Bearing device for wafer detection of water immersion type ultrasonic scanning microscope

Abstract

The invention relates to the technical field of semiconductor detection, in particular to a bearing device for wafer detection of a water immersion type ultrasonic scanning microscope, which comprises a bearing table, an adsorption flow channel is arranged on the bearing table, a negative pressure flow channel is arranged in the bearing table, a negative pressure hole communicated with the adsorption flow channel is arranged on the bearing table, and a containing groove is arranged on the bearing table. A plurality of supporting tables used for supporting wafers are vertically fixed to the bottom of the containing groove, an adsorption flow channel is formed between the side wall of each supporting table and the containing groove, a soft annular sealing ring is arranged in the outer annular channel, the thickness of the sealing ring is not smaller than the height of the supporting tables, and a plurality of reducing claws located in the outer annular channel are evenly arranged on the bearing table in the circumferential direction. And the variable-diameter claw is slidably connected into the outer ring way in the radial direction of the containing groove and is connected with the sealing ring. And due to the sealing of the sealing ring, the residual detection liquid between the upper surface of the supporting table and the wafer is small, the adsorption force between the two is small, and the wafer is not easy to break when being taken down, so that the wafer breaking rate is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor detection, and in particular to a carrier device for wafer detection using a water immersion ultrasonic scanning microscope. Background Art

[0002] Ultrasonic scanning microscope is a non-destructive testing device that uses transmission media. It uses reflection or transmission scanning methods to check for defects such as delamination, voids, cracks, etc. inside components, materials, wafers, etc. When in use, the wafer is placed in the test liquid and tested with an ultrasonic probe.

[0003] The wafer itself is generally thin, so in order to ensure stability during detection, the wafer is usually fixed by adsorption through negative pressure adsorption. For related technology, please refer to the Chinese patent with publication number CN116399957A, which discloses a water-immersion ultrasonic scanning microscope sample conveying device and control method, which includes: a wafer stage, a pulley, a guide rail, a guide rail bracket, a push-pull drive mechanism, a liquid tank and a bottom plate, wherein a vacuum suction cup and a vacuum air path system are arranged on the wafer stage, and the vacuum suction cup is used to absorb the wafer.

[0004] Under normal circumstances, wafers can be picked up and placed by suction cups by evacuating and releasing the vacuum in a gas environment. However, in the working environment of an ultrasonic scanning microscope, the wafer is immersed in liquid. There will be a gap between the wafer and the carrier, and the detection liquid will penetrate between the wafer and the carrier. When the wafer is adsorbed on the carrier by negative pressure, the detection liquid between the two is also clamped between the two.

[0005] When the test is completed and the vacuum is released, the air path on the carrier will be pressed to balance the external air pressure. However, the test liquid between the carrier and the wafer will have a certain tension and will still adsorb the two together. If the wafer is forcibly removed at this time, the tension of the test liquid will easily damage the wafer and cause fragmentation. Summary of the invention

[0006] In order to reduce the risk of fragmentation, the present application provides a carrier device for water immersion ultrasonic scanning microscope wafer inspection.

[0007] The present application provides a carrier device for wafer inspection using a water immersion ultrasonic scanning microscope, which adopts the following technical solution: A carrying device for wafer inspection using a water-immersion ultrasonic scanning microscope comprises a liftable carrying platform, an adsorption flow channel is provided on the carrying platform, a negative pressure flow channel is provided inside the carrying platform, a negative pressure hole is provided on the carrying platform and is connected to the adsorption flow channel, a receiving groove for accommodating wafers is provided on the carrying platform, a plurality of supporting platforms for supporting wafers are vertically fixed to the bottom of the receiving groove, an adsorption flow channel is formed between the side wall of the supporting platform and the receiving groove, the adsorption flow channel comprises an outer ring channel with a diameter greater than the diameter of the wafer, a soft annular sealing ring is provided inside the outer ring channel, the thickness of the sealing ring is not less than the height of the supporting platform, a plurality of diameter-changing claws are evenly provided circumferentially on the carrying platform and are located in the outer ring channel, the diameter-changing claws are connected to the outer ring channel along the radial sliding direction of the receiving groove, and the diameter-changing claws are connected to the sealing ring.

[0008] By adopting the above technical solution, the wafer is placed in the receiving groove of the carrier, the wafer contacts the upper surface of the support platform, the support platform supports the wafer, and the adsorption channel is located below the wafer. In addition, the sealing ring serves as the outer wall of the outer ring channel, the edge of the wafer is pressed on the upper surface of the sealing ring, and the sealing ring seals and isolates the adsorption channel to prevent external detection liquid from flowing into the channel, thereby ensuring the dryness of the adsorption channel. Negative pressure suction is generated in the negative pressure channel, and the adsorption channel is connected to the negative pressure channel through the negative pressure hole, so as to adsorb the wafer and fix the wafer. After the inspection is completed, the support table rises, the inspection liquid rises, and the variable diameter claw contracts to pull the sealing ring, increasing the diameter of the sealing ring until the sealing ring is separated from the wafer. At this time, the outer ring is opened and in contact with the outside air, thereby balancing the air pressure on both sides of the wafer, making it easier to remove the wafer. Due to the sealing of the sealing ring, the residual inspection liquid between the upper surface of the support table and the wafer is small, and the adsorption force between the two is small. The wafer is not easy to break when it is removed, thereby reducing the wafer breakage rate. Even if the inspection liquid gathers, most of it is gathered between the sealing ring and the wafer. When the variable diameter claw pulls the sealing ring, the sealing ring and the wafer slide radially, and will not produce vertical destructive force on the wafer, thereby further protecting the wafer and reducing the fragmentation rate.

[0009] Preferably, the reducing claw comprises a reducing rod penetrating the side wall of the accommodating groove and slidably connected to the side wall of the accommodating groove, and a connecting claw piece fixed to the end of the reducing rod and vertically connected to the end of the reducing rod, and the connecting claw piece is fixed in the sealing ring.

[0010] By adopting the above technical solution, the connecting claw piece is buried in the sealing ring to enhance the structural strength of the sealing ring, and also ensures the deformation effect of the sealing ring when the connecting claw piece pulls the sealing ring.

[0011] Preferably, at least two annular waterproof bosses are provided on the upper surface of the sealing ring, and a water return groove is formed between the waterproof bosses.

[0012] By adopting the above technical solution, multiple waterproof bosses enhance the waterproof effect on the detection liquid. When the detection liquid penetrates through a waterproof boss, the return water tank will also temporarily store the detection liquid to reduce its subsequent leakage.

[0013] Preferably, the connecting claws correspond one-to-one to the return water grooves, a plurality of return water holes corresponding one-to-one to the connecting claws are opened at the bottom of the return water grooves, a return water channel opposite to the return water holes is opened in the connecting claws, and the reducing rod is hollow and connected to the return water channel.

[0014] By adopting the above technical solution, negative pressure suction is generated in the variable diameter rod, and it is connected to the return water tank through the connecting claw piece, so as to suck out the detection liquid in the return water tank, further reducing the leakage of the detection liquid. Moreover, the negative pressure suction generated in the return water tank can also enhance the adsorption stability of the wafer and ensure the detection effect.

[0015] Preferably, one end of the reducing rod is rotatably connected to the connecting claw piece with a connecting head, and the connecting head is connected to the connecting claw piece through a thread.

[0016] By adopting the above technical solution, the reducing rod is detachably connected to the sealing ring through a thread, which facilitates the replacement and maintenance of the sealing ring.

[0017] Preferably, the end of the reducing rod away from the connecting claw piece is connected to the negative pressure flow channel through a soft air pipe.

[0018] By adopting the above technical solution, negative pressure suction is generated in the negative pressure flow channel to adsorb the wafer, while negative pressure suction is generated in the variable diameter rod to absorb the detection liquid in the return water tank. After the detection is completed, negative pressure suction is no longer generated in the negative pressure flow channel, and the variable diameter rod no longer needs to continue to absorb the detection liquid. The two work synchronously, and there is no need to add additional airways for control, which is easy to use.

[0019] Preferably, a control disk is rotatably connected inside the support platform, a spiral groove is provided on the upper surface of the control disk, a block threadedly connected to the spiral groove is fixed on the reducer rod, and a control motor for driving the control disk to rotate is provided inside the support platform.

[0020] By adopting the above technical solution, the control motor is started, and the control disk rotates to drive the diameter-changing rod to slide linearly through the block. One control motor can control the synchronous linear movement of all diameter-changing rods at the same time, which is easy to use.

[0021] Preferably, a plurality of concave drainage grooves are provided on the upper surface of the support platform, and the bottom of the drainage grooves is inclined.

[0022] By adopting the above technical solution, if the detection liquid leaks into the adsorption channel and is located between the support table and the wafer, the detection liquid will remain in the drainage groove, and the detection liquid will flow out of the drainage groove. The contact area between the support table and the wafer is smaller, thereby reducing the adsorption force between the detection liquid and the wafer, making it easier to remove the wafer.

[0023] In summary, this application includes the following beneficial technical effects: Through the setting of the sealing ring, the adsorption flow channel is in a relatively sealed state, the residual detection liquid between the upper surface of the support table and the wafer is small, the adsorption force between the two is small, and the wafer is not easy to break when removed, thereby reducing the wafer breakage rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the embodiment; Figure 2 is a structural schematic diagram of a carrier platform in an embodiment; Figure 3 Schematic diagram of the internal structure of the carrier platform in the embodiment.

[0025] Description of reference numerals: 1. Carrying platform; 11. Negative pressure flow channel; 12. Negative pressure hole; 2. Adsorption flow channel; 21. Outer ring channel; 22. Inner channel; 3. Receiving groove; 4. Support platform; 41. Drainage groove; 5. Sealing ring; 51. Waterproof boss; 52. Return water groove; 53. Return water hole; 6. Variable diameter claw; 61. Variable diameter rod; 62. Connecting claw piece; 621. Return water channel; 63. Air pipe; 71. Control panel; 72. Block; 73. Control motor; 74. Control gear; 8. Detection groove; 9. Lifting platform. DETAILED DESCRIPTION

[0026] The present application is further described in detail below in conjunction with all the accompanying drawings. Example

[0027] The present application embodiment discloses a carrier device for wafer inspection using a water immersion ultrasonic scanning microscope, referring to Figure 1 to Figure 2 , including a testing tank 8, a lifting platform 9 is provided in the testing tank 8, and a carrier 1 for mounting a wafer is fixed on the lifting platform 9. The testing tank 8 is filled with a testing liquid, and after the wafer is placed on the carrier 1, the lifting platform 9 drives the carrier 1 to descend until the wafer is immersed in the testing liquid for testing. After the testing is completed, the lifting platform 9 drives the carrier 1 to rise until it jumps out of the liquid surface of the testing liquid, and the tested wafer is removed or replaced.

[0028] Reference Figures 2 to 3 A circular receiving groove 3 is provided on the upper surface of the carrier 1, and the diameter of the receiving groove 3 is larger than the diameter of the wafer. The wafer is placed in the receiving groove 3 for testing.

[0029] Reference Figures 2 to 3 , a number of support platforms 4 are vertically fixed at the bottom of the receiving groove 3, and the height of the support platforms 4 is less than the depth of the receiving groove 3. When the wafer is placed in the receiving groove 3, the upper surface of the support platform 4 contacts the bottom of the wafer to support the wafer, so that a gap is formed between the bottom of the wafer and the bottom of the receiving groove 3. A number of concave drainage grooves 41 are provided on the upper surface of the support platform 4, and the bottom of the drainage groove 41 is inclined. If the detection liquid leaks into the adsorption flow channel 2 and is located between the support platform 4 and the wafer, the detection liquid remains in the drainage groove 41, and the detection liquid will flow out of the drainage groove 41. The contact area between the support platform 4 and the wafer is small, thereby reducing the adsorption force between the detection liquid and the wafer, facilitating the wafer removal and reducing the breakage rate.

[0030] Reference Figures 2 to 3 An adsorption channel 2 is formed between the side wall of the support platform 4 and the receiving tank 3, and negative pressure suction is generated in the adsorption channel 2 to adsorb and fix the wafer. A negative pressure channel 11 is opened in the support platform 1 and a negative pressure hole 12 is opened at the center of the bottom of the receiving tank 3. One end of the negative pressure hole 12 is connected to the adsorption channel 2, and the other end is connected to the negative pressure channel 11. The negative pressure channel 11 is connected to an external vacuum machine to generate negative pressure suction.

[0031] Reference Figures 2 to 3 The adsorption channel 2 includes an outer annular channel 21 located at the edge of the receiving tank 3, and the outer annular channel 21 is connected to the negative pressure hole 12 through an inner channel 22. The inner channel 22 can be annular or radial to the bottom of the receiving tank 3, and it is ensured to be evenly distributed in the receiving tank 3, so that the adsorption force generated by the adsorption channel 2 on the wafer is relatively uniform.

[0032] Reference Figures 2 to 3 The diameter of the outer ring channel 21 is larger than the diameter of the wafer. A soft annular sealing ring 5 is arranged inside the outer ring channel 21. The thickness of the sealing ring 5 is not less than the height of the support platform 4. When the wafer is pressed on the support platform 4, the edge of the wafer is pressed on the sealing ring 5. The sealing ring 5 seals the adsorption flow channel 2 to prevent the detection liquid from penetrating and being adsorbed between the carrier platform 1 and the wafer, which affects the wafer removal.

[0033] Reference Figures 2 to 3 At least two annular waterproof bosses 51 are provided on the upper surface of the sealing ring 5, and a water return groove 52 is formed between the waterproof bosses 51 and the waterproof bosses 51. The multiple waterproof bosses 51 enhance the waterproof effect on the detection liquid. When the detection liquid penetrates through one waterproof boss 51, the water return groove 52 will also temporarily store the detection liquid to reduce its subsequent leakage.

[0034] Reference Figures 2 to 3During the inspection, the sealing ring 5 is located below the wafer, the inner diameter of the sealing ring 5 is smaller than the diameter of the wafer, and the sealing ring 5 seals and blocks the adsorption flow channel 2. After the inspection is completed, since the sealing ring 5 is made of a relatively soft material and can be deformed, a number of variable diameter claws 6 located in the outer annular channel 21 are evenly arranged in the circumferential direction of the accommodating groove 3, and the variable diameter claws 6 are connected to the outer annular channel 21 along the radial sliding of the accommodating groove 3. The variable diameter claws 6 are connected to the sealing ring 5, and the sealing ring 5 can be pulled to change the diameter of the sealing ring 5 until the inner diameter of the sealing ring 5 is larger than the diameter of the wafer, and the sealing ring 5 is separated from the wafer, so that the adsorption flow channel 2 is connected to the external environment, balancing the air pressure on both sides of the wafer, and facilitating the wafer removal.

[0035] Moreover, when the diameter-changing claw 6 pulls the sealing ring 5, the sealing ring 5 and the wafer slide radially, and no vertical destructive force is generated on the wafer, thereby further protecting the wafer and reducing the breakage rate. The diameter-changing claw 6 is composed of a diameter-changing rod 61 and a connecting claw piece 62.

[0036] Reference Figures 2 to 3 , a control mechanism for controlling the sliding of the variable diameter claw 6 is provided in the bearing platform 1. The control mechanism includes a control disk 71 rotatably connected to the bearing platform 1 and coaxial with the receiving groove 3. A spiral groove is provided on the upper surface of the control disk 71. A plurality of blocks 72 are evenly threadedly connected to the spiral groove in the circumferential direction. When the control disk 71 rotates, all the blocks 72 slide linearly along the radial direction of the control disk 71. A tooth groove is provided on the lower surface of the control disk 71. A control motor 73 is installed in the bearing platform 1. The control motor 73 is a stepping motor. A control gear 74 meshing with the lower surface of the control disk 71 is connected to the output shaft of the control motor 73. The control motor 73 starts to drive the control disk 71 to rotate, thereby controlling all the blocks 72 to slide.

[0037] Reference Figures 2 to 3 The clamping block 72 corresponds to the reducing rod 61 one by one and is fixedly connected. The reducing rod 61 is horizontally arranged and extends from the side of the receiving groove 3 and is located in the outer ring road 21. The end of the reducing rod 61 is rotatably connected with a connector, and the connector is connected to the connecting claw piece 62 through a thread. The connecting claw piece 62 is fixed in the sealing ring 5. The reducing rod 61 is detachably connected to the sealing ring 5, which is convenient for replacement and maintenance of the sealing ring 5. The control motor 73 is started, and the clamping block 72 drives the reducing rod 61 to slide, thereby pulling the sealing ring 5 and changing the diameter of the sealing ring 5.

[0038] Reference Figures 2 to 3The number of connecting claws 62 connected to each reducing rod 61 is consistent with the number of return water grooves 52, and the position of the connecting claws 62 on each reducing rod 61 corresponds to the return water grooves 52. A plurality of return water holes 53 corresponding to the connecting claws 62 are provided at the bottom of the return water groove 52, and a return water channel 621 opposite to the return water holes 53 is provided in the connecting claws 62. The reducing rod 61 is hollow and connected to the return water channel 621. The end of the reducing rod 61 away from the connecting claws 62 is connected to the negative pressure flow channel 11 through a soft air pipe 63. The negative pressure suction force generated in the negative pressure flow channel 11 absorbs the detection liquid infiltrated into the return water groove 52 through the connecting claws 62, thereby ensuring the dryness in the adsorption flow channel 2.

[0039] The implementation principle of the carrier device for wafer inspection using an immersion ultrasonic scanning microscope in the embodiment of the present application is as follows: the operator injects the inspection liquid into the inspection tank 8, the lifting platform 9 is started until the carrier platform 1 extends out of the page of the inspection liquid, the operator installs the wafer in the receiving tank 3, and at least makes the inner ring of the sealing ring 5 located on the lower surface of the wafer and in contact with the wafer, and the negative pressure suction is generated in the negative pressure flow channel 11 to adsorb and fix the wafer. The lifting platform 9 descends until the wafer is completely submerged in the inspection liquid, and the inspection begins. After the inspection is completed, the lifting platform 9 rises, lifts the page of the carrier platform 1 extending out of the inspection liquid, and no negative pressure suction is generated in the negative pressure flow channel 11, and the control motor 73 is started to pull the sealing ring 5 out from under the wafer, balance the air pressure on both sides of the wafer, and remove or replace the wafer.

[0040] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A carrier device for wafer inspection using an immersion ultrasonic scanning microscope, comprising a liftable carrier platform (1), an adsorption flow channel (2) being provided on the carrier platform (1), a negative pressure flow channel (11) being provided inside the carrier platform (1), a negative pressure hole (12) being provided on the carrier platform (1) and being connected to the adsorption flow channel (2), the negative pressure hole (12) being connected to the negative pressure flow channel (11), characterized in that: The carrier platform (1) is provided with a receiving groove (3) for receiving wafers, and a plurality of support platforms (4) for supporting wafers are vertically fixed at the bottom of the receiving groove (3). An adsorption channel (2) is formed between the side wall of the support platform (4) and the receiving groove (3). The adsorption channel (2) includes an outer ring channel (21) with a diameter greater than the diameter of the wafer, and a soft annular sealing ring (5) is arranged in the outer ring channel (21). The thickness of the sealing ring (5) is not less than the height of the support platform (4). A plurality of diameter-changing claws (6) located in the outer ring channel (21) are evenly arranged circumferentially on the carrier platform (1). The diameter-changing claws (6) are connected to the outer ring channel (21) by radial sliding along the receiving groove (3), and the diameter-changing claws (6) are connected to the sealing ring (5).

2. The carrying device for wafer inspection using a water immersion ultrasonic scanning microscope according to claim 1, characterized in that: The diameter-changing claw (6) comprises a diameter-changing rod (61) penetrating the side wall of the accommodating groove (3) and slidably connected to the side wall of the accommodating groove (3), and a connecting claw piece (62) fixed to the end of the diameter-changing rod (61) and vertically connected to the end of the diameter-changing rod (61), and the connecting claw piece (62) is fixed in the sealing ring (5).

3. The carrying device for wafer inspection using a water immersion ultrasonic scanning microscope according to claim 2, characterized in that: At least two annular waterproof bosses (51) are provided on the upper surface of the sealing ring (5), and a water return groove (52) is formed between the waterproof bosses (51) and the waterproof bosses (51).

4. The carrying device for wafer inspection using a water immersion ultrasonic scanning microscope according to claim 3, characterized in that: The connecting claw pieces (62) correspond to the water return grooves (52) one by one. The bottom of the water return grooves (52) is provided with a plurality of water return holes (53) corresponding to the connecting claw pieces (62) one by one. A water return channel (621) facing the water return holes (53) is provided in the connecting claw pieces (62). The reducing rod (61) is hollow and communicates with the water return channel (621).

5. The carrying device for wafer inspection using a water immersion ultrasonic scanning microscope according to claim 4, characterized in that: One end of the diameter-changing rod (61) facing the connecting claw piece (62) is rotatably connected to a connecting head, and the connecting head is connected to the connecting claw piece (62) via a thread.

6. The carrying device for wafer inspection using a water immersion ultrasonic scanning microscope according to claim 4, characterized in that: The end of the reducing rod (61) away from the connecting claw piece (62) is connected to the negative pressure flow channel (11) through a soft air pipe (63).

7. The carrying device for wafer inspection using a water immersion ultrasonic scanning microscope according to claim 6, characterized in that: A control disk (71) is rotatably connected inside the bearing platform (1), a spiral groove is provided on the upper surface of the control disk (71), a clamping block (72) threadably connected to the spiral clamping groove is fixed on the diameter-changing rod (61), and a control motor (73) for driving the control disk (71) to rotate is provided inside the bearing platform (1).

8. The carrying device for wafer inspection using a water immersion ultrasonic scanning microscope according to claim 1, characterized in that: The upper surface of the support platform (4) is provided with a plurality of concave drainage grooves (41), and the bottom of the drainage grooves (41) is inclined.

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