Heat dissipation device for server

Abstract

The invention discloses a heat dissipation device for a server, which relates to the field of server heat dissipation and comprises a server base frame, side plates detachably mounted on the left side and the right side of the server base frame, a top cover plate fixedly mounted on the upper surface of the server base frame and a bottom cover plate fixedly mounted on the lower surface of the server base frame. A first heat dissipation mechanism and a second heat dissipation mechanism are installed at the front end and the rear end of the server base frame correspondingly. Side mounting plates are arranged on the left side and the right side of the inner wall of the server base frame, circuit board assemblies are fixedly mounted on the sides, close to each other, of the two side mounting plates, and heat dissipation modules are mounted on the sides, away from the side mounting plates, of the circuit board assemblies. The heat dissipation device is provided with the free rotating unit capable of driving the air inlet fan and the exhaust fan for heat dissipation to rotate freely, so that the server can be subjected to comprehensive heat dissipation; and through the trapezoidal guide plates, the time of flowing gas in the ventilation duct is further prolonged, and the heat exchange efficiency is improved.

Description

Technical Field

[0001] The invention relates to the field of server heat dissipation, and in particular to a heat dissipation device for a server. Background Art

[0002] A server is a type of computer that runs faster, has a higher load, and is more expensive than an ordinary computer. A server provides computing or application services to other clients (such as PCs, smart phones, ATMs and other terminals, and even large equipment such as train systems) in the network. Servers have high-speed CPU computing power, long-term reliable operation, powerful I / O external data throughput capabilities, and better scalability.

[0003] The Chinese authorized patent with application number (CN202220598630.3) discloses a server chassis, including a chassis body, wherein the chassis body includes a component installation box, a heat dissipation box and a junction box, wherein the heat dissipation box is located on one side of the component installation box, and the junction box is located on the other side of the component installation box, a cover plate is installed at the front end of the component installation box, and a thermostat is installed at the upper end of the cover plate, a heat sink structure is installed inside the heat dissipation box, and a first heat dissipation fan, a second heat dissipation fan and a third heat dissipation fan are installed on the outer side of the heat dissipation box; The above technical solution cools the server by performing heat exchange through the cooling fan and the heat sink. However, the heat exchange effect between the airflow driven by the exhaust fan and the heat sink is poor, which can easily lead to heat accumulation inside the server and cannot be dissipated in time, thereby affecting the normal operation of the server. Summary of the invention

[0004] The objective of the present invention is achieved through the following technical solutions: A heat dissipation device for a server, comprising a server base frame, side panels detachably mounted on the left and right sides of the server base frame, a top cover plate fixedly mounted on the upper surface of the server base frame, and a bottom cover plate fixedly mounted on the lower surface of the server base frame, wherein a first heat dissipation mechanism and a second heat dissipation mechanism are respectively mounted on the front and rear ends of the server base frame; Side mounting plates are provided on both left and right sides of the inner wall of the server base frame. Circuit board assemblies are fixedly installed on the sides of the two side mounting plates close to each other, and a heat dissipation module is installed on the side of the circuit board assembly away from the side mounting plates.

[0005] Preferably, the heat dissipation mechanism 1 comprises a mounting base plate 1 detachably mounted on the front surface of the server frame and three air intake fans rotatably mounted on the mounting base plate 1 through free rotation units.

[0006] Preferably, the second heat dissipation mechanism comprises a second mounting base plate detachably mounted on the rear surface of the server frame and three exhaust fans rotatably mounted on the second mounting base plate through free rotation units.

[0007] Preferably, the free-rotating unit includes a free-rotating outer connection frame and a free-rotating inner connection frame, the free-rotating inner connection frame is rotatably installed and connected in the free-rotating outer connection frame, the air intake fan or the exhaust fan is installed and connected in the free-rotating outer connection frame, and the free-rotating outer connection frame is rotatably installed and connected in a mounting hole opened in mounting substrate one or mounting substrate two.

[0008] Preferably, one side of the freely rotatable external connection frame is rotatably connected to a side wall of the mounting hole in the horizontal direction through a horizontal rotation shaft; The other side of the freely rotatable external connection frame is rotatably connected to the other side wall of the mounting hole in the horizontal direction through a ball joint structure; One end of the horizontal rotating shaft away from the freely rotating outer connecting frame is connected with a horizontal driving micro motor for driving the horizontal rotating shaft to rotate. The horizontal driving micro motor is installed in a hole on the side wall of the installation hole.

[0009] Preferably, one end surface of the freely rotatable inner connection frame is rotatably connected to the inner wall of the freely rotatable outer connection frame via a first vertical rotation axis; The other end surface of the freely rotatable inner connection frame is rotatably connected to the inner wall of the freely rotatable outer connection frame away from the first vertical rotation axis through the second vertical rotation axis; The second vertical rotating shaft is connected with a vertical driving micro motor for driving the second vertical rotating shaft to rotate. The vertical driving micro motor is used to be installed in a side wall hole of an end face of the freely rotating outer connecting frame close to the second vertical rotating shaft.

[0010] Preferably, a power supply is fixedly mounted on the inner top surface of the server base frame, and the power supply is compatible with the structural size and position of the server base frame.

[0011] Preferably, the heat dissipation module includes a trapezoidal guide plate arranged on one side of the circuit board assembly, a plurality of corrugated heat exchange plates fixedly mounted on the side of the trapezoidal guide plate away from the circuit board assembly, and a thermal conductive silicone pad fixedly mounted on the side of the trapezoidal guide plate close to the circuit board assembly.

[0012] Preferably, the trapezoidal guide plate is in contact with the circuit board assembly via a thermally conductive silicone pad, and a plurality of corrugated heat exchange plates are arranged in a straight line at equal intervals in the length direction of the trapezoidal guide plate.

[0013] The beneficial effects of the present invention are as follows: the purpose of the present invention is to provide a heat dissipation device for a server, the heat dissipation device is provided with a free rotating unit capable of driving an inlet fan and an exhaust fan for heat dissipation to rotate freely (including horizontal rotation for heat dissipation and vertical rotation for heat dissipation), so as to fully dissipate the heat of the server; and, through the trapezoidal guide plate, the flowing gas entering the inside of the server base frame can flow along the ventilation duct formed between the two trapezoidal guide plates. Since the middle distance between the two trapezoidal guide plates is closer than the end portions, the airflow velocity can be accelerated when the airflow enters the ventilation duct, and at the same time, the corrugated heat exchange plate can exchange heat with the gas flowing through, and transfer heat to the flowing gas for heat dissipation. At the same time, when the gas flows along the corrugated heat exchange plate, the time of the flowing gas in the ventilation duct can be further increased, further compensating for the problem of reduced heat exchange efficiency caused by reduced contact time with the corrugated heat exchange plate due to the high airflow velocity. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A three-dimensional schematic diagram of a server base frame of a heat dissipation device for a server according to the present invention; Figure 2 A schematic diagram of a server base of a heat dissipation device for a server according to the present invention; Figure 3 A schematic diagram of a mounting base plate of a heat dissipation device for a server according to the present invention; Figure 4 A schematic diagram of an inlet fan of a heat dissipation device for a server according to the present invention; Figure 5 This is a schematic diagram of a side mounting plate of a heat dissipation device for a server according to the present invention; Figure 6 A schematic diagram of a corrugated heat exchange plate of a heat dissipation device for a server according to the present invention; Figure 7 It is a schematic diagram of a free-rotating unit of a heat dissipation device for a server according to the present invention; In the figure: 1. Server base frame; 2. Side panel; 3. Top cover; 4. Bottom cover; 5. Mounting base plate 2; 6. Exhaust fan; 7. Mounting base plate 1; 8. Inlet fan; 9. Power supply; 10. Side mounting plate; 11. Circuit board assembly; 12. Trapezoidal guide plate; 13. Thermal conductive silicone pad; 14. Corrugated heat exchange plate; 15. Freely rotating outer connection frame; 16. Freely rotating inner connection frame; 151. Ball joint structure. DETAILED DESCRIPTION

[0015] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0016] Example 1 like Figures 1 to 7 As shown, a heat dissipation device for a server comprises a server frame 1, side panels 2 detachably mounted on the left and right sides of the server frame 1, a top cover 3 fixedly mounted on the upper surface of the server frame 1, and a bottom cover 4 fixedly mounted on the lower surface of the server frame 1. The server frame 1, the side panels 2, the top cover 3, and the bottom cover 4 together constitute a server bearing base box body, which can be used for installing and using the server. A heat dissipation mechanism 1 and a heat dissipation mechanism 2 are respectively mounted on the front and rear ends of the server frame 1. The heat dissipation mechanism 1 and the heat dissipation mechanism 2 can respectively transport gas to one end of the server frame 1 and transport and discharge the hot gas inside the server frame 1. The heat generated inside the server base frame 1 is heat exchanged by using gas as a medium to reduce the internal temperature of the server base frame 1. Side mounting plates 10 are provided on the left and right sides of the inner wall of the server base frame 1. Circuit board assemblies 11 are fixedly installed on the sides of the two side mounting plates 10 close to each other. A heat dissipation module is installed on the side of the circuit board assembly 11 away from the side mounting plates 10. The heat dissipation module can facilitate the internal heat exchange of the server base frame 1. A power supply 9 is fixedly installed on the inner top surface of the server base frame 1. The power supply 9 is compatible with the structural size and position of the server base frame 1. The power supply 9 can be connected to an external power supply to power the power consumption unit inside the server base frame 1.

[0017] Furthermore, in an embodiment, the heat dissipation mechanism includes a mounting base plate 7 detachably mounted on the front surface of the server base frame 1 and three air intake fans 8 rotatably mounted on the mounting base plate 7 through free rotation units, and the free rotation unit can be controlled and adjusted to realize free rotation of the respective air intake fans 8 in the horizontal and vertical directions for heat dissipation; the air outside the server base frame 1 can be transported to the inside of the server base frame 1 through the arranged air intake fans 8, and air-cooling heat exchange is performed by utilizing the fact that the temperature of the external gas of the server base frame 1 is lower than the temperature of the server base frame 1, thereby taking away the heat generated inside the server base frame 1 through the flowing gas.

[0018] In addition, the heat dissipation mechanism 2 includes a mounting base 2 5 detachably mounted on the rear surface of the server base 1 and three exhaust fans 6 respectively mounted on the mounting base 2 5 through free rotation units; by controlling and adjusting the free rotation unit, it is possible to drive each exhaust fan 6 to freely rotate in the horizontal and vertical directions to "absorb heat"; the exhaust fans 6 can further increase the flow speed of the airflow inside the server base 1, thereby improving the heat dissipation effect inside the server base 1.

[0019] Example 2 On the basis of Example 1, in order to achieve better heat dissipation for the server, each of the inlet fans 8 and the exhaust fans 6 are freely rotatably installed through a free rotation unit in a hole specially provided for connecting the mounting substrate 1 7 of the inlet fan 8 and the mounting substrate 2 5 of the exhaust fan 6; that is, the free rotation unit for driving the exhaust fan 6 has the same structure and function as the inlet fan 8, and is specifically implemented as follows: The free-rotating unit includes a free-rotating outer connecting frame 15 and a free-rotating inner connecting frame 16. The free-rotating inner connecting frame 16 is rotatably installed and connected in the free-rotating outer connecting frame 15. The inlet fan 8 or the exhaust fan 6 is installed and connected in the free-rotating outer connecting frame 16. The free-rotating outer connecting frame 15 is rotatably installed and connected in the mounting hole opened in the mounting substrate 1 7 or the mounting substrate 2 5.

[0020] In addition, one side of the freely rotating external connection frame 15 is rotatably connected to a side wall of the mounting hole in the horizontal direction through a horizontal rotating shaft; the other side of the freely rotating external connection frame 15 is rotatably connected to the other side wall of the mounting hole in the horizontal direction through a ball joint structure 151; one end of the horizontal rotating shaft away from the freely rotating external connection frame 15 is connected to a horizontal driving micro motor for driving the horizontal rotating shaft to rotate, and the horizontal driving micro motor is installed in a hole on the side wall of the mounting hole.

[0021] At the same time, one end face of the freely rotating inner connecting frame 16 is rotatably connected to the inner wall of the freely rotating outer connecting frame through a first vertical rotating shaft; the other end face of the freely rotating inner connecting frame 16 is rotatably connected to the inner wall of the freely rotating outer connecting frame 15 away from the first vertical rotating shaft through a second vertical rotating shaft; a vertical driving micro motor for driving the second vertical rotating shaft to rotate is installed on the second vertical rotating shaft, and the vertical driving micro motor is used to be installed in a side wall hole of one end face of the freely rotating outer connecting frame 15 close to the second vertical rotating shaft.

[0022] By means of this arrangement, the unit can be freely rotated, as shown in FIG. Figure 7 As shown, that is, the ball joint structure 151 set on one side wall of the freely rotating external connection frame 15 can be "rotatably hinged" with the horizontal side wall of the mounting hole opened in the mounting substrate 1 7 or the mounting substrate 2 5, and the other horizontal side of the freely rotating external connection frame 15 is rotationally connected to the horizontal driving micro motor through a horizontal rotating shaft, and the horizontal driving micro motor is installed in the side wall hole of the mounting hole. By controlling the horizontal driving micro motor to drive the horizontal rotating shaft to rotate, under the rotation limiting action of the ball joint structure 151, it is possible to drive the rotating external connection frame 15 to "rotate vertically" in the mounting hole, thereby driving the exhaust fan 6 and the inlet fan 8 installed and connected in the rotating internal connection frame 16 to "move vertically to dissipate heat inside the server (inlet fan 8 for intake heat dissipation, exhaust fan 6 for suction heat dissipation)".

[0023] At the same time, the second vertical rotating shaft is driven to rotate by the vertical driving micro motor. Under the action of the rotation limit of the first vertical rotating shaft, the freely rotating inner connecting frame 16 arranged in the freely rotating outer connecting frame 15 is driven to "rotate horizontally", thereby driving the exhaust fan 6 and the inlet fan 8 installed on the freely rotating inner connecting frame 16 to "move horizontally to dissipate heat inside the server".

[0024] Therefore, the free-rotating unit can drive the exhaust fan 6 and the inlet fan 8 to perform active heat dissipation in the horizontal and vertical directions, thereby achieving the purpose of heat dissipation for each location inside the server that requires heat dissipation and improving the efficiency of heat dissipation.

[0025] Example 3 Specifically, the heat dissipation module includes a trapezoidal guide plate 12 arranged on one side of the circuit board assembly 11, a plurality of corrugated heat exchange sheets 14 fixedly installed on the side of the trapezoidal guide plate 12 away from the circuit board assembly 11, and a thermally conductive silicone pad 13 fixedly installed on the side of the trapezoidal guide plate 12 close to the circuit board assembly 11. The trapezoidal guide plate 12 contacts the circuit board assembly 11 through the thermally conductive silicone pad 13, and the plurality of corrugated heat exchange sheets 14 are arranged in a straight line with equal spacing in the length direction of the trapezoidal guide plate 12. The flowing gas entering the server base frame 1 can be discharged along the two trapezoidal guide plates. The ventilation duct formed between the flow plates 12 flows, and since the middle distance between the two trapezoidal guide plates 12 is closer than the end distance, the airflow velocity can be accelerated when the airflow enters the ventilation duct, and at the same time, the corrugated heat exchange plate 14 can exchange heat with the gas flowing through, and transfer the heat to the flowing gas for heat dissipation. At the same time, when the gas flows along the corrugated heat exchange plate 14, the time of the flowing gas in the ventilation duct can be further increased, and the problem of reduced heat exchange efficiency caused by the reduced contact time with the corrugated heat exchange plate 14 due to the high airflow velocity is further compensated.

[0026] Working principle: The air outside the server rack 1 can be transported to the inside of the server rack 1 by the inlet fan 8, and the air temperature outside the server rack 1 is lower than the temperature of the server rack 1 to perform air cooling heat exchange, so that the heat generated inside the server rack 1 is taken away by the flowing air; The exhaust fan 6 can further increase the flow speed of the airflow inside the server base frame 1, thereby improving the heat dissipation effect inside the server base frame 1. The flowing gas entering the server base frame 1 can flow along the ventilation duct formed between the two trapezoidal guide plates 12. Since the middle distance between the two trapezoidal guide plates 12 is closer than the end, the airflow speed can be accelerated when the airflow enters the ventilation duct. At the same time, the corrugated heat exchange plate 14 can exchange heat with the flowing gas and transfer the heat to the flowing gas for heat dissipation. At the same time, when the gas flows along the corrugated heat exchanger fins 14, the time the flowing gas spends in the ventilation duct can be further increased, further compensating for the problem of reduced heat exchange efficiency caused by reduced contact time with the corrugated heat exchanger fins 14 due to the high air flow velocity.

Claims

1. A heat dissipation device for a server, comprising a server frame (1), side panels (2) detachably mounted on the left and right sides of the server frame (1), a top cover (3) fixedly mounted on the upper surface of the server frame (1), and a bottom cover (4) fixedly mounted on the lower surface of the server frame (1), characterized in that: The server base frame (1) is provided with a first heat dissipation mechanism and a second heat dissipation mechanism installed at the front and rear ends respectively; The server base frame (1) is provided with side mounting plates (10) on both left and right sides of the inner wall, the two side mounting plates (10) are fixedly mounted with circuit board assemblies (11) on the sides close to each other, and a heat dissipation module is mounted on the sides of the circuit board assemblies (11) away from the side mounting plates (10).

2. A heat dissipation device for a server according to claim 1, characterized in that: The heat dissipation mechanism comprises a mounting base plate (7) detachably mounted on the front surface of the server base frame (1) and three air inlet fans (8) respectively rotatably mounted on the mounting base plate (7) via free rotation units.

3. A heat dissipation device for a server according to claim 2, characterized in that: The second heat dissipation mechanism comprises a second mounting base plate (5) detachably mounted on the rear surface of the server base frame (1) and three exhaust fans (6) rotatably mounted on the second mounting base plate (5) via free rotation units.

4. A heat dissipation device for a server according to claim 2 or 3, characterized in that: The free-rotating unit comprises a free-rotating outer connection frame (15) and a free-rotating inner connection frame (16); the free-rotating inner connection frame (16) is rotatably mounted and connected in the free-rotating outer connection frame (15); the air inlet fan (8) or the exhaust fan (6) is mounted and connected in the free-rotating outer connection frame (16); and the free-rotating outer connection frame (15) is rotatably mounted and connected in a mounting hole provided in mounting substrate one (7) or mounting substrate two (5).

5. A heat dissipation device for a server according to claim 4, characterized in that: One side of the freely rotatable external connection frame (15) is rotatably connected to a side wall of the mounting hole in the horizontal direction via a horizontal rotation shaft; The other side of the freely rotatable external connection frame (15) is rotatably connected to the other side wall of the mounting hole in the horizontal direction via a ball joint structure (151); One end of the horizontal rotating shaft away from the freely rotating external connection frame (15) is connected to a horizontal driving micro motor for driving the horizontal rotating shaft to rotate, and the horizontal driving micro motor is installed in a hole on the side wall of the installation hole.

6. A heat dissipation device for a server according to claim 5, characterized in that: One end surface of the freely rotatable inner connecting frame (16) is rotatably connected to the inner wall of the freely rotatable outer connecting frame via a first vertical rotating shaft; The other end surface of the freely rotatable inner connection frame (16) is rotatably connected to the inner wall of the freely rotatable outer connection frame (15) away from the first vertical rotation axis via a second vertical rotation axis; The second vertical rotating shaft is connected to a vertical driving micro motor for driving the second vertical rotating shaft to rotate. The vertical driving micro motor is installed in a hole on the side wall of a freely rotating external connection frame (15) close to an end face of the second vertical rotating shaft.

7. A heat dissipation device for a server according to claim 1, characterized in that: A power supply (9) is fixedly mounted on the inner top surface of the server base frame (1); the power supply (9) is compatible with the server base frame (1) in terms of structure, size and position.

8. The heat dissipation device for a server according to claim 1, characterized in that: The heat dissipation module comprises a trapezoidal guide plate (12) arranged on one side of the circuit board assembly (11), a plurality of corrugated heat exchange plates (14) fixedly mounted on a side of the trapezoidal guide plate (12) away from the circuit board assembly (11), and a heat conductive silicone pad (13) fixedly mounted on a side of the trapezoidal guide plate (12) close to the circuit board assembly (11).

9. A heat dissipation device for a server according to claim 1, characterized in that: The trapezoidal guide plate (12) is in contact with the circuit board assembly (11) via a heat-conducting silicone pad (13), and a plurality of corrugated heat exchange sheets (14) are arranged in a straight line at equal intervals in the length direction of the trapezoidal guide plate (12).

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