High-uniformity pixel type packaging module structure and manufacturing method thereof
By arranging the light emitting components equally in the pixel-type packaging module structure and a light blocking wall that is equidistantly arranged and staggered with the light emitting components, the contradiction between the cost and halo effect of the pixelated vehicle light solution in the prior art is solved, and high uniform luminescence and low cost effects are achieved.
Patent Information
- Application Number
- CN202411979690.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-03-21
AI Technical Summary
There is a contradiction between the existing pixelated car light solutions achieving halo effect and cost control, especially when the pixel spacing is large, the system cost is higher; while when the pixel spacing is small, the overall cost has increased sharply, making it difficult to meet the cost-effective demand.
A highly uniform pixel-type packaging module structure is designed, including substrate, light emitting components, electrical components, packaging adhesive layer and light blocking wall. Through equidistantly arranged light emitting components and multiple sets of light blocking walls arranged equidistantly and staggered with the light emitting components, light crosstalk is prevented and uniform light emitting and efficient transmission is achieved.
With the pixel pitch of 2.5 to 6 mm, the luminescence uniformity and the clarity of the display effect are achieved, the dependence and cost investment on complex optical structural parts are reduced, and space costs are saved. It is suitable for various occasions where high uniform luminescence effect is required.
Smart Images
Figure CN119677283A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of light-emitting semiconductors, and in particular to a highly uniform pixel-type packaging module structure and a manufacturing method thereof. Background Art
[0002] In the field of automotive lighting and display technology, pixelated design has become an important means to enhance visual effects and user experience. However, existing pixelated automotive lighting solutions often have a contradiction between achieving halo effects and cost control. Specifically, when the pixel pitch (Pitch) is greater than 10mm, although a good halo effect can be achieved through optical structural parts, this solution requires a large amount of space and has a high system cost, which is not conducive to the popularization and application of the product.
[0003] On the other hand, when the pixel pitch is reduced to 1.25-2.0mm, although it can present an excellent interactive screen display effect, the excessive number of LED particles causes the overall cost to rise sharply. This is obviously not an ideal choice for car lights and display products that pursue cost-effectiveness.
[0004] In addition, for pixel pitch of Pitch = 2.5 ~ 6mm, although the cost of a single lamp bead is relatively low, when used directly for direct display, the actual effect is not ideal due to the strong sense of graininess, and it is difficult to meet users' demand for high-quality visual effects. Summary of the invention
[0005] In order to overcome the problems existing in the prior art, an object of the present invention is to provide a highly uniform pixel packaging module structure and a manufacturing method thereof.
[0006] The technical solution adopted by the present invention to solve the technical problem is: a highly uniform pixel packaging module structure, comprising:
[0007] Substrates, light-emitting components, electrical components, encapsulation adhesive layers, light-blocking walls;
[0008] The light-emitting components are provided in plurality, and the plurality of light-emitting components are equidistantly arranged on one side of the substrate, and the electrical component is arranged on the other side of the substrate;
[0009] The packaging glue layer is arranged on a side of the substrate where the light-emitting components are arranged, and the packaging glue layer covers a plurality of the light-emitting components;
[0010] The light-blocking wall is arranged above the packaging glue layer, and the light-blocking wall is provided in multiple groups, and the multiple groups of light-blocking walls are arranged at equal distances and staggered with the multiple light-emitting components.
[0011] Main working principle: The substrate serves as the basic supporting structure of the entire package module, and provides a mounting platform for components such as light-emitting components and electrical components. The substrate is usually made of insulating material to ensure electrical isolation between the electrical components and the light-emitting components, and has good mechanical strength and thermal stability to withstand various stresses during the packaging process and temperature changes during long-term use. Light-emitting components Multiple light-emitting components are equidistantly arranged on one side of the substrate to form a uniform light-emitting array. The light-emitting component is the core component of the module, where the light-emitting component can be a light-emitting chip or a packaged LED, which is responsible for converting electrical energy into light energy. Each light-emitting component is connected to the electrical component through a specific circuit to receive control signals and electrical energy. The light-emitting performance of the light-emitting component directly affects the light-emitting effect and brightness uniformity of the entire module. The electrical component is arranged on the other side of the substrate to provide electrical energy and control signals to the light-emitting component. These components may include drive circuits, power management modules, signal processors, etc., which work together to ensure that the light-emitting component can emit light in a predetermined mode and time sequence, thereby achieving the desired display effect. The encapsulation glue layer is arranged on the side of the substrate where the light-emitting component is arranged, and covers the multiple light-emitting components. The main function of the encapsulation layer is to protect the light-emitting components from damage by the external environment, such as moisture, dust, mechanical shock, etc. At the same time, the encapsulation layer also has a certain light transmittance to ensure that the light emitted by the light-emitting components can be smoothly transmitted to the outside of the module, and also has a diffusion effect. There are diffusion particles in the encapsulation glue, which can play a role in uniform light and reduce granularity. The light-blocking wall is set above the encapsulation layer, and multiple groups of light-blocking walls are arranged at equal distances and staggered with multiple light-emitting components. The main function of the light-blocking wall is to prevent light crosstalk between light-emitting components, that is, to prevent the light emitted by one light-emitting component from interfering with the light-emitting effect of the adjacent light-emitting component. By precisely designing and manufacturing the height, width and position of the light-blocking wall, it can be ensured that the light of each light-emitting component can be independently transmitted to the outside of the module, thereby achieving a highly uniform light-emitting effect.
[0012] In summary, the high uniformity pixel packaging module structure of the present invention realizes uniform light emission and efficient transmission of the light emitting component by rationally designing the layout and structure of components such as the substrate, light emitting component, electrical component, packaging glue layer and light blocking wall. At the same time, the structure also has good protection performance and stability, and is suitable for various occasions requiring high uniformity light emission effect.
[0013] Preferably, the light-blocking wall is filled with a black filler;
[0014] Alternatively, the light blocking wall is filled with black filler and white filler, the white filler is filled inside the light blocking wall, the black filler is arranged outside the light blocking wall, and the white filler occupies 50%-90% of the space of the light blocking wall.
[0015] Preferably, the reflectivity of the white filler is above 80%.
[0016] Preferably, the spacing between the plurality of light-emitting components is 2.5 mm-6 mm.
[0017] Preferably, the packaging glue layer has a thickness of 0.5 mm-10 mm.
[0018] Preferably, the width of the light-blocking wall is 0.4-2.0 mm, and the distance between the light-blocking wall and the substrate is less than 0.5 mm.
[0019] A method for manufacturing a high-uniformity pixel-type packaging module structure is used to manufacture the above-mentioned high-uniformity pixel-type packaging module structure, and the steps are as follows:
[0020] S1. Solder the electrical components and light-emitting components to the substrate through SMT process;
[0021] S2, setting a dam around the substrate;
[0022] S3, pouring a packaging glue layer in the middle of the dam, and covering the packaging glue layer above the light-emitting component until the packaging glue layer solidifies;
[0023] S4, cutting a plurality of slots on the packaging glue layer by a half-cutting process;
[0024] S5, filling the slot with a black filler, or a black filler and a white filler, to form a light-blocking wall;
[0025] S6. The dam is cut off to obtain a pixel-type packaging module structure with high uniformity.
[0026] Preferably, in S3, when the slot is only filled with black filler, the black filler needs to completely fill the slot until it is flush with the top of the packaging glue layer.
[0027] Preferably, in S3, when the slot needs to be filled with both black filler and white filler at the same time, the white filler needs to be poured into the slot first until the white filler fills 50%-90% of the slot space, and then the black filler is poured on top of the white filler until it is flush with the top of the encapsulation glue layer.
[0028] Compared with the prior art, the present invention has the following beneficial effects:
[0029] The present invention effectively prevents light crosstalk between light-emitting components by designing light-emitting components that are arranged at equal intervals and multiple groups of light-blocking walls that are arranged at equal intervals and staggered with the light-emitting components, so that the light of each light-emitting component can be independently and evenly transmitted to the outside of the module. For pixel lights with a pixel pitch of Pitch = 2.5 to 6 mm, not only the light uniformity of the entire module is improved, but also the clarity and delicacy of the display effect are enhanced. Compared with the traditional solution that requires complex optical structures to achieve the halo effect, the present invention can achieve a similar effect through a simple light-blocking wall design, thereby reducing dependence on optical structures and cost investment. At the same time, since the light-emitting components are arranged at equal intervals, no additional space is required to accommodate complex optical structures, further saving space costs.
[0030] In summary, the high-uniformity pixel packaging module structure of the present invention has significant beneficial effects in improving light emission uniformity, reducing system costs, improving production efficiency, enhancing product competitiveness and broadening application fields. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.
[0032] Figure 1 Schematic diagram of the high uniformity pixel packaging module structure Figure 1 ;
[0033] Figure 2 Schematic diagram of the high uniformity pixel packaging module structure Figure 2 ;
[0034] Figure 3 The figure is a workflow diagram of the method for manufacturing the highly uniform pixel packaging module structure.
[0035] 1. Substrate; 2. Light-emitting component; 3. Electrical component; 4. Packaging adhesive layer; 5. Light-blocking wall; 50. Black filler; 51. White filler; 7. Dam. DETAILED DESCRIPTION
[0036] In order to more clearly understand the above-mentioned objects, features and advantages of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth in order to fully understand the present invention, and the embodiments described are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in the art without making creative work are within the scope of protection of the present invention.
[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.
[0038] Example 1
[0039] This embodiment discloses a highly uniform pixel packaging module structure, such as Figure 1-Figure 2 As shown, it includes a substrate 1, a light-emitting component 2, an electrical component 3, a packaging glue layer 4, and a light-blocking wall 5. The substrate 1 is the basic supporting structure of the entire packaging module, and the substrate 1 provides a mounting platform for components such as the light-emitting component 2 and the electrical component 3. The substrate 1 is usually made of insulating material to ensure electrical isolation between the electrical component 3 and the light-emitting component 2, and at the same time has good mechanical strength and thermal stability to withstand various stresses during the packaging process and temperature changes during long-term use. Multiple light-emitting components 2 are equidistantly arranged on one side of the substrate 1 to form a uniform light-emitting array. The light-emitting component 2 is the core component of the module and is responsible for converting electrical energy into light energy. Each light-emitting component 2 is connected to the electrical component 3 through a specific circuit to receive control signals and electrical energy. The light-emitting performance of the light-emitting component 2 directly affects the light-emitting effect and brightness uniformity of the entire module. The electrical component 3 is arranged on the other side of the substrate 1 to provide electrical energy and control signals to the light-emitting component 2. These components may include a driving circuit, a power management module, a signal processor, etc., which work together to ensure that the light-emitting component 2 can emit light in a predetermined mode and time sequence, thereby achieving the desired display effect. The encapsulation layer 4 is arranged on the side of the substrate 1 where the light emitting components 2 are arranged, and covers the top of the plurality of light emitting components 2. The main function of the encapsulation layer 4 is to protect the light emitting components 2 from damage by the external environment, such as moisture, dust, mechanical impact, etc. At the same time, the encapsulation layer 4 also has a certain light transmittance to ensure that the light emitted by the light emitting components 2 can be smoothly transmitted to the outside of the module. The encapsulation layer 4 has diffusion particles, which scatter the light emitted by the light emitting components 2, expand the surface, and achieve the effect of uniform surface light emission.
[0040] The light-blocking walls 5 are arranged above the encapsulation glue layer 4, and multiple groups of light-blocking walls 5 are arranged at equal distances and staggered with multiple light-emitting components 2. The main function of the light-blocking walls 5 is to prevent light crosstalk between the light-emitting components 2, that is, to prevent the light emitted by one light-emitting component 2 from interfering with the light-emitting effect of the adjacent light-emitting component 2. By accurately designing and manufacturing the height, width and position of the light-blocking walls 5, it can be ensured that the light of each light-emitting component 2 can be independently transmitted to the outside of the module, thereby achieving a highly uniform light-emitting effect.
[0041] In summary, the high uniformity pixel packaging module structure of the present invention realizes uniform light emission and efficient transmission of the light emitting component 2 by reasonably designing the layout and structure of components such as the substrate 1, the light emitting component 2, the electrical component 3, the packaging glue layer 4 and the light blocking wall 5. At the same time, the structure also has good protection performance and stability, and is suitable for various occasions requiring high uniformity light emission effects.
[0042] In some optional embodiments, the light blocking wall 5 is filled with a black filler 50 , or is filled with both a black filler 50 and a white filler 51 .
[0043] like Figure 1 As shown, when filled with a black filler 50, the black filler 50 may be black silica gel, and the black filler 50 has high light absorption, and can absorb excess light inside and outside the light-blocking wall 5 to prevent light crosstalk;
[0044] like Figure 2 As shown, when filled with black filler 50 and white filler 51, white filler 51 can be white silica gel, white filler 51 is filled inside the light-blocking wall 5, black filler 50 is arranged outside the light-blocking wall 5, and white filler 51 occupies 50%-90% of the space of the light-blocking wall. White filler 51 has high reflectivity and can reflect the light emitted by the light-emitting component 2, thereby improving the utilization rate of light and the uniformity of the light-emitting effect. When white filler 51 occupies a certain space of the light-blocking wall 5, it can ensure the reflection effect and avoid light interference caused by excessive reflection.
[0045] The light uniformity and light utilization rate are further improved by filling the black and white fillers 51. At the same time, this design also increases the functionality and flexibility of the light-blocking wall 5, and the proportion and position of the fillers can be adjusted according to specific needs.
[0046] In some optional embodiments, the reflectivity of the white filler 51 is above 80%, ensuring a high reflective effect. The white filler 51 with high reflectivity can more effectively reflect the light emitted by the light-emitting component 2, reduce light loss, and improve luminous efficiency and uniformity. The white filler 51 with high reflectivity significantly improves the luminous efficiency and light utilization, allowing the module to emit brighter and more uniform light at the same power consumption.
[0047] In some optional embodiments, the spacing between multiple light-emitting components 2 is 2.5mm-6mm. This range not only ensures the clarity of the light-emitting effect, but also avoids the poor actual effect caused by too strong granularity. Within this spacing range, the light-emitting components 2 can emit clear and uniform light while avoiding light interference between adjacent light-emitting components 2. Reasonable spacing between light-emitting components 2 allows the module to maintain high light uniformity while reducing system cost and production difficulty.
[0048] In some optional embodiments, the thickness of the encapsulation layer 4 of this embodiment is 0.5mm-10mm, and this range can be adjusted according to specific needs. The encapsulation layer 4 plays a role in protecting and fixing the light-emitting component 2, while allowing light to pass through. Within this thickness range, the encapsulation layer 4 can provide a good protection effect without affecting the transmission of light. A reasonable thickness of the encapsulation layer 4 enables the module to have good durability and stability while maintaining high luminous efficiency.
[0049] In some optional embodiments, the width of the light-blocking wall 5 of this embodiment is 0.4-2.0 mm, and the distance between the light-blocking wall 5 and the substrate 1 is less than 0.5 mm. This range not only ensures the light-blocking effect, but also avoids the excessive size of the module caused by the light-blocking wall 5 being too wide. Within this size range, the light-blocking wall 5 can effectively block the light interference between adjacent light-emitting components 2 while maintaining the compactness of the module structure. The reasonable size of the light-blocking wall 5 enables the module to have a small size and light weight while maintaining high light uniformity, making it easy to carry and install.
[0050] Example 2
[0051] This embodiment provides a method for manufacturing a highly uniform pixel-type packaging module structure, which is applicable to manufacturing the highly uniform pixel-type packaging module structure in Embodiment 1. Figure 3 As shown, the specific production steps are as follows:
[0052] S1. First, the electrical components 3 (such as driving circuits, power management modules, etc.) and the light-emitting components 2 are precisely soldered to the substrate 1 through the surface mounting technology (SMT) process. This step ensures that the electrical connection between the electrical components 3 and the light-emitting components 2 is stable and reliable, while maintaining the compactness of the module structure.
[0053] S2. Next, a dam 7 is arranged around the substrate 1. The dam 7 is used to prevent the encapsulation glue layer 4 from overflowing in the subsequent steps to ensure the smooth progress of the encapsulation process. The material and size of the dam 7 should be selected and designed according to specific needs.
[0054] S3, then, pour an appropriate amount of encapsulation glue layer 4 in the middle of the dam 7. The encapsulation glue layer 4 should cover the light emitting component 2 and fill to an appropriate height. Before the encapsulation glue layer 4 solidifies, ensure that its surface is flat and free of bubbles. This step provides necessary protection and fixation for the light emitting component 2 while allowing light to pass through.
[0055] S4, after the encapsulation glue layer 4 is completely solidified, a plurality of grooves are cut on the encapsulation glue layer 4 by a half-cutting process. The position and number of the grooves should be determined according to the layout of the light-emitting component 2 and the design requirements of the light-blocking wall 5. This step is ready for the subsequent formation of the light-blocking wall 5.
[0056] S5. Fill the slot with black filler 50, or fill the slot with black filler 50 and white filler 51 at the same time. When two fillers are used, the white filler 51 should be filled inside the light-blocking wall 5 first, and then the black filler 50 should be placed outside the light-blocking wall 5. The proportion and position of the fillers should be adjusted according to specific needs to ensure the functionality and aesthetics of the light-blocking wall 5.
[0057] S6. Finally, the dam 7 is removed to obtain a complete pixel-type package module structure with high uniformity. After the dam 7 is removed, the module should be cleaned and inspected as necessary to ensure that its quality and performance meet the design requirements.
[0058] The method realizes the production of a highly uniform pixel-type encapsulation module structure through the steps of precise SMT process welding, dam 7 setting, encapsulation glue layer 4 pouring, half-cut process cutting and grooving, filler filling and dam 7 removal. In the production process, each step cooperates with each other to ensure the compactness, stability and uniformity of light emission of the module structure.
[0059] The method adopts precise SMT process and half-cut process to ensure the precise position and size of the electrical component 3, the light-emitting component 2 and the light-blocking wall 5, thereby improving the accuracy and consistency of module production. Through reasonable layout of the light-emitting component 2 and design of the light-blocking wall 5, as well as precise filling of the filler, the method realizes a pixel-type packaging module structure with high uniformity of light emission. This helps to improve the display effect and user experience. The method simplifies the production process, reduces the dependence on complex optical structural parts, and thus reduces the system cost. At the same time, efficient production technology also helps to improve production efficiency and reduce costs. The method can adjust the layout of the light-emitting component 2, the design of the light-blocking wall 5, and the proportion and position of the filler according to specific needs, so as to produce a pixel-type packaging module structure that meets the needs of different application scenarios.
[0060] In some optional embodiments, in S3 , when the groove is only filled with the black filler 50 , the black filler 50 needs to completely fill the groove until it is flush with the top of the packaging glue layer 4 .
[0061] In some optional embodiments, in S3, when the slot needs to be filled with both the black filler 50 and the white filler 51 at the same time, the white filler 51 needs to be poured into the slot first until the white filler 51 fills 50%-90% of the slot space, and then the black filler 50 is poured above the white filler 51 until it is flush with the top of the encapsulation glue layer 4.
[0062] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Therefore, any modification, equivalent change and modification made to the above embodiment according to the technical essence of the present invention without departing from the technical solution of the present invention shall still fall within the scope of the technical solution of the present invention.
Claims
1. A high uniformity pixel packaging module structure, characterized in that: include: Substrates, light-emitting components, electrical components, encapsulation adhesive layers, light-blocking walls; There are multiple light-emitting components, which are equidistantly arranged on one side of the substrate, and the electrical component is arranged on the other side of the substrate; The packaging glue layer is arranged on a side of the substrate where the light-emitting components are arranged, and the packaging glue layer covers a plurality of the light-emitting components; The light-blocking wall is arranged above the packaging glue layer, and the light-blocking wall is provided in multiple groups, and the multiple groups of light-blocking walls are arranged at equal distances and staggered with the multiple light-emitting components.
2. The high uniformity pixel packaging module structure according to claim 1, characterized in that: The light-blocking wall is filled with a black filler; Alternatively, the light blocking wall is filled with black filler and white filler, the white filler is filled inside the light blocking wall, the black filler is arranged outside the light blocking wall, and the white filler occupies 50%-90% of the space of the light blocking wall.
3. The high uniformity pixel packaging module structure according to claim 2, characterized in that: The reflectivity of the white filler is above 80%.
4. The high uniformity pixel packaging module structure according to claim 1, characterized in that: The spacing between the plurality of light emitting components is 2.5 mm to 6 mm.
5. The high uniformity pixel packaging module structure according to claim 1, characterized in that: The thickness of the packaging glue layer is 0.5mm-10mm.
6. The high uniformity pixel packaging module structure according to claim 1, characterized in that: The width of the light-blocking wall is 0.4-2.0 mm, and the distance between the light-blocking wall and the substrate is less than 0.5 mm.
7. A method for manufacturing a high-uniformity pixel packaging module structure, used for manufacturing the high-uniformity pixel packaging module structure according to any one of claims 1 to 6, characterized in that: Here are the steps: S1. Solder the electrical components and light-emitting components to the substrate through SMT process; S2, setting a dam around the substrate; S3, pouring a packaging glue layer in the middle of the dam, and covering the packaging glue layer above the light-emitting component until the packaging glue layer solidifies; S4, cutting a plurality of slots on the packaging glue layer by a half-cutting process; S5, filling the slot with a black filler, or a black filler and a white filler, to form a light-blocking wall; S6. The dam is cut off to obtain a pixel-type packaging module structure with high uniformity.
8. The method for manufacturing a high-uniform pixel packaging module structure according to claim 7, characterized in that: In S3, when the slot is only filled with black filler, the black filler needs to completely fill the slot until it is flush with the top of the encapsulation glue layer.
9. The method for manufacturing a high-uniformity pixel packaging module structure according to claim 7, characterized in that: In S3, when the slot needs to be filled with black filler and white filler at the same time, the white filler needs to be poured into the slot first until the white filler fills 50%-90% of the slot space, and then the black filler is poured on top of the white filler until it is flush with the top of the encapsulation glue layer.