Pixel unit, LED display module and LED display screen

Abstract

The invention relates to the technical field of LED display, solves the problem that in the prior art, only transparent adhesive film packaging is adopted for packaging, and the display contrast ratio is low, and provides a pixel unit, an LED display module and an LED display screen. The pixel unit includes: a substrate; a plurality of light-emitting chips fixed on the front surface of the substrate; a bottom black layer and a transparent adhesive layer are sequentially arranged on the substrate, the top surface of the bottom black layer is lower than the light-emitting surfaces of the light-emitting chips, and the transparent adhesive layer covers the light-emitting surfaces of the light-emitting chips, or the transparent adhesive layer and a low-transmittance film are sequentially arranged on the substrate, and the transparent adhesive layer covers the light-emitting surfaces of the light-emitting chips; a plurality of weld legs fixed on the back surface of the substrate; and the pixel units are manufactured by adopting an MIP packaging process. According to the invention, the display contrast can be improved, and a better display effect is achieved.

Description

[0001] This invention is a divisional application of the invention patent application filed on December 31, 2023, with the invention name “A pixel unit, LED display module and LED display screen” and application number 202311860249.5. Technical Field

[0002] The present invention relates to the field of LED display technology, and in particular to a pixel unit, an LED display module and an LED display screen. Background Art

[0003] At present, for LED display screens, when they are lit up, they generally have excellent light and color display effects for viewers facing forward. However, due to the limitations of the current structure and manufacturing methods of LED display screens, existing LED display screens have abnormal light and color display situations such as light color mixing, which will bring poor viewing effects due to abnormal light colors for non-frontal viewers.

[0004] Although industry insiders have developed a new packaging architecture for Micro LED - the MIP (Micro LED in package) structure, which realizes the organic combination of Micro LED and discrete devices by separately packaging a large-area display panel. Specifically, the MIP structure includes a black substrate, a plurality of light-emitting chips packaged on the front of the black substrate, and solder feet formed on the back of the black substrate. When making an LED display module, a PCB board is first made, and a layer of solder mask ink is formed on the front of the PCB board. The solder mask ink forms a window to expose the pads on the PCB board; then the solder feet of the black substrate are soldered to the pads on the PCB board. However, the existing MIP structure only uses transparent film packaging to achieve packaging. This packaging method is too simple, resulting in a low contrast ratio of the pixel unit made using the MIP structure, which makes the display contrast of the LED display module low, which is unfavorable to the display effect.

[0005] Therefore, there is an urgent need to provide a pixel unit, an LED display module and an LED display screen with improved contrast. Summary of the invention

[0006] The present invention aims at the problem that the prior art only uses transparent film packaging for packaging, resulting in low display contrast. To achieve one purpose of the present invention, a pixel unit is provided, comprising:

[0007] substrate;

[0008] A plurality of light-emitting chips fixed on the front surface of the substrate;

[0009] A bottom black layer and a transparent adhesive layer are sequentially arranged on the substrate, the top surface of the bottom black layer is lower than the light-emitting surface of each light-emitting chip, and the transparent adhesive layer covers the light-emitting surface of each light-emitting chip, or a transparent adhesive layer and a low-transmittance film are sequentially arranged on the substrate, and the transparent adhesive layer covers the light-emitting surface of each light-emitting chip;

[0010] A plurality of solder pins fixed to the back side of the substrate;

[0011] The pixel unit is manufactured by using the MIP packaging process.

[0012] Furthermore, a plurality of light emitting chips emitting light of different colors are fixed on the front side of the substrate, and the different color lights include red light, blue light and green light.

[0013] Furthermore, the multiple light-emitting chips on the substrate are arranged into two rows and three columns along the first direction and the second direction respectively, and the light-emitting chips in each column are arranged parallel to the second direction, one row has two parallel and spaced first light-emitting chips and a second light-emitting chip facing each other, and the first light-emitting chip and the second light-emitting chip emit a first color light and a second color light respectively, and the other row has a third light-emitting chip that emits a third color light; the projections of the first light-emitting chip and the second light-emitting chip in the second direction do not overlap with the projection of the third light-emitting chip in the second direction; and the pixel units adjacent to each other in the first direction and the second direction can realize RGB three-primary color pixel multiplexing.

[0014] Furthermore, the multiple light-emitting chips on the substrate are arranged into two rows and three columns along the first direction and the second direction, respectively, and each light-emitting chip is inclined at a preset acute angle relative to the second direction, and the preset acute angle has a value range of 0°-45°. One row has two inclined parallel spaced first light-emitting chips and a second light-emitting chip, and the first light-emitting chip and the second light-emitting chip emit a first color light and a second color light, respectively, and the other row has a third light-emitting chip that emits a third color light.

[0015] Furthermore, the multiple light-emitting chips on the substrate are arranged into three rows and three columns along the first direction and the second direction respectively, and each light-emitting chip is arranged parallel to the first direction, each row has a first light-emitting chip emitting a first color light, a second light-emitting chip emitting a second color light, and a third light-emitting chip emitting a third color light, and each column has a first light-emitting chip emitting a first color light, a second light-emitting chip emitting a second color light, and a third light-emitting chip emitting a third color light, and the light-emitting chips are arranged in a stepped shape as a whole.

[0016] Furthermore, it is characterized in that the bottom black layer comprises a black UV ink material, the transparent adhesive layer adopts an OCA adhesive film or a liquid epoxy resin, and the low-transmittance film adopts an OCA adhesive film and adds 40%-60% of melanin.

[0017] To achieve another object of the present invention, an LED display module is provided, comprising: a CB board, a plurality of solder pads being provided on the PCB board; a plurality of pixel units according to any one of claims 1 to 6, wherein the pixel units are aligned and arranged into a plurality of rows and a plurality of columns in a first direction and a second direction, respectively, and the substrates of two adjacent pixel units in each row are arranged on the PCB board at the same angle, or the substrates of two adjacent pixel units in each row are arranged on the PCB board alternately at two mirror angles and the pixel units in each column are arranged at the same angle; and the solder feet of each pixel unit are correspondingly soldered to the solder pads.

[0018] Furthermore, when a plurality of light-emitting chips on the substrate are arranged into two rows and three columns along the first direction and the second direction respectively and each light-emitting chip is arranged in parallel to the second direction, the LED display module has two kinds of pixel units, one of which is equivalent to the center point of the substrate of the other pixel unit rotated 180° and then mirrored in the first direction, and the two kinds of pixel units in each row are arranged on the PCB board in a repeated alternating manner, so that the number of light-emitting chips in the same row in each pixel unit in the same row alternates between two and one, and the types of light-emitting chips in two rows of two adjacent pixel units are different, and the light-emitting chips in each column in each pixel unit in the same column are aligned with each other sideways and are of the same type; when the light-emitting chips on the substrate are arranged into two rows and three columns along the first direction and the second direction respectively and each light-emitting chip is inclined at a preset acute angle relative to the second direction, the two light-emitting chips in each row The substrates of two adjacent pixel units are arranged on the PCB board at an angle parallel to the first direction, the number of light-emitting chips in the same row in each pixel unit in the same row is one or two, and the type of light-emitting chips in each row of two adjacent pixel units is the same, and the light-emitting chips in each column in each pixel unit in the same column are aligned with each other top and bottom surfaces and are of the same type; when a plurality of light-emitting chips are arranged into three rows and three columns along the first direction and the second direction respectively and each light-emitting chip is arranged along a direction parallel to the first direction, the substrates of two adjacent pixel units in each row are arranged on the PCB board at an angle parallel to the first direction, the number of light-emitting chips in the same row in each pixel unit in the same row is one, and the type of light-emitting chips in each row of two adjacent pixel units is the same, and the light-emitting chips in each column in each pixel unit in the same column are aligned with each other top and bottom surfaces and are of the same type.

[0019] Furthermore, in the first direction, three adjacent light-emitting chips of two adjacent pixel units can realize pixel multiplexing, and in the second direction, three adjacent light-emitting chips of two adjacent pixel units can realize pixel multiplexing.

[0020] To achieve another object of the present invention, an LED display screen is provided, characterized in that it includes any one of the above LED display modules.

[0021] The beneficial effects of the present invention are:

[0022] The pixel unit, LED display module and LED display screen provided by the present invention include: a substrate; a plurality of light-emitting chips fixed on the front side of the substrate; a bottom black layer and a transparent adhesive layer are arranged in sequence on the substrate, the top surface of the bottom black layer is lower than the light-emitting surface of each light-emitting chip, and the transparent adhesive layer covers the light-emitting surface of each light-emitting chip, or a transparent adhesive layer and a low-transmittance film are arranged in sequence on the substrate, and the transparent adhesive layer covers the light-emitting surface of each core light-emitting chip; a plurality of solder pins are fixed on the back side of the substrate; the pixel unit is made by using the MIP packaging process. The present invention is different from the prior art that only uses transparent adhesive film packaging for packaging, and is combined with stacking two layers of light-transmitting layers with different light transmittances, and the light transmittance of the outer light-transmitting layer is lower than the light transmittance of the inner light-transmitting layer, so that the contrast of the pixel unit is higher, so that the display contrast of the LED display module and LED screen using the pixel unit is higher, bringing better display effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings required for use in the embodiment of the present invention will be briefly introduced below. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work, and these are all within the protection scope of the present invention.

[0024] Figure 1 A schematic diagram of a specific implementation of the first embodiment of the pixel unit provided by the embodiment of the present invention;

[0025] Figure 2 A schematic diagram of another specific implementation of the first embodiment of the pixel unit provided by the embodiment of the present invention;

[0026] Figure 3 A schematic diagram of a second embodiment of a pixel unit provided by an embodiment of the present invention;

[0027] Figure 4 A schematic diagram of a third embodiment of a pixel unit provided by an embodiment of the present invention;

[0028] Figure 5 A schematic diagram of a fourth embodiment of a pixel unit provided by an embodiment of the present invention;

[0029] Figure 6 A schematic diagram of a fifth embodiment of a pixel unit provided by an embodiment of the present invention;

[0030] Figure 7 A schematic diagram of a sixth embodiment of a pixel unit provided by an embodiment of the present invention;

[0031] Figure 8A schematic diagram of a sixth embodiment of a pixel unit provided by an embodiment of the present invention;

[0032] Fig. 9 A schematic diagram of a first embodiment of an LED display module provided by an embodiment of the present invention;

[0033] Fig.10 A schematic diagram of a second embodiment of an LED display module provided by an embodiment of the present invention;

[0034] Fig.11 A schematic diagram of a third embodiment of an LED display module provided by an embodiment of the present invention;

[0035] Fig.12 A schematic diagram of a fourth embodiment of an LED display module provided by an embodiment of the present invention;

[0036] Fig.13 A schematic diagram of a fifth embodiment of an LED display module provided by an embodiment of the present invention;

[0037] Fig.14 A schematic diagram of a sixth embodiment of an LED display module provided by an embodiment of the present invention;

[0038] Fig.15 A schematic diagram of a seventh embodiment of an LED display module provided by an embodiment of the present invention;

[0039] Fig.16 A schematic side view of a packaging structure of a pixel unit embodiment provided by an embodiment of the present invention;

[0040] Fig.17 A side schematic diagram of another packaging structure of a pixel unit embodiment provided by an embodiment of the present invention.

[0041] Description of reference numerals:

[0042] 10-pixel unit; 1-substrate; 2-first light-emitting chip; 3-second light-emitting chip; 4-third light-emitting chip; 5-bottom black layer; 6-transparent adhesive layer; 7-low-transmittance film; 81-first positive electrode pad; 82-second positive electrode pad; 83-third positive electrode pad; 9-common negative electrode; X-first direction; Y-second direction. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution in the embodiment of the present invention will be clearly and completely described in conjunction with the drawings in the embodiment of the present invention. It should be noted that, in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. In the description of the present invention, it should be understood that the orientation or position relationship indicated by the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. Moreover, the terms "comprises", "includes" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element limited by the sentence "comprising..." does not exclude the presence of other identical elements in the process, method, article or device including the element. If there is no conflict, the embodiments of the present invention and the various features in the embodiments can be combined with each other, all within the scope of protection of the present invention.

[0044] refer to Figures 1 to 8 As an object of the present invention, a pixel unit 10 is provided, which includes a substrate 1, a plurality of light-emitting chips emitting different colors of light, and a plurality of solder pins. The pixel unit 10 is manufactured by using a MIP packaging process. Specifically, a plurality of light-emitting chips are first transferred to the substrate by a mass transfer technology, then packaged, and finally cut into small packages, namely, pixel units 10. In the present invention, unless otherwise specified, the pixel units 10 in each embodiment are obtained by a new packaging architecture of Micro LED - MIP (Micro LED inpackage) structure. Among them, different colors of light include red light, blue light and green light. A plurality of light-emitting chips and a plurality of solder pins (not shown) are respectively fixed on the front and back of the substrate 1 by welding, for example. A plurality of light-emitting chips are arranged in a first direction X into a plurality of rows that are staggered and equal to two rows, and at least one light-emitting chip is arranged in each row. In a second direction Y perpendicular to the first direction X, it can be understood that, Figures 1 to 15As shown, in this specification, the first direction X and the second direction Y are respectively described by taking the horizontal direction and the vertical direction as examples, and each light-emitting chip is arranged into a plurality of columns that are staggered and are greater than or equal to three columns, and at least one light-emitting chip is arranged in each column. Therefore, by arranging a plurality of light-emitting chips into a plurality of rows and a plurality of columns, compared with the prior art that arranges each light-emitting chip in a straight line, the drawbacks of great mutual shielding, overlapping and mixing of light between the light-emitting chips are eliminated, thereby reducing or even eliminating the occurrence of abnormal side color light, thereby improving the contrast. In addition, since multiple light-emitting chips are misaligned in multiple rows and columns, it is possible to facilitate pixel reuse of two adjacent pixel units 10 (further detailed description will be given below), and thus, at the same cost, the number of light-emitting chips can be reduced to a certain extent, thereby reducing the probability of substandard solid crystal accuracy, thereby reducing or eliminating the adverse conditions of skewness and offset of the MIP structure. Moreover, the pixel multiplexing technology can be used to improve the resolution of the display module and display screen to which the pixel unit 10 is applied, and reduce the manufacturing cost of the display module and display screen, thereby overcoming the technical prejudice of those skilled in the art that the application of the MIP structure process to Micro LED is costly, so that the pixel unit 10 reduces the cost on the basis of obtaining the advantages of the MIP structure.

[0045] Please refer to further Figure 1 and Figure 2 As the first embodiment of the pixel unit of the present invention, the plurality of light-emitting chips on the substrate 1 are arranged into two rows and three columns along the first direction X and the second direction Y, respectively. In each embodiment of the pixel unit 10 of the present invention, based on technology, operational feasibility and reliability, the light-emitting chips are all in the shape of a long rectangular strip, and the substrate 1 is all in the shape of a square close to a square. In addition, according to actual needs, the substrate can also be rectangular. It can be seen that the rectangle and the square refer to the cross-sectional shapes of the light-emitting chip and the substrate, respectively. In addition, the first light-emitting chip 2, the second light-emitting chip 3 and the third light-emitting chip 4 are respectively specifically used in the three types of chips, namely, a red chip, a blue chip and a green chip. In addition, according to actual conditions, the specific chip types used by each light-emitting chip can be interchanged with each other. Preferably, the positive electrodes of the first light-emitting chip 2, the second light-emitting chip 3 and the third light-emitting chip 4 are respectively welded to the first positive electrode pad 81, the second positive electrode pad 82 and the third positive electrode pad 83, and the negative electrodes of the three are welded to the common negative electrode 9. Each column of light-emitting chips, especially its long sides, are arranged parallel to the second direction Y, such as Figure 1 and Figure 2As shown in the direction indicated by the Y-axis arrow, the first row has two parallel and spaced first light-emitting chips 2 and second light-emitting chips 3 facing each other, and the first light-emitting chip 2 and the second light-emitting chip 3 emit the first color light and the second color light respectively, and the second row has a third light-emitting chip 4 emitting the third color light, and the spacing between the light-emitting chips in the first direction X is equal, which can also be said that the parallel distances of the two adjacent parallel long sides of the two adjacent light-emitting chips in the first direction X are equal. Specifically, as Figure 1 As shown in the direction indicated by the Y-axis arrow, as an implementation of the pixel unit 10 of this embodiment, the first row has two parallel, spaced, and directly opposite first and second light-emitting chips 2 and 3 that emit first and second color lights respectively, and the second row has a third light-emitting chip 4 that emits a third color light. Figure 2 As shown in the direction indicated by the Y-axis arrow, as another implementation of the pixel unit 10 of this embodiment, the first row has a third light-emitting chip 4 that emits a third color light, and the second row has two parallel, spaced, and directly opposite first and second light-emitting chips 2 and 3. For the two implementations of the pixel unit 10, the spacing between the light-emitting chips in the first direction X is equal, which can also be said that the parallel distances of the two adjacent parallel long sides of the two adjacent light-emitting chips in the first direction X are equal. In this case, since the first light-emitting chip 2 and the second light-emitting chip 3 are staggered with the third light-emitting chip 4 in the second direction Y, that is, the projections of the first light-emitting chip 2 and the second light-emitting chip 3 in the second direction Y do not overlap with the projection of the third light-emitting chip 4 in the second direction Y. In addition, please refer to Fig. 9 When the pixel units 10 of the two implementations of this embodiment are applied to the LED display module, the pixel units 10 are arranged in multiple rows and columns on the PCB board of the LED display module, and for the two types of pixel units 10 that are adjacent to each other and arranged alternately in each row, each subsequent pixel unit 10 is equivalent to rotating 180° about the center point of the substrate 1 and then mirroring it in the first direction relative to the previous pixel unit 10. In this way, when looking at the side of the substrate 1 from the outside along the first direction X, there will be no drawbacks such as great mutual shielding and overlapping light mixing between the light-emitting chips. In addition, referring to Fig. 9 As can be seen from the following description of the first embodiment of the LED display module, by rotating the two pixel units 10 in the first embodiment of the pixel unit by 180° with the center point of the substrate 1 and then mirroring them in the first direction, the two adjacent pixel units 10 in the first direction X and the second direction Y can realize the multiplexing of the three primary colors of RGB, so that at the same cost, the LED display module and display screen to which the pixel unit 10 of this embodiment is applied have the advantage of higher resolution. Similarly, the following pixel unit embodiments 2 to 7 can also obtain the beneficial effects obtained in the first embodiment of the pixel unit, which will not be repeated below.

[0046] Please refer to further Figure 3 and 4 , as the second embodiment of the pixel unit of the present invention, as Figure 3 As shown, the plurality of light-emitting chips on the substrate 1 are arranged in two rows and three columns along the first direction X and the second direction Y, respectively. Each light-emitting chip is inclined at a preset acute angle relative to the second direction Y. It can be understood that the preset acute angle is the acute angle at which the light-emitting chip in the first embodiment is deflected relative to the second direction Y. The value range of the preset acute angle can be 0°-45°. Moreover, according to repeated experiments by the applicant, when the preset acute angle is in the range of 0°-30°, the process difficulty is relatively low and the overall light output effect applied to the display screen is better. Figure 3 As shown in the direction indicated by the Y-axis arrow, each light-emitting chip is rotated counterclockwise by a preset acute angle relative to the second direction Y, wherein the first row has a third light-emitting chip 4, and the second row has two inclined parallel spaced first light-emitting chips 2 and second light-emitting chips 3. As the third embodiment of the pixel unit of the present invention, each light-emitting chip has the same inclined preset acute angle as each light-emitting chip in the second embodiment of the pixel unit 10, except that Figure 4 As shown in the direction indicated by the Y-axis arrow, the first row has two second light-emitting chips 3 and a first light-emitting chip 2 that are spaced apart in parallel and obliquely, and the second row has one third light-emitting chip 4 .

[0047] Similarly, as the fifth embodiment of the pixel unit of the present invention, Figure 5 As shown in the direction indicated by the Y-axis arrow, each light-emitting chip is rotated clockwise by a preset acute angle relative to the second direction Y, wherein the first row has a third light-emitting chip 4, and the second row has two inclined parallel spaced first light-emitting chips 2 and second light-emitting chips 3. In addition, as the fifth embodiment of the pixel unit of the present invention, each light-emitting chip has the same inclined preset acute angle as each light-emitting chip in the fourth embodiment of the pixel unit 10, except that Figure 6 As shown in the direction indicated by the Y-axis arrow, the first row has two second light-emitting chips 3 and a first light-emitting chip 2 that are spaced apart in parallel and obliquely, and the second light-emitting chip 3 and the first light-emitting chip 2 emit the second color light and the first color light respectively, and the second row has a third light-emitting chip 4. In the first to fifth embodiments of the pixel unit of the present invention, the projections of the first light-emitting chip 2, the second light-emitting chip 3 and the third light-emitting chip 4 in the first direction X are the first projection, the second projection and the third projection respectively, and the third projection is located between the first projection and the second projection.

[0048] Please refer to further Figure 7As a sixth embodiment of the pixel unit of the present invention, a plurality of light-emitting chips on a substrate 1 are arranged in three rows and three columns along a first direction X and a second direction Y, respectively. Each light-emitting chip is arranged in parallel to the first direction X, and each light-emitting chip is arranged as a whole in a stepped shape ascending from the lower left corner to the upper right corner, and the spacings in the first direction X and the second direction Y are equal. A first light-emitting chip 2 emitting a first color light, a second light-emitting chip 3 emitting a second color light, and a third light-emitting chip 4 emitting a third color light are arranged at each step position, that is, Figure 7 As shown in the directions indicated by the arrows on the X-axis and the Y-axis, the light-emitting chips in the first row and the first column, the second row and the second column, and the third row and the third column are the second light-emitting chip 3, the third light-emitting chip 4, and the first light-emitting chip 2, respectively. With respect to the projections in the first direction X, the lengths of the lines connecting the two projection points of the short sides of the rectangles of the second light-emitting chip 3, the third light-emitting chip 4, and the first light-emitting chip 2 are equal, and with respect to the projections in the second direction Y, the lengths of the lines connecting the two projection points of the long sides of the rectangles of the second light-emitting chip 3, the third light-emitting chip 4, and the first light-emitting chip 2 are equal.

[0049] Similarly, as the seventh embodiment of the pixel unit of the present invention, each light-emitting chip is arranged as a whole in a stepped shape descending from the upper left corner to the lower right corner, and as shown in FIG. Figure 8 As shown in the directions indicated by the arrows on the X-axis and the Y-axis, the light-emitting chips in the first row and third column, the second row and second column, and the third row and first column are the second light-emitting chip 3, the third light-emitting chip 4, and the first light-emitting chip 2, respectively.

[0050] Further preferably, for the above-mentioned various pixel units 10, please refer to Fig.16 , a bottom black layer 5 and a transparent adhesive layer 6 are sequentially arranged on the substrate 1, the top surface of the bottom black layer 5 is lower than the light-emitting surface of each light-emitting chip, and the transparent adhesive layer 6 covers the light-emitting surface of each chip, or, please refer to Fig.17 , a transparent adhesive layer 6 and a low-transmittance film 7 are sequentially arranged on the substrate, the transparent adhesive layer 6 covers the light-emitting surface of each chip, and the bottom black layer 5 includes a black UV ink material, the transparent adhesive layer 6 adopts an OCA adhesive film or a liquid epoxy resin, and the low-transmittance film 7 adopts an OCA adhesive film and adds 40%-60% melanin. Therefore, different from the prior art that only uses transparent adhesive film packaging for packaging, the pixel unit 10 of the present invention is equipped with two layers of light-transmitting layers with different light transmittances, and the light transmittance of the outer light-transmitting layer is lower than that of the inner light-transmitting layer, so that the contrast of the pixel unit 10 is higher, so that the display contrast of the LED display module and LED screen using the pixel unit 10 is higher, bringing a good display effect.

[0051] As another object of the present invention, in conjunction with reference Figures 9 to 15, provides an LED display module, which includes a PCB board (not shown), a plurality of pixel units 10 of any one of the above, a plurality of pads (not shown) are provided on the PCB board, and the soldering feet of each pixel unit 10 are correspondingly soldered to the pads. In the first direction X and the second direction Y, on the PCB board, each pixel unit 10 is aligned and arranged into multiple rows and columns, respectively, and for the above pixel unit embodiments 2 to 7, the substrates of two adjacent pixel units 10 in each row are arranged at the same angle, that is, the light-emitting chips in the same row of each pixel unit 10 are all the same, and for the above pixel unit embodiment 1, the substrates of two adjacent pixel units 10 in each row are alternately arranged at two mirror angles, or it can be said that each subsequent pixel unit 10 in each row is equivalent to rotating 180° about the center of the substrate relative to the previous pixel unit 10, and the pixel units 10 in each column are arranged at the same angle, that is, the light-emitting chips in the same column of each pixel unit 10 are all the same. Therefore, as described above, the LED display module having the pixel unit 10 including any of the above embodiments can achieve the beneficial effects of reducing the side color light abnormality and improving the contrast.

[0052] Specifically, corresponding to the LED display module embodiment 1 of the above-mentioned pixel unit embodiment 1, please refer to Fig. 9 , when the plurality of light-emitting chips on the substrate 1 are arranged into two rows and three columns along the first direction X and the second direction Y respectively and each light-emitting chip is arranged in parallel to the second direction Y, the two adjacent pixel units 10 in each row arranged on the PCB board adopt the pixel units of the two implementation methods in the first pixel unit embodiment, so that the number of light-emitting chips in the same row of each pixel unit 10 alternates between two and one and the types of the light-emitting chips in the two rows of the two adjacent pixel units 10 are different, and the light-emitting chips in each column of each pixel unit 10 in the same column are aligned with each other and are of the same type. Corresponding to the second to fifth LED display module embodiments of the above-mentioned pixel unit embodiments, please refer to the second to fifth embodiments of the LED display module embodiments of the second to fifth embodiments. Figures 10 to 13 , when the light-emitting chips on the substrate 1 are arranged into two rows and three columns along the first direction X and the second direction Y respectively and each light-emitting chip is inclined at a preset acute angle relative to the second direction Y, the substrates of the two adjacent pixel units 10 in each row are arranged on the PCB board at an angle parallel to the first direction X, the number of light-emitting chips in the same row in each pixel unit 10 in the same row is one or two, and the type of light-emitting chips in each row of the two adjacent pixel units 10 is the same, and the light-emitting chips in each column of each pixel unit 10 in the same column are aligned with each other, that is, the bottom surface of one light-emitting chip is aligned with the top surface of another light-emitting chip and the types are the same; corresponding to the LED display module embodiments 6 and 7 of the above-mentioned pixel unit embodiments 6 and 7, please refer to Fig.14 and15 , when a plurality of light-emitting chips are arranged in three rows and three columns along the first direction X and the second direction Y respectively and each light-emitting chip is arranged in parallel to the first direction X, the substrates of two adjacent pixel units 10 in each row are arranged on the PCB board at an angle parallel to the first direction X, the number of light-emitting chips in the same row in each pixel unit 10 in the same row is one and the types of light-emitting chips in each row of two adjacent pixel units 10 are the same, and the light-emitting chips in each column of each pixel unit 10 in the same column are aligned with each other at the top and bottom and are of the same type. Therefore, the LED display module having the pixel unit 10 including any of the above pixel unit 10 embodiments can obtain the beneficial effects of reducing side color light abnormality and improving contrast.

[0053] Please refer to Figures 9 to 15 The dotted ellipse in each figure shows that in the first direction X, three adjacent light-emitting chips of two adjacent pixel units 10 can realize pixel multiplexing, and the solid circle in each figure shows that in the second direction Y, three adjacent light-emitting chips of two adjacent pixel units 10 can realize pixel multiplexing. Therefore, since pixel multiplexing of any three light-emitting chips that are two adjacent in the first direction X and the second direction Y is realized, the LED display module can obtain higher resolution at the same cost.

[0054] As another object of the present invention, an LED display screen is provided. The LED display screen especially adopts an LED display module obtained by a new packaging architecture of Micro LED - MIP (Micro LED in package) structure. Therefore, the LED display screen can obtain any beneficial effect of the LED display module described above, which will not be repeated here. When the viewer views the display screen from the side, there will be basically no abnormal light color on the side of the display screen, thereby improving the side display effect of the display screen and also improving the contrast of the display screen.

[0055] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. These modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A pixel unit, characterized in that: include: substrate; A plurality of light-emitting chips fixed on the front surface of the substrate; A bottom black layer and a transparent adhesive layer are sequentially arranged on the substrate, the top surface of the bottom black layer is lower than the light-emitting surface of each light-emitting chip, and the transparent adhesive layer covers the light-emitting surface of each light-emitting chip, or a transparent adhesive layer and a low-transmittance film are sequentially arranged on the substrate, and the transparent adhesive layer covers the light-emitting surface of each light-emitting chip; A plurality of solder pins fixed to the back side of the substrate; The pixel unit is manufactured by using the MIP packaging process.

2. The pixel unit according to claim 1, characterized in that: A plurality of light emitting chips emitting light of different colors are fixed on the front side of the substrate, and the different color lights include red light, blue light and green light.

3. The pixel unit according to claim 1, characterized in that: The plurality of light-emitting chips on the substrate are arranged into two rows and three columns along a first direction and a second direction, respectively. The light-emitting chips in each column are arranged in parallel to the second direction. One row has two parallel, spaced and directly opposite first light-emitting chips and the first light-emitting chip and the second light-emitting chip emit a first color light and a second color light respectively. The other row has a third light-emitting chip that emits a third color light. The projections of the first light-emitting chip and the second light-emitting chip in the second direction do not overlap with the projection of the third light-emitting chip in the second direction. The pixel units adjacent to each other in the first direction and the second direction can realize RGB three-primary color pixel multiplexing.

4. The pixel unit according to claim 1, characterized in that: The multiple light-emitting chips on the substrate are arranged into two rows and three columns along the first direction and the second direction, respectively. Each light-emitting chip is inclined at a preset acute angle relative to the second direction, and the preset acute angle has a value range of 0°-45°. One row has two inclined parallel spaced first light-emitting chips and a second light-emitting chip, and the first light-emitting chip and the second light-emitting chip emit a first color light and a second color light, respectively. The other row has a third light-emitting chip that emits a third color light.

5. The pixel unit according to claim 1, characterized in that: The multiple light-emitting chips on the substrate are arranged into three rows and three columns along the first direction and the second direction respectively, and each light-emitting chip is arranged parallel to the first direction, each row has a first light-emitting chip emitting a first color light, a second light-emitting chip emitting a second color light, and a third light-emitting chip emitting a third color light, and each column has a first light-emitting chip emitting a first color light, a second light-emitting chip emitting a second color light, and a third light-emitting chip emitting a third color light, and the light-emitting chips are arranged in a stepped shape as a whole.

6. The pixel unit according to any one of claims 1 to 5, characterized in that: The bottom black layer includes black UV ink material, the transparent adhesive layer uses OCA adhesive film or liquid epoxy resin, and the low-transmittance film uses OCA adhesive film and adds 40%-60% melanin.

7. An LED display module, characterized in that: include: A PCB board, on which a plurality of pads are provided; A plurality of pixel units according to any one of claims 1 to 6, wherein the pixel units are aligned and arranged into a plurality of rows and a plurality of columns in a first direction and a second direction, and the substrates of two adjacent pixel units in each row are arranged on the PCB at the same angle, or the substrates of two adjacent pixel units in each row are arranged on the PCB at two mirror-image angles alternately and the pixel units in each column are arranged on the PCB at the same angle; The welding feet of each pixel unit are correspondingly welded to the welding pad.

8. The LED display module according to claim 7, characterized in that: When a plurality of light-emitting chips on the substrate are arranged into two rows and three columns along the first direction and the second direction respectively, and each light-emitting chip is arranged in parallel to the second direction, the LED display module has two kinds of pixel units, one of which is equivalent to the center point of the substrate of the other pixel unit rotated 180° and then mirrored in the first direction, and the two kinds of pixel units in each row are arranged on the PCB board in a repeated alternating manner, so that the number of light-emitting chips in the same row in each pixel unit in the same row alternates between two and one, and the types of light-emitting chips in two rows of two adjacent pixel units are different, and the light-emitting chips in each column of each pixel unit in the same column are mutually aligned laterally and are of the same type; When the light-emitting chips on the substrate are arranged into two rows and three columns along the first direction and the second direction respectively, and each light-emitting chip is inclined at a preset acute angle relative to the second direction, the substrates of two adjacent pixel units in each row are arranged on the PCB board at an angle parallel to the first direction, the number of light-emitting chips in the same row in each pixel unit in the same row is one or two, and the type of light-emitting chips in each row of two adjacent pixel units is the same, and the light-emitting chips in each column of each pixel unit in the same column are aligned with each other top and bottom surfaces and are of the same type; When multiple light-emitting chips are arranged into three rows and three columns along the first direction and the second direction respectively, and each light-emitting chip is arranged in parallel to the first direction, the substrates of two adjacent pixel units in each row are arranged on the PCB board at an angle parallel to the first direction, the number of light-emitting chips in the same row in each pixel unit in the same row is one and the type of light-emitting chips in each row of two adjacent pixel units is the same, and the light-emitting chips in each column in each pixel unit in the same column are aligned with each other top and bottom surfaces and are of the same type.

9. The LED display module according to claim 7, characterized in that: In the first direction, three adjacent light-emitting chips of two adjacent pixel units can realize pixel multiplexing, and in the second direction, three adjacent light-emitting chips of two adjacent pixel units can realize pixel multiplexing.

10. An LED display screen, characterized in that: Comprising the LED display module as described in any one of claims 7 to 9.

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