Heating assembly of heat treatment equipment

Abstract

The embodiment of the invention provides a heating assembly of heat treatment equipment, and the heating assembly comprises a lamp holder which comprises a first heating area and a second heating area, and the first heating area is surrounded by the second heating area; the multiple first heating lamps are arranged in the first heating area; the second heating lamps are arranged in the second heating area; wherein the first heating lamp is a circular lamp, and the second heating lamp is a linear lamp. According to the technical scheme provided by the embodiment of the invention, the wafer can be subjected to heat treatment through two heating lamps, so that the adjustability of thermal power is improved; the edge part of the wafer is subjected to heating and temperature compensation through the second heating lamp, so that the temperature gradient of different areas of the substrate can be effectively reduced, and the temperature uniformity and the film forming uniformity are optimized and improved; and the second heating area is arranged around the first heating area, so that the heat overlapping area is reduced, and the equipment is convenient to install, debug and maintain.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor processing technology, and in particular to a heating component of a heat treatment equipment. Background Art

[0002] In the chamber of the heat treatment equipment, the heating lamps are used to heat the substrate, which is placed above the rotating mechanism and rotates with it to achieve uniform heating. The arrangement of the heating lamps has a great influence on the thermal uniformity of the substrate. Summary of the invention

[0003] The embodiments of the present disclosure provide a heating assembly for heat treatment equipment to solve or alleviate one or more technical problems in the prior art.

[0004] As one aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a heating assembly for a heat treatment device, comprising:

[0005] A lamp holder, the lamp holder comprising a first heating area and a second heating area, the first heating area being surrounded by the second heating area;

[0006] first heating lamps, a plurality of first heating lamps are arranged in the first heating zone;

[0007] second heating lamps, a plurality of second heating lamps being disposed in the second heating zone;

[0008] Among them, the first heating lamp is a round lamp, and the second heating lamp is a linear lamp.

[0009] In a possible implementation, a projection of the first heating zone toward the wafer to be processed covers a first circular area formed by the wafer.

[0010] In a possible implementation, a projection of the second heating zone toward the wafer to be processed covers a second circular area formed by an edge ring, the edge ring is used to support the wafer, and a diameter of the edge ring is greater than a diameter of the wafer.

[0011] In a possible implementation, the plurality of first heating lamps are arranged equidistantly in a hexagon, and the first heating zone is a regular hexagon.

[0012] In a possible implementation, the plurality of second heating lamps include six groups of strip lights, and the six groups of strip lights are respectively arranged on each side of the first heating zone.

[0013] In one possible implementation, each group of second heating lamps includes a first strip light and a second strip light, the first strip light is arranged on a side close to the first heating zone, and the second strip light is arranged on a side away from the first heating zone; the length of the first strip light is equivalent to the side length of the first heating zone, and the length of the second strip light is less than the length of the first strip light.

[0014] In a possible implementation, a plurality of first heating lamps are arranged to form a plurality of concentric circles, and the first heating area is circular.

[0015] In a possible implementation, the plurality of second heating lamps include a plurality of arc lamps, and the plurality of arc lamps form at least one circular ring, which surrounds the first heating area.

[0016] In a possible implementation, the plurality of groups of arc-shaped lamps are in the shape of a quarter ring, a semi-circular ring or a circular ring.

[0017] As one aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a heat treatment device, including: a chamber body, in which a heating component provided by any embodiment is provided.

[0018] The disclosed embodiment adopts the above-mentioned technical solution, and performs heat treatment on the wafer by using two heating lamps, thereby improving the adjustability of the thermal power; the edge portion of the wafer is heated and compensated by the second heating lamp, which can effectively reduce the temperature gradient in different areas of the substrate, and optimize and improve the temperature uniformity and film formation uniformity; the second heating zone is arranged around the first heating zone, which reduces the thermal overlap area and facilitates the installation, debugging and maintenance of the equipment.

[0019] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present disclosure will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments provided according to the present disclosure and should not be regarded as limiting the scope of the present disclosure.

[0021] Figure 1 A bottom view schematic diagram of the structure of a heating assembly of a heat treatment device according to an embodiment of the present disclosure is shown;

[0022] Figure 2 A bottom view schematic diagram of a heating assembly of a heat treatment device according to another embodiment of the present disclosure is shown;

[0023] Figure 3 A cross-sectional view showing a heat treatment apparatus according to an embodiment of the present disclosure;

[0024] Figure 4 for Figure 3 A partial enlarged view of .

[0025] Explanation of the reference numerals: 10, lamp holder; 11, first heating lamp; 12, second heating lamp; 13, lower component; 14, reaction chamber; 15, quartz window; 16, sealing ring; 20, wafer; 30, edge ring. DETAILED DESCRIPTION

[0026] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present disclosure. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0027] In the related technology, there are two main heating component arrangement methods for mainstream heat treatment equipment products. One of them is to arrange the lights equidistantly in a hexagon, and the heating method at the edge of the wafer is to use multiple groups of lights for heating. Another commonly used method is to arrange the strip lights equidistantly in the horizontal and vertical directions, and the heating method at the edge of the wafer is the same as the heating method at other positions. In the traditional lighting heating method, there are many heating lamps, and the processing, installation, and maintenance are complicated; the control logic of the edge area is complex and prone to problems. In the traditional strip light heating method, the impact of heat treatment on the edge area of ​​the substrate is no different from the impact on other areas, but the edge area is the low temperature area of ​​the wafer. In order to ensure the uniformity of temperature, the power needs to be relatively increased, which easily leads to uneven heating of the edge area.

[0028] In order to at least partially solve one or more of the above-mentioned problems and other potential problems, the embodiments of the present invention provide a heating component for heat treatment equipment. By using the technical solution of the embodiments of the present invention, the low-temperature zone of the wafer can be auxiliary heated to improve the temperature uniformity.

[0029] Figure 1 FIG. 2 is a schematic diagram showing a bottom view of a heating assembly of a heat treatment device according to an embodiment of the present disclosure. Figure 1 As shown, the heating component at least includes:

[0030] The lamp holder 10 comprises a first heating area and a second heating area, wherein the first heating area is surrounded by the second heating area.

[0031] The first heating lamps 11, a plurality of first heating lamps 11 are disposed in the first heating zone.

[0032] The second heating lamps 12, a plurality of second heating lamps 12 are disposed in the second heating zone.

[0033] The first heating lamp 11 is a round lamp, and the second heating lamp 12 is a linear lamp.

[0034] In the embodiment of the present disclosure, the lamp holder 10 has a lower surface facing the chamber of the heat treatment equipment, and the shape of the lamp holder 10 matches the chamber structure, and is generally circular. The lower surface of the lamp holder 10 is divided into a first heating zone and a second heating zone, and the first heating zone is located at the center of the lower surface, and may be the same center point as the lower surface. The second heating zone is arranged outside the edge of the first heating zone and surrounds the first heating zone, and it can also be understood that the second heating zone is the area of ​​the lower surface of the lamp holder 10 except the first heating zone.

[0035] The first heating lamp 11 is a round lamp, usually hundreds of round lamps are densely arranged together, each round lamp has a small diameter, and the round lamps can also be called spot lamps. Multiple spot lamps are densely arranged in the first heating zone. The lamp board is fixedly connected to the lamp holder 10, and the lamp holder 10 has coolant inlet and outlet pipelines for circulating cooling of the lamp board. A lamp tube for installing the first heating lamp 11 can be provided in the lamp tube, one end of the lamp tube is connected to the lamp board, and coolant can be passed into the gaps between the multiple lamp tubes. The above-mentioned lamp board, lamp tube and cooling structure can adopt various technical solutions known to ordinary technicians in this field now and in the future, which will not be described in detail here.

[0036] The second heating lamp 12 is a linear lamp, including a straight-line lamp and a curved-line lamp, that is, the second heating lamp is in a straight line or an arc shape as a whole. A straight-line heating lamp can also be called a strip lamp. The first heating zone is surrounded by one or more linear lamps to form a second heating zone. The second heating zone is used to perform auxiliary heating on the edge of a silicon wafer (such as a substrate, a wafer, a chip) that needs to be heat treated.

[0037] The heating assembly heats the surface of the wafer 20 through the quartz window 15 disposed above the wafer 20, and the wafer 20 can be rotated by the lower assembly 13. The heat treatment chamber is isolated and sealed from the lamp holder by the sealing rings 16 on the upper and lower surfaces of the quartz window 15.

[0038] According to the scheme of the embodiment of the present disclosure, the wafer 20 is heat treated by two types of heating lamps, which improves the adjustability of the thermal power; the edge portion of the wafer 20 is heated and compensated by the second heating lamp 12, which can effectively reduce the temperature gradient in different areas of the substrate, and optimize and improve the temperature uniformity and film formation uniformity; the second heating zone is arranged around the first heating zone, which reduces the thermal overlap area and facilitates the installation, debugging and maintenance of the equipment.

[0039] In a possible implementation, a projection of the first heating zone toward the wafer 20 to be processed covers a first circular area formed by the wafer 20 .

[0040] In the disclosed embodiment, the first heating lamp 11 is the main heat source of the heat treatment equipment, and the first heating zone composed of a plurality of first heating lamps 11 completely covers the first circular area where the wafer 20 is located.

[0041] The power of each first heating lamp 11 can be adjusted individually. Normally, the temperature in each radial range is measured by multiple groups of thermometers on the back of the wafer 20, and the power of the corresponding lighting group or the corresponding strip light group is adjusted accordingly, thereby improving the consistency of radiant heat energy and reducing temperature gradients.

[0042] According to the solution of the embodiment of the present disclosure, the plurality of first heating lamps 11 in the first heating zone can achieve heat treatment on the wafer 20 .

[0043] In a possible implementation, the projection of the second heating zone toward the wafer 20 to be processed covers a second circular area formed by the edge ring 30 . The edge ring 30 is used to support the wafer 20 . The diameter of the edge ring 30 is greater than the diameter of the wafer 20 .

[0044] In the embodiment of the present disclosure, when the wafer 20 is performing the relevant process, it is placed on the edge ring 30, and the edge ring 30 contacts the lower surface of the wafer 20 and supports the wafer 20. The diameter of the edge ring 30 is larger than the diameter of the wafer 20, and the outer diameter of the edge ring 30 is within the outermost heating component, that is, the second heating zone, that is, the edge ring 30 will also be heated by the heating component, so that the temperature gradient between the edge and the inner center of the wafer 20 is minimized through heat conduction of the edge ring 30.

[0045] According to the solution of the embodiment of the present disclosure, the second heating zone can increase the temperature of the edge portion of the wafer 20 to achieve auxiliary heating; at the same time, the second heating zone can heat the edge ring 30, and the edge ring 30 can transfer part of the heat to the wafer 20, further reducing the temperature gradient between the edge and the internal center of the wafer 20.

[0046] In a possible implementation, the plurality of first heating lamps 11 are arranged equidistantly in a hexagon, and the first heating zone is a regular hexagon.

[0047] In the disclosed embodiment, except for the first heating lamp 11 at the edge of the first heating zone, each of the remaining first heating lamps 11 forms a regular hexagon with the six surrounding first heating lamps 11, and the first heating zone formed by the multiple first heating lamps 11 is also a regular hexagon.

[0048] According to the solution of the embodiment of the present disclosure, the first heating zone has six sides, which is convenient for cooperating with the strip light to enclose the first heating zone.

[0049] In a possible implementation, the plurality of second heating lamps 12 include six groups of strip lights, and the six groups of strip lights are respectively disposed on each side of the first heating zone.

[0050] In the disclosed embodiment, each group of strip lights is arranged close to each side of the first heating zone. The first heating zone may be a regular hexagon, and the six groups of strip lights are arranged on each side of the first heating zone, so as to achieve close contact between the first heating zone and the second heating zone and reduce the gap.

[0051] It should be noted that if the first heating zone is in a shape whose other sides are straight lines, the grouping of the second heating lamps 12 and the number and length of each group of second heating lamps 12 can be adjusted accordingly with the number and length of the sides of the first heating zone, and the resulting structure should be covered within the protection scope of the present disclosure.

[0052] According to the solution of the embodiment of the present disclosure, reducing the gap between the two heating zones helps to improve the controllability and uniformity of the temperature.

[0053] In a possible implementation, each group of second heating lamps 12 includes a first strip light and a second strip light, the first strip light is arranged on a side close to the first heating zone, and the second strip light is arranged on a side away from the first heating zone; the length of the first strip light is equivalent to the side length of the first heating zone, and the length of the second strip light is less than the length of the first strip light.

[0054] In the disclosed embodiment, each group of second heating lamps 12 includes at least one first strip light and at least one second strip light, and one or more second strip lights can fill the gap between the first strip light and the edge of the light board. When the lower surface of the light board is circular, the gap between the first strip light and the edge of the light board is arc-shaped, and the gap between the first strip light and the edge of the light board can be further reduced by combining strip lights of different lengths.

[0055] According to the solution of the embodiment of the present disclosure, the lower surface of the lamp panel is filled with heating components to reduce the gaps, which helps to improve the controllability and uniformity of the temperature.

[0056] In one example, if Figure 1 As shown, the first heating lamps are lighting lamps, totaling 271, arranged in a regular hexagonal honeycomb pattern with the center of the water-cooled lamp panel as the center and installed within a range of 300 mm or 12 inches in diameter.

[0057] The 12 first strip lights are located outside the hexagon of the lighting group and inside the second strip lights, and are symmetrically distributed around the center of the hexagon.

[0058] The six second strip lights are located outside the first strip lights and inside the edge of the water-cooled light board.

[0059] The water-cooled lamp board is fixedly connected to the lamp holder 10 , and the lamp holder 10 is provided with cooling water inlet and outlet pipes for circulating cooling of the lamp board.

[0060] According to the solution of the embodiment of the present disclosure, by using a strip light group instead of a point light group, the heat power supplement and adjustability of the edge are increased; the two heating lamps are located on the same plane, which simplifies the structure and facilitates installation, debugging and maintenance.

[0061] In another possible implementation, a plurality of first heating lamps 11 are arranged to form a plurality of concentric circles, and the first heating area is circular.

[0062] In the present disclosure, Figure 2 As shown, the plurality of first heating lamps 11 are arranged to form a plurality of concentric circles with the central first heating lamp 11 as the center. The diameter of the ring formed by the outermost circle of first heating lamps 11 is greater than the diameter of the wafer 20 .

[0063] According to the solution of the embodiment of the present disclosure, the shape of the first heating zone is the same as the shape of the wafer 20, so that the temperature of the edge of the wafer 20 is closer.

[0064] In a possible implementation, the plurality of second heating lamps 12 include a plurality of arc lamps, and the plurality of arc lamps form at least one circular ring, which surrounds the first heating area.

[0065] In the embodiment of the present disclosure, one or more second heating lamps 12 are combined to form a first circular ring to surround the first heating zone. One or more second heating lamps 12 are combined to form a second circular ring to surround the first circular ring. Similarly, there may be a third circular ring, a fourth circular ring, etc.

[0066] According to the solution of the embodiment of the present disclosure, the first heating zone and the second heating zone are both circular or annular, so that the heating of the wafer 20 is more uniform.

[0067] In one example, the first heating lamps 11 are lit, with a total of 325 lamps, which are arranged in a regular circular array with the center of the water-cooled lamp board as the center and installed in the central range.

[0068] The second heating lamps 12 are annular lamp groups, with a total of 3 groups, which are located outside the lighting group and inside the edge of the water-cooling lamp board, and are distributed in a ring shape.

[0069] According to the solution of the embodiment of the present disclosure, the complexity of the structure is reduced by using a ring light group instead of a lighting group; the two heating lamps are located on the same plane, which is convenient for installation, debugging and maintenance.

[0070] In a possible implementation, the plurality of groups of arc-shaped lamps are in the shape of a quarter ring, a semi-circular ring or a circular ring.

[0071] In the disclosed embodiment, a ring light group may be composed of a circular ring light, or two semicircular ring lights, or four quarter-circular ring lights, or may be composed of a plurality of arc lights with the same curvature.

[0072] According to the solution of the embodiment of the present disclosure, a plurality of second heating lamps 12 form a ring, which can improve the adjustability of the temperature.

[0073] Figure 3 1 shows a cross-sectional view of a heat treatment device according to an embodiment of the present disclosure. Figure 3 As shown, the heat treatment equipment includes:

[0074] A chamber body, in which a heating component provided by any embodiment is arranged.

[0075] Figure 4 yes Figure 3 A partial enlarged view of Figure 3 , 4 As shown, in a possible implementation, the chamber body includes a lower component 13, in which a rotating mechanism, a temperature measuring mechanism and an edge ring 30 are provided. The lower component 13 and the heating component jointly define a reaction chamber 14. A quartz window 15 is provided at the bottom of the heating component, and the reaction chamber 14 is isolated and sealed from the lamp holder 10 by sealing rings 16 on the upper and lower surfaces of the quartz window 15.

[0076] Other components of the heat treatment equipment in the above embodiment may adopt various technical solutions known to ordinary technicians in this field now and in the future, and will not be described in detail here.

[0077] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0078] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0079] In the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0080] In the present disclosure, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being “above”, “above”, and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0081] The disclosure above provides many different embodiments or examples to realize different structures of the present disclosure. In order to simplify the disclosure of the present disclosure, the components and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present disclosure. In addition, the present disclosure can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0082] The above is only a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A heating assembly for heat treatment equipment, comprising: A lamp holder (10), the lamp holder (10) comprising a first heating zone and a second heating zone, the first heating zone being surrounded by the second heating zone; A first heating lamp (11), wherein a plurality of first heating lamps (11) are arranged in the first heating zone; A second heating lamp (12), wherein a plurality of second heating lamps (12) are arranged in the second heating zone; Wherein, the first heating lamp (11) is a circular lamp, and the second heating lamp (12) is a linear lamp.

2. The heating assembly of the heat treatment equipment according to claim 1, wherein: The projection of the first heating zone toward the wafer (20) to be processed covers a first circular area formed by the wafer (20).

3. The heating assembly of the heat treatment equipment according to claim 1, wherein: The projection of the second heating zone toward the wafer (20) to be processed covers a second circular area formed by an edge ring (30), the edge ring (30) is used to support the wafer (20), and the diameter of the edge ring (30) is greater than the diameter of the wafer (20).

4. The heating assembly of the heat treatment equipment according to claim 1, wherein: The plurality of first heating lamps (11) are arranged equidistantly in a hexagon, and the first heating zone is a regular hexagon.

5. The heating assembly of the heat treatment equipment according to claim 1, wherein: The plurality of second heating lamps (12) include six groups of strip-shaped lamps, and the six groups of strip-shaped lamps are respectively arranged on each side of the first heating area.

6. The heating assembly of the heat treatment equipment according to claim 5, wherein: Each group of second heating lamps (12) comprises a first strip light and a second strip light, wherein the first strip light is arranged on a side close to the first heating zone, and the second strip light is arranged on a side away from the first heating zone; the length of the first strip light is equal to the side length of the first heating zone, and the length of the second strip light is less than the length of the first strip light.

7. The heating assembly of the heat treatment equipment according to claim 1, wherein: The plurality of first heating lamps (11) are arranged to form a plurality of concentric circles, and the first heating area is circular.

8. The heating assembly of the heat treatment equipment according to claim 1, wherein: The plurality of second heating lamps (12) include a plurality of arc lamps, and the plurality of arc lamps form at least one circular ring, and the circular ring surrounds the first heating area.

9. The heating assembly of the heat treatment equipment according to claim 8, wherein: The plurality of groups of arc-shaped lamps are in the shape of a quarter circle, a semicircle or a circle.

10. A heat treatment device, wherein: include: A chamber body, wherein the heating assembly as claimed in any one of claims 1 to 9 is arranged.

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