Electronic device including electrostatic discharge path

Abstract

According to various embodiments disclosed herein, an electronic device may include a housing having a first opening. The electronic device may include: a key button at least partially exposed to the outside via a first opening; and a flexible printed circuit board (FPCB), one end of which is attached to the key button and the other end of which is electrically connected to a printed circuit board disposed in the internal space of the housing. The electronic device may include a key structure having a second opening and supporting at least a portion of a key button assembly including a key button and a flexible circuit board in an internal space of the housing. The electronic device may include a conductive plate disposed on the key structure to block a second opening in the key structure. The electronic device may include a support member having a key structure received therein. A flexible circuit board in the electronic device may extend from the first opening so as to pass between the key structure and the conductive plate via the second opening. At least a portion of a conductive plate in the electronic device may be electrically connected to a ground of a printed circuit board inside the electronic device connected to the support member via at least a portion of the flexible circuit board. In addition to the embodiments disclosed herein, various embodiments are possible.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to electronic devices including electrostatic discharge paths. Background Art

[0002] The electronic device may include one or more keys and sensors. For example, one or more keys (e.g., a volume control key and / or a power key) and a sensor (e.g., a fingerprint sensor) may be disposed on a side surface of a housing of the electronic device. A gap may be formed between the side surface of the housing of the electronic device and the one or more keys and sensors disposed on the side surface. An electrostatic discharge (ESD) phenomenon may occur through the gap, in which charges accumulated on the surface of the electronic device are instantly moved to electronic components disposed inside the electronic device. Summary of the invention

[0003] Technical issues

[0004] When the ESD phenomenon occurs, electronic components provided inside the electronic device may be damaged, and thus, the electronic device may not operate normally or may deteriorate in performance.

[0005] The electronic device according to the embodiment of the present disclosure may be provided with an ESD path configured to allow charges accumulated on the surface of the electronic device to move to the ground via a connection between at least one conductive member provided inside the electronic device and the ground.

[0006] Solution to the problem

[0007] An electronic device according to an embodiment of the present disclosure may include a housing including a first opening. The electronic device may include: a key button, arranged to be at least partially exposed to the outside through the first opening; and a flexible circuit board (FPCB), including one end attached to the key button and the other end electrically connected to a printed circuit board arranged in the internal space of the housing. The electronic device may include a key structure, which is configured to support at least a portion of a key button assembly including a key button and a flexible circuit board in the internal space of the housing, wherein the key structure includes a second opening. The electronic device may include a conductive plate arranged on the key structure to close the second opening included in the key structure. The electronic device may include a supporting member in which the key structure is accommodated. The flexible circuit board included in the electronic device may extend between the key structure and the conductive plate from the first opening through the second opening. At least a portion of the conductive plate included in the electronic device may be electrically connected to a ground inside the electronic device via at least a portion of the area of ​​the flexible circuit board, and the ground is connected to the supporting member.

[0008] An electronic device according to an embodiment of the present disclosure may include a housing including an opening. The electronic device may include a sensor circuit configured to be at least partially exposed to the outside through the opening, the sensor circuit including a first conductive pattern. The electronic device may include a flexible printed circuit board (FPCB), the flexible printed circuit board including an end attached to the sensor circuit and another end electrically connected to a printed circuit board disposed in an internal space of the housing. The flexible printed circuit board included in the electronic device may be electrically connected to the first conductive pattern. The flexible printed circuit board included in the electronic device may include a second conductive pattern electrically connected to the ground of the printed circuit board.

[0009] An electronic device according to an embodiment of the present disclosure may include a housing including a first opening. The electronic device may include: a sensor circuit, which is arranged to be at least partially exposed to the outside through the first opening and includes a first conductive pattern; and a flexible circuit board (FPCB), including one end attached to the sensor circuit and the other end electrically connected to a printed circuit board arranged in the internal space of the housing. The electronic device may include a key structure, which is configured to support at least a portion of a key button assembly in the internal space of the housing and includes a second opening. The electronic device may include a conductive plate arranged on the key structure to close the second opening included in the key structure. The electronic device may include a supporting member in which the key structure is accommodated. At least a portion of the conductive plate included in the electronic device may be electrically connected to a ground inside the electronic device via at least a partial area of ​​the flexible circuit board, which is connected to the supporting member. The flexible circuit board included in the electronic device may extend between the key structure and the conductive plate from the first opening through the second opening. The flexible circuit board included in the electronic device may include a second conductive pattern electrically connected to the first conductive pattern and the ground of the printed circuit board.

[0010] Advantageous Effects of the Invention

[0011] The electronic device according to the embodiment of the present disclosure is provided with an ESD path, which is configured to allow the charges accumulated on the surface of the electronic device to be transferred to the ground via a connection between at least one conductive member provided inside the electronic device and the ground. Therefore, it is possible to prevent the electronic components provided in the internal space of the electronic device from being damaged. Therefore, the performance of the electronic device can also be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a block diagram of an electronic device according to an embodiment of the present disclosure in a network environment.

[0013] Figure 2a is a front perspective view of an electronic device according to an embodiment of the present disclosure.

[0014] Figure 2b According to the embodiments of the present disclosure Figure 2a A rear perspective view of an electronic device.

[0015] Figure 3 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0016] Figure 4 According to the embodiment of the present disclosure, Figure 2a A cross-sectional view taken along line AA'.

[0017] Figure 5a is a view showing a state in which a conductive plate is provided inside an electronic device according to an embodiment of the present disclosure.

[0018] Figure 5b Shown are views of a conductive plate and enlarged views of at least a portion of a conductive plate according to an embodiment of the present disclosure.

[0019] Figure 6a According to the embodiment of the present disclosure, Figure 5b A cross-sectional view taken along line BB'.

[0020] Figure 6b The embodiment according to the present disclosure is shown in FIG. Figure 6a A view of an example of the shape of a portion designated by reference numeral 630.

[0021] Figure 7a is a view showing a conductive pattern provided in a sensor circuit according to an embodiment of the present disclosure.

[0022] Figure 7b is a view showing a conductive pattern provided in a flexible circuit board according to an embodiment of the present disclosure.

[0023] Figure 7c is a view showing a state in which a sensor circuit and a flexible circuit board overlap each other according to an embodiment of the present disclosure.

[0024] Figure 8a is a view showing a key button assembly according to an embodiment of the present disclosure.

[0025] Figure 8b According to the embodiment of the present disclosure, Figure 8a A cross-sectional view taken along line CC'. DETAILED DESCRIPTION

[0026] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0027] Reference Figure 1, the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (eg, display module 160).

[0028] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent or combined with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0029] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0030] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0031] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0032] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0033] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0034] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0035] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0036] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. Depending on the embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0037] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0038] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0039] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0040] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0041] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0042] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0043] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0044] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). Depending on the embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0045] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.

[0046] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0047] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0048] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the function or service requested, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request in the case of further processing the result or without further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0049] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0050] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., the second element)”, “combined to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” when the terms “operably” or “communicatively” are used or when the terms “operably” or “communicatively” are not used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0051] As used in connection with various embodiments of the present disclosure, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, depending on the embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0052] The various embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0053] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be published in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be published online (e.g., downloaded or uploaded) via an application store (e.g., Play StoreTM), or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a manufacturer's server, an application store's server, or a memory of a forwarding server).

[0054] According to various embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities, and some entities in the multiple entities may be detachably arranged in different components. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

[0055] Figure 2a is a perspective view showing a front surface of an electronic device according to an embodiment of the present disclosure. Figure 2b The present invention is shown in the embodiment of the present invention. Figure 2a A perspective view of the rear surface of the electronic device shown in FIG.

[0056] Figure 2a and Figure 2b The electronic device 200 may be at least partially similar to Figure 1 The electronic device 101 may also include other implementations of the electronic device.

[0057] refer to Figure 2a and Figure 2b, the electronic device 200 may include a housing 210, the housing 210 including a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a side surface 210C surrounding a space between the first surface 210A and the second surface 210B. The housing 210 may refer to a structure forming a portion of the first surface 210A, the second surface 210B, and the side surface 210C. The first surface 210A may be formed by a front surface plate 202 (e.g., a glass plate or a polymer plate coated with various coatings) at least a portion of which is substantially transparent. The second surface 210B may be formed by a substantially opaque rear surface plate 211. The rear surface plate 211 may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium) or any combination thereof. The side surface 210C may be formed by a side frame structure (or "side member") 218 ​​that is combined with the front surface plate 202 and the rear surface plate 211 and includes metal and / or polymer. The rear surface plate 211 and the side frame structure 218 may be integrally formed and may be formed of the same material (eg, a metal material such as aluminum).

[0058] The front surface plate 202 may include two first areas 210D that are respectively arranged at the long sides of the front surface plate 202 and are seamlessly bent and extended from the first surface 210A toward the rear surface plate 211. Similarly, the rear surface plate 211 may include two second areas 210E that are respectively arranged at the long sides of the rear surface plate 211 and are seamlessly bent and extended from the second surface 210B toward the front surface plate 202. The front surface plate 202 (or the rear surface plate 211) may include only one of the first areas 210D (or the second areas 210E). The first area 210D or the second area 210E may be partially omitted. When observed from the side wall of the electronic device 200, the side frame structure 218 may have a first thickness (or width) on the side wall that does not include the first area 210D or the second area 210E, and may have a second thickness less than the first thickness on the other side wall that includes the first area 210D or the second area 210E.

[0059] The electronic device 200 may include at least one of the following items: a display 201 (eg, Figure 1 display module 160), input device 203 (for example, Figure 1 input module 150), one or more sound output devices 207 and 214 (e.g., Figure 1 sound output module 155), one or more sensor modules 204 and 219 (e.g., Figure 1 sensor module 176), one or more camera modules 205, 212 and 213 (e.g., Figure 1 camera module 180), key input device 217, indicator, connector hole 208 (eg, Figure 1 The electronic device 200 may omit at least one of the above components (eg, the key input device 217 or the indicator), or may further include other components.

[0060] For example, the display 201 may be exposed through a large portion of the front surface plate 202. At least a portion of the display 201 may be exposed through the front surface plate 202 of the first region 210D forming the first surface 210A and the side surface 210C. The display 201 may be combined with or adjacent to a touch sensing circuit, a pressure sensor capable of measuring touch strength (pressure), and / or a digitizer for detecting a stylus. At least a portion of the sensor modules 204 and 219 and / or at least a portion of the key input device 217 may be disposed in the first region 210D and / or the second region 210E.

[0061] The input device 203 may include a microphone. In some embodiments, the input device 203 may include a plurality of microphones arranged to sense the direction of sound. The sound output devices 207 and 214 may include a speaker. The speaker may include an external speaker 207 and a receiver 214 for calls. In some embodiments, the microphone, the speaker, and the connector hole 208 are arranged in the space of the electronic device 200 and may be exposed to the external environment through at least one hole formed in the housing 210. The hole formed in the housing 210 may be used for both the microphone and the speaker. The sound output devices 207 and 214 may include a speaker (e.g., a piezoelectric speaker) that works while not including the hole formed in the housing 210.

[0062] The sensor modules 204 and 219 may generate electrical signals or data corresponding to the internal operating state or external environmental conditions of the electronic device 200. The sensor modules 204 and 219 may include a first sensor module 204 (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on the first surface 210A of the housing 210 and / or a third sensor module 219 (e.g., a heart rate monitor (HRM) sensor) disposed on the second surface 210B of the housing 210. The fingerprint sensor may be disposed on the first surface 210A of the housing 210. The fingerprint sensor (e.g., an ultrasonic fingerprint sensor or an optical fingerprint sensor) may be disposed below the display 201 of the first surface 210A. The fingerprint sensor may be disposed on the second surface 210B of the housing 210 as well as the first surface 210A (e.g., the display 201). The electronic device 200 may further include at least one of a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, and an illumination sensor.

[0063] The camera modules 205, 212, and 213 may include a first camera device (e.g., camera module 205) disposed on a first surface 210A of the electronic device 200, and a second camera device (e.g., camera module 212) and / or a flash (e.g., camera module 213) disposed on a second surface 210B. The camera module 205 or the camera module 212 may include one or more lenses, an image sensor, and / or an image signal processor. The flash (e.g., camera module 213) may include, for example, a light emitting diode or a xenon lamp. Two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and an image sensor may be disposed on one side of the electronic device 200.

[0064] The key input device 217 may be provided on the side surface 210C of the housing 210. The electronic device 200 may not include some or all of the above-mentioned key input devices 217, and the key input device 217 not included may be implemented in another form (such as a soft key on the display 201). The key input device 217 may include a sensor module provided on the second surface 210B of the housing 210. In another embodiment, the key input device 217 may be implemented using a pressure sensor included in the display 201.

[0065] The indicator may be provided on the first surface 210A of the housing 210. For example, the indicator may provide status information of the electronic device 200 in an optical form. The indicator may provide a light source related to the operation of the camera module 205. The indicator may include, for example, a light emitting diode (LED), an infrared (IR) LED, or a xenon lamp.

[0066] The connector hole 208 may include a first connector hole suitable for a connector (e.g., a universal serial bus (USB) connector or an interface connector port module) for transmitting power and / or data to and receiving power and / or data from an external electronic device. The connector hole 208 may include a second connector hole suitable for a connector (e.g., a headphone jack) for transmitting and receiving audio signals to and from an external electronic device.

[0067] Some of the camera modules 205 and 212, some of the sensor modules 204 and 219, or indicators may be arranged to be exposed through the display 201. For example, the camera module 205, the sensor module 204, or the indicator may be arranged in the internal space of the electronic device 200 so as to contact the external environment through the opening of the display 201 that is perforated upward to the front surface plate 202. The area of ​​the display 201 facing the camera module 205 may be formed as a transparent area with a specified transmittance as part of the area where the content is displayed. The transmission area may have a transmittance in the range of from about 5% to about 20%. Such a transmission area may include an area overlapping with the effective area (e.g., the viewing angle area) of the camera module 205, through which light for generating an image by the image sensor passes. The transparent area of ​​the display 201 may include an area having a lower pixel density or wiring density or both than the surrounding area. The transmission area may replace the opening. The camera module 205 may include an under-screen camera (UDC). The sensor module 204 may be arranged to perform functions in the internal space of the electronic device 200 without being visually exposed through the display 201. For example, in this case, the area of ​​the display 201 facing the sensor module may not require a perforated opening.

[0068] Figure 3 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0069] Figure 3 The electronic device 300 shown in FIG. 1 may be at least partially similar to Figure 1 The electronic device 100 or Figure 2a and Figure 2b The electronic device 200 may also include another implementation of the electronic device.

[0070] refer to Figure 3 , the electronic device 300 may include a side member 310 (e.g., a side frame structure), a first support member 311 (e.g., a bracket), a front plate 320 (e.g., a front cover), a display 330, a printed circuit board (PCB) 340, a battery 350, a second support member 360 (e.g., a rear shell), an antenna 370, and a rear plate 380 (e.g., a rear cover). The electronic device 300 may omit at least one of the above components (e.g., the first support member 311 or the second support member 360), or may further include another component. Some components of the electronic device 300 may be different from those of the electronic device 300. Figure 2a or Figure 2b The components of the electronic device 200 shown in FIG. 1 are the same or similar, and therefore, description thereof is omitted below.

[0071] The first support member 311 is disposed inside the electronic device 300 and may be connected to or integrated with the side member 310. The first support member 311 may be formed of, for example, a metal material and / or a non-metallic (e.g., polymer) material. The first support member 311 may be combined with the display 330 at one side thereof and may also be combined with the PCB 340 at the other side thereof. On the PCB 340, a processor (e.g., Figure 1 processor 120), memory (e.g., Figure 1 Memory 130) and / or interfaces (e.g., Figure 1 interface 177).

[0072] The processor may include, for example, one or more of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP).

[0073] The memory may include, for example, volatile memory (e.g., Figure 1 volatile memory 132 and non-volatile memory (e.g., Figure 1 One or more of the non-volatile memory 134).

[0074] The interface may include, for example, a high-definition multimedia interface (HDMI), a USB interface, a secure digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card / multimedia card (MMC) connector, or an audio connector.

[0075] The battery 350 is a device for supplying power to at least one component of the electronic device 300, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 350 may be disposed on substantially the same plane as the PCB 340. The battery 350 may be integrally disposed within the electronic device 300, and may be detachably disposed from the electronic device 300.

[0076] The antenna 370 may be disposed between the back plate 380 and the battery 350. The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna 370 may perform short-range communication with an external device, or transmit and receive power required for wireless charging. The antenna structure may be formed by part or a combination of the side member 310 and / or the first support member 311.

[0077] Figure 4 According to the embodiment of the present disclosure, Figure 2aA cross-sectional view taken along line AA'.

[0078] refer to Figure 4 , the electronic device 400 (eg, Figure 1 electronic device 101, Figure 2a and Figure 2b The electronic device 200 or Figure 3 The electronic device 300 may include a housing (eg, Figure 2a and Figure 2b In an embodiment, the housing 210 may include a front surface plate (eg, Figure 2a A front surface plate 202 facing a second direction (eg, −z-axis direction) opposite to the first direction, and a rear surface plate (eg, Figure 2b The rear surface plate 211 of the front surface plate 202 and the side surface member (e.g., the rear surface plate 211) facing a third direction (e.g., ±x-axis directions) perpendicular to each of the first direction and the second direction and surrounding at least a portion of the space between the front surface plate 202 and the rear surface plate 211 Figure 2a and Figure 2b side member 218 in the figure).

[0079] In an implementation, the key button assembly 410 may include at least one of the following elements: a key button 411 , a solder 413 , a flexible printed circuit board (FPCB) 415 , and a dome switch 417 .

[0080] In an embodiment, the key button assembly 410 may be disposed on at least a portion of the side member 218. In an embodiment, the first opening 401 may be disposed (e.g., formed) in a partial area of ​​the side member 218 to expose a partial surface of the key button assembly 410 (e.g., the key button 411) to the outside.

[0081] In an implementation, the solder 413 may electrically connect the key button 411 and the flexible circuit board 415 to each other.

[0082] In an embodiment, the flexible circuit board 415 may be configured to connect the key button assembly 410 to a printed circuit board (eg, Figure 3 For example, one end of the flexible circuit board 415 may be electrically connected to the solder 413 (or the key button 411), and the other end may be electrically connected to the printed circuit board 340.

[0083] In an embodiment, the other end of the flexible circuit board 415 may be provided with a connector (eg, Figure 5b The connector 520 of FIG. 51 is provided, and may be connected to a printed circuit board (PCB) 340 via the connector 520. However, the present disclosure is not limited thereto.

[0084] Therefore, the electronic device is provided with an ESD path configured to allow charges accumulated on the surface of the electronic device (ie, the key button 411 ) to be transferred to the drain via the flexible circuit board 415 .

[0085] In an embodiment, the housing 210 may include a key structure 430 configured to allow the key button assembly 410 to be placed between the side member 218 and the support member (e.g., Figure 3 The key structure 430 may include a key bracket 431 and / or a front dummy 435 configured to support the key button assembly 410 so that it can be operated. The key bracket 431 may be accommodated in a portion of the supporting member 311 to support the movement of the key button 411 in a specific direction (e.g., ±x-axis direction). The front dummy 435 may be a protective member configured to protect the key button assembly 410 accommodated in a portion of the housing 210 (e.g., the first opening 401). In an embodiment, the key bracket 431 may be made of a polycarbonate (PC) material.

[0086] In an embodiment, the key bracket 431 may be fixed to the side member 218 via the first coupling member 441. The front dummy 435 may be fixed to the first supporting member 311 via the second coupling member 443. For example, the first coupling member 441 and the second coupling member 443 may be made of liquid silicone rubber (LSR) for providing shockproof and waterproof protection.

[0087] In an embodiment, the electronic device 400 may include at least one waterproof structure. The waterproof structure may be installed between the support member 311 and the key button assembly 410 to seal the space between the first space 451 in which the key button assembly 410 is located and the second space 453 in which the printed circuit board 340 is located. In an embodiment, the waterproof structure may include a conductive plate 420 and one or more waterproof tapes that spatially isolate the first space 451 and the second space 453 from each other (or close the second opening 403). For example, the one or more waterproof tapes may include a first waterproof tape 421 and a second waterproof tape 423. However, the present disclosure is not limited thereto.

[0088] In an embodiment, the first waterproof tape 421 and the second waterproof tape 423 may be double-sided tapes. In an embodiment, the second waterproof tape 423 may be attached to one surface of the first waterproof tape 421, and the conductive plate 420 may be attached to the other surface of the first waterproof tape 421. The first waterproof tape 421 may be attached to one surface of the second waterproof tape 423, and the key structure 430 (e.g., the key bracket 431 and / or the front dummy piece 435) may be attached to the other surface of the second waterproof tape 423.

[0089] In an embodiment, the conductive plate 420 may be disposed above the first waterproof tape 421 (e.g., in the z-axis direction) to press the first waterproof tape 421 and the second waterproof tape 423 disposed below the conductive plate 420 (e.g., in the -z-axis direction), thereby preventing the first waterproof tape 421 and the second waterproof tape 423 from being lifted. In an embodiment, the conductive plate 420 may include stainless steel (SUS) (e.g., stainless steel (STS)).

[0090] In an embodiment, at least a portion of the flexible circuit board 415 may pass through the space between the first waterproof tape 421 and the second waterproof tape 423, and pass through the space between at least a portion of the conductive plate 420 and the second waterproof tape 423. At least a portion of the flexible circuit board 415 may pass through the space between the first waterproof tape 421 and the second waterproof tape 423, and pass through the space between at least a portion of the conductive plate 420 and the second waterproof tape 423, and then may be electrically connected to the printed circuit board 340.

[0091] In an embodiment, the flexible circuit board 415 may include an insulating layer and a conductive layer (e.g., copper foil) alternately stacked, and the outer surface of the flexible circuit board 415 may be made of the insulating layer. In an embodiment, at least a portion of the insulating layer on the outer surface of the flexible circuit board 415 may be removed. When at least a portion of the insulating layer on the outer surface of the flexible circuit board 415 is removed, at least a portion of the conductive layer disposed under the insulating layer may be exposed to the outside.

[0092] In an embodiment, the tensioning ribs (e.g. Figure 5b The tensioning rib 555 may be disposed (eg, formed) on at least a portion of the conductive plate 420. For example, the tensioning rib 555 may be disposed in at least a portion of the conductive plate 420 in a slit shape.

[0093] In an implementation, when at least a portion of the insulating layer on the outer surface of the flexible circuit board 415 is removed, at least a partial area of ​​the conductive plate 420 may contact at least a portion of the conductive layer exposed to the outside.

[0094] In various embodiments, when at least a portion of the conductive plate 420 contacts at least a portion of the conductive layer exposed to the outside due to removal of the insulating layer on the outer surface of the flexible circuit board 415, the electronic device 400 can be provided with (e.g., formed with) an ESD path so that the charge accumulated (or generated) outside the electronic device 400 (e.g., the charge generated and accumulated on the key button 411) is transferred to the flexible circuit board 415, the area of ​​the flexible circuit board 415 that contacts at least a portion of the conductive plate 420 (e.g., at least a portion of the conductive layer of the flexible circuit board 415 exposed to the outside) and the ground inside the electronic device 400, which is connected to the supporting member 311. However, the present disclosure is not limited to this, and the electronic device 400 can be configured so that the charges accumulated (or generated) outside the electronic device 400 (for example, the charges generated and accumulated on the key button 411) are transferred to the flexible circuit board 415, the area of ​​the flexible circuit board 415 that contacts at least a portion of the conductive plate 420 (for example, at least a portion of the area of ​​the conductive layer of the flexible circuit board 415 exposed to the outside), and the ground of the printed circuit board 340.

[0095] In various embodiments of the present disclosure, by providing a transfer path (eg, an ESD path) for charges accumulated (or generated) outside the electronic device 400 , electronic components provided in the internal space of the electronic device 400 may be prevented from being damaged.

[0096] Despite Figure 4 , but according to various embodiments, the key button assembly 410 may also include a sensor circuit (e.g., Figure 7a sensor circuit 705).

[0097] In an embodiment, the sensor circuit 705 may include a biometric sensor, which may include, for example, a fingerprint sensor. The first opening 401 disposed (e.g., formed) in at least a portion of the side member 218 may expose a sensing surface (e.g., an area configured to sense biometric information (e.g., fingerprint) of the sensor circuit 705 (e.g., biometric sensor) of the key button assembly 410.

[0098] In various embodiments, when the key button assembly 410 further includes the sensor circuit 705, the solder 413 may be a sensor solder. The sensor circuit 705 and the flexible circuit board 415 may be electrically connected to each other via the sensor solder.

[0099] Figure 5a 4 is a view showing a state in which a conductive plate 420 is provided inside an electronic device 400 according to an embodiment of the present disclosure. Figure 5bA view of a conductive plate 420 and an enlarged view of at least a portion of the conductive plate 420 are shown according to an embodiment of the present disclosure.

[0100] refer to Figure 5a , the conductive plate 420 may be fastened to the support member (eg, Figure 3 The first support member 311 in the electronic device (eg, Figure 4 The electronic device 400 may be provided with a surface in the inner space thereof (eg, a surface facing the −z-axis direction). Although two locking devices 515 are shown, the present disclosure is not limited thereto.

[0101] like Figure 4 As shown in FIG. , the conductive plate 420 may be provided on a first waterproof tape (eg, Figure 4 The conductive plate 420 is provided above the first waterproof tape 421 (for example, in the z-axis direction) to press the first waterproof tape 421 and the second waterproof tape (for example, Figure 4 The first and second waterproof tapes 421 and 423 are fixed to one surface of the support member 311 via the pair of locking devices 515. Therefore, the first and second waterproof tapes 421 and 423 can be prevented from being lifted via the conductive plate 420 and the pair of locking devices 515.

[0102] In accordance with various embodiments Figure 5a In the present invention, the electric charge accumulated (or generated) outside the electronic device 400 (for example, the electric charge generated and accumulated on the key button 411) can be transferred to the ground inside the electronic device 400 via the flexible circuit board 415, the area of ​​the flexible circuit board 415 that contacts a surface (for example, the surface facing the z-axis direction) of the tensioning rib 555 of the conductive plate 420 (for example, at least a portion of the conductive layer of the flexible circuit board 415 exposed to the outside), the paired locking devices 515 and the supporting member 311.

[0103] refer to Figure 5b

[510] , the tensioning rib 555 may be provided (e.g., formed) on at least a portion of the conductive plate 420. For example, the tensioning rib 555 may be provided in a slit shape in at least a portion of the conductive plate 420. In an embodiment, when the conductive plate 420 is fixed by being fastened to the supporting member 311 via a pair of locking devices 515, the tensioning rib 555 provided in at least a portion of the conductive plate 420 in a slit shape may elastically contact with at least a partial area 560 of the flexible circuit board 415 (e.g., at least a partial area of ​​the conductive layer of the flexible circuit board 415 exposed to the outside).

[0104] In an embodiment, Figure 5b

[570] shows that when the insulating layer on the outer surface of the flexible circuit board 415 is removed, at least a portion of the conductive layer of the flexible circuit board 415 is exposed to the outside. In an embodiment, the tensioning rib 555 provided in at least a portion of the conductive plate 420 can be elastically in contact with at least a portion of the conductive layer 560 of the flexible circuit board 415 exposed to the outside.

[0105] Figure 6a According to the embodiment of the present disclosure, Figure 5b A cross-sectional view taken along line BB'.

[0106] refer to Figure 6a , electronic devices (e.g. Figure 4 The electronic device 400 may include a support member (eg, Figure 3 The first support member 311) and the key button assembly (eg, Figure 4 The waterproof structure may include a conductive plate 420, a first waterproof tape 421, and a second waterproof tape 423, which separate a first space 451 in which the key button assembly 410 is positioned and a printed circuit board (e.g., Figure 3 The second spaces 453 of the printed circuit board 340 are spatially isolated from each other (or the second openings (eg, Figure 4 The second opening 403 in the embodiment of the present invention is shown in FIG.

[0107] In an embodiment, the second waterproof tape 423 may be attached to one surface of the first waterproof tape 421 (e.g., the surface facing the z-axis direction), and the conductive plate 420 may be attached to the other surface (e.g., the surface facing the -z-axis direction). The first waterproof tape 421 may be attached to one surface of the second waterproof tape 423 (e.g., the surface facing the -z-axis direction), and the key structure 430 (e.g., the key bracket 431 and / or the front dummy piece 435) may be attached to the other surface (e.g., the surface facing the z-axis direction).

[0108] In an embodiment, at least a portion of the flexible circuit board 415 can pass through the space between the first waterproof tape 421 and the second waterproof tape 423, and through the space between a surface 610 (e.g., a surface facing the z-axis direction) of the tensioning rib 555 of the conductive plate 420 and the second waterproof tape 423, and can then be electrically connected to the printed circuit board 340.

[0109] In an embodiment, the tensioning rib 555 may be provided in a slit shape in a partial region of the conductive plate 420. One surface 610 (e.g., a surface facing the z-axis direction) of the tensioning rib 555 in the conductive plate 420 may have a step lower than one surface (e.g., a surface facing the z-axis direction) of the conductive plate 420 on which the tensioning rib 555 is not provided. For example, one surface 610 (e.g., a surface facing the z-axis direction) of the tensioning rib 555 and one surface (e.g., a surface facing the z-axis direction) of the conductive plate 420 on which the tensioning rib 555 is not provided may have a predetermined length difference 620 (e.g., about 0.1 mm).

[0110] In an embodiment, since one surface 610 of the tensioning rib 555 (e.g., the surface facing the z-axis direction) may have a step lower than one surface of the conductive plate 420 on which the tensioning rib 555 is not provided (e.g., the surface facing the z-axis direction), and one surface 610 of the tensioning rib 555 is in elastic contact with at least a portion of the flexible circuit board 415 (e.g., at least a portion of the conductive layer of the flexible circuit board 415 exposed to the outside), electrical contact between one surface 610 of the tensioning rib 555 and at least a portion of the conductive layer of the flexible circuit board 415 exposed to the outside may be maintained.

[0111] Figure 6b The embodiment according to the present disclosure is shown in FIG. Figure 6a A view of an example of the shape of a portion designated by reference numeral 630.

[0112] refer to Figure 6b , at least a portion of the conductive plate 420 and the flexible circuit board 415 (eg, at least a portion of the conductive layer of the flexible circuit board 415 exposed to the outside) (eg, Figure 5b The area of ​​the conductive plate 420 that is in electrical contact with at least a portion of the area 560 of the flexible circuit board 415 (e.g., at least a portion of the area of ​​the conductive layer of the flexible circuit board 415 exposed to the outside) can have various shapes. For example, as shown in reference numeral

[650] , the area of ​​the conductive plate 420 that is in electrical contact with at least a portion of the area 560 of the flexible circuit board 415 (e.g., at least a portion of the area of ​​the conductive layer of the flexible circuit board 415 exposed to the outside) can be implemented in an inverted triangle shape 651. As another example, as shown in reference numeral

[660] , the area of ​​the conductive plate 420 that is in electrical contact with at least a portion of the area 560 of the flexible circuit board 415 (e.g., at least a portion of the area of ​​the conductive layer of the flexible circuit board 415 exposed to the outside) can be implemented in a shape with rounded corners. As another example, as shown in reference numeral

[670] , the area of ​​the conductive plate 420 that is in electrical contact with at least a portion of the area 560 of the flexible circuit board 415 (e.g., at least a portion of the area of ​​the conductive layer of the flexible circuit board 415 exposed to the outside) can be implemented in an inverted trapezoidal shape 671.

[0113] Figure 7a is a view showing a conductive pattern 720 provided (eg, formed) in a sensor circuit 705 according to an embodiment of the present disclosure.

[0114] As mentioned above Figure 4 As described, the key button assembly (e.g., Figure 4 The key button assembly 410) may also include a sensor circuit 705.

[0115] refer to Figure 7a , the sensor circuit 705 may include a plurality of terminals 710 and a first conductive pattern 720. The plurality of terminals 710 and the first conductive pattern 720 may be disposed on one surface of the sensor circuit 705, for example, on a surface facing the -x axis direction. The first conductive pattern 720 may be disposed inside the sensor circuit 705 in the form of surrounding the outer periphery of the sensor circuit 705. For example, an insulating layer and a conductive layer (e.g., copper foil) may be applied (or attached) to one surface (or both surfaces) of the sensor circuit 705, and the outer surface of the sensor circuit 705 may be provided by the insulating layer. When the insulating layer disposed on the outer surface of the sensor circuit 705 is removed in the form of surrounding the outside of the sensor circuit 705 (e.g., in the form of surrounding the plurality of terminals 710), and at least a portion of the conductive layer disposed under the insulating layer is exposed, the first conductive pattern 720 may be disposed.

[0116] Figure 7b is a view showing a conductive pattern 740 provided on a flexible circuit board 415 according to an embodiment of the present disclosure.

[0117] refer to Figure 7b , the sensor circuit 705 is positioned on one surface of the flexible circuit board 415 (eg, the surface facing the x-axis direction), and the dome switch 417 may be positioned on the other surface of the flexible circuit board 415 (eg, the surface facing the −x-axis direction).

[0118] In an embodiment, the flexible circuit board 415 may include a plurality of terminals 730 and / or a second conductive pattern 740. The plurality of terminals 730 and the second conductive pattern 740 may be disposed (e.g., formed) on one surface (e.g., a surface facing the -x-axis direction) of the flexible circuit board 415. The second conductive pattern 740 may be disposed inside the flexible circuit board 415 to surround the plurality of terminals 730 of the flexible circuit board 415. For example, an insulating layer and a conductive layer (e.g., copper foil) may be applied (or attached) to one surface (or both surfaces) of the flexible circuit board 415, and the outer surface of the flexible circuit board 415 may be provided by the insulating layer. The second conductive pattern 740 may be disposed by removing the insulating layer disposed on the outer surface of the flexible circuit board 415 in a form surrounding the plurality of terminals 730 to expose at least a portion of the conductive layer disposed under the insulating layer.

[0119] Figure 7c is a view showing a state in which the sensor circuit 705 and the flexible printed circuit 415 overlap each other according to an embodiment of the present disclosure.

[0120] refer to Figure 7c In an embodiment, the sensor circuit 705 and the flexible circuit board 415 may be combined with each other. For example, when the sensor circuit 705 and the flexible circuit board 415 are combined with each other, the plurality of terminals 710 of the sensor circuit 705 and the plurality of terminals 730 of the flexible circuit board 415 may be in electrical contact with each other. For example, the plurality of terminals 710 provided on one surface of the sensor circuit 705 (e.g., the surface facing the -x-axis direction) and the plurality of terminals 730 provided on one surface of the flexible circuit board 415 (e.g., the surface facing the x-axis direction) may be in electrical contact with each other. In an embodiment, since the sensor circuit 705 operates as a physical key button, it may be necessary to maintain flatness, and by combining the sensor circuit 705 and the flexible circuit board 415 with each other, the flatness of the sensor circuit 705 and the flatness of the flexible circuit board 415 may be matched.

[0121] In an embodiment, the first conductive pattern 720 of the sensor circuit 705 and the second conductive pattern 740 of the flexible circuit board 415 may be electrically connected to each other via a conductive adhesive (e.g., a conductive liquid material). After matching the flatness of the sensor circuit 705 with the flatness of the flexible circuit board 415, the conductive adhesive (e.g., a conductive liquid material) may be injected into the space 750 between the sensor circuit 705 and the flexible circuit board 415. By injecting the conductive adhesive (e.g., a conductive liquid material) into the space 750 between the sensor circuit 705 and the flexible circuit board 415, the raised space between the sensor circuit 705 and the flexible circuit board 415 may be filled with the conductive adhesive. Therefore, the first conductive pattern 720 of the sensor circuit 705 and the second conductive pattern 740 of the flexible circuit board 415 may be electrically connected to each other via the conductive adhesive (e.g., a conductive liquid material).

[0122] In an embodiment, the conductive adhesive may include silver epoxy. In an embodiment, the conductive adhesive may be cured by a thermal curing method or an ultraviolet curing method.

[0123] Figure 8a is a view showing a key button assembly 410 according to an embodiment of the present disclosure. Figure 8b According to the embodiment of the present disclosure, Figure 8a A cross-sectional view taken along line CC'.

[0124] refer to Figure 8a and Figure 8b , key button components (e.g., Figure 4 The key button assembly 410 may include a sensor circuit 705, a flexible circuit board 415, and optionally also a dome switch 417.

[0125] In an embodiment, the sensor circuit 705 and the flexible circuit board 415 may be electrically connected to each other through the sensor solder 725. For example, the sensor circuit 705 and the flexible circuit board 415 may be electrically connected to each other by making a plurality of terminals (e.g., Figure 7a The plurality of terminals 710 in the flexible circuit board 415 and the plurality of terminals (eg, Figure 7b In an embodiment, the sensor circuit 705 may be disposed on one region or one surface (e.g., a surface facing the x-axis direction) of the flexible circuit board 415, and the dome switch 417 may be disposed on another region or another surface (e.g., a surface facing the -x-axis direction) of the flexible circuit board 415.

[0126] In an embodiment, the first conductive pattern (eg, Figure 7aThe first conductive pattern 720 of the flexible circuit board 415 and the second conductive pattern (eg, Figure 7b The first conductive pattern 720 of the sensor circuit 705 and the second conductive pattern 740 of the flexible circuit board 415 can be electrically connected to each other via a conductive adhesive 805 (e.g., a conductive liquid material). The first conductive pattern 720 of the sensor circuit 705 and the second conductive pattern 740 of the flexible circuit board 415 can be electrically connected to each other via the conductive adhesive 805, and the flexible circuit board 415 can be electrically connected to a printed circuit board (e.g., Figure 3 The ground of the printed circuit board 340).

[0127] In accordance with various embodiments Figures 7a to 8b In the electronic device 400, an ESD path may be provided (e.g., formed) so that charges accumulated (or generated) outside the electronic device 400 (e.g., charges generated and accumulated on the key button 411) are transferred to the ground of the first conductive pattern 720, the second conductive pattern 740, and the printed circuit board 340.

[0128] In various embodiments, when applying the above according to Figures 4 to 6b Implementation and basis Figures 7a to 8b In both embodiments, the electronic device 400 can be provided with (for example, formed with) a first ESD path and a second ESD path, the first ESD path being configured such that charges accumulated (or generated) outside the electronic device 400 (for example, charges generated and accumulated on the key button 411) are transferred to the flexible circuit board 415, an area of ​​the flexible circuit board 415 that contacts a surface (for example, a surface facing the z-axis direction) of the tensioning ribs 555 of the conductive plate 420 (for example, at least a portion of the conductive layer of the flexible circuit board 415 exposed to the outside) and a ground inside the electronic device 400 connected to the support member 311 (and / or a ground of the printed circuit board 340), and the second ESD path being configured such that the charges are transferred to the first conductive pattern 720, the second conductive pattern 740 and the ground of the printed circuit board 340.

[0129] The electronic device 101, 200, 300 or 400 according to an embodiment of the present disclosure includes a housing 210 including a first opening 401. The electronic device 101, 200, 300 or 400 includes a key button 411 disposed to be at least partially exposed to the outside through the first opening 401, and a flexible circuit board (FPCB) 415 including one end attached to the key button 411 and the other end electrically connected to a printed circuit board 340 disposed in an internal space of the housing 210. The electronic device 101, 200, 300 or 400 includes a key structure 430 configured to support at least a portion of a key button assembly 410 including the key button 411 and the flexible circuit board 415 in the internal space of the housing 210, and the key structure 430 may include a second opening 403. The electronic device 101, 200, 300 or 400 includes a conductive plate 420 disposed on a key structure 430 to close a second opening 403 included in the key structure 430. The electronic device 101, 200, 300 or 400 includes a support member 311 in which the key structure 430 is accommodated. A flexible circuit board 415 included in the electronic device 101, 200, 300 or 400 extends between the key structure 430 and the conductive plate 420 from the first opening 401 through the second opening 403. At least a portion of the conductive plate 420 included in the electronic device 101, 200, 300 or 400 is electrically connected to a ground inside the electronic device 101, 200, 300 or 400 via at least a partial area 560 of the flexible circuit board 415, and the ground is connected to the support member 311.

[0130] In an implementation, the tension rib 555 may be disposed on at least a portion of the conductive plate 420 .

[0131] In an implementation, the tension rib 555 may be provided in at least a portion of the conductive plate 420 in a slit shape.

[0132] In an implementation, one surface 610 of the tension rib 555 in the conductive plate 420 may have a step lower than one surface of the conductive plate 420 on which the tension rib 555 is not disposed.

[0133] In an implementation, insulating layers and conductive layers may be alternately stacked on one surface of the flexible circuit board 415 .

[0134] In an embodiment, the outer surface of the flexible circuit board 415 is provided by an insulating layer.

[0135] In an implementation, at least a portion of an insulating layer disposed on an outer surface of the flexible circuit board 415 may be removed so that at least a partial region 560 of a conductive layer disposed under the insulating layer may be exposed to the outside.

[0136] In an implementation, the tension rib 555 of the conductive plate 420 may be in contact with at least a partial region 560 of the conductive layer of the flexible circuit board 415 that is exposed to the outside.

[0137] In an embodiment, the electronic device 101, 200, 300 or 400 can be provided with an ESD path so that the charge introduced from the outside of the key button 411 is transferred to the ground of the printed circuit board 340 via the flexible circuit board 415 and at least a partial area 560 of the flexible circuit board 415 that contacts a surface of the tensioning rib 555 of the conductive plate 420.

[0138] In an embodiment, the electronic device 101, 200, 300 or 400 can be provided with an ESD path so that the charge introduced from the outside of the key button 411 is transferred to the ground inside the electronic device 400 via the flexible circuit board 415, at least a partial area 560 of the flexible circuit board 415 that contacts a surface of the tensioning rib 555 of the conductive plate 420, and the supporting member 311.

[0139] In an implementation, a region of the conductive plate 420 that electrically contacts at least a partial region 560 of the flexible circuit board 415 may have an inverted triangle shape 651 , a shape 661 with rounded corners, or an inverted trapezoid shape 671 .

[0140] In an embodiment, the electronic device 101 , 200 , 300 , or 400 may further include a first waterproof tape 421 and a second waterproof tape 423 disposed between the key structure 430 and the conductive plate 420 .

[0141] In an implementation, a first waterproof tape 421 and a second waterproof tape 423 may be disposed under the conductive plate 420 .

[0142] In an implementation, the conductive plate 420 may press the first waterproof tape 421 and the second waterproof tape 423 to prevent the first waterproof tape 421 and the second waterproof tape 423 from being lifted.

[0143] In an implementation, the conductive plate 420 may be fixed to one surface of the support member 311 disposed in the internal space of the electronic device 400 via a locking device 515 .

[0144] In an implementation, the key button assembly 410 may also include a sensor circuit 705 .

[0145] The electronic device 101, 200, 300 or 400 according to an embodiment of the present disclosure includes a housing 210 including an opening 401. The electronic device 101, 200, 300 or 400 includes a sensor circuit 705 provided to be at least partially exposed to the outside through the opening 401 and including a first conductive pattern 720, and a flexible printed circuit board (FPCB) 415 including one end attached to the sensor circuit 705 and the other end electrically connected to a printed circuit board 340 provided in an internal space of the housing 210. The flexible printed circuit board 415 included in the electronic device 101, 200, 300 or 400 includes a second conductive pattern 740 electrically connected to the first conductive pattern 720 and electrically connected to a ground of the printed circuit board 340.

[0146] In an implementation, the first conductive pattern 720 may be provided inside the sensor circuit 705 in a form surrounding the plurality of terminals 710 included in the sensor circuit 705 .

[0147] In an implementation, the second conductive pattern 740 may be disposed inside the flexible circuit board 415 to surround the plurality of terminals 710 included in the flexible circuit board 415 .

[0148] In an implementation, the first conductive pattern 720 and the second conductive pattern 740 may be electrically connected to each other via a conductive adhesive.

[0149] In an embodiment, the conductive adhesive may include silver epoxy.

[0150] In an embodiment, the conductive adhesive may be cured by a thermal curing method or an ultraviolet curing method.

[0151] In an implementation, the electronic device 101 , 200 , 300 or 400 may be provided with an ESD path so that charges introduced from outside the key button 411 are transferred to the ground of the first conductive pattern 720 , the second conductive pattern 740 and the printed circuit board 340 .

[0152] The electronic device 101, 200, 300 or 400 according to an embodiment of the present disclosure includes a housing 210 including a first opening 401. The electronic device 101, 200, 300 or 400 includes a sensor circuit 705 disposed to be at least partially exposed to the outside through the first opening 401 and including a first conductive pattern 720, and a flexible circuit board (FPCB) 415 including one end attached to the sensor circuit 705 and the other end electrically connected to a printed circuit board 340 disposed in the internal space of the housing 210. The electronic device 101, 200, 300 or 400 includes a key structure 430 configured to support at least a portion of a key button assembly 410 in the internal space of the housing 210, and the key structure 430 includes a second opening 403. The electronic device 101, 200, 300 or 400 includes a conductive plate 420 disposed on a key structure 430 to close a second opening 403. The electronic device 101, 200, 300 or 400 includes a support member 311 in which the key structure 430 is accommodated. At least a portion of the conductive plate 420 included in the electronic device 101, 200, 300 or 400 is electrically connected to a ground inside the electronic device 101, 200, 300 or 400 via at least a partial area 560 of a flexible circuit board 415, which is connected to the support member 311. The flexible circuit board 415 included in the electronic device 101, 200, 300 or 400 extends from the first opening 401 through the second opening 403 between the key structure 430 and the conductive plate 420. The flexible circuit board 415 included in the electronic device 101 , 200 , 300 , or 400 includes a second conductive pattern 740 electrically connected to the first conductive pattern 720 and a ground of the printed circuit board 340 .

[0153] The embodiments of the present disclosure disclosed in this specification and the drawings are provided only for presenting specific examples, so as to easily describe the technical features of the embodiments according to the present disclosure and help understand the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Therefore, the scope of the various embodiments of the present disclosure should be interpreted in such a way that, in addition to the embodiments disclosed herein, all changes or modifications derived from the technical ideas of the various embodiments of the present disclosure are included in the scope of the various embodiments of the present disclosure.

Claims

1. An electronic device (101, 200, 300, 400), comprising: A housing (210) comprising a first opening (401); A key button (411) is arranged to be at least partially exposed to the outside through the first opening (401); a flexible circuit board FPCB (415) including one end attached to the key button (411) and the other end electrically connected to a printed circuit board (340) disposed in the internal space of the housing (210); A key structure (430) configured to support at least a portion of a key button assembly (410) including the key button (411) and the flexible circuit board (415) in an internal space of the housing (210), the key structure (430) comprising a second opening (403); A conductive plate (420) disposed on the key structure (430) to close the second opening (403); as well as a support member (311), the key structure (430) being accommodated in the support member (311), wherein the FPCB (415) extends from the first opening (401) through the second opening (403) between the key structure (430) and the conductive plate (420); and At least a portion of the conductive plate (420) is electrically connected to a ground inside the electronic device (101, 200, 300, 400) via at least a partial area (560) of the FPCB (415), and the ground is connected to the supporting member (311).

2. The electronic device according to claim 1, wherein: Tension ribs (555) are disposed in at least a portion of the conductive plate (420).

3. The electronic device according to claim 2, wherein: The tension rib (555) is provided in at least a portion of the conductive plate (420) in a slit shape.

4. The electronic device according to claim 2 or 3, wherein: One surface (610) of the tensioning rib (555) in the conductive plate (420) has a step lower than one surface of the conductive plate (420) on which the tensioning rib (555) is not disposed.

5. The electronic device according to claim 2 or 3, wherein: Insulating layers and conductive layers are alternately stacked on one surface of the FPCB (415), Wherein, the outer surface of the FPCB (415) is provided by the insulating layer, Wherein, at least a partial area of ​​the insulating layer disposed on the outer surface of the FPCB (415) is removed, so that at least a partial area (560) of the conductive layer disposed under the insulating layer is exposed to the outside.

6. The electronic device according to claim 5, wherein: The tensioning rib (555) of the conductive plate (420) contacts at least a portion of the conductive layer (560) of the FPCB (415) that is exposed to the outside.

7. The electronic device according to any one of claims 2 to 6, wherein: An electrostatic discharge (ESD) path is provided so that the charge introduced from the outside of the key button (411) is transferred to the ground of the printed circuit board (340) via the FPCB (415) and at least the partial area (560) of the FPCB (415) in contact with one surface of the tensioning rib (555) of the conductive plate (420), and / or The ESD path is provided so that the electric charge introduced from the outside of the key button (411) is transferred to the ground inside the electronic device (400) via the FPCB (415), at least a partial area (560) of the FPCB (415) in contact with a surface of the tensioning rib (555) of the conductive plate (420), and the supporting member (311).

8. The electronic device according to any one of claims 5 to 7, wherein: The area of ​​the conductive plate (420) that is in electrical contact with at least a partial area (560) of the FPCB (415) has an inverted triangle shape (651), a shape with rounded corners (661), or an inverted trapezoidal shape (671).

9. The electronic device according to any one of claims 1 to 8, further comprising a first waterproof tape (421) and a second waterproof tape (423) provided between the key structure (430) and the conductive plate (420), and in, The first waterproof tape (421) and the second waterproof tape (423) are arranged under the conductive plate (420), and Wherein, the conductive plate (420) is configured to press the first waterproof tape (421) and the second waterproof tape (423) to prevent the first waterproof tape (421) and the second waterproof tape (423) from being lifted.

10. The electronic device according to any one of claims 1 to 9, wherein: The conductive plate (420) is fastened to a surface of the support member (311) disposed in the internal space of the electronic device (400) via a locking device (515).

11. The electronic device according to claim 1, wherein: The key button assembly (410) also includes a sensor circuit (705).

12. The electronic device (101, 200, 300, 400) according to any one of claims 1 to 10, further comprising: A sensor circuit (705) is arranged to be at least partially exposed to the outside through the first opening (401) and includes a first conductive pattern (720); The FPCB (415) includes a second conductive pattern (740) electrically connected to the first conductive pattern (720) and a ground of the printed circuit board (340).

13. The electronic device according to claim 12, wherein: The first conductive pattern (720) is arranged inside the sensor circuit (705) in the form of surrounding a plurality of terminals (710) included in the sensor circuit (705). wherein the second conductive pattern (740) is disposed inside the FPCB (415) in the form of surrounding a plurality of terminals (710) included in the FPCB (415); and Wherein, the first conductive pattern (720) and the second conductive pattern (740) are electrically connected to each other via a conductive adhesive.

14. The electronic device according to claim 13, wherein: The conductive adhesive includes silver epoxy, and Wherein, the conductive adhesive is cured by a thermal curing method or an ultraviolet curing method.

15. The electronic device according to any one of claims 12 to 14, wherein: An electrostatic discharge (ESD) path is provided so that charges introduced from outside the key button (411) are transferred to the first conductive pattern (720), the second conductive pattern (740) and the ground of the printed circuit board (340).

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