Semiconductor packaging material pressure testing method and device
By applying pressure to semiconductor packaging devices and measuring real-time voltage, the problem of inaccurate measurement of the stress condition of packaging materials in semiconductor packaging tests is solved, and the accurate measurement of the limit pressure of packaging materials is achieved, simplifying the diagnostic process and reducing costs.
Patent Information
- Application Number
- CN202411841078.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-13
- Publication Date
- 2025-03-21
AI Technical Summary
During semiconductor packaging testing, it is impossible to accurately measure the stress status of the packaging material, resulting in chip damage and failure, and the diagnosis process is complex and costly.
By applying pressure to the semiconductor package device to be tested and obtaining real-time pressure, measuring the real-time voltage during its pressure, when the voltage change meets the preset conditions, determining the device is in a damaged state, and recording the limit pressure to complete the pressure test.
Accurate pressure testing of semiconductor packaging materials is realized, accurate acquisition of the ultimate pressure of different materials, simplifies the diagnosis process, reduces costs, and provides effective support for semiconductor device failure.
Smart Images
Figure CN119666563A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of semiconductor testing, and in particular to a semiconductor packaging material pressure testing method and device. Background Art
[0002] During the semiconductor packaging and testing production process, the materials are affected by the chip, plastic packaging material, injection molding pressure, etc., resulting in very different stresses on the semiconductor materials after plastic packaging. There are different pressures in different processes, which leads to chip damage and failure without damage to the plastic packaging body. At present, it is impossible to determine the stress condition of the semiconductor packaging material itself. Therefore, after the back-end customer complains, it is impossible to accurately measure the stress condition of the semiconductor packaging material. When analyzing the cause of the semiconductor device failure, we can only determine whether there is a problem with the semiconductor packaging material first, and then use the elimination method or substitution method to determine whether the semiconductor packaging material is the cause of the semiconductor device damage. The diagnostic process is extremely complicated and costly.
[0003] Therefore, how to provide a pressure testing solution that can accurately measure the pressure of semiconductor packaging materials is a technical problem that urgently needs to be solved. Summary of the invention
[0004] In view of the above shortcomings of the prior art, the present invention provides a technical solution for pressure testing of semiconductor packaging materials to solve at least one of the above technical problems.
[0005] In order to achieve the above-mentioned purpose and other related purposes, the technical solution provided by this application is as follows.
[0006] According to the embodiments provided in the present application, in a first aspect, a semiconductor packaging material pressure testing method is provided, comprising:
[0007] Apply pressure to the semiconductor package device to be tested and obtain real-time pressure;
[0008] Measuring the real-time voltage of the semiconductor package device under test during the pressure process;
[0009] When the real-time voltage change meets the preset voltage change condition, it is determined that the semiconductor package device to be tested is in a damaged state after the pressure is applied, and the real-time pressure in the damaged state is used as the limit pressure of the packaging material corresponding to the semiconductor package device to be tested after the pressure is applied to complete the pressure test.
[0010] In one embodiment of the present application, applying pressure to a semiconductor package device under test and obtaining real-time pressure includes: gradually increasing pressure on the semiconductor package device under test through a pressure test; and continuously obtaining the real-time pressure using a pressure tester after each application of pressure.
[0011] In one embodiment of the present application, after measuring the real-time voltage of the semiconductor packaged device under test during the pressure process, it also includes: determining the damage condition of the semiconductor packaged device under test after the pressure is applied according to the voltage change of the real-time voltage; if the change of the real-time voltage does not meet the preset voltage change condition, determining that the semiconductor packaged device under test after the pressure is applied is in a normal state; if the change of the real-time voltage meets the preset voltage change condition, determining that the semiconductor packaged device under test after the pressure is applied is in the damaged state.
[0012] In one embodiment of the present application, after determining the ultimate pressure of the semiconductor package device to be tested after pressure is applied, it also includes: obtaining pressure operating parameters of equipment related to the damaged semiconductor package device to be tested; and determining the cause of damage to the damaged semiconductor package device to be tested based on the ultimate pressure and the pressure operating parameters.
[0013] According to the embodiments provided in the present application, in the second aspect, a semiconductor packaging material pressure testing device is also provided, and the testing device includes: a pressure testing mechanism, which is used to place the semiconductor packaging device to be tested, and apply pressure to the semiconductor packaging device to be tested and obtain a real-time pressure value; an electrical tester, which is used to measure the voltage of the semiconductor packaging device to be tested during the pressure application process to obtain a real-time voltage; and a controller, which is used to determine the limit pressure of the packaging material corresponding to the semiconductor packaging device to be tested after the pressure is applied according to the change of the real-time voltage.
[0014] In one embodiment of the present application, the pressure testing mechanism includes: a test platform, used to provide a test platform for the semiconductor packaged device to be tested; a pressure testing frame, used to provide support for the test platform; a pressure tester, vertically fixed on a lifting mechanism on the pressure testing frame, used to collect real-time pressure of the semiconductor packaged device to be tested; a pressure testing needle, arranged on the pressure testing frame, in contact with the semiconductor packaged device to be tested, so as to concentrate the pressure applied by the pressure testing frame to the detection point of the semiconductor packaged device to be tested.
[0015] The present application provides a semiconductor packaging material pressure testing method and device, the method comprising: applying pressure to a semiconductor packaging device to be tested and obtaining real-time pressure, and measuring the real-time voltage of the semiconductor packaging device to be tested during the pressure application process, and when the change in the real-time voltage meets the preset voltage change condition, determining that the semiconductor packaging device to be tested after the pressure is applied is in a damaged state, and using the real-time pressure in the damaged state as the limit pressure of the packaging material corresponding to the semiconductor packaging device to be tested, thereby achieving pressure testing of the semiconductor packaging material. The semiconductor packaging material pressure testing scheme provided by the present application, by applying pressure to the semiconductor packaging device to be tested and according to the voltage change of the device during the pressure application process, the limit pressure of different semiconductor packaging materials can be accurately obtained, providing strong support for studying the failure of semiconductor devices.
[0016] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The drawings herein are incorporated into the specification and constitute a part of the specification, showing embodiments consistent with the present invention, and together with the specification, are used to explain the principles of the present invention. Obviously, the drawings described below are only some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work. In the drawings:
[0018] Figure 1 The figure is a flow chart of a semiconductor packaging material pressure testing method shown in an exemplary embodiment of the present invention. DETAILED DESCRIPTION
[0019] The following will describe the embodiments of the present invention with reference to the accompanying drawings and preferred embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be understood that the preferred embodiments are only for illustrating the present invention, not for limiting the scope of protection of the present invention.
[0020] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present invention, and thus the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.
[0021] In the following description, numerous details are discussed to provide a more thorough explanation of the embodiments of the present invention. However, it is obvious to those skilled in the art that the embodiments of the present invention can be implemented without these specific details. In other embodiments, well-known structures and devices are shown in the form of block diagrams rather than in detail to avoid making the embodiments of the present invention difficult to understand.
[0022] During the semiconductor packaging and testing production process, the materials are affected by the chip, plastic packaging material, injection molding pressure, etc., resulting in a very large difference in the stress of the semiconductor materials after plastic packaging. There is stress in the pin cutting process, and it is affected by the speed and pressure of the equipment during the test process, which leads to the phenomenon of chip damage failure without damage to the plastic packaging body. At present, it is impossible to judge the stress condition of the semiconductor packaging material itself, and the proportion of chip damage failure varies greatly with different test equipment, different test speeds, and different chips. Therefore, it is impossible to determine whether the semiconductor material itself has poor stress resistance after plastic packaging, or whether the failure is caused by excessive pressure or too fast running speed of the pin cutting processing equipment and test equipment. After the back-end customer complains, because it is impossible to accurately measure the stress condition of the semiconductor packaging material, when analyzing the cause of the semiconductor device function failure, whether there is a problem with the semiconductor packaging material, we can only first determine whether there is a problem with the equipment, and then use the elimination method or substitution method to determine whether the semiconductor packaging material is the cause of the semiconductor device damage. The diagnosis process is very complicated and costly.
[0023] Before the test, a packaged semiconductor package device to be tested with normal functions is prepared first. The semiconductor package device can be a packaged diode, triode, Metal-Oxide-Semi conductor Field-Effect Transistor (MOSFET), etc. The semiconductor package device can measure the voltage reaction device to see whether it is normal.
[0024] To solve the above problems, Figure 1 As shown, the present application provides a semiconductor packaging material pressure testing method, which at least includes steps S110 to S130:
[0025] S110 , applying pressure to the semiconductor package device to be tested and obtaining real-time pressure.
[0026] In detail, applying pressure to the semiconductor package device to be tested and obtaining real-time pressure includes: applying pressure to the semiconductor package device to be tested step by step through pressure testing; and continuously obtaining real-time pressure using a pressure tester after each application of pressure. Specifically, before applying pressure, the applied pressure is first adjusted to zero, and then incrementally adjusted according to a preset pressure adjustment value, and pressure is applied to the detection point of the semiconductor package device to be tested through pressure testing, and the real-time pressure after each application of pressure is obtained through the pressure tester.
[0027] S120, measuring the real-time voltage of the semiconductor package device under test during the pressure process.
[0028] Specifically, during the process of applying pressure to the semiconductor package device to be tested, the real-time voltage of the semiconductor package device to be tested is measured by an electrical tester to reflect the damage of the semiconductor package device according to the voltage transformation of the real-time voltage.
[0029] S130. When the real-time voltage change meets the preset voltage change condition, determine that the semiconductor package device to be tested is in a damaged state after the pressure is applied, and use the real-time pressure in the damaged state as the limit pressure of the packaging material corresponding to the semiconductor package device to be tested after the pressure is applied to complete the pressure test.
[0030] In detail, after measuring the real-time voltage of the semiconductor packaged device to be tested during the pressure process, it also includes: determining the damage condition of the semiconductor packaged device to be tested after the pressure is applied according to the voltage change of the real-time voltage; if the change of the real-time voltage does not meet the preset voltage change condition, then determining that the semiconductor packaged device to be tested after the pressure is applied is in a normal state; if the change of the real-time voltage meets the preset voltage change condition, then determining that the semiconductor packaged device to be tested after the pressure is applied is in a damaged state. Specifically, the preset voltage change condition is: the percentage change of the real-time voltage exceeds the percentage change threshold of the voltage of the normal voltage of the package material to be tested. For example, if the change of the real-time voltage with the real-time pressure is less than the preset voltage change condition, it is determined that the semiconductor package device to be tested after the pressure is applied is not damaged and the semiconductor package device is normal; when the change of the real-time voltage with the real-time pressure is greater than or equal to the preset voltage change condition, it is determined that the semiconductor package device to be tested after the pressure is applied is damaged. For example, the voltage of a certain semiconductor package is 1800V when it is normal, the voltage change percentage threshold is 30%, and the percentage change of the real-time voltage is less than the percentage change threshold, then it is determined that the semiconductor package device to be tested after the pressure is applied is in a normal state. If the percentage change of the real-time voltage is greater than or equal to the percentage change threshold, then it is determined that the semiconductor package device to be tested after the pressure is applied is in a damaged state. It should be noted that the percentage change threshold of the voltage can be determined according to actual conditions and is not limited here.
[0031] When the semiconductor package device is damaged, the real-time pressure of the damaged state is recorded, and the real-time pressure is used as the limit bearing pressure of the packaging material corresponding to the semiconductor package device under test.
[0032] In detail, after determining the ultimate pressure of the semiconductor package device to be tested after applying pressure, it also includes: obtaining the pressure operating parameters of the equipment related to the damaged semiconductor package device to be tested; and determining the cause of damage to the damaged semiconductor package device to be tested according to the ultimate pressure and the pressure operating parameters. Specifically, when the back-end customer reports that the semiconductor device is abnormal, the pressure operating parameters of the equipment related to the manufacturing of the damaged semiconductor package device to be tested are obtained. If the ultimate pressure is less than or equal to the pressure operating parameters, it is determined that the cause of damage to the semiconductor device is the semiconductor packaging material. If the ultimate pressure is greater than the pressure operating parameters, it is determined that the cause of damage to the semiconductor device is caused by the processing or testing equipment during the packaging process.
[0033] The present application provides a semiconductor packaging material pressure testing device, the testing device comprising:
[0034] A pressure testing mechanism, used for placing the semiconductor package device to be tested, applying pressure to the semiconductor package device to be tested and obtaining a real-time pressure value;
[0035] An electrical tester is used to measure the voltage of the semiconductor package device to be tested during the pressure application process to obtain the real-time voltage;
[0036] The controller is used to determine the limit pressure of the packaging material corresponding to the semiconductor packaging device to be tested after the pressure is applied according to the change of the real-time voltage.
[0037] In detail, the pressure testing mechanism includes: a test platform, which is used to provide a test platform for the semiconductor packaged device to be tested; a pressure testing frame, which is used to provide support for the test platform; a pressure tester, which is vertically fixed on the lifting mechanism on the pressure testing frame, and is used to collect the real-time pressure of the semiconductor packaged device to be tested; a pressure testing needle, which is arranged on the pressure testing frame and contacts the semiconductor packaged device to concentrate the pressure applied by the pressure testing frame to the detection point of the semiconductor packaged device to be tested.
[0038] The present application provides a semiconductor packaging material pressure testing method and device, the method comprising: applying pressure to the semiconductor packaging device to be tested and obtaining real-time pressure, and measuring the real-time voltage of the semiconductor packaging device to be tested during the pressure application process, and when the change in the real-time voltage meets the preset voltage change condition, determining that the semiconductor packaging device to be tested after the pressure is applied is in a damaged state, thereby determining the abnormal cause of the damaged semiconductor packaging device according to the limit pressure. The semiconductor packaging material pressure testing scheme provided by the present application, by applying pressure to the semiconductor packaging device to be tested and according to the voltage change of the device during the pressure application process, the limit pressure of different semiconductor packaging materials can be accurately obtained. When the back-end customer feedbacks that the semiconductor device is abnormal, it can be preferentially determined whether the device damage is caused by the semiconductor material, simplifying the abnormality determination process, and providing strong support for the study of semiconductor device failure.
[0039] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed by the present invention shall still be covered by the claims of the present invention.
Claims
1. A semiconductor packaging material pressure testing method, characterized in that: include: Apply pressure to the semiconductor package device to be tested and obtain real-time pressure; Measuring the real-time voltage of the semiconductor package device under test during the pressure process; When the real-time voltage change meets the preset voltage change condition, it is determined that the semiconductor package device to be tested is in a damaged state after the pressure is applied, and the real-time pressure in the damaged state is used as the limit pressure of the packaging material corresponding to the semiconductor package device to be tested after the pressure is applied to complete the pressure test.
2. The semiconductor packaging material pressure testing method according to claim 1, characterized in that: Apply pressure to the semiconductor package device under test and obtain real-time pressure, including: Applying pressure gradually and incrementally to the semiconductor package device to be tested through a pressure test; After each application of pressure, the real-time pressure is continuously acquired using a pressure tester.
3. The semiconductor packaging material pressure testing method according to claim 2, characterized in that: After measuring the real-time voltage of the semiconductor package device under test during the pressure process, the method further includes: Determining the damage of the semiconductor package device to be tested after the pressure is applied according to the voltage transformation of the real-time voltage; If the real-time voltage change does not satisfy the preset voltage change condition, determining that the semiconductor package device to be tested is in a normal state after the pressure is applied; If the real-time voltage change condition satisfies the preset voltage change condition, it is determined that the semiconductor package device to be tested is in the damaged state after the pressure is applied.
4. The semiconductor packaging material pressure testing method according to claim 1, characterized in that: After determining the limit pressure of the semiconductor package device to be tested after the pressure is applied, the method further includes: Obtaining pressure operating parameters of equipment related to the damaged semiconductor package device under test; The damage cause of the damaged semiconductor package device to be tested is determined according to the limit pressure and the pressure operation parameter.
5. A semiconductor packaging material pressure testing device, characterized in that: The testing device comprises: A pressure testing mechanism, used for placing a semiconductor package device to be tested, applying pressure to the semiconductor package device to be tested and obtaining a real-time pressure value; An electrical tester, used to measure the voltage of the semiconductor package device to be tested during the pressure application process to obtain the real-time voltage; The controller is used to determine the limit pressure of the packaging material corresponding to the semiconductor packaging device to be tested after the pressure is applied according to the change of the real-time voltage.
6. The semiconductor packaging material pressure testing device according to claim 5, characterized in that: The pressure testing organization includes: A test platform, used to provide a test platform for the semiconductor package device to be tested; A pressure test frame, used to provide support for the test platform; A pressure tester, vertically fixed on the lifting mechanism on the pressure test frame, used to collect the real-time pressure of the semiconductor package device to be tested; A pressure test needle is arranged on the pressure test frame and contacts the semiconductor package device to be tested so as to concentrate the pressure applied by the pressure test frame to the detection point of the semiconductor package device to be tested.