Display module and display device

Abstract

The invention relates to a display module and a display device. The display module comprises a display panel, a supporting layer, a flexible circuit board and an auxiliary structure, the display panel comprises a display part and a binding part located on the side, away from a display face, of the display part. The supporting layer is arranged on the side, away from the display face, of the display part and located between the display part and the binding part. The flexible circuit board comprises a connecting part and a circuit board main body, one end of the connecting part is connected to the binding part, and the other end of the connecting part is connected to the circuit board main body; the auxiliary structure is connected with the circuit board main body and is attached to one surface, far away from the display part, of the supporting layer; wherein the orthographic projection of at least part of the auxiliary structure on the supporting layer is not overlapped with the orthographic projection of the flexible circuit board on the supporting layer, and the material of the auxiliary structure comprises a metal material; according to the display module, the yield of the Bending process of the display module can be improved, and the stability of the display module is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] As users’ requirements for display modules become higher and higher, such as longer battery life, device manufacturers have begun to reduce the size of various components.

[0003] In a display module, a flexible circuit board is often placed on the back side of a display panel, so that the flexible circuit board occupies a certain space. In order to save space on the back side of the display panel to meet higher user demands, such as increasing the volume of the battery to improve battery life, it is necessary to reduce the volume of the flexible circuit board, resulting in a smaller area of ​​the flexible circuit board.

[0004] Currently, in the bending process of flexible circuit boards, bending equipment is often used to control the flexible circuit boards to be placed on the back side of the display panel. Due to the small area of ​​the flexible circuit boards, it is difficult to adsorb and control the flexible circuit boards through the bending equipment, resulting in a decrease in the yield of the bending process of the flexible circuit boards. Summary of the invention

[0005] The embodiments of the present application provide a display module and a display device, which can improve the yield of the bending process of the display module and improve the stability of the display module.

[0006] The present application provides a display module, which includes:

[0007] The display panel comprises a display portion and a binding portion located at a side of the display portion away from a display surface;

[0008] A supporting layer, arranged on a side of the display portion away from the display surface and located between the display portion and the binding portion;

[0009] A flexible circuit board, comprising a connecting portion and a circuit board body, wherein one end of the connecting portion is connected to the binding portion, and the other end of the connecting portion is connected to the circuit board body;

[0010] An auxiliary structure connected to the circuit board body, wherein the auxiliary structure is attached to a side of the support layer away from the display portion;

[0011] The orthographic projection of at least part of the auxiliary structure on the support layer does not overlap with the orthographic projection of the flexible circuit board on the support layer, and the material of the auxiliary structure includes a metal material.

[0012] In one embodiment of the present application, the circuit board body is located on a side of the connecting portion away from the binding portion, the orthographic projection of the auxiliary structure on the supporting layer does not overlap with the orthographic projection of the binding portion on the supporting layer, and the circuit board body is attached to a side of the auxiliary structure away from the supporting layer.

[0013] In one embodiment of the present application, the auxiliary structure includes a first sub-portion attached to the circuit board body and a second sub-portion connected to the first sub-portion, the orthographic projection of the first sub-portion on the support layer is located within the orthographic projection of the circuit board body on the support layer, and the orthographic projection of the second sub-portion on the support layer is located outside the orthographic projection of the circuit board body on the support layer;

[0014] Wherein, the second sub-portion is located at a side of the circuit board body away from the connecting portion.

[0015] In one embodiment of the present application, the display module further includes a first adhesive layer disposed between the circuit board body and the auxiliary structure and a second adhesive layer disposed between the support layer and the auxiliary structure;

[0016] The orthographic projection of the first adhesive layer on the support layer is located within the orthographic projection of the circuit board body on the support layer, and the orthographic projection of the second adhesive layer on the support layer is located within the orthographic projection of the auxiliary structure on the support layer.

[0017] In an embodiment of the present application, the material of the auxiliary structure and the material of the support layer both include the same metal material.

[0018] In one embodiment of the present application, the circuit board body is attached to a side of the support layer away from the display portion;

[0019] The auxiliary structure is connected to a side of the circuit board body away from the connecting portion, and an orthographic projection of the auxiliary structure on the supporting layer does not overlap with an orthographic projection of the circuit board body on the supporting layer.

[0020] In one embodiment of the present application, the circuit board body includes a plurality of stacked sub-layers, and the auxiliary structure is connected to at least one of the sub-layers;

[0021] The auxiliary structure is made of the same material as the sub-layer to which it is connected.

[0022] In one embodiment of the present application, the display module also includes a third adhesive layer arranged between the supporting layer and the circuit board body and a fourth adhesive layer arranged between the supporting layer and the auxiliary structure, and the thickness of the fourth adhesive layer is less than the thickness of the third adhesive layer.

[0023] In one embodiment of the present application, the third adhesive layer is connected to the fourth adhesive layer, and the material of the third adhesive layer is the same as that of the fourth adhesive layer.

[0024] In one embodiment of the present application, the thickness of the auxiliary structure is smaller than the thickness of the circuit board body.

[0025] In an embodiment of the present application, a groove is formed on a side of the support layer away from the display portion, and at least the auxiliary structure is attached to the groove.

[0026] In one embodiment of the present application, a distance from a side of the auxiliary structure away from the display portion to the bottom of the groove is less than or equal to a depth of the groove.

[0027] In one embodiment of the present application, the depth of the groove is less than or equal to half of the thickness of the support layer.

[0028] In one embodiment of the present application, the orthographic projection of the auxiliary structure on the supporting layer is located in the groove, and the orthographic projection area of ​​the auxiliary structure on the supporting layer is smaller than the area of ​​the groove.

[0029] In one embodiment of the present application, the display module includes a bending region, the supporting layer includes a patterned structure disposed in the bending region, and the groove is located outside the bending region.

[0030] In one embodiment of the present application, the display module further includes:

[0031] A cover plate, disposed on a side of the display panel away from the support layer;

[0032] A first back plate, disposed between the display portion and the support layer;

[0033] A buffer layer, disposed between the first back plate and the support layer;

[0034] The second back plate is arranged between the binding portion and the supporting layer.

[0035] According to the above-mentioned purpose of the present application, an embodiment of the present application further provides a display device, which includes the display module.

[0036] The present application provides a display module and a display device, by adding an auxiliary structure connected to a circuit board body, and at least part of the auxiliary structure is not overlapped with the circuit board body, so that the auxiliary structure that does not overlap with the circuit board body can be used for adsorption with an adsorption device of a bending device to complete the bending process of the display module, and the auxiliary structure will be attached to the side of the support layer away from the display part, and does not need to be torn off, so that no stress will be generated on the circuit board body due to tearing off the auxiliary structure, thereby reducing the probability of the circuit board body falling off, and can improve the yield of the bending process of the display module and improve the stability of the display module.

[0037] Other features and advantages of the present application will be described in detail in the subsequent specific implementation section. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0039] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same figure numbers represent the same parts in the following description.

[0040] Figure 1 A schematic diagram of the structure of a display panel provided by an embodiment;

[0041] Figure 2 and Figure 3 A schematic diagram of the bending process structure of a display panel provided by an embodiment;

[0042] Figure 4 A schematic diagram of the structure of a display panel provided in an embodiment of the present application;

[0043] Figure 5 and Figure 6 A schematic diagram of a bending process structure of a display panel provided in an embodiment of the present application;

[0044] Figure 7 A structural schematic diagram of a flexible circuit board and auxiliary structure provided in an embodiment of the present application;

[0045] Figure 8 A schematic diagram of a top view of the auxiliary structure and the second adhesive layer provided in an embodiment of the present application;

[0046] Fig. 9A schematic side view of the auxiliary structure, the first adhesive layer and the second adhesive layer provided in an embodiment of the present application;

[0047] Fig.10 A schematic diagram of a top view of the auxiliary structure and the first adhesive layer provided in an embodiment of the present application;

[0048] Fig.11 Provided in the embodiments of this application Figure 1 and Figure 4 The shown display module's impact test bar graph;

[0049] Fig.12 Another schematic diagram of the structure of a display panel provided in an embodiment of the present application;

[0050] Fig.13 A structural schematic diagram of the auxiliary structure and the circuit board body provided in the embodiment of the present application;

[0051] Fig.14 Another structural schematic diagram of the auxiliary structure and the circuit board body provided in an embodiment of the present application.

[0052] Description of reference numerals:

[0053] 1. Display panel; 2. Support plate; 3. Flexible circuit board; 4. Adhesive layer; 5. Support film;

[0054] 10. display panel; 11. display portion; 12. binding portion; 13. bending portion; 101. display surface;

[0055] 20. support layer; 201. groove;

[0056] 30. flexible circuit board; 31. circuit board body; 32. connection part; 301. device area; 311. sublayer;

[0057] 40. auxiliary structure; 401. adsorption area;

[0058] 51, first adhesive layer; 52, second adhesive layer; 53, third adhesive layer; 54, fourth adhesive layer;

[0059] 61. Cover plate; 62. Fifth adhesive layer; 63. Polarizer; 641. First back plate; 642. Second back plate; 65. Buffer layer; 66. Spacer layer; 67. Bending protection part. DETAILED DESCRIPTION

[0060] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0061] Please combine Figure 1 , Figure 2 as well as Figure 3 In one embodiment, the display module includes a display panel 1, a support plate 2 arranged on the back side of the display panel 1, and a flexible circuit board 3 attached to the side of the support plate 2 away from the display panel, and the flexible circuit board 3 is bonded to the support plate 2 through a glue layer 4; in the bending process of the flexible circuit board 3, since the area of ​​the flexible circuit board 3 is compressed, it is difficult for the bending device to directly adsorb the flexible circuit board 3, therefore, a support film 5 is attached to the flexible circuit board 3, and the bending device adsorbs the support film 5 and drives the flexible circuit board 3 to be bent; however, when the adhesion between the support film 5 and the flexible circuit board 3 is insufficient, the support film 5 is likely to fall off, thereby causing the flexible circuit board 3 to be unable to be pulled to the preset position, such as Figure 3 As shown; currently, the yield of Bending is often improved by enhancing the adhesion between the support film 5 and the flexible circuit board 3. However, when the support film 5 is torn off, due to the large adhesion between the support film 5 and the flexible circuit board 3, the adhesive layer 4 and the support board 2 fall off and separate, which causes the flexible circuit board 3 to interfere with other components of the display module, seriously affecting the Bending yield and stability of the display module.

[0062] Please refer to Figure 4 The embodiment of the present application provides a display module, which includes a display panel 10, a supporting layer 20, a flexible circuit board 30 and an auxiliary structure 40; the display panel 10 includes a display portion 11 and a binding portion 12 located on a side of the display portion 11 away from a display surface 101; the supporting layer 20 is arranged on a side of the display portion 11 away from the display surface 101, and is located between the display portion 11 and the binding portion 12; the flexible circuit board 30 includes a connecting portion 32 and a circuit board body 31, one end of the connecting portion 32 is connected to the binding portion 12, and the other end of the connecting portion 32 is connected to the circuit board body 31; the auxiliary structure 40 is connected to the circuit board body 31, and the auxiliary structure 40 is attached to a side of the supporting layer 20 away from the display portion 11.

[0063] The orthographic projection of at least part of the auxiliary structure 40 on the support layer 20 does not overlap with the orthographic projection of the flexible circuit board 30 on the support layer 20 , and the material of the auxiliary structure 40 includes a metal material.

[0064] During the implementation of the application, the embodiment of the present application adds the auxiliary structure 40 connected to the circuit board body 31, and at least part of the auxiliary structure 40 is not overlapped with the circuit board body 31, so that the auxiliary structure 40 that does not overlap with the circuit board body 31 can be used for adsorption with the adsorption device of the Bending equipment to complete the Bending process of the display module, and the auxiliary structure 40 will be attached to the side of the support layer 20 away from the display part 11 and does not need to be torn off, so that the circuit board body 31 will not be stressed due to the tearing off of the auxiliary structure 40, thereby reducing the probability of the circuit board body 31 falling off, and can improve the yield of the Bending process of the display module and improve the stability of the display module.

[0065] It should be noted that one end of the display panel 10 is bent and extended toward a side away from the display surface 101; specifically, the display panel 10 also includes a bending portion 13 connected between the display portion 11 and the binding portion 12, the display portion 11 can be straight, the binding portion 12 is located on the side of the display portion 11 away from the display surface 101, and the bending portion 13 is bent and connected between the end of the display portion 11 and the end of the binding portion 12.

[0066] In some embodiments, the display module also includes a cover plate 61 arranged on one side of the display surface 101 of the display unit 11, a third adhesive layer 62 arranged between the display unit 11 and the cover plate 61, and a polarizer 63 arranged between the third adhesive layer 62 and the display unit 11, and the polarizer 63 is bonded to the cover plate 61 through the third adhesive layer 62, and the polarizer 63 can be attached to the display surface 101 of the display unit 11.

[0067] In some embodiments, the display module may not include the polarizer 63, and the cover plate 61 is directly attached to the display surface 101 of the display unit 11 through the third adhesive layer 62, and the display panel 10 may be an OLED display panel. A color film layer may be added to the display panel 10 to achieve the functions of filtering, anti-reflection and replacing the polarizer.

[0068] In some embodiments, the display module also includes a first back panel 641 disposed between the display portion 11 and the supporting layer 20, a buffer layer 65 disposed between the first back panel 641 and the supporting layer 20, a second back panel 642 disposed between the binding portion 12 and the supporting layer 20, a spacer portion 66 disposed between the second back panel 642 and the supporting layer 20, and a bending protection portion 67 covering the outer side of the bending of the bending portion 13.

[0069] The support layer 20 , the first back plate 641 , the buffer layer 65 , the second back plate 642 and the spacer portion 66 are all located on the inner side of the bend of the bend portion 13 , and the bend protection portion 67 covers the outer side of the bend of the bend portion 13 .

[0070] In some embodiments, the material of the buffer layer 65 may include at least one of polyimide, polyurethane rubber, silicon-containing polyurethane rubber and foam to support and buffer the display panel, and the material of the support layer 20 may include stainless steel, aluminum alloy or titanium alloy to support and protect the display panel.

[0071] In the embodiment of the present application, one end of the flexible circuit board 30 is connected to the binding portion 12, and the other end of the flexible circuit board 30 extends in a direction away from the binding portion 12 and is attached to a side of the supporting layer 20 away from the display portion 11; specifically, the flexible circuit board 30 includes a connecting portion 32 and a circuit board body 31 connected to each other, and the connecting portion 32 is connected to the binding portion 12, the circuit board body 31 extends in a direction away from the binding portion 12, and is attached to a side of the supporting layer 20 away from the display portion 11, that is, the circuit board body 31 is located on a side of the connecting portion 32 away from the binding portion 12.

[0072] In some embodiments, a device area 301 is provided on the circuit board body 31 for arranging lines, circuits, components, etc.

[0073] Please combine Figure 4 , Figure 5 as well as Figure 6 The display module provided in the embodiment of the present application includes an auxiliary structure 40, and the auxiliary structure 40 is connected to the flexible circuit board 30, and the auxiliary structure 40 is attached to the side of the supporting layer 20 away from the display part 11.

[0074] Among them, the orthographic projection of the auxiliary structure 40 on the supporting layer 20 does not overlap with the orthographic projection of the binding part 12 on the supporting layer 20, and at least part of the auxiliary structure 40 is not overlapped with the flexible circuit board 30. The auxiliary structure 40 that is not overlapped with the flexible circuit board 30 is provided with an adsorption area 401 for adsorption with the adsorption device of the Bending equipment, such as adsorption with the suction nozzle of the Bending equipment.

[0075] In the bending process of the display module, the adsorption device of the bending device is adsorbed to the adsorption area 401 on the auxiliary structure 40, and the auxiliary structure 40 and the flexible circuit board 30 are pulled to the side of the display portion 11 away from the display surface 101 by the bending device. Figure 6 As shown; the circuit board body 31 is then bonded to the side of the support layer 20 away from the display unit 11, and the auxiliary structure 40 is bonded to the side of the support layer 20 away from the display unit 11; on the one hand, the auxiliary structure 40 does not need to be torn off, thereby avoiding the generation of large stress on the circuit board body 31 due to tearing off the auxiliary structure 40, reducing the probability of the circuit board body 31 peeling off due to stress, reducing the probability of the circuit board body 31 interfering with other components of the display module due to falling off, and improving the yield of the bending process of the display module; on the other hand, the present application can increase the adhesion between the auxiliary structure 40 and the circuit board body 31 to ensure that the bending equipment can pull the circuit board body 31 to a preset position for attachment, further improving the yield of the bending process of the display module.

[0076] In some embodiments, the thickness of the auxiliary structure 40 is smaller than the thickness of the circuit board body 31. Therefore, the auxiliary structure 40 added in the embodiment of the present application has less impact on the spatial arrangement of other devices in the display module compared to the circuit board body 31, and is more conducive to increasing the arrangement space of other devices in the display module, such as increasing the volume of the battery in the display module, so that the display module has a longer battery life.

[0077] In one embodiment of the present application, please combine Figure 4 , Figure 7 , Figure 8 , Fig. 9 as well as Fig.10 In this embodiment, the circuit board body 31 is attached to a surface of the auxiliary structure 40 away from the supporting layer 20 .

[0078] Among them, the auxiliary structure 40 includes a first sub-portion 41 that is attached to the circuit board body 31 and a second sub-portion 42 connected to the first sub-portion 41, the orthographic projection of the first sub-portion 41 on the supporting layer 20 is located within the orthographic projection of the circuit board body 31 on the supporting layer 20, the orthographic projection of the second sub-portion 42 on the supporting layer 20 is located outside the orthographic projection of the circuit board body 31 on the supporting layer 20, and the circuit board body 31 is attached to the side of the first sub-portion 41 away from the display portion 11, and the adsorption area 401 can be set on the first sub-portion 41.

[0079] It can be understood that since the side of the circuit board body 31 close to the support layer 20 can be bonded with the auxiliary structure 40, the adhesion between the circuit board body 31 and the auxiliary structure 40 can be effectively improved, and it is more conducive to the auxiliary structure 40 to drive the circuit board body 31 to move to the preset position on the back side of the display part 11 for bonding, so as to improve the yield of the bending process of the display module.

[0080] In some embodiments, the second sub-portion 42 is located on a side of the circuit board body 31 away from the connecting portion 32 , that is, the orthographic projection of the second sub-portion 42 on the supporting layer 20 is located on a side of the orthographic projection of the circuit board body 31 on the supporting layer 20 away from the orthographic projection of the connecting portion 32 on the supporting layer 20 .

[0081] In some embodiments, the distance L1 from the second sub-portion 42 along the first sub-portion 41 to the second sub-portion 42 can be greater than or equal to 7.5 mm and less than or equal to 8.5 mm. For example, the distance L1 can be 7.5 mm, 7.6 mm, 7.7 mm, 7.8 mm, 7.9 mm, 8 mm, 8.1 mm, 8.2 mm, 8.3 mm, 8.4 mm or 8.5 mm.

[0082] In some embodiments, the material of the auxiliary structure 40 may include a metal material, such as stainless steel or aluminum alloy, or the material of the auxiliary structure 40 and the material of the supporting layer 20 may include the same material, for example, the material of the auxiliary structure 40 and the material of the supporting layer 20 may both include stainless steel.

[0083] In some embodiments, the display module also includes a first adhesive layer 51 arranged between the circuit board body 31 and the auxiliary structure 40, and a second adhesive layer 52 arranged between the support layer 20 and the auxiliary structure 40; the auxiliary structure 40 is attached to the side of the support layer 20 away from the display unit 11 through the second adhesive layer 52, and the circuit board body 31 is attached to the side of the auxiliary structure 40 away from the support layer 20 through the first adhesive layer 51.

[0084] Among them, the orthographic projection of the first adhesive layer 51 on the supporting layer 20 is located within the orthographic projection of the circuit board body 31 on the supporting layer 20, and the orthographic projection of the second adhesive layer 52 on the supporting layer 20 is located within the orthographic projection of the auxiliary structure 40 on the supporting layer 20; that is, the edge of the first adhesive layer 51 can be retracted relative to the edge of the circuit board body 31 to avoid the first adhesive layer 51 exceeding the coverage range of the circuit board body 31 due to the factors of fitting accuracy; the edge of the second adhesive layer 52 can be retracted relative to the edge of the auxiliary structure 40 to avoid the second adhesive layer 52 exceeding the coverage range of the auxiliary structure 40 due to the factors of fitting accuracy.

[0085] Furthermore, the orthographic projection of the first adhesive layer 51 on the supporting layer 20 does not exceed the coverage range of the orthographic projection of the auxiliary structure 40 on the supporting layer 20. For example, the edge of the first adhesive layer 51 can be flush with the edge of the first sub-portion 41 so that the attachment area between the circuit board body 31 and the auxiliary structure 40 is maximized.

[0086] In some embodiments, the thickness of the second adhesive layer 52 is less than that of the first adhesive layer 51, so as to reduce the sum of the thicknesses of the second sub-portion 42 and the second adhesive layer 52, thereby reducing the influence of the second sub-portion 42 and the second adhesive layer 52 on the layout space of other components of the display module.

[0087] In some embodiments, a groove 201 is formed on a side of the support layer 20 away from the display portion 11, and at least the auxiliary structure 40 is attached to the groove 201, that is, the auxiliary structure 40 and the second adhesive layer 52 are located in the groove 201, which can effectively reduce the overall thickness of the display module due to the addition of the auxiliary structure 40, and since the auxiliary structure 40 is arranged in the groove 201, it can be avoided that the setting of the auxiliary structure 40 affects the layout space of other devices; wherein, since the material of the auxiliary structure 40 includes metal material, the auxiliary structure 40 has better support, and when the auxiliary structure 40 is attached to the groove 201, it can compensate for the reduced support of the support layer 20 due to the opening of the groove 201.

[0088] In an embodiment of the present application, the distance from one side of the auxiliary structure 40 away from the display portion 11 to the bottom of the groove 201 is less than or equal to the depth of the groove 201; further preferably, the one side of the auxiliary structure 40 away from the display portion 11 is flush with the portion of the support layer 20 where the groove 201 is not set.

[0089] In some embodiments, the depth of the groove 201 is less than or equal to half of the thickness of the support layer 20 . On the one hand, the groove 201 can be provided to save space of the display module, and on the other hand, the supporting performance of the support layer 20 can be ensured.

[0090] In some embodiments, the orthographic projection of the auxiliary structure 40 on the supporting layer 20 is located in the groove 201, and the orthographic projection area of ​​the auxiliary structure 40 on the supporting layer 20 is smaller than the area of ​​the groove 201, so as to facilitate the attachment of the auxiliary structure 40 to the groove 201 and reduce the probability of interference of the auxiliary structure 40 during the attachment process.

[0091] In some embodiments, the distance L2 between the orthographic projection area of ​​the auxiliary structure 40 on the support layer 20 and the side wall of the groove 201 is greater than or equal to 0.6 mm and less than or equal to 0.7 mm. For example, the distance L2 can be 0.6 mm, 0.61 mm, 0.62 mm, 0.63 mm, 0.64 mm, 0.65 mm, 0.66 mm, 0.67 mm, 0.68 mm, 0.69 mm or 0.7 mm.

[0092] In a specific embodiment of the present application, the first adhesive layer 51 can be a conductive thermosetting adhesive with a thickness of 0.05 mm, the auxiliary structure 40 can be stainless steel with a thickness of 0.05 mm, and the first adhesive layer 51 is bonded to the auxiliary structure 40, and the first adhesive layer 51 is flush with the edge of the first sub-portion 41, and then the side of the first adhesive layer 51 away from the auxiliary structure 40 is bonded to the circuit board body 31, and then cured at high temperature; further, the second adhesive layer 52 can be a conductive adhesive with a thickness of 0.025 mm, and the side of the auxiliary structure 40 away from the first adhesive layer 51 is bonded to the second adhesive layer 52, and the distance by which the edge of the second adhesive layer 52 is retracted relative to the edge of the auxiliary structure 40 can be 0.2 mm; then, a groove 201 is opened on the support layer 20, and the auxiliary structure 40 is attached to the groove 201 through the second adhesive layer 52, and the depth of the groove 201 can be 0.075 mm, and the thickness of the support layer 20 can be 0.15 mm.

[0093] Furthermore, the embodiments of the present application are Figure 1 The display module structure and Figure 4 The display module structure shown in the figure is subjected to an impact test to verify the Figure 4 The impact resistance of the display module shown in FIG. Fig.11 The bar graph shown in Figure 2 shows the comparison of Figure 1 The impact resistance test data of the display module is shown in the example Figure 4 The display module is tested for impact resistance and is Fig.11 It can be seen that the impact resistance of the display module provided in the embodiment of the present application will not be reduced due to the provision of the auxiliary structure 40 .

[0094] It should be noted that the display module also includes a bending area, and the display portion 11 is bent in the bending area. The support layer 20 includes a patterned structure arranged in the bending area to reduce bending stress, and the groove 201 is arranged outside the bending area.

[0095] In some embodiments, the patterned structure can be arranged on a side of the supporting layer 20 away from the display unit 11, or can be arranged on a side of the supporting layer 20 close to the display unit 11, or can be arranged as a through hole penetrating the supporting layer 20; and the groove 201 can be formed in the same process as the patterned structure.

[0096] As mentioned above, in the embodiment of the present application, the auxiliary structure 40 is attached to the side of the support layer 20 away from the display unit 11, and the circuit board body 31 is directly attached to the side of the auxiliary structure 40 away from the support layer 20, so that the auxiliary structure 40 that does not overlap with the circuit board body 31 can be used for adsorption with the adsorption device of the Bending equipment to complete the Bending process of the display module, and the auxiliary structure 40 and the circuit board body 31 are stacked and attached to the side of the support layer 20 away from the display unit 11 and do not need to be torn off, so that no stress is generated on the circuit board body 31 due to tearing off the auxiliary structure 40, thereby reducing the probability of the circuit board body 31 falling off, and can improve the yield of the Bending process of the display module, and improve the stability of the display module.

[0097] In another embodiment of the present application, please refer to Fig.12 In this embodiment, the circuit board body 31 is attached to the side of the support layer 20 away from the display portion 11 , that is, the circuit board body 31 and the support layer 20 are both attached to the side of the support layer 20 away from the display portion 11 .

[0098] In some embodiments, one end of the auxiliary structure 40 is connected to a side of the circuit board body 31 away from the connecting portion 32, and the other end of the auxiliary structure 40 extends in a direction away from the circuit board body 31, and is attached to a side of the supporting layer 20 away from the display portion 11, and the orthographic projection of the auxiliary structure 40 on the supporting layer 20 does not overlap with the orthographic projection of the circuit board body 31 on the supporting layer 20.

[0099] In some embodiments, the display module also includes a third adhesive layer 53 disposed between the supporting layer 20 and the circuit board body 31 and a fourth adhesive layer 54 disposed between the supporting layer 20 and the auxiliary structure 40 , and the thickness of the fourth adhesive layer 54 is less than or equal to the thickness of the third adhesive layer 53 .

[0100] Among them, when the thickness of the fourth adhesive layer 54 is less than the thickness of the third adhesive layer 53, the sum of the thicknesses of the auxiliary structure 40 and the fourth adhesive layer 54 can be reduced, thereby reducing the influence of the auxiliary structure 40 and the fourth adhesive layer 54 on the layout space of other devices of the display module; when the thickness of the fourth adhesive layer 54 is equal to the thickness of the third adhesive layer 53, the side of the auxiliary structure 40 close to the fourth adhesive layer 54 is flush with the side of the circuit board body 31 close to the third adhesive layer 53, which can effectively reduce stress and reduce the probability of damage to the circuit board body 31 due to stress.

[0101] In some embodiments, the third adhesive layer 53 is connected to the fourth adhesive layer 54 , and the material of the third adhesive layer 53 is the same as that of the fourth adhesive layer 54 , that is, the third adhesive layer 53 and the fourth adhesive layer 54 may be an integrated structure.

[0102] In some embodiments, the auxiliary structure 40 and the circuit board body 31 contain the same material; specifically, the circuit board body 31 is a multilayer board structure, that is, the circuit board body 31 includes a plurality of sublayers 311 stacked together, and the auxiliary structure 40 is connected to at least one of the sublayers 311; wherein, the auxiliary structure 40 is made of the same material as the sublayer 311 to which it is connected, that is, the auxiliary structure 40 and at least one sublayer 311 to which it is connected are an integrated structure.

[0103] It should be noted that the auxiliary structure 40 is connected to at least one of the multiple sub-layers 311 close to the supporting layer 20, so that the auxiliary structure 40 can be arranged closer to the supporting layer 20, thereby reducing the impact of the auxiliary structure 40 on the layout space of other devices in the display module.

[0104] In some embodiments, the circuit board body 311 includes signal lines and electrical devices arranged in multiple sub-layers 311, wherein the signal lines and electrical devices can be made of metal materials; then the auxiliary structure 40 can use the same layer of metal materials as the signal lines and electrical devices to prepare a metal film layer to increase the support and stiffness of the auxiliary structure 40, and the metal film layer in the auxiliary structure 40 is insulated from the signal lines and electrical devices in the circuit board body 311, and there is no signal transmission relationship.

[0105] In some embodiments, the auxiliary structure 40 is connected to one of the sub-layers 311, such as Fig.13 As shown, or the auxiliary structure 40 is connected to the two sub-layers 311, as shown Fig.14 shown.

[0106] In some embodiments, a groove 201 is provided on a side of the support layer 20 away from the display portion 11, and the auxiliary structure 40 and the circuit board body 31 are both attached to the groove 201, that is, the circuit board body 31 and the auxiliary structure 40 are respectively located in the groove 201 through the third adhesive layer 53 and the fourth adhesive layer 54, which can effectively reduce the overall thickness of the display module after the auxiliary structure 40 is added, and because the auxiliary structure 40 and the circuit board body 31 are attached to the groove 201, it can be avoided that the setting of the auxiliary structure 40 affects the layout space of other devices; wherein, since the material of the auxiliary structure 40 includes metal material, the auxiliary structure 40 has better support, and when the auxiliary structure 40 is attached to the groove 201, it can compensate for the reduced support of the support layer 20 due to the opening of the groove 201.

[0107] It should be noted that the circuit board body 31 is attached to the groove 201, that is, the circuit board body 31 is attached to the bottom of the groove 201 through the third adhesive layer 53, but the circuit board body 31 is relatively thick, so the circuit board body 31 will protrude outside the groove 201.

[0108] In an embodiment of the present application, the distance from a side of at least part of the auxiliary structure 40 away from the display portion 11 to the bottom of the groove 201 is less than or equal to the depth of the groove 201; further preferably, at least a side of at least part of the auxiliary structure 40 away from the display portion 11 is flush with a portion of the support layer 20 where the groove 201 is not set.

[0109] In some embodiments, the depth of the groove 201 is less than or equal to half of the thickness of the support layer 20 . On the one hand, the groove 201 can be provided to save space of the display module, and on the other hand, the supporting performance of the support layer 20 can be ensured.

[0110] In some embodiments, the orthographic projection of the auxiliary structure 40 on the supporting layer 20 and the orthographic projection of the circuit board body 31 on the supporting layer 20 are both located in the groove 201, and the sum of the orthographic projection area of ​​the auxiliary structure 40 on the supporting layer 20 and the orthographic projection area of ​​the circuit board body 31 on the supporting layer 20 is smaller than the area of ​​the groove 201, so as to facilitate the auxiliary structure 40 and the circuit board body 31 to be attached to the bottom of the groove 201, thereby reducing the probability of interference of the auxiliary structure 40 during the attachment process.

[0111] In some embodiments, the distance between the orthographic projection area of ​​the auxiliary structure 40 on the support layer 20 and the side wall of the groove 201 is greater than or equal to 0.6 mm and less than or equal to 0.7 mm. For example, the distance L2 can be 0.6 mm, 0.61 mm, 0.62 mm, 0.63 mm, 0.64 mm, 0.65 mm, 0.66 mm, 0.67 mm, 0.68 mm, 0.69 mm or 0.7 mm.

[0112] It should be noted that the display module also includes a bending area, and the display portion 11 is bent in the bending area. The support layer 20 includes a patterned structure arranged in the bending area to reduce bending stress, and the groove 201 is arranged outside the bending area.

[0113] In some embodiments, the patterned structure can be arranged on a side of the supporting layer 20 away from the display unit 11, or can be arranged on a side of the supporting layer 20 close to the display unit 11, or can be arranged as a through hole penetrating the supporting layer 20; and the groove 201 can be formed in the same process as the patterned structure.

[0114] As mentioned above, the embodiment of the present application forms the auxiliary structure 40 by using a partial film layer in the circuit board body 31 of the multi-layer board structure, that is, the auxiliary structure 40 and the circuit board body 31 are an integrated structure, and no additional film layer is required, which simplifies the process and reduces the cost; and the auxiliary structure 40 is a part of the circuit board body 31 extending away from the connecting portion 32, therefore, the auxiliary structure 40 and the circuit board body 31 do not overlap, and thus the auxiliary structure 40 can be used for adsorption with the adsorption device of the Bending equipment to complete the Bending process of the display module, and the auxiliary structure 40 and the circuit board body 31 are both attached to the side of the support layer 20 away from the display portion 11 and do not need to be torn off, and thus no stress is generated on the circuit board body 31 due to tearing off the auxiliary structure 40, which reduces the probability of the circuit board body 31 falling off, can improve the yield of the Bending process of the display module, and improve the stability of the display module.

[0115] In addition, an embodiment of the present application further provides a display device, which includes the display module described in the above embodiment.

[0116] It can be understood that, since the display device has the same display module as that in the above embodiment, the display device has the same beneficial effects as the display module, which will not be described in detail herein.

[0117] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0118] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0119] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0120] The above are only preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A display module, characterized in that: include: The display panel comprises a display portion and a binding portion located at a side of the display portion away from a display surface; A supporting layer, arranged on a side of the display portion away from the display surface and located between the display portion and the binding portion; A flexible circuit board, comprising a connecting portion and a circuit board body, wherein one end of the connecting portion is connected to the binding portion, and the other end of the connecting portion is connected to the circuit board body; An auxiliary structure connected to the circuit board body, wherein the auxiliary structure is attached to a side of the support layer away from the display portion; The orthographic projection of at least part of the auxiliary structure on the support layer does not overlap with the orthographic projection of the flexible circuit board on the support layer, and the material of the auxiliary structure includes a metal material.

2. The display module according to claim 1, characterized in that: The circuit board body is located on a side of the connecting portion away from the binding portion, the orthographic projection of the auxiliary structure on the supporting layer does not overlap with the orthographic projection of the binding portion on the supporting layer, and the circuit board body is attached to a side of the auxiliary structure away from the supporting layer.

3. The display module according to claim 2, characterized in that: The auxiliary structure comprises a first sub-portion attached to the circuit board body and a second sub-portion connected to the first sub-portion, the orthographic projection of the first sub-portion on the support layer is located within the orthographic projection of the circuit board body on the support layer, and the orthographic projection of the second sub-portion on the support layer is located outside the orthographic projection of the circuit board body on the support layer; Wherein, the second sub-portion is located at a side of the circuit board body away from the connecting portion.

4. The display module according to claim 2, characterized in that: The display module further includes a first adhesive layer disposed between the circuit board body and the auxiliary structure and a second adhesive layer disposed between the support layer and the auxiliary structure; The orthographic projection of the first adhesive layer on the support layer is located within the orthographic projection of the circuit board body on the support layer, and the orthographic projection of the second adhesive layer on the support layer is located within the orthographic projection of the auxiliary structure on the support layer.

5. The display module according to claim 2, characterized in that: The material of the auxiliary structure and the material of the support layer both include the same metal material.

6. The display module according to claim 1, characterized in that: The circuit board body is attached to a side of the support layer away from the display part; The auxiliary structure is connected to a side of the circuit board body away from the connecting portion, and an orthographic projection of the auxiliary structure on the supporting layer does not overlap with an orthographic projection of the circuit board body on the supporting layer.

7. The display module according to claim 6, characterized in that: The circuit board body includes a plurality of stacked sub-layers, and the auxiliary structure is connected to at least one of the sub-layers; The auxiliary structure is made of the same material as the sub-layer to which it is connected.

8. The display module according to claim 6, characterized in that: The display module further includes a third glue layer disposed between the support layer and the circuit board body and a fourth glue layer disposed between the support layer and the auxiliary structure, and a thickness of the fourth glue layer is less than or equal to a thickness of the third glue layer.

9. The display module according to claim 8, characterized in that: The third adhesive layer is connected to the fourth adhesive layer, and the material of the third adhesive layer is the same as that of the fourth adhesive layer.

10. The display module according to claim 1, characterized in that: The thickness of the auxiliary structure is smaller than the thickness of the circuit board body.

11. The display module according to any one of claims 1 to 10, characterized in that: A groove is formed on one side of the support layer away from the display portion, and at least the auxiliary structure is attached to the groove.

12. The display module according to claim 11, characterized in that: The distance between a side of the auxiliary structure away from the display portion and the bottom of the groove is less than or equal to the depth of the groove.

13. The display module according to claim 11, characterized in that: The depth of the groove is less than or equal to half of the thickness of the support layer.

14. The display module according to claim 11, characterized in that: The orthographic projection of the auxiliary structure on the supporting layer is located in the groove, and the orthographic projection area of ​​the auxiliary structure on the supporting layer is smaller than the area of ​​the groove.

15. The display module according to claim 11, characterized in that: The display module includes a bending area, the supporting layer includes a patterned structure arranged in the bending area, and the groove is located outside the bending area.

16. The display module according to claim 1, characterized in that: The display module also includes: A cover plate, disposed on a side of the display panel away from the support layer; A first back plate, disposed between the display portion and the support layer; A buffer layer, disposed between the first back plate and the support layer; The second back plate is arranged between the binding portion and the supporting layer.

17. A display device, characterized in that: The display device comprises the display module according to any one of claims 1 to 16.

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