LED packaging substrate and LED device

Abstract

The invention discloses an LED packaging substrate and an LED device, the LED packaging substrate comprises a substrate, the front surface of the substrate is provided with a plurality of bonding pads, the bonding pads comprise common electrode bonding pads and non-common electrode bonding pads, and the non-common electrode bonding pads comprise a first polarity bonding pad, a second polarity bonding pad and a third polarity bonding pad; a plurality of pins are arranged on the back surface of the substrate and comprise common electrode pins and non-common electrode pins, and the non-common electrode pins comprise a first polarity pin, a second polarity pin and a third polarity pin; the common electrode bonding pad is connected with the common electrode pin, the first polarity bonding pad is connected with the first polarity pin, the second polarity bonding pad is connected with the second polarity pin, and the third polarity bonding pad is connected with the third polarity pin. The LED device comprises the LED packaging substrate provided by the utility model. The invention provides the LED packaging substrate which is compatible with the LED devices of the common-cathode structure and the common-anode structure at the same time, the manufacturing and delivery period of the LED devices is greatly shortened, the material cost is reduced, and the production efficiency of the LED devices is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of LED devices, and in particular to an LED packaging substrate and an LED device. Background Art

[0002] The traditional driving method of LED display screens is the common anode driving method, and its manufacturing process is the most mature. In recent years, the emerging common cathode driving method has a greater advantage in energy saving than the common anode driving method, and its manufacturing process is becoming more mature. Therefore, the LED display market has been in a state of coexistence of common anode structure products and common cathode structure products.

[0003] For LED display manufacturers, for flip-chip LED devices, the common cathode structure and common anode structure can share the LED packaging substrate, and the switch between the common cathode and common anode structures can be achieved by simply changing the direction of the LED chip. However, for normal-mounted LED devices, the lead frames used by common cathode and common anode devices are completely different, and a common substrate cannot be achieved. Since manufacturers will only produce one of the common cathode or common anode structures of the same size device under normal circumstances, when manufacturers receive two types of structure devices at the same time, they need to redesign the mold and make the substrate, which not only prolongs the production and delivery cycle, but also increases its material cost and greatly reduces its production efficiency. Summary of the invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art. The present invention provides an LED packaging substrate that is compatible with both common cathode structure and common anode structure LED devices, which greatly shortens the manufacturing and delivery cycle of LED devices, reduces material costs, and improves the production efficiency of LED devices.

[0005] The present invention provides an LED packaging substrate, the LED packaging substrate comprises a substrate, a front surface of the substrate is provided with a plurality of pads, the plurality of pads comprises at least one common pole pad and at least three non-common pole pads, the non-common pole pads comprises at least one first polarity pad, at least one second polarity pad and at least one third polarity pad;

[0006] A plurality of pins are arranged on the back of the substrate, the plurality of pins include common polarity pins and non-common polarity pins, and the non-common polarity pins include first polarity pins, second polarity pins and third polarity pins;

[0007] The common polarity pad is connected to the common polarity pin, the first polarity pad is connected to the first polarity pin, the second polarity pad is connected to the second polarity pin, and the third polarity pad is connected to the third polarity pin.

[0008] Furthermore, the plurality of pads also include a bearing pad.

[0009] Further, when the plurality of pads include more than two common-pole pads, the more than two common-pole pads are connected to each other based on an electrical connection line;

[0010] When the plurality of pads include more than two first polarity pads, the more than two first polarity pads are connected to each other based on an electrical connection line;

[0011] When the plurality of pads include more than two second polarity pads, the more than two second polarity pads are connected to each other based on an electrical connection line;

[0012] When the plurality of pads include more than two third polarity pads, the more than two third polarity pads are connected to each other based on an electrical connection line.

[0013] Furthermore, the substrate is provided with a plurality of conductive holes, the conductive holes penetrate the substrate, and the plurality of pads are correspondingly connected to the plurality of pins based on the conductive holes and the electrical connection lines.

[0014] Furthermore, when the pad is used to carry an LED chip, the pad has a length ≥ 200 μm and a width ≥ 200 μm;

[0015] When the solder pad is used to carry two LED chips, the length of the solder pad is ≥350 μm and the width is ≥200 μm;

[0016] When the pad is used to carry three LED chips, the pad has a length of ≥500 μm and a width of ≥200 μm;

[0017] When the pad is used to weld a wire, the pad has a length of ≥80 μm and a width of ≥80 μm;

[0018] When the pad is used to weld two wires, the pad has a length of ≥140 μm and a width of ≥80 μm;

[0019] When the pad is used to weld three wires, the pad has a length of ≥200 μm and a width of ≥80 μm.

[0020] Further, at least one non-common-pole pad meets the size required for bonding three bonding wires.

[0021] Furthermore, the distance between any two adjacent pads is ≥20 μm.

[0022] Furthermore, positioning ink is provided on the back side of the substrate.

[0023] Furthermore, the plurality of pins include special-shaped pins.

[0024] The present invention also provides an LED device, which includes the above-mentioned LED packaging substrate, three LED chips and several welding wires, the three LED chips include a first LED chip, a second LED chip and a third LED chip, the LED chip is a positive LED chip, the LED chip is arranged on the welding pad, and the electrode of the LED chip is connected to the welding pad based on the welding wire.

[0025] Furthermore, the first LED chip is a red LED chip, the second LED chip is a green LED chip, and the third LED chip is a blue LED chip;

[0026] Or the first LED chip is a red LED chip, the second LED chip is a blue LED chip, and the third LED chip is a green LED chip.

[0027] Furthermore, the first LED chip is fixed on the pad based on conductive glue, and the second LED chip and the third LED chip are fixed on the pad based on insulating glue.

[0028] Furthermore, the first LED chip is a vertical structure chip.

[0029] Furthermore, the pad carrying the first LED chip meets the size for welding three welding wires.

[0030] Further, when the LED device is a common cathode structure, the cathode of the first LED chip, the cathode of the second LED chip, and the cathode of the third LED chip are connected to the common polarity pad, the anode of the first LED chip is connected to the first polarity pad, the anode of the second LED chip is connected to the second polarity pad, and the anode of the third LED chip is connected to the third polarity pad;

[0031] When the LED device is a common anode structure, the anode of the first LED chip, the anode of the second LED chip, and the anode of the third LED chip are connected to the common polarity pad, the cathode of the first LED chip is connected to the first polarity pad, the cathode of the second LED chip is connected to the second polarity pad, and the cathode of the third LED chip is connected to the third polarity pad.

[0032] Furthermore, when the LED device implements a common cathode structure and a common anode structure respectively, it is necessary to change the position or direction of more than one LED chip.

[0033] The present invention provides an LED packaging substrate and an LED device, wherein at least one common pole pad and at least three non-common pole pads are arranged on the front side of the substrate, including at least one first polarity pad, at least one second polarity pad and at least one third polarity pad, and pins are arranged on the back side of the substrate, which are connected to the pads on the front side, so that it can be compatible with LED devices with common cathode structure and common anode structure at the same time. When the common cathode structure and common anode structure of the same product are produced at the same time, there is no need to redesign the mold and make the substrate, which greatly shortens the manufacturing and delivery cycle of the LED device, reduces material costs, and improves the production efficiency of the LED device. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0035] Figure 1 It is a front view schematic diagram of the LED package substrate structure in the first embodiment of the present invention;

[0036] Figure 2 It is a schematic diagram of the back side of the LED package substrate structure in the first embodiment of the present invention;

[0037] Figure 3 is a schematic diagram of a common cathode structure of an LED device in Embodiment 2 of the present invention;

[0038] Figure 4 is a schematic diagram of the common anode structure of an LED device in Embodiment 2 of the present invention;

[0039] Figure 5 is a front view schematic diagram of the LED package substrate structure in the third embodiment of the present invention;

[0040] Figure 6 is a schematic diagram of the back side of the LED package substrate structure in the third embodiment of the present invention;

[0041] Figure 7 is a schematic diagram of a common cathode structure of an LED device in a fourth embodiment of the present invention;

[0042] Figure 8 is a schematic diagram of the common anode structure of an LED device in Embodiment 4 of the present invention;

[0043] Fig. 9 is a front view schematic diagram of the LED package substrate structure in the fifth embodiment of the present invention;

[0044] Fig.10is a schematic diagram of the back side of the LED package substrate structure in the fifth embodiment of the present invention;

[0045] Fig.11 is a schematic diagram of a common cathode structure of an LED device in a sixth embodiment of the present invention;

[0046] Fig.12 is a schematic diagram of a common anode structure of an LED device in a sixth embodiment of the present invention;

[0047] Fig.13 is a front view schematic diagram of the LED package substrate structure in the seventh embodiment of the present invention;

[0048] Fig.14 is a schematic diagram of the back side of the LED package substrate structure in the seventh embodiment of the present invention;

[0049] Fig.15 is a schematic diagram of a common cathode structure of an LED device in Embodiment 8 of the present invention;

[0050] Fig.16 is a schematic diagram of a common anode structure of an LED device in Embodiment 8 of the present invention;

[0051] Fig.17 is a front view schematic diagram of the LED package substrate structure in Embodiment 9 of the present invention;

[0052] Fig.18 is a schematic diagram of the back side of the LED package substrate structure in the ninth embodiment of the present invention;

[0053] Fig.19 is a schematic diagram of a common cathode structure of an LED device in a tenth embodiment of the present invention;

[0054] Fig. 20 is a schematic diagram of a common anode structure of an LED device in a tenth embodiment of the present invention;

[0055] Fig.21 is a front view schematic diagram of the LED package substrate structure in the eleventh embodiment of the present invention;

[0056] Fig. 22 is a schematic diagram of the back side of the LED package substrate structure in the eleventh embodiment of the present invention;

[0057] Fig.23 is a schematic diagram of a common cathode structure of an LED device in a twelfth embodiment of the present invention;

[0058] Fig.24 It is a schematic diagram of the common anode structure of the LED device in the twelfth embodiment of the present invention. DETAILED DESCRIPTION

[0059] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0060] In the present invention, it should be understood that terms such as "include" or "have" are intended to indicate the existence of features, numbers, steps, behaviors, components, parts or a combination thereof disclosed in the specification, and are not intended to exclude the possibility that one or more other features, numbers, steps, behaviors, components, parts or a combination thereof exist or are added.

[0061] It should also be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0062] Embodiment 1

[0063] Embodiment 1 of the present invention provides an LED packaging substrate, which includes a substrate, and five solder pads are arranged on the front side of the substrate, the five solder pads include two common pole solder pads and three non-common pole solder pads, and the three non-common pole solder pads include a first polarity solder pad, a second polarity solder pad and a third polarity solder pad.

[0064] In an optional implementation of this embodiment, Figure 1 As shown, Figure 1 A front schematic diagram of the LED package substrate structure in embodiment 1 of the present invention is shown, wherein the LED package substrate comprises a substrate 1, and five solder pads arranged on the front of the substrate 1 comprise a first solder pad 11, a second solder pad 12, a third solder pad 13, a fourth solder pad 14 and a fifth solder pad 15, wherein the first solder pad 11 and the second solder pad 12 are common polarity solder pads, the third solder pad 13 is a first polarity solder pad, the fourth solder pad 14 is a second polarity solder pad, and the fifth solder pad 15 is a third polarity solder pad.

[0065] Specifically, Figure 1 As shown, the first solder pad 11 is arranged in the center of the substrate 1, the second solder pad 12 is arranged on the left side of the first solder pad 11 and is connected to the first solder pad 11 based on an electrical connection line, the third solder pad 13 is arranged on the upper side of the first solder pad 11, and the fourth solder pad 14 and the fifth solder pad 15 are arranged on the right side of the first solder pad 11, wherein the fourth solder pad 14 is arranged on the upper side of the fifth solder pad 15.

[0066] In an optional implementation of this embodiment, when the plurality of pads include more than two common-pole pads, the more than two common-pole pads are connected to each other based on electrical connection lines.

[0067] Specifically, the first pad 11 and the second pad 12 are connected to each other based on an electrical connection line.

[0068] In an optional implementation of this embodiment, four pins are provided on the back side of the substrate 1 , and the four pins include a common pole pin and a non-common pole pin, and the non-common pole pin includes a first polarity pin, a second polarity pin and a third polarity pin.

[0069] Specifically, Figure 2 As shown, Figure 2 A schematic diagram of the back side of the LED package substrate structure in the first embodiment of the present invention is shown, and four pins are arranged on the back side of the substrate 1, and the four pins include a first pin 91, a second pin 92, a third pin 93 and a fourth pin 94, wherein the first pin 91 is a common pole pin, the second pin 92 is a first polarity pin, the third pin 93 is a second polarity pin, and the fourth pin 94 is a third polarity pin.

[0070] In an optional implementation of this embodiment, the common polarity pad is connected to the common polarity pin, the first polarity pad is connected to the first polarity pin, the second polarity pad is connected to the second polarity pin, and the third polarity pad is connected to the third polarity pin.

[0071] Specifically, the first pad 11 and the second pad 12 are connected to the first pin 91 , the third pad 13 is connected to the second pin 92 , the fourth pad 14 is connected to the third pin 93 , and the fifth pad 15 is connected to the fourth pin 94 .

[0072] In an optional implementation of the present embodiment, when the soldering pad is used to carry one LED chip, the length of the soldering pad is ≥200μm, and the width is ≥200μm; when the soldering pad is used to carry two LED chips, the length of the soldering pad is ≥350μm, and the width is ≥200μm; when the soldering pad is used to carry three LED chips, the length of the soldering pad is ≥500μm, and the width is ≥200μm; when the soldering pad is used to weld one soldering wire, the length of the soldering pad is ≥80μm, and the width is ≥80μm; when the soldering pad is used to weld two soldering wires, the length of the soldering pad is ≥140μm, and the width is ≥80μm; when the soldering pad is used to weld three soldering wires, the length of the soldering pad is ≥200μm, and the width is ≥80μm.

[0073] Specifically, when the LED packaging substrate of this embodiment is used in the LED device application scenario mentioned in the subsequent embodiment 2, the first soldering pad 11 carries at most three LED chips, the second soldering pad 12 is welded with at most three soldering wires, the third soldering pad 13 carries at most one LED chip, and the fourth soldering pad 14 and the fifth soldering pad 15 are welded with at most one soldering wire. Therefore, in this embodiment, the length of the first soldering pad 11 is ≥500μm, and the width is ≥200μm, the length of the second soldering pad 12 is ≥200μm, and the width is ≥80μm, the length of the third soldering pad 13 is ≥200μm, and the width is ≥200μm, and the length of the fourth soldering pad 14 and the fifth soldering pad 15 is ≥80μm, and the width is ≥80μm.

[0074] In an optional implementation of this embodiment, at least one non-common-pole pad meets the size required for bonding three bonding wires.

[0075] Specifically, the third pad 13 , the fourth pad 14 and the fifth pad 15 all meet the size required for welding three wires, that is, the length is ≥ 200 μm and the width is ≥ 80 μm.

[0076] In an optional implementation of this embodiment, the distance between any two adjacent pads is ≥20 μm.

[0077] Specifically, the spacings between the first pad 11 and the second pad 12 , the first pad 11 and the third pad 13 , the first pad 11 and the fourth pad 14 , the first pad 11 and the fifth pad 15 , and the fourth pad 14 and the fifth pad 15 are all ≥20 μm.

[0078] In an optional implementation of this embodiment, four conductive holes 95 are provided on the substrate 1 , and the conductive holes 95 penetrate the substrate 1 . The pads are connected to the pins correspondingly based on the conductive holes 95 and the electrical connection lines.

[0079] In an optional implementation of this embodiment, a positioning ink 96 is provided on the back side of the substrate 1 .

[0080] In an optional implementation of this embodiment, the plurality of pins include special-shaped pins.

[0081] Specifically, the first pin 91 is a special-shaped pin.

[0082] Positioning ink and special-shaped pins are set here to distinguish the type of pins and thus the direction of the device.

[0083] In summary, embodiment 1 of the present invention provides an LED packaging substrate, wherein two common pole pads and three non-common pole pads are arranged on the front side of the substrate, and pins are arranged on the back side of the substrate, which are connected to the corresponding pads on the front side, so that it can be compatible with LED devices with both common cathode structure and common anode structure. When the common cathode structure and common anode structure of the same product are produced at the same time, there is no need to redesign the mold and manufacture the substrate, which greatly shortens the manufacturing and delivery cycle of LED devices, reduces material costs, and improves the production efficiency of LED devices.

[0084] Embodiment 2

[0085] Embodiment 2 of the present invention provides an LED device, which includes the LED packaging substrate described in Embodiment 1, three LED chips and a plurality of welding wires, the three LED chips include a first LED chip, a second LED chip and a third LED chip, the LED chip is a positive-mounted LED chip, the LED chip is arranged on the welding pad, and the electrode of the LED chip is connected to the welding pad based on the welding wire.

[0086] In an optional implementation of this embodiment, the first LED chip is a red LED chip, the second LED chip is a green LED chip, and the third LED chip is a blue LED chip.

[0087] In an optional implementation of this embodiment, the first LED chip is fixed on the pad based on a conductive adhesive, and the second LED chip and the third LED chip are fixed on the pad based on an insulating adhesive.

[0088] In an optional implementation of this embodiment, the first LED chip is a vertical structure chip.

[0089] In an optional implementation of this embodiment, when the LED device is a common cathode structure, such as Figure 3 As shown, Figure 3 A schematic diagram of a common cathode structure of an LED device in a second embodiment of the present invention is shown, wherein the three LED chips, namely a first LED chip 16, a second LED chip 17, and a third LED chip 18 are arranged on the first soldering pad 11 and are arranged in a "1" shape, wherein the cathode of the first LED chip 16 is connected to the first soldering pad 11 supporting the first LED chip 16 based on a conductive adhesive, the cathode of the second LED chip 17 and the cathode of the third LED chip 18 are connected to the second soldering pad 12 based on a soldering wire, the anode of the first LED chip 16 is connected to the third soldering pad 13 based on a soldering wire, the anode of the second LED chip 17 is connected to the fourth soldering pad 14 based on a soldering wire, and the anode of the third LED chip 18 is connected to the fifth soldering pad 15 based on a soldering wire.

[0090] It should be noted that, except that the position of the first LED chip 16 is fixed, the positions of the second LED chip 17 and the third LED chip 18 are interchangeable.

[0091] In an optional implementation of this embodiment, when the LED device is a common anode structure, Figure 4 As shown, Figure 4 A schematic diagram of the common anode structure of the LED device in the second embodiment of the present invention is shown, the first LED chip 16 is arranged on the third soldering pad 13, the second LED chip 17 and the third LED chip 18 are arranged on the first soldering pad 11, the anode of the first LED chip 16, the anode of the second LED chip 17, and the anode of the third LED chip 18 are connected to the second soldering pad 12 based on the soldering wire, the cathode of the first LED chip 16 is connected to the third soldering pad 13 carrying the first LED chip 16 based on the conductive glue, the cathode of the second LED chip 17 is connected to the fourth soldering pad 14 based on the soldering wire, and the cathode of the third LED chip 18 is connected to the fifth soldering pad 15 based on the soldering wire.

[0092] It should be noted that, except that the position of the first LED chip 16 is fixed, the positions of the second LED chip 17 and the third LED chip 18 are interchangeable.

[0093] In an optional implementation of this embodiment, the pad carrying the first LED chip meets the size required for welding three bonding wires.

[0094] Specifically, the first soldering pad 11 and the third soldering pad 13 carrying the first LED chip 16 both meet the size for soldering three soldering wires, that is, the length is ≥200 μm and the width is ≥80 μm.

[0095] It should be noted that when the LED device implements a common cathode structure and a common anode structure respectively, the position or direction of more than one LED chip needs to be changed.

[0096] Specifically, in this embodiment, the position of the first LED chip 16 needs to be changed. When a common cathode structure is used, the first LED chip 16 is located at the first solder pad 11 . When a common anode structure is used, the first LED chip is located at the third solder pad 13 .

[0097] In summary, embodiment 2 of the present invention provides an LED device, including the LED packaging substrate in embodiment 1, wherein two common pole pads and three non-common pole pads are arranged on the front side of the substrate, and pins are arranged on the back side of the substrate, which are connected to the corresponding pads on the front side. By changing the placement position of the LED chip and the welding wire method, the structure of the LED packaging substrate, including the position and number of pads, electrical connecting wires, conductive holes, and pins, is not required to be changed, so that it can be compatible with both common cathode structure and common anode structure LED devices. When the common cathode structure and common anode structure of the same product are produced at the same time, there is no need to redesign the mold and produce the substrate, which greatly shortens the manufacturing and delivery cycle of the LED device, reduces material costs, and improves the production efficiency of the LED device.

[0098] Embodiment 3

[0099] Embodiment 3 of the present invention provides an LED packaging substrate, which includes a substrate, and seven solder pads are arranged on the front side of the substrate, the seven solder pads include two common pole solder pads and four non-common pole solder pads, and the four non-common pole solder pads include two first polarity solder pads, one second polarity solder pad and one third polarity solder pad.

[0100] In an optional implementation of this embodiment, the seven pads further include a carrying pad.

[0101] In an optional implementation of this embodiment, Figure 5 As shown, Figure 5 A front schematic diagram of the LED package substrate structure in embodiment three of the present invention is shown, wherein the LED package substrate includes a substrate 2, and seven solder pads arranged on the front of the substrate 2 include a sixth solder pad 21, a seventh solder pad 22, an eighth solder pad 23, a ninth solder pad 24, a tenth solder pad 25, an eleventh solder pad 26 and a twelfth solder pad 27.

[0102] Specifically, Figure 5 As shown, the sixth solder pad 21 is arranged in the center of the substrate 2, the seventh solder pad 22 is arranged on the upper left side of the sixth solder pad 21, the eighth solder pad 23 is arranged on the lower side of the sixth solder pad 21, the ninth solder pad 24 and the eleventh solder pad 26 are arranged on the upper right side of the sixth solder pad 21, the tenth solder pad 25 is arranged on the left side of the sixth solder pad 21, and the twelfth solder pad 27 is arranged on the upper side of the sixth solder pad 21.

[0103] In an optional implementation of this embodiment, when the LED package substrate is applied to an LED device with a common cathode structure, the sixth pad 21 and the seventh pad 22 are common polarity pads, the eighth pad 23 and the ninth pad 24 are first polarity pads, the tenth pad 25 is a second polarity pad, the eleventh pad 26 is a third polarity pad, and the twelfth pad 27 is a bearing pad;

[0104] When the LED packaging substrate is applied to an LED device with a common anode structure, the eighth solder pad 23 and the ninth solder pad 24 are common polarity solder pads, the sixth solder pad 21 and the seventh solder pad 22 are first polarity solder pads, the eleventh solder pad 26 is a second polarity solder pad, the tenth solder pad 25 is a third polarity solder pad, and the twelfth solder pad 27 is a bearing solder pad.

[0105] In an optional implementation of the present embodiment, when the plurality of pads include more than two common pole pads, the two or more common pole pads are interconnected based on electrical connection lines; when the plurality of pads include more than two first polarity pads, the two or more first polarity pads are interconnected based on electrical connection lines.

[0106] Specifically, the sixth pad 21 and the seventh pad 22 are connected to each other based on an electrical connection line, and the eighth pad 23 and the ninth pad 24 are connected to each other based on an electrical connection line.

[0107] In an optional implementation of this embodiment, Figure 6 As shown, Figure 6 A schematic diagram of the back side of the LED package substrate structure in the third embodiment of the present invention is shown. Four pins are arranged on the back side of the substrate 1 , and the four pins include a first pin 91 , a second pin 92 , a third pin 93 and a fourth pin 94 .

[0108] In an optional implementation of this embodiment, when the LED package substrate is applied to an LED device with a common cathode structure, the first pin 91 is a second polarity pin, the second pin 92 is a common polarity pin, the third pin 93 is a third polarity pin, and the fourth pin 94 is a first polarity pin;

[0109] When the LED package substrate is applied to an LED device with a common anode structure, the first pin 91 is a third polarity pin, the second pin 92 is a first polarity pin, the third pin 93 is a second polarity pin, and the fourth pin 94 is a common polarity pin.

[0110] In an optional implementation of the present embodiment, regardless of whether the LED packaging substrate is applied to an LED device with a common cathode structure or a common anode structure, the sixth solder pad 21 and the seventh solder pad 22 are connected to the second pin 92, the eighth solder pad 23 and the ninth solder pad 24 are connected to the fourth pin 94, the tenth solder pad 25 is connected to the first pin 91, and the eleventh solder pad 26 is connected to the third pin 93.

[0111] In an optional implementation of the present embodiment, when the LED package substrate of the present embodiment is used in the LED device application scenario mentioned in the subsequent embodiment 4, the sixth soldering pad 21 carries at most two LED chips, the seventh soldering pad 22 and the eighth soldering pad 23 are welded with at most two soldering wires, the ninth soldering pad 24, the tenth soldering pad 25, and the eleventh soldering pad 26 are welded with at most one soldering wire, and the twelfth soldering pad 27 carries at most one LED chip. Therefore, in the present embodiment, the length of the sixth soldering pad 21 is ≥350μm, and the width is ≥200μm, the length of the seventh soldering pad 22 and the eighth soldering pad 23 is ≥140μm, and the width is ≥80μm, the length of the ninth soldering pad 24, the tenth soldering pad 25, and the eleventh soldering pad 26 is ≥80μm, and the width is ≥80μm, and the length of the twelfth soldering pad 27 is ≥200μm, and the width is ≥200μm.

[0112] In an optional implementation of this embodiment, the sixth pad 21 meets the size required for bonding three bonding wires, that is, the length is ≥200 μm and the width is ≥80 μm.

[0113] In an optional implementation of the present embodiment, the spacing between the sixth pad 21 and the seventh pad 22, the sixth pad 21 and the eighth pad 23, the sixth pad 21 and the ninth pad 24, the sixth pad 21 and the tenth pad 25, the sixth pad 21 and the twelfth pad 27, the seventh pad 22 and the twelfth pad 27, the twelfth pad 27 and the ninth pad 24, and the ninth pad 24 and the eleventh pad 26 are all ≥20μm.

[0114] In an optional implementation of this embodiment, four conductive holes 95 are provided on the substrate 2 , and positioning ink 96 is provided on the back side of the substrate 2 .

[0115] In an optional implementation of this embodiment, the second pin 92 is a special-shaped pin.

[0116] Positioning ink and special-shaped pins are set here to distinguish the type of pins and thus the direction of the device.

[0117] In summary, embodiment three of the present invention provides an LED packaging substrate, with two common pole pads, four non-common pole pads and one bearing pad arranged on the front side of the substrate, and pins arranged on the back side of the substrate, which are connected to the corresponding pads on the front side, so that it can be compatible with LED devices of common cathode structure and common anode structure at the same time. When producing the common cathode and common anode structures of the same product at the same time, there is no need to redesign the mold and manufacture the substrate, which greatly shortens the manufacturing and delivery cycle of LED devices, reduces material costs, and improves the production efficiency of LED devices.

[0118] Embodiment 4

[0119] Embodiment 4 of the present invention provides an LED device, which includes the LED package substrate described in Embodiment 3, and has a structure similar to that of the LED device in Embodiment 2, except that:

[0120] In an optional implementation of this embodiment, when the LED device is a common cathode structure, such as Figure 7 As shown, Figure 7 A schematic diagram of the common cathode structure of the LED device in Embodiment 4 of the present invention is shown, wherein the first LED chip 28 and the second LED chip 29 are arranged on the sixth solder pad 21, and the third LED chip 20 is arranged on the twelfth solder pad 27. The cathode of the first LED chip 28 is connected to the sixth solder pad 21 carrying the first LED chip 28 based on a conductive glue, the cathode of the second LED chip 29 and the cathode of the third LED chip 20 are connected to the seventh solder pad 22 based on a solder wire, the anode of the first LED chip 28 is connected to the eighth solder pad 23 based on a solder wire, the anode of the second LED chip 29 is connected to the tenth solder pad 25 based on a solder wire, and the anode of the third LED chip 20 is connected to the eleventh solder pad 26 based on a solder wire.

[0121] In an optional implementation of this embodiment, when the LED device is a common anode structure, Figure 8 As shown, Figure 8 A schematic diagram of the common anode structure of the LED device in Embodiment 4 of the present invention is shown, wherein the first LED chip 28 and the third LED chip 20 are arranged on the sixth pad 21, and the second LED chip 29 is arranged on the twelfth pad 27, the anode of the first LED chip 28 and the anode of the third LED chip 20 are connected to the eighth pad 23 based on welding wires, the anode of the second LED chip 29 is connected to the ninth pad 24 based on welding wires, the cathode of the first LED chip 28 is connected to the sixth pad 21 carrying the first LED chip 28 based on conductive glue, the cathode of the second LED chip 29 is connected to the eleventh pad 26 based on welding wires, and the cathode of the third LED chip 20 is connected to the tenth pad 25 based on welding wires.

[0122] It should be noted that when Figure 8 After the LED device with a common anode structure is rotated 180°, the position of the pins with the same function on the back side is the same as Figure 7 The positions of the pins with the same functions on the back of the LED device with a common cathode structure correspond one to one, that is, Figure 7 The second pin 92 as the common pole pin is connected to Figure 8 The fourth pin 94 serving as the common pole pin corresponds to the position of the fourth pin 94, and the same is true for the remaining pins.

[0123] In an optional implementation of this embodiment, the sixth soldering pad 21 carrying the first LED chip 28 meets the size for soldering three soldering wires, that is, the length is ≥200 μm and the width is ≥80 μm.

[0124] In an optional implementation of the present embodiment, it is necessary to change the positions of the second LED chip 29 and the third LED chip 20. When a common cathode structure is used, the second LED chip 29 is located at the sixth solder pad 21, and the third LED chip 20 is located at the twelfth solder pad 27. When a common anode structure is used, the second LED chip 29 is located at the twelfth solder pad 27, and the third LED chip 20 is located at the sixth solder pad 21.

[0125] In summary, embodiment four of the present invention provides an LED device, including the LED packaging substrate in embodiment three, wherein two common pole pads, four non-common pole pads, and one bearing pad are arranged on the front side of the substrate, and pins are arranged on the back side of the substrate, which are connected to the pads on the front side. By changing the placement position of the LED chip and the welding wire method, the structure of the LED packaging substrate, including the position and number of pads, electrical connecting wires, conductive holes, and pins, is not required to be changed, so that it can be compatible with both common cathode structure and common anode structure LED devices. When the common cathode structure and common anode structure of the same product are produced at the same time, there is no need to redesign the mold and produce the substrate, which greatly shortens the manufacturing and delivery cycle of the LED device, reduces material costs, and improves the production efficiency of the LED device.

[0126] Embodiment 5

[0127] A fifth embodiment of the present invention provides an LED package substrate, which includes a substrate, and five solder pads are arranged on the front side of the substrate.

[0128] In an optional implementation of this embodiment, when the LED package substrate of this embodiment is applied to a common cathode structure LED device, the five pads include two common polarity pads and three non-common polarity pads, and the non-common polarity pads include a first polarity pad, a second polarity pad and a third polarity pad;

[0129] When the LED package substrate of this embodiment is applied to a common anode structure LED device, the five pads include one common pole pad and four non-common pole pads, and the non-common pole pads include two first polarity pads, one second polarity pad and one third polarity pad.

[0130] In an optional implementation of this embodiment, Fig. 9 As shown, Fig. 9 A front schematic diagram of the LED package substrate structure in embodiment five of the present invention is shown, wherein the LED package substrate includes a substrate 3, and five solder pads arranged on the front of the substrate 3 include a thirteenth solder pad 31, a fourteenth solder pad 32, a fifteenth solder pad 33, a sixteenth solder pad 34 and a seventeenth solder pad 35.

[0131] Specifically, Fig. 9 As shown, the thirteenth pad 31 is arranged at the center of the substrate 3 , the fourteenth pad 32 and the seventeenth pad 35 are arranged on the left side of the thirteenth pad 31 , and the fifteenth pad 33 and the sixteenth pad 34 are arranged on the right side of the thirteenth pad 31 .

[0132] In an optional implementation of this embodiment, when the LED package substrate is applied to an LED device with a common cathode structure, the thirteenth pad 31 and the fourteenth pad 32 are common polarity pads, the fifteenth pad 33 is a first polarity pad, the sixteenth pad 34 is a second polarity pad, and the seventeenth pad 35 is a third polarity pad;

[0133] When the LED packaging substrate is applied to a common anode structure LED device, the fifteenth pad 33 is a common polarity pad, the thirteenth pad 31 and the fourteenth pad 32 are first polarity pads, the seventeenth pad 35 is a second polarity pad, and the sixteenth pad 34 is a third polarity pad.

[0134] In an optional implementation of the present embodiment, when the plurality of pads include more than two common pole pads, the two or more common pole pads are interconnected based on electrical connection lines; when the plurality of pads include more than two first polarity pads, the two or more first polarity pads are interconnected based on electrical connection lines.

[0135] Specifically, when the LED package substrate is applied to an LED device with a common cathode structure, and when the LED package substrate is applied to an LED device with a common anode structure, the thirteenth solder pad 31 and the fourteenth solder pad 32 are interconnected based on an electrical connection line.

[0136] In an optional implementation of this embodiment, Fig.10 As shown, Fig.10A schematic diagram of the back side of the LED package substrate structure in the fifth embodiment of the present invention is shown. Four pins are arranged on the back side of the substrate 3 , and the four pins include a first pin 91 , a second pin 92 , a third pin 93 and a fourth pin 94 .

[0137] In an optional implementation of this embodiment, when the LED package substrate is applied to an LED device with a common cathode structure, the first pin 91 is a common polarity pin, the second pin 92 is a third polarity pin, the third pin 93 is a first polarity pin, and the fourth pin 94 is a second polarity pin;

[0138] When the LED package substrate is applied to an LED device with a common anode structure, the first pin 91 is a first polarity pin, the second pin 92 is a second polarity pin, the third pin 93 is a common polarity pin, and the fourth pin 94 is a third polarity pin.

[0139] In an optional implementation of the present embodiment, regardless of whether the LED packaging substrate is applied to an LED device with a common cathode structure or a common anode structure, the thirteenth solder pad 31 and the fourteenth solder pad 32 are connected to the first pin 91, the fifteenth solder pad 33 is connected to the third pin 93, the sixteenth solder pad 34 is connected to the fourth pin 94, and the seventeenth solder pad 35 is connected to the second pin 92.

[0140] In an optional implementation of the present embodiment, when the LED package substrate of the present embodiment is used in the LED device application scenario mentioned in the subsequent embodiment six, the thirteenth pad 31 carries at most three LED chips, the fourteenth pad 32 is welded with at most two welding wires, the fifteenth pad 33 is welded with at most three welding wires, and the sixteenth pad 34 and the seventeenth pad 35 are welded with at most one welding wire. Therefore, in the present embodiment, the length of the thirteenth pad 31 is ≥500μm, and the width is ≥200μm, the length of the fourteenth pad 32 is ≥140μm, and the width is ≥80μm, the length of the fifteenth pad 33 is ≥200μm, and the width is ≥80μm, and the length of the sixteenth pad 34 and the seventeenth pad 35 is ≥80μm, and the width is ≥80μm.

[0141] In an optional implementation of the present embodiment, the thirteenth pad 31 and the fifteenth pad 33 meet the size for welding three welding wires, that is, the length is ≥200 μm and the width is ≥80 μm.

[0142] In an optional implementation of the present embodiment, the spacing between the thirteenth pad 31 and the fourteenth pad 32, the thirteenth pad 31 and the fifteenth pad 33, the thirteenth pad 31 and the sixteenth pad 34, the thirteenth pad 31 and the seventeenth pad 35, the fourteenth pad 32 and the seventeenth pad 35, and the fifteenth pad 33 and the sixteenth pad 34 are all ≥20μm.

[0143] In an optional implementation of this embodiment, four conductive holes 95 are provided on the substrate 3 , and positioning ink 96 is provided on the back side of the substrate 3 .

[0144] In an optional implementation of this embodiment, the first pin 91 is a special-shaped pin.

[0145] Positioning ink and special-shaped pins are set here to distinguish the type of pins and thus the direction of the device.

[0146] In summary, embodiment five of the present invention provides an LED packaging substrate, with two common pole pads and three non-common pole pads, or one common pole pad and four non-common pole pads, arranged on the front side of the substrate, and pins arranged on the back side of the substrate, which are connected to the pads on the front side, so that it can be compatible with LED devices with both common cathode structure and common anode structure. When producing the common cathode structure and common anode structure of the same product at the same time, there is no need to redesign the mold and produce the substrate, which greatly shortens the manufacturing and delivery cycle of LED devices, reduces material costs, and improves the production efficiency of LED devices.

[0147] Embodiment 6

[0148] Embodiment 6 of the present invention provides an LED device, which includes the LED package substrate described in Embodiment 5. Its structure is similar to that of the LED device in Embodiment 2, and the differences include the following contents:

[0149] In an optional implementation of this embodiment, when the LED device is a common cathode structure, Fig.11 As shown, Fig.11 A schematic diagram of the common cathode structure of the LED device in Example 6 of the present invention is shown, wherein the three LED chips are arranged on the thirteenth soldering pad 31, the cathode of the first LED chip 36 is connected to the thirteenth soldering pad 31 supporting the first LED chip based on conductive glue, the cathode of the second LED chip 37 and the cathode of the third LED chip 38 are connected to the fourteenth soldering pad 32 based on welding wires, the anode of the first LED chip 36 is connected to the fifteenth soldering pad 33 based on welding wires, the anode of the second LED chip 37 is connected to the sixteenth soldering pad 34 based on welding wires, and the anode of the third LED chip 38 is connected to the seventeenth soldering pad 35 based on welding wires.

[0150] In an optional implementation of this embodiment, when the LED device is a common anode structure, Fig.12 As shown, Fig.12A schematic diagram of the common anode structure of the LED device in the sixth embodiment of the present invention is shown, wherein the three LED chips are arranged on the thirteenth pad 31, the anode of the first LED chip 36, the anode of the second LED chip 37, and the anode of the third LED chip 38 are connected to the fifteenth pad 33 based on welding wires, the cathode of the first LED chip 36 is connected to the thirteenth pad 31 supporting the first LED chip 36 based on conductive glue, the cathode of the second LED chip 37 is connected to the seventeenth pad 35 based on welding wires, and the cathode of the third LED chip 38 is connected to the sixteenth pad 34 based on welding wires.

[0151] It should be noted that when Fig.12 After the LED device with a common anode structure is rotated 180°, the position of the pins with the same function on the back side is the same as Fig.11 The positions of the pins with the same functions on the back of the LED device with a common cathode structure correspond one to one, that is, Fig.11 The second pin 92 as the common pole pin is connected to Fig.12 The fourth pin 94 serving as the common pole pin corresponds to the position of the fourth pin 94, and the same is true for the remaining pins.

[0152] In an optional implementation of this embodiment, the thirteenth soldering pad 31 carrying the first LED chip 36 meets the size for soldering three soldering wires, that is, the length is ≥200 μm and the width is ≥80 μm.

[0153] In an optional implementation of the present embodiment, it is necessary to change the positions of the second LED chip 37 and the third LED chip 38. When a common cathode structure is used, the second LED chip 37 is located at the lower half of the thirteenth solder pad 31, and the third LED chip 38 is located at the upper half of the thirteenth solder pad 31. When a common anode structure is used, the second LED chip 37 is located at the upper half of the thirteenth solder pad 31, and the third LED chip 38 is located at the lower half of the thirteenth solder pad 31.

[0154] In summary, embodiment six of the present invention provides an LED device, including the LED packaging substrate in embodiment five, wherein two common pole pads and three non-common pole pads, or one common pole pad and four non-common pole pads are arranged on the front side of the substrate, and pins are arranged on the back side of the substrate, which are connected to the pads on the front side, so that it can be compatible with LED devices with common cathode structure and common anode structure at the same time. When the common cathode structure and common anode structure of the same product are produced at the same time, there is no need to redesign the mold and produce the substrate, which greatly shortens the manufacturing and delivery cycle of the LED device, reduces material costs, and improves the production efficiency of the LED device.

[0155] Embodiment 7

[0156] Embodiment 7 of the present invention provides an LED packaging substrate, which includes a substrate, and six solder pads are arranged on the front side of the substrate, and the six solder pads include two common pole solder pads, three non-common pole solder pads and one bearing solder pad, and the non-common pole solder pads include a first polarity solder pad, a second polarity solder pad and a third polarity solder pad.

[0157] In an optional implementation of this embodiment, Fig.13 As shown, Fig.13 A front schematic diagram of the LED package substrate structure in embodiment seven of the present invention is shown, wherein the LED package substrate comprises a substrate 4, and six solder pads arranged on the front of the substrate 4 comprise an eighteenth solder pad 41, a nineteenth solder pad 42, a twentieth solder pad 43, a twenty-first solder pad 44, a twenty-second solder pad 45, and a twenty-third solder pad 46, wherein the eighteenth solder pad 41 and the nineteenth solder pad 42 are common polarity solder pads, the 20th solder pad 43 is a first polarity solder pad, the twenty-first solder pad 44 is a second polarity solder pad, the twenty-second solder pad 45 is a third polarity solder pad, and the twenty-third solder pad 46 is a bearing solder pad.

[0158] Specifically, the eighteenth solder pad 41 is arranged at the lower left of the substrate 4, the nineteenth solder pad 42 is arranged at the upper left of the substrate 4, the twentieth solder pad 43 is arranged at the lower right of the substrate 4, the twenty-first solder pad 44 and the twenty-second solder pad 45 are arranged at the lower right of the substrate 4, and the twenty-third solder pad 46 is arranged at the top of the substrate 4.

[0159] In an optional implementation of this embodiment, when the plurality of pads include more than two common-pole pads, the more than two common-pole pads are connected to each other based on electrical connection lines.

[0160] Specifically, the eighteenth pad 41 and the nineteenth pad 42 are connected to each other based on an electrical connection line.

[0161] In an optional implementation of this embodiment, Fig.14 As shown, Fig.14 A schematic diagram of the back side of the LED package substrate structure in Embodiment 7 of the present invention is shown, wherein four pins are arranged on the back side of the substrate 4, and the four pins include a first pin 91, a second pin 92, a third pin 93 and a fourth pin 94, wherein the first pin 91 is a first polarity pin, the second pin 92 is a common polarity pin, the third pin 93 is a third polarity pin, and the fourth pin 94 is a second polarity pin.

[0162] In an optional implementation of this embodiment, the eighteenth and nineteenth solder pads 41 and 42 are connected to the second pin 92 , the 20th solder pad 43 is connected to the first pin 91 , the 21st solder pad 44 is connected to the fourth pin 94 , and the 22nd solder pad 45 is connected to the third pin 93 .

[0163] In an optional implementation of the present embodiment, when the LED package substrate of the present embodiment is used in the LED device application scenario mentioned in the subsequent embodiment eight, the eighteenth soldering pad 41 and the twentieth soldering pad 43 carry at most one LED chip, the nineteenth soldering pad 42 is welded with at most two soldering wires, the twenty-first soldering pad 44 and the twenty-second soldering pad 45 are welded with at most one soldering wire, and the twenty-third soldering pad 46 carries at most two LED chips. Therefore, in the present embodiment, the length of the eighteenth soldering pad 41 and the twentieth soldering pad 43 is ≥200μm, and the width is ≥200μm, the length of the nineteenth soldering pad 42 is ≥140μm, and the width is ≥80μm, the length of the twenty-first soldering pad 44 and the twenty-second soldering pad 45 is ≥80μm, and the width is ≥80μm, and the length of the twenty-third soldering pad 46 is ≥350μm, and the width is ≥200μm.

[0164] In an optional implementation of this embodiment, the twentieth bonding pad 43 meets the size required for bonding three bonding wires, that is, the length is ≥200 μm and the width is ≥80 μm.

[0165] In an optional implementation of this embodiment, the spacing between the eighteenth pad 41 and the twentieth pad 43, the nineteenth pad 42 and the twenty-third pad 46, the twenty-first pad 44 and the twenty-third pad 46, the twenty-second pad 45 and the twenty-third pad 46, and the twenty-first pad 44 and the twenty-second pad 45 are all ≥20μm.

[0166] In an optional implementation of this embodiment, four conductive holes 95 are provided on the substrate 4 , and positioning ink 96 is provided on the back side of the substrate 4 .

[0167] In an optional implementation of this embodiment, the second pin 92 is a special-shaped pin.

[0168] Positioning ink and special-shaped pins are set here to distinguish the type of pins and thus the direction of the device.

[0169] In summary, embodiment seven of the present invention provides an LED packaging substrate, with two common pole pads, three non-common pole pads and one bearing pad arranged on the front side of the substrate, and pins arranged on the back side of the substrate, which are connected to the corresponding pads on the front side, so that it can be compatible with both common cathode structure and common anode structure LED devices. When the common cathode structure and common anode structure of the same product are produced at the same time, there is no need to redesign the mold and produce the substrate, which greatly shortens the manufacturing and delivery cycle of LED devices, reduces material costs, and improves the production efficiency of LED devices.

[0170] Embodiment 8

[0171] Embodiment 8 of the present invention provides an LED device, which includes the LED package substrate described in Embodiment 7, and has a structure similar to that of the LED device in Embodiment 2, except that:

[0172] In an optional implementation of this embodiment, when the LED device is a common cathode structure, Fig.15 As shown, Fig.15 A schematic diagram of the common cathode structure of the LED device in the eighth embodiment of the present invention is shown, the first LED chip 47 is arranged on the eighteenth solder pad 41, the second LED chip 48 and the third LED chip 49 are arranged on the twenty-third solder pad 46, the cathode of the first LED chip 47 is connected to the eighteenth solder pad 41 supporting the first LED chip 47 based on conductive glue, the cathode of the second LED chip 48 and the cathode of the third LED chip 49 are connected to the nineteenth solder pad 42 based on welding wires, the anode of the first LED chip 47 is connected to the 20th solder pad 43 based on welding wires, the anode of the second LED chip 48 is connected to the 21st solder pad 44 based on welding wires, and the anode of the third LED chip 49 is connected to the 22nd solder pad 45 based on welding wires.

[0173] It should be noted that, except that the position of the first LED chip 47 is fixed, the positions of the second LED chip 48 and the third LED chip 49 are interchangeable.

[0174] In an optional implementation of this embodiment, when the LED device is a common anode structure, Fig.16 As shown, Fig.16A schematic diagram of the common anode structure of the LED device in the eighth embodiment of the present invention is shown, the first LED chip 47 is arranged on the 20th solder pad 43, the second LED chip 48 and the third LED chip 49 are arranged on the 23rd solder pad 46, the anode of the first LED chip 47 is connected to the 18th solder pad 41 based on the solder wire, the anode of the second LED chip 48 and the anode of the third LED chip 49 are connected to the 19th solder pad 42 based on the solder wire, the cathode of the first LED chip 47 is connected to the 20th solder pad 43 supporting the first LED chip 47 based on the conductive glue, the cathode of the second LED chip 48 is connected to the 21st solder pad 44 based on the solder wire, and the cathode of the third LED chip 49 is connected to the 22nd solder pad 45 based on the solder wire.

[0175] It should be noted that, except that the position of the first LED chip 47 is fixed, the positions of the second LED chip 48 and the third LED chip 49 are interchangeable.

[0176] In an optional implementation of this embodiment, the eighteenth soldering pad 41 and the twentieth soldering pad 43 carrying the first LED chip 47 meet the size for soldering three soldering wires, that is, the length is ≥200 μm and the width is ≥80 μm.

[0177] In an optional implementation of this embodiment, the position of the first LED chip 47 needs to be changed. When a common cathode structure is used, the first LED chip 47 is located at the eighteenth solder pad 41 . When a common anode structure is used, the first LED chip 47 is located at the twentieth solder pad 43 .

[0178] In summary, embodiment eight of the present invention provides an LED device, including the LED packaging substrate in embodiment seven, wherein two common pole pads, three non-common pole pads and one bearing pad are arranged on the front side of the substrate, and pins are arranged on the back side of the substrate, which are connected to the pads on the front side, so that it can be compatible with LED devices of common cathode structure and common anode structure at the same time. When the common cathode structure and common anode structure of the same product are produced at the same time, there is no need to redesign the mold and produce the substrate, which greatly shortens the manufacturing and delivery cycle of the LED device, reduces material costs, and improves the production efficiency of the LED device.

[0179] Embodiment 9

[0180] Embodiment 9 of the present invention provides an LED packaging substrate, which includes a substrate, and seven solder pads are arranged on the front side of the substrate, the seven solder pads include two common pole solder pads and five non-common pole solder pads, and the non-common pole solder pads include a first polarity solder pad, two second polarity solder pads and two third polarity solder pads.

[0181] In an optional implementation of this embodiment, Fig.17 As shown, Fig.17 A front schematic diagram of the LED package substrate structure in Example 9 of the present invention is shown, wherein the seven pads arranged on the front of the substrate 5 include a twenty-fourth pad 51, a twenty-fifth pad 52, a twenty-sixth pad 53, a twenty-seventh pad 54, a twenty-eighth pad 55, a twenty-ninth pad 56, and a thirtieth pad 57, wherein the twenty-fourth pad 51 and the twenty-fifth pad 52 are common polarity pads, the twenty-sixth pad 53 is a first polarity pad, the twenty-seventh pad 54 and the twenty-eighth pad 55 are second polarity pads, and the twenty-ninth pad 56 and the thirtieth pad 57 are third polarity pads.

[0182] Specifically, Fig.17 As shown, the twenty-fourth solder pad 51 is arranged above the substrate 5, the twenty-fifth solder pad 52 is arranged on the lower right side of the twenty-fourth solder pad 51, the twenty-sixth solder pad 53 is arranged on the lower left side of the twenty-fourth solder pad 51, the twenty-seventh solder pad 54 and the twenty-ninth solder pad 56 are arranged on the right side of the twenty-fourth solder pad 51, and the twenty-eighth solder pad 55 and the thirtieth solder pad 57 are arranged on the left side of the twenty-fourth solder pad 51.

[0183] In an optional implementation of the present embodiment, when the plurality of welding pads include more than two common polarity welding pads, the two or more common polarity welding pads are interconnected based on the electrical connection line; when the plurality of welding pads include more than two second polarity welding pads, the two or more second polarity welding pads are interconnected based on the electrical connection line; when the plurality of welding pads include more than two third polarity welding pads, the two or more third polarity welding pads are connected to each other based on the electrical connection line.

[0184] Specifically, the 24th solder pad 51 and the 25th solder pad 52 are connected to each other based on electrical connection lines, the 27th solder pad 54 and the 28th solder pad 55 are connected to each other based on electrical connection lines, and the 29th solder pad 56 and the 30th solder pad 57 are connected to each other based on electrical connection lines.

[0185] In an optional implementation of this embodiment, Fig.18 As shown, Fig.18 A schematic diagram of the back side of the LED package substrate structure in Embodiment 9 of the present invention is shown, wherein four pins are arranged on the back side of the substrate 5, and the four pins include a first pin 91, a second pin 92, a third pin 93 and a fourth pin 94, wherein the first pin 91 is a first polarity pin, the second pin 92 is a common polarity pin, the third pin 93 is a third polarity pin, and the fourth pin 94 is a second polarity pin.

[0186] In an optional implementation of the present embodiment, the twenty-fourth solder pad 51 and the twenty-fifth solder pad 52 are connected to the second pin 92, the twenty-sixth solder pad 53 is connected to the first pin 91, the twenty-seventh solder pad 54 and the twenty-eighth solder pad 55 are connected to the fourth pin 94, and the twenty-ninth solder pad 56 and the thirtieth solder pad 57 are connected to the third pin 93.

[0187] In an optional implementation of the present embodiment, when the LED package substrate of the present embodiment is used in the LED device application scenario mentioned in the subsequent embodiment ten, the twenty-fourth soldering pad 51 carries at most two LED chips, the twenty-fifth soldering pad 52 and the twenty-sixth soldering pad 53 carry at most one LED chip, the twenty-seventh soldering pad 54, the twenty-eighth soldering pad 55, the twenty-ninth soldering pad 56, and the thirtieth soldering pad 57 are each welded with at most one soldering wire, and because the twenty-fourth soldering pad 51 is in the common cathode and common anode structures, the LED chips are respectively arranged on the left and right sides of the soldering pad, so in the present embodiment, the length of the twenty-fourth soldering pad 51 is ≥350μm, and the width is ≥200μm*2, that is, the width is ≥400μm, the length of the twenty-fifth soldering pad 52 and the twenty-sixth soldering pad 53 is ≥200μm, and the width is ≥200μm, and the length of the twenty-seventh soldering pad 54, the twenty-eighth soldering pad 55, the twenty-ninth soldering pad 56, and the thirtieth soldering pad 57 is ≥80μm, and the width is ≥80μm.

[0188] In an optional implementation of this embodiment, the twenty-sixth bonding pad 53 meets the size required for bonding three bonding wires, that is, the length is ≥200 μm and the width is ≥80 μm.

[0189] In an optional implementation of the present embodiment, the spacing between the twenty-fourth pad 51 and the twenty-fifth pad 52, the twenty-sixth pad 53, the twenty-seventh pad 54, the twenty-eighth pad 55, the twenty-ninth pad 56, the thirtieth pad 57, the twenty-fifth pad 52 and the twenty-sixth pad 53, the twenty-seventh pad 54 and the twenty-ninth pad 56, and the twenty-eighth pad 55 and the thirtieth pad 57 are all ≥20μm.

[0190] In an optional implementation of this embodiment, four conductive holes 95 are provided on the substrate 5 , and positioning ink 96 is provided on the back side of the substrate 5 .

[0191] In an optional implementation of this embodiment, the second pin 92 is a special-shaped pin.

[0192] Positioning ink and special-shaped pins are set here to distinguish the type of pins and thus the direction of the device.

[0193] In summary, embodiment nine of the present invention provides an LED packaging substrate, with two common pole pads and five non-common pole pads on the front side of the substrate, and pins on the back side of the substrate, which are connected to the pads on the front side, so that it can be compatible with both common cathode structure and common anode structure LED devices. When the common cathode structure and common anode structure of the same product are produced at the same time, there is no need to redesign the mold and produce the substrate, which greatly shortens the manufacturing and delivery cycle of LED devices, reduces material costs, and improves the production efficiency of LED devices.

[0194] Embodiment 10

[0195] Embodiment 10 of the present invention provides an LED device, which includes the LED package substrate described in Embodiment 9. Its structure is similar to that of the LED device in Embodiment 2, and the differences include the following contents:

[0196] In an optional implementation of this embodiment, when the LED device is a common cathode structure, Fig.19 As shown, Fig.19 A schematic diagram of the common cathode structure of the LED device in the tenth embodiment of the present invention is shown, the first LED chip 58 is arranged on the twenty-fifth soldering pad 52, the second LED chip 59 and the third LED chip 50 are arranged on the right half of the twenty-fourth soldering pad 51, the cathode of the first LED chip 58 is connected to the twenty-fifth soldering pad 52 carrying the first LED chip 58 based on conductive glue, the cathode of the second LED chip 59 and the cathode of the third LED chip 50 are connected to the left half of the twenty-fourth soldering pad 51 carrying the second LED chip 59 and the third LED chip 50 based on welding wires, the anode of the first LED chip 58 is connected to the twenty-sixth soldering pad 53 based on welding wires, the anode of the second LED chip 59 is connected to the twenty-seventh soldering pad 54 based on welding wires, and the anode of the third LED chip 50 is connected to the twenty-ninth soldering pad 56 based on welding wires.

[0197] It should be noted that, except that the position of the first LED chip 58 is fixed, the positions of the second LED chip 59 and the third LED chip 50 are interchangeable.

[0198] In an optional implementation of this embodiment, when the LED device is a common anode structure, Fig. 20 As shown, Fig. 20A schematic diagram of a common anode structure of an LED device in a tenth embodiment of the present invention is shown. When the LED device is a common anode structure, the first LED chip 58 is arranged on the twenty-sixth solder pad 53, the second LED chip 59 and the third LED chip 50 are arranged on the left half of the twenty-fourth solder pad 51, the anode of the first LED chip 58 is connected to the twenty-fifth solder pad 52 based on a welding wire, the anode of the second LED chip 59 and the anode of the third LED chip 50 are connected to the right half of the twenty-fourth solder pad 51 carrying the second LED chip 59 and the third LED chip 50 based on a welding wire, the cathode of the first LED chip 58 is connected to the twenty-sixth solder pad 53 carrying the first LED chip 58 based on a conductive glue, the cathode of the second LED chip 59 is connected to the twenty-eighth solder pad 55 based on a welding wire, and the cathode of the third LED chip 50 is connected to the thirtieth solder pad 57 based on a welding wire.

[0199] It should be noted that, except that the position of the first LED chip 58 is fixed, the positions of the second LED chip 59 and the third LED chip 50 are interchangeable.

[0200] In an optional implementation of this embodiment, the twenty-fifth soldering pad 52 and the twenty-sixth soldering pad 53 carrying the first LED chip 58 meet the size for soldering three soldering wires, that is, the length is ≥200 μm and the width is ≥80 μm.

[0201] In an optional implementation of this embodiment, the position of the first LED chip 58 needs to be changed. When a common cathode structure is used, the first LED chip 58 is located at the twenty-fifth soldering pad 52 . When a common anode structure is used, the first LED chip 58 is located at the twenty-sixth soldering pad 53 .

[0202] In summary, embodiment ten of the present invention provides an LED device, including the LED packaging substrate in embodiment nine, wherein two common pole pads and five non-common pole pads are arranged on the front side of the substrate, and pins are arranged on the back side of the substrate, corresponding to the pads on the front side, and by changing the placement position of the LED chip and the welding wire method, without changing the structure of the LED packaging substrate, including the position and number of pads, electrical connecting wires, conductive holes, and pins, it can be compatible with both common cathode structure and common anode structure LED devices. When producing the common cathode structure and common anode structure of the same product at the same time, there is no need to redesign the mold and produce the substrate, which greatly shortens the manufacturing and delivery cycle of the LED device, reduces material costs, and improves the production efficiency of the LED device.

[0203] Embodiment 11

[0204] Embodiment eleven of the present invention provides an LED packaging substrate, which includes a substrate, and six solder pads are arranged on the front side of the substrate, the six solder pads include two common pole solder pads and three non-common pole solder pads, and the three non-common pole solder pads include a first polarity solder pad, a second polarity solder pad and a third polarity solder pad.

[0205] In an optional implementation of this embodiment, the six pads further include a carrying pad.

[0206] In an optional implementation of this embodiment, Fig.21 As shown, Fig.21 A front schematic diagram of the LED package substrate structure in Example 11 of the present invention is shown, wherein the LED package substrate includes a substrate 6, and five solder pads arranged on the front of the substrate 6 include a thirty-first solder pad 61, a thirty-second solder pad 62, a thirty-third solder pad 63, a thirty-fourth solder pad 64, a thirty-fifth solder pad 65 and a thirty-sixth solder pad 66, wherein the thirty-first solder pad 61 and the thirty-second solder pad 62 are common polarity solder pads, the thirty-third solder pad 63 is a first polarity solder pad, the thirty-fourth solder pad 64 is a second polarity solder pad, the thirty-fifth solder pad 65 is a third polarity solder pad, and the thirty-sixth solder pad 66 is a bearing solder pad.

[0207] Specifically, Fig.21 As shown, the thirty-first solder pad 61 is located at the lower part of the substrate 6, the thirty-second solder pad 62 is located at the upper left of the substrate 6, the thirty-third solder pad 63 is located below the substrate 6, the thirty-fourth solder pad 64 and the thirty-fifth solder pad 65 are located at the upper right of the substrate 6, and the thirty-sixth solder pad 66 is located above the substrate 6.

[0208] In an optional implementation of this embodiment, when the plurality of pads include more than two common-pole pads, the more than two common-pole pads are connected to each other based on electrical connection lines.

[0209] Specifically, the thirty-first pad 61 and the thirty-second pad 62 are connected to each other based on an electrical connection line.

[0210] In an optional implementation of this embodiment, Fig. 22 As shown, Fig. 22 A schematic diagram of the back side of the LED package substrate structure in the eleventh embodiment of the present invention is shown, and four pins are arranged on the back side of the substrate 6, and the four pins include a first pin 91, a second pin 92, a third pin 93 and a fourth pin 94, wherein the first pin 91 is a first polarity pin, the second pin 92 is a common polarity pin, the third pin 93 is a third polarity pin, and the fourth pin 94 is a second polarity pin.

[0211] In an optional implementation of the present embodiment, the thirty-first solder pad 61 and the thirty-second solder pad 62 are connected to the second pin 92 , the thirty-third solder pad 63 is connected to the first pin 91 , the thirty-fourth solder pad 64 is connected to the fourth pin 94 , and the thirty-fifth solder pad 65 is connected to the third pin 93 .

[0212] In an optional implementation of the present embodiment, when the LED package substrate of the present embodiment is used in the LED device application scenario mentioned in the subsequent embodiment 12, the thirty-first soldering pad 61 and the thirty-third soldering pad 63 carry at most one LED chip, the thirty-second soldering pad 62 welds at most two soldering wires, the thirty-fourth soldering pad 64 and the thirty-fifth soldering pad 65 welds at most one soldering wire, and the thirty-sixth soldering pad 66 carries at most two LED chips. Therefore, in the present embodiment, the length of the thirty-first soldering pad 61 and the thirty-third soldering pad 63 is ≥200μm, and the width is ≥200μm, the length of the thirty-second soldering pad 62 is ≥140μm, and the width is ≥80μm, the length of the thirty-fourth soldering pad 64 and the thirty-fifth soldering pad 65 is ≥80μm, and the width is ≥80μm, and the length of the thirty-sixth soldering pad 66 is ≥350μm, and the width is ≥200μm.

[0213] In an optional implementation of this embodiment, the thirty-third bonding pad 63 meets the size required for bonding three bonding wires, that is, the length is ≥200 μm and the width is ≥80 μm.

[0214] In an optional implementation of the present embodiment, the spacing between the thirty-first solder pad 61 and the thirty-sixth solder pad 66, the thirty-second solder pad 62 and the thirty-sixth solder pad 66, the thirty-fourth solder pad 64 and the thirty-sixth solder pad 66, the thirty-fifth solder pad 65 and the thirty-sixth solder pad 66, the thirty-fourth solder pad 64 and the thirty-fifth solder pad 65, and the thirty-first solder pad 61 and the thirty-third solder pad 63 are all ≥20μm.

[0215] In an optional implementation of this embodiment, four conductive holes 95 are provided on the substrate 6 , and positioning ink 96 is provided on the back side of the substrate 6 .

[0216] In an optional implementation of this embodiment, the second pin 92 is a special-shaped pin.

[0217] Positioning ink and special-shaped pins are set here to distinguish the type of pins and thus the direction of the device.

[0218] In summary, embodiment eleven of the present invention provides an LED packaging substrate, with two common pole pads, three non-common pole pads and one bearing pad arranged on the front side of the substrate, and pins arranged on the back side of the substrate, which are connected to the corresponding pads on the front side, so that it can be compatible with both common cathode structure and common anode structure LED devices. When the common cathode structure and common anode structure of the same product are produced at the same time, there is no need to redesign the mold and produce the substrate, which greatly shortens the manufacturing and delivery cycle of LED devices, reduces material costs, and improves the production efficiency of LED devices.

[0219] Embodiment 12

[0220] The twelfth embodiment of the present invention provides an LED device, which includes the LED package substrate described in the eleventh embodiment, and has a structure similar to that of the LED device in the second embodiment, except that:

[0221] In an optional implementation of this embodiment, when the LED device is a common cathode structure, such as Fig.23 As shown, Fig.23 A schematic diagram of a common cathode structure of an LED device in a twelfth embodiment of the present invention is shown. When the LED device is a common cathode structure, the first LED chip 67 is arranged on the thirty-first solder pad 61, the second LED chip 68 and the third LED chip 69 are arranged on the thirty-sixth solder pad 66, the cathode of the first LED chip 67 is connected to the thirty-first solder pad 61 carrying the first LED chip 67 based on a conductive glue, the cathode of the second LED chip 68 and the cathode of the third LED chip 69 are connected to the thirty-second solder pad 62 based on a welding wire, the anode of the first LED chip 67 is connected to the thirty-third solder pad 63 based on a welding wire, the anode of the second LED chip 68 is connected to the thirty-fourth solder pad 64 based on a welding wire, and the anode of the third LED chip 69 is connected to the thirty-fifth solder pad 65 based on a welding wire.

[0222] It should be noted that, except that the position of the first LED chip 67 is fixed, the positions of the second LED chip 68 and the third LED chip 69 are interchangeable.

[0223] In an optional implementation of this embodiment, when the LED device is a common anode structure, Fig.24 As shown, Fig.24A schematic diagram of the common anode structure of the LED device in the twelfth embodiment of the present invention is shown. When the LED device is a common anode structure, the first LED chip 67 is arranged on the thirty-third solder pad 63, the second LED chip 68 and the third LED chip 69 are arranged on the thirty-sixth solder pad 66, the anode of the first LED chip 67 is connected to the thirty-first solder pad 61 based on the welding wire, the anode of the second LED chip 68 and the anode of the third LED chip 69 are connected to the thirty-second solder pad 62 based on the welding wire, the cathode of the first LED chip 67 is connected to the thirty-third solder pad 63 supporting the first LED chip 67 based on the conductive glue, the cathode of the second LED chip 68 is connected to the thirty-fourth solder pad 64 based on the welding wire, and the cathode of the third LED chip 69 is connected to the thirty-fifth solder pad 65 based on the welding wire.

[0224] It should be noted that, except that the position of the first LED chip 67 is fixed, the positions of the second LED chip 68 and the third LED chip 69 are interchangeable.

[0225] In an optional implementation of the present embodiment, the thirty-first soldering pad 61 and the thirty-third soldering pad 63 carrying the first LED chip 67 meet the dimensions for soldering three soldering wires, that is, the length is ≥200 μm and the width is ≥80 μm.

[0226] In an optional implementation of this embodiment, the position of the first LED chip 67 needs to be changed. When a common cathode structure is used, the first LED chip 67 is located at the thirty-first solder pad 61 . When a common anode structure is used, the first LED chip 67 is located at the thirty-third solder pad 63 .

[0227] In summary, the twelfth embodiment of the present invention provides an LED device, including the LED packaging substrate in the eleventh embodiment, wherein two common pole pads, three non-common pole pads and one bearing pad are arranged on the front side of the substrate, and pins are arranged on the back side of the substrate, which are connected to the corresponding pads on the front side. By changing the placement position of the LED chip and the welding wire method, without changing the structure of the LED packaging substrate, including the pads, electrical connecting wires, conductive holes, and the position and number of pins, it can be compatible with both common cathode structure and common anode structure LED devices. When the common cathode structure and common anode structure of the same product are produced at the same time, there is no need to redesign the mold and produce the substrate, which greatly shortens the manufacturing and delivery cycle of the LED device, reduces material costs, and improves the production efficiency of the LED device.

[0228] As described above, the common cathode structure and common anode structure of the LED device do not need to change the structure of the LED package substrate, including the position and number of solder pads, electrical connection lines, conductive holes, and pins. By placing the LED chips in different positions and soldering wires, the common cathode structure and common anode structure of the same LED device can be compatible. In actual applications, it can be applied to both the common cathode structure and the common anode structure of the same LED device.

[0229] A person of ordinary skill in the art can understand that all or part of the steps in the various methods of the above embodiments can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable storage medium, and the storage medium may include: a read-only memory (ROM), a random access memory (RAM), a disk or an optical disk, etc.

[0230] In addition, the embodiments of the present invention are described in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. An LED packaging substrate, characterized in that: The LED package substrate comprises a substrate, a front surface of the substrate is provided with a plurality of pads, the plurality of pads comprises at least one common pole pad and at least three non-common pole pads, the non-common pole pads comprises at least one first polarity pad, at least one second polarity pad and at least one third polarity pad; A plurality of pins are arranged on the back of the substrate, the plurality of pins include common polarity pins and non-common polarity pins, and the non-common polarity pins include first polarity pins, second polarity pins and third polarity pins; The common polarity pad is connected to the common polarity pin, the first polarity pad is connected to the first polarity pin, the second polarity pad is connected to the second polarity pin, and the third polarity pad is connected to the third polarity pin.

2. The LED package substrate according to claim 1, characterized in that: The plurality of pads further include a carrying pad.

3. The LED package substrate according to claim 1, characterized in that: When the plurality of pads include more than two common-pole pads, the two or more common-pole pads are connected to each other based on an electrical connection line; When the plurality of pads include more than two first polarity pads, the more than two first polarity pads are connected to each other based on an electrical connection line; When the plurality of pads include more than two second polarity pads, the more than two second polarity pads are connected to each other based on an electrical connection line; When the plurality of pads include more than two third polarity pads, the more than two third polarity pads are connected to each other based on an electrical connection line.

4. The LED package substrate according to claim 1, characterized in that: The substrate is provided with a plurality of conductive holes, the conductive holes penetrate the substrate, and the plurality of pads are correspondingly connected to the plurality of pins based on the conductive holes and the electrical connection lines.

5. The LED package substrate according to claim 1, characterized in that: When the pad is used to carry an LED chip, the pad has a length of ≥200 μm and a width of ≥200 μm; When the solder pad is used to carry two LED chips, the length of the solder pad is ≥350 μm and the width is ≥200 μm; When the pad is used to carry three LED chips, the pad has a length of ≥500 μm and a width of ≥200 μm; When the pad is used to weld a wire, the pad has a length of ≥80 μm and a width of ≥80 μm; When the pad is used to weld two wires, the pad has a length of ≥140 μm and a width of ≥80 μm; When the pad is used to weld three wires, the pad has a length of ≥200 μm and a width of ≥80 μm.

6. The LED package substrate according to claim 5, characterized in that: At least one non-common-pole pad satisfies a size for bonding three bonding wires.

7. The LED package substrate according to claim 1, characterized in that: The distance between any two adjacent pads is ≥20μm.

8. The LED package substrate according to claim 1, characterized in that: Positioning ink is arranged on the back side of the substrate.

9. The LED package substrate according to claim 1, characterized in that: The plurality of pins include special-shaped pins.

10. An LED device, characterized in that: The LED device includes the LED packaging substrate according to any one of claims 1 to 9, three LED chips and a plurality of welding wires, the three LED chips include a first LED chip, a second LED chip and a third LED chip, the LED chip is a positive-mounted LED chip, the LED chip is arranged on the welding pad, and the electrode of the LED chip is connected to the welding pad based on the welding wire.

11. The LED device according to claim 10, characterized in that The first LED chip is a red LED chip, the second LED chip is a green LED chip, and the third LED chip is a blue LED chip; Or the first LED chip is a red LED chip, the second LED chip is a blue LED chip, and the third LED chip is a green LED chip.

12. The LED device according to claim 11, characterized in that The first LED chip is fixed on the pad based on conductive glue, and the second LED chip and the third LED chip are fixed on the pad based on insulating glue.

13. The LED device according to claim 10, characterized in that The first LED chip is a vertical structure chip.

14. The LED device according to claim 13, characterized in that The pad carrying the first LED chip has a size sufficient for welding three wires.

15. The LED device according to claim 10, characterized in that When the LED device is a common cathode structure, the cathode of the first LED chip, the cathode of the second LED chip, and the cathode of the third LED chip are connected to the common polarity pad, the anode of the first LED chip is connected to the first polarity pad, the anode of the second LED chip is connected to the second polarity pad, and the anode of the third LED chip is connected to the third polarity pad; When the LED device is a common anode structure, the anode of the first LED chip, the anode of the second LED chip, and the anode of the third LED chip are connected to the common polarity pad, the cathode of the first LED chip is connected to the first polarity pad, the cathode of the second LED chip is connected to the second polarity pad, and the cathode of the third LED chip is connected to the third polarity pad.

16. The LED device according to claim 10, characterized in that When the LED device implements a common cathode structure and a common anode structure respectively, it is necessary to change the position or direction of more than one LED chip.

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