Semiconductor chilling plate welding structure and method

By pre-installing the copper pads in the soldering structure of the semiconductor refrigeration sheet and filling and assembled solder, it ensures that the ends of the thermoelectric semiconductor particles are completely covered with the tin filling groove, which solves the problem of solder overflow contact reaction, and improves the reliability of the refrigeration sheet and the solder control effect.

CN119654046APending Publication Date: 2025-03-18HANGZHOU DAHE THERMO MAGNETICS CO LTD
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Patent Information

Application Number
CN202411736153.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-29
Publication Date
2025-03-18

AI Technical Summary

Technical Problem

During the assembly of semiconductor refrigeration sheets, solder is prone to overflow from the side and contact with bismuth telluride material, resulting in reaction and performance attenuation, and the thickness and movement position of the solder are difficult to control.

Method used

A semiconductor refrigeration sheet soldering structure is adopted, which includes two substrates and a plurality of thermoelectric semiconductor particles arranged between the two substrates. The substrate is pre-installed with copper pads and filled with assembled solder in its tin-filled tank. The ends of the thermoelectric semiconductor particles completely cover the tin-filled tank to avoid solder overflow.

Benefits of technology

The contact reaction between solder and bismuth telluride material is effectively avoided, the reliability of the semiconductor refrigeration sheet is enhanced, and the amount of solder is well controlled to prevent the solder from flowing outward from the edge of the end face of the thermoelectric semiconductor particles.

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Abstract

The invention discloses a semiconductor chilling plate welding structure and method, and aims to overcome the defect that the performance of thermoelectric semiconductor particles is degraded due to the fact that soldering tin for assembling a semiconductor chilling plate is likely to overflow from the side edge and make contact with a bismuth telluride material. The thermoelectric module comprises two substrates and a plurality of thermoelectric semiconductor particles arranged between the two substrates, a plurality of copper bonding pads in one-to-one correspondence with the thermoelectric semiconductor particles are preassembled on the opposite surfaces of the two substrates, sunken tin filling grooves are formed in the copper bonding pads, the tin filling grooves are filled with assembling soldering tin, the tin filling grooves are completely covered by the end portions of the thermoelectric semiconductor particles, and the thermoelectric semiconductor particles are arranged on the two substrates. And the assembly soldering tin is welded with the end parts of the thermoelectric semiconductor particles. In the assembling process of the semiconductor chilling plate, soldering tin is not prone to overflowing from the side edge and making contact with the bismuth telluride material, contact reaction is avoided, the reliability of the semiconductor chilling plate is enhanced, and the amount of the soldering tin is well controlled.
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