Electronic paper laser cutting supporting device and method

Abstract

The invention discloses an electronic paper laser cutting supporting device and method. The device comprises a porous assembly and a matching assembly. A plurality of through holes A are formed in the porous component; the porous assembly and the matching assembly are combined to form a negative pressure space; the negative pressure space is used for being communicated with an external negative pressure device; and the through hole A is used for enabling fragments generated by laser cutting of the electronic paper to enter the negative pressure space. The electronic paper laser cutting method is based on an electronic paper laser cutting supporting device, and the electronic paper laser cutting supporting device comprises a porous assembly and a laser cutting assembly; a plurality of through holes A are formed in the porous component; a negative pressure space is arranged below the through hole A; the negative pressure space is used for being communicated with a negative pressure device; placing the electronic paper on the porous assembly; starting a negative pressure device, and starting a laser cutting device to cut the electronic paper; and the through hole A is used for enabling fragments generated by cutting the electronic paper to enter the negative pressure space. And hollow laser cutting is adopted, cutting with the function of avoiding and collecting electronic paper residues is achieved, and the productivity and the product yield of electronic paper laser cutting are improved.

Description

Technical Field

[0001] The present application belongs to the field of electronic paper manufacturing, and specifically relates to an electronic paper laser cutting support device and method. Background Art

[0002] Electronic paper modules are now widely used in supermarket price tags, e-books, mobile phones and other electronic devices. With the increase in market demand and the increasing maturity of automation equipment, the production capacity bottleneck of electronic paper is obvious.

[0003] In the prior art, the production of electronic paper laser cutting has the following problems: Problem 1: When cutting electronic paper on a flat cutting platform, when cutting according to a fixed layout, long cutting time causes the cutting marks on the platform carrying the electronic paper to deepen and widen, affecting its flatness and cleanliness, thereby affecting the electronic paper cutting yield. Problem 2: When laser cutting electronic paper, the edge of the electronic paper is prone to sticking to the platform, and the cutting debris will cause the edge of the electronic paper to be seriously dirty. The labor cost of manually wiping the dirt is too high and the efficiency is very low. In view of the above problems, there is an urgent need for improvement to increase the production capacity of electronic paper. Summary of the invention

[0004] The technical problem to be solved by the present invention is to avoid the shortcomings of the above-mentioned prior art, namely, low yield, serious contamination and low efficiency in removing contamination of electronic paper laser cutting, and to provide an electronic paper laser cutting support device and method, which is a cutting platform with hollow collection of electronic paper residues. The hollow laser cutting platform is used to improve the production capacity and product yield of electronic paper cutting.

[0005] The technical solution of the present application to solve the above technical problems is an electronic paper laser cutting support device, including: a porous component and a matching component; the porous component includes multiple A through holes; the porous component and the matching component are combined to form a negative pressure space; the negative pressure space is used to connect with an external negative pressure device; the A through holes are used for the fragments generated by laser cutting of electronic paper to enter the above negative pressure space.

[0006] The matching component includes a bottom module; the porous component includes a laser-cut support porous plate; the bottom of the laser-cut support porous plate includes a negative pressure groove, the bottom module closes the opening of the negative pressure groove, and the laser-cut support porous plate and the bottom module are enclosed to form a negative pressure space; the laser-cut support porous plate is used to support electronic paper; the laser-cut support porous plate includes a plurality of A through holes, and the A through holes penetrate the laser-cut support porous plate; the A through holes are used to allow the fragments generated by laser cutting of electronic paper to enter the negative pressure space; an opening is provided on the bottom module for connecting with an external negative pressure device.

[0007] The matching component includes a support module; the porous component includes a laser-cut support porous plate; the support module includes a negative pressure groove, the laser-cut support porous plate closes the opening of the negative pressure groove, and the laser-cut support porous plate and the support module enclose a negative pressure space; the laser-cut support porous plate is used to support electronic paper; the laser-cut support porous plate includes a plurality of A through holes, and the A through holes penetrate the laser-cut support porous plate; the A through holes are used to allow the fragments generated by laser cutting of electronic paper to enter the negative pressure space.

[0008] The above-mentioned support module includes a support frame and an enclosed bottom plate. The middle of the support frame includes a B through hole that communicates with each other from top to bottom. The enclosed bottom plate is installed at the bottom of the support frame through an installation component to close the opening of the B through hole at the bottom of the support frame. The above-mentioned negative pressure groove is formed by the combination of the support frame and the enclosed bottom plate.

[0009] The enclosed bottom plate includes an air pipe connecting opening, and the air pipe connecting opening is used to connect an air extraction pipeline.

[0010] The electronic paper laser cutting support device also includes a sealing gasket, which is installed at the joint between the support frame of the negative pressure groove and the enclosed bottom plate for sealing.

[0011] The above-mentioned through hole A includes a D part and a B part; the D part is connected to the B part, and the D part is above the B part; the cross-sectional area of ​​the D part is greater than the cross-sectional area of ​​the B part.

[0012] The vertical section of the D portion is trapezoidal, and the upper opening of the D portion is larger than the lower opening of the D portion.

[0013] The cross-sectional length or width of the upper opening of the above-mentioned D portion is greater than 8 mm and less than 8.5 mm; the cross-sectional length or width of the lower opening of the above-mentioned D portion is greater than 4 mm and less than 5 mm.

[0014] The above-mentioned electronic paper laser cutting support device includes any one or more of the following technical features: Feature TA1: The B through hole in the middle of the above-mentioned support frame is a stepped through hole, and the stepped through hole connected to the upper surface of the support frame is used to install the above-mentioned laser cutting support porous plate; Feature TA2: The above-mentioned laser cutting support porous plate is a rectangular plate; Feature TA3: The above-mentioned A through holes are distributed in the middle of the laser cutting support porous plate, and the periphery of the laser cutting support porous plate includes a non-perforated portion with a width of 20 mm, and the non-perforated portion does not have A through holes distributed; Feature TA4: The periphery of the above-mentioned laser cutting support porous plate includes installation and fixing holes; Feature TA5: The periphery of the above-mentioned laser cutting support porous plate includes pull ring installation holes; Feature TA6: The periphery of the above-mentioned support module includes pull ring installation holes.

[0015] The technical solution of the present application to solve the above technical problems can also be an electronic paper laser cutting method, based on an electronic paper laser cutting support device, the electronic paper laser cutting support device includes: a porous component; the porous component includes a plurality of A through holes; a negative pressure space is set under the A through hole; the negative pressure space is used to connect with the negative pressure device; the electronic paper is placed on the porous component; the negative pressure device is started, and the laser cutting device is started to cut the electronic paper; the A through hole is used to cut the fragments generated by the electronic paper into the above negative pressure space. Adjust the negative pressure provided by the negative pressure device according to the progress of cutting the electronic paper. Turn off the negative pressure device and remove the cut electronic paper.

[0016] One of the beneficial effects of the technical solution in this application is that when the electronic paper is cut, the electronic paper is placed above the porous component. When the laser cuts the electronic paper, when the laser passes through the electronic paper, it is likely to pass through the A through hole, and the probability of the main body of the porous component itself being damaged by laser cutting is small. The longer the porous component can maintain flatness, the higher the yield of the production process. As a high-value consumable in the production process, the porous component is designed to be disassembled for easy replacement. The porous design also reduces the frequency of replacement, further improving production efficiency and reducing production costs.

[0017] One of the beneficial effects of the technical solution in the present application is the hollow cutting platform, which can reduce the contact area between the platform and the electronic paper, so that the residues produced on the edge during laser cutting can be adsorbed by vacuum, thereby reducing the dirt on the electronic paper membrane and solving the problem of manual wiping process, improving product yield and reducing labor costs.

[0018] One of the beneficial effects of the technical solution in the present application is that the upper part of the through hole A, namely the D part, is inclined at an angle of 45°, so that the efficiency of vacuum adsorption is improved, which is more conducive to the removal of residues and the cleaning degree is better.

[0019] One of the beneficial effects of the technical solution in the present application is that the bottom module and the porous component include a combination of a laser-cut supporting porous plate, which facilitates the replacement of the laser-cut supporting porous plate and is more flexible.

[0020] One of the beneficial effects of the technical solution in the present application is that the support module and the porous component include a laser-cut support porous plate, which facilitates the replacement of the laser-cut support porous plate, while minimizing the cost of replacing parts and minimizing the cost of consumables.

[0021] One of the beneficial effects of the technical solution in the present application is that the structural design of the support module includes a support frame and an enclosing bottom plate, which facilitates the accumulation and regular removal of residues, eliminates the need for real-time removal of residues, and improves production efficiency.

[0022] One of the beneficial effects of the technical solution in the present application is that the sealing gasket is installed at the junction of the support frame and the enclosing bottom plate of the negative pressure groove, which increases the sealing and improves the negative pressure adsorption effect.

[0023] One of the beneficial effects of the technical solution in the present application is that the cross-sectional area of ​​part D is larger than that of part B. The structural design of large top and small bottom facilitates the entry and cleaning of residues, and the residues are not easy to block through-hole A, further improving production efficiency. The cross-sectional area of ​​part D is larger than that of part B, so that the outer wall of part D forms a certain elevation angle, usually 45 degrees. The residue falls more smoothly. At the same time, the area of ​​through-hole A on the top surface is increased as much as possible, which reduces the probability of being irradiated by laser, reduces the damage of laser cutting to the laser cutting support porous plate, can extend the service life of the laser cutting support porous plate, reduce the replacement interval, and improve production efficiency.

[0024] One of the beneficial effects of the technical solution in the present application is that the upper opening of the D part is larger than the lower opening of the D part. The structural design of the upper part being larger and the lower part being smaller facilitates the entry and cleaning of the residues, and the residues are not easy to block the through-hole A, further improving the production efficiency. At the same time, the area of ​​the through-hole A on the top surface is increased as much as possible, the probability of being irradiated by the laser is reduced, and the damage of the laser cutting to the laser cutting support porous plate is reduced, which can extend the service life of the laser cutting support porous plate, reduce the replacement interval, and improve the production efficiency.

[0025] One of the beneficial effects of the technical solution in the present application is that the B through hole is a stepped through hole, which is connected to the upper surface of the support frame and is used to install the above-mentioned laser-cut support porous plate, which is convenient for cleaning and maintenance, and ensures that the sealed negative pressure space has sufficient sealing and space to carry residues.

[0026] One of the beneficial effects of the technical solution in the present application is that the laser cutting support porous plate is a rectangular plate, which is convenient for manufacturing.

[0027] One of the beneficial effects of the technical solution in the present application is that the periphery of the laser-cut supporting porous plate includes a non-perforated portion with a width of 20 mm, and the non-perforated portion does not have A through holes distributed therein, which facilitates installation and maintenance and reduces costs.

[0028] One of the beneficial effects of the technical solution in the present application is that the periphery of the laser-cut support porous plate includes installation fixing holes, which facilitates fixed installation.

[0029] One of the beneficial effects of the technical solution in the present application is that the periphery of the laser-cut support porous plate includes pull ring mounting holes; the periphery of the support module includes pull ring mounting holes, which facilitates lifting.

[0030] One of the beneficial effects of the technical solution in this application is to adjust the negative pressure provided by the negative pressure device according to the progress of cutting the electronic paper. As the cutting progresses, the probability of air entering the negative pressure space increases. If the negative pressure is not adjusted accordingly, the adsorption effect of the negative pressure is affected and the cleanliness level is reduced. Turn off the negative pressure device and remove the cut electronic paper. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is an exploded schematic diagram of one embodiment of an electronic paper laser cutting support device;

[0032] Figure 2 is an exploded schematic diagram of a second embodiment of an electronic paper laser cutting support device;

[0033] Figure 3 This is a schematic diagram of the assembly state of the third embodiment of the electronic paper laser cutting support device;

[0034] Figure 4 is a schematic diagram of a disassembled state of a fourth embodiment of an electronic paper laser cutting support device;

[0035] Figure 5 is a schematic diagram of a disassembled state of a fifth embodiment of an electronic paper laser cutting support device;

[0036] Figure 6 It is one of the schematic diagrams of laser cutting supporting porous plates;

[0037] Figure 7 yes Figure 6 A local enlarged schematic diagram of the N part;

[0038] Figure 8 yes Figure 7 A partial enlarged schematic diagram of the H portion in the middle;

[0039] Fig. 9 It is a schematic diagram of the dimensions of the enclosed base plate;

[0040] Fig.10 This is the second schematic diagram of laser cutting supporting porous plates;

[0041] Fig.11 This is the third schematic diagram of laser cutting supporting porous plates;

[0042] Fig.12 yes Fig.11 A partial enlargement and a partial section view, and a partial enlargement schematic diagram of the partial section view;

[0043] Fig.13 is a schematic side view of through hole A;

[0044] Fig.14 is a top view schematic diagram of through hole A;

[0045] Fig.15 It is a partial schematic diagram of through hole A. DETAILED DESCRIPTION

[0046] The embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings.

[0047] It should be noted that the following is a description of the preferred embodiments of the present application, which does not constitute any limitation to the present application. The description of the preferred embodiments of the present application is only an explanation of the general principles of the present application. The embodiments described in this application are only a part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0048] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", and technical features numbered with Arabic numerals 1, 2, 3, etc., and numbers such as "A" and "B", are only used for descriptive purposes and are only for the convenience of explanation, and do not represent a sequential relationship in time or space; they cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and numbered with Arabic numerals 1, 2, 3, etc. may explicitly or implicitly include one or more of the features. In the description of the present application, “several” means two or more than two, unless otherwise clearly and specifically defined.

[0049] As mentioned above, there are many problems in the production of electronic paper laser cutting: including long cutting time, which causes the cutting marks of the platform carrying the electronic paper to deepen and widen, affecting its flatness and cleanliness, thereby affecting the electronic paper cutting yield; the edge of the electronic paper is prone to sticking to the platform, and the cutting debris can cause the edge of the electronic paper to be seriously dirty; and the labor cost of manually wiping off the dirt is too high and the efficiency is very low.

[0050] In the electronic paper laser cutting support device and method of the present application, a cutting platform with hollow collection of electronic paper residues is designed, and the hollow laser cutting platform is used to improve the product production capacity and product yield.

[0051] In an embodiment of an electronic paper laser cutting method, based on an electronic paper laser cutting support device, the electronic paper laser cutting support device includes: a porous component; a plurality of A through holes on the porous component; a negative pressure space is set under the A through hole; the negative pressure space is used to communicate with the negative pressure device; the electronic paper is placed on the porous component; the negative pressure device is started, and the laser cutting device is started to cut the electronic paper; the A through hole is used to cut the electronic paper. The fragments generated by the electronic paper enter the above-mentioned negative pressure space. Turn off the negative pressure device and remove the cut electronic paper. Adjust the negative pressure provided by the negative pressure device according to the progress of cutting the electronic paper. As the cutting proceeds, the probability of air entering the negative pressure space increases. If the negative pressure size is not adjusted accordingly, the adsorption effect of the negative pressure is affected and the cleanliness level is reduced. Turn off the negative pressure device and remove the cut electronic paper.

[0052] like Figure 1 In an embodiment of an electronic paper laser cutting support device and method, the device comprises: a porous component 1100 and a matching component 1200; the porous component 1100 comprises a plurality of A through holes 1110, and the A through holes 1110 are connected; the porous component 1100 and the matching component 1200 are combined to form a negative pressure space 1210; the negative pressure space 1210 is used to communicate with an external negative pressure device; the A through holes 1110 are used to allow the fragments generated by laser cutting of electronic paper to enter the above-mentioned negative pressure space 1210.

[0053] like Figure 2 In an embodiment of an electronic paper laser cutting support device and method, the device comprises: a porous component 2100 and a matching component 2200; the porous component 2100 comprises a plurality of A through holes 2110, and the A through holes 2110 are connected; the porous component 2100 and the matching component 2200 are combined to form a negative pressure space 2210; the negative pressure space 2210 is used to communicate with an external negative pressure device; the A through holes 2110 are used for the fragments generated by laser cutting of electronic paper to enter the above-mentioned negative pressure space 2210.

[0054] When cutting the electronic paper, the electronic paper is placed on top of the porous component. When the laser cuts the electronic paper, when the laser passes through the electronic paper, it is likely to pass through the A hole. The probability of the main body of the porous component being damaged by the laser cutting is small. The longer the porous component can maintain its flatness, the higher the yield of the production process. As a high-value consumable in the production process, the porous component is designed to be disassembled for easy replacement. The porous design also reduces the replacement frequency, further improving production efficiency and reducing production costs.

[0055] In some embodiments of the electronic paper laser cutting support device not shown in other drawings, the matching component can be a single-layer bottom plate, and a negative pressure space is set at the bottom of the porous component 2100, and the single-layer bottom plate covers the bottom of the porous component to form a negative pressure space. The matching component includes a bottom module 2200; the porous component includes a laser cutting support porous plate 2100; the bottom of the laser cutting support porous plate 2100 includes a negative pressure groove, the bottom module 2200 closes the opening of the negative pressure groove, and the laser cutting support porous plate 2100 and the bottom module 2200 are enclosed to form a negative pressure space; the laser cutting support porous plate 2100 is used to support the electronic paper; the laser cutting support porous plate 2100 includes a plurality of A through holes, and the A through holes penetrate the laser cutting support porous plate; the A through holes are used for the fragments generated by laser cutting of the electronic paper to enter the above negative pressure space; the bottom module is provided with an opening for communicating with an external negative pressure device.

[0056] like Figure 3 and Figure 4 In an embodiment of an electronic paper laser cutting support device and method, the matching component includes a support module 3200; the porous component includes a laser cutting support porous plate 3100.

[0057] like Figure 4 In an embodiment of an electronic paper laser cutting support device and method, the support module 3200 includes a negative pressure groove 3210, the laser cutting support porous plate 3100 covers and closes the opening of the negative pressure groove 3210, and the laser cutting support porous plate 3100 and the support module 3200 enclose a negative pressure space; the laser cutting support porous plate 3100 is used to support the electronic paper; the laser cutting support porous plate 3100 includes a plurality of A through holes, and the A through holes penetrate the laser cutting support porous plate 3100; the A through holes are used to allow the fragments generated by laser cutting of the electronic paper to enter the negative pressure space. In the use state, the fragments generated by laser cutting of the electronic paper enter the negative pressure space through the A through holes. The support module 3200 can be an integrally formed component.

[0058] like Figure 4 In an embodiment of an electronic paper laser cutting support device and method, the negative pressure groove 3210 includes a step 3211, which is connected to the upper surface of the support module 3200 and is used to install the laser cutting support porous plate 3100. A sealing gasket can be set between the step 3211 and the laser cutting support porous plate 3100.

[0059] like Figure 5In an embodiment of an electronic paper laser cutting support device and method, the support module 5200 includes a support frame 5210 and an enclosure bottom plate 5220, the support frame 5210 includes a through hole 5250 communicating with each other from top to bottom, the enclosure bottom plate 5220 is installed at the bottom of the support frame 5210 by means of mounting components such as fasteners, and closes the opening of the through hole 5250 at the bottom of the support frame 5210; the negative pressure groove is formed by the combination of the support frame 5210 and the enclosure bottom plate 5220. The laser cutting support porous plate 5100 covers and closes the opening of the negative pressure groove.

[0060] like Figure 5 In an embodiment of an electronic paper laser cutting support device and method, the through hole 5250 in the middle of the above-mentioned support frame 5210 is a stepped through hole, and the stepped through hole connected to the upper surface of the support frame 5210 is used to install the above-mentioned laser cutting support porous plate 5100.

[0061] like Figure 5 In an embodiment of an electronic paper laser cutting support device and method, the enclosed bottom plate 5220 includes an air pipe connecting opening 5227, which is used to connect to an external air extraction pipeline, and the air extraction of the external air extraction pipeline forms a negative pressure. The number of the air pipe connecting openings 5227 is an even number, and the air pipe connecting openings 5227 are arranged in pairs on both sides of the central axis of the enclosed bottom plate.

[0062] like Fig. 9 In an embodiment of an electronic paper laser cutting support device and method, the enclosed bottom plate 7220 includes an air pipe connecting opening 7227, which is used to connect to an external air extraction pipeline, and the air extraction of the external air extraction pipeline forms a negative pressure. The number of the air pipe connecting openings 7227 is 4, and the air pipe connecting openings 7227 are arranged in pairs on both sides of the central axis of the enclosed bottom plate.

[0063] Fig. 9 In the figure, a front view, a side view and a top view of the enclosed base plate 7220 are included. Fig. 9 The middle figure is a front view of the enclosed bottom plate 7220; Fig. 9 The figure below is a top view of the enclosed bottom plate 7220; Fig. 9The right picture is a side view of the enclosed bottom plate 7220; the main view shows that the outer dimensions of the enclosed bottom plate 7220 are 894 mm in length and 704 mm in width; the aperture of the air pipe connecting opening 7227 is 56 mm, the horizontal spacing is 300 mm, and the vertical spacing is 200 mm, which are symmetrically distributed around the center of the enclosed bottom plate 7220. The outer diameter of the air pipe connecting opening 7227 and the external vacuum pipe connection can also be 60 mm. It can be seen from the main view that the enclosed bottom plate 7220 is provided with A sealing gasket fixing positions 7228, and the enclosed bottom plate 7220 is provided with B sealing gasket fixing positions 7229, and the A sealing gasket fixing positions 7228 and the B sealing gasket fixing positions 7229 are enclosed in a circle for fixing the sealing gasket. The sealing gasket can be sponge rubber, which is attached to the A sealing gasket fixing position 7228 and the B sealing gasket fixing position 7229. The width of the A sealing gasket fixing position 7228 is 32 mm; the width of the B sealing gasket fixing position 7229 is also 32 mm.

[0064] Some embodiments not shown in the drawings further include a sealing gasket, which is installed at the joint between the support frame and the enclosed bottom plate to seal the negative pressure groove.

[0065] like Figures 13 to 15 In an embodiment of an electronic paper laser cutting support device and method, the A through hole 900 includes a D portion 910 and a B portion 920; the D portion 910 is connected to the B portion 920, and the D portion 910 is above the B portion 920; the cross-sectional area of ​​the D portion 910 is greater than the cross-sectional area of ​​the B portion 920.

[0066] like Figures 13 to 15 In an embodiment of an electronic paper laser cutting support device and method, the above-mentioned D portion 910 has a trapezoidal vertical section, and the upper opening portion 911 of the D portion 910 is larger than the lower opening portion 912 of the D portion 910. When the size of the upper opening portion 911 of the D portion 910 and the size of the lower opening portion 912 of the D portion 910 are precisely set, the elevation angle of the outer wall of the D portion can be controlled; in some embodiments, the size is set so that the elevation angle of the outer wall of the D portion is 45°. When performing electronic paper laser cutting, the degree of negative pressure in the negative pressure space is controlled accordingly to remove cutting impurities and fix the electronic paper at the same time. Each A through hole 900 is in the shape of a trumpet,

[0067] like Figures 13 to 15 In an embodiment of an electronic paper laser cutting support device and method, the cross-sectional length or width of the upper opening portion 911 of the above-mentioned D portion 910 is greater than 8 mm and less than 8.5 mm; the cross-sectional length or width of the lower opening portion 912 of the above-mentioned D portion 910 is greater than 4 mm and less than 5 mm.

[0068] Figure 7 yes Figure 6 A local enlarged schematic diagram of the N part; Figure 8yes Figure 7 A partial enlarged schematic diagram of part H in FIG. Figures 6 to 8 In an embodiment of an electronic paper laser cutting support device and method, the laser cutting support porous plate 7100 is a rectangular plate; the above-mentioned A through holes 7110 are distributed in the middle of the laser cutting support porous plate 7100, and the periphery of the laser cutting support porous plate includes a non-perforated portion 7120 with a width of 20 mm, and the non-perforated portion 7120 is not distributed with A through holes; the periphery of the above-mentioned laser cutting support porous plate includes a mounting fixing hole 7300. Multiple A through holes are closely arranged and cover the perforated portion of the laser cutting support porous plate 7100.

[0069] like Figures 10 to 12 In an embodiment of an electronic paper laser cutting support device and method, the laser cutting support porous plate 8100 is a rectangular plate with a length of 920 mm and a width of 720 mm. The periphery of the laser cutting support porous plate includes a non-perforated portion 8120 with a width of 20 mm.

[0070] Fig.12 The lower right picture is Fig.11 A partial enlarged schematic diagram of part C in the middle. Fig.12 The upper figure is a partial longitudinal sectional view of the C part, and the partial enlarged schematic diagram of the F part in the figure is Fig.12 The lower left figure in the figure. The reference numeral 9800 in the figure is an A through hole. Each A through hole is arranged adjacent to each other. Fig.12 In the embodiment, the upward elevation angle of the through hole D portion of A is 45°. In other embodiments, the elevation angle can be 30°, 60° or other angles.

[0071] like Figure 3 In an embodiment of an electronic paper laser cutting support device and method, the laser cutting support porous plate 3100 includes a pull ring mounting hole around it for mounting a porous plate pull ring 3150; there can be multiple porous plate pull rings 3150, which are symmetrically arranged. The support module 3200 includes a pull ring mounting hole around it for mounting a support module pull ring 3250; there can be multiple support module pull rings 3250, which are symmetrically arranged.

[0072] The electronic paper laser cutting support device designed in this application is a cutting platform with a hollow collection function for electronic paper residues. The designed hollow cutting platform solves the problem of low electronic paper laser cutting capacity and can improve product capacity and product yield.

[0073] The hollow cutting platform can reduce the contact area between the platform and the electronic paper, so that the residues produced on the edge during laser cutting can be adsorbed by vacuum, thereby reducing the dirt on the electronic paper membrane and solving the problem of manual wiping process, improving product yield and reducing labor costs.

[0074] The upper part of the A through hole, i.e., part D, is a vacuum hole arranged at an angle of 45°. Each vacuum hole is in the shape of a trumpet. The hollow laser electronic paper cutting process is performed on multiple A through holes, i.e., the group holes, to reduce the contact area between the electronic paper and the cutting platform. When the electronic paper is laser cut, the cutting residues on the edge of the electronic paper are sucked away by vacuum, thereby reducing the dirt on the electronic paper and improving the cutting yield.

[0075] In the present application, in the electronic paper laser cutting method based on the electronic paper laser cutting support device, the contact area between the electronic paper and the support device or the support platform is reduced through hollowing process, and the laser cutting residue is sucked away by vacuum, thereby reducing the residual electronic paper residue. There is no need for manual wiping of the electronic paper process, thereby improving product yield and reducing labor costs.

[0076] like Figures 1 to 15 As shown, the above are only embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. An electronic paper laser cutting method, characterized in that: Based on the electronic paper laser cutting support device, The electronic paper laser cutting support device comprises: a porous component; the porous component comprises a plurality of A through holes; a negative pressure space is arranged under the A through holes; the negative pressure space is used to communicate with the negative pressure device; Placing the electronic paper on the porous component; Start the negative pressure device, and start the laser cutting device to cut the electronic paper; A through hole is used to cut the fragments generated by the electronic paper into the negative pressure space.

2. The electronic paper laser cutting method according to claim 1, characterized in that: The negative pressure provided by the negative pressure device is adjusted according to the progress of cutting the electronic paper.

3. The electronic paper laser cutting method according to claim 1, characterized in that: Turn off the negative pressure device and remove the cut electronic paper.

4. An electronic paper laser cutting support device, characterized in that: include: Porous components, mating components; The porous component includes a plurality of A through holes; The porous components and matching components are combined to form a negative pressure space; The negative pressure space is used to communicate with an external negative pressure device; A through hole is used for laser cutting to allow the debris generated by cutting the electronic paper to enter the negative pressure space.

5. The electronic paper laser cutting support device according to claim 4, characterized in that: The mating components include a bottom module; The porous assembly includes a laser cut support porous plate; The bottom of the laser-cut supporting porous plate includes a negative pressure groove, the bottom module seals the opening of the negative pressure groove, and the laser-cut supporting porous plate and the bottom module enclose a negative pressure space; Laser-cut support porous plates are used to support electronic paper; The laser cutting support porous plate includes a plurality of A through holes, and the A through holes penetrate the laser cutting support porous plate; A through hole is used for the debris generated by laser cutting of electronic paper to enter the negative pressure space; The bottom module is provided with an opening for communicating with an external negative pressure device.

6. The electronic paper laser cutting support device according to claim 4, characterized in that: The mating components include a support module; The porous assembly includes a laser cut support porous plate; The support module includes a negative pressure groove, the laser cut support porous plate closes the opening of the negative pressure groove, and the laser cut support porous plate and the support module are enclosed to form a negative pressure space; Laser-cut support porous plates are used to support electronic paper; The laser cutting support porous plate includes a plurality of A through holes, and the A through holes penetrate the laser cutting support porous plate; A through hole is used for laser cutting to allow the debris generated by cutting the electronic paper to enter the negative pressure space.

7. The electronic paper laser cutting support device according to claim 6, characterized in that: The support module comprises a support frame and an enclosed bottom plate, the support frame comprises a through hole B communicating with each other from top to bottom in the middle, the enclosed bottom plate is mounted on the bottom of the support frame through a mounting component, and closes the opening of the through hole B at the bottom of the support frame; the negative pressure groove is formed by the combination of the support frame and the enclosed bottom plate; The enclosed bottom plate includes an air pipe communication opening, and the air pipe communication opening is used to connect an air extraction pipeline; It also includes a sealing gasket, which is installed at the joint between the supporting frame and the enclosed bottom plate of the negative pressure groove for sealing.

8. The electronic paper laser cutting support device according to claim 4, characterized in that: The through hole A comprises a D portion and a B portion; the D portion is connected to the B portion, and the D portion is above the B portion; and the cross-sectional area of ​​the D portion is greater than the cross-sectional area of ​​the B portion.

9. The electronic paper laser cutting support device according to claim 8, characterized in that: The vertical section of the D portion is a trapezoid, and the upper opening of the D portion is larger than the lower opening of the D portion; the length or width of the cross section of the upper opening of the D portion is greater than 8 mm and less than 8.5 mm; The cross-sectional length or width of the lower opening of the D portion is greater than 4 mm and less than 5 mm.

10. The electronic paper laser cutting support device according to claim 4, characterized in that: Includes any one or more of the following technical features: Feature TA1: The through hole B in the middle of the support frame is a stepped through hole, which is connected to the upper surface of the support frame and is used to install the laser cutting support porous plate; Feature TA2: The laser cutting support porous plate is a rectangular plate; Feature TA3: The A through holes are distributed in the middle of the laser-cut supporting porous plate, and the periphery of the laser-cut supporting porous plate includes a non-perforated portion with a width of 20 mm, and the non-perforated portion does not have A through holes distributed; Feature TA4: The periphery of the laser-cut support porous plate includes mounting and fixing holes; Feature TA5: The periphery of the laser-cut support porous plate includes pull ring mounting holes; Feature TA6: The support module includes pull ring mounting holes around its periphery.

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