Test unit sample preparation device and sample preparation method applied to heat transport test

Abstract

The invention relates to the technical field of heat transport test sample preparation, and discloses a test unit sample preparation device applied to heat transport test and a sample preparation method, the test unit sample preparation device comprises a fixing part provided with a first limiting groove used for fixing a bottom support part, and a blocking part connected with the fixing part; the blocking component comprises blocking assemblies which are arranged side by side in the first direction, and a second limiting groove is formed between the blocking assemblies and used for limiting the sample; the blocking assembly comprises blocking pieces which are arranged in parallel in the second direction so as to block the adjacent wire parts. Through the design of the sample preparation device, the problem of fixation of all parts in the sample preparation process of the test unit is solved, the phenomena of mutual winding and the like of all spring wires of the wire part caused by slight displacement of a sample and all parts in the sample preparation process are avoided, the unreliability and the sample damage rate in the sample preparation process are reduced, and the test efficiency is improved. And the sample preparation efficiency of the test unit is effectively improved.

Description

Technical Field

[0001] The invention belongs to the technical field of sample preparation for heat transport testing, and in particular relates to a test unit sample preparation device and a sample preparation method for heat transport testing. Background Art

[0002] Generally speaking, low-temperature systems equipped for heat transfer testing often need to reach extremely low temperatures below 2K. However, the power limitation of the cooling process and the precision of the measurement components involved greatly limit the size of the system sample chamber. In addition, since the heat transfer test needs to achieve a process similar to one-dimensional heat transfer, the samples for low-temperature testing are usually small, and sample preparation is cumbersome and difficult.

[0003] In the existing sample preparation process, it is required that one end of the sample not exceeding 2*2*10mm be glued with thermal conductive glue to facilitate its vertical standing on the cold end bottom support plate, and the other end be glued with thermal conductive glue to a heating source with two wires welded. Then, the long and narrow surface of the sample needs to be fixed with thermal conductive glue to fix 6 test wires. In order to reduce the increase of heat dissipation caused by too short wires, the above 8 wires must be wound into springs and do not touch each other. Due to the small size of the sample, the diameter of each wire is extremely thin and does not exceed 50μm, and the requirements for the bonding points of thermal conductive glue, thermal conductive glue, etc. cannot be too large, so all operations of heat transport test sample preparation need to be carried out under an industrial microscope, and the thermal conductive glue and thermal conductive glue need to be heated and baked for different hours before each wire can be dried and solidified.

[0004] In the above sample preparation process, a slight change in the position of the sample will cause the sample to fall when the thermal conductive glue is not dry, the spring wire to fall off, deform and break when the thermal conductive glue is not dry, and the 8 spring wires to be entangled and short-circuited, which will damage the sample, making the sample preparation process unreliable and the sample damage rate high. Because it is necessary to pay attention to avoid various phenomena caused by slight changes in the position of the sample and the components required for the test during the sample preparation process, the preparation of the test unit consumes too much energy and time, and the sample preparation operation is cumbersome and difficult, and the efficiency is low. Summary of the invention

[0005] In order to solve the shortcomings of the prior art, the present invention provides a test unit sample preparation device applied to heat transport testing. Through the design of the test unit sample preparation device, a first limiting groove is used to fix the base portion, a second limiting groove is used to limit the sample, and a barrier is used to separate the wire portion, thereby solving the problem of fixing various components of the sample during the heat transport sample preparation process, avoiding the mutual entanglement of various wire portions caused by slight displacement of the test unit, and achieving one-time clamping of the sample so that the sample does not need to be repeatedly taken and placed during the entire sample preparation process. The overall sample preparation operation is simple and convenient, saving worry and labor, greatly reducing the unreliability and sample damage rate in the sample preparation process, and effectively improving the sample preparation efficiency of the test unit.

[0006] The technical effects to be achieved by the present invention are achieved through the following aspects:

[0007] In a first aspect, the present invention provides a test unit sample preparation device for heat transport testing, wherein the test unit comprises a base, a sample, a heating portion, and a wire portion, wherein the lower end of the sample is connected to the base, the upper end of the sample is connected to the heating portion, and the wire portion is connected to the surface of the sample; the sample preparation device comprises:

[0008] A fixing component is provided with a first limiting groove, wherein the first limiting groove is used to fix the bottom support part, and

[0009] A blocking component connected to the fixing component;

[0010] The barrier component comprises barrier components arranged side by side in a first direction, and a second limiting groove is formed between the barrier components, and the second limiting groove is used to limit the sample;

[0011] The barrier assembly includes barrier members arranged in parallel in the second direction to barrier adjacent to the wire portions.

[0012] In some implementations, the fixing component includes a first fixing component and a second fixing component that are detachably connected, the first limiting groove is formed between the first fixing component and the second fixing component, and the blocking component is connected to the second fixing component.

[0013] In some implementations, a notch is provided on one side of the first fixing member, and the second fixing member is placed on the notch.

[0014] In some implementations, the first fixing member is provided with a first threaded hole corresponding to the second fixing member, and the second fixing member is provided with a second threaded hole corresponding to the first threaded hole, and the first threaded hole and the second threaded hole are fixedly connected by screws penetrating therethrough.

[0015] In some implementations, the second fixing member is provided with a fixing groove corresponding to the barrier member, and the barrier member is fixedly inserted in the fixing groove.

[0016] In some implementations, the barrier component and the second fixing member are integrally formed, and the barrier component is formed by extending the second fixing member along the third direction.

[0017] In some implementations, a height of the second fixture is not greater than a height of the sample.

[0018] In some implementations, the width of the second limiting groove is 2-5 mm.

[0019] In some implementations, the barrier member protrudes from the second fixing member by 3-5 mm.

[0020] In a second aspect, the present invention provides a sample preparation method, using the test unit sample preparation device as described above, comprising the following sample preparation steps:

[0021] S1, adjust the test unit sample preparation device to a standing state, and then insert the base portion into the first limiting groove and fixedly connected with the fixing component;

[0022] S2, embedding the sample into the second limiting groove, and fixing the bottom end of the sample to the bottom support portion by means of thermal conductive adhesive;

[0023] S3, fixing the top of the sample to the heating part through a thermally conductive adhesive;

[0024] S4, moving the semi-finished test unit and the test unit sample preparation device that have been preliminarily glued to an oven as a whole, so that the thermal conductive glue becomes dry, and the sample is absolutely fixed to the heating part and the bottom support part;

[0025] S5, adjusting the test unit sample preparation device to a tilted state, the wire portion is connected to the surface of the sample through a thermally conductive and electrically conductive adhesive, and the wire portion is separated and placed by the barrier;

[0026] S6, moving the test unit and the test unit sample preparation device to an oven to dry the thermal conductive adhesive and the thermal conductive and electrical conductive adhesive, thereby completing sample preparation.

[0027] In summary, the present invention has at least the following benefits:

[0028] 1. The test unit sample preparation device provided by the present invention adopts a first limiting groove to fix the base part, a second limiting groove to limit the sample, and a baffle to separate the wire part, thereby solving the problem of fixing the sample and various components during the test unit sample preparation process, avoiding the mutual entanglement of various wires caused by slight displacement of the sample, and achieving one-time clamping of the sample so that the sample does not need to be repeatedly taken and placed during the entire sample preparation process. The overall sample preparation operation is simple and convenient, saving worry and labor, greatly reducing the unreliability and sample damage rate in the sample preparation process, and effectively improving the sample preparation efficiency of the test unit.

[0029] 2. The test unit sample preparation device provided by the present invention has a strong practical structural design, is conducive to sample preparation, ensures the stability and reliability of the sample preparation process, has a simple and ingenious overall structure, is easy to produce, and can be widely promoted and used. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 Schematic diagram of the structure of the test unit in Example 1.

[0031] Figure 2 This is a schematic diagram of the structure of the test unit sample preparation device in Example 1.

[0032] Figure 3 This is a schematic diagram of the state of the test unit in Example 1 using the test unit sample preparation device.

[0033] Figure 4 Schematic diagram of the separate structure of the test unit sample preparation device in Example 1.

[0034] Figure 5 This is a schematic diagram of the bottom view of the second fixing member in Example 1.

[0035] Figure 6 for Figure 4 Enlarged schematic diagram of part A.

[0036] Figure 7 Schematic diagram of the sample preparation method in Example 3.

[0037] Figure 8 This is a structural schematic diagram of the test unit sample preparation device in Example 3 in a standing state.

[0038] Fig. 9 This is a schematic diagram of the top view of the test unit sample preparation device in Example 3 in a tilted state.

[0039] Markings in the figure:

[0040] 1. Fixing component, 11. First limiting groove, 12. First fixing component, 121. Notch, 122. First threaded hole, 13. Second fixing component, 131. Second threaded hole, 1311. Fixing groove; 2. Blocking component, 21. Blocking assembly, 211. Blocking component, 22. Second limiting groove; 3. Test unit, 31. Bottom support, 32. Sample, 33. Wire part, 34. Heating part. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. The described embodiments are only part of the embodiments of the present invention, not all of them.

[0042] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] Embodiment 1:

[0044] Please see attached Figure 1 -Attached Figure 3 The present invention is a test unit sample preparation device for heat transport test, the test unit 3 includes a bottom support 31, a sample 32, a heating part 34 and a wire part 33, the lower end of the sample 32 is connected to the bottom support 31, the upper end of the sample 32 is connected to the heating part 34, and the wire part 33 is connected to the surface of the sample 32. Specifically, the heating part 34 includes a heating source and two spring wires. The wire part 33 includes six spring wires, and the bottom support 31, the heating part 34 and the wire part 33 are all auxiliary parts for performing thermal conductivity and Seebeck tests on the sample 32.

[0045] The sample preparation device includes a fixing component 1 and a blocking component 2. The fixing component 1 is provided with a first limiting groove 11, and the first limiting groove 11 is used to fix the bottom support part 31. The blocking component 2 is connected to the fixing component 1; the blocking component 2 includes blocking components 21 arranged side by side in a first direction, and second limiting grooves 22 are formed between the blocking components 21, and the second limiting grooves 22 are used to limit the sample 32; the blocking component 21 includes blocking members 211 arranged side by side in the second direction to block adjacent wire parts 33.

[0046] In order to facilitate the description of the structure of the test unit sample preparation device of the present invention, the directions of the space are first defined, the first direction is the X direction, and the second direction is the Y direction.

[0047] Specifically, after the bottom bracket 31 of the test unit 3 is inserted into the first limiting groove 11 , the bottom bracket 31 can be fixed by screw locking, which is also convenient for loosening the test unit 3 later.

[0048] Preferably, two barrier assemblies 21 are provided, and each barrier assembly 21 is provided with three barrier members 211. The number setting can be flexibly set according to the number of wire portions 33 in the test unit 3.

[0049] The test unit sample preparation device in this embodiment has the following sample preparation actions: first, insert the bottom support part 31 of the test unit 3 into the first limiting groove 11, and lock the bottom support part 31 by the existing screws to position it. Secondly, place the sample 32 in the second limiting groove 22, and use thermal conductive glue to fix the bottom end of the sample 32 and the bottom support part 31 to each other, so as to position the sample 32. Subsequently, the semi-finished test unit and the sample preparation device that have been initially glued are moved to the oven as a whole, so that the thermal conductive glue becomes dry, and the absolute fixation of the sample with the heating part and the bottom support part is completed. Then, the test unit sample preparation device is tilted and placed, and the wire part 33 is adhered to the surface of the sample 32 by thermal conductive glue, and the wire part 33 is separated and placed by the barrier 211, so as to fix the various components of the test unit 3. Finally, the sample preparation device is driven to move to the oven, that is, the test unit 3 is moved into the oven for baking to make the connection dry, so that the sample 3 is firmly bonded to the wire part 33.

[0050] Through the arrangement of the test unit sample preparation device, the base portion 31 is fixed by the first limiting groove 11, the sample 32 is limited by the second limiting groove 22, and the wire portion 33 is separated by the barrier member 211, thereby solving the problem of fixing the components of the test unit 3 during the sample preparation process, avoiding the mutual entanglement of the spring wires in the wire portion 33 caused by a slight displacement of the sample 3, and achieving one-time clamping of the sample 3 so that the test unit 3 does not need to be repeatedly taken and placed during the entire sample preparation process. The overall sample preparation operation is simple and convenient, saving worry and effort, greatly reducing the unreliability of the sample preparation process and the damage rate of the sample 32, and effectively improving the sample preparation efficiency of the test unit.

[0051] In addition, the structure of the test unit sample preparation device in this embodiment is conducive to the preparation of the test unit 3 with ease and labor, can effectively ensure the stability and reliability of the sample preparation process, and has strong structural practicality. The overall structure is simple and ingenious, which is convenient for mass production of the test unit sample preparation device and is conducive to its wide promotion and use.

[0052] In some embodiments, see the attached Figure 4 The fixing component 1 includes a first fixing component 12 and a second fixing component 13 that are detachably connected. A first limiting groove 11 is formed between the first fixing component 12 and the second fixing component 13. The blocking component 2 is connected to the second fixing component 13. In this way, the fixing component 1 is divided into the first fixing component 12 and the second fixing component 13, which is convenient for later maintenance and replacement of parts. In addition, the width of the first limiting groove 11 can be flexibly adjusted according to the thickness of the bottom support portion 31, which is more flexible and more adaptable.

[0053] Please see attached Figure 4A notch 121 is provided on one side of the first fixing member 12, and the second fixing member 13 is placed on the notch 121. Specifically, the first fixing member 12 is an L-shaped first fixing member 12. Through the structural setting of the first fixing member 12, the assembly structure of the second fixing member 13 and the first fixing member 12 is compact and occupies a small space. Since the second fixing member 13 is placed at the notch 121, the corners of the first fixing member 12 provide a strong supporting force for the second fixing member 13, thereby ensuring the stability of the placement of the second fixing member 13, avoiding looseness and causing the movement of the test unit 3, and effectively ensuring the reliability of sample preparation.

[0054] Please see attached Figure 4 -Attached Figure 5 The first fixing member 12 is provided with a first threaded hole 122 corresponding to the second fixing member 13, and the second fixing member 13 is provided with a second threaded hole 131 corresponding to the first threaded hole 122. The first threaded hole 122 and the second threaded hole 131 are fixedly connected by screws. Preferably, two first threaded holes 122 and two second threaded holes 131 are provided. In this way, the connection between the first fixing member 12 and the second fixing member 13 is achieved by screws penetrating the first threaded hole 122 and the second threaded hole 131. This connection method is simple, and the tightening and loosening operation of the bottom support part 31 in the test unit 3 is quick and easy, thereby improving the convenience of sample preparation.

[0055] In some embodiments, see the attached Figure 6 The second fixing member 13 is provided with a fixing groove 1311 corresponding to the barrier member 211, and the barrier member 211 is fixedly inserted in the fixing groove 1311. With this arrangement, the barrier member 211 and the second fixing member 13 are two parts, which facilitates the independent maintenance of the second fixing member 13 and the barrier member 211 in the later stage, and by being embedded in the fixing groove 1311, the size of the barrier member 211 can be flexibly changed according to the size of the sample 32, and the barrier member 211 has higher flexibility in use and stronger adaptability.

[0056] In some embodiments, the height of the second fixing member 13 is not greater than the height of the sample 32. Preferably, the height of the second fixing member 13 is designed to be no more than 10 mm, and the height of the sample 32 is generally 10 mm. In this way, the top of the sample 32 in the test unit 3 is exposed, thereby facilitating the installation of other components on the top of the sample 32, such as the installation of the heating unit 34, and effectively improving the convenience of installation.

[0057] In some embodiments, the width of the second limiting groove 22 is 2-5 mm. This arrangement facilitates the placement of a standard sample 32 that is no wider than 2 mm and can assist in fixing the sample 32 to stand upright.

[0058] In some embodiments, the barrier 211 protrudes 3-5 mm from the second fixing member 13. Preferably, the barrier 211 protrudes 4 mm from the second fixing member 13. In this way, the wire portion 33 can be fully supported to prevent the wire portion 33 from sliding out of the barrier 211 during movement, effectively isolating adjacent wires from each other and improving the ability to resist shaking.

[0059] Embodiment 2:

[0060] The difference between this embodiment and the first embodiment is that the barrier component 2 and the second fixing member 13 of this embodiment are integrally formed, and the barrier component 211 is formed by extending the second fixing member 13 along the third direction. Preferably, the material of the second fixing member 13 is a metal or non-metallic temperature-resistant material such as stainless steel and polytetrafluoroethylene. Through this arrangement, the barrier component 2 and the second fixing member 13 are integrated, and this structure improves the convenience of installation, is simple to operate, and has higher installation efficiency.

[0061] The test unit sample making device in this embodiment can be directly die-formed during the production process of the sample making device, so that the mold is also an integral whole, which effectively simplifies the production process, facilitates the production of the sample making device, and thus correspondingly improves the production efficiency of the sample making device.

[0062] Embodiment 3:

[0063] This embodiment is based on the above embodiment. Figure 7-Figure 9 , provides a sample preparation method, using the test unit sample preparation device as described above, including the following sample preparation steps:

[0064] S1, adjust the test unit sample preparation device to a standing state, then insert the bottom support part 31 into the first limiting groove 11, and fix it with the fixing component 1; the fixing connection can be tightened by screws, so as to facilitate the loosening and tightening action of the bottom support part 31;

[0065] S2, embed the sample 32 into the second limiting groove 22, and fix the bottom end of the sample 32 to the bottom support 31 through a thermal conductive adhesive;

[0066] S3, the top of the sample 32 is fixedly connected to the heating part 34 through a thermal conductive adhesive;

[0067] S4, moving the semi-finished test unit and the test unit sample preparation device that have been initially glued to an oven as a whole, so that the thermal conductive glue becomes dry, and the sample 32 is absolutely fixed to the heating part 34 and the bottom support part 31;

[0068] S5, the test unit sample preparation device is adjusted to a tilted state, the wire portion 33 is connected to the outer surface of the sample 32 through the thermal and electrical conductive adhesive, and the spring wires in the wire portion 33 are separated and placed through the barrier 211;

[0069] S6, moving the test unit 3 and the test unit sample preparation device to an oven to dry the thermal conductive adhesive and the thermal conductive and electrical conductive adhesive, thereby completing the sample preparation.

[0070] The test unit sample preparation method in this embodiment adopts the above-mentioned test unit sample preparation device. During the sample preparation process, each component is placed in a corresponding position in combination with the sample preparation device, so that each component in the sample is fixed, and there is no need to spend energy to pay attention to the phenomenon of slight displacement causing mutual entanglement between each spring wire in the wire part 33. The operation is simple and convenient, which effectively improves the ease of sample preparation, thereby improving the heat transport sample preparation efficiency of the sample 32, and improving the reliability of the sample preparation process, and reducing the damage rate of the sample 32.

[0071] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0072] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0073] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0074] In the present invention, unless otherwise clearly specified and limited, a first feature being above or below a second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through another feature between them. Moreover, a first feature being above, above, and above a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being below, below, and below a second feature includes the first feature being directly below and obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0075] Although the present invention is described in conjunction with the above specific embodiments, it is obvious that those skilled in the art can make many substitutions, modifications and changes according to the above content. Therefore, all such substitutions, improvements and changes are included in the spirit and scope of the appended claims.

Claims

1. A test unit sample preparation device for heat transport testing, the test unit comprising a base, a sample, a heating unit and a wire, the lower end of the sample is connected to the base, the upper end of the sample is connected to the heating unit, and the wire is connected to the surface of the sample; characterized in that: The sample preparation device includes: A fixing component is provided with a first limiting groove, wherein the first limiting groove is used to fix the bottom support part, and A blocking component connected to the fixing component; The barrier component comprises barrier components arranged side by side in a first direction, and a second limiting groove is formed between the barrier components, and the second limiting groove is used to limit the sample; The barrier assembly includes barrier members arranged in parallel in the second direction to barrier adjacent to the wire portions.

2. The test unit sample preparation device for heat transport testing according to claim 1, characterized in that: The fixing component includes a first fixing component and a second fixing component that are detachably connected, the first limiting groove is formed between the first fixing component and the second fixing component, and the blocking component is connected to the second fixing component.

3. The test unit sample preparation device for heat transport testing according to claim 2, characterized in that: A notch is arranged on one side of the first fixing member, and the second fixing member is placed on the notch.

4. The test unit sample preparation device for heat transport testing according to claim 2, characterized in that: The first fixing member is provided with a first threaded hole corresponding to the second fixing member, and the second fixing member is provided with a second threaded hole corresponding to the first threaded hole. The first threaded hole and the second threaded hole are fixedly connected by screws penetrating therethrough.

5. The test unit sample preparation device for heat transport testing according to claim 2, characterized in that: The second fixing member is provided with a fixing groove corresponding to the barrier member, and the barrier member is fixedly inserted in the fixing groove.

6. The test unit sample preparation device for heat transport testing according to claim 2, characterized in that: The barrier component is integrally formed with the second fixing member, and the barrier component is formed by extending the second fixing member along the third direction.

7. The test unit sample preparation device for heat transport testing according to any one of claims 2 to 6, characterized in that: The height of the second fixing member is not greater than the height of the sample.

8. The test unit sample preparation device for heat transport testing according to any one of claims 2 to 6, characterized in that: The width of the second limiting groove is 2-5 mm.

9. The test unit sample preparation device for heat transport testing according to any one of claims 5 to 6, characterized in that: The barrier member protrudes from the second fixing member by 3-5 mm.

10. A sample preparation method, characterized in that: The test unit sample preparation device according to any one of claims 1 to 9 comprises the following sample preparation steps: S1, adjust the test unit sample preparation device to a standing state, and then insert the base portion into the first limiting groove and fixedly connected with the fixing component; S2, embedding the sample into the second limiting groove, and fixing the bottom end of the sample to the bottom support portion by means of thermal conductive adhesive; S3, fixing the top of the sample to the heating part through a thermally conductive adhesive; S4, moving the semi-finished test unit and the test unit sample preparation device that have been preliminarily glued to an oven as a whole, so that the thermal conductive glue becomes dry, and the sample is absolutely fixed to the heating part and the bottom support part; S5, adjusting the test unit sample preparation device to a tilted state, the wire portion is connected to the surface of the sample through a thermally conductive and electrically conductive adhesive, and the wire portion is separated and placed by the barrier; S6, moving the test unit and the test unit sample preparation device to an oven to dry the thermal conductive adhesive and the thermal conductive and electrical conductive adhesive, thereby completing sample preparation.

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