that the heat dissipation protective shell of the present application can be used to dissipate heat for electronic devices including mobile phones, tablet computers, etc. The heat dissipation protective shell 800 includes but is not limited to the following structures: a housing 810, a fluid diaphragm 820, a semiconductor refrigerator 830, and a radiator 840.

[0022] For more information, please see Figure 4 , Figure 4 1 is a schematic diagram of the structure of an embodiment of an electronic device assembly of the present application, wherein the electronic device assembly includes a heat dissipation protective shell 800 and an electronic device 10. The housing 810 of the heat dissipation protective shell 800 is connected to the electronic device 10, and the heat dissipation protective shell 800 is used to dissipate heat for the electronic device 10.

[0023] The housing 810 may include a first housing 801 and a second housing 802. The first housing 801 is formed with a receiving groove 811 for receiving the electronic device 10. The second housing 802 is used to receive and fix structures such as a radiator 840. The first surface of the fluid membrane 820 is attached to the receiving groove 811, and the second surface opposite to the first surface is used to fit with the electronic device 10 disposed in the receiving groove 811. One side of the semiconductor refrigerator 830 fits with the first surface of the fluid membrane 820, and the other side fits with the radiator 840.

[0024] Thermo Electric Cooler 830 (TEC for short) is made by utilizing the Peltier effect of semiconductor materials. The so-called Peltier effect refers to the phenomenon that when a direct current passes through a couple composed of two semiconductor materials, one end absorbs heat and the other end releases heat. Heavily doped N-type and P-type bismuth telluride are mainly used as semiconductor materials for TEC. The bismuth telluride elements are electrically connected in series and generate heat in parallel. TEC includes some P-type and N-type pairs (groups), which are connected together through electrodes and sandwiched between two ceramic electrodes. When current flows through TEC, the heat generated by the current will be transferred from one side of TEC to the other side, generating a "hot" side and a "cold" side on the TEC. This is the heating and cooling principle of TEC.

[0025] See also Figure 5 , Figure 5The figure is a schematic diagram of the structure of a back-clip radiator and an electronic device in a conventional technical solution, wherein the back-clip radiator 10a can only dissipate heat for the rear shell of the electronic device 10b, and the heat dissipation area mainly corresponds to the area of ​​the dotted box 10c (battery compartment) in the figure, while the dotted box area 10d in the figure is generally the motherboard area of ​​the electronic device. The back-clip radiator 10a in the conventional solution cannot directly fit and dissipate heat in this area (10d), resulting in poor overall heat dissipation effect.

[0026] For comparison, please also refer to Figure 2 and Figure 6 , Figure 6 820 is a schematic diagram of the structure of the heat dissipation protective shell and the electronic device in this embodiment. By designing the structure of the fluid diaphragm 820, direct heat dissipation of various areas of the electronic device can be achieved. The fluid diaphragm 820 has a flow channel 821 formed inside, and the flow channel 821 is filled with a liquid heat dissipation medium. When the heat dissipation protective shell is used in conjunction with the electronic device ( Figure 6 The extension position of the flow channel 821 corresponds to at least the battery compartment of the electronic device and the mainboard compartment between the camera module 101 and the left or right side (the right side in this embodiment) of the length direction (the direction of the arrow X in the figure), that is, Figure 5 The area corresponding to the dotted box 10d.

[0027] In addition, in some other embodiments, the flow channel 821 of the fluid diaphragm 820 may also be other areas with high heat generation, such as the area surrounding the camera module 101 of the corresponding electronic device, which is not specifically limited here. Figure 6 The fluid diaphragm 820 in this embodiment further includes a piezoelectric micropump 822 (which may be one or more, not specifically limited here), and the piezoelectric micropump 822 is connected to the flow channel 821 to drive the liquid heat dissipation medium in the flow channel 821 to flow and circulate.

[0028] The thickness of the fluid diaphragm 820 is 0.2-0.4 mm, and the size and performance (maximum temperature difference, maximum current, maximum voltage, maximum cooling capacity) of the TEC (semiconductor cooler 830) are related to the heat dissipation capacity requirements and the size of the whole machine, and are not particularly limited. The heat sink 840 can be made of aluminum, copper, high thermal conductivity polymer, etc.

[0029] Optionally, see Figures 2 to 6The heat dissipation protection shell 800 in this embodiment also includes a heat dissipation fan 850, which is arranged adjacent to the radiator 840 and is used to air-cool the radiator 840, wherein the radiator 840 may be a fin-type structure radiator. Optionally, the number of radiators 840 in this embodiment is two, and the heat dissipation fan 850 is located between the two radiators 840. There may also be two semiconductor refrigerators 830 in this embodiment, which are arranged one-to-one with the radiator 840. The semiconductor refrigerator 830 and the radiator 840 and the fluid diaphragm may be connected by thermally conductive gel, thermally conductive pad, thermally conductive silicone grease (marked 8304 in the figure), etc., to reduce the interface thermal resistance. The fan may be an axial flow fan, a piezoelectric fan, a centrifugal fan, etc.

[0030] In addition, in some other embodiments, the number of the radiator 840 can be multiple, and the multiple radiators 840 can be arranged around the cooling fan 850. The detailed features of this part are within the scope of understanding of those skilled in the art and will not be repeated here.

[0031] Optionally, please also refer to Figure 2 and Figure 7 , Figure 7 It is a schematic diagram of the cross-sectional structure of another embodiment of the heat dissipation protective shell of the present application. The heat dissipation protective shell 800 in this embodiment also includes a thermally conductive protective sheet 860, which is attached to the fluid diaphragm 820 and covers the fluid diaphragm 820. When the heat dissipation protective shell 800 is used in conjunction with an electronic device, the thermally conductive protective sheet 860 is disposed between the fluid diaphragm 820 and the electronic device, thereby protecting the fluid diaphragm 820 and conducting heat between the electronic device and the fluid diaphragm 820.

[0032] The material of the thermal conductive protective sheet 860 may be thermal conductive particles doped in silicone, or the thermal conductive protective sheet 860 may be made of other flexible thermal conductive materials, which can conduct heat and prevent electronic equipment from being scratched, and protect the fluid membrane 820. The thickness of the thermal conductive protective sheet 860 is 0.05-0.2 mm, and the thermal conductivity is 0.2-100 W / mK.

[0033] Optionally, see Figure 2 and Figure 3 The heat dissipation protective shell 800 in this embodiment further includes a functional ring 870, which may be embedded in the housing 810. In some embodiments, the functional ring 870 may be an electromagnetic coil for wirelessly charging the electronic device; in some embodiments, the functional ring 870 may also be made of a magnetic material for magnetically attaching the heat dissipation protective shell 800 to the electronic device or other external fixings.

[0034] The working principle of the heat dissipation protective shell in the embodiment of the present application is as follows: the heat generated by the electronic device (taking a mobile phone as an example) is conducted to the battery cover, and then to the thermal conductive protective sheet 860 and the fluid diaphragm 820. The piezoelectric micropump 822 drives the liquid working medium in the fluid diaphragm 820 to flow to achieve temperature uniformity. At the same time, the TEC (semiconductor refrigerator 830) works to actively transfer heat from the cold end to the hot end, and then diffuse the heat into the environment through the radiator 840 and the cooling fan 850.

[0035] Conventional heat dissipation back clips cannot directly provide a parallel area for the camera decoration ring ( Figure 5 The heat is dissipated in the middle 10d area, and most of the mobile phone SOC is distributed in this area, which is the area with the highest temperature on the back cover of the mobile phone. The technical solution in the embodiment of the present application transfers the heat from the SOC area of ​​the back cover of the mobile phone to the area corresponding to the battery compartment of the mobile phone through the efficient temperature equalization of the fluid diaphragm, and then uses the TEC+radiator+fan to achieve efficient heat dissipation. Thanks to the improvement of the overall heat dissipation effect of the fluid diaphragm, the TEC, radiator and fan can choose specifications with lower heat dissipation capacity, and the corresponding volume and weight can be significantly reduced, thereby making the overall volume of the heat dissipation protective shell smaller and lighter.

[0036] Optionally, please also refer to Figure 2 and Figure 8 , Figure 8 It is a schematic diagram of the structure from the inner perspective of the heat dissipation protective shell of the present application, wherein the heat dissipation protective shell in this embodiment also includes an electrical connection component 880, wherein the electrical connection component 880 includes a control circuit board 881, a connecting FPC882 and an electrical connection contact 883, wherein the control circuit board 881 is connected to the fan circuit board 851 of the heat dissipation fan 850 through the electrical connection contact 883 and the connecting FPC882, and the electrical connection contact 883 is protruding from the surface of the shell 810, and is connected to the fan circuit board 851 on the one hand, and is connected to the control circuit board 881 through the connecting FPC882 on the other hand, and the control circuit board 881 can be connected to the charging interface of the electronic device to realize the electronic device to power the heat dissipation protective shell.

[0037] See also Fig. 9 , Fig. 9It is a structural schematic diagram of another embodiment of the heat dissipation protective shell of the present application, wherein the heat dissipation protective shell 800 in this embodiment may also include: a shell 810, a fluid diaphragm 820, a semiconductor refrigerator 830, a radiator 840, a heat dissipation fan 850, a thermal conductive protective sheet 860 and other structures. Different from the aforementioned embodiment, the radiator 840 and the semiconductor refrigerator 830 in this embodiment are both one, and the radiator 840 includes an annular structure or two independent heat dissipation fins 841 and a connecting plate 842 in the middle. The heat dissipation fan 850 and the semiconductor refrigerator 830 are respectively connected to the two sides of the connecting plate 842, and the annular structure of the radiator 840 or the two independent heat dissipation fins 841 are arranged around the heat dissipation fan 850. For other structural features of the heat dissipation protective shell, please refer to the relevant description of the aforementioned embodiment, which will not be repeated here. The structure of the heat dissipation protective shell in this embodiment has the characteristics of fewer overall parts, more compact structure and convenient assembly.

[0038] The heat dissipation protective shell provided in the embodiment of the present application is designed with a heat dissipation protective shell structure that cooperates with a liquid cooling diaphragm and a semiconductor refrigerator, which has the characteristics of strong heat dissipation effect, light weight and does not fall in the hand, and small size that does not delay game operations.

[0039] See also Fig.10 , Fig.10 It is a schematic diagram of the structural composition block diagram of an embodiment of an electronic device of the present application. The electronic device can be a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. The diagram of this embodiment takes a mobile phone as an example. The structure of the electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940, a sensor 950, an audio circuit 960, a wifi module 970, a processor 980, and a power supply 990. Among them, the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively connected to the processor 980; the power supply 990 is used to provide power to the entire electronic device.

[0040] Specifically, the RF circuit 910 is used to receive and send signals; the memory 920 is used to store data instruction information; the input unit 930 is used to input information, which may specifically include a touch panel 931 and other input devices 932 such as operation buttons; the display unit 940 may include a display panel 941, etc.; the sensor 950 includes an infrared sensor, a laser sensor, etc., for detecting user approach signals, distance signals, etc.; the speaker 961 and the microphone (or microphone) 962 are connected to the processor 980 through the audio circuit 960 for receiving and sending sound signals; the wifi module 970 is used to receive and transmit wifi signals, and the processor 980 is used to process data information of the electronic device. Regarding the specific structural features of the electronic device, within the scope of understanding of those skilled in the art, no detailed introduction will be given here.

[0041] The above descriptions are only some embodiments of the present application, and do not limit the protection scope of the present application. Any equivalent device or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A heat dissipation protective shell, characterized in that: The heat dissipation protective shell includes: a shell, a fluid diaphragm, a semiconductor refrigerator and a radiator; the shell is formed with a receiving groove for accommodating an electronic device, the first surface of the fluid diaphragm is attached to the receiving groove, and the second surface opposite to the first surface is used to fit with the electronic device arranged in the receiving groove, one side of the semiconductor refrigerator is attached to the first surface of the fluid diaphragm, and the other side is attached to the radiator.

2. The heat dissipation protective shell according to claim 1, characterized in that: A flow channel is formed inside the fluid diaphragm, and the flow channel is filled with liquid heat dissipation medium.

3. The heat dissipation protective shell according to claim 2, characterized in that: The fluid diaphragm further comprises a piezoelectric micro pump, which is communicated with the flow channel and is used to drive the liquid heat dissipation medium in the flow channel to flow and circulate.

4. The heat dissipation protective shell according to claim 3, characterized in that: When the heat dissipation protective shell is used in conjunction with an electronic device, the extension position of the flow channel at least corresponds to a battery compartment of the electronic device and a mainboard compartment located between a camera module and the left or right side of the electronic device in the length direction.

5. The heat dissipation protective shell according to claim 1, characterized in that: The heat dissipation protection shell also includes a heat dissipation fan, which is arranged adjacent to the radiator and is used for air cooling the radiator.

6. The heat dissipation protective shell according to claim 5, characterized in that: There are multiple radiators, and the cooling fan is located between the multiple radiators.

7. The heat dissipation protective shell according to claim 5, characterized in that: The radiator is arranged around the cooling fan.

8. The heat dissipation protective shell according to claim 1, characterized in that: The heat dissipation protection shell further comprises a heat conductive protection sheet, which is attached to and covers the fluid membrane. When the heat dissipation protection shell is used in conjunction with the electronic device, the heat conductive protection sheet is arranged between the fluid membrane and the electronic device.

9. The heat dissipation protective shell according to claim 8, characterized in that: The material of the thermal conductive protection sheet is thermal conductive particles doped in silica gel.

10. An electronic device component, characterized in that: The electronic device assembly comprises an electronic device and the heat dissipation protective shell according to any one of claims 1 to 9, wherein the shell of the heat dissipation protective shell is connected to the electronic device, and the heat dissipation protective shell is used to dissipate heat for the electronic device.

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