Electronic device including optical sensor mounted on back side of display

Abstract

There is provided an electronic device including an optical sensor mounted on a back surface of a display, the electronic device including: a housing including a front surface, a back surface opposite to the front surface, and a space between the front surface and the back surface; a display which is located inside the housing and is visible to the outside of the electronic device through the front surface of the housing; a support member that supports the display by protruding from the side surface toward the inside of the housing; an optical sensor including a light emitting unit and a light receiving unit, in which the optical sensor is located on a rear surface of the display and overlaps with at least one region of the display when viewed from a top of the front surface; and a partition wall member made of an elastic material, in which the partition wall member is located between the display and the optical sensor, and in which at least a partial region of the partition wall member is located between the light emitting unit and the light receiving unit to partition the light emitting unit from the light receiving unit.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application is a divisional application of patent application No. 202080051885.1 filed on January 17, 2022 (invention title: electronic device including an optical sensor mounted on the back of a display). The application is based on and claims priority from Korean Patent Application No. 10-2019-0086990 filed in the Korean Intellectual Property Office on July 18, 2019, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] The present disclosure generally relates to an electronic device including an optical sensor mounted behind a display of the electronic device. Background Art

[0004] An optical sensor is a device that detects information contained in light by converting light into electrical signals, and is composed of a light-emitting unit and a light-receiving unit to obtain information about an object.

[0005] Specifically, the optical sensor obtains information of an object, such as the shape and movement of the object, by measuring the amount of light generated by a light emitting unit, reflected on the object and returned to a light receiving unit.

[0006] Such an optical sensor is applied to a mobile device to acquire information such as whether a user exists in a position near the mobile device or whether a user's body is passing by the mobile device.

[0007] Since the optical sensor is a sensor using light, in order to ensure transmittance, the optical sensor is generally mounted on the bezel area of ​​the mobile device, but recently a method of mounting the optical sensor on the back (rear) of the display of the electronic device to expand the area of ​​the display has been proposed. Summary of the invention

[0008] Technical issues

[0009] The advantage of mounting the optical sensor on the back of the display of the electronic device is that the display area can be widened compared to the case where the optical sensor is mounted in the frame area, but the performance of the optical sensor is degraded due to diffusion generated at the bottom (or back) of the display.

[0010] Specifically, the diffusion generated at the bottom of the display increases the crosstalk, and due to the increase in crosstalk, the light receiving unit cannot separate the input signal reflected by the object from the crosstalk. That is, when the optical sensor is mounted on the back of the display, the display area is enlarged, but the performance of the optical sensor for sensing object information such as the shape and movement of the object may be degraded.

[0011] Solution to the problem

[0012] An electronic device includes: a shell, the shell including a front surface, a rear surface opposite to the front surface, and a space between the front surface and the rear surface; a display, the display is located inside the shell and is observable to the outside of the electronic device through the front surface of the shell; a supporting member, the supporting member supports the display by protruding from a side surface toward the inside of the shell; an optical sensor, the optical sensor including a light-emitting unit and a light-receiving unit, wherein the optical sensor is located on the rear surface of the display and overlaps with at least one area of ​​the display when viewed from the top of the front surface; and a partition wall member made of an elastic material, wherein the partition wall member is located between the display and the optical sensor, and at least a portion of the area of ​​the partition wall member is located between the light-emitting unit and the light-receiving unit to separate the light-emitting unit from the light-receiving unit.

[0013] Advantageous Effects of the Invention

[0014] An electronic device capable of preventing performance degradation of an optical sensor while reducing crosstalk caused by diffusion by arranging the optical sensor at the rear of a display. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent through the following description in conjunction with the accompanying drawings, in which:

[0016] Figure 1 is a block diagram of an electronic device in a network environment according to an embodiment;

[0017] Figure 2A is a perspective view of an electronic device according to an embodiment;

[0018] Figure 2B is viewed from the back according to the embodiment Figure 2A A perspective view of an electronic device;

[0019] Figure 3 is an exploded perspective view of an electronic device according to an embodiment;

[0020] Figure 4 is a view showing a partition wall member and an optical sensor provided on a rear surface of a display of an electronic device according to an embodiment;

[0021] Figure 5A According to the embodiment Figure 4 A cross-sectional view of the electronic device along the direction AA';

[0022] Figure 5B According to the embodiment Figure 4 A cross-sectional view of the electronic device along direction BB';

[0023] Fig. 6AAccording to the embodiment Figure 4 A cross-sectional view of the electronic device along the direction AA';

[0024] Figure 6B According to the embodiment Figure 4 A cross-sectional view of the electronic device along direction BB';

[0025] Figure 7 A partition wall member and an optical sensor provided on the back surface of a display of an electronic device according to an embodiment are shown;

[0026] Fig. 8A According to the embodiment Figure 7 A cross-sectional view of the electronic device along the direction CC';

[0027] Figure 8B According to the embodiment Figure 7 A cross-sectional view of the electronic device along the direction DD';

[0028] Fig.9A According to the embodiment Figure 7 A cross-sectional view of the electronic device along the direction CC';

[0029] Fig. 9B According to the embodiment Figure 7 A cross-sectional view of the electronic device along the direction DD';

[0030] Fig.10 A partition wall member and an optical sensor provided on the back surface of a display of an electronic device according to an embodiment are shown;

[0031] Fig.11A According to the embodiment Fig.10 A cross-sectional view of the electronic device along the direction EE';

[0032] Fig. 11B According to the embodiment Fig.10 A cross-sectional view of the electronic device along the direction FF';

[0033] Fig. 12A According to the embodiment Fig.10 A cross-sectional view of the electronic device along the direction EE';

[0034] Fig. 12B According to the embodiment Fig.10 A cross-sectional view of the electronic device along the direction FF';

[0035] Fig.13 illustrates electrical connections between a processor and an optical sensor according to an embodiment; and

[0036] Fig.14is a flow chart illustrating an operation of controlling an electronic device in response to an output value of an optical sensor according to an embodiment. DETAILED DESCRIPTION

[0037] Various embodiments of the present disclosure are described with reference to the accompanying drawings. However, the various embodiments of the present disclosure are not limited to specific embodiments, and it should be understood that various modifications, equivalents and / or substitutions may be made to the embodiments described herein. With respect to the description of the accompanying drawings, similar components may be marked with similar reference numerals.

[0038] Therefore, the present disclosure is directed to providing an electronic device capable of preventing performance degradation of an optical sensor while reducing crosstalk caused by diffusion by disposing the optical sensor on the rear surface of a display.

[0039] Figure 1 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input device 150, a sound output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the components (e.g., the display device 160 or the camera module 180) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit.For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented to be embedded in the display device 160 (eg, a display).

[0040] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may load a command or data received from another component (e.g., sensor module 176 or communication module 190) into the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. Additionally or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be specifically used for a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121 , or as part of the main processor 121 .

[0041] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., display device 160, sensor module 176, or communication module 190) among the components of the electronic device 101 (not the main processor 121), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., display device 160, sensor module 176, or communication module 190) among the components of the electronic device 101 together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) that is functionally related to the auxiliary processor 123.

[0042] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0043] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0044] The input device 150 may receive commands or data from outside the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus).

[0045] The sound output device 155 can output a sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records, and the receiver can be used for incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as a part of the speaker.

[0046] The display device 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display device 160 may include a touch circuit adapted to detect a touch or a sensor circuit (e.g., a pressure sensor) adapted to measure the strength of a force caused by a touch.

[0047] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input device 150, or output sound via the sound output device 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0048] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0049] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0050] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0051] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0052] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0053] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0054] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0055] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0056] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a PCB). According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as a part of the antenna module 197.

[0057] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0058] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 and the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute the requested at least part of the function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.

[0059] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0060] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but rather include various changes, equivalents, or alternative forms for the corresponding embodiments. For the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that a noun in the singular form corresponding to a term may include one or more things, unless the relevant context clearly indicates otherwise.

[0061] As used herein, each of phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B or C” may include any one or all possible combinations of items listed together with a corresponding one of the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish a corresponding component from another component and do not limit the components in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., the second element)”, “combined to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” when the terms “operably” or “communicatively” are used or when the terms “operably” or “communicatively” are not used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0062] As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0063] The various embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), but the term does not distinguish between data being semi-permanently stored in a storage medium and data being temporarily stored in a storage medium.

[0064] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be published in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be published online (e.g., downloaded or uploaded) via an application store (e.g., Play StoreTM), or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a manufacturer's server, an application store's server, or a memory of a forwarding server).

[0065] According to various embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

[0066] Figure 2A is a perspective view showing an electronic device 200 according to an embodiment. Figure 2B is a diagram showing a method according to an embodiment of the present invention. Figure 2A 2 is a perspective view of the back side of the electronic device 200.

[0067] refer to Figure 2A and Figure 2B , the electronic device 200 includes a housing 210, and the housing 210 includes a first face (or front face) 210A, a second face (or rear face) 210B, and a side face 210C surrounding a space between the first face 210A and the second face 210B. The housing may refer to a structure constituting a portion of the first face 210A, the second face 210B, and the third face 210C.

[0068] The front plate 202 may include two first areas 210D, which extend seamlessly by bending from the first surface 210A to the rear plate 211 at both ends of the long side of the front plate 202. The rear plate 211 may include two second areas 210E, which extend seamlessly by bending from the second surface 210B to the front plate 202 at both ends of the long side. The front plate 202 (or the rear plate 211) may include only one of the first areas 210D (or the second areas 210E). Some of the first areas 210D or the second areas 210E may not be included. In the side view of the electronic device 200, the side frame structure 218 may have a first thickness (or width) at the side that does not include the first area 210D or the second area 210E, and may have a second thickness thinner than the first thickness at the side that includes the first area 210E or the second area 210E.

[0069] The first surface 210A may be formed by a front plate 202 that is at least partially substantially transparent (eg, a glass plate or a polymer plate including various coatings). The front plate 202 may include a curved portion that smoothly extends from the first surface 210A to the rear plate 211.

[0070] The second surface 210B may be formed by a substantially opaque back plate 211. The back plate 211 may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium), or a combination of at least two of the above materials. The back plate 211 may include a curved portion extending from the second surface 210B to the front plate 202 and extending seamlessly.

[0071] The side 210C is connected to the front plate 202 and the back plate 211 and can be formed by a side frame structure (side member or side wall) 218 ​​including metal and / or polymer. The back plate 211 and the side frame structure 218 can be integrally formed and include the same material (e.g., a metal material such as aluminum).

[0072] The electronic device 200 may include at least one of the display 201, the audio module 203, the sensor module 207, the first camera module 205, the second camera module 206, the third camera module 212, the fourth camera module 213, the key input device 217, and the connector hole 208. The electronic device 200 may omit at least one of the components (e.g., the key input device 217), or additionally include other components.

[0073] The electronic device 200 may include a sensor module (e.g., a proximity sensor or an illumination sensor). The sensor module 207 may be provided at a position adjacent to the display 201. The sensor module may be mounted on the rear surface of the display 201 within the area provided by the front panel 202, and may be arranged in an integrated state with the display 201.

[0074] The electronic device 200 may further include a light emitting element disposed in a position adjacent to the display 201 in an area provided by the front plate 202. The light emitting device may provide status information of the electronic device 200 in the form of light. The light emitting element may provide, for example, a light source interlocked with the operation of the camera module. The light emitting device may include, for example, at least one of a light emitting diode (LED), an infrared (IR) LED, and a xenon lamp. The display 201 may be viewed from outside the electronic device 200 through a significant portion of the front plate 202. The edge of the display 201 may be formed to be substantially the same as the adjacent outer shape (e.g., a curved surface) of the front plate 202. In order to expand the visible area of ​​the display 201, the gap between the outer edge of the display 201 and the outer edge of the front plate 202 may be substantially the same. A recess or opening is formed in a portion of the screen display area of ​​the display 201 and is formed in another electronic component, such as a camera module 205 (aligned with the recess or opening), a proximity sensor, or an illumination sensor.

[0075] At least one of the first camera module 212, the second camera module 213, the fingerprint sensor 216, and the flash 206 may be included on the rear surface of the screen display area of ​​the display 201. The display 201 may be coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer that detects a magnetic field type stylus.

[0076] The audio module may include a microphone hole and a speaker hole 203. In the microphone hole, a microphone for acquiring external sound may be arranged inside, and in some embodiments, a plurality of microphones may be arranged to sense the direction of the sound. The speaker hole 203 and the microphone hole may be implemented as one hole, or may include only a speaker (e.g., a piezoelectric speaker) without a separate speaker hole.

[0077] The electronic device 200 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state by including a sensor module. The sensor module may include a fingerprint sensor integrated with or adjacent to the display 201 and / or a biometric sensor (e.g., a heart rate monitor (HRM) sensor) disposed on the second surface 210B of the housing 210. The electronic device 200 includes a sensor module, for example, a gesture sensor, a gyroscope sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared sensor, a liveness sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0078] The first camera module 205 is disposed on the first surface 210A of the electronic device 200, and the third camera module 212 is disposed on the second surface 210B and / or the second camera module 206 (e.g., a flash). The first camera module 205, the third camera module 212, and the fourth camera module 213 may include one or more lenses, image sensors, and / or ISPs. The second camera module 206 may include, for example, an LED or a xenon lamp. Two or more lenses (IR camera, wide-angle lens, and telephoto lens) and an image sensor may be disposed on one side of the electronic device 200.

[0079] The key input device 217 may be provided on the side 210C of the housing 210. The electronic device 200 may not include some or all of the key input devices 217 described above, and the key input device 217 may be implemented in other forms such as soft keys on the display 201. The key input device 217 may include at least a portion of the fingerprint sensor 216 provided on the second side 210B of the housing 210.

[0080] The connector hole 208 is a first connector hole that can accommodate a connector (e.g., a USB connector) for sending power and / or data to and receiving power and / or data from an external electronic device, and / or sending audio signals to and receiving audio signals from an external electronic device. The electronic device 200 may include a second connector hole (e.g., a headphone jack) that can accommodate a connector. The first connector hole and the second connector hole may be implemented as one hole 208. The electronic device 200 sends power and / or data to and receives power and / or data from an external electronic device without a connector hole. Audio signals may also be sent and received.

[0081] Figure 3 is an exploded perspective view of an electronic device according to an embodiment.

[0082] refer to Figure 3 , the electronic device 300 includes a housing 310, a first support member 311 (e.g., a bracket), a front plate 320, a display 330, a PCB 340, a battery 350, a second support member 360 (e.g., a rear case), an optical sensor 370, a partition member 380, and a rear plate 390. The electronic device 300 may omit at least one component (e.g., the first support member 311 or the second support member 360) or additionally include other components. At least one component of the electronic device 300 may be different from the first support member 311 or the second support member 360. Figure 2A and Figure 2B At least one component of the electronic device 200 is the same or similar. Repeated description will be omitted below.

[0083] The housing 310 includes a first surface (eg, Figure 2AThe front surface 210A in the embodiment, the second surface (eg, Figure 2B The back surface 210B in the electronic device 300 and the side surfaces (eg, Figure 2B side surface 210C).

[0084] The first support member 311 may be arranged inside the electronic device 300 and connected to the side surface of the housing 310, or may be integrally formed with the side surface of the housing 310. The first support member 311 may be made of a metal material and / or a non-metal (e.g., a polymer). The display 330 may be coupled to one surface of the first support member 311, and the PCB 340 may be coupled to the other surface.

[0085] The front plate 320 forms a first surface of the electronic device 300. The edge of the front plate 320 is connected to a portion of the side surface (or side wall) of the housing 310. The front plate 320 is made of a transparent polymer material or a glass material such as polycarbonate (PC), polymethyl methacrylate (PMMA), polyimide (PE), polyethylene terephthalate (PET), and polytrimethylene terephthalate (PPT). Here, the transparent polymer or glass material is only an example of a material forming the front plate 320, and the material of the front plate 320 is not necessarily limited thereto.

[0086] The display 330 is formed of multiple layers and is disposed between the front plate 320 and the first supporting member 311. The display 330 includes a base substrate, a thin film transistor (TFT) layer, an electrode layer, an organic material layer or a pixel layer. The display 330 also includes any suitable components, such as a thin film encapsulation layer that encapsulates the pixel layer and a back film for supporting the substrate. The display 330 emits light from the pixel to send information to the user, and the emitted light is sent to the outside through the front plate 320.

[0087] The display 330 may include a display panel or a touch panel. The touch panel may be provided on a unit of the display panel. The display 330 may be combined with or adjacent to a portion of a touch sensing circuit connected to the touch panel to sense a touch, a pressure sensor capable of measuring touch strength (pressure), or a digitizer for detecting a magnetic field type stylus.

[0088] PCB 340 may be equipped with processor 120, memory and / or interface. The processor may include one or more of a CPU, an AP, a GPU, an ISP, a sensor hub processor or a CP. The memory may include a volatile memory or a non-volatile memory. The interface may include an HDMI, a USB interface, an SD card interface and / or an audio interface. The interface may electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card / MMC connector or an audio connector.

[0089] The battery 350 is a device for supplying power to at least one component of the electronic device 300, and may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. In one example, an opening is formed in 340 so that at least a portion of the battery 350 can be arranged on the same plane as the PCB 340. The battery 350 may be integrally arranged inside the electronic device 300 or may be detachably arranged together with the electronic device 300.

[0090] The optical sensor 370 is located on the rear surface of the display 330 and includes a light emitting unit 371 and a light receiving unit 372. The optical sensor 370 measures the amount of light generated from the light emitting unit 371, reflected back to an object (e.g., a user), and returned to the light receiving unit 372, thereby determining information such as whether an object exists within a predetermined distance from the electronic device or the proximity of an object.

[0091] The partition wall member 380 is located between the display 330 and the optical sensor 370, and separates the light-emitting unit 371 and the light-receiving unit 372 in the optical sensor 370. When the light-emitting unit 371 of the optical sensor 370 generates light behind (or at the bottom of) the display 330, diffusion is generated due to the display 330, and interference input (i.e., crosstalk) to the light-receiving unit 372 increases. The partition wall member 380 is located between the light-emitting unit 371 and the light-receiving unit 372 to prevent the diffuse light from entering the light-receiving unit 372. As a result, even if the optical sensor 370 is located on the rear surface of the display 330, the performance of the optical sensor 370 is prevented from being deteriorated.

[0092] Figure 4 4 is a view illustrating a partition wall member 480 and an optical sensor 470 provided on a rear surface of a display 430 of an electronic device 400 according to an embodiment.

[0093] refer to Figure 4 , the electronic device 400 includes a housing 410, a support member 411, a display 430, an optical sensor 470, and a partition wall member 480. At least one component of the electronic device 400 may be connected to Figure 3 At least one component of the electronic device 300 is the same or similar, and repeated description will be omitted below.

[0094] When viewed from the front of the housing 410, the optical sensor 470 is located on the rear surface (or bottom) of the display 430 so as to overlap with at least one area of ​​the display 430. The optical sensor 470 includes a light emitting unit 471 and a light receiving unit 472. An opening 411A penetrating at least one area of ​​the support member 411 is formed in the support member 411 so that the optical sensor 470 can be located in the opening 411A.

[0095] The partition wall member 480 is located between the display 430 and the optical sensor 470. The partition wall member 480 is made of a black material and can absorb crosstalk incident in the direction of the light receiving unit 472. For example, the partition wall member 480 is formed of a compressible elastic material such as sponge, rubber, or polymer, so that even if external pressure is applied to the display 430, the optical sensor 470 can be prevented from damaging the display 430.

[0096] The partition wall member 480 is formed in a columnar shape surrounding at least a portion of the peripheral area of ​​the light receiving unit 472. When viewed from the top front of the housing 410, the partition wall member 480 is formed in a "C" shape bent in the direction of the light receiving unit 472. Since the partition wall member 480 is formed in a columnar shape surrounding at least a portion of the peripheral area of ​​the light receiving unit 472, it separates the light emitting unit 471 of the optical sensor 470 from the light receiving unit 472.

[0097] Table 1

[0098]

[0099] Table 1 is a table showing the ADC conversion amount of the crosstalk flowing into the light receiving unit 472 according to the presence or absence of the partition wall member 480 .

[0100] Referring to Table 1, in a case where the partition wall member 480 is not located between the light emitting unit 471 and the light receiving unit 472 of the optical sensor 470, the amount of crosstalk flowing into the light receiving unit 472 is 10,000 or more (for example, sample 1 represents 11,349, and sample 2 represents 14,572) (ADC conversion value). In a case where the partition wall member 480 is located between the light emitting unit 471 and the light receiving unit 472 of the optical sensor 470, the amount of crosstalk flowing into the light receiving unit 472 is reduced to a value of 500 or less (for example, sample 1 represents 479, and sample 2 represents 229) (ADC conversion value). That is, in the electronic device 400, by having the partition wall member 480 between the light emitting unit 471 and the light receiving unit 472, the amount of crosstalk flowing into the light receiving unit 472 is reduced by approximately 95%.

[0101] Figure 5A is Figure 4 A cross-sectional view of the electronic device 400 along the AA' direction. Figure 5B is Figure 4 A cross-sectional view of the electronic device 400 along the BB' direction.

[0102] refer to Figure 5A and Figure 5B, the electronic device 400 includes a housing 410 , a front plate 420 , a display 430 , a cover plate 431 , a support member 411 , an optical sensor 470 , a partition wall member 480 , an inserter 441 , and a PCB 440 .

[0103] The cover plate 431 is attached to the back of the display 430 to prevent the display 430 from being twisted or bent. For example, the cover plate 431 includes a black coated embossed layer 432 and a metal layer 433. The black coated embossed layer 432 includes an embossed (embossed) pattern and has an uneven area and a structure containing bubbles. In addition, since the black coated embossed layer 432 has been coated with black, it is prohibited (prevented) to observe the electronic device 400 from the outside of the electronic device 400. The metal layer 433 prevents the display 430 from being twisted or bent. According to an embodiment, the metal layer 433 is made of copper (Cu).

[0104] The cover plate 431 has a region in which at least one hole 431A is formed.

[0105] In one example, at least one hole 431A is formed at a position corresponding to the position of the light emitting unit 471 and the position of the light receiving unit 472 of the optical sensor 470 located on the rear (back) surface of the display 430, so that light generated by the light emitting unit 471 passes through the display 430 or light reflected by an object (e.g., a user) flows into the light receiving unit 472.

[0106] The support member 411 is formed by protruding from the side surface of the housing 410 or formed integrally with the side surface of the housing 410, thereby supporting the display 430 attached with the cover plate 431. The support member 411 includes at least one area in which an opening 411A for mounting an electronic component (e.g., an optical sensor) is formed.

[0107] The optical sensor 470 is located inside the opening 411A of the support member 411 to obtain information such as the presence or absence of an object within a predetermined distance from the electronic device or the proximity of an object. For example, the optical sensor 470 is electrically connected to the PCB 440 below the optical sensor 470 via the interposer 441. That is, the output value of the information including the object of the optical sensor 470 is sent to the electrically connected PCB 440, and the processor 120 mounted on the PCB 440 controls the driving (including on / off) of the electronic device 400 in response to the output value of the optical sensor 470.

[0108] The partition wall member 480 is located between the display 430 and the optical sensor 470, and more particularly, between the cover plate 431 attached to the rear surface of the display 430 and the optical sensor 470. The partition wall member 480 is formed in a columnar shape surrounding at least a portion of the peripheral area of ​​the light receiving unit 472 of the optical sensor 470, thereby preventing crosstalk generated by diffusion from flowing into the light receiving unit 472 (see Figure 5A ). For example, the partition wall member 480 is an elastic material (e.g., sponge, rubber or polymer having a high compression ratio), and the partition wall member 480 is located between the display 430 and the optical sensor 470 in a compressed state so that there is no gap between the display 430 and the optical sensor 470. That is, for the area where the partition wall member 480 is arranged, the internal space between the display 430 and the optical sensor 470 is completely shielded.

[0109] The partition wall member 480 is made of an elastic material having a specified compression ratio (compressibility) so as to be able to compensate for height deviations of the optical sensor 470, the interposer 441, and / or the PCB 440 occurring during the manufacturing process.

[0110] Table 2

[0111]

[0112]

[0113] Table 2 is a table showing the effect of compensating for the height deviation of the partition wall member 480 .

[0114] Referring to Table 2, as an example, if the shortest distance between the display 430 and the optical sensor 470, that is, the distance (air gap) between the bottom (or back) of the cover plate 431 and the optical sensor 470 (e.g., Figure 5A h) in Table 2 is 0.3 millimeters (mm), the actual air gap may not be 0.3 mm due to the overlap caused by the height variation of the optical sensor 470, the interposer 441 and / or the PCB 440. For example (e.g., Sample 1 in Table 2), if the overlap that occurs during the manufacturing process becomes 0.01 mm, the actual air gap is 0.29 mm. Or (e.g., Sample 2 in Table 2), if the overlap that occurs during the manufacturing process is 0.06 mm, the actual air gap becomes 0.24 mm.

[0115] When the distance between the cover plate 431 and the optical sensor 470 is designed to be 0.3 mm, a partition wall member 480 having a thickness (or height) of 0.3 mm corresponding to the air gap is provided between the cover plate 431 and the optical sensor 470. The partition wall member 480 is made of a material having a compression ratio of 33%, and the thickness (or height) of the partition wall member 480 can be compressed by 0.2 mm due to external pressure. That is, in one example (e.g., sample 1 in Table 2), the overlap is 0.01 mm. Here, the partition wall member 480 is able to compensate for an additional deviation of up to 0.09 mm. Alternatively (e.g., sample 2 in Table 2), if the resulting overlap is 0.06 mm, the partition wall member 480 is able to compensate for an additional deviation of up to 0.04 mm.

[0116] In order to compensate for the deviation of the optical sensor 470, the interposer 441 and / or the PCB 440 during the manufacturing process, the partition wall member 480 is preferably made of a material having a compression ratio greater than 30%. When considering the manufacturing cost and the availability of mass production, it is preferred that the partition wall member 480 is made of a material having a compression ratio between 30% and 40%. However, it is also acceptable for the partition wall member 480 to be made of a material having a compression ratio less than 30% or greater than 40%.

[0117] Fig. 6A According to the embodiment Figure 4 A cross-sectional view of the electronic device along direction AA'. Figure 6B According to the embodiment Figure 4 A cross-sectional view of the electronic device along direction BB'.

[0118] refer to Fig. 6A and Figure 6B , the electronic device 400 includes a housing 410, a front plate 420, a display 430, a cover plate 431, a support member 411, an optical sensor 470, a partition wall member 480, an inserter 441, a PCB 440 and a waterproof layer 412. Figure 5A and Figure 5B Description of the same or similar electronic device components in .

[0119] The waterproof layer 412 is located between the cover plate 431 attached to the back of the display 430 and the support member 411, and prevents water from entering between the cover plate 431 and the support member 411. For example, the waterproof layer 412 is formed of a waterproof tape and is attached to the lower surface of the cover plate 431 and the upper surface of the support member 411, respectively.

[0120] The opening 412A is formed in a region of the waterproof layer 412 corresponding to the opening 411A of the support member 411. The opening 412A provides a space in which electronic components are installed. The optical sensor 470 is located inside the opening 412A of the waterproof layer 412 and the opening 411A of the support member 411, so that information about the presence or absence of an object within a predetermined distance from the electronic device and / or the proximity of the object can be obtained.

[0121] The partition wall member 480 is located inside the opening 412A of the waterproof layer 412 and the opening 411A of the support member 411 and is formed in a columnar shape surrounding at least a portion of the peripheral area of ​​the light receiving unit 472 , thereby separating the light emitting unit 471 and the light receiving unit 472 of the optical sensor 470 .

[0122] Figure 7 is a diagram illustrating a partition wall member 780 and an optical sensor 770 provided on a rear surface of a display 730 of an electronic device 700 according to an embodiment.

[0123] refer to Figure 7 The electronic device 700 includes a housing 710, a support member 711, a display 730, an optical sensor 770, and a partition wall member 780. At least one of the components of the electronic device 700 may be connected to Figure 3 The electronic device 300 or Figure 4 The elements of the electronic device 400 are the same or similar, and repeated descriptions will be omitted below.

[0124] The supporting member 711 has at least one region in which an opening 711A is formed. The optical sensor 770 is located in the opening 711A.

[0125] The partition wall member 780 is located between the display 730 and the optical sensor 770, and completely surrounds the light receiving unit 772 of the optical sensor 770. That is, when viewed from the top of the front of the housing 710, the partition wall member 780 is formed in a cylindrical shape having a ring or annular shape, and completely surrounds the peripheral area of ​​the light receiving unit 772 of the optical sensor 770.

[0126] like Figure 4 As shown, if the partition wall member 480 is formed into a shape that surrounds (encloses) a portion (part) of the area of ​​the light receiving unit 472, the light diffused on the display 430 may not be completely blocked by the partition wall member, may be re-reflected in some areas of the partition wall member, and may be introduced into the light receiving unit.

[0127] On the other hand, the electronic device 700 includes a partition wall member 780 that completely surrounds the light receiving unit 772, and can reduce crosstalk generated due to diffusion on the display 730 and flowing into the light receiving unit 772. In addition, the partition wall member 780 can also reduce crosstalk that is re-reflected on the partition wall member 780 and flows into the light receiving unit 772. The partition wall member 780 can be located in the seat groove 714 formed in the support member 711.

[0128] Fig. 8A According to the embodiment Figure 7 A cross-sectional view of the electronic device along direction CC'. Figure 8B According to the embodiment Figure 7 A cross-sectional view of an electronic device along direction DD'.

[0129] refer to Fig. 8A and Figure 8B , the electronic device 700 includes a housing 710, a front plate 720, a display 730, a cover plate 731, a support member 711, an optical sensor 770, a partition wall member 780, an inserter 741, and a PCB 740. At least one component of the electronic device 700 may be connected to Figure 5A or one component of the electronic device 300 of 5B is the same or similar, and repeated description will be omitted.

[0130] The cover plate 731 includes a black coated embossed layer 732 and a metal layer 733. The cover plate 731 has at least one region in which a hole 731A is formed. For example, at least one hole 731A is formed in a region corresponding to the positions of the light emitting unit 771 and the light receiving unit 772 of the optical sensor 770 located on the rear surface of the display 730, and the at least one hole 731A allows light generated by the light emitting unit 771 to pass through the display 730 or light reflected by an object (e.g., a user) to flow into the light receiving unit 772.

[0131] The support member 711 has an opening 711A passing through at least one area of ​​the support member 711. The optical sensor 770 is located inside the opening 711A and is mounted on the rear surface of the display 730.

[0132] The partition wall member 780 is formed in a shape that completely surrounds the light receiving unit 772. When the partition wall member 780 is formed in a shape that completely surrounds the light receiving unit 772, the partition wall member 780 occupies a wider space than when the partition wall member 780 is formed in a shape that surrounds at least a portion of the periphery of the partition wall member 780. As a result, since the partition wall member 780 may damage other components (for example, the support member 711 or the display 730), it is necessary to ensure a space for placing the partition wall member 780.

[0133] In such Fig. 8A and Figure 8B In the electronic device 700 shown in FIG. 1 , a portion of the support member 711 (eg, Fig. 8A Area A or Figure 8B The partition wall member 780 is provided with a partition wall 780 in the region B to ensure installation space for at least a portion of the partition wall member 780. For example, by removing at least one region of the opening 711A adjacent to (close to) the light receiving unit 772 of the optical sensor 770 (for example, Fig. 8A A area in or Figure 8B B area in the figure), a formation is formed inside the opening 711A. As a result, a seat groove 714 is formed in at least one region inside the opening 711A.

[0134] like Figure 7 As shown, a portion of the partition wall member 780, that is, an area outside the outer peripheral surface of the opening 711A is located in the seat groove 714. When the seat groove 714 having the multi-stage structure 713 is formed in at least some areas inside the opening 711A, the partition wall member 780 is formed into a shape that completely surrounds the light receiving unit 772, and as a result, the blocking rate of the crosstalk flowing into the light receiving unit 772 is increased.

[0135] Fig.9A According to the embodiment Figure 7 A cross-sectional view of the electronic device along direction CC'. Fig. 9B According to the embodiment Figure 7 A cross-sectional view of an electronic device along direction DD'.

[0136] refer to Fig.9A and Fig. 9B , the electronic device 700 includes a housing 710, a front plate 720, a display 730, a cover plate 731, a support member 711, an optical sensor 770, a partition wall member 780, an inserter 741, a PCB 740 and a waterproof layer 712. Fig. 8A and Figure 8B Description of the same or similar parts in .

[0137] The waterproof layer 712 is located between the cover plate 731 and the support member 711, and prevents water from flowing between the cover plate 731 and the support member 711. The waterproof layer 712 is formed of, for example, a waterproof tape and is attached to the lower surface of the cover plate 731 and the upper surface of the support member 711, respectively. The waterproof tape is only one example of the waterproof layer 712, and the type of the waterproof layer is not limited thereto.

[0138] An opening 712A is formed in a region of the waterproof layer 712 corresponding to the opening 711A of the support member 711 to ensure a space for installing the optical sensor 770 on the back side of the display 730. That is, the optical sensor 770 is located inside the opening 711A of the support member 711 and the opening 712A of the waterproof layer 712 to obtain information such as whether an object exists within a predetermined distance and / or whether an object is close to the electronic device 700.

[0139] like Figure 7 As shown, when viewed from the top of the front surface 210A of the housing 710 , the partition wall member 780 is formed in a ring-shaped or annular column shape so as to completely surround the area around the light receiving unit 772 .

[0140] If the partition wall member 780 is formed in a shape that completely surrounds the area around the light receiving unit 772, the space occupied by the partition wall member 780 in the housing 710 becomes wider, and the partition wall member 780 may damage other components (for example, the support member 711 or the display 730). Therefore, in order to prevent the partition wall member 780 from damaging other components in the housing 710, it is necessary to ensure a space for placing the partition wall member 780. Fig.9A and Fig. 9B As shown, the area where the waterproof layer 712 is removed (e.g., Fig.9A The C region and Fig. 9B By removing at least a portion of the waterproof layer 712 area near the light receiving unit 772 of the optical sensor 770, a portion of the D area in the partition wall member 780 is formed between the waterproof layer 712 and the support member 711. The multi-stage structure 715 is formed to be lower than the waterproof layer 712. The multi-stage structure 715 formed between the waterproof layer 712 and the supporting member 711 exposes a portion of the supporting member 711 to form a seat groove 716. A portion of the partition wall member 780 is located in the seat groove 716.

[0141] The multi-stage structure 715 is formed in at least some areas inside the opening 712A of the waterproof layer 712, thereby providing a space for installing the partition wall member 780. As a result, in order not to damage other components inside the housing 710, the partition wall member 780 is formed in a shape that completely surrounds the light receiving unit 772.

[0142] Fig.10 A partition wall member and an optical sensor provided at the rear of a display of an electronic device according to an embodiment are shown.

[0143] refer to Fig.10The electronic device 1000 includes a housing 1010, a support member 1011, a display 1030, an optical sensor 1070, and a partition wall member 1080. At least one component of the electronic device 1000 is Figure 3 The electronic device 300, Figure 4 The electronic device 400 and Figure 7 At least one component of the electronic device 700 is the same or similar. The overlapping description thereof is omitted.

[0144] An opening 1011A is formed in at least one region of the support member 1011 to provide a space to place other components (eg, the optical sensor 1070) in the support member 1011. For example, the optical sensor 1070 is located inside the opening 1011A and thus is disposed on the back surface of the display 1030.

[0145] The partition wall member 1080 is located between the display 1030 and the optical sensor 1070, and includes a first partition wall 1081 and a second partition wall 1082. In one example, when viewed from the top of the front surface 210A of the housing 1010, the first partition wall 1081 is formed in a cylindrical shape having a ring or annular shape, and completely surrounds the peripheral area of ​​the light receiving unit 1072. In another example, when viewed from the top of the front surface 210A of the housing 1010, the second partition wall 1082 is formed in a cylindrical shape having a ring or annular shape, and completely surrounds the peripheral area of ​​the light emitting unit 1071. Due to the first partition wall 1081 and the second partition wall 1082, the partition wall member 1080 is in an "8" shape when viewed from the top of the front surface of the housing 1010.

[0146] The electronic device 1000 improves the blocking rate of the partition wall member 1080 against the crosstalk introduced into the light receiving unit 1072. The partition wall member 1080 completely surrounds (encloses) the light receiving unit 1072 and the light emitting unit 1071.

[0147] When foreign matter (e.g., dust) is introduced into the light emitting unit 1071 and / or the light receiving unit 1072, crosstalk caused by the foreign matter may occur. The electronic device 1000 includes a partition wall member 1080 that completely surrounds the light emitting unit 1071 and the light receiving unit 1072 to prevent foreign matter from being introduced into the light emitting unit 1071 and the light receiving unit 1072, thereby improving the sensing performance of the optical sensor 1070. The partition wall member 1080 is located on the seat groove 1014 formed in the support member 1011.

[0148] Fig.11A According to the embodiment Fig.10 A cross-sectional view of an electronic device along direction EE'. Fig. 11B According to the embodiment Fig.10 Cross-sectional view of the electronic device along direction FF'.

[0149] refer to Fig.11A and Fig. 11B , the electronic device 1000 includes a housing 1010, a front plate 1020, a display 1030, a cover plate 1031, a support member 1011, an optical sensor 1070, a partition wall member 1080, an inserter 1041, and a PCB 1040. At least one component of the electronic device 1000 may be connected to Fig. 8A and 8B The components of the electronic device 700 are the same or similar, and repeated description thereof will be omitted.

[0150] The cover plate 1031 includes a black coated embossed layer 1032 and a metal layer 1033. The cover plate 1031 has at least one area in which a hole 1031A is formed. In one example, the hole 1031A is formed in an area corresponding to the position of the light emitting unit 1071 of the optical sensor 1070 located on the back side of the display 1030 and the position of the light receiving unit 1072. Light generated by the light emitting unit 1071 passes through the display 1030, or light reflected by an object (e.g., a user) flows into the light receiving unit 1072.

[0151] The support member 1011 includes an opening 1011A passing through at least one region of the support member 1011 , and the optical sensor 1070 is located inside the opening 1011A and is mounted on the rear surface of the display 1030 .

[0152] like Fig.10 As shown, the partition wall member 1080 is formed into a shape that completely surrounds the light receiving unit 1072 and the light emitting unit 1071. Since the partition wall member 1080 completely surrounds the light receiving unit 1072, the space of the partition wall member 1080 inside the housing 1010 is wide. As a result, the partition wall member 1080 may damage other elements (for example, the support member 1011 or the display 1030). Therefore, it is necessary to ensure a space for placing the partition wall member 1080 in the housing 1010.

[0153] like Fig.11A and Fig. 11B As shown, the electronic device 1000 has at least one region (eg, Fig.11A The E area or Fig. 11B The F region in the figure is removed to ensure an area (e.g., installation space) where at least a portion of the partition wall member 1080 is arranged. By removing at least one area of ​​the opening 1011A adjacent to the light receiving unit 1072 of the optical sensor 1070 and at least one area of ​​the opening 1011A adjacent to the light emitting unit 1072, a space having a plurality of partition walls is formed inside the opening 1011A. As a result, a seat groove (inner mounting groove) 1014 is formed in at least one area inside the opening 1011A, such as Fig.10 As shown, an area deviated from the outer peripheral surface of the opening 1011A of the partition wall member 1080 is located in the seat groove 1014.

[0154] That is, since the seat groove 1014 having the multi-level structure 1013 is formed in at least a portion of the area inside the opening 1011A, the partition wall member 1080 can completely surround (enclose) the light emitting unit 1071 and the light receiving unit 1072. As a result, even if the optical sensor 1070 is installed on the back surface of the display 1030, the performance of the optical sensor 1070 can be maintained at the same level as the optical sensor 1070 installed in the bezel area.

[0155] Fig. 12A According to the embodiment Fig.10 A cross-sectional view of an electronic device along direction EE'. Fig. 12B According to the embodiment Fig.10 Cross-sectional view of the electronic device along direction FF'.

[0156] refer to Fig. 12A and Fig. 12B , the electronic device 1000 includes a housing 1010, a front plate 1020, a display 1030, a cover plate 1031, a support member 1011, an optical sensor 1070, a partition wall member 1080, an inserter 1041, a PCB 1040 and a waterproof layer 1012. Fig.11A and Fig. 11B Description of the parts that are the same or similar to the parts.

[0157] The waterproof layer 1012 is located between the cover plate 1031 and the support member 1011, thereby preventing water from flowing between the cover plate 1031 and the support member 1011. The waterproof layer 1012 is formed, for example, as a waterproof tape and is attached to the bottom surface of the cover plate 1031 and the upper surface of the support member 1011, respectively.

[0158] The opening 1012A is formed in an area of ​​the waterproof layer 1012 corresponding to the area of ​​the opening 1011A of the support member 1011, thereby providing a space for installing the optical sensor 1070 on the back surface of the display 1030. That is, the optical sensor 1070 is located in the opening 1011A of the support member 1011 and the opening 1012A of the waterproof layer 1012 to obtain information such as the presence or absence of an object and / or whether the object is approaching.

[0159] like Fig.10As shown, when viewed from the top of the front portion of the housing 1010 , the partition wall member 1080 is formed into a column type having an “8” shape and completely covers the peripheral areas of the light emitting unit 1071 and the light receiving unit 1072 .

[0160] The partition wall member 1080 formed to completely surround the light emitting unit 1071 and the light receiving unit 1072 requires a wide space inside the housing 1010, and as a result, the partition wall member 1080 may damage other components (for example, the support member 1011 or the display 1030). Therefore, it is necessary to ensure a space for placing the partition wall member 1080 to prevent the partition wall member 1080 from damaging other components in the housing 1010.

[0161] Remove the area of ​​waterproof layer 712 (e.g. Fig.11A The E area or Fig. 11B F area in the middle) to ensure space for placing at least a portion of the partition wall member 1080.

[0162] By removing at least one area of ​​the waterproof layer adjacent to the light receiving unit 1072 of the optical sensor 1070 and at least one area of ​​the waterproof layer 1012 adjacent to the light emitting unit 1071 of the optical sensor 1070, a gap having a plurality of layers is formed between the waterproof layer 1012 and the support member 1011. The multi-stage structure 1015 formed between the waterproof layer 1012 and the support member 1011 exposes a portion of the support member 1011 and is formed with a seat groove (installation groove) 1016. A portion of the partition wall member 1080 is located in the seat groove 1016.

[0163] That is, since the multi-stage structure 1015 is formed in at least some areas inside the opening of the waterproof layer 1012, the seat groove 1016 is formed in the support member 1011 to ensure a space in which the partition wall member 1080 is arranged. As a result, the partition wall member 1080 is formed to completely surround the light emitting unit 1071 and the light receiving unit 1072 without damaging other components in the housing 1010.

[0164] Fig.13 Shown is the electrical connection between a processor and an optical sensor according to an embodiment.

[0165] refer to Fig.13 , the electronic device 1300 includes a processor 1310 and an optical sensor 1320 located at the back of the display 330. The optical sensor 1320 is electrically connected to the processor 1310, and an output value of the optical sensor 1320 is transmitted to the processor 1310. The processor 1310 recognizes the transmitted output value of the optical sensor 1320 and controls the electronic device 1300 in response to the recognized output value.

[0166] In addition, the optical sensor 1320 may be electrically connected to the sensing hub, and the processor 1310 may receive an output value of the optical sensor 1320 from the sensing hub and control the electronic device 1300 .

[0167] Fig.14 is a flow chart illustrating an operation of controlling an electronic device in response to an output value of an optical sensor according to an embodiment.

[0168] refer to Fig.14 In step 1401, the processor 1310 of the electronic device 1300 recognizes an output value sent from the optical sensor 1320. Even when the display is activated, that is, in a driving state, the processor can receive an output value from the optical sensor mounted on the rear (back) surface of the display.

[0169] In step 1402, the processor 1310 of the electronic device determines information of an object (e.g., a user) based on the output value of the optical sensor 1320 identified in step 1401. For example, the processor 1310 may determine whether the object is within a predetermined distance from the electronic device 1300, or whether the object is close to (or using) the electronic device, based on the output value of the optical sensor 1320. The processor 1310 controls the driving of the electronic device based on the determined object information. The processor controls whether to drive the display on / off and / or drive the always-on display (AOD) mode on / off based on the output value of the optical sensor identified in step 1401. The processor determines whether the input touch is an erroneous touch based on the output value of the optical sensor identified in step 1401. The AOD mode may indicate a mode in which the display is always driven at low power.

[0170] In one example, based on the output value of the optical sensor and / or the driving of the recognition receiver (for example, through the operation of the microphone hole), if the display does not need to be driven because it is found that the user is talking through the receiver, the processor controls the display to be turned off to avoid unnecessary power consumption. Additionally or optionally, when the output value of the optical sensor indicates that the electronic device is located inside the bag, the processor stops the operation of the AOD mode because there is no need to actively maintain the AOD mode. Additionally or optionally, when the result of identifying the output value of the optical sensor indicates that the user is found close to the electronic device, and the application driven (i.e., being used) in the electronic device indicates that the user is calling, the processor determines whether the touch input on the display is an erroneous touch. Therefore, when the touch is judged to be erroneous, the processor does not drive the display to respond to the erroneous touch. When it is determined that the touch is not erroneous, the processor drives the display to display data by responding to the touch, thereby providing information to the user.

[0171] An electronic device according to various embodiments of the present disclosure includes: a shell including a front surface, a rear surface opposite to the front surface, and a side surface surrounding a space between the front surface and the rear surface; a display located inside the shell and viewable (visible) from the outside of the electronic device through the front surface of the shell; a supporting member supporting the display by protruding from the side surface to the inside of the shell; an optical sensor including a light-emitting unit and a light-receiving unit, and located on the rear surface of the display, overlapping with at least a portion of the display when viewed from the top of the front surface; a partition wall member located between the display and the optical sensor, and made of an elastic material, wherein the partition wall member has at least a partial area located between the light-emitting unit and the light-receiving unit to separate the light-emitting unit from the light-receiving unit.

[0172] The partition wall member may be located in a compressed state between the display and the optical sensor.

[0173] The support member may include an opening penetrating at least a portion of an area of ​​the support member, and the optical sensor may be located inside the opening.

[0174] The partition wall member may be formed in a shape surrounding at least a portion of the light receiving unit.

[0175] The partition wall member may be formed in a shape that completely surrounds (encloses) the light receiving unit.

[0176] The partition wall member may include a first partition wall surrounding at least a portion of the light receiving unit and a second partition wall surrounding at least some areas of the light emitting unit.

[0177] A seating groove having a multi-stage structure may be formed in at least one region inside the opening.

[0178] At least a portion of the partition wall member may be located in the seating groove.

[0179] A processor operably connected to the optical sensor may also be included, wherein the processor determines access by an external object in response to an output value of the optical sensor and performs a predetermined operation in response to the determination.

[0180] The processor may be configured to determine access of an external object in response to an output value of the optical sensor even when the display is driven (eg, when the display is in a turned-on state).

[0181] The predetermined operation may include at least one of turning on the display, turning off the display, maintaining the AOD mode, or determining an erroneous touch.

[0182] An electronic device according to various embodiments of the present disclosure includes: a shell including a front surface, a rear surface opposite to the front surface, and a side surface surrounding a space between the front surface and the rear surface; a display located inside the shell and visible to the outside of the electronic device through the front surface of the shell; a waterproof layer attached to the rear surface of the display; a supporting member located on the rear surface of the waterproof layer and used to support the display by protruding from the side surface toward the inside of the shell; an optical sensor including a light-emitting unit and a light-receiving unit, and located on the rear surface of the display, overlapping with at least one area of ​​the display when viewed from the top of the front surface; and a partition wall member made of an elastic material and located between the optical sensor and the display, wherein the partition wall member has at least a portion located between the light-emitting unit and the light-receiving unit to separate the light-emitting unit from the light-receiving unit.

[0183] The partition wall member may be formed in a shape surrounding at least a portion of the light receiving unit.

[0184] The partition wall member may be formed in a shape that completely surrounds the light receiving unit.

[0185] The partition wall member may include a first partition wall surrounding at least a partial area of ​​the light receiving unit and a second partition wall surrounding at least a partial area of ​​the light emitting unit.

[0186] The waterproof layer may include a first opening penetrating at least a portion of the waterproof layer, and the supporting member may include a second opening penetrating an area corresponding to the first opening area.

[0187] The optical sensor may be located within the first opening and the second opening.

[0188] The multi-stage structure may be formed between at least one region inside the first opening and at least one region inside the second opening, the at least one region inside the second opening corresponding to at least one region inside the first opening. A seat groove may be formed inside the second opening, and at least a portion of the partition wall member is located in the seat groove.

[0189] A processor electrically connected to the optical sensor may further be included, wherein the processor determines access by an external object in response to an output value of the optical sensor and performs a predetermined operation in response to the determination.

[0190] The processor may be configured to determine access of the external object in response to an output value of the optical sensor even when the display is driven in an on state.

[0191] Therefore, the electronic device according to various embodiments of the present disclosure can reduce crosstalk caused by diffusion, thereby reducing performance degradation of the optical sensor that occurs when the optical sensor is mounted on the rear surface of the display.

[0192] Furthermore, in the electronic device according to various embodiments, when a user input is applied to the display, damage to the display by the optical sensor may be reduced.

[0193] In the above-mentioned embodiments of the present disclosure, the components included in the present disclosure are expressed in the singular or plural according to the specific embodiments presented. However, for the convenience of explanation, the presented situations appropriately select the singular or plural expressions, and the present disclosure is not limited to singular or plural components, and even the components expressed in the plural may be composed of singular components, or the components expressed in the singular may be composed of plural components.

[0194] While the present disclosure has been particularly shown and described with reference to certain embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents.

Claims

1. An electronic device, comprising: a housing, the housing comprising a first surface, a second surface opposite to the first surface, and a side surface surrounding a space between the first surface and the second surface; a display, the display being visible to the outside of the electronic device through the first surface of the housing; a cover plate, wherein the cover plate is disposed below the display when viewed in a direction perpendicular to the first surface; an optical sensor, the optical sensor comprising a light emitting unit and a light receiving unit, wherein the optical sensor is located below the display and overlaps with at least one area of ​​the display when viewed in a direction perpendicular to the first surface; and a partition wall member disposed between the cover plate and the optical sensor, When viewed in a direction perpendicular to the first surface, at least a portion of the partition wall member is located between the light emitting unit and the light receiving unit. wherein the cover plate comprises at least one hole, and Wherein, when viewed in a direction perpendicular to the first surface, the optical sensor is visible through the at least one hole.

2. The electronic device according to claim 1, further comprising a supporting member for supporting the display, in, The support member includes an opening formed through at least a partial area of ​​the support member, and the optical sensor is located in the opening.

3. The electronic device according to claim 1, wherein: The partition wall member is provided to surround at least a portion of the light receiving unit when viewed in a direction perpendicular to the first surface.

4. The electronic device according to claim 1, wherein: The partition wall member has a concave shape facing the light receiving unit when viewed in a direction perpendicular to the first surface.

5. The electronic device according to claim 1, wherein: The partition wall member is formed of a black material that absorbs light, thereby reducing crosstalk.

6. The electronic device according to claim 1, wherein: The cover plate includes a metal layer formed of copper, and The at least one hole included in the cover plate includes a first hole and a second hole, the first hole is positioned to correspond to the light emitting unit of the optical sensor, and the second hole is positioned to correspond to the light receiving unit of the optical sensor.

7. The electronic device according to claim 1, wherein: The partition wall member is disposed so as to surround the light receiving unit when viewed in a direction perpendicular to the first surface.

8. The electronic device according to claim 1, wherein: The cover plate includes a metal layer and a black embossed layer.

9. The electronic device according to claim 1, further comprising: A waterproof layer is attached to the rear surface of the cover plate.

10. The electronic device according to claim 9, wherein: The waterproof layer is formed by a waterproof tape.

11. The electronic device of claim 1 , further comprising a processor operably connected to the optical sensor, in, The processor determines whether an external object is within a predetermined distance from the electronic device in response to an output value of the optical sensor, and performs a designated operation in response to the determination.

12. The electronic device according to claim 11, wherein: The processor is configured to determine whether the external object is within a predetermined distance from the electronic device in response to an output value of the optical sensor when the display is in an on state.

13. The electronic device according to claim 11, wherein: The designated operation includes a turn-on mode of the display, a turn-off mode of the display, an always-on display (AOD) mode of the display, or determining whether an input touch is an erroneous touch input.

14. The electronic device according to claim 1, wherein: The partition wall member is disposed so as to completely surround the light receiving unit when viewed in a direction perpendicular to the first surface, and is disposed so as to completely surround the light emitting unit when viewed in a direction perpendicular to the first surface.

15. The electronic device according to claim 1, wherein: The partition wall member includes a first portion completely surrounding the light receiving unit and a second portion completely surrounding the light emitting unit.

16. The electronic device according to claim 1, in, The partition wall member comprises a third hole and a fourth hole, the third hole at least partially corresponding to the at least one hole of the cover plate, the fourth hole at least partially corresponding to the at least one hole of the cover plate, wherein the third hole of the partition wall member is positioned to correspond to the light receiving unit of the optical sensor, and Wherein, the fourth hole of the partition wall member is positioned to correspond to the light emitting unit of the optical sensor.

17. The electronic device according to claim 16, in, When viewed in a direction perpendicular to the first surface, the light receiving unit is visible through the third hole, and When viewed along a direction perpendicular to the first surface, the light-emitting unit is visible through the fourth hole.

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