Glass heating plate

Abstract

The invention discloses a glass heating plate, which comprises 15-25% of an electromagnetic sealing shielding conductive adhesive A, 15-25% of an electromagnetic sealing shielding conductive adhesive B, 1-8% of silane coupling pills, 10-20% of carbon black, 15-20% of superconducting graphite, 10-20% of carbon nanotubes, 1-3% of graphene, and 30-60% of an organic solvent. Graphene is an excellent material with a high heat conductivity coefficient and has very good heat conduction performance, so that heat on a pcb device is conveniently transferred to the glass heating plate, the heat dissipation area is increased, and compared with natural heat dissipation through a shell, the glass heating plate has the characteristics of accelerating heat dissipation and cooling of the pcb circuit board, and the heat dissipation efficiency of the pcb circuit board is improved. The carbon nanotubes and the superconducting graphite are used as main materials, so that the whole plate has the characteristics of corrosion resistance, wear resistance, high temperature resistance, light weight and high strength, and is not easy to break when being made into a thin plate. And the support has the remarkable advantages of low loss, high density of through holes and the like, and finer line width and line distance control can be realized.

Description

Technical Field

[0001] The invention relates to the technical field related to PCB board heat dissipation, and in particular to a glass heating plate. Background Art

[0002] PCB circuit board is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Because it is made by electronic printing, it is called "printed" circuit board. After electronic equipment uses printed boards, due to the consistency of similar printed boards, errors in manual wiring are avoided, and automatic insertion or mounting, automatic soldering, and automatic detection of electronic components can be realized, ensuring the quality of electronic equipment, improving labor productivity, reducing costs, and facilitating maintenance; while in the use of existing PCB boards, the heat-generating components rely on their own shells for heat dissipation, and the heat dissipation effect is poor for components with higher heat generation, which is prone to heat accumulation and damage to the components. Summary of the invention

[0003] In order to solve the problem in the prior art that during the use of the existing PCB board, the heat-generating device relies on its own shell to dissipate heat, the heat dissipation effect is poor for the device with higher heat generation, heat accumulation is easily generated, and the device is damaged, the present invention provides a glass heating plate.

[0004] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0005] The glass heating plate of the present invention comprises the following raw material components: electromagnetic sealing shielding conductive glue A: 15-25%, electromagnetic sealing shielding conductive glue B: 15-25%, silane couple pills: 1-8%, carbon black 10-20%, superconductive graphite: 15-20%, carbon nanotubes: 10-20%, graphene 1-3%, and organic solvent 30-60%;

[0006] The preparation process is as follows: comprising the following steps:

[0007] Step 1, pre-treating carbon black, superconducting graphite, carbon nanotubes and graphene by heating;

[0008] Step 2: introducing the pretreated carbon black, superconducting graphite, carbon nanotubes and graphene into a disperser, and then introducing part of the organic solvent into the disperser, and the disperser performs high-speed dispersion and stirring;

[0009] Step 3, after high-speed dispersing and stirring, add silane pellets into the disperser, disperse and stir, then add the electromagnetic sealing shielding conductive glue A and the electromagnetic sealing shielding conductive glue B and the remaining organic solvent into the disperser after stirring, and disperse at high speed to obtain a final dispersion;

[0010] Step 4. coating the final dispersion on the release film to form a coating, and then curing the coating at high temperature;

[0011] Step 5: peel the cured coating from the release film, roll the coating into a roll, and cut it to form a glass heating plate.

[0012] As a preferred technical solution of the present invention, the method for pretreating carbon black, superconducting graphite, carbon nanotubes and graphene in step 1 is: putting carbon black, superconducting graphite, carbon nanotubes and graphene together into a heating furnace, and keeping them at 180°C for 2 hours, and cooling them with the furnace. The heating furnace can be provided with a stirring structure to disperse and mix the carbon black, superconducting graphite, carbon nanotubes and graphene. Within the first half hour of heating in the heating furnace, the exhaust gas generated during the heating process is extracted, and then the heating furnace is sealed and kept still, the temperature is maintained for one and a half hours, and then cooled with the furnace.

[0013] As a preferred technical solution of the present invention, in step 2 and step 3, high-speed dispersion is carried out at a rotation speed of 900 / min.

[0014] As a preferred technical solution of the present invention, the method for high temperature curing of the coating is to cure it at a temperature of 180° C. for half an hour.

[0015] As a preferred technical solution of the present invention, the components of the electromagnetic sealing shielding conductive glue A include a mixture of metal powder, carbon nanotubes, conductive polymers and conductive fibers, wherein the mass composition of the electromagnetic sealing shielding conductive glue A is 10 parts of metal powder, 20 parts of conductive polymers and 5 parts of conductive fibers.

[0016] As a preferred technical solution of the present invention, the electromagnetic sealing shielding conductive adhesive B comprises thermally conductive and electrically conductive electromagnetic shielding filler, vinyl silicone oil, hydrogen-containing silicone oil, platinum catalyst and inhibitor.

[0017] As a preferred technical solution of the present invention, the thermally conductive and electrically conductive electromagnetic shielding filler is one or more of carbon nanotubes, graphene, graphite, silver powder, copper powder, and nickel powder.

[0018] The beneficial effects of the present invention are:

[0019] In this glass heating plate, carbon black, superconducting graphite, carbon nanotubes and graphene are used as the substrate materials of the core plate. Graphene has excellent thermal conductivity and high thermal conductivity, which makes it convenient to transfer the heat on the PCB device to the glass heating plate, thereby increasing the heat dissipation area. Compared with the natural heat dissipation of the shell, the glass heating plate has the characteristics of accelerating the heat dissipation and cooling of the PCB circuit board. The addition of carbon black plays a coloring role, and has high stability. Moreover, carbon black is very cheap, which effectively reduces the cost. Among them, the superconducting graphite with a large mass of superconducting graphite improves the overall corrosion resistance, wear resistance and high temperature resistance, and plays an antistatic role; and the carbon nanotube has a small density but high strength, so that the glass heating plate is light in overall weight and not easy to break. In addition, the carbon nanotube and superconducting graphite are mainly used, which ensures that the overall has the characteristics of corrosion resistance, wear resistance, high temperature resistance, light weight and high strength, and is not easy to break when made into a thin plate. Furthermore, the present invention has significant advantages such as low loss and high-density through holes, and can also achieve more precise line width and line spacing control. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

[0021] In the attached picture:

[0022] Figure 1 It is a test temperature rise diagram of a glass heating plate of the present invention;

[0023] Figure 2 It is a schematic diagram of test point selection during the test of a glass heating plate of the present invention. DETAILED DESCRIPTION

[0024] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0025] Embodiment: A glass heating plate of the present invention comprises the following raw material components: electromagnetic sealing shielding conductive glue A: 15-25%, electromagnetic sealing shielding conductive glue B: 15-25%, silane couple pills: 1-8%, carbon black 10-20%, superconductive graphite: 15-20%, carbon nanotubes: 10-20%, graphene 1-3%, and organic solvent 30-60%;

[0026] The preparation process is as follows: comprising the following steps:

[0027] Step 1, pre-treating carbon black, superconducting graphite, carbon nanotubes and graphene by heating;

[0028] Step 2: introducing the pretreated carbon black, superconducting graphite, carbon nanotubes and graphene into a disperser, and then introducing part of the organic solvent into the disperser, and the disperser performs high-speed dispersion and stirring;

[0029] Step 3, after high-speed dispersing and stirring, add silane pellets into the disperser, disperse and stir, then add the electromagnetic sealing shielding conductive glue A and the electromagnetic sealing shielding conductive glue B and the remaining organic solvent into the disperser after stirring, and disperse at high speed to obtain a final dispersion;

[0030] Step 4. coating the final dispersion on the release film to form a coating, and then curing the coating at high temperature;

[0031] Step 5: peel the cured coating from the release film, roll the coating into a roll, and cut it to form a glass heating plate.

[0032] The substrate material with carbon black, superconducting graphite, carbon nanotubes and graphene as the core board, wherein graphene has an excellent material with high thermal conductivity, has very good thermal conductivity, so that it is convenient to transfer the heat on the pcb device to the glass heating plate, so that the heat dissipation area is increased, and compared with the natural heat dissipation of the shell, the glass heating plate has the characteristics of accelerating the heat dissipation and cooling of the pcb circuit board, wherein the addition of carbon black plays a role in coloring, and has high stability, and carbon black is very cheap, which effectively reduces the cost, wherein the superconducting graphite with a large mass of superconducting graphite improves the overall corrosion resistance, wear resistance, high temperature resistance performance, and plays an antistatic role; and the carbon nanotube has a small density, but a high strength, so that the glass heating plate is light in overall weight and not easy to break, and is mainly composed of carbon nanotubes and superconducting graphite, so that the overall has the characteristics of corrosion resistance, wear resistance, high temperature resistance, light weight and high strength, and is not easy to break when made into a thin plate. And the invention supports the significant advantages of low loss, high-density through holes, and can also achieve more precise line width and line spacing control. A specific preparation process is used to prepare the glass heating plate.

[0033] Among them, the method for pretreating carbon black, superconducting graphite, carbon nanotubes and graphene in the step 1 is: put carbon black, superconducting graphite, carbon nanotubes and graphene into a heating furnace together, and keep them at 180°C for 2 hours, and cool them with the furnace. The heating furnace can be provided with a stirring structure to disperse and mix the carbon black, superconducting graphite, carbon nanotubes and graphene. Within the first half hour of heating in the heating furnace, the exhaust gas generated during the heating process is extracted, and then the heating furnace is sealed and stationary, and the temperature is maintained for one and a half hours, and then cooled with the furnace.

[0034] Wherein, in step 2 and step 3, high-speed dispersion is carried out at a rotation speed of 900 / min.

[0035] Wherein, the method for high temperature curing of the coating is to cure it at a temperature of 180° C. for half an hour.

[0036] The electromagnetic sealing and shielding conductive glue A comprises a mixture of metal powder, carbon nanotubes, conductive polymers and conductive fibers, wherein the electromagnetic sealing and shielding conductive glue A comprises 10 parts of metal powder, 20 parts of conductive polymers and 5 parts of conductive fibers by mass.

[0037] Among them, the electromagnetic sealing shielding conductive glue B component composition is thermal conductive and conductive electromagnetic shielding filler, vinyl silicone oil, hydrogen-containing silicone oil, platinum catalyst and inhibitor, the thermal conductive and conductive electromagnetic shielding filler is one or more of carbon nanotubes, graphene, graphite, silver powder, copper powder, nickel powder; the thermal conductive and conductive electromagnetic shielding silicone is placed in a solvent to swell, and then the thermal conductive insulating filler-silicone in the solvent is cross-linked in the solution, and part of the silicone can enter the interior of the swollen thermal conductive and conductive electromagnetic shielding silicone, thereby improving the bonding strength of the interface.

[0038] The product is made into a glass heating plate with a thickness of 1-2mm, and a heating experiment is carried out. A suitable heater is selected, and a test block is placed on the heater. The test block is provided with a temperature sensor for real-time detection of the temperature of the test block. A glass heating plate is placed on the test block, and different test points are selected on the glass heating plate at different intervals from the test block. The temperature of each test point is detected in real time and drawn into a heating graph, such as Figure 1 and Figure 2 As shown, it can be known from the temperature rise diagram that the glass heating plate prepared by the present invention has good thermal conductivity and uniform heat conduction. The temperature difference is small at the distance from the heat source, so the heat can be dissipated to various places.

[0039] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A glass heating plate, characterized in that: The raw material components include: electromagnetic sealing shielding conductive glue A: 15-25%, electromagnetic sealing shielding conductive glue B: 15-25%, silane pellets: 1-8%, carbon black 10-20%, superconductive graphite: 15-20%, carbon nanotubes: 10-20%, graphene 1-3%, and organic solvent 30-60%; The preparation process is as follows: comprising the following steps: Step 1, pre-treating carbon black, superconducting graphite, carbon nanotubes and graphene by heating; Step 2: introducing the pretreated carbon black, superconducting graphite, carbon nanotubes and graphene into a disperser, and then introducing part of the organic solvent into the disperser, and the disperser performs high-speed dispersion and stirring; Step 3, after high-speed dispersing and stirring, add silane pellets into the disperser, disperse and stir, then add the electromagnetic sealing shielding conductive glue A and the electromagnetic sealing shielding conductive glue B and the remaining organic solvent into the disperser after stirring, and disperse at high speed to obtain a final dispersion; Step 4. coating the final dispersion on the release film to form a coating, and then curing the coating at high temperature; Step 5: peel the cured coating from the release film, roll the coating into a roll, and cut it to form a glass heating plate.

2. A glass heating plate according to claim 1, characterized in that: The method for pretreating carbon black, superconducting graphite, carbon nanotubes and graphene in step 1 is: putting carbon black, superconducting graphite, carbon nanotubes and graphene together into a heating furnace, and keeping them at 180°C for 2 hours, and cooling them with the furnace. The heating furnace can be provided with a stirring structure to disperse and mix the carbon black, superconducting graphite, carbon nanotubes and graphene. Within the first half hour of heating in the heating furnace, the exhaust gas generated during the heating process is extracted, and then the heating furnace is sealed and kept still, and the temperature is maintained for one and a half hours, and then cooled with the furnace.

3. A glass heating plate according to claim 1, characterized in that: In step 2 and step 3, high-speed dispersion is performed at a rotation speed of 900 / min.

4. A glass heating plate according to claim 2, characterized in that: The method for high temperature curing of the coating is to cure it at a temperature of 180° C. for half an hour.

5. A glass heating plate according to claim 1, characterized in that: The electromagnetic sealing and shielding conductive glue A comprises a mixture of metal powder, carbon nanotubes, conductive polymers and conductive fibers, wherein the electromagnetic sealing and shielding conductive glue A comprises 10 parts of metal powder, 20 parts of conductive polymers and 5 parts of conductive fibers by mass.

6. A glass heating plate according to claim 5, characterized in that: The electromagnetic sealing shielding conductive adhesive B comprises heat-conductive and electrically conductive electromagnetic shielding filler, vinyl silicone oil, hydrogen-containing silicone oil, platinum catalyst and inhibitor.

7. A glass heating plate according to claim 6, characterized in that: The thermally conductive and electrically conductive electromagnetic shielding filler is one or more of carbon nanotubes, graphene, graphite, silver powder, copper powder, and nickel powder.

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