Substrate processing apparatus and method for aligning transport arm

Abstract

A substrate processing apparatus for processing a substrate is provided with: a transport module for transporting the substrate therein; a transfer arm disposed inside the transfer module and having at least one holding arm for holding the substrate; and a processing module connected to the transport module and including a processing chamber in which the substrate is processed, the processing chamber including: a substrate support portion having a support surface for the substrate; a plate member which is disposed above the substrate supporting part; and a side wall part forming an inner side surface of the processing chamber, in which a processing space surrounded by the substrate support part, the plate member, and the side wall part is formed, the transfer arm has a sensor, and the substrate support part, the plate member, and the side wall part are supported by the substrate support part and the side wall part. The alignment of the transfer arm is performed on the basis of the distances between the transfer arm and the substrate support part, the plate member, and the side wall part in the processing space.

Description

Technical Field

[0001] The present invention relates to a method for aligning a substrate processing device and a conveying arm. Background Art

[0002] Patent document 1 discloses a technique for setting the position of a substrate transfer machine using a reflective distance detection sensor in a semiconductor manufacturing device. In the semiconductor substrate position detection device disclosed in Patent document 1, a jig having a pin vertically provided at the center of a plate having the same shape as the semiconductor substrate and a reflective distance detection sensor are used. The reflective distance detection sensor detects the side of the jig to read the longitudinal position of the semiconductor substrate, and then detects the center of the pin to detect the left and right angular position of the substrate transfer machine and the distance to the pin.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 7-74229 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] The technology disclosed herein appropriately aligns the transfer arm in the processing chamber.

[0008] Solutions for solving problems

[0009] A technical solution disclosed herein is a substrate processing device, which is a substrate processing device for processing substrates, and comprises: a conveying module, which conveys the substrate inside; a conveying arm, which is arranged inside the conveying module and has at least one holding arm for holding the substrate; and a processing module, which is connected to the conveying module and has a processing chamber for processing the substrate inside, the processing chamber comprising: a substrate supporting part, which has a supporting surface for the substrate; a plate member, which is arranged above the substrate supporting part; and a side wall part, which constitutes an inner side surface of the processing chamber, and a processing space surrounded by the substrate supporting part, the plate member, and the side wall part is formed in the processing chamber, the conveying arm has a sensor, and the conveying arm is aligned with the sensor based on the distance between the substrate supporting part, the plate member, and the side wall part in the processing space.

[0010] Effects of the Invention

[0011] According to the present disclosure, the transfer arm can be properly positioned in the processing chamber. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1It is a plan view schematically showing the structure of the wafer processing apparatus according to the present embodiment.

[0013] Figure 2 It is a perspective view showing the structure of the transport arm of the transfer module.

[0014] Figure 3 This is a schematic plan view showing an example of the structure of the actuator during positioning.

[0015] Figure 4 This is a schematic diagram for explaining the alignment method in the processing module.

[0016] Figure 5 This is a schematic diagram for explaining the alignment method in the processing module.

[0017] Figure 6 This is a schematic diagram to explain the rotation direction of the sensor. DETAILED DESCRIPTION

[0018] In the manufacturing process of semiconductor devices, the following process is performed: an oxide film formed on the surface of a semiconductor wafer (hereinafter, sometimes referred to as a "wafer") is etched and removed. For example, the etching process of the oxide film is performed by a COR (Chemical Oxide Removal) process and a PHT (Post Heat Treatment) process.

[0019] Here, in the substrate processing system, there is a case where the COR process and the PHT process are respectively performed in different processing modules. In order to properly perform the processing of the wafer in each processing module, the wafer to be processed needs to be accurately delivered to the appropriate position of the mounting table, etc. For this purpose, an operation is performed in which the delivery position of the wafer on the mounting table, etc. is stored as a target position as a position coordinate in the teaching (also called alignment) of the transport arm that transports the wafer to the processing module.

[0020] Patent Document 1 discloses that the position of a semiconductor substrate is automatically detected using a jig and a sensor, thereby improving the work efficiency and performance such as shortening the teaching work time.

[0021] However, in the method described in Patent Document 1, the semiconductor substrate position detection is performed in two dimensions (e.g., in the XY plane direction), and no three-dimensional (e.g., in the XYZ space direction) teaching is performed. In recent years, it is known that in a processing module, components contained in a chamber such as a substrate support portion (also referred to as a stage) and a shower plate are configured to be movable. The displacement of the substrate support portion and the shower plate has been adjusted according to the process conditions of each treatment such as a COR treatment and a PHT treatment, which may cause differences between device models and between multiple processing modules in the same device. In addition, there is also the problem of an increase in the process debugging period for adjustment.

[0022] In the processing modules of substrate processing systems in recent years, even if the wafer is placed at the center of the stage, the process results are affected by the flow of gas, the heat from the side walls of the chamber, etc. Therefore, the installation errors of various components such as the stage and the shower plate, including the height direction, greatly affect the process. Therefore, in order to transport the wafer to the optimal position in the process space, it is required to guide the transport arm to any teaching position in the three-dimensional space in the processing chamber.

[0023] The technology disclosed in the present invention is made in view of the above situation, and the transfer arm is properly aligned in the processing chamber. Figure 1 In addition, in this specification and drawings, for elements having substantially the same functional configuration, the same reference numerals are used to abbreviate overlapping descriptions.

[0024] <Wafer processing equipment>

[0025] First, the structure of the wafer processing apparatus according to the present embodiment will be described. Figure 1 1 is a schematic top view showing the structure of the wafer processing device of the present embodiment. In the present embodiment, the case where the wafer processing device 1 is provided with various processing modules for performing substrate processing, cleaning processing, and positioning processing on the wafer W as a substrate is described. In addition, the module structure of the wafer processing device 1 disclosed in the present invention is not limited to this and can be selected arbitrarily. In this specification, there is a case where the width direction of the wafer processing device 1 is illustrated as the X-axis direction, the length direction is illustrated as the Y-axis direction, and the height direction is illustrated as the Z-axis direction for description.

[0026] like Figure 1 As shown, the wafer processing device 1 has a structure in which an atmospheric section 10 and a decompression section 11 are integrally connected by means of load lock modules 20a and 20b. The atmospheric section 10 includes a plurality of atmospheric modules for performing desired processing on the wafer W under an atmospheric pressure atmosphere. The decompression section 11 includes a plurality of decompression modules for performing desired processing on the wafer W under a decompression atmosphere.

[0027] The load lock module 20a temporarily holds wafers W in order to deliver wafers W conveyed from the load module 30 (described later) of the atmosphere section 10 to the transfer module 60 (described later) of the decompression section 11. The load lock module 20a includes an upper stocker 21a and a lower stocker 22a for holding two wafers W in the vertical direction.

[0028] The load lock module 20a is connected to the load module 30 to be described later via a door 24a provided with a gate valve 23a. The gate valve 23a is used to ensure airtightness and communication between the load lock module 20a and the load module 30. In addition, the load lock module 20a is connected to the transfer module 60 to be described later via a door 26a provided with a gate valve 25a. The gate valve 25a is used to ensure airtightness and communication between the load lock module 20a and the transfer module 60.

[0029] The load lock module 20a is connected to a gas supply unit (not shown) for supplying gas and an exhaust unit (not shown) for exhausting gas, and is configured so that the atmosphere inside can be switched between atmospheric pressure and reduced pressure atmosphere by using the gas supply unit and the exhaust unit. That is, the load lock module 20a is configured so that the wafer W can be properly transferred between the atmospheric pressure unit 10 and the reduced pressure unit 11.

[0030] The load lock module 20b has the same structure as the load lock module 20a, that is, the load lock module 20b has an upper storage tank 21b and a lower storage tank 22b, a gate valve 23b and a door 24b on the load module 30 side, and a gate valve 25b and a door 26b on the transfer module 60 side.

[0031] In addition, the number and arrangement of the load-lock modules 20 a and 20 b are not limited to the present embodiment, and can be set arbitrarily.

[0032] The atmosphere section 10 comprises: a loading module 30 having a wafer conveying mechanism 40 to be discussed later; a loading section 32 for placing a front-opening wafer transfer box 31 capable of storing a plurality of wafers W; a wafer cleaning module 33 for removing fluorine from the wafers W; and a positioning module 34 for adjusting the horizontal orientation of the wafers W.

[0033] The loading module 30 as a conveying device for wafer W is composed of a shell with a rectangular interior, so that the interior of the shell is maintained at an atmospheric pressure atmosphere. A plurality of, for example, three loading units 32 are arranged on one side of the long side of the shell of the loading module 30. Loading interlock modules 20a and 20b are arranged on the other side of the long side of the shell of the loading module 30. Sometimes, an atmospheric substrate processing device (for example, a wafer cleaning module, a wafer cooling module, an optical film thickness measuring device, etc.) 33 is arranged on one side of the short side of the shell of the loading module 30. A positioning module 34 is arranged on the other side of the short side of the shell of the loading module 30.

[0034] The number and arrangement of the loading unit 32 and the positioning module 34 are not limited to the present embodiment and can be arbitrarily designed. For example, a plurality of wafer cleaning modules 33 may be provided on both sides of the load lock modules 20a and 20b.

[0035] The front-opening FOUP 31 stores a plurality of wafers W, for example, 25 wafers W per batch, stacked at equal intervals in multiple layers. The interior of the front-opening FOUP 31 placed on the loading unit 32 is filled with air, nitrogen, or the like and sealed.

[0036] The atmospheric substrate processing apparatus 33 may cool the wafer W after the COR process or the PHT process, and may measure the film thickness of the wafer W before and after the COR process.

[0037] The positioning module 34 rotates the wafer W to adjust the horizontal orientation. Specifically, the positioning module 34 adjusts the wafer W so that when wafer processing is performed on each of the plurality of wafers W, the orientation relative to the horizontal reference position (eg, notch position) is the same for each wafer processing.

[0038] A wafer conveying mechanism 40 for conveying wafers W is provided inside the loading module 30. The wafer conveying mechanism 40 includes a conveying arm 41 (41a, 41b) that moves while holding the wafer W, a rotating table 42 that rotatably supports the conveying arm 41, and a rotating mounting table 43 that carries the rotating table 42. The wafer conveying mechanism 40 is configured to be movable along the longitudinal direction inside the housing of the loading module 30.

[0039] The decompression section 11 includes: a transfer module 60 that simultaneously transports two wafers W; a substrate processing module 61 that performs, for example, COR processing on the wafers W transported from the transfer module 60; and a substrate processing module 62 that performs, for example, PHT processing. The interiors of the transfer module 60, the substrate processing module 61, and the substrate processing module 62 are respectively maintained in a decompression atmosphere. With respect to the transfer module 60, a plurality of substrate processing modules 61 and a plurality of substrate processing modules 62 are provided, for example, three substrate processing modules 61 and three substrate processing modules 62 are provided.

[0040] The transfer module 60 is composed of a housing with a rectangular interior, and is connected to the load lock modules 20a and 20b via the gate valves 25a and 25b as described above. The transfer module 60 is composed of a housing with a rectangular interior, and sequentially transfers the wafer W sent to the load lock module 20a to a substrate processing module 61 and a substrate processing module 62 to perform, for example, COR processing and PHT processing, and then sends the wafer to the atmosphere section 10 via the load lock module 20b.

[0041] Two stages 63a and 63b are provided inside the substrate processing module 61 for placing two wafers W in a horizontal arrangement. The substrate processing module 61 performs, for example, COR processing on the two wafers W simultaneously by placing the wafers W in an arrangement on the stages 63a and 63b. In addition, a gas supply unit (not shown) for supplying a processing gas, a purge gas, etc., and an exhaust unit (not shown) for exhausting the gas are connected to the substrate processing module 61.

[0042] The substrate processing module 61 is connected to the transfer module 60 via a door 65 provided with a gate valve 64. The gate valve 64 is used to ensure airtightness between the transfer module 60 and the substrate processing module 61 and to provide communication therewith.

[0043] Two stages 66a and 66b are provided inside the substrate processing module 62 for placing two wafers W arranged in a horizontal direction. The substrate processing module 62 performs, for example, PHT processing on the two wafers W simultaneously by placing the wafers W in an arranged manner on the stages 66a and 66b. In addition, a gas supply unit (not shown) for supplying gas and an exhaust unit (not shown) for exhausting gas are connected to the substrate processing module 62.

[0044] The substrate processing module 62 is connected to the transfer module 60 via a door 68 provided with a gate valve 67. The gate valve 67 is used to ensure airtightness between the transfer module 60 and the substrate processing module 62 and to ensure communication between them.

[0045] A wafer conveying mechanism 70 for conveying wafers W is provided inside the transfer module 60. The wafer conveying mechanism 70 includes a conveying arm 71 (71a, 71b) that moves while holding two wafers W; a rotating table 72 that rotatably supports the conveying arms 71a, 71b; and a rotating stage 73 that carries the rotating table 72. In addition, a guide rail 74 extending in the longitudinal direction of the transfer module 60 is provided inside the transfer module 60. The rotating stage 73 is provided on the guide rail 74 and is configured so that the wafer conveying mechanism 70 can move along the guide rail 74.

[0046] In the transfer module 60, the two wafers W held in the upper storage 21a and the lower storage 22a in the load lock module 20a are received by the transfer arm 71a and transferred to the substrate processing module 61. In addition, the transfer arm 71a holds two wafers W that have been subjected to, for example, COR processing, and transfers them to the substrate processing module 62. In addition, the transfer arm 71b holds two wafers W that have been subjected to, for example, PHT processing, and sends them to the load lock module 20b.

[0047] The above wafer processing device 1 is provided with a control unit 80. The control unit 80 is a computer having, for example, a CPU, a memory, etc., and has a program storage unit (not shown). The program storage unit stores a program for controlling the processing of the wafer W in the wafer processing device 1. The above program may also control the conveying arm 71 of the wafer processing device 1 and a sensor provided on the conveying arm 71. In addition, a correction operation unit for control may also be provided. In addition, the above program may be stored in a computer-readable storage medium H, and loaded from the storage medium H to the control unit 80. In addition, the above storage medium H may be either temporary or non-temporary.

[0048] <Conveyor arm structure>

[0049] Figure 2 71 is a perspective view showing the schematic structure of the transport arm 71. Figure 2 As shown, the transport arm 71a includes: a first arm 75a, one end of which is rotatably connected to the rotating table 72; a second arm 76a, one end of which is rotatably connected to the other end of the first arm 75a; and a third arm 77a, which is rotatably connected to the other end of the second arm 76a. A multilayer actuator 78a is connected to the other end of the third arm 77a as a picker for holding the wafer W. The multilayer actuator 78a is composed of a plurality of actuators stacked in multiple layers, and the number of layers is arbitrary, and it can also be a two-layer type, for example. In this case, it can also be composed of an upper actuator 78a-1 and a lower actuator 78a-2.

[0050] In addition, the transport arm 71b includes: a first arm 75b, one end of which is rotatably connected to the rotating table 72; a second arm 76b, one end of which is rotatably connected to the other end of the first arm 75b; and a third arm 77b, which is rotatably connected to the other end of the second arm 76b. A multilayer actuator 78b is connected to the other end of the third arm 77b as a picker for holding the wafer W. The multilayer actuator 78b is composed of a plurality of actuators stacked in multiple layers, and the number of layers is arbitrary, and it can also be a two-layer type, for example. In this case, it can also be composed of an upper actuator 78b-1 and a lower actuator 78b-2.

[0051] Figure 3 This is a schematic top view showing an example of the structure of the multi-layer actuators 78a (78a-1, 78a-2) and 78b (78b-1, 78b-2) during alignment, and is a diagram showing the upper actuator 78b-1 in a top view, taking the actuators of the transport arms 71a and 71b as representatives. Figure 3 As shown, the upper actuator 78b-1 includes claws 90 and 91 that are bifurcated around the connection position with the third arm 77a. A sensor 100 is mounted on the tip of at least one of the claws 90 (and / or 91).

[0052] The sensor 100 may be, for example, a photoelectric sensor that measures the distance by irradiating a laser to an object and detecting the reflected light that returns. In addition, the sensor 100 as a photoelectric sensor may be configured to be freely rotatable 360° around the axis (in the ZY plane direction) with the extension direction of the conveying arm 71 as the axis. That is, the sensor 100 may be configured to irradiate laser light in all three-dimensional directions while the conveying arm 71 is extended. If the conveying arm 71 is inserted into a processing module such as the substrate processing module 61 or the substrate processing module 62, the sensor 100 may be used to measure the distance between components such as the substrate support (stage), the plate member (gas supply plate), and the side wall of each processing module. In addition, the sensor 100 may also be used to measure the shapes of various components such as the outer shape of the substrate support and the outer shape of the plate member. That is, by laser scanning components such as the substrate support, the plate member, and the side wall, the height position, the center position, and the spatial center position of the processing space formed in the processing module of the component may be determined. In addition, the plate member in each processing module may also include an upper electrode assembly.

[0053] In addition, the sensor 100 can also be configured to be freely assembled and disassembled. That is, it can also be a structure in which the sensor 100 is installed on the actuator during alignment, and the sensor 100 is removed during substrate processing. In addition, in the structure of the present embodiment, it is preferred that at least one sensor 100 is installed on each of the multi-layer actuators 78a and 78b. In the multi-layer actuators 78a and 78b, the sensor 100 can also be installed on any of the upper and lower actuators. The installation position of the sensor 100 in the multi-layer actuators 78a and 78b is arbitrary and is not limited to the position shown in the figure. It can also be a position such as the root of the claw 90 (and / or 91). However, it is required to predetermine the relationship between the center position of the wafer W held in the multi-layer actuators 78a and 78b and the installation position of the sensor 100.

[0054] <Alignment method in processing module>

[0055] The conveying arm 71 of the wafer conveying mechanism 70 that is provided inside the transfer module 60 and conveys the wafer W can be inserted into each processing module such as the substrate processing module 61 and the substrate processing module 62. The conveying arm 71 is inserted in various situations, such as when the wafer W is held and substrate processing is performed in each processing module, when the conveying arm 71 is aligned while holding a dummy wafer, etc.

[0056] Figure 4 and Figure 5 This is a schematic diagram for explaining the alignment method in the processing module, schematically illustrating the state in which the transfer arm 71 is inserted from the transfer module 60 of the wafer processing device 1 of this embodiment into each processing module such as the substrate processing module 61 and the substrate processing module 62. In addition, as an example, Figure 4 An XZ cross-sectional view showing a state where the transfer arm 71 is inserted into the substrate processing module 61, Figure 5 A YZ cross-sectional view showing a state where the transfer arm 71 is inserted into the substrate processing module 61 .

[0057] like Figure 4 and Figure 5 As shown, the substrate processing module 61 includes a processing chamber 112, including a side wall portion 113 constituting the inner side of the processing chamber 112. A stage 63a (63b) as a substrate support portion is provided at the lower part of the processing chamber 112. A plate member 110 for, for example, gas supply is arranged above the stage 63a (63b). In the processing space U surrounded by the stage 63a (63b), the plate member 110, and the side wall portion 113, a COR process, for example, is performed on the wafer W.

[0058] When the transfer arm 71 is aligned, first, the transfer module 60 and the substrate processing module 61 are set in a reduced pressure atmosphere. At this time, a processing gas for COR processing, for example, may be supplied to the processing space U.

[0059] Next, the transport arm 71 is moved in the X-axis direction (left-right direction in the figure) to move the position of the sensor 100, and as shown in FIG. Figure 6 The arrows in the figure indicate that the sensor 100 is rotated in the YZ direction (Z radial direction) while performing laser scanning. Thus, the distances between the sensor 100 and the stage 63a (63b), the plate member 110, and the side wall portion 113 are measured, and the outer shapes of each member are measured.

[0060] Then, the conveying arm 71 is aligned based on the measured data. The alignment is effective for any taught position, for example, the optimal position coordinates of the conveying arm 71 are calculated for the processing space U in which the wafer W is to be processed as desired. Specifically, the correction position on the XY plane is calculated based on the relationship between the center of the stage 63a (63b) in the XY plane and the center of the plate member 110 in the XY plane. In addition, the middle position between the stage and the plate member is calculated as the correction position in the Z-axis direction. Then, based on, for example, the relationship between the center position of the conveying arm 71 and the center position of the held wafer W, the ideal center position coordinates of the wafer W are calculated. The optimal position ( Figure 4 and Figure 5 The position P) in the middle is calculated as the ideal center position of wafer W.

[0061] In this manner, for each of the processing modules such as the substrate processing module 61 and the substrate processing module 62 , for example, the ideal center position coordinates of the wafer W relative to the processing space U are calculated, and the transfer arm 71 is guided.

[0062] The method of positioning the transfer arm 71 described above may be implemented as an automatic teaching method by automatic control. That is, it may be automatically implemented by the control of the control unit 80 provided in the wafer processing apparatus 1 .

[0063] In addition, the above-mentioned alignment method can also be implemented by setting each processing module to the same conditions as the conditions during substrate processing, or can also be implemented by setting each processing module to the conditions different from the conditions during substrate processing. For example, it can also be implemented by opening the chamber of each processing module to the atmosphere during the alignment of the conveying arm 71.

[0064] Alternatively, a substrate support such as a stage 63a (63b) provided in each processing module may be provided with a driving mechanism (not shown) to drive the substrate in the vertical direction ( Figure 4 and Figure 5The substrate support portion is configured to be movable in the Z-axis direction. By moving the substrate support portion, the positional relationship between the plate member 110 and the substrate support portion can be adjusted. The above-mentioned method of aligning the transport arm 71 that can be performed at any position in the three-dimensional space is also effective for such a structure.

[0065] <Function and effect of the technology disclosed herein>

[0066] As described above, in the conveying arm 71 of the wafer conveying mechanism 70 of the wafer processing device 1 of the present embodiment, the distance between the sensor 100 and the stage 63a (63b), the plate member 110, and the side wall portion 113 is measured, and alignment is performed based on the measured data. As a result, the conveying arm 71 can be aligned to any position in the three-dimensional space in the processing chamber of each processing module such as the substrate processing module 61 and the substrate processing module 62. That is, the conveying arm 71 holding the wafer W can be guided to any position in the three-dimensional space in the processing chamber, and the wafer W can be placed at a desired position.

[0067] As in the wafer processing device 1 of the present embodiment, it is common that a plurality of processing modules such as the substrate processing module 61 and the substrate processing module 62 are provided. For each processing module and each chamber, errors associated with the assembly of components and errors in process conditions associated with the mounting of other components are generated. Specifically, the displacement of the height of the stage 63a (63b), the displacement of the height of the plate member 110, the displacement of the center position of the plate member 110, etc. become assembly errors and errors caused by the mounting of other components, which may become the cause of process differences, an increase in the process debugging period, etc. According to the alignment method described in the present embodiment, the conveying arm 71 is aligned at an arbitrary position in the three-dimensional space in the processing chamber of each processing module, so such problems can be solved.

[0068] In addition, the alignment method described in this embodiment can be automatically implemented in a state where the wafer processing apparatus 1 is set to a condition substantially the same as the process condition. That is, there is no need to open the wafer processing apparatus 1 to the atmosphere and have the operator perform the alignment operation, thereby improving the alignment accuracy and improving the efficiency of the operability.

[0069] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The above embodiments may also be omitted, replaced, or changed in various forms without departing from the attached claims and their gist. For example, the constituent elements of the above embodiments may be arbitrarily combined. Of course, the functions and effects of the combined constituent elements may be obtained from the arbitrary combination, and other functions and effects that are obvious to those skilled in the art based on the description of this specification may be obtained.

[0070] In addition, the effects described in this specification are merely for illustrative or exemplary purposes and are not limiting. That is, the technology disclosed in this specification can have other effects that are obvious to those skilled in the art based on the description of this specification together with or in place of the above effects.

[0071] For example, in the above-mentioned embodiment, the wafer processing apparatus 1 is described as having processing modules for performing COR processing, PHT processing, cleaning processing, and positioning processing on the wafer W, and the figure shows a case where two wafers W are arranged in a horizontal direction in the substrate processing module 61 and the substrate processing module 62, but the present invention is not limited thereto. That is, a so-called multi-wafer structure in which three or more wafers W are arranged in a horizontal direction may also be used.

[0072] Description of Reference Numerals

[0073] 1. Wafer processing device; 61. Substrate processing module; 62. Substrate processing module; 63a, 63b, loading table; 66a, 66b, loading table; 71. Transfer arm; 100. Sensor; 110. Plate member; 113. Side wall; U. Processing space; W. Wafer.

Claims

1. A substrate processing device, which is a substrate processing device for processing a substrate, wherein: The substrate processing device comprises: a conveying module that conveys the substrate internally; A conveying arm, which is arranged inside the conveying module and has at least one holding arm for holding the substrate; as well as a processing module connected to the conveying module and having a processing chamber for processing the substrate therein; The processing chamber comprises: a substrate support portion having a support surface for the substrate; a plate member disposed above the substrate support portion; and a side wall portion constituting an inner side of the processing chamber, A processing space surrounded by the substrate support portion, the plate member, and the side wall portion is formed in the processing chamber. The transfer arm includes a sensor, and the transfer arm is positioned based on distances between the transfer arm and the substrate support portion, the plate member, and the side wall portion in the processing space using the sensor.

2. The substrate processing apparatus according to claim 1, wherein: The sensor is configured to be rotatable about an axis in the extending direction of the transfer arm, and is a photoelectric sensor that scans the interior of the processing chamber to measure the distances to the substrate support, the plate member, and the side wall.

3. The substrate processing apparatus according to claim 1 or 2, wherein: The substrate support portion is configured to be movable in a vertical direction inside the processing chamber.

4. A method for aligning a conveyor arm, which is a method for aligning a conveyor arm for conveying a substrate in a substrate processing device, wherein: The substrate processing device comprises: a conveying module that conveys the substrate internally; A conveying arm, which is arranged inside the conveying module and has at least one holding arm for holding the substrate; as well as a processing module connected to the conveying module and having a processing chamber for processing the substrate therein; The processing chamber comprises: a substrate support portion having a support surface for the substrate; a plate member disposed above the substrate support portion; and a side wall portion constituting an inner side of the processing chamber, A processing space surrounded by the substrate support portion, the plate member, and the side wall portion is formed in the processing chamber. The transfer arm includes a sensor, and the transfer arm is positioned based on distances between the transfer arm and the substrate support portion, the plate member, and the side wall portion in the processing space using the sensor.

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