Semiconductor device manufacturing apparatus and member suction method

Abstract

An apparatus (10) for manufacturing a semiconductor device is provided with: a reference jig (40) having a larger size than a semiconductor chip (60); and a mounting tool (15) that sucks and transfers the semiconductor chip (60) and the reference jig (40) separately, the mounting tool (15) having: a base surface (26) that comes into contact with the upper surface of the reference jig (40) when the reference jig (40) is suctioned and held; and a second block (22) protruding from the base surface (26), having a suction hole (28) formed therein, and being in contact with the upper surface of the semiconductor chip (60) when the semiconductor chip (60) is held by suction, the reference jig (40) having a receiving recess (46) for receiving the upper surface of the semiconductor chip (60) when the semiconductor chip (60) is held by suction by the mounting tool (15), and the second block (22) being in contact with the upper surface of the semiconductor chip (60) when the semiconductor chip (60) is held by suction by the mounting tool (15). The second block (22) is received, and a closed space is formed between the second block (22) and the installation tool (15).

Description

Technical Field

[0001] This specification discloses a semiconductor device manufacturing apparatus including a mounting tool that sucks and transfers a semiconductor chip and a reference jig larger in size than the semiconductor chip separately, and a member transfer method. Background Art

[0002] In a semiconductor device manufacturing apparatus, a mounting tool holds a semiconductor chip by suction. Then, the mounting tool moves while the semiconductor chip is being sucked, and the semiconductor chip is bonded to a substrate or the like.

[0003] This type of mounting tool not only sucks and holds the semiconductor chip, but also sometimes sucks and holds a reference fixture that is larger than the semiconductor chip. For example, in order to correct the positioning of the mounting tool, the mounting tool is sometimes used to suck and hold a transparent flat-plate-shaped correction fixture and move it to a specified position. In addition, in order to measure the flatness of the substrate, the mounting tool is sometimes used to suck and hold a measurement fixture that is larger than the semiconductor chip. Hereinafter, a fixture that is larger than the semiconductor chip and is sucked and held by the mounting tool, such as a correction fixture and a measurement fixture, is referred to as a "reference fixture."

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2007-165594 Summary of the invention

[0007] Problems to be solved by the invention

[0008] Here, the reference fixture is significantly larger than the semiconductor chip. Thus, when attempting to use a single mounting tool to suction and hold components of significantly different sizes, various problems are likely to occur.

[0009] For example, if the suction surface of the mounting tool is reduced according to the size of the semiconductor chip, a large reference fixture cannot be properly suctioned. On the other hand, if the suction surface of the mounting tool is increased according to the size of the reference fixture, when suctioning the semiconductor chip, a part of the suction surface may protrude from the semiconductor chip, thereby interfering with other adjacent semiconductor chips.

[0010] In addition, Patent Document 1 discloses a technique in which the bottom surface of a chuck is formed into a hollow pyramid shape. According to the chuck, a plurality of suction objects of different sizes can be suctioned. However, even the chuck of Patent Document 1 cannot solve the problem that the portion of the chuck extending from the suction object interferes with other adjacent components.

[0011] Therefore, this specification discloses a semiconductor device manufacturing apparatus and a member suction method that can appropriately suction and hold both a semiconductor chip and a reference jig by a single mounting tool.

[0012] Technical means of solving problems

[0013] The manufacturing device of the semiconductor device disclosed in this specification is characterized in that it includes: a reference fixture, which is larger than the semiconductor chip; and an installation tool, which sucks and transfers the semiconductor chip and the reference fixture separately, and the installation tool has: a base surface, which contacts the upper surface of the reference fixture when the reference fixture is sucked and held; and a suction protrusion, which protrudes from the base surface and is formed with a suction hole, and contacts the upper surface of the semiconductor chip when the semiconductor chip is sucked and held, and the reference fixture has a receiving recess, which receives the suction protrusion when the installation tool is sucked and held and forms a closed space between the receiving recess and the installation tool.

[0014] In this case, the outer shape of the suction protrusion may be smaller than that of the semiconductor chip.

[0015] In addition, the receiving recess may be in a shape without sharp corners.

[0016] In addition, the reference fixture may be a calibration fixture or a measurement fixture.

[0017] In addition, the outer dimensions of the receiving recess may be more than 50% of the outer dimensions of the reference fixture.

[0018] The suction method of the component disclosed in this specification utilizes an installation tool to separately suction a semiconductor chip and a reference fixture whose size is larger than that of the semiconductor chip. The suction method of the component is characterized in that the installation tool has: a base surface; and a suction protrusion, which protrudes from the base surface and is formed with a suction hole, and the reference fixture is formed with a receiving recess on its upper surface to completely accommodate the suction protrusion. When the semiconductor chip is suctioned by the installation tool, the suction protrusion is brought into contact with the semiconductor chip, and when the reference fixture is suctioned by the installation tool, the base surface is brought into contact with the upper surface of the reference fixture while the suction protrusion is accommodated in the receiving recess.

[0019] Effects of the Invention

[0020] According to the technology disclosed in this specification, both a semiconductor chip and a reference jig can be appropriately held by suction by one mounting tool. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] [ Figure 1] is a schematic diagram showing the structure of a semiconductor device manufacturing apparatus.

[0022] [ Figure 2 ] is a schematic diagram showing the structure of a semiconductor device manufacturing apparatus.

[0023] [ Figure 3 ] is a plan view of the reference fixture.

[0024] [ Figure 4 ] is a diagram showing the situation of joining semiconductor chips using a mounting tool.

[0025] [ Figure 5 ] is a diagram showing a situation in which a configuration reference fixture is transferred using an installation tool.

[0026] [ Fig. 6A ] is a diagram showing an example of another reference fixture.

[0027] [ Figure 6B ] is a diagram showing another example of another reference fixture.

[0028] [ Figure 7 ] is a diagram showing the situation of bonding a semiconductor chip using a comparative example tool.

[0029] [ Figure 8 ] is a diagram showing a situation in which a reference fixture of a comparative example is transferred using an installation tool. DETAILED DESCRIPTION

[0030] Hereinafter, the structure of the semiconductor device manufacturing apparatus 10 will be described with reference to the drawings. Figure 1 and Figure 2 1 is a schematic diagram showing the structure of a manufacturing apparatus 10. The manufacturing apparatus 10 manufactures a semiconductor device by bonding a semiconductor chip 60 to a bonding object. The bonding object is a substrate 70 or another semiconductor chip 60 bonded to the substrate 70.

[0031] The manufacturing apparatus 10 includes a stage 12, a mounting head 14, and a reference jig 40. The stage 12 is a stage on which a substrate 70 is mounted. The stage 12 may include a heater (not shown) for heating the substrate 70.

[0032] A mounting head 14 is provided on the upper side of the stage 12. The mounting head 14 has a mounting tool 15 that can move in the horizontal direction and the vertical direction. The mounting tool 15 sucks and holds the semiconductor chip 60 at its bottom surface and transfers the semiconductor chip 60. The bottom of the mounting tool 15 is a two-layer structure in which the first block 20 and the second block 22 are stacked up and down. The outer dimensions of the first block 20 in a plan view are sufficiently larger than the outer dimensions of the semiconductor chip 60. In addition, the bottom surface of the first block 20 functions as a base surface 26 that contacts the upper surface of the reference fixture 40 when the reference fixture 40 described later is sucked and held.

[0033] The second block 22 protrudes downward from the bottom surface (i.e., the base surface 26) of the first block 20. The second block 22 functions as a suction protrusion for suction-holding the semiconductor chip 60. The outer dimensions of the second block 22 in a plan view are smaller than the outer dimensions of the semiconductor chip 60. The bottom surface of the second block 22 functions as a suction surface 24 that contacts the upper surface of the semiconductor chip 60 when the semiconductor chip 60 is suction-held.

[0034] The suction surface 24 has a suction hole 28 formed therein. The suction hole 28 is fluidically connected to a suction pump 30 via a suction passage 29 formed inside the mounting tool 15. The suction pump 30 is provided outside the mounting tool 15 and applies negative pressure to the suction hole 28.

[0035] The reference fixture 40 is a fixture for calibrating or measuring various components related to the manufacturing device 10. The reference fixture 40 is, for example, a calibration fixture 42 for calibrating the positioning function of the installation tool 15. The calibration fixture 42 is, for example, a flat member containing a transparent raw material such as glass. The calibration process using the calibration fixture 42 is not particularly limited. For example, in order to calibrate the positioning function of the installation tool 15, a fixture side mark (not shown) may also be pre-attached to the calibration fixture 42. Then, when calibrating, the calibration fixture 42 is sucked, held and transferred by the installation tool 15, and the calibration fixture 42 is positioned and configured relative to the reference point of the substrate 70. Moreover, after the positioning and configuration, the correction amount of the positioning function of the installation tool 15 can be determined based on the positional offset between the reference point observable through the transparent calibration fixture 42 and the fixture side mark.

[0036] Figure 3 is a plan view of the reference fixture 40. Figure 3 In FIG. 1 , the two-dot chain line shows the appearance of the first block 20 and the second block 22 of the installation tool 15. Figure 2 and Figure 3As is clear, the outer dimensions of the reference jig 40 are sufficiently larger than the outer dimensions of the semiconductor chip 60. In addition, the outer dimensions of the reference jig 40 are larger than the outer dimensions of the first block 20 (and therefore the outer dimensions of the base surface 26). In addition, a receiving recess 46 for receiving the second block 22 is formed on the upper surface of the reference jig 40. The outer dimensions of the receiving recess 46 are sufficiently larger than the outer dimensions of the second block 22. In addition, the depth of the receiving recess 46 is sufficiently larger than the height of the second block 22. Therefore, when the reference jig 40 is suctioned and held by the mounting tool 15, the base surface 26 of the mounting tool 15 is in close contact with the upper surface of the reference jig 40, whereby the receiving recess 46 constitutes a closed space blocked by the mounting tool 15.

[0037] Here, as is clear from the above description, the bottom of the mounting tool 15 of this example has a two-layer structure, and a receiving recess 46 is formed on the upper surface of the reference jig 40. The reason for adopting the above structure will be described in comparison with the comparative example.

[0038] Figure 7 The installation tool 15 of the comparative example is shown. The semiconductor chip 60 is bonded. The mounting tool 15 The second block 22 is not provided which is smaller than the semiconductor chip 60. The bottom surface of the first block 20, that is, the bottom surface of the first block 20 is a flat surface without protrusions, and a suction hole 28 is formed on the bottom surface of the first block 20. When the semiconductor chip 60 is bonded, the upper surface of the semiconductor chip 60 is brought into contact with the bottom surface of the first block 20, and the semiconductor chip 60 is held by suction. Figure 7 As is clear, a part of the bottom surface of the first block 20 protrudes outside the semiconductor chip 60. Consider the case where the semiconductor chip 60 is picked up from a chip supply source (e.g., a diced wafer, etc.) in the above state, or the case where the semiconductor chip 60 held by suction is bonded to the substrate 70. In this case, Figure 7 As shown, the portion of the first block 20 that extends outward from the semiconductor chip 60 may interfere with another adjacent semiconductor chip 60 , thereby causing damage to the other semiconductor chip 60 .

[0039] Therefore, in this example, a second block 22 smaller than the size of the semiconductor chip 60 is provided on the bottom surface of the mounting tool 15. Figure 4 As shown, when the semiconductor chips 60 are bonded, a portion of the second block 22 can be effectively prevented from interfering with another semiconductor chip 60 .

[0040] However, in the case of such a mounting tool 15, it is difficult to compare the reference jig 40 of the comparative example. The problem of suction maintenance. Figure 8 The reference fixture 40 of the comparative example is shown using the installation tool 15. The case of suction holding. Reference jig 40 of the comparative example The upper surface of the fixture is flat, refer to the fixture 40 There is no receiving recess 46. When the reference fixture 40 is mounted by the mounting tool 15 When suction is performed, the suction force acts only on the reference fixture 40. The suction hole 28 and the reference fixture 40 are is very small compared to the reference fixture, so in this case there are 40 Excessive stress concentration occurs in the portion of the reference fixture 40 facing the suction hole 28. In addition, when the area where the suction force acts is small, there is also a risk of damage to the reference fixture 40. It becomes difficult to maintain the gravity balance during suction and holding, which may cause the reference jig 40 to tilt or fall.

[0041] Therefore, in this example, a receiving recess 46 for receiving the second block 22 is formed on the upper surface of the reference fixture 40. By setting the structure as described above, Figure 5 As shown in FIG. 1 , when the reference jig 40 is held by suction, the suction force acts on the entire receiving recess 46. Since the receiving recess 46 is sufficiently larger than the suction hole 28, Figure 8 Compared with the comparative example, the concentration of stress can be alleviated and the gravity balance can be easily maintained.

[0042] In addition, in this example, the receiving recess 46 is formed into a shape without sharp corners. Figure 2 , Figure 3 As shown in FIG. 1 , the receiving recess 46 is formed into a shape with rounded corners. The reason for setting the above structure is to prevent stress from being concentrated on the corners when the reference fixture 40 is suctioned and held. In addition, the larger the outer dimensions of the receiving recess 46, the more the stress concentration is alleviated, and the more stable the gravity balance is. Therefore, the outer dimensions of the receiving recess 46 can also be set to be more than 50% or more than 80% of the outer dimensions of the reference fixture 40.

[0043] In conclusion, as is clear from the above description, according to the manufacturing apparatus 10 of this example, both the semiconductor chip 60 and the reference jig 40 can be appropriately transferred by one mounting tool 15. In addition, the above description is an example. Therefore, as long as the mounting tool 15 includes a base surface 26 in contact with the upper surface of the reference jig 40 and a suction protrusion protruding from the base surface 26, and the reference jig 40 includes a receiving recess 46 for receiving the suction protrusion, other structures can also be changed.

[0044] For example, in the above example, the calibration jig 42 is used as the reference jig 40, but the reference jig 40 may be another jig as long as it is larger than the semiconductor chip 60 and is held by suction by the mounting tool 15. Fig. 6A The measuring jig 44 is used when measuring the parallelism of the stage 12 or the substrate 70. Fig. 6A The measuring jig 44 shown includes a flat plate and a cone protruding downward from the flat plate. When measuring the parallelism of the surface to be measured, the front end of the cone is brought into contact with two or more points of the surface to be measured in sequence while the measuring jig 44 is held by suction by the mounting tool 15. Then, the parallelism is measured based on the height of the mounting tool 15 at each contact time. A receiving recess 46 for receiving the second block 22 may also be formed on the upper surface of such a measuring jig 44.

[0045] In addition, the reference fixture 40 may also be Figure 6B A measuring jig 44 as shown. Figure 6B The measuring jig 44 shown includes a flat plate and a cone protruding upward from the flat plate. In this case, the measuring jig 44 is placed on the stage 12 or the substrate 70 while being held by the mounting tool 15 by suction. Then, the front end of the cone is brought into contact with two or more points on the bottom surface of the mounting tool 15, and the parallelism is measured based on the height of the mounting tool 15 at each contact time. A receiving recess 46 for receiving the second block 22 may also be formed on the upper surface of such a measuring jig 44. In addition, in this case, of course, the receiving recess 46 is formed at a position away from the cone.

[0046] In addition, the shape and size of the receiving recess 46 may be appropriately changed as long as the second block 22 can be completely received. For example, the receiving recess 46 may be in a shape having a sharp corner. In addition, the outer dimensions of the receiving recess 46 may be less than 50% of the outer dimensions of the reference fixture 40. In addition, the first block 20 and the second block 22 may be integrated with the installation tool 15, or may be removable relative to the installation tool 15. For example, the first block 20 and the second block 22 may be accessories that can be removable relative to the installation tool 15.

[0047] Description of Figure Numbers

[0048] 10: Manufacturing device

[0049] 12: Carrier

[0050] 14: Install the head

[0051] 15: Install Tools

[0052] 20: First Block

[0053] 22: Second Block

[0054] 24: Suction surface

[0055] 26: Base surface

[0056] 28: Suction hole

[0057] 29: Suction channel

[0058] 30: Suction pump

[0059] 40: Reference fixture

[0060] 42: Calibration fixture

[0061] 44: Measuring fixture

[0062] 46: Receiving recess

[0063] 60: Semiconductor chips

[0064] 70: Substrate

Claims

1. A semiconductor device manufacturing device, characterized in that include: A reference fixture having a size larger than the semiconductor chip; and A mounting tool is provided for sucking and transferring the semiconductor chip and the reference fixture separately, wherein the mounting tool has: a base surface that contacts an upper surface of the reference fixture when the reference fixture is held by suction; and a suction protrusion protruding from the base surface and having a suction hole formed therein, and contacting with the upper surface of the semiconductor chip when the semiconductor chip is held by suction, The reference jig has a receiving recessed portion which receives the suction protrusion and forms a closed space with the installation tool when the receiving recessed portion is held by the installation tool under suction.

2. The semiconductor device manufacturing apparatus according to claim 1, wherein: The suction protrusion has an outer shape smaller than that of the semiconductor chip.

3. The semiconductor device manufacturing apparatus according to claim 1, wherein: The receiving recess has no sharp corners.

4. The semiconductor device manufacturing apparatus according to claim 1, wherein: The reference fixture is a calibration fixture or a measurement fixture.

5. The semiconductor device manufacturing apparatus according to claim 1, wherein: The outer dimensions of the receiving recess are more than 50% of the outer dimensions of the reference fixture.

6. A component suction method, wherein a semiconductor chip and a reference fixture having a larger size than the semiconductor chip are suctioned separately by a mounting tool, wherein the component suction method is characterized in that: The installation tool comprises: a base surface; and a suction protrusion protruding from the base surface and having a suction hole formed therein, The reference fixture is formed with a receiving recess on its upper surface for completely accommodating the suction protrusion. When the semiconductor chip is sucked by the mounting tool, the suction protrusion is brought into contact with the semiconductor chip, When the reference jig is suctioned by the mounting tool, the base surface is brought into contact with the upper surface of the reference jig in a state where the suction protrusion is accommodated in the receiving recess.

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