A packaging structure for a heat-dissipating integrated circuit chip

Abstract

The present invention discloses a packaging structure for a heat-dissipating integrated circuit chip, which relates to the field of chip packaging. It includes an upper packaging board, a chip packaging board, and a heat-dissipating packaging board that are assembled together in sequence from top to bottom. A chip slot is provided at the top of the chip packaging board, and the chip slot is used for implanting a chip. A heat-dissipating slot is provided at the top of the heat-dissipating packaging board, and paraffin is filled in the heat-dissipating slot. The pins of the chip are connected to one end of the pins through wires. Installation slots are penetrated at the positions corresponding to the pins on the chip packaging board. Lead-out slots are provided on the inner side wall of the heat-dissipating slot, and the lead-out slots pass through the outer side wall of the heat-dissipating packaging board. Each installation slot is correspondingly provided with a lead-out slot, and the other end of the pin passes through the installation slot and is arranged outside the heat-dissipating packaging board together with the lead-out slot. The paraffin phase-change material absorbs heat and melts to absorb the heat generated by the chip, so that the chip packaging structure can dissipate heat by itself, and the continuous working time of the chip is extended.

Description

Technical Field

[0001] The invention relates to the technical field of chip packaging, in particular to a packaging structure of a heat dissipation type integrated circuit chip. Background Art

[0002] The inside of a chip is usually composed of many precision circuits. If these precision circuits are directly exposed to the air, they will be corroded by impurities, bad gases and water vapor in the air, resulting in a decrease in the electrical performance of the circuits. Chip packaging technology is a process technology that can wrap the precision circuits inside the chip to prevent them from contacting the outside world, which can effectively protect the precision circuits inside the chip. In the field of chip packaging technology, chips are usually packaged in a cavity formed by a packaging shell to protect the precision circuit inside the chip. However, after the chip is packaged, the chip is completely sealed by the packaging shell. Part of the heat generated by the chip is first transferred through the cavity medium in the packaging shell, and then transferred from the cavity medium to the packaging shell and then to the outside through the packaging shell, resulting in poor heat dissipation of the packaged chip. All of them need to be equipped with heat dissipation equipment later. After the integrated circuit chip package is connected to the circuit, a water cooling equipment will be installed on the upper surface of the integrated circuit chip package. The coolant is circulated by a water pump to drive the heat generated by the chip. However, the heat dissipation area of ​​this method is small, and the heat at the bottom of the chip package will continue to rise, resulting in poor heat dissipation capacity of the entire chip package. After the chip temperature exceeds the safety temperature, it is necessary to shut down and wait for the chip to cool down. The low heat dissipation capacity leads to a short working time of the chip and great limitations. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a packaging structure of a heat dissipation integrated circuit chip to solve the deficiencies of the prior art.

[0004] The objective of the present invention is achieved through the following technical solutions: A packaging structure of a heat-dissipating integrated circuit chip, comprising an upper packaging board, a chip packaging board and a heat-dissipating packaging board assembled together in sequence from top to bottom, a chip slot being provided on the top of the chip packaging board, the chip slot being used to implant the chip, a heat-dissipating slot being provided on the top of the heat-dissipating packaging board, the heat-dissipating slot being filled with paraffin, the pins of the chip being connected to one end of the pins through a wire, a mounting slot being provided through the position of the chip packaging board corresponding to the pins, a lead-out slot being provided on the inner side wall of the heat-dissipating slot, the lead-out slot passing through the outer side wall of the heat-dissipating packaging board, each of the mounting slots corresponding to one lead-out slot being provided, and the other end of the pin passing through the mounting slot and the lead-out slot being arranged outside the heat-dissipating packaging board.

[0005] Furthermore, the pin adopts a split structure. The pin includes a chip connection pin and a lead-out pin. One end of the chip connection pin is located inside the chip packaging board and is connected to the chip, and the other end passes through the installation groove and extends into the heat dissipation groove. One end of the lead-out pin penetrates into the lead-out groove and is connected to the other end of the chip connection pin.

[0006] Furthermore, the chip connection pin includes a long side, a vertical side, and a short side. The two ends of the vertical side are respectively connected to the long side and the short side by arc transitions. A pin hole is opened at one end of the short side away from the vertical side. The shapes of the chip connection pin and the lead-out pin are both Z-shaped. A pin is fixed at one end of the lead-out pin close to the short side. The diameter of the pin gradually increases along the direction close to the lead-out pin. The pin is press-fitted into the pin hole.

[0007] Furthermore, a pin installation groove is opened on the side wall of the heat dissipation groove. Each pin corresponds to one pin installation groove. The pin installation groove penetrates through the top of the heat dissipation packaging board. The lead-out groove communicates with the pin installation groove. The chip connection pin is connected to the lead-out pin in the pin installation groove. A plurality of strip-shaped grooves are opened on the top of the chip packaging board. The plurality of strip-shaped grooves correspond to the plurality of pins one by one. The two ends of the strip-shaped groove respectively communicate with the installation groove and the chip groove.

[0008] Furthermore, a first elastic block is arranged at the bottom of the pin installation groove. The side wall of the first elastic block is flush with the inner side wall of the heat dissipation groove. One end of the short side and the lead-out pin are both in contact with the top surface of the first elastic block.

[0009] Furthermore, an installation gap is formed between the vertical side and the inner side wall of the pin installation groove. A second sealing block is arranged in the installation gap. The second sealing block penetrates out of the installation groove. The top surface of the second sealing block is located above the top surface of the chip packaging board. The upper packaging board and the chip packaging board are assembled and pressed against the second sealing block to generate compressive deformation, so that the second sealing block is press-fitted in the installation groove and the pin installation groove.

[0010] Furthermore, mounting posts are fixed at the four corners of the bottom of the upper packaging board. Through holes are respectively opened in the chip packaging board and the heat dissipation packaging board at the positions corresponding to the mounting posts. A threaded hole is opened at one end of the mounting post away from the upper packaging board. The mounting post penetrates into the through hole of the heat dissipation packaging board. Screws are arranged at the four through holes at the bottom of the heat dissipation packaging board. The screw body of the screw is threadedly connected in the threaded hole.

[0011] Further, four counterbores are formed in the bottom of the heat dissipation encapsulation board. The four counterbores are coaxially arranged with the four through holes one by one. The diameter of the counterbore is larger than that of the through hole. A sealing ring is arranged in the counterbore, and the head of the screw is located in the counterbore and squeezes the sealing ring to deform.

[0012] Further, a first sealing ring is fixed to the bottom of the upper encapsulation board. A first annular groove is formed around the chip groove at the top of the chip encapsulation board. The first sealing ring is in interference fit in the first annular groove. A second sealing ring is fixed to the bottom of the chip encapsulation board. A second annular groove is formed around the heat dissipation groove at the top of the heat dissipation encapsulation board. The second sealing ring is in interference fit in the second annular groove.

[0013] Further, a plurality of heat dissipation air grooves are formed in the bottom of the heat dissipation encapsulation board, and the heat dissipation air grooves are arranged horizontally through.

[0014] The beneficial effects of the present invention are as follows:

[0015] 1. The paraffin phase change material is filled in the chip encapsulation mechanism. The paraffin phase change material acts below the chip, and the heat generated by the chip is absorbed by the endothermic melting of the paraffin phase change material, so that the chip encapsulation structure can dissipate heat by itself and the continuous working time of the chip is prolonged.

[0016] 2. The pins pass through the heat dissipation groove and the lead-out groove, so that the pins are in contact with the paraffin phase change material, and the heat of the chip can be transferred to the paraffin phase change material through the pins and absorbed, improving the heat dissipation effect.

[0017] 3. In order to prevent the paraffin phase change material from creeping along the pins into the chip groove after melting, a second elastic block is provided. The mounting groove is blocked by the second elastic block to prevent the paraffin phase change material from entering the chip groove, playing a role in protecting the chip. Description of the Drawings

[0018] Figure 1 is an exploded view of a packaging structure of a heat dissipation type integrated circuit chip of the present invention Figure 1 ;

[0019] Figure 2 is an exploded view of a packaging structure of a heat dissipation type integrated circuit chip of the present invention Figure 2 ;

[0020] Figure 3 is a schematic structural diagram of a heat dissipation encapsulation board in a packaging structure of a heat dissipation type integrated circuit chip of the present invention;

[0021] Figure 4 is a top view of a packaging structure of a heat dissipation type integrated circuit chip of the present invention;

[0022] Figure 5 is Figure 4 the sectional view taken along the A-A direction in

[0023] Figure 6 is Figure 5 the enlarged view at position A in

[0024] Figure 7 is Figure 4 the sectional view taken along the B-B direction in

[0025] Figure 8 is Figure 7 the enlarged view at position B in

[0026] In the figure, 1 - upper encapsulation board, 2 - chip encapsulation board, 3 - heat dissipation encapsulation board, 4 - chip slot, 5 - heat dissipation slot, 6 - chip, 7 - pin, 8 - installation slot, 9 - lead-out slot, 10 - chip connection pin, 11 - lead-out pin, 12 - long side, 13 - vertical side, 14 - short side, 15 - pin hole, 16 - pin, 17 - pin installation slot, 18 - strip slot, 19 - first elastic block, 20 - second sealing block, 21 - mounting post, 22 - through hole, 23 - threaded hole, 24 - screw, 25 - counterbore, 26 - sealing ring, 27 - first sealing ring, 28 - first annular groove, 29 - second sealing ring, 30 - second annular groove, 31 - heat dissipation air slot. Specific embodiments

[0027] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings, but the protection scope of the present invention is not limited to the following.

[0028] Embodiment 1: As shown in Figures 1 to 8As shown in the figure, a packaging structure of a heat-dissipating integrated circuit chip includes an upper packaging board 1, a chip packaging board 2, and a heat-dissipating packaging board 3 that are assembled together from top to bottom in sequence. A chip slot 4 is opened at the top of the chip packaging board 2, and the chip slot 4 is used to implant a chip 6. A heat-dissipating slot 5 is opened at the top of the heat-dissipating packaging board 3, and paraffin wax is filled in the heat-dissipating slot 5. The pins of the chip 6 are connected to one end of a pin 7 through a wire. An installation slot 8 is penetrated and opened at the position corresponding to the pin 7 on the chip packaging board 2. An extraction slot 9 is opened on the inner side wall of the heat-dissipating slot 5, and the extraction slot 9 penetrates through the outer side wall of the heat-dissipating packaging board 3. Each installation slot 8 corresponds to an extraction slot 9. The other end of the pin 7 passes through the installation slot 8 and is arranged outside the heat-dissipating packaging board 3 together with the extraction slot 9. The chip packaging structure is set as a three-layer split structure, which is convenient for the installation of the chip and the filling of the paraffin phase change material. Make solid paraffin wax matching the size of the heat-dissipating slot 5, put the solid paraffin wax into the heat-dissipating slot 5, install the chip 6 in the chip slot 4. Through the setting of the chip slot 4, the distance between the chip 6 and the paraffin wax is greatly reduced, and the paraffin wax is arranged close to the chip to effectively absorb heat. Then install the pins, connect one end of the pin 7 to the pins of the chip 6, and the other end of the pin 7 extends into the heat-dissipating slot 5 through the installation slot 8, and then passes through the extraction slot 9 to the outside, which is used to be welded to the chip holes on the circuit board. Finally, assemble the upper packaging board 1, the chip packaging board 2, and the heat-dissipating packaging board 3 together in sequence. The heat generated by the chip is transferred to the paraffin phase change material through the chip packaging board 2, and the paraffin phase change material absorbs the heat generated by the chip to realize the self-cooling of the chip packaging structure. Secondly, the pin 7 is in direct contact with the paraffin phase change material locally, so that the heat of the chip 6 can be transferred to the paraffin phase change material through the pin 7 and absorbed, so that the heat of the chip can be transferred in multiple directions, improving the heat dissipation effect. Specifically in implementation, a water-cooling device is installed on the upper surface of the chip package body, and the paraffin phase change material is used to dissipate heat from the upper and lower two sides of the chip 6, greatly improving the heat dissipation effect and prolonging the continuous working time of the chip 6. When the temperature of the chip 6 exceeds the set value, the chip 6 stops working for cooling, and the paraffin phase change material releases heat and changes back from the liquid state to the solid state, waiting for the next heat absorption reaction.

[0029] Further, as Figures 1 to 3 shown, a plurality of heat-dissipating air slots 31 are opened at the bottom of the heat-dissipating packaging board 3, and the heat-dissipating air slots 31 are arranged horizontally through. After the traditional chip package body is welded to the circuit board, the bottom surface of the chip package body contacts the circuit board, resulting in the heat not being discharged in time. Since a heat-dissipating fan is assembled separately in the server and the air in the server is in a flowing state, by opening the heat-dissipating air slots 31, the air can flow between the heat-dissipating packaging board 3 and the circuit board, and the heat can be taken away, further improving the heat dissipation performance of the chip package body.

[0030] Embodiment 2: The traditional pin shape is Z-shaped, and this structure cannot enable the pin to penetrate into the heat dissipation groove 5 from the installation groove 8 and then penetrate out from the lead-out groove 9. Therefore, on the basis of Embodiment 1, as Figures 1 to 6 shown, the pin 7 adopts a split structure. The pin 7 includes a chip connection pin 10 and a lead-out pin 11. One end of the chip connection pin 10 is located inside the chip packaging board 2 to connect the chip 6, and the other end passes through the installation groove 8 and extends into the heat dissipation groove 5. One end of the lead-out pin 11 penetrates into the heat dissipation groove 5 from the lead-out groove 9 to connect the other end of the chip connection pin 10. The pin 7 is set as a split structure, which is convenient to assemble the pin 7 on the chip packaging board 2 and the heat dissipation packaging board 3, so that the pin 7 can smoothly contact the paraffin phase change material. The chip connection pin 10 penetrates into the heat dissipation groove 5 from the installation groove 8. The chip connection pin 10 is used to connect the chip 6. Then, the lead-out pin 11 penetrates into the heat dissipation groove 5 through the lead-out groove 9, and then the chip connection pin 10 and the lead-out pin 11 are connected to form the pin 7, so that the pin 7 can smoothly contact the paraffin phase change material for heat transfer without affecting the assembly of the pin 7.

[0031] Furthermore, as Figures 1 to 6 shown, the chip connection pin 10 includes a long side 12, a vertical side 13 and a short side 14. The two ends of the vertical side 13 are respectively connected to the long side 12 and the short side 14 by arc transitions. One end of the short side 14 away from the vertical side 13 is provided with a pin hole 15. The shapes of the chip connection pin 10 and the lead-out pin 11 are both Z-shaped. One end of the lead-out pin 11 close to the short side 14 is fixed with a pin 16. The diameter of the pin 16 gradually increases along the direction close to the lead-out pin 11. The pin 16 is in interference fit in the pin hole 15. The vertical side 13 carries the short side 14 through the installation groove 8, and then the long side 12 is connected to the pin of the chip 6 through a wire or directly welded to the pin of the chip 6. Then, the upper packaging board 1, the chip packaging board 2 and the heat dissipation packaging board 3 are assembled together. Finally, the lead-out pin 11 is assembled. One end of the lead-out pin 11 with the pin 16 is inserted from the lead-out groove 9. After the lead-out pin 11 is assembled in place, the pin 16 is inserted into the pin hole 15. The tapered setting of the pin 16 enables the pin 16 to be inserted into the pin hole 15 within the error range, and the tapered surface enables the pin 16 to deform and be in interference fit in the pin hole 15, thus completing the connection between the chip connection pin 10 and the lead-out pin 11 and realizing the heat dissipation assembly of the pin 7.

[0032] Embodiment 3: On the basis of Embodiment 2, as Figures 1 to 6As shown in the figure, a pin mounting groove 17 is formed in the side wall of the heat dissipation groove 5. Each pin 7 corresponds to a pin mounting groove 17. The pin mounting groove 17 penetrates through the top of the heat dissipation encapsulation board 3. The lead-out groove 9 communicates with the pin mounting groove 17. The chip connection pin 10 is connected to the lead-out pin 11 in the pin mounting groove 17. A plurality of strip-shaped grooves 18 are formed in the top of the chip encapsulation board 2. The plurality of strip-shaped grooves 18 correspond to the plurality of pins 7 one by one. Both ends of the strip-shaped groove 18 communicate with the mounting groove 8 and the chip groove 4 respectively. In order to facilitate the production of paraffin standard parts, the shape of the heat dissipation groove 5 is rectangular. The pin mounting groove 17 is formed in the side wall of the heat dissipation groove 5, so that the pin 7 penetrates into the pin mounting groove 17 to contact the paraffin phase change material. The paraffin is made into a cuboid shape and matches the size of the heat dissipation groove 5, which facilitates the production of the paraffin phase change material, enables it to be implanted into the heat dissipation groove 5, and enables the pin 7 to contact the side of the paraffin phase change material. The standardized paraffin phase change material can also make the solid paraffin phase change material contact the bottom surface of the chip encapsulation board 2 to achieve better heat transfer; the setting of the strip-shaped groove 18 enables the long side 12 of the chip connection pin 10 to be embedded in the chip encapsulation board 2, ensuring that the chip encapsulation board 2 and the heat dissipation encapsulation board 3 can be well fitted and assembled together, and ensuring that the sealing performance of the chip package is not affected.

[0033] Embodiment 4: Since the solid shape of the paraffin phase change material matches the heat dissipation groove 5, it can well contact the bottom surface of the chip encapsulation board 2. However, after the paraffin phase change material absorbs heat and liquefies, its volume will increase, resulting in squeezing the chip encapsulation board 2 and the heat dissipation encapsulation board 3, which is likely to cause deformation or damage to the chip package. Therefore, on the basis of Embodiment 3, as Figures 1 to 6 shown, a first elastic block 19 is arranged at the bottom of the pin mounting groove 17. The side wall of the first elastic block 19 is flush with the inner side wall of the heat dissipation groove 5. The short side 14 and one end of the lead-out pin 11 both contact the top surface of the first elastic block 19. The vertical side 13 of the chip connection pin 10 does not extend to the bottom of the pin mounting groove 17, leaving a buffer space between the short side 14 and the bottom of the pin mounting groove 17. The first elastic block 19 is installed in the buffer space. When the volume of the paraffin phase change material increases due to liquefaction, it will squeeze the first elastic block 19 to deform, so that the liquefied paraffin flows into the pin mounting groove 17, thereby adapting to the volume change of the paraffin phase change material. During the process of the paraffin phase change material changing from liquid to solid, under the reaction force of the first elastic block 19, the paraffin phase change material is shaped so that it returns to the heat dissipation groove 5, ensuring that the solid paraffin phase change material can still contact the chip encapsulation board 2 to dissipate heat from the chip, and enabling the chip package to have excellent heat dissipation ability.

[0034] Embodiment 5: Due to the setting of the mounting groove 8 and the connection of the short side 14 provided for the pin 7, there is a gap between the vertical side 13 and the mounting groove 8. The water vapor liquefied from the paraffin phase change material will enter the chip groove 4 through this gap. Therefore, on the basis of Embodiment 4, as Figures 1 to 6As shown, there is an installation gap formed between the vertical side 13 and the inner side wall of the pin installation groove 17. A second sealing block 20 is arranged in the installation gap. The second sealing block 20 passes through the installation groove 8. The top surface of the second sealing block 20 is located above the top surface of the chip packaging board 2. The upper packaging board 1 and the chip packaging board 2 are assembled and extruded to cause the second sealing block 20 to generate compressive deformation, so as to make the second sealing block 20 be in interference fit in the installation groove 8 and the pin installation groove 17. After the chip connection pins 10 are installed on the chip packaging board 2, the second sealing block 20 is inserted into the installation groove 8. Then, the chip packaging board 2 and the heat dissipation packaging board 3 are attached together, and the second sealing block 20 is extruded downward again to make the second sealing block 20 contact the short side 14, so as to assemble the second sealing block 20 in place. Then, the upper packaging board 1 is attached to the chip packaging board 2 to complete the assembly. The upper packaging board 1 and the second sealing block 20 jointly act to fix the position of the chip connection pins 10. Finally, the lead-out pins 11 are inserted from the lead-out groove 9 to connect the chip connection pins 10, and the assembly of the entire chip package is completed. By blocking the installation groove 8 with the second sealing block 20, it is ensured that water vapor will not enter the chip groove 4 to affect the use of the chip 6. At the same time, the first elastic block 19 will deform and closely adhere to the side wall of the pin installation groove 17 under the extrusion of the liquefied paraffin. The second sealing block 20 itself is in interference fit and will also closely adhere to the side wall of the pin installation groove 17, so as to seal the lead-out groove 9 well and prevent the liquefied paraffin phase change material from overflowing from the lead-out groove 9, ensuring the structural stability.

[0035] Example Six: On the basis of Example Five, as Figure 1 、 Figure 2 、 Figure 7 and Figure 8 shown, mounting posts 21 are fixed at the four corners of the bottom of the upper packaging board 1. The chip packaging board 2 and the heat dissipation packaging board 3 are both provided with through holes 22 at the positions corresponding to the mounting posts 21. A threaded hole 23 is provided at one end of the mounting post 21 away from the upper packaging board 1. The mounting post 21 penetrates into the through hole 22 of the heat dissipation packaging board 3. Screws 24 are arranged at the four through holes 22 at the bottom of the heat dissipation packaging board 3. The threaded body of the screw 24 is threadedly connected in the threaded hole 23. Four counterbores 25 are provided at the bottom of the heat dissipation packaging board 3. The four counterbores 25 are coaxially arranged with the four through holes 22 one by one. The diameter of the counterbore 25 is larger than the diameter of the through hole 22. A sealing ring 26 is arranged in the counterbore 25. The head of the screw 24 is located in the counterbore 25 and extrudes the sealing ring 26 to generate deformation. The mounting post 21 of the upper packaging board 1 is sequentially passed through the through holes 22 of the chip packaging board 2 and the heat dissipation packaging board 3, and then the screw 24 is connected in the threaded hole 23 of the mounting post 21. After the screw 24 is tightened, it will extrude the sealing ring 26 to generate deformation, and the through hole 22 is sealed by the sealing ring 26, so as to seal and assemble the upper packaging board 1, the chip packaging board 2 and the heat dissipation packaging board 3 together.

[0036] Example Seven: On the basis of Example Six, asFigure 1 , Figure 2 , Figure 7 and Figure 8 As shown in Figure 1 , Figure 2 , Figure 7 and Figure 8 , a first sealing ring 27 is fixed to the bottom of the upper encapsulation board 1. A first annular groove 28 is formed around the chip groove 4 at the top of the chip encapsulation board 2. The first sealing ring 27 is in interference fit in the first annular groove 28. A second sealing ring 29 is fixed to the bottom of the chip encapsulation board 2. A second annular groove 30 is formed around the heat dissipation groove 5 at the top of the heat dissipation encapsulation board 3. The second sealing ring 29 is in interference fit in the second annular groove 30. The axial length of the first sealing ring 27 is greater than the axial length of the first annular groove 28, and the axial length of the second sealing ring 29 is greater than the axial length of the second annular groove 30. After the upper encapsulation board 1, the chip encapsulation board 2 and the heat dissipation encapsulation board 3 are assembled, the first sealing ring 27 will be compressed and in interference fit in the first annular groove 28 to eliminate the gap between the upper encapsulation board 1 and the chip encapsulation board 2. The second sealing ring 29 is compressed and in interference fit in the second annular groove 30 to eliminate the gap between the chip encapsulation board 2 and the heat dissipation encapsulation board 3, improving the sealing performance of the entire chip encapsulation body.

Claims

1. A packaging structure of a heat dissipation integrated circuit chip, characterized in that: The invention comprises an upper packaging plate (1), a chip packaging plate (2) and a heat dissipation packaging plate (3) which are assembled together in sequence from top to bottom, wherein a chip slot (4) is provided on the top of the chip packaging plate (2), wherein the chip slot (4) is used to implant a chip (6), a heat dissipation slot (5) is provided on the top of the heat dissipation packaging plate (3), wherein the heat dissipation slot (5) is filled with paraffin, wherein the pin of the chip (6) is connected to one end of a pin (7) via a wire, a mounting slot (8) is provided through the position corresponding to the pin (7) on the chip packaging plate (2), an outlet slot (9) is provided on the inner side wall of the heat dissipation slot (5), wherein the outlet slot (9) passes through the outer side wall of the heat dissipation packaging plate (3), wherein each mounting slot (8) corresponds to one outlet slot (9), and the other end of the pin (7) passes through the mounting slot (8) and the outlet slot (9) and is arranged outside the heat dissipation packaging plate (3); The pin (7) adopts a split structure, and the pin (7) comprises a chip connection pin (10) and a lead pin (11), one end of the chip connection pin (10) is located in the chip packaging board (2) and connected to the chip (6), and the other end passes through the installation groove (8) and extends into the heat dissipation groove (5), and one end of the lead pin (11) passes through the lead groove (9) and is connected to the other end of the chip connection pin (10).

2. The packaging structure of a heat dissipation integrated circuit chip according to claim 1, characterized in that: The chip connection pin (10) comprises a long side (12), a vertical side (13) and a short side (14); the two ends of the vertical side (13) are connected to the long side (12) and the short side (14) by arc transition; one end of the short side (14) away from the vertical side (13) is provided with a pin hole (15); the chip connection pin (10) and the lead pin (11) are both Z-shaped; one end of the lead pin (11) close to the short side (14) is fixed with a pin (16); the diameter of the pin (16) gradually increases in a direction close to the lead pin (11); and the pin (16) is interference-fitted into the pin hole (15).

3. The packaging structure of a heat dissipation integrated circuit chip according to claim 2, characterized in that: The side wall of the heat dissipation slot (5) is provided with a pin mounting slot (17), each pin (7) corresponds to a pin mounting slot (17), the pin mounting slot (17) passes through the top of the heat dissipation packaging plate (3), the lead-out slot (9) is connected to the pin mounting slot (17), the chip connection pin (10) is connected to the lead-out pin (11) in the pin mounting slot (17), and the top of the chip packaging plate (2) is provided with a plurality of strip grooves (18), the plurality of strip grooves (18) correspond one-to-one to the plurality of pins (7), and the two ends of the strip groove (18) are respectively connected to the mounting slot (8) and the chip slot (4).

4. The packaging structure of a heat dissipation integrated circuit chip according to claim 3, characterized in that: A first elastic block (19) is provided at the bottom of the pin installation groove (17); the side wall of the first elastic block (19) is flush with the inner side wall of the heat dissipation groove (5); and the short side (14) and one end of the lead pin (11) are both in contact with the top surface of the first elastic block (19).

5. The packaging structure of a heat dissipation integrated circuit chip according to claim 4, characterized in that: An installation gap is formed between the vertical edge (13) and the inner side wall of the pin installation groove (17), and a second sealing block (20) is arranged in the installation gap. The second sealing block (20) passes through the installation groove (8), and the top surface of the second sealing block (20) is located above the top surface of the chip packaging board (2). The upper packaging board (1) and the chip packaging board (2) are assembled to squeeze the second sealing block (20) to generate compression deformation, so as to make the second sealing block (20) interference fit in the installation groove (8) and the pin installation groove (17).

6. The packaging structure of a heat dissipation integrated circuit chip according to claim 1, characterized in that: The four corners of the bottom of the upper packaging plate (1) are fixed with mounting posts (21); the chip packaging plate (2) and the heat dissipation packaging plate (3) are provided with through holes (22) at positions corresponding to the mounting posts (21); a threaded hole (23) is provided at one end of the mounting post (21) away from the upper packaging plate (1); the mounting post (21) penetrates into the through hole (22) of the heat dissipation packaging plate (3); screws (24) are provided at the four through holes (22) at the bottom of the heat dissipation packaging plate (3); the screw body of the screw (24) is threadedly connected in the threaded hole (23).

7. The packaging structure of a heat dissipation integrated circuit chip according to claim 6, characterized in that: Four countersunk holes (25) are provided at the bottom of the heat dissipation packaging plate (3); the four countersunk holes (25) are coaxially arranged with the four through holes (22); the diameter of the countersunk holes (25) is larger than the diameter of the through holes (22); a sealing ring (26) is provided in the countersunk hole (25); the head of the screw (24) is located in the countersunk hole (25) and squeezes the sealing ring (26) to generate deformation.

8. The heat dissipation integrated circuit chip packaging structure according to claim 1, characterized in that: A first sealing ring (27) is fixed at the bottom of the upper packaging plate (1), a first annular groove (28) is provided at the top of the chip packaging plate (2) around the chip groove (4), and the first sealing ring (27) is interference fit in the first annular groove (28), a second sealing ring (29) is fixed at the bottom of the chip packaging plate (2), a second annular groove (30) is provided at the top of the heat dissipation packaging plate (3) around the heat dissipation groove (5), and the second sealing ring (29) is interference fit in the second annular groove (30).

9. The heat dissipation integrated circuit chip packaging structure according to claim 1, characterized in that: A plurality of heat dissipation slots (31) are provided at the bottom of the heat dissipation packaging plate (3), and the heat dissipation slots (31) are arranged to penetrate in a horizontal direction.

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