Device for coating solder paste in hole of heat pipe radiator

Abstract

The invention relates to the technical field of heat pipe radiators, in particular to a heat pipe radiator in-hole solder paste coating device which comprises a frame body and a feeding mechanism, the feeding mechanism is installed on the frame body and used for injecting tin into a radiator, the feeding mechanism comprises a tin injection pipeline, and the tin injection pipeline can move towards the radiator and inject tin into a hole groove of the radiator; the protective shell is movably arranged at the end of the tin injection pipeline in a sleeving mode, a protective bin is formed in the protective shell, the top of the protective shell and the tin injection pipeline are arranged in a sealed mode, a tin inlet channel communicated with the protective bin is formed in the bottom of the protective shell, and the outer diameter of the tin inlet channel is smaller than the inner diameter of a radiator hole groove. The problem that distribution of the solder paste is often not uniform enough can be solved, the thermal contact effect of the heat pipe is improved, the problem that the solder paste is prone to overflowing is solved, and the problems that other assemblies are polluted, and the overall production efficiency and the product quality are affected are avoided.

Description

Technical Field

[0001] The invention relates to the technical field of heat pipe radiators, and in particular to a device for coating solder paste in a hole of a heat pipe radiator. Background Art

[0002] In modern electronic devices, heat management is a key factor in ensuring device performance and reliability. As the power consumption of electronic devices continues to increase, heat pipe radiators are widely used in various electronic devices due to their excellent thermal conductivity and efficient heat dissipation capabilities.

[0003] At present, the installation process of the heat pipe mainly includes opening a heat pipe groove on the surface of the substrate of the heat pipe radiator, pressing the heat pipe into the heat pipe groove and making it in close contact with the substrate surface. In order to ensure good thermal contact between the heat pipe and the radiator, solder paste is usually coated between the heat pipe groove and the heat pipe. After the solder paste is heated to melt in a reflow oven, a firm welding connection can be formed between the heat pipe and the radiator. After completion, the solder paste is cooled and solidified to achieve the fixation of the heat pipe and the radiator.

[0004] Although the current heat pipe installation process has achieved certain results, there are still some technical bottlenecks and problems. First, when injecting solder paste into the heat pipe groove, due to the influence of the operating environment and process parameters, the distribution of solder paste is often not uniform, which may cause insufficient solder paste in some areas and affect the thermal contact effect of the heat pipe. Secondly, in the process of pressing the heat pipe into the heat pipe groove, the solder paste is prone to overflow, which not only leads to waste of solder paste, but also may cause pollution to other components, affecting the overall production efficiency and product quality. Summary of the invention

[0005] The present invention is intended to solve one of the problems existing in the background technology.

[0006] To this end, the present invention provides a device for applying solder paste in the hole of a heat pipe radiator.

[0007] The technical solution adopted by the present invention to solve its technical problem is:

[0008] A device for applying solder paste in a hole of a heat pipe radiator, comprising:

[0009] Frame, and

[0010] A feeding mechanism, which is mounted on the frame and used for injecting tin into the heat sink, comprises:

[0011] A tin injection pipe, which can move toward the heat sink and inject tin into the hole groove thereof;

[0012] A protective shell is movably sleeved on the end of the tin injection pipe, a protective chamber is provided in the protective shell, a seal is provided between the top of the protective shell and the tin injection pipe, a tin inlet channel connected to the protective chamber is provided at the bottom of the protective shell, and the outer diameter of the tin inlet channel is smaller than the inner diameter of the radiator hole groove.

[0013] Furthermore, a boss is provided at the bottom of the protective shell, and the boss is inserted into the top of the radiator hole groove to position the protective shell.

[0014] Furthermore, the feeding mechanism further comprises:

[0015] A fixed top plate is sleeved on the tin injection pipeline and is detachably connected to the tin injection pipeline. The fixed top plate is connected to the protective shell through a connecting component.

[0016] Furthermore, the connection component includes:

[0017] A support sleeve, wherein the support sleeve is connected to the top of the protective shell;

[0018] A support rod, the support rod is connected to the bottom of the fixed top plate, and the support rod is inserted into the support sleeve;

[0019] A support spring is connected between the support rod and the support sleeve.

[0020] Furthermore, a plurality of the connection components are provided, and the plurality of the connection components are circumferentially arranged around the tin injection pipe.

[0021] Furthermore, a limiting sleeve is fixedly connected to the fixed top plate, fastening bolts are installed on the limiting sleeve, and screw holes matching the fastening bolts are opened on the outer wall of the tin injection pipe.

[0022] Furthermore, the feeding mechanism further comprises:

[0023] A driving device, wherein the driving device is mounted on the frame;

[0024] An assembly plate is connected to the output end of the driving device through a driving arm, and the assembly plate is used to install a tin injection pipeline.

[0025] Furthermore, a tin supply component is connected to the frame, and the tin supply component is connected to the tin injection pipeline for supplying tin to the tin injection pipeline.

[0026] Furthermore, the frame includes an assembly base, a support arm and a support top plate, the support arm is connected between the support top plate and the assembly base, and the assembly base is used to place the radiator.

[0027] Furthermore, a placement groove for placing the radiator is provided on the assembly base, and clamping panels capable of moving toward or away from the placement groove are provided on both sides of the placement groove.

[0028] The beneficial effect of the present invention is that the device for applying solder paste in the hole of the heat pipe radiator of the present invention gradually inserts the end of the tin injection pipe into the hole groove of the substrate, and then the solder paste can be injected into the interior of the hole groove of the substrate through the tin injection component. After the solder paste in the hole groove of the substrate is gradually filled, under the action of the protective shell, a certain seal can be formed on the hole groove of the substrate, thereby ensuring that the solder paste can fill the interior of the hole groove of the substrate, and then the injection of the solder paste is more uniform, and then the protective component can be taken out separately, and then the heat pipe is inserted into the hole groove of the substrate through the protective component, and then the protective component can be moved again to prevent the solder paste from overflowing onto the surface of the radiator, thereby solving the problem that the distribution of the solder paste is often not uniform. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0030] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0031] Figure 2 This is the structure for clamping the panel in the present invention.

[0032] Figure 3 It is a structural schematic diagram of the feeding mechanism of the present invention.

[0033] Figure 4 It is a schematic diagram of the structure of the protection component of the present invention.

[0034] Figure 5 For the present invention Figure 4 Schematic diagram of the structure with a partial enlargement at point A in the middle.

[0035] Figure 6 It is a structural schematic diagram of the protection cabin of the present invention.

[0036] Figure 7 For the present invention Figure 6 Schematic diagram of the structure with a partial enlargement at point B in the middle.

[0037] Figure 8 It is a schematic structural diagram of the heat pipe assembly of the present invention.

[0038] In the figure: 1. Assembly base; 11. Fixed side plate; 12. Adjustment screw; 13. Clamping panel; 14. Placement slot; 2. Support arm; 3. Support top plate; 4. Tin supply assembly; 41. Storage box; 42. Pump body; 43. Delivery pipeline; 44. Connecting pipeline; 5. Feeding mechanism; 51. Drive device; 52. Drive arm; 53. Assembly plate; 54. Tin injection pipeline; 55. Protection assembly; 551. Fixed top plate; 5511. Limiting sleeve; 5512. Fastening bolt; 552. Connecting assembly; 5521. Support sleeve; 5522. Support rod; 5523. Support spring; 553. Protection shell; 5531. Protection bin; 5532. Tin inlet channel; 5533. Boss. DETAILED DESCRIPTION

[0039] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.

[0040] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0041] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] A device for applying solder paste in the hole of a heat pipe radiator comprises a frame, a tin supply assembly 4 and a feeding mechanism 5, wherein the frame comprises an assembly base 1, a support arm 2 and a support top plate 3. The support arm 2 is connected between the support top plate 3 and the assembly base 1, the feeding mechanism 5 is connected to the support top plate 3 and is used to feed tin toward the heat pipe radiator placed on the assembly base 1, and the tin supply assembly 4 is connected to the feeding mechanism 5 and is used to supply tin to the feeding mechanism 5.

[0043] Specifically, one end of a plurality of support arms 2 is respectively fixedly connected to the top four corners of the assembly base 1, the support top plate 3 is fixedly connected to the other end of the support arm 2, and the tin supply assembly 4 is installed on the top of the support top plate 3. A placement groove 14 is provided on the assembly base 1, and clamping panels 13 are provided on both sides of the placement groove 14. The clamping panel 13 can move toward or away from the placement groove 14, and the clamping panel 13 is slidably connected to the assembly base 1 along the horizontal direction. Specifically, a fixed side panel 11 corresponding to the clamping panel 13 is connected to the assembly base 1, and the fixed side panel 11 is located on the side of the clamping panel 13 away from the placement groove 14. An adjusting screw 12 is passed through the fixed side panel 11, and the adjusting screw 12 is threadedly connected to the fixed side panel 11, and the clamping panel 13 is rotatably connected to the end of the adjusting screw 12.

[0044] The feeding mechanism 5 includes a driving device 51, a driving arm 52, an assembly plate 53, a tin injection pipe 54 and a protective assembly 55. The driving device 51 is installed at the bottom of the supporting top plate 3, and the output end of the driving device 51 passes through the supporting top plate 3. One end of the driving arm 52 is fixedly connected to the output end of the driving device 51, and the other end is fixedly connected to the top of the assembly plate 53 located between the supporting top plate 3 and the assembly base 1. The driving device 51 and the driving arm 52 control the assembly plate 53 to move toward or away from the assembly base 1. The driving device 51 described in this embodiment is a cylinder.

[0045] One end of a plurality of tin injection pipes 54 is fixedly connected to the bottom of the assembly plate 53 in an array, and one end of the tin injection pipes 54 is connected to the tin supply component 4 , and the protective component 55 is installed on the outer wall of the tin injection pipes 54 .

[0046] Specifically, when injecting solder paste into the substrate hole groove of the heat dissipation fin of the heat pipe radiator, by starting the driving device 51, the end of the driving arm 52 can be driven to move downward, and then the assembly plate 53 can be driven to move downward, so that the end of the tin injection pipe 54 can gradually enter the substrate hole groove, and then the solder paste can be injected into the interior of the substrate hole groove through the tin supply component 4. After the solder paste in the substrate hole groove is gradually filled, under the action of the protective component 55, a certain seal can be formed on the substrate hole groove, thereby ensuring that the solder paste can fill the interior of the substrate hole groove, and then the injection of the solder paste is more uniform. Then the protective component 55 can be taken out separately, and then the heat pipe is inserted into the substrate hole groove through the protective component 55, and then the protective component 55 can be moved again to prevent the solder paste from overflowing onto the surface of the radiator, thereby solving the problem that the distribution of the solder paste is often not uniform, which may cause insufficient solder paste in some areas and affect the thermal contact effect of the heat pipe. Secondly, in the process of pressing the heat pipe into the heat pipe groove, the solder paste is prone to overflow, which not only leads to waste of solder paste, but also may cause pollution to other components, affecting the overall production efficiency and product quality.

[0047] In one embodiment of the present invention, Figure 1-Figure 7 As shown, the protective component 55 includes a fixed top plate 551, a connecting component 552 and a protective shell 553. The fixed top plate 511 is coaxially sleeved outside the tin injection pipe 54. The top of the fixed top plate 551 is fixedly connected to a limiting sleeve 5511. The limiting sleeve 5511 is also sleeved on the tin injection pipe 54. The outer wall of the limiting sleeve 5511 is installed with a fastening bolt 5512. The outer wall of the tin injection pipe 54 is provided with a screw hole matching the fastening bolt 5512. The screw hole does not penetrate the wall thickness of the tin injection pipe 54. The fastening bolt 5512 cooperates with the screw hole to fix the fixed top plate 551 on the tin injection pipe 54.

[0048] The protective shell 553 is slidably sleeved on the end of the tin injection pipe 54 , and a plurality of connecting components 552 are arranged in a circular array between the top of the protective shell 553 and the bottom of the fixed top plate 551 , and are connected through the connecting components 552 .

[0049] It should be noted that a protective chamber 5531 is provided inside the protective shell 553. A circular tin inlet channel 5532 is provided at the bottom of the protective shell 553 described in this embodiment, close to the tin injection pipe 54. The tin inlet channel 5532 is connected to the protective chamber 5531. The outer diameter of the tin inlet channel 5532 is smaller than the inner diameter of the substrate hole groove on the heat sink fin. At the same time, a sealing strip is installed between the top of the protective shell 553 and the outer wall of the tin injection pipe 54. Furthermore, a boss 5533 is provided at the bottom of the protective shell 553. The boss 5533 can be clamped in the top of the substrate hole groove, thereby fixing the position of the protective shell 553.

[0050] Specifically, in order to ensure that after the solder paste is injected, the solder paste inside the hole groove of the heat pipe installation substrate of the substrate is more evenly distributed, and after the heat pipe is inserted into the hole groove of the substrate, the solder paste will not overflow to the surface of the radiator, because the top of the fixed top plate 551 is fixedly connected to the limiting sleeve 5511, the outer wall of the limiting sleeve 5511 is installed with a fastening bolt 5512, and the outer wall of the tin injection pipe 54 is provided with a screw hole matching the fastening bolt 5512, the fixed top plate 551 and the limiting sleeve 5511 are both sleeved on the outer wall of the tin injection pipe 54, the protective shell 553 is slidably sleeved on the end of the tin injection pipe 54, and a plurality of connecting components 552 are arranged in a circular array between the top of the protective shell 553 and the bottom of the fixed top plate 551, and are connected through the connecting components 552, and then the limiting sleeve 5511 is first fixedly sleeved on the tin injection pipe 54, and then when the tin injection pipe 54 continues to move downward, the protective shell 553 always presses against the When the heat pipe is inserted into the substrate hole groove, the solder paste in the substrate hole groove will overflow into the inside of the protective bin 5531, and the solder paste will not overflow onto the surface of the radiator, thereby avoiding the solder paste from overflowing. This not only leads to the waste of solder paste, but also may cause pollution to other components, affecting the overall production efficiency and product quality.

[0051] In one embodiment of the present invention, Figure 1-Figure 8 As shown, the connecting assembly 552 includes a supporting sleeve 5521, a supporting rod 5522 and a supporting spring 5523, wherein one end of the supporting sleeve 5521 is fixedly connected to the top of the protective shell 553, one end of the supporting spring 5523 is fixedly connected to the inner bottom of the supporting sleeve 5521, one end of the supporting rod 5522 passes through the other end of the supporting sleeve 5521 and is fixedly connected to the other end of the supporting spring 5523, and the other end of the supporting rod 5522 is fixedly connected to the bottom of the fixed top plate 551.

[0052] Specifically, in order to ensure that the tin injection pipe 54 moves downward more stably, one end of the support sleeve 5521 is fixedly connected to the top of the protective shell 553, one end of the support spring 5523 is fixedly connected to the inner bottom of the support sleeve 5521, one end of the support rod 5522 passes through the other end of the support sleeve 5521 and is fixedly connected to the other end of the support spring 5523, and the other end of the support rod 5522 is fixedly connected to the bottom of the fixed top plate 551. As the tin injection pipe 54 continues to move downward, the downward movement process can be ensured to be more linear under the action of the support spring 5523, thereby improving the uniformity of injection.

[0053] In one embodiment of the present invention, Figure 1-Figure 7 As shown, the tin supply assembly 4 includes a storage box 41, a pump body 42, a conveying pipe 43 and a connecting pipe 44, wherein the storage box 41 and the pump body 42 are both installed on the top of the supporting top plate 3, and the feed port of the pump body 42 is connected to the discharge end of the storage box 41, one end of the conveying pipe 43 is connected to the discharge port of the pump body 42, and the other end of the conveying pipe 43 passes through the supporting top plate 3, and multiple connecting pipes 44 are arranged between the ends of the multiple tin injection pipes 54 and the other end of the conveying pipes 43, and are connected through the connecting pipes 44.

[0054] It should be noted that a material injection hole is provided on the top of the storage box 41 described in this embodiment, and a sealing plug is installed at the material injection hole.

[0055] Specifically, in order to ensure convenient transportation of solder paste, the storage box 41 and the pump body 42 are both installed on the top of the support top plate 3, and the feed port of the pump body 42 is connected to the discharge end of the storage box 41, one end of the delivery pipe 43 is connected to the discharge port of the pump body 42, and the other end of the delivery pipe 43 passes through the support top plate 3. A plurality of connecting pipes 44 are arranged between the ends of the plurality of tin injection pipes 54 and the other end of the delivery pipe 43, and are connected through the connecting pipes 44. Then, by starting the pump body 42, the solder paste in the storage box 41 can be respectively transported to the corresponding tin injection pipes 54 through the delivery pipe 43 and the connecting pipe 44, thereby completing the tin injection operation.

[0056] In summary, the in-hole solder paste coating device of the heat pipe radiator of the embodiment of the present invention can gradually allow the end of the tin injection pipe 54 to enter the substrate hole groove gradually, and then the solder paste can be injected into the interior of the substrate hole groove through the tin supply component 4. After the solder paste in the substrate hole groove is gradually filled, under the action of the protective shell 553, a certain seal can be formed on the substrate hole groove, thereby ensuring that the solder paste can fill the interior of the substrate hole groove, and then the injection of the solder paste is more uniform. Then the protective component 55 can be taken out separately, and then the heat pipe is inserted into the substrate hole groove through the protective component 55, and then the protective component 55 can be moved to prevent the solder paste from overflowing onto the surface of the radiator, thereby solving the problem that the distribution of the solder paste is often not uniform, which may cause insufficient solder paste in some areas and affect the thermal contact effect of the heat pipe. Secondly, in the process of pressing the heat pipe into the heat pipe groove, the solder paste is prone to overflow, which not only leads to waste of solder paste, but also may cause pollution to other components, affecting the overall production efficiency and product quality.

[0057] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A device for applying solder paste in the hole of a heat pipe radiator, characterized in that: include, Frame, and A feeding mechanism (5), the feeding mechanism (5) is installed on the frame and is used for injecting tin into the heat sink, the feeding mechanism (5) comprises: A tin injection pipe (54), wherein the tin injection pipe (54) is capable of moving toward the heat sink and injecting tin into the hole groove thereof; A protective shell (553), the protective shell (553) is movably sleeved on the end of the tin injection pipeline (54), a protective chamber (5531) is provided in the protective shell (553), a seal is provided between the top of the protective shell (553) and the tin injection pipeline (54), and a tin inlet channel (5532) connected to the protective chamber (5531) is provided at the bottom of the protective shell (553), and the outer diameter of the tin inlet channel (5532) is smaller than the inner diameter of the heat sink hole groove.

2. The device for applying solder paste in the hole of a heat pipe radiator according to claim 1, characterized in that: The bottom of the protective shell (553) is provided with a boss, and the boss is inserted into the top of the radiator hole groove to position the protective shell (553).

3. The device for applying solder paste in the hole of a heat pipe radiator according to claim 1, characterized in that: The feeding mechanism (5) further comprises: A fixed top plate (551) is sleeved on the tin injection pipeline (54) and is detachably connected to the tin injection pipeline (54); the fixed top plate (551) is connected to the protective shell (553) via a connecting assembly (552).

4. The device for applying solder paste in the hole of a heat pipe radiator according to claim 3, characterized in that: The connection assembly (552) includes, A support sleeve (5521), wherein the support sleeve (5521) is connected to the top of the protective shell (553); A support rod (5522), the support rod (5522) is connected to the bottom of the fixed top plate (551), and the support rod (5522) is inserted into the support sleeve (5521); A support spring (5523), wherein the support spring (5523) is connected between the support rod (5522) and the support sleeve (5521).

5. The device for applying solder paste in the hole of a heat pipe radiator according to claim 3, characterized in that: A plurality of the connection components (552) are provided, and the plurality of the connection components (552) are circumferentially arranged around the tin injection pipe (54).

6. The device for applying solder paste in the hole of a heat pipe radiator according to claim 3, characterized in that: The fixed top plate (551) is fixedly connected to a limiting sleeve plate (5511), a fastening bolt (5512) is installed on the limiting sleeve plate (5511), and the outer wall of the tin injection pipe (54) is provided with a screw hole matching the fastening bolt (5512).

7. The device for applying solder paste in the hole of a heat pipe radiator according to claim 1, characterized in that: The feeding mechanism (5) further comprises: A driving device (51), wherein the driving device (51) is installed on the frame; An assembly plate (53) is connected to the output end of the driving device (51) through a driving arm (52), and the assembly plate (53) is used to install a tin injection pipeline (54).

8. The device for applying solder paste in the hole of a heat pipe radiator according to claim 1, characterized in that: The frame is connected to a tin supply component (4), and the tin supply component (4) is connected to a tin injection pipeline (54) for supplying tin to the tin injection pipeline (54).

9. The device for applying solder paste in the hole of a heat pipe radiator according to claim 1, characterized in that: The frame comprises an assembly base (1), a support arm (2) and a support top plate (3); the support arm (2) is connected between the support top plate (3) and the assembly base (1); and the assembly base (1) is used for placing a radiator.

10. The device for applying solder paste in the hole of a heat pipe radiator according to claim 9, characterized in that: A placement groove (14) for placing a radiator is provided on the assembly base (1), and clamping panels (13) capable of moving toward or away from the placement groove (14) are provided on both sides of the placement groove (14).

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