Metal honeycomb ice holding processing device for semiconductor refrigeration

Abstract

The application relates to a metal honeycomb ice holding machining device for semiconductor refrigeration, and particularly relates to a metal honeycomb ice holding machining device for semiconductor refrigeration. The application provides a metal honeycomb ice holding machining device for semiconductor refrigeration. The application comprises a clamp body 1.1, which is characterized in that a water container 1.3 is arranged in the clamp body 1.1, a temperature measuring thermocouple 1.6 and a stirrer 2.1 are arranged on the side wall of the water container 1.3, a heating component 3.9 is arranged on the bottom surface of the water container 1.3, and semiconductor refrigerating sheets 1.5 are arranged on the side wall of the water container 1.3 and the bottom surface of the water container 1.3; a water inlet 1.8 is arranged on one side of the lower end of the clamp body 1.1, and a water outlet 1.9 is arranged on the other side of the lower end of the clamp body 1.1; a cooling water cavity 1.7 is left between the inner wall of the clamp body 1.1 and the outer wall of the water container 1.3 and between the inner bottom surface of the clamp body 1.1 and the outer bottom surface of the water container.

Description

Technical Field

[0001] This invention belongs to the field of thin-walled metal cutting technology, and particularly relates to a semiconductor refrigeration metal honeycomb ice holding processing equipment. Background Technology

[0002] Due to their lightweight, high strength, good rigidity, long service life, and good processing adaptability, honeycomb material components made of metal alloys such as titanium alloys, nickel-based superalloys, and aluminum alloys are widely used in important national economic and livelihood fields such as aerospace, aviation, and shipbuilding. These honeycomb components are mainly formed by welding together several thin-walled alloy strips pressed into a corrugated shape, resulting in a porous thin-walled structure. Although they have high strength along the axial direction of the honeycomb holes, their hole wall thickness is generally less than 0.1 mm, and their radial in-plane equivalent strength is poor, making them difficult-to-machine, low-stiffness thin-walled materials. In machining processes using traditional clamping methods, these components are constantly subjected to radial forces from the cutting tool, inevitably resulting in a certain amount of extrusion deformation. Simultaneously, the cutting area is the weakest point in terms of rigidity, often leading to cutting avoidance, ineffective chip breaking, insufficient cutting, and burr residue. This results in reduced manufacturing precision, a yield rate of only about 30%, and processing costs as high as 90%. Consequently, metal honeycomb components obtained using traditional processing methods cannot meet the assembly requirements of aerospace, affecting the practical function of the product and reducing processing costs.

[0003] Therefore, in honeycomb machining, especially in the milling of aerospace metal honeycomb materials, effective positioning and clamping of honeycomb components are often required. Domestic research has been conducted on improving the ice-holding capacity of thin-walled components. A domestic invention patent, patent number: ZL202210441745.6, invention title: An ice-holding cooling fixture and its clamping method. This method uses water to freeze and form solid ice to hold thin-walled components, but this method still requires offline refrigeration by a refrigerator, which takes a long time, and the ice melts easily, affecting the long-term holding capacity. A domestic utility model patent, patent number: ZL93212141.1, patent title: Electro-cooled ice-fixing fixture. This fixture lacks an ice control system and a rapid melting function after processing, and the holding capacity cannot be effectively controlled. Summary of the Invention

[0004] The present invention addresses the above-mentioned problems by providing a semiconductor-cooled metal honeycomb ice holding and processing device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: the present invention includes a clamp body 1.1, characterized in that a water container 1.3 is provided inside the clamp body 1.1, a temperature measuring thermocouple 1.6 and a stirrer 2.1 are provided on the side wall of the water container 1.3, a heating element 3.9 is provided on the bottom surface of the water container 1.3, and a semiconductor cooling chip 1.5 is provided on the side wall and the bottom surface of the water container 1.3;

[0006] A water inlet 1.8 is provided on one side of the lower end of the clamp body 1.1, and a water outlet 1.9 is provided on the other side of the lower end of the clamp body 1.1; a cooling water cavity 1.7 is provided between the inner wall of the clamp body 1.1 and the outer wall of the water container 1.3, and between the inner bottom surface of the clamp body 1.1 and the outer bottom surface of the water container;

[0007] A positioning device 1.10 for a honeycomb workpiece 1.11 is provided in the middle of the inner bottom surface of the water container 1.3, and support plates 2.3 for the honeycomb workpiece 1.11 are provided on the inner bottom surface of the water container 1.3 on both sides of the positioning device 1.10;

[0008] The upper end of the water container 1.3 is equipped with a pressure plate 2.7 for the honeycomb workpiece 1.11.

[0009] As a preferred embodiment, the water container 1.3 of the present invention has a connecting plate extending outward at its upper end, and the connecting plate is connected to the upper end of the clamping body 1.1 by fastener 1.2.

[0010] As another preferred embodiment, the fastener 1.2 of the present invention is a screw.

[0011] As another preferred embodiment, the water container 1.3 of the present invention is made of low thermal conductivity Ti-6Al-4V titanium alloy material, and the surface of the water container 1.3 is subjected to micro-arc oxidation to generate a ZrO2 heat-insulating ceramic coating.

[0012] As another preferred embodiment, the semiconductor cooling chip 1.5 of the present invention is disposed in the hole in the side wall and bottom surface of the water container 1.3, and a sealing ring 1.4 is provided between the outer wall of the semiconductor cooling chip 1.5 and the hole wall.

[0013] As another preferred embodiment, the water container 1.3 of the present invention is provided with semiconductor cooling chips 1.5 on the upper and lower parts of both side walls along the length direction, and semiconductor cooling chips 1.5 on both sides of the bottom surface of the water container 1.3; a temperature measuring thermocouple 1.6 is provided in the middle of both side walls along the length direction; and a stirrer 2.1 is provided on both side walls along the width direction.

[0014] As another preferred embodiment, the positioning device 1.10 of the present invention includes a rotating plate 5.1, a stud 5.2 with its upper end passing through the central hole of the rotating plate 5.1 and screwed with a nut 5.3, and horizontal notches 2.4 provided on both sides of the rotating plate 5.1; a positioning diamond pin 5.4 is provided at one notch 2.4 and a positioning cylindrical pin 5.7 is provided at the other notch 2.4; the lower ends of the positioning diamond pin 5.4 and the positioning cylindrical pin 5.7 are screwed through the notch 2.4 and the washer 5.5 in sequence and screwed with a nut 5.6; the lower end of the stud 5.2 is screwed into the threaded hole on the bottom surface of the water container 1.3.

[0015] As another preferred embodiment, the support plate 2.3 of the present invention is connected to the bottom surface of the water container 1.3 on both sides by screws 2.2.

[0016] As another preferred embodiment, the semiconductor cooling chip 1.5 described in this invention is connected in series to the output terminal of the controllable power supply 3.3 via cable 3.4. The control signal input terminal of the controllable power supply 3.3 is connected to the control signal output terminal of the programmable logic controller (PLC) 3.2. The control signal input terminal of the PLC 3.2 is connected to the control signal output terminal of the processor 3.1. The detection signal output port of the temperature measuring thermocouple 1.6 is connected to the detection signal input port of the processor 3.1. The control signal output terminal of the PLC 3.2 is connected to the control signal input terminals of the stirrer motor 3.7, the circulation pump motor 3.8, and the heating component 3.9, respectively.

[0017] As another preferred embodiment, the heating element 3.9 of the present invention is a heating resistor.

[0018] As another preferred embodiment, the heating resistor of the present invention is connected to the bottom surface of the water container 1.3 by a buckle 4.3 and a screw. The heating resistor is arranged in a serpentine shape, and its two ends are connected to the wires 4.4.

[0019] Secondly, the relationship between the ratio of honeycomb ice retention strength to honeycomb tensile strength at freezing temperature and the elastic modulus of the honeycomb workpiece at freezing temperature is as follows:

[0020]

[0021] In the formula: P T(x,y,z) The holding strength of honeycomb ice in the x, y, and z directions (MPa), δ T The tensile strength of the honeycomb structure is given by (MPa), T is the temperature (°C), and E is the temperature. w The workpiece's elastic modulus (GPa), ΔL w For the radial dimension variation of the workpiece, ΔL i This represents the radial dimension variation of the ice.

[0022] Furthermore, the ice retention strength acquisition method described in this invention is as follows:

[0023] (1) Apply a force perpendicular to the table surface and upward to the honeycomb workpiece 1.11, gradually increasing the force until the honeycomb workpiece 1.11 loosens and falls off the holding processing equipment. Record the applied force F. z The z-axis holding effect of the holding processing equipment is achieved by the static friction between the ice in the honeycomb core injected into the honeycomb workpiece 1.11 and the n sidewalls of the honeycomb. During the processing, the static friction F between the honeycomb and the ice is... f With F zTo achieve equilibrium and prevent the honeycomb core from moving in the z-direction, the following formula expresses the honeycomb ice holding strength P in the z-direction. Tz ;

[0024]

[0025] In the formula: S z The total contact area between ice and the sidewall of a single cell (m²) 2 ).

[0026] (2) When the cell wall is subjected to a load F perpendicular to the cell wall r At that time, the ice holding strength P of the honeycomb wall in the x-direction is... Tx Equal to the compressive strength σ of ice Ti It is greater than the compressive stress of the honeycomb under load, and less than the ultimate tensile strength δ. T ;

[0027]

[0028] In the formula: F r The applied load (N) is α, and the angle between two adjacent sides of the cell is ( o ), S xy The contact area between the honeycomb wall and the applied load (m²) 2 ).

[0029] The beneficial effects of this invention.

[0030] This invention relates to a clamping device that utilizes the cooling function of a semiconductor and controls its ability to hold metal honeycomb, thereby enabling efficient clamping and high-precision machining of weak-rigidity metal honeycomb components.

[0031] This invention overcomes the shortcomings of conventional ice-holding capabilities and proposes a new method for holding metal honeycomb ice using semiconductor refrigeration. It is highly practical and adopts a universal fixture design concept, thereby ensuring the standardization and universality of the ice-holding fixture device in structural design, as well as the serialization of the series of fixture devices developed later.

[0032] The technical solution adopted in this invention is a semiconductor refrigeration method for holding and processing metal honeycomb ice. Semiconductor refrigeration is a technology that utilizes the Peltier effect of semiconductor materials to achieve cooling. The cooling capacity can be controlled by controlling the current flowing through the semiconductor thermocouple, and the direction of the current can be controlled to change the cooling and heating functions, facilitating the rapid melting of the ice after cooling. Attached Figure Description

[0033] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. The scope of protection of the present invention is not limited to the following description.

[0034] Figure 1-Cross-sectional view of the ice holding clamp device. Wherein: 1.1-clamp body, 1.2-fastener, 1.3-water container, 1.4-sealing ring, 1.5-semiconductor cooling chip, 1.6-temperature measuring thermocouple, 1.7-cooling water chamber (cooling water is drawn inside the cooling water chamber), 1.8-water inlet, 1.9-water outlet, 1.10-positioning device, 1.11-honeycomb workpiece.

[0035] Figure 2 - Top view of the ice-holding clamp device. Wherein 2.1-stirrer, 2.2-screw, 2.3-support plate, 5.4-positioning diamond pin, 5.7-positioning cylindrical pin, 2.6-screw, 2.7-pressure plate, 2.8-U-shaped opening, 2.9-pin hole.

[0036] Figure 3 - Layout diagram of a thermoelectric cooler. Where: 3.1-Processor, 3.2-Programmable Logic Controller (PLC), 3.3-Controllable Power Supply, 3.4-Cable, 1.5-Thermoelectric Cooler, 1.6-Thermocouple, 3.7-Stirrer Motor, 3.8-Circulating Pump Motor, 3.9-Heating Components.

[0037] Figure 4 - Heating system diagram. Where: 1.3-Water container, 4.3-Snap-fit, 4.4-Connecting wire.

[0038] Figure 5 , Figure 6 —Diagram of positioning device. Wherein: 5.1-disc, 5.2-stud, 5.3-nut, 5.4-positioning diamond pin, 5.5-washer, 5.6-nut 2, 5.7-positioning cylindrical pin.

[0039] Figure 7 - Diagram of support plates at different heights.

[0040] Figure 8 -Structural diagram of pressure plate related components.

[0041] Figure 9 - Temperature control flowchart. Detailed Implementation

[0042] like Figure 1As shown, the clamping process for the honeycomb workpiece 1.11 is as follows: First, the clamping body 1.1 is placed on a flat worktable. The water container 1.3 is fixed to the clamping body 1.1 using fasteners 1.2. The water container 1.3 is made of low thermal conductivity Ti-6Al-4V titanium alloy, and its surface is coated with a ZrO2 heat-insulating ceramic coating through micro-arc oxidation. The water inlet 1.8 is connected to a water pipe to inject cooling water into the cooling water chamber 1.7. While the cooling water is being injected into the cooling water chamber 1.7, the cooling water in the cooling water chamber 1.7 is simultaneously circulated by the circulating pump motor 3.8, completing the heat exchange process of the semiconductor refrigeration chip 1.5. The semiconductor refrigeration chip 1.5 cools on one side and heats on the other, requiring heat dissipation.

[0043] The water container 1.3 and the clamp body 1.1 are made into a detachable structure, which is simple to process and easy to process into a qualified shape to achieve the required function.

[0044] The inlet of the circulating pump can be connected to the outlet of the external water tank, the outlet of the circulating pump can be connected to the inlet 1.8, and the outlet 1.9 can be connected to the inlet of the external water tank.

[0045] like Figure 2 As shown, the stirrer 2.1 is installed on the side wall of the water container 1.3, and the support plate 2.3 is installed on the bottom surface of the water container 1.3 by screws 2.2. The honeycomb workpiece 1.11 is placed on the support plate 2.3, and the positioning device 1.10 is equipped with positioning pins (positioning diamond pin 5.4 and positioning cylindrical pin 5.7). The position of the positioning pins is adjusted so that they are inserted into the two positioning holes on the honeycomb workpiece 1.11, thereby restricting the degree of freedom of the honeycomb workpiece 1.11 and completing the positioning work.

[0046] like Figure 1 , 8 As shown, first, screw bolt 2.6 and screw 9.2 into the water container 1.3. Then, sequentially insert spring 9.3, washer 9.4, and pressure plate 2.7 onto bolt 2.6. Once the pressing end of pressure plate 2.7 contacts the upper surface of the honeycomb, adjust the height of screw 9.2 so that the top of screw 9.2 contacts the bottom surface of pressure plate 2.7, ensuring that pressure plate 2.7 remains horizontal. Next, insert washer 9.6 onto bolt 2.6. Finally, screw nut 9.7 onto bolt 2.6 and tighten it to complete the clamping operation.

[0047] The support plate 2.3 and the water container 1.3 can be detachably connected. The support plate 2.3 of different heights can be replaced according to the honeycomb height of the honeycomb workpiece 1.11. For example, a shorter support plate 2.3 can be selected for a high honeycomb.

[0048] The positioning cylindrical pin 5.7 restricts two translational degrees of freedom of the honeycomb workpiece 1.11, the rhomboid pin 5.4 restricts one rotational degree of freedom of the honeycomb workpiece 1.11, and the support plate 2.3 restricts two rotations and one translation of the honeycomb workpiece 1.11, for a total of six degrees of freedom, achieving complete positioning.

[0049] like Figure 3 As shown, the processor 3.1 is connected to the input terminal of the programmable logic controller (PLC) 3.2 using a cable, and the output terminal of the PLC 3.2 is connected to the input terminal of the controllable power supply 3.3 using a cable. The thermocouple 1.5 is connected in series with a cable and connected to the output terminal of the controllable power supply 3.3. The temperature measuring thermocouple 1.6 is connected to the processor 3.1. The stirrer motor 3.7, the circulating pump motor 3.8, and the heating element 3.9 are connected to the output terminal of the PLC 3.2.

[0050] like Figure 4 As shown, the heating element 3.9 is located on the bottom surface of the water container 1.3 and is fixed with clips 4.3 and screws. The two connectors of the heating element 3.9 are connected to the wires 4.4.

[0051] As another preferred embodiment, the buckle 4.3 of the present invention can be a U-shaped clip from the following URL: https: / / e.tb.cn / h.TkkMtkMs3rhPGBX?tk=ljTzedjzazdHU287.

[0052] like Figure 5 As shown, initially, nut 5.3 is not tightened, and rotating plate 5.1 can rotate around stud 5.2. The center hole of rotating plate 5.1 is a smooth hole without threads. Based on the deflection angle between the positioning hole on honeycomb workpiece 1.11 and the notch 2.4 of rotating plate 5.1, the rotation angle of rotating plate 5.1 is determined, allowing the positioning diamond pin 5.4 and positioning cylindrical pin 5.7 at notch 2.4 to be inserted into the positioning hole on honeycomb workpiece 1.11. Then, nut 5.3 is tightened to fix it, keeping rotating plate 5.1 stationary. Next, according to the radial dimension required by the center of the honeycomb positioning distance fixture 1.1, the positioning diamond pin 5.4 and positioning cylindrical pin 5.7 are slid laterally through notch 2.4 to the required position. Washers 5.5 and nut 5.6 are used to fix the position of positioning diamond pin 5.4 and positioning cylindrical pin 5.7, allowing them to be inserted into the two positioning holes on honeycomb workpiece 1.11.

[0053] To improve the clamping efficiency of honeycomb materials, reduce the freezing time, enable the clamping system to hold metal honeycomb workpieces in ice-freezing mode and maintain the frozen temperature, and simultaneously achieve rapid thawing and disassembly of the workpiece after honeycomb processing, the specific steps of the implementation method of this invention are as follows:

[0054] 1. When the sealing ring 1.4 and the thermoelectric cooler 1.5 are installed on the water container 1.3, the inner and outer surfaces of the sealing ring 1.4 need to be tightly attached to the water container 1.3 and the thermoelectric cooler 1.5, and their bottom surfaces need to be on the same surface. Only after the water pressure test shows no leakage can it be installed on the clamp 1.1.

[0055] 2. Based on the height and bottom surface of the honeycomb workpiece 1.11, select a support plate 2.3 that is adapted to the height of the honeycomb structure. Use a level to measure the top surface of the support plate 2.3 to ensure it is horizontal. This ensures that the bottom surface of the honeycomb workpiece 1.11 serves as a positioning surface, restricting the degrees of freedom of rotation along the x and y axes and movement along the z axis. The bottom surface of the honeycomb workpiece 1.11 must be horizontal, and the top surface of the support plate 2.3 must be in contact with the bottom surface of the honeycomb workpiece 1.11 to achieve the restriction of positioning degrees of freedom.

[0056] 3. When the positioning device 1.10 is installed in the blind hole in the middle position of the water container 1.3, it is necessary to ensure that the axis of the rotating plate 5.1 is perpendicular to the bottom surface of the clamp body 1.1, and at the same time, it is necessary to ensure that the axes of the positioning rhomboid pin 5.4 and the positioning cylindrical pin 5.7 are parallel to the axis of the rotating plate 5.1, so that the positioning cylindrical pin 5.7 restricts the movement in the x and y directions and the positioning rhomboid pin 5.4 restricts the rotational freedom of the z axis, which meets the requirements of the two-hole positioning method on one side and achieves complete positioning.

[0057] 4. After positioning, use the pressure plate 2.7 to clamp the non-machined area on the upper surface of the honeycomb workpiece 1.11, and then inject pure water into the water container 1.3.

[0058] The freezing temperature setting scheme is as follows:

[0059] At extremely low temperatures, the volume of ice increases as the temperature decreases. When ice is held in place, the lower the temperature, the smaller the volume of the metal honeycomb, and the greater the ice holding force on the honeycomb. However, due to the poor radial stiffness of the honeycomb, a greater holding force will affect the deformation of the honeycomb, thus affecting the dimensions after processing. It is necessary to set a balance between the honeycomb ice holding strength and the honeycomb tensile strength at freezing temperatures (-10℃ to -55℃), and their ratio should be related to the workpiece's elastic modulus at freezing temperatures as follows:

[0060]

[0061] In the formula: P T(x,y,z) The holding strength of honeycomb ice in the x, y, and z directions (MPa), δ T The tensile strength of the honeycomb structure is given by (MPa), T is the temperature (°C), and E is the temperature. w The workpiece's elastic modulus (GPa), ΔL w For the radial dimension variation of the workpiece, ΔL i This represents the radial dimension variation of the ice. The tensile strength of the honeycomb (MPa) δ T It can be measured through a laboratory tensile test. ΔL w This can be measured through laboratory tensile tests. Specifically, the above formula, when setting ice holding parameters, aims to prevent the honeycomb from failing to return to its original shape after being subjected to holding force and exhibiting plastic deformation. It requires that the ice holding strength and honeycomb tensile strength under ice holding conditions maintain a balanced state. This balance is specifically determined by the workpiece's elastic modulus E at a certain temperature.w Workpiece radial dimension variation ΔL w And the radial dimension change of ice ΔL i To measure.

[0062] The method for obtaining ice retention strength is as follows:

[0063] (1) Apply a force perpendicular to the table surface and upward to the honeycomb workpiece 1.11 (i.e., an upward force in the z direction, Fz, equivalent to pulling the honeycomb up), with the magnitude of the force gradually increasing (the initial value of the applied force can be set to 0, and then the honeycomb workpiece is pulled upward with a pulling force of 5 N / s) until the honeycomb core loosens and falls off the holding platform, and record the applied force F. z (i.e., the force that ultimately causes the honeycomb workpiece 1.11 to detach), the z-axis holding effect of the holding platform is achieved by the static friction between the ice injected into the honeycomb core and the n sidewalls of the honeycomb (each honeycomb wall and ice are in a relatively static state after being frozen and bonded together; when a load is applied to the honeycomb, static friction is generated between the honeycomb and the ice), during the processing, the static friction F between the honeycomb and the ice f With F z To achieve equilibrium and prevent the honeycomb core from shifting in the z-direction, the z-direction holding strength P is expressed by the following formula. Tz .

[0064]

[0065] In the formula: S z The total contact area between ice and the sidewall of a single cell (m²) 2 F z For the cutting force in the z direction, the ice holding point is to suppress the load (cutting force in the x and y directions).

[0066] For a regular hexagonal honeycomb, there is S z =6lz h Where l is the side length of the regular hexagon (m), z h Let be the height (m) along the z-axis of the honeycomb. The formula can be modified to...

[0067]

[0068] In the formula: m is the number of honeycomb cells in the honeycomb material.

[0069] (2) The purpose of ice retention is to improve the stiffness of the honeycomb in the x and y directions, that is, to improve the retention strength in the x and y directions. As long as the ice in the honeycomb does not deform, the honeycomb will not deform. When the honeycomb wall is subjected to a load F perpendicular to the honeycomb wall... r (That is, using a horizontal force, such as P) Tx When pushing and holding the honeycomb workpiece, the holding strength P of the honeycomb wall is... TxIt should be equal to the compressive strength σ of ice Ti At the same time, it should be greater than the compressive stress of the honeycomb under load, and less than the ultimate tensile strength δ. T .

[0070]

[0071] In the formula: F r The applied load (N) is α, and the angle between two adjacent sides of the cell is ( o ), S xy The contact area between the honeycomb wall and the applied load (m²) 2 P Ty Apply a horizontal force to the honeycomb workpiece after it has been held in place. Tx and P Ty These are the cutting forces in the x and y directions during actual machining.

[0072] The specific operation method of the device of the present invention is as follows:

[0073] 1. For example Figure 1 , 2 As shown, the sealing ring 1.4 is pressed into the square hole of the water container 1.3, and then the thermoelectric cooler 1.5 is installed into the sealing ring 1.4, ensuring that the sides of the thermoelectric cooler 1.5 and the sealing ring 1.4 are on the same plane as the corresponding sides of the water container 1.3.

[0074] 2. For example Figure 1 , 2 As shown, the temperature measuring thermocouple 1.6 is screwed into the hole of the water container 1.3, and four stirrers 2.1 are installed on the side wall of the water container 1.3. The temperature measuring thermocouple 1.6 and the stirrers 2.1 are then connected to the processor 3.1 using wires.

[0075] 3. For example Figure 3 As shown, each semiconductor cooling chip 1.5 is connected in series by a cable and sequentially connected to the programmable logic controller (PLC) 3.2 and the processor 3.1.

[0076] 4. For example Figure 4 As shown, the heating resistor 3.9 is placed in the water container 1.3 and fixed with the clip 4.3. The two connectors are connected to the wires 4.4, and then the wires 4.4 are connected to the processor 3.1.

[0077] 5. For example Figure 1 , 2 As shown, the support plate 2.3 is installed on the water container 1.3 using screws 2.2, ensuring that the top surface is parallel and meets the positioning requirements of the positioning surface of the honeycomb workpiece 1.11 to be processed.

[0078] 6. For example Figure 5As shown, based on the position of the positioning hole of the honeycomb workpiece 1.11, the circumferential angle and radial coordinate of the positioning cylindrical pin 5.7 and the positioning rhomboid pin 5.4 on the rotating plate 5.1 are adjusted to complete the assembly of the positioning device 1.10 component. Then, the installed positioning component is installed in the blind hole in the middle position of the water container 1.3.

[0079] 7. For example Figure 2 As shown, the positioning holes of the honeycomb workpiece 1.11 are inserted into the positioning pins (positioning cylindrical pin 5.7 and positioning diamond pin 5.4), and at the same time, the bottom surface of the honeycomb workpiece 1.11 and the top surface of the support plate 2.3 achieve planar contact positioning. Then, the pressure plate 2.7 achieves the clamping operation of the honeycomb workpiece 1.11.

[0080] 8. For example Figure 1 As shown, the assembled water container 1.3 is installed onto the fixture 1.1 using screws 1.2, and then the fixture 1.1 is clamped onto the CNC machine tool worktable. U-shaped openings 2.8 and pin holes 2.9 are provided on both sides of the fixture 1.1. The fixture 1.1 is fixed to the machine tool worktable using fixing bolts through the U-shaped openings 2.8, and then a locating pin is inserted into the pin hole 2.9 to position it with the worktable hole. Water is then injected into the inner cavity (cooling water cavity 1.7) through the water inlet 1.8 until it is full, while simultaneously injecting water into the water container 1.3 until the water just covers the workpiece.

[0081] 9. For example Figure 3 , 8 First, set the freezing temperature T in processor 3.1. 设 (T 设 (Can be set to -25℃), using thermocouple 1.6 to measure the temperature T of pure water in water container 1.3. 测 Then, by comparing T 设 and T 测 When ΔT=|T 测 -T 设 At temperatures ≥2℃, the processor 3.1 starts the programmable logic controller (PLC) 3.2, which in turn starts the controllable power supply 3.3. At this time, the semiconductor cooling chip 1.5 begins operation, and simultaneously, the stirrer motor 3.7 and the circulating pump motor 3.8 begin operation. When T... 测 At 0℃, the processor 3.1 controls the stirrer motor 3.7 to stop working; then when ΔT = |T 测 -T 设After maintaining a temperature below 2°C for 5 minutes, milling tool setting is performed, followed by starting the spindle for milling (the milling cutter enters from above the device to mill the honeycomb workpiece 1.11. The milling cutter processes the honeycomb workpiece 1.11 while it is frozen. The milling cutter first penetrates the ice before processing the honeycomb workpiece 1.11). Finally, after the honeycomb workpiece 1.11 is processed, the processor 3.1 controls the circulating pump motor 3.8 to stop working, and simultaneously starts the heating resistor 3.9 to heat the pure ice. After the pure ice melts, the honeycomb workpiece 1.11 is removed, completing the entire process of honeycomb ice holding processing.

[0082] Compared to existing offline freezing and holding methods for refrigerators, this invention provides a method for ice-fixed metal honeycomb processing in semiconductor refrigerators. It enhances honeycomb holding capacity, maintains a long-term holding state, and fully considers the influence of holding temperature, holding strength, and internal stress on holding accuracy. (With offline freezing and holding methods, the freezing temperature cannot be maintained over time; the ice melts and the temperature rises, causing changes in holding strength. Therefore, it is impossible to accurately guarantee the holding state and capacity, affecting processing accuracy. This invention, however, can maintain a stable freezing temperature, achieving precise holding and machinability.) It also meets the requirement for rapid ice melting (using a 3.9 ohm heating resistor) after processing, improving the cutting efficiency of thin-walled honeycomb materials in difficult-to-machine metals and suppressing processing defects such as edge curling, weld cracking, and deformation. This method can be effectively used on CNC machine tools for cutting difficult-to-machine metal honeycomb materials, achieving efficient cutting of difficult-to-machine thin-walled honeycomb material workpieces with weak stiffness.

[0083] The device of this invention can achieve controllable ice holding capacity, thereby improving the processing range of workpieces and the processing efficiency of metal honeycomb. (1) The adjustable positioning device 1.10 can realize the holding processing of metal honeycomb of different sizes, and the temperature control device and system can realize honeycomb processing with different holding state requirements. (2) Compared with traditional cutting, it improves cutting accuracy and processing efficiency. Compared with traditional offline ice holding, the temperature control device and system reduce the pre-freezing time, accurately maintain the ice holding temperature, and improve processing accuracy.

[0084] It is understood that the above specific description of the present invention is only for illustrating the present invention and is not limited to the technical solutions described in the embodiments of the present invention. Those skilled in the art should understand that modifications or equivalent substitutions can still be made to the present invention to achieve the same technical effect; as long as the use needs are met, they are all within the protection scope of the present invention.

Claims

1. A semiconductor refrigeration metal honeycomb ice holding and processing device, comprising a clamping body (1.1), characterized in that... A water container (1.3) is provided inside the clamp (1.1). A temperature measuring thermocouple (1.6) and a stirrer (2.1) are provided on the side wall of the water container (1.3). A heating element (3.9) is provided on the bottom surface of the water container (1.3). A semiconductor cooling chip (1.5) is provided on the side wall and the bottom surface of the water container (1.3). A water inlet (1.8) is provided on one side of the lower end of the clamp body (1.1), and a water outlet (1.9) is provided on the other side of the lower end of the clamp body (1.1); a cooling water cavity (1.7) is provided between the inner wall of the clamp body (1.1) and the outer wall of the water container (1.3), and between the inner bottom surface of the clamp body (1.1) and the outer bottom surface of the water container. A positioning device (1.10) for a honeycomb workpiece (1.11) is provided in the middle of the inner bottom surface of the water container (1.3), and a support plate (2.3) for the honeycomb workpiece (1.11) is provided on the inner bottom surface of the water container (1.3) on both sides of the positioning device (1.10). The upper end of the water container (1.3) is provided with a pressure plate (2.7) for the honeycomb workpiece (1.11). The positioning device (1.10) includes a rotating plate (5.1), a stud (5.2) with its upper end passing through the center hole of the rotating plate (5.1) and screwed with a nut (5.3), and horizontal notches (2.4) on both sides of the rotating plate (5.1); a positioning diamond pin (5.4) is provided at one notch (2.4), and a positioning cylindrical pin (5.7) is provided at the other notch (2.4); the screws at the lower ends of the positioning diamond pin (5.4) and the positioning cylindrical pin (5.7) pass through the notch (2.4) and the washer (5.5) in sequence and are screwed with a nut (5.6); the lower end of the stud (5.2) is screwed into the threaded hole on the bottom surface of the water container (1.3).

2. The semiconductor refrigeration metal honeycomb ice holding and processing equipment according to claim 1, characterized in that... The water container (1.3) has an outwardly extending connecting plate at its upper end, which is connected to the upper end of the clamping body (1.1) by fasteners (1.2).

3. The semiconductor refrigeration metal honeycomb ice holding and processing equipment according to claim 1, characterized in that... The water container (1.3) is made of low thermal conductivity Ti-6Al-4V titanium alloy material, and the surface of the water container (1.3) is coated with ZrO2 heat-insulating ceramic coating by micro-arc oxidation.

4. The semiconductor refrigeration metal honeycomb ice holding and processing equipment according to claim 1, characterized in that... The semiconductor cooling chip (1.5) is disposed in the holes on the side wall and bottom surface of the water container (1.3), and a sealing ring (1.4) is provided between the outer wall of the semiconductor cooling chip (1.5) and the hole wall.

5. A semiconductor refrigeration metal honeycomb ice holding and processing apparatus according to claim 1, characterized in that... Semiconductor cooling plates (1.5) are provided on the upper and lower parts of both side walls along the length of the water container (1.3), and semiconductor cooling plates (1.5) are provided on both sides of the bottom surface of the water container (1.3); thermocouples (1.6) are provided in the middle of both side walls along the length of the water container (1.3); and stirrers (2.1) are provided on both side walls along the width of the water container (1.3).

6. A semiconductor refrigeration metal honeycomb ice holding and processing apparatus according to claim 1, characterized in that... The semiconductor cooling chip (1.5) is connected in series and then connected to the output terminal of the controllable power supply (3.3) via a cable (3.4). The control signal input terminal of the controllable power supply (3.3) is connected to the control signal output terminal of the programmable controller (3.2). The control signal input terminal of the programmable controller (3.2) is connected to the control signal output terminal of the processor (3.1). The detection signal output port of the temperature measuring thermocouple (1.6) is connected to the detection signal input port of the processor (3.1). The control signal output terminal of the programmable controller (3.2) is connected to the control signal input terminal of the stirrer motor (3.7), the control signal input terminal of the circulating pump motor (3.8), and the control signal input terminal of the heating component (3.9), respectively.

7. A semiconductor refrigeration metal honeycomb ice holding and processing apparatus according to claim 1, characterized in that... The heating element (3.9) is a heating resistor.

8. A semiconductor refrigeration metal honeycomb ice holding and processing apparatus according to claim 1, characterized in that... The ratio of honeycomb ice holding strength to honeycomb tensile strength at freezing temperature is related to the elastic modulus (1.11) of the honeycomb workpiece at freezing temperature as follows: ； In the formula: P T(x,y,z) for x , y , z Directional cell ice holding strength (MPa) δ T The tensile strength of the honeycomb structure (MPa) T Temperature (°C) E w The workpiece's elastic modulus (GPa), ∆ L w For the radial dimension variation of the workpiece, ∆L i This represents the radial dimension variation of ice.

9. A semiconductor-cooled metal honeycomb ice holding and processing apparatus according to claim 8, characterized in that... The method for obtaining the ice holding strength is as follows: (1) Apply a force perpendicular to the table surface upward to the honeycomb workpiece (1.11), gradually increasing the force until the honeycomb workpiece (1.11) loosens and falls off from the holding processing equipment. Record the applied force. F z ; holding the processing equipment z The holding effect is achieved by the ice in the honeycomb core injected into the honeycomb workpiece (1.11) and the honeycomb... n This is achieved through static friction between the sidewalls; during processing, static friction occurs between the honeycomb and the ice. F f and F z To achieve balance and prevent the honeycomb core from being in z The movement occurs; expressed by the following formula. z Directional honeycomb ice holding strength P Tz ; ； In the formula: S z The total contact area between ice and a single cell sidewall (m²) 2 ). (2) When the cell wall is subjected to a load perpendicular to the cell wall F r At that time, the cell wall was subjected to x Directional honeycomb ice holding strength P Tx Equal to the compressive strength of ice σ Ti It is greater than the compressive stress of the honeycomb under load, but less than the ultimate tensile strength. δ T ; ； ； In the formula: F r For the applied load (N), α The included angle between two adjacent sides of the honeycomb ( o ), S xy The contact area between the honeycomb wall and the applied load (m²) 2 ).

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