Intelligent control method and device for full-closed vacuum isothermal forging die changing system

Abstract

The application provides an intelligent control and device of a fully-closed vacuum isothermal forging die changing system, and relates to the field of high-end intelligent device manufacturing.The method comprises the following steps: obtaining attribute information of a target die stack; the attribute information comprises the size of the target die stack and / or the hit rate of the target die stack; the hit rate is the probability of the target die stack being called in multiple forging tasks; based on the attribute information of the target die stack, the temperature of the target die stack is changed from the temperature changing chamber in the original filling state to the temperature changing chamber in the first temperature changing zone or the second temperature changing zone; wherein the first temperature changing zone and the second temperature changing zone each comprise multiple groups of oppositely arranged split-opening temperature changing chambers; the distance between the first temperature changing zone and the vacuum forging chamber is smaller than the distance between the second temperature changing zone and the vacuum forging chamber; the temperature changing comprises heating or cooling. The method is suitable for the temperature changing process of the die stack, and is used for realizing die changing in a vacuum environment and dynamically adjusting the temperature changing chamber of the die stack.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of high-end intelligent device manufacturing, and in particular to an intelligent control method and device for a fully-closed vacuum isothermal forging die changing system. BACKGROUND

[0002] Isothermal forging refers to an advanced forging method in which a die stack (or die) is heated to the same or similar temperature as a forged piece for forging.

[0003] For aero-engine hot-end components such as powder turbine discs, the forging temperature is very high, and the conventional die stack material is difficult to meet the requirements. The commonly used die stack material at present is molybdenum-titanium-zirconium alloy (TZM), but this material is easily oxidized in the atmospheric environment and must be forged in a vacuum environment.

[0004] However, in a fully-closed vacuum environment, how to change the die stack and improve the production efficiency has become a big problem. SUMMARY

[0005] The present application provides an intelligent control method and device for a fully-closed vacuum isothermal forging die changing system, which can realize die changing in a vacuum environment and dynamically adjust the temperature change of the die stack.

[0006] In a first aspect, the present application provides an intelligent control method for a fully-closed vacuum isothermal forging die changing system. The method is applied to an intelligent control device for a fully-closed vacuum isothermal forging die changing system. The fully-closed vacuum isothermal forging die changing system further includes a vacuum transfer chamber and a vacuum forging chamber. The vacuum transfer chamber includes a plurality of sets of oppositely arranged split temperature change chambers, an intelligent platform vehicle in each temperature change chamber, and an intelligent robot. An intelligent platform vehicle track is laid between each set of oppositely arranged split temperature change chambers, extending through the temperature change chambers. A smart robot track is laid in the vacuum transfer chamber perpendicular to the direction of the intelligent platform vehicle track, extending to the vacuum forging chamber. The intelligent platform vehicle is used to transfer the die stack in the temperature change chamber to the intersection of the intelligent platform vehicle track and the intelligent robot track along the intelligent platform vehicle track. The intelligent robot is used to transfer the die stack along the intelligent robot track between the intersection and the vacuum forging chamber. The method includes: obtaining attribute information of a target die stack; the attribute information includes the size of the target die stack and / or the hit rate of the target die stack; the hit rate is the probability of the target die stack being called in multiple forging tasks; based on the attribute information of the target die stack, the target die stack is adjusted from the temperature change chamber at the original loading time to the temperature change chamber in the first temperature change zone or the second temperature change zone for temperature change; wherein the first temperature change zone and the second temperature change zone each include a plurality of sets of oppositely arranged split temperature change chambers; the distance between the first temperature change zone and the vacuum forging chamber is less than the distance between the second temperature change zone and the vacuum forging chamber; the temperature change includes heating or cooling.

[0007] In the intelligent control method of the full-closed isothermal forging die changing system provided in the application, the vacuum transfer chamber in the full-closed vacuum isothermal forging die changing system can include multiple groups of oppositely arranged split-opening temperature changing chambers, so that when a certain temperature changing chamber heats or cools the die stack, the other temperature changing chambers can provide the die stack after heating or cooling is completed, thereby ensuring the continuous execution of the forging task.

[0008] In addition, the intelligent control device in the application can obtain attribute information of the target die stack, and based on the attribute information of the target die stack, adjust the target die stack from the temperature changing chamber at the original filling time to the first temperature changing chamber or the second temperature changing chamber, and the attribute information can specifically include the size and / or hit rate of the target die stack. In this way, the die stacks with different attribute information can be heated or cooled in different zones, which helps to reduce the transportation time, optimize the workflow connection, and improve the intelligent degree of the full-closed isothermal forging die changing system.

[0009] Optionally, based on the attribute information of the target die stack, adjusting the target die stack from the temperature changing chamber at the original filling time to the temperature changing chamber in the first temperature changing zone or the second temperature changing zone for temperature changing includes: in response to that all die stacks of the current batch of forging tasks are filled, based on the attribute information of the target die stack, adjusting the target die stack from the temperature changing chamber at the original filling time to the temperature changing chamber in the first temperature changing zone or the second temperature changing zone for temperature changing; the target die stack is a die stack in all die stacks of the current batch of forging tasks.

[0010] In this way, the step of adjusting the target die stack to the temperature changing chamber in the first temperature changing zone or the second temperature changing zone for temperature changing can be triggered after a batch of die stacks are filled.

[0011] Optionally, based on the attribute information of the target die stack, adjusting the target die stack from the temperature changing chamber at the original filling time to the temperature changing chamber in the first temperature changing zone or the second temperature changing zone for temperature changing includes: in the execution process of the current batch of forging tasks, in response to that the intelligent robot is in an idle state, based on the attribute information of the target die stack, adjusting the target die stack from the temperature changing chamber at the original filling time to the temperature changing chamber in the first temperature changing zone or the second temperature changing zone for temperature changing; the target die stack is a die stack that has not undergone temperature changing in the current vacuum transfer chamber.

[0012] In this way, the step of adjusting the target die stack to the temperature changing chamber in the first temperature changing zone or the second temperature changing zone for temperature changing can be triggered when the intelligent robot is idle in the execution process of the forging task.

[0013] Optionally, the method further includes: based on that no die stack is detected at the intersection of the track of the intelligent platform vehicle and the track of the intelligent robot between each group of temperature changing chambers, and the intelligent robot is located at the starting point position of the track of the intelligent robot, determining that the intelligent robot is in an idle state.

[0014] Optionally, the attribute information comprises a size of the target die stack; and based on the attribute information of the target die stack, the target die stack is adjusted from the temperature changing chamber at the original filling time to a temperature changing chamber in the first temperature changing zone or the second temperature changing zone for temperature changing, comprising: based on the size of the target die stack being greater than a size threshold, the target die stack is adjusted from the temperature changing chamber at the original filling time to the temperature changing chamber in the first temperature changing zone for temperature changing; and based on the size of the target die stack being less than the size threshold, the target die stack is adjusted from the temperature changing chamber at the original filling time to the temperature changing chamber in the second temperature changing zone for temperature changing.

[0015] In the intelligent control method of the full-closed isothermal forging die changing system provided in the application, the intelligent control device can adjust the target die stack from the temperature changing chamber at the original filling time to the temperature changing chamber in the first temperature changing zone for temperature changing based on the size of the target die stack being greater than a size threshold, and adjust the target die stack from the temperature changing chamber at the original filling time to the temperature changing chamber in the second temperature changing zone for temperature changing based on the size of the target die stack being less than the size threshold. Generally, a die stack with a larger size has a faster heat dissipation, so that the die stack with a larger size and a faster heat dissipation can be adjusted to the first temperature changing zone which is closer to the vacuum forging chamber, and the die stack with a smaller size and a slower heat dissipation can be adjusted to the second temperature changing zone which is farther away from the vacuum forging chamber, so as to reasonably allocate the temperature changing zones and avoid the temperature of the die stack with a larger size from dropping too much in the process of entering the vacuum forging chamber, thereby affecting the isothermal forging effect.

[0016] Optionally, the attribute information comprises a hit rate of the target die stack; and based on the attribute information of the target die stack, the target die stack is adjusted from the temperature changing chamber at the original filling time to a temperature changing chamber in the first temperature changing zone or the second temperature changing zone for temperature changing, comprising: based on the hit rate of the target die stack being greater than a hit rate threshold, the target die stack is adjusted from the temperature changing chamber at the original filling time to the temperature changing chamber in the first temperature changing zone for temperature changing; and based on the hit rate of the target die stack being less than the hit rate threshold, the target die stack is adjusted from the temperature changing chamber at the original filling time to the temperature changing chamber in the second temperature changing zone for temperature changing.

[0017] In the intelligent control method of the full-closed isothermal forging die changing system provided in the application, the intelligent control device can adjust the target die stack from the temperature changing chamber at the original filling time to the temperature changing chamber in the first temperature changing zone for temperature changing based on the size of the target die stack being greater than a size threshold, and adjust the target die stack from the temperature changing chamber at the original filling time to the temperature changing chamber in the second temperature changing zone for temperature changing based on the size of the target die stack being less than the size threshold. Generally, a die stack with a larger size has a faster heat dissipation, so that the die stack with a larger size and a faster heat dissipation can be adjusted to the first temperature changing zone which is closer to the vacuum forging chamber, and the die stack with a smaller size and a slower heat dissipation can be adjusted to the second temperature changing zone which is farther away from the vacuum forging chamber, so as to reasonably allocate the temperature changing zones and avoid the temperature of the die stack with a larger size from dropping too much in the process of entering the vacuum forging chamber, thereby affecting the isothermal forging effect.

[0018] Optionally, the attribute information comprises a size and a hit rate of the target die stack; and the adjusting the target die stack from the temperature changing chamber at the original filling time to the temperature changing chamber of the first temperature changing zone or the second temperature changing zone for temperature changing based on the attribute information of the target die stack comprises: based on the size of the target die stack being greater than a size threshold and the hit rate of the target die stack being greater than a hit rate threshold, adjusting the target die stack from the temperature changing chamber at the original filling time to the temperature changing chamber of the first temperature changing zone for temperature changing; and based on the size of the target die stack being less than the size threshold and the hit rate of the target die stack being less than the hit rate threshold, adjusting the target die stack from the temperature changing chamber at the original filling time to the temperature changing chamber of the second temperature changing zone for temperature changing.

[0019] Optionally, the method further comprises: during the adjusting the target die stack to the temperature changing chamber of the first temperature changing zone or the second temperature changing zone, stopping the movement of the intelligent platform vehicle in all the temperature changing chambers and locking all the gates of the temperature changing chambers.

[0020] In this way, the intelligent robot can be prevented from colliding with the intelligent platform vehicle or the die stack when adjusting the die stack to the temperature changing zone.

[0021] In a second aspect, the present application provides an intelligent control device of a fully-closed vacuum isothermal forging die changing system, which comprises various functional modules for the method of the first aspect.

[0022] In a third aspect, the present application provides an intelligent control device of a fully-closed vacuum isothermal forging die changing system, which further comprises a vacuum transfer chamber and a vacuum forging chamber; the vacuum transfer chamber comprises a plurality of sets of oppositely arranged pair of opening temperature changing chambers, an intelligent platform vehicle in each temperature changing chamber, and an intelligent robot; a set of intelligent platform vehicle tracks is arranged between each set of oppositely arranged pair of opening temperature changing chambers and extends through the temperature changing chambers; an intelligent robot track extending to the vacuum forging chamber is arranged in the vacuum transfer chamber and is perpendicular to the direction of the intelligent platform vehicle tracks; the intelligent platform vehicle is used to transfer the die stack in the temperature changing chamber to the intersection of the intelligent platform vehicle track and the intelligent robot track along the intelligent platform vehicle track; the intelligent robot is used to transfer the die stack along the intelligent robot track between the intersection and the vacuum forging chamber; the intelligent control device comprises a processor and a memory; the memory stores instructions executable by the processor; and the processor is configured to execute the instructions so that the intelligent control device implements the method of the first aspect.

[0023] In a fourth aspect, the present application provides a readable storage medium comprising software instructions; when the software instructions are run in an intelligent control device, the intelligent control device implements the method of the first aspect.

[0024] In a fifth aspect, the present application provides a computer program product, comprising: computer instructions; when the computer instructions are run in the intelligent control device, the intelligent control device implements the method according to the first aspect.

[0025] The advantages of the second aspect to the fifth aspect are as described in the first aspect, and will not be described again. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0027] Figure 1 The composition schematic diagram of the full-closed vacuum isothermal forging mold changing system provided by the embodiments of the present application is shown in the figure.

[0028] Figure 2 The flowchart of the intelligent control method of the full-closed vacuum isothermal forging mold changing system provided by the embodiments of the present application is shown in the figure.

[0029] Figure 3 The composition schematic diagram of the intelligent control device of the full-closed vacuum isothermal forging mold changing system provided by the embodiments of the present application is shown in the figure.

[0030] Figure 4 The composition schematic diagram of another intelligent control device of the full-closed vacuum isothermal forging mold changing system provided by the embodiments of the present application is shown in the figure. DETAILED DESCRIPTION

[0031] The technical solutions of the embodiments of the present application will be described clearly and completely in the following with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0032] It should be noted that in the embodiments of the present application, the words such as "exemplarily" or "for example" are used to represent as an example, illustration or explanation. Any embodiment or design scheme described as "exemplarily" or "for example" in the embodiments of the present application should not be interpreted as more preferred or more advantageous than other embodiments or design schemes. In fact, the words such as "exemplarily" or "for example" are intended to present the relevant concept in a specific way.

[0033] In order to facilitate a clear description of the technical solutions of the embodiments of the present application, in the embodiments of the present application, words such as "first" and "second" are used to distinguish between identical or similar items with basically the same functions and effects. Those skilled in the art can understand that words such as "first" and "second" do not limit the quantity and execution order.

[0034] Isothermal forging refers to an advanced forging method in which the die stack (or mold) is heated to the same or similar temperature as the forging.

[0035] Forging hot-end components of aircraft engines, such as powder turbine disks, requires extremely high temperatures, making it difficult for conventional mold materials to meet these requirements. Currently, the commonly used mold material is molybdenum-titanium-zirconium alloy (TZM), but this material is easily oxidized in atmospheric conditions and must be forged in a vacuum environment.

[0036] However, in a fully enclosed vacuum environment, how to replace the mold stack and improve production efficiency has become a major problem.

[0037] Based on this, the embodiment of the present application provides an intelligent control method and device for a fully enclosed vacuum isothermal forging die changing system, which can realize die changing in a vacuum environment and dynamically adjust the temperature change chamber of the die stack.

[0038] The following is an introduction with reference to the accompanying drawings.

[0039] Figure 1 This is a schematic diagram of the composition of the fully enclosed vacuum isothermal forging die changing system provided in the embodiment of the present application. Figure 1 As shown, the fully enclosed vacuum isothermal forging die changing system includes: a vacuum transfer chamber 10 and a vacuum forging chamber 12. The vacuum transfer chamber 10 and the vacuum forging chamber 12 can be opened through a vacuum gate ( Figure 1 The black thick solid line between the vacuum transfer chamber 10 and the vacuum forging chamber 12 is used as an example to control the connection or isolation.

[0040] The vacuum transfer chamber 10 may include a plurality of pairs of relatively arranged temperature change chambers 1 ( Figure 1 In the figure, one group is used as an example. In practice, multiple groups of temperature change chambers 1 can be understood as being arranged in the same direction. Figure 1 The left and right sides of the temperature change chamber 1 are shown, and the corresponding vacuum transfer chamber 10 can also be compared to Figure 1 The width is widened as shown), the intelligent platform vehicle 3 and the intelligent robot 8 in each temperature change chamber 1.

[0041] An intelligent platform vehicle track 7 is laid between each group of relatively open temperature change chambers 1 and passes through the group of temperature change chambers 1. The intelligent platform vehicle track 7 extends to the outside of the temperature change chamber 1 through the furnace door 2 of the temperature change chamber 1, and the mold stack can be loaded into the temperature change chamber 1 through the furnace door 2.

[0042] An intelligent robot track 11 extending to the vacuum forging chamber 12 is also laid in the vacuum transfer chamber 10 perpendicular to the direction of the intelligent platform vehicle track 7 .

[0043] The intelligent platform vehicle 3 can be used to transfer the mold stack in the temperature change chamber 1 along the intelligent platform vehicle track 7 to the intersection of the intelligent platform vehicle track 7 and the intelligent robot track 11.

[0044] In some embodiments, the intelligent platform vehicle 3 is further provided with an upper mold stack holder 5 and a lower mold stack holder 4. The intelligent platform vehicle 3 can fix the mold stack through the upper mold stack holder 5 and the lower mold stack holder 4.

[0045] In some embodiments, an ejection device 9 may be further provided at the intersection of the intelligent platform vehicle track 7 and the intelligent robot track 11. After the intelligent platform vehicle 3 transfers the mold stack to the intersection, the ejection device 9 may eject the mold stack, and then the intelligent platform vehicle 3 may be returned to the temperature change chamber 1 along the intelligent platform vehicle track 7.

[0046] The intelligent robot 8 can be used to transfer the mold stack between the aforementioned intersection and the vacuum forging chamber 12 along the intelligent robot track 11.

[0047] For example, the intelligent robot 8 can transfer the mold stack at the aforementioned intersection that has been heated in the temperature change chamber 1 to the vacuum forging chamber 12 along the intelligent robot track 11 for forging.

[0048] For another example, the intelligent robot 8 can also transfer the mold stack that has been forged in the vacuum forging chamber 12 from the vacuum forging chamber 12 to the aforementioned intersection.

[0049] In some embodiments, the vacuum forging chamber 12 may include a workbench 13 , and an ejection mechanism is also provided on the workbench 13 . Specifically, the intelligent robot 8 may transfer the mold stack to the workbench 13 of the vacuum forging chamber 12 .

[0050] In some embodiments, the fully enclosed vacuum isothermal forging die changing system further includes a vacuum unit ( Figure 1 (not shown in the figure), the vacuum pumping unit may include a Roots pump and a diffusion pump, and is connected to each temperature change chamber 1, the vacuum transfer chamber 10, and the vacuum forging chamber 12 through a vacuum pipe.

[0051] The vacuum pumping unit may be used to vacuum each of the temperature change chamber 1 , the vacuum transfer chamber 10 , and the vacuum forging chamber 12 .

[0052] In some embodiments, a vacuum gate may also be provided between the temperature changing chamber 1 and other spaces of the vacuum transfer chamber 10 .

[0053] In some embodiments, the fully enclosed vacuum isothermal forging die changing system further includes an intelligent control device ( Figure 1 The intelligent control device can be connected with the above Figure 1 The components shown are communicatively connected. For example, the intelligent control device can be communicatively connected to the intelligent robot 8, and the intelligent control device can control the intelligent robot 8 to dynamically adjust the temperature change chamber of the die stack. The specific process can be referred to the intelligent control method for a fully enclosed vacuum isothermal forging die changing system provided in the following embodiment, and will not be repeated here.

[0054] The intelligent control method for a fully enclosed vacuum isothermal forging die-changing system provided in the embodiments of the present application is implemented by an intelligent control device. The intelligent control device can be a computing device with computing and processing capabilities, such as a computer or server, or the intelligent control device can also be the control unit of the fully enclosed vacuum isothermal forging die-changing system. For example, if the computing device and control unit are collectively referred to as electronic devices, the intelligent control method for the fully enclosed vacuum isothermal forging die-changing system can be implemented by a processor (e.g., a central processing unit (CPU)) in the electronic device; or by a software system installed in the electronic device for implementing the intelligent control method; or even by a functional module in the electronic device for implementing the intelligent control method. The embodiments of the present application are not limited to this.

[0055] For simplicity of description, the intelligent control method of the fully enclosed vacuum isothermal forging die changing system provided in the embodiment of the present application is uniformly introduced below by taking the intelligent control device as an example to be the executor.

[0056] Figure 2 This is a flow chart of the intelligent control method for the fully enclosed vacuum isothermal forging die changing system provided in the embodiment of the present application. Figure 2 As shown, the method includes the following steps:

[0057] S101: Obtain attribute information of a target module stack.

[0058] The attribute information includes the size of the target mold stack and / or the hit rate of the target mold stack. The hit rate is the probability that the target mold stack is called in multiple (unexecuted) forging tasks.

[0059] In some possible embodiments, the intelligent control device may obtain multiple forging tasks of the current batch, wherein the forging tasks may include (called) die stacks and the size of the die stacks (in terms of Figure 1As shown in the die stack, the size here can be understood as the axial length in the vertical axis after the die stack is combined, and the like. The intelligent control device can analyze the size and hit rate of each die stack according to the obtained multiple forging tasks of the current batch.

[0060] In a possible implementation, the intelligent control device can include an input and output interface, which can include a mouse, a keyboard, or a touch display screen, and the like. The intelligent control device can receive the forging task input by the worker through the input and output interface.

[0061] In another possible implementation, the intelligent control device can also be in communication connection with other devices or platforms, and the intelligent control device can receive the forging task sent by the other devices or platforms.

[0062] S102, based on the attribute information of the target die stack, adjusting the target die stack from the temperature changing chamber at the original filling time to the temperature changing chamber in the first temperature changing zone or the second temperature changing zone to change the temperature.

[0063] The first temperature changing zone and the second temperature changing zone each include multiple groups of oppositely arranged split temperature changing chambers. The distance between the first temperature changing zone and the vacuum forging chamber is less than the distance between the second temperature changing zone and the vacuum forging chamber. The temperature changing includes heating or cooling.

[0064] For example, in a fully closed vacuum isothermal die changing system including N groups of oppositely arranged split temperature changing chambers, the N / 2 groups of temperature changing chambers close to the vacuum forging chamber can be understood as the first temperature changing zone, and the N / 2 groups of temperature changing chambers away from the vacuum forging chamber can be understood as the second temperature changing zone, where N is a positive integer greater than 2.

[0065] It should be noted that the proportions of the temperature changing chambers in the first temperature changing zone and the second temperature changing zone are only examples. In practice, 2 / 3 of the temperature changing chambers can be arranged in the first temperature changing zone, and 1 / 3 of the temperature changing chambers can be arranged in the second temperature changing zone. Alternatively, 3 / 4 of the temperature changing chambers can be arranged in the first temperature changing zone, and 1 / 4 of the temperature changing chambers can be arranged in the second temperature changing zone. The specific proportion values are not limited in the embodiments of the application.

[0066] As an example, the intelligent control device can preferentially adjust the die stack with a larger size and / or a larger hit rate in the attribute information to the first temperature changing zone, and preferentially adjust the die stack with a smaller size and / or a smaller hit rate in the attribute information to the second temperature changing zone.

[0067] Exemplarily, the intelligent control device can control the smart platform vehicle in the original temperature changing chamber to transfer the target mold stack to the intersection of the smart platform vehicle track and the smart robot track, then control the ejection device at the intersection to eject the target mold stack, and then control the smart robot to transfer the target mold stack to the intersection of the smart platform vehicle track and the smart robot track of the first temperature changing zone or the second temperature changing zone, so that the target mold stack is transferred into the temperature changing chamber by the smart platform vehicle in the temperature changing chamber of the first temperature changing zone or the second temperature changing zone, thereby completing the adjustment of the temperature changing chamber.

[0068] The intelligent control method of the fully-closed isothermal forging mold changing system provided in the embodiments of the present application can include a plurality of groups of oppositely arranged split temperature changing chambers. In this way, when one temperature changing chamber is heating or cooling a mold stack, the other temperature changing chambers can provide mold stacks after heating or cooling is completed, thereby ensuring continuous execution of forging tasks.

[0069] In addition, the intelligent control device in the present application can obtain attribute information of the target mold stack, and based on the attribute information of the target mold stack, adjust the target mold stack from the temperature changing chamber at the time of original filling to the first temperature changing chamber or the second temperature changing chamber. The attribute information can specifically include the size and / or hit rate of the target mold stack. In this way, mold stacks with different attribute information can be heated or cooled in different zones, which helps to reduce transportation time, optimize workflow connection, and improve the intelligent degree of the fully-closed isothermal forging mold changing system.

[0070] The specific process of S102 is described below.

[0071] In some possible embodiments, the step of adjusting the temperature changing chamber of the target mold stack can be triggered and executed after a batch of mold stacks are filled. In this case, S102 can specifically include the following steps:

[0072] Step 1a, in response to the fact that all mold stacks of the current batch of forging tasks are filled, based on the attribute information of the target mold stack, adjusting the target mold stack from the temperature changing chamber at the time of original filling to the temperature changing chamber of the first temperature changing zone or the second temperature changing zone for temperature changing.

[0073] The target mold stack is a mold stack in all mold stacks of the current batch of forging tasks.

[0074] For example, the intelligent control device can traverse all mold stacks filled in the current batch of forging tasks, and perform the above-mentioned temperature changing chamber adjustment operation on each mold stack.

[0075] In some other possible embodiments, the step of adjusting the target mold stack temperature change chamber can be triggered when the intelligent robot is idle during the forging task. In this case, the above S102 specifically includes the following steps:

[0076] Step 1b. During the execution of the current batch forging task, in response to the intelligent robot being in an idle state, based on the attribute information of the target mold stack, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber of the first temperature change zone or the second temperature change zone for temperature change.

[0077] The target module stack is a module stack in which the temperature in the current vacuum transfer chamber has not changed.

[0078] Optionally, the intelligent control device can also determine whether the intelligent robot is in an idle state based on the situation of the mold stack detected on the intelligent robot track and the position of the intelligent robot. In this case, before the above step 1b, the method can also include:

[0079] Step 1c: Based on the fact that no mold stack is detected at the intersection of the intelligent platform vehicle track and the intelligent robot track between each group of temperature change chambers, and the intelligent robot is located at the starting position of the intelligent robot track, it is determined that the intelligent robot is in an idle state.

[0080] For example, a detection device may be provided at the intersection of the intelligent platform vehicle track and the intelligent robot track. The detection device may be, for example, a photoelectric sensor or a pressure sensor, and the intelligent control device may detect whether there is a mold stack at the intersection based on the detection device.

[0081] For another example, a detection device may also be provided at the starting position of the intelligent robot track, and the intelligent control device may detect whether the intelligent robot is located at the starting position based on the detection device.

[0082] Optionally, the intelligent control device can also determine that the intelligent robot is in a transporting state based on detecting the mold stack at the intersection of the intelligent platform vehicle track and the intelligent robot track between any group of temperature change chambers, and / or the intelligent robot is located outside the starting position of the intelligent robot track.

[0083] In some embodiments, the intelligent control device can adjust the larger mold stack to the first temperature variable zone and the smaller mold stack to the second temperature variable zone. In this case, the above S102 can specifically include the following steps:

[0084] Step 1d: Based on the size of the target mold stack being larger than the size threshold, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber in the first temperature change zone for temperature change.

[0085] Among them, as mentioned above, in the aboveFigure 1 The size of the target die stack can also be understood as the axial length of the target die stack, for example, in the shape of the temperature changing chamber.

[0086] Alternatively, the intelligent control device can obtain the size of all die stacks of the current batch of forging tasks (invoked) and take the average or median as the size threshold.

[0087] Alternatively, the intelligent control device can also receive the size threshold input by the worker manually.

[0088] Step 2d, based on the size of the target die stack being smaller than the size threshold, adjusting the target die stack from the temperature changing chamber at the original filling time to the temperature changing chamber in the second temperature changing zone for temperature changing.

[0089] It should be noted that in the case where the size of the target die stack is equal to the size threshold, the intelligent control device can adjust the target die stack to the temperature changing chamber in the second temperature changing zone or the temperature changing chamber in the first temperature changing zone for temperature changing. The present application embodiment does not limit this.

[0090] For example, in the case where the size of the target die stack is equal to the size threshold, the intelligent control device can determine the number of idle temperature changing chambers or the temperature changing chamber utilization rate in the current first temperature changing zone and second temperature changing zone, and select the temperature changing zone with more idle temperature changing chambers or lower temperature changing chamber utilization rate from the first temperature changing zone and the second temperature changing zone. The target die stack is adjusted to the temperature changing chamber in the temperature changing zone for temperature changing.

[0091] In the intelligent control method of the fully enclosed isothermal forging die changing system provided by the present application embodiment, the intelligent control device can adjust the target die stack to the temperature changing chamber in the first temperature changing zone for temperature changing based on the size of the target die stack being greater than the size threshold, and adjust the target die stack to the temperature changing chamber in the second temperature changing zone for temperature changing based on the size of the target die stack being smaller than the size threshold. The larger size die stack usually cools faster, so the larger size die stack that cools faster can be adjusted to the first temperature changing zone closer to the vacuum forging chamber, and the smaller size die stack that cools slower can be adjusted to the second temperature changing zone farther from the vacuum forging chamber, thereby reasonably allocating the temperature changing zones and avoiding the temperature of the larger size die stack from dropping too much during the process of entering the vacuum forging chamber, which affects the isothermal forging effect.

[0092] In other embodiments, the intelligent control device can adjust the die stack with a higher hit rate to the first temperature changing zone and the die stack with a lower hit rate to the second temperature changing zone. In this case, the above S102 can specifically include the following steps:

[0093] Step 1e, based on the hit rate of the target die stack being greater than the hit rate threshold, adjusting the target die stack from the temperature changing chamber at the original loading time to a temperature changing chamber in the first temperature changing zone for temperature changing.

[0094] Optionally, the intelligent control device can obtain the hit rates of all die stacks of the current batch of forging tasks (invoked) and take the average or median as the hit rate threshold.

[0095] Optionally, the intelligent control device can also receive the hit rate threshold input by the worker manually.

[0096] Step 2e, based on the hit rate of the target die stack being less than the hit rate threshold, adjusting the target die stack from the temperature changing chamber at the original loading time to a temperature changing chamber in the second temperature changing zone for temperature changing.

[0097] It should be noted that in the case where the hit rate of the target die stack is equal to the hit rate threshold, the intelligent control device can adjust the target die stack from the temperature changing chamber at the original loading time to a temperature changing chamber in the second temperature changing zone or a temperature changing chamber in the first temperature changing zone for temperature changing. The present application embodiments do not limit this.

[0098] For example, in the case where the hit rate of the target die stack is equal to the hit rate threshold, the intelligent control device can determine the number of idle temperature changing chambers or the temperature changing chamber utilization rate in the current first temperature changing zone and second temperature changing zone, and select the temperature changing zone with more idle temperature changing chambers or lower temperature changing chamber utilization rate from the first temperature changing zone and the second temperature changing zone, and adjust the target die stack to a temperature changing chamber in the temperature changing zone for temperature changing.

[0099] In the intelligent control method of the fully-closed isothermal forging die changing system provided by the present application embodiments, the intelligent control device can adjust the target die stack from the temperature changing chamber at the original loading time to a temperature changing chamber in the first temperature changing zone for temperature changing based on the hit rate of the target die stack being greater than the hit rate threshold, and adjust the target die stack from the temperature changing chamber at the original loading time to a temperature changing chamber in the second temperature changing zone for temperature changing based on the hit rate of the target die stack being less than the hit rate threshold. The hit rate is the probability of the target die stack being invoked in multiple forging tasks, and the higher the hit rate, the higher the probability of the target die stack being invoked. Adjusting the die stack with a higher probability of being invoked to the first temperature changing zone closer to the vacuum forging chamber helps shorten the transfer distance when these die stacks are frequently invoked, thereby improving the forging efficiency.

[0100] In yet some embodiments, the intelligent control device can also jointly determine the size and the hit rate to adjust the temperature changing zone. In this case, the above S102 can also specifically include the following steps:

[0101] Step 1f, based on the size of the target mold stack being greater than the size threshold value and the hit rate of the target mold stack being greater than the hit rate threshold value, adjusting the target mold stack from the temperature changing chamber at the original filling time to the temperature changing chamber of the first temperature changing zone for temperature changing.

[0102] Step 2f, based on the size of the target mold stack being less than the size threshold value and the hit rate of the target mold stack being less than the hit rate threshold value, adjusting the target mold stack from the temperature changing chamber at the original filling time to the temperature changing chamber of the second temperature changing zone for temperature changing.

[0103] Steps 1f to 2f can refer to the above steps 1d to 2d and steps 1e to 2e, which will not be repeated here.

[0104] In some possible embodiments, the lock device can also be arranged at the gate of the temperature changing chamber, so as to avoid collision of the intelligent robot when adjusting the mold stack temperature changing zone. During the process of adjusting the temperature changing zone by the intelligent robot, the intelligent control device can also pause the rotating movement in the temperature changing chamber. In this case, the method can further include the following steps:

[0105] Step 1g, stopping the movement of the intelligent platform vehicle in all temperature changing chambers and locking the gates (i.e. the above-mentioned vacuum gates) of all temperature changing chambers during the process of adjusting the target mold stack to the temperature changing chamber of the first temperature changing zone or the second temperature changing zone.

[0106] The above mainly introduces the scheme provided by the embodiments of the present application from the perspective of the method. In order to realize the above functions, the intelligent control device can include hardware structures and / or software modules for executing respective functions. Those skilled in the art should easily realize that, in combination with the units and algorithm steps of the examples described in the embodiments disclosed herein, the present application can be realized in the form of hardware or a combination of hardware and computer software. Whether a certain function is realized in the form of hardware or computer software driven hardware depends on the specific application and design constraints of the technical scheme. The professional technical target can use different methods to realize the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.

[0107] In the exemplary embodiments, the embodiments of the present application also provide an intelligent control device of a fully-closed vacuum isothermal forging mold changing system. Figure 3 The composition schematic diagram of the intelligent control device of the fully-closed vacuum isothermal forging mold changing system provided by the embodiments of the present application is shown in FIG. 3. As shown in FIG. 3, the intelligent control device includes an acquisition module 301 and a processing module 302. Figure 3

[0108] ​The acquisition module 301 is used to obtain the attribute information of the target mold stack; the attribute information includes the size of the target mold stack and / or the hit rate of the target mold stack; the hit rate is the probability of the target mold stack being called in multiple forging tasks.

[0109] The processing module 302 is used to adjust the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber in the first temperature change zone or the second temperature change zone for temperature change based on the attribute information of the target mold stack.

[0110] Among them, the first temperature change zone and the second temperature change zone both include multiple groups of relatively open temperature change chambers; the distance between the first temperature change zone and the vacuum forging chamber is smaller than the distance between the second temperature change zone and the vacuum forging chamber; the temperature change includes heating or cooling.

[0111] In some possible embodiments, the processing module 302 is specifically used to adjust the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber in the first temperature change zone or the second temperature change zone for temperature change in response to the completion of loading of all mold stacks of the current batch of forging tasks, based on the attribute information of the target mold stack; the target mold stack is the mold stack among all mold stacks of the current batch of forging tasks.

[0112] In some other possible embodiments, the processing module 302 is specifically used to, in response to the intelligent robot being in an idle state during the execution of the current batch forging task, adjust the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber of the first temperature change zone or the second temperature change zone for temperature change based on the attribute information of the target mold stack; the target mold stack is the mold stack that has not undergone temperature change in the current vacuum transfer chamber.

[0113] In some other possible embodiments, the processing module 302 is further used to determine that the intelligent robot is in an idle state based on the fact that no mold stack is detected at the intersection of the intelligent platform vehicle track and the intelligent robot track between each group of temperature change chambers, and the intelligent robot is located at the starting position of the intelligent robot track.

[0114] In some other possible embodiments, the attribute information includes the size of the target mold stack; the processing module 302 is specifically used to adjust the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber of the first temperature change zone for temperature change based on the size of the target mold stack being greater than a size threshold; and to adjust the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber of the second temperature change zone for temperature change based on the size of the target mold stack being less than a size threshold.

[0115] In some possible embodiments, the attribute information includes a hit rate of the target die stack; and the processing module 302 is specifically configured to: based on the hit rate of the target die stack being greater than a hit rate threshold, adjust the target die stack from the temperature changing chamber in the original loading state to a temperature changing chamber in the first temperature changing zone for temperature changing; and based on the hit rate of the target die stack being less than the hit rate threshold, adjust the target die stack from the temperature changing chamber in the original loading state to a temperature changing chamber in the second temperature changing zone for temperature changing.

[0116] In some possible embodiments, the attribute information includes a size and a hit rate of the target die stack; and the processing module 302 is specifically configured to: based on the size of the target die stack being greater than a size threshold and the hit rate of the target die stack being greater than a hit rate threshold, adjust the target die stack from the temperature changing chamber in the original loading state to a temperature changing chamber in the first temperature changing zone for temperature changing; and based on the size of the target die stack being less than the size threshold and the hit rate of the target die stack being less than the hit rate threshold, adjust the target die stack from the temperature changing chamber in the original loading state to a temperature changing chamber in the second temperature changing zone for temperature changing.

[0117] In some possible embodiments, the processing module 302 is further configured to stop the movement of the intelligent platform vehicle in all the temperature changing chambers and lock all the gates of the temperature changing chambers during the adjustment of the target die stack to the temperature changing chamber in the first temperature changing zone or the temperature changing chamber in the second temperature changing zone.

[0118] It should be noted that, Figure 3 The division of the modules in the above description is illustrative only, and is merely a logical function division. In actual implementation, another division manner can be used. For example, two or more functions can be integrated into one processing module. The integrated module can be implemented in the form of hardware or in the form of a software function unit.

[0119] In an example embodiment, the present application also provides an intelligent control device of a full-closed vacuum isothermal forging die changing system. Figure 4 Another component schematic diagram of an intelligent control device of a full-closed vacuum isothermal forging die changing system provided by the present application is shown in FIG. 2. As shown in FIG. 2, the intelligent control device includes a processor 10, a memory 20, a communication line 30, a communication interface 40, and an input / output interface 50. Figure 4

[0120] The processor 10, the memory 20, the communication interface 40, and the input / output interface 50 can be connected through the communication line 30.

[0121] ​The processor 10 is configured to execute instructions stored in the memory 20 to implement the intelligent control method of the full-closed vacuum isothermal forging mold changing system provided in the embodiments of the present application. The processor 10 can be a CPU, a general processor, a network processor (NP), a digital signal processing (DSP), a microprocessor, a micro control unit (MCU) / single chip microcomputer / single-chip microcontroller, a programmable logic device (PLD), or any combination thereof. The processor 10 can also be any other device with processing function, such as a circuit, a device, or a software module, and the embodiments of the present application are not limited thereto. In an example, the processor 10 can include one or more CPUs, such as the CPU0 and the CPU1 in FIG. 1. Figure 3 As an optional implementation, the intelligent control device can include multiple processors, for example, in addition to the processor 10, the processor 60 (illustrated in FIG. 1 by a dashed line) can also be included. Figure 3

[0122] The memory 20 is configured to store instructions. For example, the instructions can be a computer program. Alternatively, the memory 20 can be a read-only memory (ROM) or other type of static storage device that can store static information and / or instructions, or a random access memory (RAM) or other type of dynamic storage device that can store information and / or instructions, or an electrically erasable programmable read-only memory (EEPROM), a CD-ROM or other optical disk storage, a magnetic disk storage or other magnetic storage device, etc., and the embodiments of the present application are not limited thereto.

[0123] It should be noted that the memory 20 can exist independently of the processor 10, or can be integrated with the processor 10. The memory 20 can be located in the intelligent control device, or can be located outside the intelligent control device, and the embodiments of the present application are not limited thereto.

[0124] The communication line 30 is configured to transmit information between components included in the intelligent control device.

[0125] ​The communication interface 40 is configured to communicate with other devices or other communication networks. The other communication networks can be an Ethernet, a radio access network (RAN), a wireless local area network (WLAN), or the like. The communication interface 40 can be a module, a circuit, a transceiver, or any device capable of realizing communication.

[0126] The input / output interface 50 is configured to realize the human-computer interaction between the user and the intelligent control device. For example, the input / output interface 50 is configured to realize the action interaction, the text interaction, or the voice interaction between the user and the intelligent control device.

[0127] For example, the input / output interface 50 can be a physical keyboard or a touch display screen, or the like. The action interaction or the text interaction between the user and the intelligent control device can be realized through the physical keyboard or the touch display screen.

[0128] It should be noted that, Figure 4 The structure shown in the figures does not constitute a limitation on the intelligent control device, and the intelligent control device can include more or fewer components than those shown in the figures, or a combination of some components, or a different arrangement of components. Figure 4 The intelligent control device can include more or fewer components than those shown in the figures, or a combination of some components, or a different arrangement of components.

[0129] In an example embodiment, the present application also provides a computer program product, which includes computer instructions. When the computer instructions are run in the intelligent control device, the intelligent control device realizes the method as described in the foregoing method embodiments.

[0130] In an example embodiment, the present application also provides a computer program product, which includes computer instructions. When the computer instructions are run in the intelligent control device, the intelligent control device realizes the method as described in the foregoing method embodiments. The computer readable storage medium can be a non-transitory computer readable storage medium, for example, the non-transitory computer readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, and an optical data storage device, or the like.

[0131] In the above embodiments, all or part can be implemented by software, hardware, firmware or any combination thereof. When implemented by software, all or part can be implemented in the form of a computer program product. The computer program product includes one or more computer-executable instructions. When the computer-executable instructions are loaded and executed on a computer, all or part generates the flow or function according to the embodiments of the present application. The computer can be a general purpose computer, a special purpose computer, a computer network, or other programmable devices. The computer-executable instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another computer-readable storage medium, for example, the computer-executable instructions can be transmitted from one website site, computer, server or data center to another website site, computer, server or data center through wired (for example, coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (for example, infrared, wireless, microwave, etc.).

[0132] Although the present application is described herein in conjunction with various embodiments, it is understood that other variations of the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed application, from an inspection of the drawings, the disclosure, and the appended claims. The word "comprising" does not exclude other components or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. A single processor or other unit can fulfill the functions of several items recited in the claims. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to an advantage.

[0133] Although the present application is described herein in conjunction with specific features and embodiments thereof, it is understood that modifications and combinations can occur to those skilled in the art to which the present application pertains, within its spirit and scope. Accordingly, the description and drawings are to be regarded as illustrative in nature and are not to be regarded as limiting the scope of the application as defined in the appended claims. Obviously, many modifications and variations of this application are possible in light of its teachings. It is therefore to be understood that within the scope of the appended claims and their equivalents, this application can be practiced otherwise than as specifically described. Thus, the present application is intended to embrace all such modifications and variations as fall within the scope of the appended claims and their equivalents.

[0134] The above description is merely illustrative of the application, and is not to be taken in a limiting sense. Any variation which relies on the teachings of the application is to be considered to fall within the scope of the present application. Therefore, the scope of the present application is to be interpreted only in accordance with the appended claims and their equivalents.

Claims

1. An intelligent control method for a fully enclosed vacuum isothermal forging die changing system, characterized in that: The method is applied to an intelligent control device of a fully enclosed vacuum isothermal forging die-changing system, wherein the fully enclosed vacuum isothermal forging die-changing system further comprises a vacuum transfer chamber and a vacuum forging chamber; the vacuum transfer chamber comprises a plurality of oppositely arranged pairs of open temperature change chambers, an intelligent platform vehicle in each temperature change chamber, and an intelligent robot; an intelligent platform vehicle track is laid between each group of oppositely arranged pairs of open temperature change chambers, passing through the group of temperature change chambers; an intelligent robot track is laid in the vacuum transfer chamber perpendicular to the direction of the intelligent platform vehicle track and extending to the vacuum forging chamber; the intelligent platform vehicle is used to transfer the mold stack in the temperature change chamber to the intersection of the intelligent platform vehicle track and the intelligent robot track along the intelligent platform vehicle track; The intelligent robot is used to transfer the mold stack between the intersection and the vacuum forging chamber along the intelligent robot track; The method comprises: Acquiring attribute information of a target mold stack; the attribute information includes the size of the target mold stack and / or the hit rate of the target mold stack; the hit rate is the probability of the target mold stack being called in multiple forging tasks; Based on the property information of the target mold stack, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber of the first temperature change zone or the second temperature change zone for temperature change; Among them, the first temperature change zone and the second temperature change zone both include multiple groups of relatively open temperature change chambers; the distance between the first temperature change zone and the vacuum forging chamber is smaller than the distance between the second temperature change zone and the vacuum forging chamber; the temperature change includes heating or cooling.

2. The method according to claim 1, characterized in that The step of adjusting the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber in the first temperature change zone or the second temperature change zone for temperature change based on the property information of the target mold stack includes: In response to the completion of loading of all mold stacks of the current batch of forging tasks, based on the attribute information of the target mold stack, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber of the first temperature change zone or the second temperature change zone for temperature change; the target mold stack is the mold stack among all mold stacks of the current batch of forging tasks.

3. The method according to claim 1, characterized in that The step of adjusting the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber in the first temperature change zone or the second temperature change zone for temperature change based on the property information of the target mold stack includes: During the execution of the current batch forging task, in response to the intelligent robot being in an idle state, based on the attribute information of the target mold stack, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber of the first temperature change zone or the second temperature change zone for temperature change; the target mold stack is the mold stack that has not undergone temperature change in the current vacuum transfer chamber.

4. The method according to claim 3, characterized in that The method further comprises: Based on the fact that no mold stack is detected at the intersection of the intelligent platform vehicle track and the intelligent robot track between each group of temperature change chambers, and the intelligent robot is located at the starting position of the intelligent robot track, it is determined that the intelligent robot is in an idle state.

5. The method according to claim 1, wherein The attribute information includes a size of the target mold stack; and adjusting the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber in the first temperature change zone or the second temperature change zone to perform temperature change based on the attribute information of the target mold stack includes: Based on the size of the target mold stack being greater than a size threshold, adjusting the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber of the first temperature change zone for temperature change; Based on the size of the target mold stack being smaller than the size threshold, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber in the second temperature change zone for temperature change.

6. The method according to claim 1, characterized in that The attribute information includes a hit rate of the target module stack; and adjusting the target module stack from a temperature change chamber at the time of original loading to a temperature change chamber in a first temperature change zone or a second temperature change zone for temperature change based on the attribute information of the target module stack includes: Based on the hit rate of the target mold stack being greater than a hit rate threshold, adjusting the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber in the first temperature change zone for temperature change; Based on the hit rate of the target mold stack being less than a hit rate threshold, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber in the second temperature change zone for temperature change.

7. The method according to claim 1, characterized in that The attribute information includes a size and a hit rate of the target mold stack; and adjusting the target mold stack from a temperature change chamber at the time of original loading to a temperature change chamber in a first temperature change zone or a second temperature change zone for temperature change based on the attribute information of the target mold stack includes: Based on the fact that the size of the target mold stack is greater than a size threshold and the hit rate of the target mold stack is greater than a hit rate threshold, adjusting the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber in the first temperature change zone for temperature change; Based on the size of the target mold stack being smaller than the size threshold and the hit rate of the target mold stack being smaller than the hit rate threshold, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber in the second temperature change zone for temperature change.

8. The method according to any one of claims 1 to 7, characterized in that The method further comprises: During the process of adjusting the target module stack to the temperature change chamber of the first temperature change zone or the second temperature change zone, the movement of all intelligent platform vehicles in the temperature change chambers is stopped, and the gates of all temperature change chambers are locked.

9. An intelligent control device for a fully enclosed vacuum isothermal forging die changing system, characterized in that: The fully enclosed vacuum isothermal forging die changing system also includes a vacuum transfer chamber and a vacuum forging chamber; the vacuum transfer chamber includes a plurality of oppositely arranged pairs of open temperature change chambers, an intelligent platform vehicle in each temperature change chamber, and an intelligent robot; a smart platform vehicle track is laid between each group of oppositely arranged pairs of open temperature change chambers, which runs through the group of temperature change chambers; an intelligent robot track is laid in the vacuum transfer chamber perpendicular to the direction of the intelligent platform vehicle track and extends to the vacuum forging chamber; the intelligent platform vehicle is used to transfer the mold stack in the temperature change chamber to the intersection of the intelligent platform vehicle track and the intelligent robot track along the intelligent platform vehicle track; The intelligent robot is used to transfer the mold stack between the intersection and the vacuum forging chamber along the intelligent robot track; The intelligent control device includes: a processor and a memory; The memory stores instructions executable by the processor; When the processor is configured to execute the instructions, the intelligent control device implements the method according to any one of claims 1 to 8.

10. A computer program product, characterized in that include: Computer instructions; When the computer instructions are executed in an intelligent control device, the intelligent control device is enabled to implement the method according to any one of claims 1 to 8.

Images