Heat sink with micro-needle columns

Abstract

The present invention discloses a heat sink with micro-pin columns, which includes at least one heat conducting plate and a plurality of micro-pin columns. The heat conducting plate has a first surface and a second surface facing each other. The first surface of the heat conducting plate is connected to the plurality of micro-pin columns, and the second surface of the heat conducting plate is used to be connected to a heat source. The heat conducting plate is formed with a small grain normal region and a plurality of large grain heat conducting channels located in the small grain normal region, and each large grain heat conducting channel is formed from the second surface of the heat conducting plate to the first surface of the heat conducting plate and is connected to each corresponding micro-pin column. The heat sink is provided with large grain heat conducting channels on the heat conducting plate and is connected to the micro-pin columns. The large grain heat conducting channels have better heat conduction effect relative to the small grain normal region. The micro-pin columns have low heat conduction thermal resistance and can provide a larger heat dissipation area for heat dissipation. In this way, the heat of the heat source can be quickly taken away, thus achieving a better heat dissipation effect.

Description

Technical Field

[0001] The invention relates to a radiator, in particular to a radiator with micro-needle columns. Background Art

[0002] Currently, the market has increasingly higher requirements for heat sinks, especially for heat dissipation performance, which often makes current heat sinks unable to meet the demand. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a heat sink with micro-needle columns in view of the deficiencies of the prior art.

[0004] An embodiment of the present invention provides a heat sink with micro-needle columns, which includes at least one heat-conducting plate and a plurality of micro-needle columns; the at least one heat-conducting plate has a first surface and a second surface opposite to each other, the first surface of the at least one heat-conducting plate is connected to the plurality of micro-needle columns, and the second surface of the at least one heat-conducting plate is used to connect to a heat source; wherein the at least one heat-conducting plate is formed with a small-grain normal area and a plurality of large-grain heat-conducting channels located in the small-grain normal area, the average size of the grains in the large-grain heat-conducting channels is larger than the average size of the grains in the small-grain normal area, each of the large-grain heat-conducting channels is formed from the second surface of the at least one heat-conducting plate to the first surface of the at least one heat-conducting plate, and is connected to each corresponding micro-needle column

[0005] In a preferred embodiment, the cross-sections of the plurality of microneedle columns are at least one of circular, elliptical, square, diamond, and teardrop-shaped, and the distance between the two farthest endpoints on the cross-section of each microneedle column is less than 0.5 mm.

[0006] In a preferred embodiment, the height of the microneedle column is greater than 3 mm.

[0007] In a preferred embodiment, the microneedle column is made of copper, copper alloy, aluminum, aluminum alloy, or copper-aluminum composite material.

[0008] In a preferred embodiment, the thickness of the heat conducting plate is less than 0.5 mm.

[0009] In a preferred embodiment, the heat conducting plate is made of copper, copper alloy, aluminum, aluminum alloy, or copper-aluminum composite material.

[0010] In a preferred embodiment, the large-grain heat conduction channel is a channel with a non-uniform cross-sectional area, and the large-grain heat conduction channel forms a portion with a maximum cross-sectional area at a position on the second surface of the heat conduction plate.

[0011] In a preferred embodiment, the large-grain heat conduction channel is a structure formed by laser melting or resistance welding and then solidified.

[0012] In a preferred embodiment, there are at least two of the heat conducting plates, and the first surface of each of the heat conducting plates is connected to the plurality of microneedle columns.

[0013] The above scheme has the following beneficial effects: the heat sink is provided with a large-grain heat conduction channel on the heat conduction plate and is connected to the microneedle column. The large-grain heat conduction channel has a better heat conduction effect than the normal area of ​​the small grain. The microneedle column has a low thermal resistance and can provide a larger heat dissipation area for heat dissipation, so that the heat from the heat source can be quickly taken away, thereby achieving a better heat dissipation effect.

[0014] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 FIG. 1 is a side view of a first embodiment of a heat sink with microneedle columns.

[0016] Figure 2 for Figure 1 In Enlarged schematic diagram of the part.

[0017] Figure 3 for Figure 1 In Enlarged schematic diagram of the part.

[0018] Figure 4 It is a schematic diagram of an implementation of a microneedle column.

[0019] Figure 5 It is a schematic diagram of an implementation of a microneedle column.

[0020] Figure 6 It is a schematic diagram of an implementation of a microneedle column.

[0021] Figure 7 It is a schematic diagram of an implementation of a microneedle column.

[0022] Figure 8 It is a schematic diagram of an implementation of a microneedle column.

[0023] Fig. 9 FIG. 4 is a side view of a second embodiment of a heat sink with microneedle columns.

[0024] Fig.10 FIG. 4 is a side view of a third embodiment of a heat sink with microneedle columns.

[0025] Fig.11 FIG. 4 is a side view of a heat sink with microneedle columns according to a fourth embodiment of the present invention. DETAILED DESCRIPTION

[0026] The following is an explanation of the relevant implementation methods disclosed in the present invention through specific specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. In addition, the same or similar parts in the drawings are marked with the same reference numerals. The following implementation methods will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention. In addition, the term "or" used in this article may include any one or more combinations of the associated listed items depending on the actual situation.

[0027] [First embodiment]

[0028] See also Figures 1 to 8 , which is the first embodiment of the present invention, and the embodiment of the present invention provides a heat sink with micro-needle columns. The heat sink with micro-needle columns provided according to the embodiment of the present invention includes a heat conducting plate 10 and a plurality of micro-needle columns 20.

[0029] In this embodiment, the heat conducting plate 10 is a metal heat conducting plate, which can be made of copper, copper alloy, aluminum, aluminum alloy, or copper-aluminum composite material, so that the heat conducting plate 10 is a bottom plate with high thermal conductivity. In other words, the thickness of the heat conducting plate 10 is less than 0.5 mm, so that the heat conducting plate 10 is an extremely thin bottom plate with high thermal conductivity.

[0030] Furthermore, the heat conducting plate 10 has a first surface 11 and a second surface 12 opposite to each other. The first surface 11 of the heat conducting plate 10 is connected to a plurality of micro-needle columns 20, and the second surface 12 of the heat conducting plate 10 is used to contact the heat source 900 (eg, power chip).

[0031] In this embodiment, the plurality of microneedle columns 20 may be integrally connected to the first surface 11 of the heat conducting plate 10, and the microneedle columns 20 may be made of copper, copper alloy, aluminum, aluminum alloy, or copper-aluminum composite material, so that the microneedle columns 20 are needle columns with high thermal conductivity. In other words, the cross section of the microneedle columns 20 may be circular (e.g. Figure 4 Schematic), ellipse (such as Figure 5 Schematic), square (such as Figure 6 Schematic), diamond (such as Figure 7 Schematic), or teardrop-shaped (such as Figure 8 Moreover, the cross section of the microneedle column 20 may be any one or more of the above shapes, such as Figure 5 , 7As shown, the distance between the two farthest endpoints A and B on the cross section of the microneedle column 20 needs to be less than 0.5 mm to meet the microneedle requirement. In addition, the height of the microneedle column 20 can be greater than 3 mm, up to 6 mm, so that the microneedle column 20 is a high needle-shaped heat dissipation column.

[0032] In order to increase the thermal conductivity of the heat conducting plate 10, the heat conducting plate 10 of the present embodiment is formed with a small grain normal area 101 and a plurality of large grain heat conducting channels 102 located in the small grain normal area 101. The grains are irregular crystals formed after metal crystallization. The grains 1020 (such as Figure 3 The average size of the grains 1010 (shown as a schematic diagram) is larger than that of the small grain normal region 101. Figure 2 In addition, each large-grain heat conduction channel 102 is formed from the second surface 12 of the heat conduction plate 10 to the first surface 11 of the heat conduction plate 10, and is connected to each corresponding micro-needle column 20. In this way, a small-grain normal area 101 and a plurality of large-grain heat conduction channels 102 are formed through the heat conduction plate 10, and each large-grain heat conduction channel 102 is formed from the second surface 12 of the heat conduction plate 10 to the first surface 11, and is connected to each corresponding micro-needle column 20, so that the heat source 900 located on the second surface 12 of the heat conduction plate 10 can conduct high heat to the micro-needle column 20 located on the first surface 11 of the heat conduction plate 10 through the large-grain heat conduction channel 102, thereby taking away the high heat.

[0033] Furthermore, the large-grain heat conduction channel 102 of the present embodiment is a channel of non-uniform cross-sectional area, and the large-grain heat conduction channel 102 is formed with a maximum cross-sectional area portion 1021 at the second surface 12 of the heat conduction plate 10, that is, compared with the minimum cross-sectional area portion 1022 formed at the first surface 11 of the heat conduction plate 10, the large-grain heat conduction channel 102 is formed with a maximum contact area with the heat source 900 at the second surface 12 of the heat conduction plate 10, so that the heat source 900 located on the second surface 12 of the heat conduction plate 10 can better conduct high heat to the microneedle column 20 located on the first surface 11 of the heat conduction plate 10 through the large-grain heat conduction channel 102, thereby taking away the high heat.

[0034] Furthermore, the large-grain heat conduction channel 102 and the small-grain normal area 101 of the heat conduction plate 10 of this embodiment are formed of homogeneous materials, thereby having material continuity, and there is no heterogeneous material interface between the large-grain heat conduction channel 102 and the small-grain normal area 101 of the heat conduction plate 10, so no interface thermal resistance is generated to affect the overall thermal conductivity.

[0035] Furthermore, in order to better form the large-grain heat conduction channel 102 in the heat conduction plate 10, the large-grain heat conduction channel 102 of the present embodiment may be a structure formed by laser processing. Further, the large-grain heat conduction channel 102 of the present embodiment is a structure formed by laser melting and then solidifying, or it can be said that it is a solid channel structure formed by laser melting and then solidifying. In addition, the large-grain heat conduction channel 102 of the present embodiment may also be a solid channel structure formed by resistance welding and then solidifying.

[0036] [Second embodiment]

[0037] See also Fig. 9 As shown, it is the second embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

[0038] The heat sink with microneedle columns provided in this embodiment includes two heat conducting plates 10. Moreover, the first surface 11 of each heat conducting plate 10 is connected to a plurality of microneedle columns 20. Further, the first surface 11 of one heat conducting plate 10 is connected to the lower ends of a plurality of microneedle columns 20, and the first surface 11 of another heat conducting plate 10 is connected to the upper ends of a plurality of microneedle columns 20. Moreover, the second surface 12 of one heat conducting plate 10 is connected to a heat source 900, and the second surface 12 of the other heat conducting plate 10 is connected to another heat source 900, so that the two heat sources 900 can conduct high heat to the microneedle columns 20 through the two heat conducting plates 10, respectively, thereby taking away the high heat.

[0039] [Third embodiment]

[0040] See also Fig.10 As shown, it is the third embodiment of the present invention. This embodiment is substantially the same as the second embodiment, and the differences are described as follows.

[0041] The heat sink with microneedle columns provided in this embodiment includes two heat conducting plates 10, wherein the first surface 11 of one heat conducting plate 10 is connected to the lower ends of a plurality of microneedle columns 20, and the first surface 11 of the other heat conducting plate 10 is connected to the upper ends of a plurality of microneedle columns 20. In addition, the second surface 12 of one heat conducting plate 10 is connected to a heat source 900, and the second surface 12 of the other heat conducting plate 10 is not connected to any heat source, so as to simply improve the heat dissipation capacity.

[0042] [Fourth embodiment]

[0043] See also Fig.11 As shown, it is the fourth embodiment of the present invention. This embodiment is substantially the same as the second embodiment, and the differences are described as follows.

[0044] The heat sink with microneedle columns provided in this embodiment includes three heat conducting plates 10, wherein the first surface 11 of one heat conducting plate 10 is connected to the lower ends of a plurality of microneedle columns 20, and the first surfaces 11 of the other two heat conducting plates 10 are connected to the upper ends of a plurality of microneedle columns 20. In addition, the second surface 12 of one heat conducting plate 10 is connected to a heat source 900, and the second surfaces 12 of the other two heat conducting plates 10 are respectively connected to the other two heat sources 900, so that heat conduction can be well performed for the three heat sources 900 at the same time, so that the three heat sources 900 can respectively conduct high heat to the microneedle columns 20 through the three heat conducting plates 10, thereby taking away the high heat.

[0045] In summary, the heat sink with microneedle columns provided by the present invention includes a heat conducting plate 10 and a plurality of microneedle columns 20. The heat conducting plate 10 has a first surface 11 and a second surface 12 facing each other. The first surface 11 of the heat conducting plate 10 is connected to the plurality of microneedle columns 20, and the second surface 12 of the heat conducting plate 10 is used to connect to the heat source 900. The heat conducting plate 10 is formed with a small grain normal area 101 and a plurality of large grain heat conducting channels 102 located in the small grain normal area 101, and each large grain heat conducting channel 102 is formed from the second surface 12 of the heat conducting plate 10 to the first surface 11 of the heat conducting plate 10, and is connected to each corresponding microneedle column 20. In this way, a small-grain normal area 101 and a plurality of large-grain heat conduction channels 102 are formed through the heat conduction plate 10, and each large-grain heat conduction channel 102 is formed from the second surface 12 of the heat conduction plate 10 to the first surface 11, and is connected to each corresponding micro-needle column 20, so that the heat source 900 located on the second surface 12 of the heat conduction plate 10 can conduct high heat to the micro-needle column 20 located on the first surface 11 of the heat conduction plate 10 through the large-grain heat conduction channel 102, thereby taking away the high heat.

[0046] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention's specification and drawings are included in the scope of the present invention.

Claims

1. A heat sink with microneedle columns, characterized in that: It includes at least one heat conducting plate and a plurality of microneedle columns; the at least one heat conducting plate has a first surface and a second surface facing each other, the first surface of the at least one heat conducting plate is connected to the plurality of microneedle columns, and the second surface of the at least one heat conducting plate is used to connect to a heat source; wherein the at least one heat conducting plate is formed with a small grain normal area and a plurality of large grain heat conducting channels located in the small grain normal area, the average size of the grains in the large grain heat conducting channels is larger than the average size of the grains in the small grain normal area, each of the large grain heat conducting channels is formed from the second surface of the at least one heat conducting plate to the first surface of the at least one heat conducting plate, and is connected to each corresponding microneedle column, the large grain heat conducting channel is a non-uniform cross-sectional area channel, and the large grain heat conducting channel has a maximum cross-sectional area portion formed at the second surface of the heat conducting plate.

2. The heat sink with microneedle columns according to claim 1, characterized in that: The cross-sections of the plurality of microneedle columns are at least one of circular, elliptical, square, diamond, and teardrop-shaped, and the distance between the two farthest endpoints on the cross-section of each microneedle column is less than 0.5 mm.

3. The heat sink with microneedle columns according to claim 1, characterized in that: The height of the microneedle column is greater than 3 mm.

4. The heat sink with microneedle columns according to claim 1, characterized in that: The microneedle column is made of copper, copper alloy, aluminum, aluminum alloy, or copper-aluminum composite material.

5. The heat sink with microneedle columns according to claim 1, characterized in that: The thickness of the heat conducting plate is less than 0.5 mm.

6. The heat sink with micro-needle columns according to claim 1, characterized in that: The heat conducting plate is made of copper, copper alloy, aluminum, aluminum alloy, or copper-aluminum composite material.

7. The heat sink with micro-needle columns according to claim 1, characterized in that: The large-grain heat conduction channel is a structure formed by laser melting or resistance welding and then solidified.

8. The heat sink with micro-needle columns according to claim 1, characterized in that: There are at least two heat conducting plates, and the first surface of each heat conducting plate is connected to the plurality of micro-needle columns.

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