Carrying mechanism, laser processing apparatus, and carrying method

Abstract

The disclosed carrying mechanism comprises a track assembly, a first carrying assembly and a second carrying assembly. The track assembly comprises a carrying track extending along a first direction; the first carrying assembly is slidingly connected to the carrying track and comprises a carrying unit and a first material taking unit, the carrying unit is used for taking material from a feeding position and discharging the material at a first preset position, and the first material taking unit is used for taking material from the first preset position, carrying the material along a second direction and discharging the material at a second preset position; the second carrying assembly is slidingly connected to the carrying track, and the second carrying assembly is used for taking material from the second preset position and discharging the material at a third preset position, and the first direction is perpendicular to the second direction. The disclosed carrying mechanism has the advantages of small volume and high integration, and is convenient for modular design. The application further discloses a laser processing device and a carrying method.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer processing, and more particularly to a conveying mechanism, a laser processing device and a conveying method. BACKGROUND

[0002] The conveying mechanism is a crucial component in many automated devices. For example, in a laser processing device for wafers, the conveying mechanism is responsible for performing the operations of taking, feeding and discharging wafers. Specifically, the conveying mechanism first takes a wafer from a storage bin, then sends it to a cleaning and coating mechanism for cleaning and coating treatment, after the treatment, the conveying mechanism carries the wafer to a processing platform for feeding, and after the processing, the conveying mechanism sends the wafer back to the storage bin for storage.

[0003] The prior art usually adopts three independent modules, i.e., a taking module, a feeding module and a discharging module, to respectively take care of the conveying work of wafers between the storage bin and the cleaning and coating mechanism, between the cleaning and coating mechanism and the processing platform, and between the processing platform and the storage bin. This design has the problems of large space occupation and high cost. Therefore, how to optimize the structure of the conveying mechanism to reduce the space occupation and cost has become a technical problem to be solved by the technical personnel in the field. SUMMARY

[0004] In view of the above, the purpose of the present application is to provide a conveying mechanism to reduce the space occupation and cost.

[0005] Another purpose of the present application is to provide a laser processing device comprising the above conveying mechanism.

[0006] Still another purpose of the present application is to provide a conveying method for conveying wafers from a storage bin to a processing platform by the above conveying mechanism.

[0007] To achieve the above purposes, the present application provides the following technical solutions:

[0008] A conveying mechanism, comprising:

[0009] a track assembly comprising a conveying track extending along a first direction;

[0010] a first conveying assembly slidingly connected to the conveying track, the first conveying assembly comprising a conveying unit and a first taking unit, the conveying unit being configured to take materials from a feeding position and discharge the materials at a first preset position, and the first taking unit being configured to take the materials from the first preset position and convey and discharge the materials at a second preset position along a second direction perpendicular to the first direction;

[0011] a second conveying assembly slidingly connected to the conveying track, the second conveying assembly being configured to take the materials from the second preset position and discharge the materials at a third preset position.

[0012] Optionally, in the conveying mechanism, the track assembly further comprises a conveying slider slidably arranged on the conveying track, and the first conveying assembly and the second conveying assembly are both slidably connected to the conveying track through the conveying slider.

[0013] Optionally, in the conveying mechanism, the first material taking unit comprises:

[0014] a first lifting mechanism arranged on the conveying slider;

[0015] a second lifting mechanism arranged on the first lifting mechanism;

[0016] a first suction disc assembly arranged on the second lifting mechanism and comprising a plurality of first suction discs for suctioning materials, the first suction discs being formed with suction planes for suctioning materials;

[0017] wherein the first lifting mechanism is configured to drive the second lifting mechanism to move the first suction disc assembly along the second direction by a first preset distance, the first preset distance being equal to a distance between the first preset position and the second preset position, and the second lifting mechanism is configured to drive the first suction disc assembly to move along the second direction by a second preset distance.

[0018] Optionally, in the conveying mechanism, the conveying unit comprises:

[0019] a rotating mechanism arranged on the conveying slider or the first material taking unit;

[0020] a clamping jaw assembly connected to the rotating mechanism and configured to clamp materials;

[0021] wherein the rotating mechanism is configured to drive the clamping jaw assembly to rotate and switch between a first pose and a second pose, when the clamping jaw assembly is in the first pose, the clamping jaw assembly is configured to clamp materials, and when the clamping jaw assembly is in the second pose, the clamping jaw assembly avoids the suction planes.

[0022] Optionally, in the conveying mechanism, the clamping jaw assembly comprises a first clamping plate, a second clamping plate and a clamping jaw driving member, the first clamping plate is connected to the rotating mechanism, the clamping jaw driving member is arranged on the first clamping plate and connected to the second clamping plate, and is configured to drive the second clamping plate to move towards or away from the first clamping plate.

[0023] Optionally, in the conveying mechanism, the first clamping plate and the second clamping plate are both provided with elastic buffer pads on the side facing each other.

[0024] Optionally, in the conveying mechanism, the second conveying assembly comprises a second material taking unit and a third lifting mechanism, the third lifting mechanism is arranged on the conveying slider, and the second material taking unit is connected with the third lifting mechanism, and the third lifting mechanism is used for driving the second material taking unit to move a third preset distance along the second direction.

[0025] Optionally, in the conveying mechanism, the second material taking unit comprises a plurality of second suction cups used for adsorbing materials; and / or,

[0026] The first preset distance is equal to the third preset distance.

[0027] A laser processing device comprises a material bin, a shaping mechanism, a cleaning and coating mechanism, a processing platform and the conveying mechanism.

[0028] The conveying track extends to the material bin, the shaping mechanism and the processing platform, the cleaning and coating mechanism is arranged below the shaping mechanism, the feeding position is located in the material bin, the first preset position is located on the shaping mechanism, the second preset position is located on the cleaning and coating mechanism, and the third preset position is located on the processing platform.

[0029] A conveying method is used for conveying materials from a material bin to a processing platform by the conveying mechanism, and comprises the following steps:

[0030] Material bin discharging, the conveying slider moves to the material bin along the conveying track, and the conveying unit takes materials from a feeding position of the material bin;

[0031] Shaping, the conveying slider moves to the shaping mechanism along the conveying track, the conveying unit discharges materials at a first preset position on the shaping mechanism, and the shaping mechanism shapes the materials;

[0032] Cleaning and coating, the first material taking unit takes materials from the first preset position and discharges the materials at a second preset position on the cleaning and coating mechanism, and the cleaning and coating mechanism cleans and coats the materials;

[0033] Platform feeding, the second conveying assembly takes materials from the second preset position, the conveying slider moves to the processing platform along the conveying track, the second conveying assembly discharges the materials at a third preset position on the processing platform, and the processing platform processes the materials.

[0034] Optionally, in the conveying method, the method further comprises the following steps:

[0035] Platform unloading and cleaning, the carrying slider moves along the carrying track to the processing platform, the second carrying assembly is taken by the third preset position, the carrying slider moves along the carrying track to the shaping mechanism, the second carrying assembly unloads the material at the second preset position, and the cleaning and coating mechanism cleans the material;

[0036] Hopper feeding, the first taking unit takes the material from the second preset position and unloads it at the first preset position, the carrying unit takes the material from the first preset position, the carrying slider moves along the carrying track to the hopper, and the carrying unit unloads the material at the unloading position of the hopper.

[0037] Optionally, in the carrying method, the method further comprises the following steps:

[0038] Platform unloading, the carrying slider moves along the carrying track to the processing platform, the second carrying assembly is taken by the third preset position, the carrying slider moves along the carrying track to the shaping mechanism, the second carrying assembly unloads the material at the first preset position;

[0039] Hopper feeding, the carrying unit takes the material from the first preset position, the carrying slider moves along the carrying track to the hopper, and the carrying unit unloads the material at the unloading position of the hopper.

[0040] The carrying mechanism comprises a track assembly, a first carrying assembly and a second carrying assembly. The track assembly comprises a carrying track extending in a first direction; the first carrying assembly is slidably connected to the carrying track and comprises a carrying unit and a first taking unit, the carrying unit is used for taking the material from a feeding position and unloading the material at a first preset position, and the first taking unit is used for taking the material from the first preset position, carrying the material in a second direction and unloading the material at a second preset position; the second carrying assembly is slidably connected to the carrying track, and the second carrying assembly is used for taking the material from the second preset position and unloading the material at a third preset position, and the first direction is perpendicular to the second direction.

[0041] With the material as the wafer as an example, the wafer needs to be first transported from the warehouse to the regular mechanism to regularize the posture, and then be transported to the cleaning and coating mechanism to be cleaned and coated, after the cleaning and coating are completed, the wafer needs to be transported to the processing platform for processing, and the wafer after processing needs to be transported back to the warehouse. Among them, the transport track extends to the warehouse, the regular mechanism and the processing platform, and the regular mechanism is located directly above the cleaning and coating mechanism, so that the first transport assembly and the second transport assembly can transport the wafer along the transport track between the warehouse, the regular mechanism, the cleaning and coating mechanism and the processing platform. Specifically, the transport unit can take out the wafer from the warehouse and move to the regular mechanism through sliding movement on the transport track, and the transport unit can unload the wafer at the first preset position on the regular mechanism for regularizing; after the regularizing is completed, the first material taking unit grabs the material and moves to the cleaning and coating mechanism along the second direction until the wafer is placed on the second preset position on the cleaning and coating mechanism; after the wafer is cleaned and coated by the cleaning and coating mechanism, the second transport assembly can take the wafer from the second preset position and transport it to the third preset position on the processing platform. The wafer before and after cleaning is transported by the first material taking unit and the second transport assembly respectively, which can avoid secondary pollution. The wafer after processing can return according to the above steps, which will not be described here.

[0042] Compared with the prior art, the transport mechanism provided by the application realizes the circulation of the wafer between the warehouse, the regular mechanism, the cleaning and coating mechanism and the processing platform through the same module, has the advantages of small size and high integration, and is convenient for modular design.

[0043] The laser processing equipment provided by the application includes a warehouse, a regular mechanism, a cleaning and coating mechanism, a processing platform and the above-mentioned transport mechanism. The transport track extends to the warehouse, the regular mechanism and the processing platform, and the cleaning and coating mechanism is arranged below the regular mechanism, the first preset position is arranged on the regular mechanism, the second preset position is arranged on the cleaning and coating mechanism, and the third preset position is arranged on the processing platform. Since the above-mentioned transport mechanism is included, the same also has the above-mentioned structure and beneficial effects, and other structures refer to the prior art, which will not be described here.

[0044] The carrying method provided by the present application is used for carrying materials by the carrying mechanism, and comprises a silo discharging step, a shaping step, a cleaning and coating step and a platform feeding step. The silo discharging step specifically comprises moving the first carrying assembly to the silo along the carrying track, and taking the materials from the feeding position of the silo by the carrying unit. The shaping step specifically comprises moving the first carrying assembly to the shaping mechanism along the carrying track, and discharging the materials by the carrying unit at the first preset position on the shaping mechanism, so that the shaping mechanism shapes the materials to keep the materials in a unified posture. The cleaning and coating step specifically comprises taking the materials by the first carrying unit from the first preset position and discharging the materials by the first carrying unit at the second preset position on the cleaning and coating mechanism, so that the cleaning and coating mechanism cleans and coats the materials. The platform feeding step specifically comprises taking the materials by the second carrying assembly from the second preset position, moving the second carrying assembly to the processing platform along the carrying track, discharging the materials by the second carrying assembly at the third preset position on the processing platform, and processing the materials by the processing platform. Compared with the prior art, the carrying method provided by the present application has the advantages of simple and convenient operation. BRIEF DESCRIPTION OF DRAWINGS

[0045] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor based on these drawings.

[0046] Figure 1 The overall structure schematic diagram of the carrying mechanism disclosed by the embodiments of the present application;

[0047] Figure 2 The structure schematic diagram of the first carrying assembly disclosed by the embodiments of the present application Figure One ;

[0048] Figure 3 The structure schematic diagram of the first carrying assembly disclosed by the embodiments of the present application Figure Two ;

[0049] Figure 4 The structure schematic diagram of the first carrying assembly disclosed by the embodiments of the present application Figure Three ;

[0050] Figure 5 The structure schematic diagram of the first carrying assembly disclosed by the embodiments of the present application Figure Four ;

[0051] Figure 6 The structure schematic diagram of the carrying unit disclosed by the embodiments of the present application Figure One ;

[0052] Figure 7Structure diagram of the carrying unit disclosed in the embodiment of the present application Figure Two ;

[0053] Figure 8 Structure diagram of the carrying mechanism disclosed in the embodiment of the present application

[0054] Figure 9 Structure diagram of the laser processing device disclosed in the embodiment of the present application.

[0055] Wherein, 100 is a carrying slider, 101 is a carrying track, 110 is a carrying unit, 111 is a rotating mechanism, 112 is a jaw driving element, 113 is a first clamping plate, 114 is a second clamping plate, 120 is a first material taking unit, 121 is a first lifting mechanism, 122 is a second lifting mechanism, 123 is a first suction disc assembly, 130 is a second carrying assembly, 131 is a third lifting mechanism, 200 is a material bin, 300 is a shaping mechanism, 400 is a cleaning and coating mechanism, 500 is a processing platform, and 600 is a wafer. DETAILED DESCRIPTION

[0056] The core of the present application is to disclose a carrying mechanism to reduce space occupation and cost.

[0057] Another core of the present application is to disclose a laser processing device comprising the above-mentioned carrying mechanism.

[0058] Still another core of the present application is to disclose a carrying method for carrying a wafer from a material bin to a processing platform by the above-mentioned carrying mechanism.

[0059] Hereinafter, the embodiments will be described with reference to the accompanying drawings. In addition, the embodiments shown below do not have any limiting effect on the invention content recited in the claims. In addition, the entire content of the configuration represented in the following embodiments is not limited to what is necessary as a solution to the invention recited in the claims. It should be noted that only the parts related to the invention are shown in the drawings for ease of description. In the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0060] In combination Figures 1-8The carrying mechanism comprises a track assembly, a first carrying assembly and a second carrying assembly 130. The track assembly comprises a carrying track 101 extending in a first direction; the first carrying assembly is slidingly connected to the carrying track 101 and comprises a carrying unit 110 and a first material taking unit 120, the carrying unit 110 is used for taking material from a feeding position and feeding the material at a first preset position, and the first material taking unit 120 is used for taking material from the first preset position, carrying the material in a second direction and feeding the material at a second preset position; the second carrying assembly 130 is slidingly connected to the carrying track 101, and the second carrying assembly 130 is used for taking material from the second preset position and feeding the material at a third preset position. The first direction is generally perpendicular to the second direction, and the first carrying assembly and the second carrying assembly 130 can be connected or not connected.

[0061] Taking the material as a wafer 600, the wafer 600 needs to be carried by the stock bin 200 to the regularizing mechanism 300 first to be regularized in posture, and then carried to the cleaning and coating mechanism 400 to be cleaned and coated, after the cleaning and coating are completed, the wafer 600 needs to be carried to the processing platform 500 to be processed, and the processed wafer 600 needs to be carried back to the stock bin 200. The carrying track 101 extends to the stock bin 200, the regularizing mechanism 300 and the processing platform 500, and the regularizing mechanism 300 is located directly above the cleaning and coating mechanism 400, so that the first carrying assembly and the second carrying assembly 130 can carry the wafer 600 between the stock bin 200, the regularizing mechanism 300, the cleaning and coating mechanism 400 and the processing platform 500 along the carrying track 101.

[0062] Specifically, the carrying unit 110 can take out the wafer 600 from the stock bin 200 and move to the regularizing mechanism 300 by sliding on the carrying track 101, and the carrying unit 110 can feed the wafer 600 at the first preset position on the regularizing mechanism 300 for regularizing; after the regularizing is completed, the first material taking unit 120 takes the material and moves to the cleaning and coating mechanism 400 in the second direction until the wafer 600 is placed at the second preset position on the cleaning and coating mechanism 400; after the wafer 600 is cleaned and coated by the cleaning and coating mechanism 400, the second carrying assembly 130 can take the wafer 600 from the second preset position and carry it to the third preset position on the processing platform 500. The wafers 600 before and after cleaning are carried by the first material taking unit 120 and the second carrying assembly 130 respectively, which can avoid secondary pollution. The processed wafer 600 can return according to the above steps, which will not be described here.

[0063] Compared with the prior art, the carrying mechanism disclosed by the application realizes the flow between the stock bin 200, the shaping mechanism 300, the cleaning and coating mechanism 400 and the processing platform 500 through the same module, has the advantages of small volume and high integration, and facilitates modular design.

[0064] Specifically, the track assembly further comprises a carrying slider 100 slidably arranged on the carrying track 101, and the first carrying assembly and the second carrying assembly 130 are both slidably connected to the carrying track 101 through the carrying slider 100, and the first carrying assembly and the second carrying assembly 130 share the same track and move together.

[0065] In an embodiment, the first material taking unit 120 comprises a first lifting mechanism 121, a second lifting mechanism 122 and a first suction disc assembly 123, the first lifting mechanism 121 is arranged on the carrying slider 100, the second lifting mechanism 122 is arranged on the first lifting mechanism 121, and the first suction disc assembly 123 is arranged on the second lifting mechanism 122 and comprises a plurality of first suction discs for adsorbing materials, each first suction disc forms an adsorption plane for adsorbing materials. Specifically, the first lifting mechanism 121 and the second lifting mechanism 122 both comprise a pneumatic cylinder. The first material taking unit 120 disclosed by the application can be used to compatibly adsorb materials of different sizes and has high practicability. The carrying unit 110 can be arranged on the carrying slider 100, the first lifting mechanism 121, the second lifting mechanism 122 or the first suction disc assembly 123.

[0066] The wafer 600 is carried by the carrying unit 110 to the first preset position for shaping, in the process, the first suction disc assembly 123 needs to avoid the carrying unit 110 and the wafer 600 carried by the carrying unit 110, and after the wafer 600 is shaped at the first preset position, the second lifting mechanism 122 is used to drive the first suction disc assembly 123 to move in the second direction by a second preset distance, so that the first suction disc can move to a position where the wafer 600 located at the first preset position can be adsorbed, after adsorption is completed, the first lifting mechanism 121 drives the first suction disc assembly 123 to move in the second direction by a first preset distance, so that the wafer 600 can be moved from the first preset position to the second preset position, and the wafer 600 is placed on the cleaning and coating mechanism 400, that is, the first preset distance is equal to the interval distance between the first preset position and the second preset position.

[0067] It can be understood by those skilled in the art that the first lifting mechanism 121 and the second lifting mechanism 122 can also realize their functions by interchanging positions.

[0068] In one embodiment, the conveying unit 110 includes a rotating mechanism 111 and a gripper assembly. The rotating mechanism 111 is disposed on the conveying slider 100 or the first material handling unit 120. The gripper assembly is connected to the rotating mechanism 111 and is used to grip materials. The rotating mechanism 111 is used to move along... Figure 6 The direction indicated by the middle arrow drives the gripper assembly to rotate and switch between a first position and a second position. When the gripper assembly is in the first position, it grips the material; when it is in the second position, it avoids the suction plane of the first suction cup assembly 123. By properly placing the wafer 600 at a first preset position, the first conveying assembly can switch between the conveying unit 110 and the first picking unit 120, thereby enabling the wafer 600 to be moved in different directions.

[0069] Specifically, in combination Figure 6 and Figure 7 The gripper assembly includes a first clamping plate 113, a second clamping plate 114, and a gripper drive 112. The first clamping plate 113 is connected to the rotating mechanism 111. The gripper drive 112 is disposed on the first clamping plate 113 and connected to the second clamping plate 114, and can drive the second clamping plate 114 to move towards or away from the first clamping plate 113, thereby gripping the material. The conveying unit 110 disclosed in this invention can compatiblely grip materials of different sizes and has strong practicality.

[0070] To further optimize the design, elastic buffer pads are provided on the facing surfaces of the first clamping plate 113 and the second clamping plate 114 to avoid damage to the wafer 600 during the clamping process.

[0071] Combination Figure 1 The second conveying assembly 130 includes a second material-grabbing unit and a third lifting mechanism 131. The third lifting mechanism 131 is disposed on the conveying slider 100, and the second material-grabbing unit is connected to the third lifting mechanism 131. The third lifting mechanism 131 is used to drive the second material-grabbing unit to move a third preset distance along a second direction. Specifically, the third lifting mechanism 131 includes a cylinder, and the second material-grabbing unit includes multiple second suction cups for adsorbing materials. The second material-grabbing unit disclosed in this invention can compatiblely adsorb materials of different sizes, making it highly practical.

[0072] The scheme is further optimized so that the loading position and the first preset position are on the same straight line along the first direction, which makes it convenient for the handling unit 110 to directly drag the wafer 600 from the loading position to the first preset position by the translational movement of the handling slider 100 on the handling track 101.

[0073] Further, the third preset position is in line with the first preset position or the second preset position in the first direction, so that the wafer 600 can be directly translated between the first preset position or the second preset position and the third preset position by the translation of the handling slider 100 on the handling track 101 after the wafer 600 is adsorbed by the second handling assembly 130.

[0074] After the wafer 600 is processed, if it does not need to be cleaned and can be directly stored in the stocker 200, preferably, the third preset position is in line with the first preset position in the first direction, i.e., the first preset distance is equal to the third preset distance, so that after the wafer 600 is processed, the second handling assembly 130 can directly carry the wafer 600 from the processing platform 500 to the regularizing mechanism 300 by the translation of the handling slider 100 on the handling track 101, and then the wafer 600 is directly carried back to the stocker 200 by the handling unit 110 without going through the second preset position on the cleaning and coating mechanism 400 and the handover of the first material taking unit 120. Correspondingly, in combination with the above description of the first embodiment, the third preset position is in line with the second preset position in the first direction, so that the wafer 600 can be directly carried from the processing platform 500 to the cleaning and coating mechanism 400 by the translation of the handling slider 100 on the handling track 101 after the wafer 600 is processed, and then the wafer 600 is directly carried to the regularizing mechanism 300 by the translation of the handling slider 100 on the handling track 101 without going through the first preset position on the first material taking unit 120 and the handover of the second material taking unit. Figure 8 In the loading process, after the second material taking unit takes the material at the second preset position, the third lifting mechanism 131 drives the second material taking unit to move the material from the second preset position to the first preset position, and then the material is carried from the first preset position to the third preset position by the movement of the handling slider 100 on the handling track 101.

[0075] In combination with the above description of the first embodiment, Figure 1 The first handling assembly and the second handling assembly 130 can be respectively installed on the opposite two sides of the handling slider 100 to avoid mutual interference.

[0076] In some embodiments, the handling mechanism disclosed in the present application further comprises a sensing assembly, which includes but is not limited to a position sensor for detecting the specific position of the handling slider 100 on the handling track 101, a position sensor for detecting whether the extension stroke of each cylinder is in place, etc. The arrangement position of each sensor can be adjusted according to the actual situation, which will not be described here.

[0077] In combination with the above description of the first embodiment, Figure 8 and Figure 9The laser processing equipment disclosed by the application comprises a hopper 200, a shaping mechanism 300, a cleaning and coating mechanism 400, a processing platform 500 and the above-mentioned conveying mechanism. The conveying track 101 extends to the hopper 200, the shaping mechanism 300 and the processing platform 500, and the cleaning and coating mechanism 400 is arranged below the shaping mechanism 300. The feeding position is located in the hopper 200, the first preset position is located on the shaping mechanism 300, the second preset position is located on the cleaning and coating mechanism 400, and the third preset position is located on the processing platform 500. Since the conveying mechanism is included, the above-mentioned structure and beneficial effects are also possessed, and other structures refer to the prior art and will not be described here. The laser processing equipment can be a laser cutting machine.

[0078] It should be noted that, after the shaping mechanism 300 completes the shaping of the material, in order to avoid affecting the conveying mechanism and the movement of the material in the second direction, the two shaping parts of the shaping mechanism 300 move to the avoiding positions in the direction away from each other, so as to facilitate the conveying mechanism to lift the material.

[0079] Those skilled in the art can understand that the laser processing equipment disclosed by the application can process two wafers 600 at the same time, specifically, during the process of processing the first wafer 600 by feeding it on the processing platform 500, the conveying mechanism can convey the second wafer 600, and during the cleaning and coating process of the second wafer 600, the conveying mechanism can feed the first wafer 600, so as to improve the work efficiency.

[0080] In addition, according to the actual situation, the processed wafer 600 can be cleaned at the cleaning and coating mechanism 400 during the feeding process, or directly conveyed back to the hopper 200.

[0081] In an embodiment, the laser processing equipment further comprises an ion wind rod, and the conveying track 101 extends to the position of the ion wind rod, so as to remove static electricity during the conveying of the wafer 600, and prevent damage to the wafer 600 and the equipment.

[0082] The conveying method disclosed by the application is used for conveying the material by the above-mentioned conveying mechanism, and comprises the following steps.

[0083] S10, hopper feeding;

[0084] The conveying slider 100 drives the first conveying assembly to move along the conveying track 101 to the hopper 200, and the conveying unit 110 takes the material from the feeding position of the hopper 200.

[0085] S20, shaping;

[0086] The carrying slider 100 drives the first carrying assembly to move along the carrying track 101 to the regularizing mechanism 300, and the carrying unit 110 discharges the material at a first preset position on the regularizing mechanism 300. The regularizing mechanism 300 regularizes the material to keep the material in a uniform posture.

[0087] S30, cleaning and coating;

[0088] The first taking unit 120 takes the material from the first preset position and discharges the material at a second preset position on the cleaning and coating mechanism 400. The cleaning and coating mechanism 400 cleans and coats the material.

[0089] It can be understood that, between S20 and S30, S21 is further included, that is, two regularizing members of the regularizing mechanism 300 move away from each other to avoid the movement of the carrying mechanism and the material in the second direction.

[0090] S40, platform feeding;

[0091] The second carrying assembly 130 takes the material from the second preset position, the carrying slider 100 drives the second carrying assembly 130 to move along the carrying track 101 to the processing platform 500, and the second carrying assembly 130 discharges the material at a third preset position on the processing platform 500. The processing platform 500 processes the material.

[0092] Compared with the prior art, the carrying method disclosed by the present application has the advantages of simple and convenient operation.

[0093] In an embodiment, in combination with Figure 8 S40 specifically includes that the second taking unit takes the material from the second preset position, the third lifting mechanism 131 drives the second taking unit to move the material from the second preset position to the first preset position, and then the carrying slider 100 moves along the carrying track 101 to the processing platform 500. The second taking unit discharges the material at the third preset position.

[0094] Further, the carrying method further includes the process of carrying the material back to the material bin 200 from the processing platform 500. If the material needs to be cleaned before being sent back to the material bin 200 in the process, the following steps are specifically included.

[0095] S50, platform discharging and cleaning;

[0096] The carrying slider 100 drives the second carrying assembly 130 to move along the carrying track 101 to the processing platform 500, the second carrying assembly 130 takes the material from the third preset position, the carrying slider 100 drives the second carrying assembly 130 to move along the carrying track 101 to the regularizing mechanism 300, the second carrying assembly 130 discharges the material at the second preset position, and the cleaning and coating mechanism 400 cleans the material.

[0097] S60, bin feeding;

[0098] The first taking unit 120 takes the material from the second preset position and feeds it at the first preset position, the carrying unit 110 takes the material from the first preset position, the carrying slider 100 drives the first carrying assembly to move along the carrying track 101 to the bin 200, and the carrying unit 110 feeds the material at the feeding position of the bin 200.

[0099] If the material does not need to be cleaned after processing and can be directly sent back to the bin 200, the carrying method further includes the following steps.

[0100] S51, platform feeding;

[0101] The carrying slider 100 drives the second carrying assembly 130 to move along the carrying track 101 to the processing platform 500, the second carrying assembly 130 takes the material from the third preset position, the carrying slider 100 drives the second carrying assembly 130 to move along the carrying track 101 to the shaping mechanism 300, and the second carrying assembly 130 feeds the material at the first preset position.

[0102] S61, bin feeding;

[0103] The carrying unit 110 takes the material from the first preset position, the carrying slider 100 drives the first carrying assembly to move along the carrying track 101 to the bin 200, and the carrying unit 110 feeds the material at the feeding position of the bin 200 for storage.

[0104] The terms "first" and "second" and the like in the description and claims of the application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. Terms "including" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion such that a process, method, system, article, or apparatus that comprises a list of elements is not necessarily limited to those elements, but can include other elements not expressly listed or inherent to such process, method, system, article, or apparatus. Also, the term "about" means that quantities, dimensions, notations, and other applied values and such terms are intended to allow for a level of variability to be expected by those of ordinary skill in the field, for example, due to physical and / or environmental limitations, manufacturing processes, measurements of values, and errors in measurements. Therefore, the term "about" refers to the intended value and a reasonable range around that intended value. Moreover, the term "about" covers any and all combinations of one or more terms "about." The terms "plurality" and "a plurality" contain the meaning of "multiple" or "two or more" unless otherwise indicated by the context.

[0105] The above description of disclosed embodiments provides enabling disclosure sufficient for one of ordinary skill in the art to implement or use the application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. The specific features of some embodiments can be combined with the specific features of other embodiments, in whole or in part, unless explicitly excluded from doing so by another embodiment. Therefore, the application is not to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A carrying mechanism characterized by, The utility model relates to a material handling system, comprising: a track assembly comprising a conveying track (101) extending along a first direction; a first conveying assembly slidingly connected to the conveying track (101) and comprising a conveying unit (110) for taking materials from a feeding position and discharging the materials at a first preset position, and a first taking unit (120) for taking materials from the first preset position and conveying and discharging the materials at a second preset position along a second direction perpendicular to the first direction; a second conveying assembly (130) slidingly connected to the conveying track (101) and used for taking materials from the second preset position and discharging the materials at a third preset position; the track assembly further comprises a conveying slider (100) slidingly arranged on the conveying track (101), and the first conveying assembly and the second conveying assembly (130) are both slidingly connected to the conveying track (101) through the conveying slider (100); the first taking unit (120) comprises a first lifting mechanism (121) and a second lifting mechanism (122), the first lifting mechanism (121) is arranged on the conveying slider (100), and the second lifting mechanism (122) is arranged on the first lifting mechanism (121).

2. The transport mechanism of claim 1, wherein, the first taking unit (120) comprises a first suction disc assembly (123) arranged on the second lifting mechanism (122) and comprising a plurality of first suction discs for adsorbing materials, and the first suction discs form an adsorption plane for adsorbing materials; the first lifting mechanism (121) is used to drive the second lifting mechanism (122) to move the first suction disc assembly (123) along the second direction by a first preset distance, and the first preset distance is equal to the interval distance between the first preset position and the second preset position; and the second lifting mechanism (122) is used to drive the first suction disc assembly (123) to move along the second direction by a second preset distance.

3. The transport mechanism of claim 2, wherein, the conveying unit (110) comprises: a rotating mechanism (111) arranged on the conveying slider (100) or the first taking unit (120); a gripper assembly connected to the rotating mechanism (111) and used for clamping materials; wherein the rotating mechanism (111) is used to drive the gripper assembly to rotate and switch between a first pose and a second pose, when the gripper assembly is in the first pose, the gripper assembly is used for clamping materials, and when the gripper assembly is in the second pose, the gripper assembly avoids the adsorption plane.

4. The transport mechanism of claim 3, wherein The clamping jaw assembly comprises a first clamping plate (113), a second clamping plate (114) and a clamping jaw driving member (112), the first clamping plate (113) is connected with the rotating mechanism (111), the clamping jaw driving member (112) is arranged on the first clamping plate (113) and connected with the second clamping plate (114) and used to drive the second clamping plate (114) to move towards or away from the first clamping plate (113).

5. The transport mechanism of claim 4, wherein, The first clamping plate (113) and the second clamping plate (114) are both provided with elastic buffer pads on the sides facing each other.

6. The transport mechanism of claim 2, wherein, The second carrying assembly (130) comprises a second material taking unit and a third lifting mechanism (131), the third lifting mechanism (131) is arranged on the carrying slider (100), the second material taking unit is connected with the third lifting mechanism (131), and the third lifting mechanism (131) is used to drive the second material taking unit to move along the second direction by a third preset distance.

7. The transport mechanism of claim 6, wherein, The second material taking unit comprises a plurality of second suction discs used for adsorbing materials; and / or, The first preset distance is equal to the third preset distance.

8. A laser processing apparatus characterized by comprising: The system comprises a material bin (200), a shaping mechanism (300), a cleaning and coating mechanism (400), a processing platform (500) and the carrying mechanism according to any one of claims 1-7. The carrying track (101) extends to the material bin (200), the shaping mechanism (300) and the processing platform (500), the cleaning and coating mechanism (400) is arranged below the shaping mechanism (300), the feeding position is located in the material bin (200), the first preset position is located on the shaping mechanism (300), the second preset position is located on the cleaning and coating mechanism (400), and the third preset position is located on the processing platform (500).

9. A method of handling, characterized by A method for carrying materials from a material bin (200) to a processing platform (500) by the carrying mechanism according to any one of claims 1-7, comprising the steps of: Material bin discharging, the first carrying assembly moves to the material bin (200) along the carrying track (101), and the carrying unit (110) takes materials from the feeding position of the material bin (200); Shaping, the first carrying assembly moves to the shaping mechanism (300) along the carrying track (101), and the carrying unit (110) discharges materials at the first preset position on the shaping mechanism (300), and the shaping mechanism (300) shapes the materials; Cleaning and coating, the first material taking unit (120) takes materials from the first preset position and discharges the materials at the second preset position on the cleaning and coating mechanism (400), and the cleaning and coating mechanism (400) cleans and coats the materials; Platform loading, the second carrying assembly (130) is taken by the second preset position, the second carrying assembly (130) moves to the processing platform (500) along the carrying track (101), and the second carrying assembly (130) unloads the material at the third preset position on the processing platform (500), and the processing platform (500) processes the material.

10. The handling method of claim 9, wherein, Further comprising steps: Platform unloading cleaning, the second carrying assembly (130) moves to the processing platform (500) along the carrying track (101), the second carrying assembly (130) is taken by the third preset position, the second carrying assembly (130) moves to the regular mechanism (300) along the carrying track (101), and the second carrying assembly (130) unloads the material at the second preset position, and the cleaning coating mechanism (400) cleans the material; Bin feeding, the first taking unit (120) is taken by the second preset position and unloaded at the first preset position, the carrying unit (110) is taken by the first preset position, the first carrying assembly moves to the bin (200) along the carrying track (101), and the carrying unit (110) unloads the material at the unloading position of the bin (200).

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