Display panel, manufacturing method thereof and display device

Abstract

The invention provides a display panel and a manufacturing method thereof and a display device.The display panel comprises a substrate, a driving circuit layer, a passivation layer, an organic insulating layer and an anode layer, the driving circuit layer, the passivation layer, the organic insulating layer and the anode layer are arranged on the substrate, and the anode layer comprises a reflection anode layer and a transparent anode layer; wherein the reflection anode layer is arranged between the passivation layer and the organic insulation layer; and the transparent anode layer is arranged on one side, far away from the substrate, of the organic insulating layer. According to the invention, on the premise that the reflection anode is kept for shading, the reflection anode layer is arranged between the passivation layer and the organic insulation layer, so that gas generated by heating of the organic insulation layer can be prevented from diffusing downwards, UV illumination of subsequent packaging can be shielded, and the yield is improved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of semiconductor technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] The reflective anode covering the non-display area in the 48-inch organic electroluminescence display (OLED) transparent product can be used to block the ultraviolet (UV) light used in subsequent packaging, but it also blocks the hydrogen ion gas generated by the organic insulating layer under the reflective anode when heated, causing the hydrogen ion gas to diffuse downward, causing the thin film transistor below to generate a large current and burn, thereby causing the adverse effect of large-area burns in the non-display area. Summary of the invention

[0003] The embodiments of the present invention provide a display panel and a manufacturing method thereof, and a display device to solve the problem that the existing display panel is prone to large-area burns.

[0004] In order to solve the above-mentioned technical problems, the present invention is achieved as follows:

[0005] In a first aspect, an embodiment of the present invention provides a display panel, including:

[0006] A base substrate, a driving circuit layer, a passivation layer, an organic insulating layer and an anode layer arranged on the base substrate, wherein the anode layer includes: a reflective anode layer and a transparent anode layer;

[0007] Wherein, the reflective anode layer is arranged between the passivation layer and the organic insulating layer;

[0008] The transparent anode layer is arranged on a side of the organic insulating layer away from the base substrate.

[0009] Optionally, the display panel includes a non-display area and a display area;

[0010] The reflective anode layer includes: a first reflective anode pattern located in the non-display area and a second reflective anode pattern located in the display area, the second reflective anode pattern is connected to the driving circuit layer through the through hole of the passivation layer in the display area, and the second reflective anode pattern is connected to the transparent anode layer through the through hole of the organic insulating layer in the display area.

[0011] Optionally, the non-display area includes an electrostatic discharge (ESD) area, and the first reflective anode pattern is disposed in the ESD area.

[0012] Optionally, an opening is provided on the transparent anode layer located in the non-display area.

[0013] Optionally, the openings on the transparent anode layer are in a grid shape.

[0014] Optionally, the driving circuit layer includes:

[0015] An active layer, a gate, a source electrode and a drain electrode, wherein the orthographic projection of the active layer on the substrate is located within the orthographic projection area of ​​the reflective anode layer on the substrate.

[0016] Optionally, the anode layer includes a layer of transparent anode layer.

[0017] In a second aspect, an embodiment of the present invention provides a display device, comprising a display panel as described in any one of the first aspects.

[0018] In a third aspect, an embodiment of the present invention provides a method for manufacturing a display panel, comprising:

[0019] providing a substrate base plate;

[0020] A driving circuit layer, a passivation layer, an organic insulating layer and an anode layer are formed on the base substrate, wherein the anode layer includes: a reflective anode layer and a transparent anode layer;

[0021] Wherein, the reflective anode layer is formed between the passivation layer and the organic insulating layer;

[0022] The transparent anode layer is formed on a side of the organic insulating layer away from the base substrate.

[0023] Optionally, the display panel includes a non-display area and a display area;

[0024] The reflective anode layer includes: a first reflective anode pattern located in the non-display area and a second reflective anode pattern located in the display area, the second reflective anode pattern is connected to the driving circuit layer through the through hole of the passivation layer in the display area, and the second reflective anode pattern is connected to the transparent anode layer through the through hole of the organic insulating layer in the display area.

[0025] Optionally, the transparent anode layer located in the non-display area is in a grid shape.

[0026] In the present invention, the display panel includes: a base substrate, a driving circuit layer, a passivation layer, an organic insulating layer and an anode layer arranged on the base substrate, wherein the anode layer includes: a reflective anode layer and a transparent anode layer; wherein the reflective anode layer is arranged between the passivation layer and the organic insulating layer; and the transparent anode layer is arranged on the side of the organic insulating layer away from the base substrate. By arranging the reflective anode layer between the passivation layer and the organic insulating layer while retaining the reflective anode for light shielding, the gas generated by the organic insulating layer due to heat can be blocked from diffusing downward, and the UV light of the subsequent packaging can be blocked, thereby improving the yield rate and solving the problem that the existing display panel is prone to large-area burns. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0028] Figure 1 is a schematic structural diagram of a display panel provided by an embodiment of the present invention;

[0029] Figure 2 is a schematic structural diagram of another display panel provided by an embodiment of the present invention;

[0030] Figure 3 is a schematic diagram of a regional distribution structure of a display panel provided by an embodiment of the present invention;

[0031] Figure 4 is a schematic structural diagram of a non-display area of ​​a display panel provided by an embodiment of the present invention;

[0032] Figure 5 is a flow chart of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0033] Figure 6 It is a structural schematic diagram of an active layer manufacturing method of a display panel provided by an embodiment of the present invention;

[0034] Figure 7 It is a structural schematic diagram of a gate manufacturing method of a display panel provided by an embodiment of the present invention;

[0035] Figure 8 It is a schematic structural diagram of a source and drain manufacturing method of a display panel provided by an embodiment of the present invention;

[0036] Fig. 9 It is a schematic structural diagram of a passivation layer manufacturing method of a display panel provided by an embodiment of the present invention;

[0037] Fig.10 It is a structural schematic diagram of manufacturing an anode layer of a display panel provided by an embodiment of the present invention;

[0038] Fig.11 It is a structural schematic diagram of a patterned manufacturing method of a passivation layer of a display panel provided by an embodiment of the present invention;

[0039] Fig.12 It is a schematic structural diagram of a patterned organic insulating layer of a display panel provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] Please refer to Figure 1 , an embodiment of the present invention provides a display panel, comprising:

[0042] A base substrate 1, a driving circuit layer 2, a passivation layer 3, an organic insulating layer 4 and an anode layer 5 arranged on the base substrate 1, wherein the anode layer 5 includes: a reflective anode layer 51 and a transparent anode layer 52;

[0043] Wherein, the reflective anode layer 51 is disposed between the passivation layer 3 and the organic insulating layer 4;

[0044] The transparent anode layer 52 is disposed on a side of the organic insulating layer 4 away from the base substrate 1 .

[0045] In the embodiment of the present invention, the base substrate 1 is the basic part of the display panel, and the base substrate 1 provides support and foundation for other parts of the display panel.

[0046] In an embodiment of the present invention, the display panel may further include a buffer layer, which is stacked on the base substrate 1 in a direction away from the base substrate 1. The purpose of the buffer layer is to reduce crystal defects between the base substrate 1 and the active layer and improve the performance of the device. The buffer layer is used to reduce charge migration and electric field effects in the transistor. In the transistor manufacturing process, it is used to reduce the instability caused by lattice mismatch between materials, and also helps to reduce leakage current in the transistor.

[0047] Please refer to Figure 2 In the embodiment of the present invention, optionally, the driving circuit layer 2 includes:

[0048] The active layer 21 , the gate 22 , the source 23 and the drain 24 , the orthographic projection of the active layer 21 on the base substrate 1 is located within the orthographic projection region of the reflective anode layer 51 on the base substrate 1 .

[0049] In an embodiment of the present invention, the material of the active layer 21 may be indium gallium zinc oxide IGZO (Indium Gallium Zinc Oxide). The electron mobility of IGZO is higher than that of traditional amorphous silicon, which enables it to operate at a higher frequency, thereby improving the response speed and refresh rate of the display; IGZO can support higher pixel density and is suitable for ultra-high-definition displays and high-resolution screens.

[0050] The orthographic projection of the gate 22 on the substrate 1 is located between the orthographic projection of the source 23 on the substrate 1 and the orthographic projection of the drain 24 on the substrate 1. The gate 22, the source 23 and the drain 24 are the main components of the transistor. The gate 22 (Gate) is the control terminal of the transistor, and the conductivity of the channel region can be adjusted by controlling the gate voltage. The source 23 is the input terminal of the transistor, responsible for providing electrons or charges. The drain 24 is the output terminal of the transistor, responsible for receiving electrons or charges.

[0051] The passivation layer 3 covers the driving circuit layer 2. The passivation layer 3 can effectively isolate air and moisture, prevent the driving circuit layer 2 from being oxidized, and extend the service life of the device; the passivation layer 3 can reduce defects and unevenness on the surface of the material, improve electrical properties, reduce leakage current, and improve device efficiency; the passivation layer 3 can improve the interface characteristics between the semiconductor and the insulating material, reduce the interface state density, and improve the overall performance of the device.

[0052] The organic insulating layer 4 can be made of resin. The resin has good electrical insulation properties, can prevent current leakage, protect circuit components, reduce the risk of short circuit and failure, and can still maintain its performance at high temperatures, and can protect the stability of electronic components under high temperature working conditions. However, in related schemes, the organic insulating layer 4 will generate gas (outgas) after being heated and diffuse downward to the active layer 21, thereby causing the IGZO negative drift of the active layer 21 to generate a large current and burn. In the embodiment of the present invention, the reflective anode layer 51 in the anode layer 5 is arranged between the passivation layer 3 and the organic insulating layer 4, which can prevent the gas outgas generated by the organic insulating layer when heated from diffusing downward, and can also block the UV light of subsequent packaging, thereby improving the yield rate and solving the problem that the existing display panel is prone to large-area burns.

[0053] The anode layer 5 includes: a reflective anode layer 51 and a transparent anode layer 52; wherein the reflective anode layer 51 is made of metal copper or molybdenum niobium or the like; the reflective anode layer 51 is arranged between the passivation layer 3 and the organic insulating layer 4, so as to prevent the outgas generated by the organic insulating layer when heated from diffusing downward, and to shield the UV light of the subsequent packaging, thereby improving the yield rate, solving the problem that the existing display panel is prone to large-area burns, and extending the service life of the device.

[0054] The transparent anode layer 52 is disposed on the side of the organic insulating layer 4 away from the base substrate 1. In the embodiment of the present invention, the anode layer includes a transparent anode layer. The transparent anode layer 52 is TOP ITO, which can allow light to pass through and provide current conduction.

[0055] In an embodiment of the present invention, optionally, the display panel includes a non-display area and a display area;

[0056] The reflective anode layer includes: a first reflective anode pattern located in the non-display area and a second reflective anode pattern located in the display area, the second reflective anode pattern is connected to the driving circuit layer through a through hole of the passivation layer on the display area, and the second reflective anode pattern is connected to the transparent anode layer through a through hole of the organic insulating layer in the display area.

[0057] In the embodiment of the present invention, please refer to Figure 3 , the display panel includes a non-display area 01 and a display area 02; the non-display area 01 includes an electrostatic discharge ESD area, and the display area 02 includes a pixel area;

[0058] Please refer to Figure 4 , is a schematic diagram of the film layer structure of the non-display area 01 , the first reflective anode pattern 511 is arranged in the ESD area, the first reflective anode pattern is arranged between the passivation layer 3 and the organic insulating layer 4 , and is not connected to the driving circuit layer 2 and the transparent anode layer 52 .

[0059] Please refer to Figure 2 , is a schematic diagram of the film layer structure of the display area 02, the second reflective anode pattern 512 is located in the display area, the second reflective anode pattern is connected to the driving circuit layer through the through hole of the passivation layer on the display area, and the second reflective anode pattern is connected to the transparent anode layer through the through hole of the organic insulating layer in the display area. Before the organic insulating layer 4 is formed, the holes in the passivation layer 3 are no longer opened after the holes in the organic insulating layer 4 are opened, thereby avoiding the OL deviation caused by the trepanning process.

[0060] In the embodiment of the present invention, optionally, an opening is provided on the transparent anode layer 52 located in the non-display area 01;

[0061] The openings may be configured in various shapes. In some embodiments, the openings on the transparent anode layer 52 are in a grid shape. The openings on the transparent anode layer 52 are in a grid shape.

[0062] In the embodiment of the present invention, please refer to Figure 4 The transparent anode layer 52 located in the non-display area 01 is in a grid shape, providing a release channel for the gas generated by the organic insulating layer 4 to prevent large-area burns in the non-display area.

[0063] In an embodiment of the present invention, the display panel includes: a base substrate, a driving circuit layer, a passivation layer, an organic insulating layer and an anode layer arranged on the base substrate, wherein the anode layer includes: a reflective anode layer and a transparent anode layer; wherein the reflective anode layer is arranged between the passivation layer and the organic insulating layer; and the transparent anode layer is arranged on the side of the organic insulating layer away from the base substrate. By arranging the reflective anode layer between the passivation layer and the organic insulating layer while retaining the reflective anode for light shielding, the gas generated by the organic insulating layer due to heat can be blocked from diffusing downward, and the UV light of the subsequent packaging can be blocked, thereby improving the yield rate and solving the problem that the existing display panel is prone to large-area burns.

[0064] An embodiment of the present invention further provides a display device, including the display panel provided by the above embodiment, and also has the above technical effects.

[0065] Please refer to Figure 5 , an embodiment of the present invention provides a method for manufacturing a display panel, comprising:

[0066] Step S51: providing a substrate 1;

[0067] In an embodiment of the present invention, a base substrate 1 is provided as a starting point for the production of a display panel. As a supporting platform for subsequent layers, the base substrate 1 provides support and foundation for other parts of the display panel. The display panel may also include a buffer layer, which is stacked on the base substrate 1 in a direction away from the base substrate 1. The purpose of the buffer layer is to reduce crystal defects between the base substrate 1 and the active layer and improve the performance of the device. The buffer layer is used to reduce charge migration and electric field effects in transistors. In the process of transistor manufacturing, it is used to reduce the instability caused by lattice mismatch between materials, and also helps to reduce leakage current in transistors.

[0068] Step S52: forming a driving circuit layer 2, a passivation layer 3, an organic insulating layer 4 and an anode layer 5 on the base substrate, wherein the anode layer 5 includes: a reflective anode layer 51 and a transparent anode layer 52; wherein the reflective anode layer 51 is formed between the passivation layer 3 and the organic insulating layer 4; and the transparent anode layer 52 is formed on a side of the organic insulating layer 4 away from the base substrate 1.

[0069] In the embodiment of the present invention, optionally, the driving circuit layer 2 includes:

[0070] The active layer 21 , the gate 22 , the source 23 and the drain 24 , the orthographic projection of the active layer 21 on the base substrate 1 is located within the orthographic projection region of the reflective anode layer 51 on the base substrate 1 .

[0071] Please refer to Figure 6-Figure 8 , an active layer 21, a gate 22, a source 23 and a drain 24 are fabricated layer by layer; the material of the active layer 21 may be indium gallium zinc oxide IGZO (Indium Gallium Zinc Oxide), and the electron mobility of IGZO is higher than that of conventional amorphous silicon, which enables it to operate at a higher frequency, thereby improving the response speed and refresh rate of the display; IGZO can support a higher pixel density and is suitable for ultra-high-definition displays and high-resolution screens;

[0072] The orthographic projection of the gate 22 on the substrate 1 is located between the orthographic projection of the source 23 on the substrate 1 and the orthographic projection of the drain 24 on the substrate 1. The gate 22, the source 23 and the drain 24 are the main components of the transistor. The gate 22 (Gate) is the control terminal of the transistor, and the conductivity of the channel region can be adjusted by controlling the gate voltage. The source 23 is the input terminal of the transistor, responsible for providing electrons or charges. The drain 24 is the output terminal of the transistor, responsible for receiving electrons or charges.

[0073] Please refer to Fig. 9 The passivation layer 3 covers the driving circuit layer 2. The passivation layer 3 can effectively isolate air and moisture, prevent the driving circuit layer 2 from being oxidized, and extend the service life of the device; the passivation layer 3 can reduce defects and unevenness on the surface of the material, improve electrical properties, reduce leakage current, and improve device efficiency; the passivation layer 3 can improve the interface characteristics between the semiconductor and the insulating material, reduce the interface state density, and improve the overall performance of the device.

[0074] Please refer to Fig.10 The organic insulating layer 4 can be made of resin. The resin has good electrical insulation properties, can prevent current leakage, protect circuit components, reduce the risk of short circuit and failure, and can still maintain its performance at high temperatures, and can protect the stability of electronic components under high temperature working conditions. However, in the related scheme, the gas (outgas) generated by the organic insulating layer 4 after being heated will diffuse downward to the active layer 21, thereby causing the IGZO negative drift of the active layer 21 to generate a large current and burn. In the embodiment of the present invention, the reflective anode layer 51 in the anode layer 5 is arranged between the passivation layer 3 and the organic insulating layer 4, which can prevent the gas outgas generated by the organic insulating layer when heated from diffusing downward, and can also block the UV light of the subsequent packaging, thereby improving the yield rate and solving the problem that the existing display panel is prone to large-area burns.

[0075] Please refer to Fig.10 The anode layer 5 includes: a reflective anode layer 51 and a transparent anode layer 52; wherein the reflective anode layer 51 is made of metal copper or molybdenum niobium or the like; the reflective anode layer 51 is arranged between the passivation layer 3 and the organic insulating layer 4, so as to prevent the outgas generated by the organic insulating layer when heated from diffusing downward, and to block the UV light of the subsequent packaging, thereby improving the yield rate, solving the problem that the existing display panel is prone to large-area burns, and extending the service life of the device.

[0076] The transparent anode layer 52 is disposed on the side of the organic insulating layer 4 away from the base substrate 1. In the embodiment of the present invention, the anode layer includes a transparent anode layer. The transparent anode layer 52 is TOP ITO, which can allow light to pass through and provide current conduction.

[0077] In an embodiment of the present invention, the display panel includes: a base substrate, a driving circuit layer, a passivation layer, an organic insulating layer and an anode layer arranged on the base substrate, wherein the anode layer includes: a reflective anode layer and a transparent anode layer; wherein the reflective anode layer is arranged between the passivation layer and the organic insulating layer; and the transparent anode layer is arranged on the side of the organic insulating layer away from the base substrate. By arranging the reflective anode layer between the passivation layer and the organic insulating layer while retaining the reflective anode for light shielding, the gas generated by the organic insulating layer due to heat can be blocked from diffusing downward, and the UV light of the subsequent packaging can be blocked, thereby improving the yield rate and solving the problem that the existing display panel is prone to large-area burns.

[0078] In an embodiment of the present invention, optionally, the display panel includes a non-display area and a display area;

[0079] The reflective anode layer includes: a first reflective anode pattern located in the non-display area and a second reflective anode pattern located in the display area, the second reflective anode pattern is connected to the driving circuit layer through a through hole of the passivation layer on the display area, and the second reflective anode pattern is connected to the transparent anode layer through a through hole of the organic insulating layer in the display area.

[0080] In the embodiment of the present invention, please refer to Figure 3 , the display panel includes a non-display area 01 and a display area 02; the non-display area 01 includes an electrostatic discharge ESD area, and the display area 02 includes a pixel area;

[0081] Please refer to Figure 4 , is a non-display area 01, the first reflective anode pattern is arranged in the ESD area, the first reflective anode pattern is arranged between the passivation layer 3 and the organic insulating layer 4, and is not connected to the driving circuit layer 2 and the transparent anode layer 52;

[0082] Please refer to Figure 1 , for display area 02, please refer to Fig.11, the anode layer 5 includes: a reflective anode layer 51 and a transparent anode layer 52; wherein the reflective anode layer 51 is made of metal copper or molybdenum niobium; the reflective anode layer 51 is arranged between the passivation layer 3 and the organic insulating layer 4, and the passivation layer 3 is patterned before forming the anode layer 5, so that the second reflective anode pattern 512 is connected to the driving circuit layer through the through hole of the passivation layer on the display area; the second reflective anode pattern 512 is connected to the transparent anode layer through the through hole of the organic insulating layer in the display area, please refer to Fig.12 , and the organic insulating layer 4 is patterned. Since the passivation layer 3 is transformed into the organic insulating layer 4, the holes in the passivation layer 3 are no longer opened after the holes in the organic insulating layer 4 are opened, thus avoiding the OL deviation caused by the hole-treating process.

[0083] In the embodiment of the present invention, optionally, an opening is provided on the transparent anode layer 52 located in the non-display area 01;

[0084] The openings may be configured in various shapes. In some embodiments, the openings on the transparent anode layer 52 are in a grid shape.

[0085] Please refer to Figure 4 In the embodiment of the present invention, the transparent anode layer 52 located in the non-display area 01 is in a grid shape, providing a release channel for the gas generated by the organic insulating layer 4 to prevent large-area burns in the non-display area.

[0086] Unless otherwise specified, spatial descriptions such as "above", "below", "upward", "left", "right", "downward", "top", "bottom", "vertical", "horizontal", "side", "above", "below", "upper", "above", "below" are indicated relative to the orientation shown in the drawings. It should be understood that the spatial descriptions used herein are for illustrative purposes only, and actual implementations of the structures described herein may be spatially arranged in any orientation or manner, with the limitation that the advantages of the embodiments of the present disclosure are not deviated by such arrangements.

[0087] As used herein, the term "vertical" is used to refer to an upward and downward direction, while the term "horizontal" refers to a direction transverse to the vertical direction.

[0088] As used herein, the terms "approximately," "substantially," "substantially," and "about" are used to describe and explain small variations. When used in conjunction with an event or circumstance, the terms may refer to instances where the event or circumstance occurred precisely as well as instances where the event or circumstance occurred very approximately. For example, when used in conjunction with a numerical value, the terms may refer to a range of variation of less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if a first numerical value is within a range of variation of less than or equal to ±10% of a second numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%, then the first numerical value may be considered to be "substantially" the same as or equal to the second numerical value. For example, "substantially" vertical may refer to an angular variation range of less than or equal to ±10° relative to 90°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.

[0089] Two surfaces are considered coplanar or substantially coplanar if the displacement between them is no more than 5 μm, no more than 2 μm, no more than 1 μm, or no more than 0.5 μm. A surface is considered substantially flat if the displacement between the highest point and the lowest point of the surface is no more than 5 μm, no more than 2 μm, no more than 1 μm, or no more than 0.5 μm.

[0090] As used herein, the singular terms "a," "an," and "the" may include plural referents unless the context clearly dictates otherwise.

[0091] As used herein, the terms "conductive," "electrically conductive," and "conductivity" refer to the ability to carry an electric current. Conductive materials generally refer to those materials that present little or no resistance to the flow of electric current. One measure of conductivity is Siemens per meter (S / m). Typically, a conductive material is a material with a conductivity greater than about 104 S / m (such as at least 105 S / m or at least 106 S / m). The conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the conductivity of a material is measured at room temperature.

[0092] In addition, amounts, ratios and other numerical values ​​are sometimes presented herein in a range format. It should be understood that such a range format is used for convenience and brevity, and should be flexibly interpreted to include not only the values ​​explicitly specified as the limits of the range, but also all individual values ​​or sub-ranges encompassed within that range, as if each value and sub-range were explicitly specified.

[0093] Although the present disclosure has been described and illustrated with reference to specific embodiments of the present disclosure, these descriptions and illustrations are not restrictive. It should be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the true spirit and scope of the present disclosure as defined by the appended claims. The illustrations may not necessarily be drawn to scale. Due to manufacturing processes and tolerances, there may be differences between the process reproduction in the present disclosure and the actual equipment. There may be other embodiments of the present disclosure that are not specifically described. This specification and drawings should be regarded as illustrative rather than restrictive. Modifications may be made to make specific situations, materials, material compositions, methods or processes suitable for the goals, spirit and scope of the present disclosure. All such modifications are intended to be within the scope of the appended claims. Although the methods disclosed herein have been described with reference to specific operations performed in a specific order, it should be understood that these operations may be combined, subdivided or reordered to form equivalent methods without departing from the teachings of the present disclosure. Accordingly, unless specifically indicated herein, the order and grouping of operations are not limitations of the present disclosure.

Claims

1. A display panel, characterized in that: include: A base substrate, a driving circuit layer, a passivation layer, an organic insulating layer and an anode layer arranged on the base substrate, wherein the anode layer includes: a reflective anode layer and a transparent anode layer; Wherein, the reflective anode layer is arranged between the passivation layer and the organic insulating layer; The transparent anode layer is arranged on a side of the organic insulating layer away from the base substrate.

2. The display panel according to claim 1, characterized in that: The display panel includes a non-display area and a display area; The reflective anode layer includes: a first reflective anode pattern located in the non-display area and a second reflective anode pattern located in the display area, the second reflective anode pattern is connected to the driving circuit layer through the through hole of the passivation layer in the display area, and the second reflective anode pattern is connected to the transparent anode layer through the through hole of the organic insulating layer in the display area.

3. The display panel according to claim 2, characterized in that: The non-display area includes an electrostatic discharge (ESD) area, and the first reflective anode pattern is disposed in the ESD area.

4. The display panel according to claim 2, characterized in that: The transparent anode layer located in the non-display area is provided with an opening.

5. The display panel according to claim 4, characterized in that: The openings on the transparent anode layer are in a grid shape.

6. The display panel according to claim 1, characterized in that: The driving circuit layer comprises: An active layer, a gate, a source electrode and a drain electrode, wherein the orthographic projection of the active layer on the substrate is located within the orthographic projection area of ​​the reflective anode layer on the substrate.

7. The display panel according to claim 1, characterized in that: The anode layer includes a transparent anode layer.

8. A display device, characterized in that: Comprising the display panel as described in any one of claims 1-7.

9. A method for manufacturing a display panel, characterized in that: include: providing a substrate base plate; Forming a driving circuit layer, a passivation layer, an organic insulating layer and an anode layer on the base substrate, wherein the anode layer includes: a reflective anode layer and a transparent anode layer; Wherein, the reflective anode layer is formed between the passivation layer and the organic insulating layer; The transparent anode layer is formed on a side of the organic insulating layer away from the base substrate.

10. The method for manufacturing a display panel according to claim 9, characterized in that: The display panel includes a non-display area and a display area; The reflective anode layer includes: a first reflective anode pattern located in the non-display area and a second reflective anode pattern located in the display area, the second reflective anode pattern is connected to the driving circuit layer through the through hole of the passivation layer in the display area, and the second reflective anode pattern is connected to the transparent anode layer through the through hole of the organic insulating layer in the display area.

11. The method for manufacturing a display panel according to claim 10, characterized in that: The transparent anode layer located in the non-display area is in a grid shape.

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