Techniques for heat dissipation of circuit

Abstract

The present invention relates to a technique for heat dissipation of a circuit. According to one aspect, an apparatus (100) includes a cooling body (110) and at least one heat transfer module (120). The heat sink (110) includes a heat sink base (114) and a plurality of fins (112) extending from the heat sink base for dissipating heat. Each heat transfer module (120) is or can be connected to the heat sink (110) in a mechanical and thermally conductive manner at the first end (122) by means of a press fit (130) and / or a metallic material fit at a joining point of the heat sink (110). Each heat transfer module (120) has a contact surface (144) on a second end (124) of the heat transfer module (120), said second end being spaced apart from the first end (122), said contact surface being designed to contact at least one heat dissipation point (142) of the electrical circuit in order to receive heat from the electrical circuit.

Description

Technical Field

[0001] The present invention relates to heat dissipation of circuits, such as electronic circuits, and more particularly, but not limited to, a device for heat dissipation, a kit of one or more such devices, an assembly of a plurality of different devices, and a method of manufacturing the device. Background Art

[0002] Circuits contain heat sources that must be dissipated at heat dissipation locations by heat sinks in order to ensure long-term and reliable function of the circuit. The heat must usually be dissipated indirectly to a cooling body via a thermal path with thermal contacts, since the most powerful heat sources, such as power transistors and processors, are spatially distributed on the circuit. The thermal path must therefore be adapted to the respective circuit.

[0003] In order to achieve this flexibility, conventional thermal paths include so-called "heat spreaders" which have the function of conducting heat between the heat dissipation points of the circuit and the cooling body. In particular, the "heat spreader" also serves as a spacer (technical term: spacer) between the circuit board of the circuit and the cooling body of the structure height for other components of the circuit.

[0004] However, conventional "heat spreaders" have disadvantages in terms of the thermodynamic and mechanical connection to the cooling body. Therefore, the "heat spreader" is usually connected to the cooling body via a housing or by a screw connection. This thermal contact point weakens the heat conduction. The use of plastic and heat-conducting materials at the contact point, which are professionally called "Thermal Interface Material" (TIM), also cannot increase the thermal conductivity to the level of a homogeneous (i.e., one-piece) casting. Summary of the invention

[0005] The object of the present invention is therefore to provide a technology for cooling circuits which allows the same heat sink to be used for different circuits and thereby achieves the same or comparable heat transfer efficiency as in a heat sink adapted to the respective circuit.

[0006] This object is achieved by the features of the respective independent claim. Advantageous embodiments and advantageous developments of the invention are given in the dependent claims.

[0007] The following discloses, in part with reference to the accompanying drawings, embodiments of the invention which are optionally combinable with each other. In particular, the features mentioned in the context of the device may also be implemented in the method accordingly, for example by steps providing the corresponding features or by steps implementing the functions of the device. Furthermore, the device may include each of the features mentioned in the context of the method and may be configured to perform each of the steps described in the context of the method.

[0008] The first aspect relates to a device for dissipating heat from a circuit. The device includes a cooling body. The cooling body has a cooling body base and a plurality of heat sinks extending from the cooling body base, and the heat sinks are used to dissipate heat. The device also includes at least one heat transfer module. The at least one heat transfer module is mechanically and heat-conductively connected or connectable to the cooling body at a joint of the cooling body by means of a press fit and / or a metal material fit at a first end of the heat transfer module. In addition, at least one heat transfer module has a contact surface at a second end of the heat transfer module spaced apart from the first end, and the contact surface is configured to contact at least one heat dissipation location of the circuit so as to receive heat from the circuit.

[0009] Starting from a (for example common) cooling body, the technology realizes a device for heat dissipation matched to the circuit. Embodiments of the device can receive heat from the circuit at the second end via at least one heat transfer module matched to at least one heat dissipation location of the circuit. In this case, at least one heat transfer module and / or the cooling body, in particular its cooling body base, can also be used for heat distribution (heat dispersion).

[0010] The circuit may include (e.g., electronic) components that are electrically connected to each other. These components may be arranged in one or more modules or on one or more circuit carriers. The components may include linear components (e.g., resistors, capacitors, or inductors) and nonlinear components (e.g., transistors), including electromechanical components (e.g., relays or solenoid valves).

[0011] In each embodiment, the press fit and / or the material fit of the metal enable a thermal (i.e., heat-conducting) and mechanical connection to the cooling body. Here, due to the material fit of the metal, the heat-conducting connection can be integral or effective after the press fit as when the cooling body and the heat transfer module are integral. That is, the device is identical to a device manufactured from one piece in terms of heat transfer. Likewise, the manufacture of simple variants is modular. For example, by press fit and / or the material fit of the metal, the surface in contact with the cooling body on the first end can have a thermal resistance that is substantially equivalent to a single component of an integral one-piece structure.

[0012] The press-fit profile at the first end of the heat transport module (also referred to as the first press-fit profile) may include a protruding face and a transverse face. The protruding face may be a convex face and / or a longitudinal face and / or extend on an extension of a line segment from the second end to the first end (i.e., in the longitudinal direction of the heat transport module).

[0013] Transverse faces may be faces that are beside and / or between the protruding faces, and / or extend transversely (eg, perpendicularly) to the longitudinal direction.

[0014] The heat sink can have a press fit contour complementary to the first contour (also referred to as a second press fit contour) at the joining point, for example, at least in sections, coordinated with each other and / or shaped correspondingly for the press fit. For example, the second contour can have a protruding surface and a transverse surface, which is complementary to the protruding surface or the transverse surface of the first contour.

[0015] By means of the press fit, heat can be transferred to the heat sink not only via the protruding surfaces but also via the transverse surfaces. Alternatively or additionally, the protruding surfaces and / or transverse surfaces as boundary surfaces between the heat transfer module and the heat sink can be eliminated by means of a metallic material fit. In various embodiments, the basic effect as a heat transfer resistance between the contact surfaces can be minimized, which is achieved by means of a metallic material fit (for example, as indicated by the press fit) or by means of a press fit at least substantially equal to a material fit.

[0016] The heat received at the contact surface and / or the heat dissipated at the heat sink (more precisely: heat quantity) may be a portion (eg, a small portion) of the heat (ie, heat quantity) generated by the circuit.

[0017] The heat sinks may comprise (eg thin-walled) sheets or (at least some of them) may be configured as such.

[0018] The heat transfer module can be a heat distributor. This can be referred to as a "heat spreader", "heat spreader module", "module heat spreader" or "module heat spreader-spacer combination" in professional terms. At least one heat dissipation location can include at least one thermal center of the circuit (professional term: "hotspot").

[0019] The at least one heat sink of the circuit may include a heat sink of an electronic component (e.g. a power transistor, an integrated circuit or a processor). Alternatively or additionally, the at least one heat sink of the circuit may include a heat collection location on a circuit carrier (e.g. a printed circuit board). The heat collection location can dissipate heat from a plurality of components of the circuit (e.g. via copper surfaces or printed conductors of the circuit).

[0020] The press fit may be a press fit (including pressing or crimping). Alternatively or additionally, the press fit may be an interference fit, for example, in which the outer (concave) press fit profile is temporarily widened by thermal expansion. Alternatively or additionally, the press fit may be joined by re-pressing, for example by re-pressing a metallic filler material, which preferably corresponds to the material of the heat transfer module and / or the cooling body.

[0021] The material fit of the metals can be a material fit between metals (eg the first metal of the heat transfer module and the first metal or second metal of the heat sink) or alloys. Alternatively or additionally, the material fit of the metals can be provided without additional material at the joint.

[0022] The second end may also be referred to as the hot end, and the first end may be referred to as the cold end or cool end, respectively. Alternatively or additionally, the first end may be referred to as the free end or the joined end.

[0023] In each exemplary embodiment, the connection point (for example one of the at least one heat transport module) can be arranged on the heat sink base or on one of the heat sinks.

[0024] Arranging at least one joining point on the heat sink base allows a compact combination of the circuit and the device, for example by arranging components of the circuit between heat sinks (for example resting against adjacent heat sinks or being arranged separately in the intermediate space).

[0025] Alternatively or additionally, arranging at least one connection point on one of the heat sinks can reduce the length of the heat path between the contact surface and the connection point through the heat transfer module (for example in comparison with a connection point on the heat sink base). This is advantageous, for example, when a heat dissipation point of the circuit (for example a heat source) is directly adjacent to the heat sink. Alternatively or additionally, it is advantageous that the heat sink can dissipate heat to the surrounding environment using the connection point without having to bypass it via the heat sink base.

[0026] Alternatively or additionally, for example, arranging at least one connection point on the outer side of one of the outer heat sinks of the heat sink can also thermally connect the component (or components) of the circuit to the heat sink, even when the component is arranged next to the heat sink, that is, not covered by the cooling surface or the heat sink base. As a result, the circuit (for example, the circuit carrier of the circuit) can be larger than the surface of the heat sink (for example, as heat sink base).

[0027] By modularly combining the cooling body with at least one heat transfer module, the same cooling body can be adapted to different circuits. In this case, a press fit and / or a material fit of metals can achieve a mechanical and thermal connection between the heat transfer module and the cooling body that is identical or similar to a monolithic device (e.g., compared to a device produced from an original monolithic base body by an initial shaping or deformation process). This state can be achieved by joining (i.e., a press fit and / or a material fit of metals).

[0028] The joining (i.e. press fit and / or material fit of metal) of at least one heat transfer module to the heat sink enables a simple, cost-effective, separately positionable and robust thermal connection of the contacted heat dissipation points (e.g. function of a thermal bridge) and / or creates structural space for components between the heat sink base and the circuit carrier (e.g. function of a spacer) without significantly impairing the efficiency of the heat conduction compared to a heat sink that is individually matched and milled out of a single piece.

[0029] This same or other embodiments of the device enable the assembly of structural elements on the circuit carrier between the circuit carrier and the cooling body base (also known as "heat sink base" in professional terms) and / or even thermal contact outside the cooling body base. The latter enables efficient circuit design of the circuit, such as efficient layout of the circuit carrier (e.g. circuit board). The first-mentioned embodiment allows the assembly of structural elements (also known as components) under the cooling body (also known as "heat sink" in professional terms), which can be built higher than the heat dissipation location (also known as "heat spot" or "hot spot" in professional terms) to be connected by the heat transfer module. That is, the cooling body or its cooling base covers the structural elements oriented toward the cooling body.

[0030] Thus, at least one of the connection locations can advantageously be used for a mounting position below the cooling body on the cooling body base and / or (particularly advantageously in the second embodiment mentioned in the preceding paragraph) be configured on the heat sink, for example for a lateral or frontal contact direction. Thus, embodiments enable a heat dissipation location of the circuit laterally outside the cooling body to be thermally connected to the cooling body.

[0031] Many geometrical variants are possible for the press-fit profile. An exemplary principle of joining is a press fit (especially an interference fit) and / or a re-pressing of the material during or after joining.

[0032] Due to the press fit and / or the metallic material fit, no thermal interface material (technical term “Thermal Interface Material”, TIM for short) is required in the thermal contact path, which results in lower material costs for the arrangement and saves application costs.

[0033] Press-fitting or material fitting of metals can reduce thermal resistance in the heat path.

[0034] Due to the effective heat dissipation, the device can contribute to a longer service life (eg, functional duration) of the components of the circuit.

[0035] Embodiments of the device can eliminate sources of error during assembly, such as loose thermal contacts, by means of a mechanically robust connection, such as a connection whose mechanical load limit is determined by the heat transfer module itself and not by a joint.

[0036] Since the device can be assembled as a subassembly, separate joining elements are eliminated, thereby simplifying assembly, saving material and reducing application costs (e.g. TIM only on the contact surface of the second end). Additional retaining elements for positioning loose spacers (dividers) and loose heat distributors (heat spreaders) in the housing can be eliminated, thereby reducing the space requirement in the housing.

[0037] Embodiments of the device can be mechanically strong, simple and individually positionable due to the press fit or material fit of the metal.

[0038] Assembly is less prone to errors. The joining contours (that is to say the joining geometry and the press fit contour) can be produced in the course of a preliminary initial shaping and / or a separate manufacturing method and are therefore not cost-intensive to a certain extent. In addition, these elements (for example, in contrast to a screw connection) are held on the cooling body in a captive manner.

[0039] A press fit (ie, a force fit) can be used as a joining technique in order to mechanically and thermally efficiently connect the functional combination of heat spreader and spacer to the cooling body to form an assembly with compact dimensions, in particular without requiring further additives / media for the connection.

[0040] Furthermore, the device may include a housing in which the circuit is arranged. The heat sink of the cooling body may be exposed outside the housing. Alternatively or additionally, at least one heat transfer module may be arranged at least partially or completely within the housing.

[0041] The cooling body may form an outer wall of the housing. Alternatively or in addition, the heat transfer module may transfer the heat of the circuit from an area of ​​the housing of the circuit that is inaccessible to the cooling or circulating air to the cooling body. For example, at least one of the heat transfer modules may not include a heat sink (e.g. a sheet) and / or may be optimized for heat transfer from the heat source to the cooling body, whereby it may further transfer heat quickly and may preferably be designed without a heat sink. Alternatively or in addition, the heat transfer module may be an active or passive thermal bridge.

[0042] The press fit can have a metallic material connection (at least in sections, in particular partially or in spots). The material connection can be brought about by cold welding, flow pressing and / or friction in the press fit.

[0043] The press fit between the heat transfer module and the cooling body can be joined by a transverse translational movement (transverse movement). For example, the transverse surface can flow or melt on the surface by shearing forces and / or transverse movement during the press fit. Alternatively or in addition, the press fit between the heat transfer module and the cooling body can be joined by a longitudinal translational movement (longitudinal movement). For example, the longitudinal surface can flow or melt on the surface by shearing forces and / or longitudinal movement during the press fit. In both cases, the material fit of the metal between the heat transfer module and the cooling body can be established at least in sections at the first end.

[0044] The material combination of the metals may be a welded connection between the metal of the heat transmission module and the metal of the cooling body. The metal of the heat transmission module and the metal of the cooling body may be the same. Alternatively or in addition, the material combination of the metals may be an alloy of the metal of the heat transmission module and the metal of the cooling body. For example, the material combination of the metals does not include a third component that is different from the metal of the heat transmission module and the metal of the cooling body. Advantageously, the joining can be carried out without using any auxiliary materials and / or without inputting additional energy (e.g. arc welding).

[0045] The material connection of metals can include an arc welding connection.The material connection of metals (ie an arc welding connection) can be produced by electrode welding (ie arc welding).

[0046] The heat transfer module can be welded at the first end to a (eg likewise flat) joining point in a form-fitting and / or flat manner by arc welding.

[0047] Alternatively or additionally, during the extrusion, a current for heating can be applied between the cooling body and the heat transfer module, so that the first end of the heat transfer module flows into the recess of the cooling body (for example, as a bottom die at the joint) by die forging or flow pressing. Residual air inclusions can be removed in conventional press fits by heating (for example, by melting) and / or by die forging or flow pressing.

[0048] The press fit may be provided with a metal material fit by means of induction heating of the first end. For example, before, during, or after the press fit, an inductor (e.g., a water-cooled induction coil) may be placed around the heat transfer module (e.g., in the longitudinal direction) for induction heating of the first end of the heat transfer module.

[0049] By means of this energy input—or by means of the fluid pressure alone—macroscopic or microscopic air inclusions between the heat transport module and the cooling body can be melted away. The heat conducting connection between the heat transport module and the cooling body can be gap-free and homogeneous.

[0050] The joining part may include two adjacent heat sinks. The press fit may include a friction fit and / or a material fit of metals between the heat transfer module and at least one of the heat sinks of the cooling body (or between two adjacent heat sinks). For example, the press fit may be achieved by an interference fit of the heat transfer module at the first end compared to the spacing between adjacent heat sinks. The heat transfer module may be squeezed between two adjacent heat sinks. The squeezing (pressing) may be implemented longitudinally or transversely.

[0051] Alternatively or additionally, the contour of the heat sink increases the surface of the cooling body compared to a flat surface for heat exchange with the surrounding environment. The contour of the heat sink can also be a press fit contour (also called second press fit contour) as a (potential) joining point for press fit.

[0052] Alternatively or in addition, the heat sink may be a press-fit profile (i.e. a second press-fit profile complementary to the first profile). In the absence of a heat transport module being press-fitted to (i.e. joined to) the cooling body, the press-fit profile may increase the surface area of ​​the cooling body for heat exchange with the surroundings (i.e. acting as a heat sink for the cooling body). In the case where the heat transport module is connected (i.e. joined) to the cooling body by a press fit, the press-fit profile may allow a press fit with the heat transport module.

[0053] At least one heat transfer module can have a first contour of a press fit at each first end. The cooling body can have a second contour complementary to the first contour (e.g., locally) at each joint. For example, the cooling body can have one or more further joints with a second contour, so that variants can be formed during production.

[0054] One or more additional joints may not be joined. That is, the cooling body can (for example, during the production before the press fit) have redundant joints. The cooling body can have a plurality of joints with a second contour during the manufacture of the device, so that one of the at least one heat transfer module is connected to one of the plurality of joints in a manner matching the circuit (for example, the geometry, position and / or number of at least one heat dissipation location of the circuit).

[0055] The first contour and the second contour can engage with each other or flow into each other without gap in the press fit. By means of a gapless or low-gap connection, for example, compared to a conventional thermal connection using a TIM, an increase in heat transfer efficiency can be achieved.

[0056] Press-fit connection partners can mesh with one another over the entire surface and without play or flow into one another (for example for a material fit of metals).

[0057] For example, the shapes of the first profile and the second profile are designed to correspond to each other so that the first profile is received in the second profile at least in sections after joining. The second profile, in particular the recessed portion in the cooling body, has the advantage of not encroaching on the area for arrangement. Optionally, the volume of the first profile (e.g., material volume) is consistent with the volume of the second profile (e.g., cavity volume) or slightly larger than the volume of the second profile, so as to prevent the formation of bubbles at the connection between the cooling body and the heat transfer module by plastic deformation (e.g., flow pressure) during press fitting. Thermal resistance can thereby be reduced.

[0058] The second end may be opposite to the first end of at least one of the at least one heat transport module. Alternatively or additionally, at least one of the at least one heat transport module extends from the second end along the longitudinal direction to the first end and / or is arranged transversely to (preferably perpendicular to) the first end. Between the first end and the second end, another contact surface may be arranged laterally in the longitudinal direction (e.g. parallel to the longitudinal direction). Alternatively or additionally, at least one of the heat transport modules may have a plurality of contact surfaces for receiving heat.

[0059] For example, the first contact surface can be arranged on the second end opposite the first end in the longitudinal direction and / or transversely, especially perpendicularly to the longitudinal direction. Alternatively or additionally, the second contact surface can be laterally (ie, transversely) deviated from the longitudinal direction and / or parallel to the longitudinal direction.

[0060] The cooling body can be constructed independently of the circuit. Alternatively or additionally, at least one heat transfer module can be connected to the cooling body and / or shaped according to the topography of at least one heat dissipation point of the circuit.

[0061] The (e.g. general) cooling body can be matched to the topography of at least one heat dissipation location of the circuit via at least one heat transfer module (e.g. in a modular construction). Thus, despite the thermally conductive connection, the cooling body can still be spaced apart from the circuit to avoid collisions. Alternatively or additionally, the at least one heat transfer module can contact distributed and / or differently oriented heat dissipation locations to receive heat from the circuit via the shape and / or length (e.g. in the longitudinal direction) of the at least one heat transfer module (e.g. at the second end).

[0062] The device may include a plurality of heat transfer modules. The heat transfer modules may extend from the cooling body with different lengths between the first end and the second end (e.g., parallel to each other). The different lengths may correspond to the topography of the heat dissipation location of the circuit (e.g., the structural height of the components of the circuit on the circuit carrier). The different lengths may complement the topography of at least one heat dissipation location of the circuit. Alternatively or additionally, the different lengths may correspond to the spacing from the cooling body base to the corresponding heat dissipation surface.

[0063] Due to the shape and / or length of the heat-transmitting module, distributed and / or differently oriented heat-dissipating locations for receiving the heat of the circuit can be contacted or can be contacted.

[0064] The cooling body may include aluminum or copper or an alloy (eg including aluminum and copper). Alternatively or in addition, at least one of the heat transport modules may include copper or aluminum or an alloy (eg including aluminum and copper).

[0065] Due to the high thermal conductivity of copper, heat conduction paths of different lengths to the heat sink can be thermally compensated. Due to the low density of aluminum, the overall weight of the arrangement can be low.

[0066] Between the circuit carrier (e.g. a printed circuit board) and the heat sink base of the heat sink and / or next to the at least one heat transfer module, a component can be arranged on the circuit carrier (e.g. on the printed circuit board), which component is designed higher in the direction of the heat sink than the heat dissipation point contacted by the heat transfer module. The component thermally connected by the heat transfer module can, for example, be smaller than the component arranged (i.e. mounted) on the circuit carrier between the heat sink base and the circuit carrier and / or next to the at least one heat transfer module.

[0067] In each embodiment, the circuit carrier (eg a printed circuit board) is preferably oriented parallel to the heat sink base when or after the heat sink is arranged thereon.

[0068] The cooling body and / or at least one of the heat transport modules can be filled with a fluid. For example, at least one of the heat transport modules can include a heat pipe pointing from the second end to the first end parallel to the heat flow or the longitudinal direction of the heat transport module. For example, the boiling point of the working medium sealed in the heat pipe can match the temperature at the first end of the heat transport module and the condensation point of the working medium can match the temperature at the second end of the heat transport module.

[0069] The heat pipe can further reduce the total thermal resistance of the composite composed of the heat transfer module and the cooling body. For example, the total thermal resistance can be lower than the total thermal resistance of a monolithic one-piece component having a corresponding combination of the heat transfer module and the cooling body.

[0070] The working medium may be a coolant. Alternatively or additionally, in order to minimize the thermal resistance, the substance of the working medium and / or the pressure of the working medium may be selected such that the boiling temperature of the working medium at the second end is only slightly higher than the boiling temperature of the working medium and / or the boiling temperature of the working medium at the first end is only slightly lower than the boiling temperature of the working medium.

[0071] As an exemplary embodiment of a heat pipe, the heat transport module can have a hole at a first end along the longitudinal direction, which hole is filled with the working medium and is closed in a gas-tight manner by a press fit.

[0072] A second aspect of the technology relates to a system, which includes a circuit (e.g., a circuit carrier having the circuit) and a device for dissipating heat from the circuit according to the first aspect. The contact surface (or multiple contact surfaces) of at least one heat transmission module can contact at least one heat dissipation part of the circuit to receive heat from the circuit.

[0073] In various aspects, the circuit carrier with the circuit can be a so-called “System on a Module (SOM-Board)”.

[0074] The system may include any of the features mentioned in the apparatus aspect. For example, at least one heat transport module may match the topography of at least one heat dissipation location of the circuit.

[0075] A third aspect of the technology relates to an assembly of a device for removing heat from an electrical circuit according to the first aspect, wherein the devices of the assembly have an identical cooling body and differ in that at least one heat transfer module is mechanically and thermally connected to the cooling body at different joining locations of the cooling body and / or at least one heat transfer module has a different length between the first end and the second end.

[0076] Advantageously, the same cooling body can be used for different circuits.

[0077] The fourth aspect of the technology relates to a kit of a device for dissipating heat from a circuit according to the first aspect or a kit of components according to the third aspect. The kit includes one or more identical cooling bodies, the one or more identical cooling bodies having a cooling body base and a plurality of heat sinks extending from the cooling body base for dissipating heat. In addition, the kit includes a plurality of heat transfer modules, which can be mechanically and thermally connected to the cooling body at the first end of the heat transfer module by means of extrusion fit and / or metal material fit at the joint part of the cooling body, and the heat transfer modules have a contact surface at the second end of the heat transfer module spaced apart from the first end, the contact surface is configured to contact at least one heat dissipation part of the circuit for receiving heat from the circuit, wherein the plurality of heat transfer modules have different lengths between the first end and the second end.

[0078] Advantageously, the kit enables modular construction of the device that matches the circuit.

[0079] A fifth aspect of the technology relates to a method for manufacturing a device for dissipating heat from a circuit, wherein the method comprises the steps of providing a cooling body having a cooling body base and a plurality of heat dissipating fins extending from the cooling body base for dissipating heat.

[0080] Furthermore, the method comprises the step of press-fitting and / or materially joining at least one heat transfer module with a first end of the heat transfer module to a joining point of the heat sink in order to connect mechanically and thermally to the heat sink.

[0081] The method further comprises the step of contacting at least one heat transmission module with a contact surface arranged on a second end of the heat transmission module spaced apart from the first end, on at least one heat dissipation location of the circuit to receive heat from the circuit.

[0082] The step of press-fitting means establishing a press fit. Alternatively or in addition, the material-fitting joining of the metals means producing a material fit of the metals. The material-fitting joining of the metals is preferably achieved by cold welding without additional introduction of process heat.

[0083] The heat sink can have a plurality of joining locations. The joining (ie, press-fitting and / or metallic material-bonding joining) can include selecting a joining location from a plurality of joining locations depending on the circuit (eg, topography).

[0084] The method can also include the step of shortening (optionally milling) at least one heat transfer module at the second end, depending on the circuit. The shortening is performed, for example, after joining, that is, after press joining and / or after material-fitting joining of metals.

[0085] For example, the plurality of heat transport modules (after joining the plurality of heat transport modules to the cooling body) can be shortened in a process (for example a milling process) in accordance with the circuit (for example the topography).

[0086] The advantage of shortening is the exact adaptation of the dimensions compared to the pre-matching, which allows a higher dimensional accuracy. Due to the mechanical connection of the heat transfer module via the cooling body, which already exists during the process, the heat transfer module can be shortened exactly to the heat dissipation point (eg topography) of the circuit.

[0087] Providing the cooling body may comprise extrusion (eg extrusion molding) of the cooling body, for example, comprising a cooling body base and cooling fins and / or comprising one or more joining locations (ie second contours).

[0088] The method may also include providing (e.g., extruding, preferably extrusion molding) at least one heat transfer module, for example including a first contour for extrusion fit on a first end and / or including a contact surface on a second end, wherein the contact surface is configured to contact a heat dissipation portion of the circuit for receiving heat from the circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0089] The present invention will be described in detail below with reference to the accompanying drawings based on preferred embodiments, which may be optionally combined with each other.

[0090] FIG1 shows a schematic cross-sectional view of a conventional cooling body according to a reference example;

[0091] Figure 2 A schematic cross-sectional view of a device for dissipating heat from an electrical circuit according to a first embodiment is shown;

[0092] Figure 3 A schematic side view of a device for dissipating heat from a circuit according to a second embodiment, viewed in a direction parallel to a heat sink, is shown;

[0093] Figure 4 A schematic cross-sectional view of a device for dissipating heat from a circuit according to a second embodiment, viewed from a direction perpendicular to a heat sink;

[0094] Figure 5 A schematic side view of a device for dissipating heat from a circuit according to a third embodiment, viewed from a direction parallel to a heat sink;

[0095] Figure 6 shows a schematic cross-sectional view of a first example of a press fit that may be used for each embodiment;

[0096] Figure 7 shows a schematic cross-sectional view of a third example of a press fit that may be used for each embodiment;

[0097] Figure 8 shows a schematic perspective view of a device for dissipating heat from an electrical circuit according to a fourth embodiment;

[0098] Fig. 9 A schematic flow chart showing a method of manufacturing one embodiment of the device; and

[0099] Fig.10 AC shows a schematic diagram of a fifth example of an extrusion fit, which can be applied to each embodiment, showing the different stages of extrusion joining through an embodiment of the manufacturing process of the present invention, and the embodiment of the manufacturing process is also applicable to other embodiments of the manufacturing process of the present invention. DETAILED DESCRIPTION

[0100] Features shown or described in different embodiments with the same reference numerals may be interchanged in this case.

[0101] 1 shows a reference example. The distance between the circuit board 13 and the base 12 is determined by thermally connecting the component 14 to the base 12 of the cooling body 11. This prevents another component 14 with a greater structural height from being placed below the cooling body on the circuit board 13.

[0102] Figure 2 A schematic cross-sectional view of a first embodiment of an apparatus, generally designated 100 , for dissipating heat from electrical (eg, electronic) circuits is shown.

[0103] The device 100 includes a cooling body 110 having a cooling body base 114 and a plurality of cooling fins 112 extending from the cooling body base for dissipating heat.

[0104] The device 100 further comprises at least one heat transfer module 120. Each heat transfer module 120 is mechanically and thermally connected to the cooling body 110 at a first end 122 of the heat transfer module 120 by means of a press fit 130 and / or a metallic material fit at a joining portion of the cooling body 110. Each heat transfer module 120 has a contact surface 144 at a second end 124 of the heat transfer module 120 spaced apart from the first end 122, the contact surface being configured to contact at least one heat dissipation portion 142 of the circuit to receive heat from the circuit.

[0105] By means of the press fit 130 and / or the metallic material connection, the heat flow in direction 126 can flow just as efficiently as if the heat transfer module 120 and the heat sink 110 were integrally formed in one piece (for example a metal casting or milled out of a workpiece).

[0106] In contrast to the direct thermal connection shown in FIG. 1 , the exemplary embodiment of the device 100 implements a combined function as a heat spreader and separator, i.e., as a thermal distance bridge if the heat dissipation location 142 of the circuit is flatter than other structural elements on the circuit carrier 140 (e.g., circuit board 140) of the circuit beneath the cooling body.

[0107] Between printed circuit board 140 and heat sink base 114 of heat sink 110 and / or next to at least one heat transfer module 120 , a component 146 is arranged on printed circuit board 140 , which is designed higher in direction 126 toward heat sink 110 than heat dissipation point 142 or heat dissipation point 142 respectively contacted by heat transfer module 120 .

[0108] The modularity of the device 100, that is, the use of the cooling element 110 for different circuits with different heat dissipation locations 142, is based on the freedom of choice when joining the cooling element 110 to the heat transfer module 120 or a plurality of heat transfer modules 120 (e.g., regarding the joining location and shape of at least one heat transfer module). This modularity is achieved without separate joining elements (such as screw connections and / or spring connections), which usually require additional assembly steps and increase the thermal resistance, because at the molecular level the screwed or spring-loaded contact surfaces are only partially in contact for heat conduction.

[0109] Figure 3 A schematic side view (seen in a direction parallel to the heat sink 112 ) of a device 100 for dissipating heat from a circuit according to a second embodiment is shown.

[0110] By means of the heat transfer module 120, the circuit can include two circuit boards 140 which are parallel to each other. For example, the heat transfer module 120 allows the circuit to have a multi-layer spatial structure. The (upper) first circuit board 140 includes a component 148 which directly contacts the cooling body base 114 in a conventional manner. The (lower) second circuit board 140 includes the following components which are thermally coupled to the cooling body 110 via at least one heat transfer module 120 as a heat dissipation site 142.

[0111] Figure 4 Schematically shows Figure 3 sectional view along the section line AA of an embodiment of the present invention. Optionally, the second circuit board 140 may include at least one component 146 arranged in the space created by the heat transport module 120. For example, the second circuit board 140 is larger than the first circuit board 140. The component 146 is arranged on the second circuit board 140 outside the first circuit board 140 and extends beyond the plane of the first circuit board 140.

[0112] In the above-described embodiments, one or more heat transport modules 120 are coupled to the cooling body base 114 for thermally contacting the heat dissipation sites 142 of components below the cooling body base 114 and / or between the heat sinks 112 .

[0113] exist Figure 5 In the third embodiment of the device 100 schematically shown in FIG, at least one heat transfer module 120 is joined to the heat sink 112 at the edge to thermally contact with a heat dissipation portion 142 (ie, a component) arranged on the circuit board 140 laterally next to the cooling body 110 .

[0114] Such a lateral coupling of the component to the heat sink 112 can be combined with any of the above-described couplings of the component to the cooling body base 114 .

[0115] Alternatively or additionally, as in the context of the third embodiment, Figure 5 As schematically shown in FIG. 1 , multiple heat dissipation locations 142 (eg, multiple components) of a circuit can be coupled to the heat transmission module 120 .

[0116] The first end 122 and the second end 124 are opposite one another in the longitudinal direction 126 of the heat transport module 120. In at least one heat transport module 120, a further contact surface 144 is arranged laterally to the longitudinal direction 126 (eg parallel to the longitudinal direction 126).

[0117] Therefore, the first contact surface 144 (for example, perpendicular to the longitudinal direction 126) can be arranged on the second end 124 of the heat transport module 120 opposite the first end 122 along the longitudinal direction 126. In addition, the second contact surface 144 (for example, parallel to the longitudinal direction) can be arranged on the heat transport module 120 laterally (i.e., transversely) offset relative to the longitudinal direction 126.

[0118] Figure 6 and 7 Schematic cross-sectional views of examples of press fitting that can be used in each embodiment of the device 100 are shown. The left half of the figure shows a state before joining, and the right half of the figure shows a joined state of the cooling body 110 and the heat transport module 120.

[0119] The first end of the heat transfer module 120 has a first press-fit profile. The joining portion of the cooling body 110 has a second press-fit complementary profile. In the example shown, the first profile is convex and the second profile is concave, but in each embodiment the first and second profiles can also be interchanged.

[0120] Each example comprises a lateral face at a first end of the heat transport module 120 that is perpendicular to the longitudinal direction (which is a vertical direction in the plane of the view).

[0121] Figure 6A first example of a first contour shown in comprises a V-shaped longitudinal face. The joining may comprise a lateral movement perpendicular to the longitudinal direction, wherein the first contour is inserted laterally into the second contour and moved along the cooling body 110 to the desired joining location.

[0122] Optionally, the friction heat generated in this process can heat or even melt the surface, thereby partially producing a metallic material bond.

[0123] Alternatively or additionally, in each embodiment and / or each contour shape, after the form-fitting and / or friction-fitting joining has been performed, the first end on the heat transport module 120 and / or the joining portion on the cooling body 110 can be inductively heated. By tempering, i.e. heating to a tempering temperature (e.g., at least 500 degrees Celsius), creep (i.e., viscoelastic or plastic deformation) of the metal heat transport module 120 at the first end and / or creep of the cooling body 110 at the joining portion can be induced or accelerated, so that the effective exchange area for heat conduction at the molecular level is significantly increased, or air inclusions are reduced or eliminated.

[0124] Alternatively or additionally, in each embodiment and / or each contour shape, after the form-fitting and / or friction-fitting connection has taken place, the first end on the heat transfer module 120 and / or the connection point on the heat sink 110 is inductively melted for the material connection of the metal.

[0125] Figure 8 The second example of the first profile shown includes a rectangular profile as a longitudinal face. The engagement may include a longitudinal movement in the longitudinal direction. The profile may be protected from lateral misalignment (e.g. by a rectangular profile of different widths and / or different depths).

[0126] Figure 8 A schematic perspective view of a device 100 according to a fourth exemplary embodiment is shown, in which the cooling fins 112 also serve as a press-fit contour (i.e. as a “second” contour on the heat sink side of the press fit). As a result, the joining locations can be freely selected over a large area of ​​the heat sink 110 (e.g. on a grid of cooling fins 112).

[0127] In locations where no heat transport module 120 is engaged, heat sink 112 continues to function to output heat to the surrounding environment.

[0128] Fig. 9 A schematic flow chart of a method 1100 for manufacturing an apparatus for dissipating heat from a circuit (eg, an embodiment of the apparatus 100 disclosed herein) is shown.

[0129] In step 1102 , a cooling body 110 is provided, the cooling body comprising a cooling body base 114 and a plurality of heat sinks 112 extending from the cooling body base to dissipate heat.

[0130] In step 1104 , a mechanical and thermally conductive connection to heat sink 110 is established by at least one heat transfer module 120 by press fit and / or metallic material bonding of first end 122 of heat transfer module 120 to a joining point of heat sink 110 .

[0131] In step 1106 , at least one heat transmission module 120 contacts at least one heat dissipation location 142 of the circuit via a contact surface 144 disposed on a second end 124 of the heat transmission module 120 spaced apart from the first end 122 to receive heat from the circuit.

[0132] The method may include each of the steps described above in the context of the device 100. The integral joining of the metals may include arc welding, for example. As an alternative or in addition to compression joining, the integral joining of the metals may be achieved by induction heating.

[0133] The heat sink can have a plurality of joints. The joining (ie, compression joining and / or metallic material-bonding joining) can include selecting a joint from the plurality of joints that is adapted to the topography of the circuit.

[0134] Preferably, after the step of joining 1104 and / or before the step of contacting 1106, the method 1100 may further include a step of shortening at least one heat transport module 120, for example by milling. Thus, a contact surface 144 for thermal contact with the corresponding heat transport module 120 may be established on the second end 124 of the corresponding heat transport module 120 according to the position and / or orientation of the heat dissipation part 142.

[0135] For example, after joining together a plurality of heat transfer modules 120, a plurality of heat transfer modules 120 can be milled in one process in accordance with the topography of the circuit. Due to the mechanical connection of the heat transfer modules 120 via the cooling body 110, which already exists during the process, the heat transfer modules 120 can be precisely matched to the height contour of the heat dissipation locations of the circuit.

[0136] Providing 1102 the cooling body 110 may include extruding (eg, extrusion molding) the cooling body, for example, including the cooling body base 114 and the heat sink 112 and / or including one or more joints (ie, the second contour).

[0137] Method 1100 may also include providing (e.g., extruding, preferably extrusion molding) at least one heat transfer module 120, for example including a first profile for extrusion fit at a first end 122 and / or including a contact surface 144 at a second end 124, the contact surface being configured to contact a heat dissipation portion 142 of a circuit to receive heat from the circuit.

[0138] Fig.10 AC shows a schematic representation of a further exemplary embodiment of the device according to the invention in a not-to-scale illustration, in which different stages of press-fitting are shown, by means of which a further exemplary embodiment of the production process is also explained.

[0139] Fig.10 A schematically shows the first stage of the compression bonding of a cooling body base 114 and a heat transfer module 120 according to another embodiment of the device 10 of the present invention, wherein the cooling body is partially shown in cross section. Fig.10 Parts of the AC diagram are representatively indicated in one diagram.

[0140] In this first phase, the heat transfer module 120 is spaced apart from the heat sink base 114 and is provided for a press fit 130 (in Fig.10 C) is oriented at the joining point 150.

[0141] Before it is inserted into a connection point 150 provided for this purpose, the first free end 122 of the heat transfer module 120 is arranged and designed such that when inserted into the connection point 150 , the first free end 122 is deformed elastically-plastically, in particular plastically, at least in sections to achieve a press fit 130 .

[0142] This makes it possible for the free end 122 to substantially approximate the cross-sectional shape 15 of the joining region 150 and to fill it with little or no gaps for thermal contact, as is the case in Fig.10 B and Fig.10 C. Thus, a press fit 130 with little or no cavity for thermal contact can be achieved, whereby the thermal contact between the heat sink 110 and the heat transfer module 120 can be optimized.

[0143] In this exemplary embodiment, the elastic-plastic deformation or plastic deformation takes place in particular at the free end 122 of the heat transfer module 120 .

[0144] For this purpose, the free end 122 before its insertion into the joining point 150 has a cross section 152 with a cross-sectional profile 154, which in this embodiment has an arrangement of projections 156 and recesses 158 arranged side by side in the longitudinal direction 126 (in each case provided with uniform reference numerals in FIG. 12A / B). Due to this cross-sectional view, the illustration is planar. However, in this embodiment, the projections 156 and recesses 158 also have an extension into the plane of the page, so that, for example, it is possible for the recesses to have a groove-like extension through the respective recesses 158. In the sense of a web-shaped extension, a similar situation also applies to the respective projections 156.

[0145] These (156, 158) are arranged adjacent to each other in the longitudinal direction 126, so that when inserted into the joint, through the aforementioned deformation, the protrusion 156 and the recess 158 adjacent to it in the longitudinal direction 126 approach each other during the aforementioned deformation and the protrusion 156 deforms and causes the recess 158 to be filled, whereby the cross-section 152 of the free end 122 of the heat transport module 120 approximately coincides with the cross-sectional shape 151 of the joint 150, as shown in FIG. Fig.10 As seen in the B / C diagram.

[0146] The projections 156 and the recesses 158 may also or only be formed at the joining portion 150 of the cooling body 110 , so that they can shape the cross-sectional shape 151 of the joining portion 150 of the cooling body 110 and / or the free end 122 of the heat transfer module 120 .

[0147] According to the invention, the advantage is therefore also that, during the insertion engagement to achieve the desired press fit 130 , stresses in the components do not lead to undesired component weakening, such as resulting in stress cracks. Furthermore, the pressing forces can be reduced to a minimum.

[0148] Fig.10 B schematically shows an intermediate stage when the free end 122 of the heat transfer module 120 is partially inserted into the joining location 150 of the cooling body 110 .

[0149] Fig.10C schematically shows the final stage in which the free end 122 of the heat transfer module 120 is inserted into the joint 150 to achieve the desired press fit 130. According to the present invention, in order to connect the heat transfer module 120 and the cooling body to each other, multiple joints 150 or free ends 122 of the heat transfer module 120 can be provided, which can have different shapes and therefore do not have to follow a uniform shape. Thus, for example, the joints can have different depths. In addition, the shape can be reversed so that a blind hole can also be formed in the free end 122 of the heat transfer module 120. In addition, it is possible that the shape is also designed alternately and differently so that the protrusion follows the recess. In addition, the protrusion and the recess can be formed in an adjacent order, for example, on the free end 122 of the heat transfer module 120 and correspondingly on the cooling body 110.

[0150] According to the present invention, a heat transfer module 120 or a heat sink 110 with a corresponding shape (in particular, the free end 122 of the heat transfer module 120 and the heat sink base 114 of the heat sink 110 or the heat sink itself) is manufactured by different manufacturing methods, in particular, initial forming methods (such as extrusion or casting) and forming methods (such as in particular extrusion molding) for press fitting or for press joining / press connection.

[0151] Although the present invention has been described with reference to exemplary embodiments, it will be appreciated by those skilled in the art that various changes may be made and equivalents may be used. In addition, many modifications may be made to adapt the device or heat transport module to a housing or circuit in accordance with the teachings of the present invention. Therefore, the present invention is not limited to the disclosed embodiments, but includes all embodiments falling within the scope of the appended claims.

[0152] Description of Reference Numerals

[0153] 10Traditional Devices

[0154] 11Cooling body of conventional device

[0155] 12The base of traditional installation

[0156] 13Circuit board of traditional device

[0157] 14 Components on a circuit board of a conventional device

[0158] 15 The case where the conventional device is not equipped with parts

[0159] 100 Device for cooling circuits

[0160] 110 cooling body

[0161] 112 heat sink of cooling body, such as thin sheet

[0162] 114 Cooling body base of cooling body

[0163] 120 heat transfer modules, such as heat distributors or thermal bridges

[0164] 122 first end of the heat transport module

[0165] 124 The second end of the heat transport module

[0166] 126 Vertical direction

[0167] 130 Press fit for thermal and mechanical connection between cooling body and heat transfer module

[0168] 140 Circuit carrier of the circuit, such as a circuit board

[0169] 142 A heat dissipation location connected by a heat transfer module, such as a circuit component or a heat accumulation location on a circuit carrier

[0170] 144 Contact surface for thermal contact, for example via thermally conductive paste, also known in the technical terminology as thermal interface material (TIM)

[0171] 146 Components arranged in the space obtained by the heat transport module

[0172] 148 Components directly connected to the cooling body

[0173] 150Jointing part on cooling body base

[0174] 151 Cross-sectional shape of the joint

[0175] 152 Cross section of the first end of the heat transport module

[0176] 154 Cross-sectional profile of the first end of the heat transport module

[0177] 156 The protrusion on the first end of the heat transport module

[0178] 158 Recess on the first end of the heat transport module

Claims

1. A device (100) for dissipating heat from a circuit, comprising: A cooling body (110) having a cooling body base (114) and a plurality of heat sinks (112) extending from the cooling body base and used for dissipating heat; and At least one heat transfer module (120) is connected or can be connected to the cooling body (110) mechanically and heat-conductively at a joint of the cooling body (110) by means of a press fit (130) and / or a metal material fit at a first end (122) of the heat transfer module (120), and the heat transfer module has a contact surface (144) at a second end (124) of the heat transfer module (120) spaced apart from the first end (122), the contact surface being configured to contact at least one heat dissipation location (142) of the circuit so as to receive heat from the circuit.

2. The device (100) according to claim 1, further comprising: A housing in which the circuit is arranged, wherein the heat sink (112) of the cooling body (110) is exposed outside the housing, and / or the at least one heat transmission module (120) is partially or completely arranged inside the housing.

3. The device (100) according to claim 1 or 2, wherein: The press fit comprises at least in some places a metallic material fit; and / or wherein the material joining of the metals comprises arc welding; and / or In this case, the press fit of the first end by means of induction heating comprises a metallic material fit.

4. The device (100) according to any one of claims 1 to 3, wherein: The joining portion includes one or two adjacent heat sinks (112) among the heat sinks (112), and / or wherein the extrusion fit includes friction fit and / or metal material fit between the heat transfer module (120) and at least one of the heat sinks (112) of the heat sink (110), optionally between the two adjacent heat sinks (112).

5. The device (100) according to any one of claims 1 to 4, wherein: The at least one heat transfer module (120) has a first contour of a press fit (130) at a first end (122), and the cooling body (110) has a second contour at least partially complementary to the first contour at a corresponding joining point. Optionally, the heat sink (110) has one or more further joining locations with a second contour and / or the first contour and the second contour engage with or flow into one another, optionally without play, in the press fit.

6. The device (100) according to any one of claims 1 to 5, wherein: In at least one heat transport module of the at least one heat transport module (120), the second end (124) is disposed opposite to the first end (122), and / or wherein at least one of the at least one heat transmission module (120) extends from the second end (124) to the first end (122) along the longitudinal direction (126), and one or more additional contact surfaces (144) for receiving heat are arranged between the first end (122) and the second end (124) laterally in the longitudinal direction (126), optionally parallel to the longitudinal direction (126), and / or The at least one heat transfer module (120) has a plurality of contact surfaces (144) for receiving heat.

7. The device (100) according to any one of claims 1 to 6, wherein: The cooling body (110) is independent of the circuit structure, and / or The at least one heat transfer module (120) is connected and / or formed with the cooling body (110) according to the morphology of the at least one heat dissipation part (142) of the circuit.

8. The device (100) according to any one of claims 1 to 7, wherein: The device (100) comprises a plurality of heat transfer modules (120), wherein the heat transfer modules extend from the cooling body (110) respectively in parallel with each other at different lengths between the first end (122) and the second end (124), Preferably, the different lengths are complementary to the morphology of at least one heat dissipation location (142) of the circuit, and / or the different lengths correspond to the distance from the cooling body base to the corresponding heat dissipation surface.

9. The device (100) according to any one of claims 1 to 8, wherein: The heat sink (110) at least partially comprises aluminum, copper and / or an alloy, and / or Therein, the at least one heat transfer module (120) comprises copper, aluminum and / or an alloy at least in sections.

10. The device (100) according to any one of claims 1 to 9, wherein a component (146) is arranged on a circuit carrier (140), optionally on a printed circuit board (140), between the circuit and a heat sink base (114) of the heat sink (110) and / or in addition to the at least one heat transfer module (120), and the component is constructed higher in the direction (126) of the heat sink (110) than a heat dissipation point (142) contacted via the heat transfer module (120).

11. The device (100) according to any one of claims 1 to 10, wherein: The at least one heat transport module (120) comprises a heat pipe oriented parallel to the heat flow or the longitudinal direction (126) of the heat transport module (120) from the second end (124) to the first end (122), the heat pipe having a fluid contained therein, Optionally, the boiling point of the working medium sealed in the heat pipe matches the temperature at the first end (122) of the heat transport module, and the condensation point of the working medium matches the temperature at the second end (124) of the heat transport module.

12. A system comprising: an electric circuit, optionally a circuit carrier having the electric circuit; and The device (100) for dissipating heat from a circuit according to any one of claims 1 to 11, wherein a contact surface (144) of the at least one heat transmission module (120) contacts at least one heat dissipation portion (142) of the circuit to receive heat from the circuit, Optionally, the at least one heat transfer module (120) matches the morphology of the at least one heat dissipation portion (142) of the circuit.

13. A component of a device (100) according to any one of claims 1 to 11 for cooling a circuit, wherein: The device (100) of the assembly has an identical cooling body (110) and differs in that the at least one heat transfer module (120) is mechanically and thermally connected to the cooling body (110) at different joints of the cooling body (110) and / or the at least one heat transfer module (120) has different lengths between the first end (122) and the second end (124).

14. A kit of devices (100) for dissipating heat from a circuit, comprising: One or more identical cooling bodies (110), each of which has a cooling body base (114) and a plurality of heat sinks (112) extending from the cooling body base and used for dissipating heat; and A plurality of heat transfer modules (120) are provided, wherein the heat transfer modules can be mechanically and thermally connected to a cooling body (110) at a first end (122) of the heat transfer module (120) by means of a press fit (130) and / or a metal material fit at a joint of the cooling body (110), and the heat transfer modules each have a contact surface (144) at a second end (124) of the heat transfer module (120) spaced apart from the first end (122), wherein the contact surface is configured to contact at least one heat dissipation location (142) of a circuit to receive heat from the circuit, wherein the plurality of heat transfer modules (120) have different lengths between the first end (122) and the second end (124).

15. A method (1100) for manufacturing a device (100) for dissipating heat from a circuit, the method comprising: Providing (1102) a cooling body (110), the cooling body having a cooling body base (114) and a plurality of heat sinks (112) extending from the cooling body base and used for dissipating heat; At least one heat transfer module (120) is respectively pressed and joined (1104) and / or joined by metal material fit at a joining position of the cooling body (110) with a first end portion (122) of the heat transfer module (120) so as to be mechanically and thermally connected to the cooling body (110); and The at least one heat transmission module (120) is brought into contact (1106) with at least one heat dissipation location (142) of the circuit through a contact surface (144) arranged on a second end (124) of the heat transmission module (120) spaced apart from the first end (122), so as to receive heat from the circuit. Optionally also include: Depending on the circuit, the at least one heat transfer module (120) is shortened, optionally milled, at the second end (124) in each case.

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