Laser welding equipment capable of actively aligning lens and chip board and use method of laser welding equipment
Through laser welding equipment that actively aligns the lens with the chip board, laser welding technology is used to directly weld the chip board to the lens, solving the problems of low assembly efficiency and high production costs in the existing technology, and achieving an efficient and low-cost assembly process.
Patent Information
- Application Number
- CN202510024328.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-07
- Publication Date
- 2025-03-25
AI Technical Summary
In the existing camera assembly process, the alignment and assembly efficiency of the chip board and the lens is low, and the production cost is high, making it difficult to meet the needs of market competition.
A laser welding device is used to actively align the lens with the chip board, and the chip board is directly soldered to the lens through laser welding technology to achieve an efficient assembly process.
No need for dispensing or threaded connections, reducing production costs, improving assembly efficiency, and enhancing product consistency and reliability.
Smart Images

Figure CN119681430A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of camera assembly equipment, and in particular to a laser welding device for actively aligning a lens with a chip board and a method for using the device. Background Art
[0002] Existing factories need to align and assemble the chip board with the camera during the camera assembly process. Conventional assembly processes use glue dispensing or threaded connections to align and assemble the chip board to the lens. Threaded connections require thread processing on the lens or mounting seat; glue dispensing requires additional glue, which increases production costs. These two methods have the problems of low assembly efficiency and high production costs, which are not conducive to market competition. Summary of the invention
[0003] In order to solve the above technical problems, the present invention provides a laser welding device for actively aligning a lens and a chip board and a method for using the device to meet the needs of actual production.
[0004] The technical solution of the present invention is: a laser welding device for actively aligning a lens with a chip board, comprising a frame, a mechanical alignment system, an electrical system and an optical system, wherein the frame is provided with an electrical system, the upper part of the frame is provided with a mechanical alignment system, and the lower part of the mechanical alignment system is provided with an optical system. A laser system is provided between the mechanical alignment system and the optical system; the laser system comprises a bracket, a multi-axis motion module and a laser module; the bracket is fixedly connected to the frame, the bracket is provided with a laser module, the multi-axis motion module is slidably connected to the bracket, and the multi-axis motion module is provided with a laser welding head.
[0005] Furthermore, a guide rail matching the multi-axis motion module is provided on the bracket, and a fixedly connected laser welding head is provided at one end of the multi-axis motion module close to the optical system, and the laser welding head is electrically connected to the laser module.
[0006] Furthermore, the mechanical alignment system includes a moving module, a clamp and a lens fixture; the lens fixture is fixedly connected to the frame, the moving module is provided above the lens fixture, and the clamp is provided on one side of the moving module close to the lens fixture.
[0007] Furthermore, the mobile module includes an xyz translation tri-axis and an xyz rotation tri-axis; the xyz translation tri-axis is fixedly connected to the xyz rotation tri-axis, and a clamp is provided on the xyz rotation tri-axis.
[0008] Furthermore, a fixing platform for matching the chip is provided at a position of the lens fixture close to the clamping claws.
[0009] Furthermore, the electrical system includes auxiliary electrical hardware, a drive module, and a motion module.
[0010] Furthermore, the optical system includes a parallel light tube module, a relay lens, a picture card module and a three-in-one light source module; a relay lens is provided directly below the lens, and multiple parallel light tube modules are provided between the relay lens and the lens, and the parallel light tube modules are evenly distributed along the circumference of the relay lens; a picture card module is provided below the relay lens, and a three-in-one light source module is provided below the picture card module.
[0011] A method for using a laser welding device that actively aligns a lens with a chip board, the method of using is as follows:
[0012] Step 1: Take the chip board and lens manually or by a robot;
[0013] Step 2: manually or by a robot, place the chip board on the chip loading position;
[0014] Step 3: manually or mechanically place the lens in the active lens alignment position;
[0015] Step 4: The multi-axis manipulator gripper takes the chip board from the chip board loading position and places it in the active alignment position;
[0016] Step 5: The system controls the multi-axis manipulator to perform active alignment;
[0017] Step 6: After active alignment, the laser moves to the soldering position for soldering;
[0018] Step 7. After soldering, the laser moves to a safe position;
[0019] Step 8. The product after soldering is taken out by a robot or manually, thereby completing the laser soldering active alignment process.
[0020] Compared with the prior art, the present invention has the advantages of: no need for glue dispensing or threaded connection, the chip board can be assembled to the camera by laser welding, which reduces the cost of equipment, improves assembly efficiency, and enhances product consistency and reliability. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0022] Figure 1 It is an overall schematic diagram of the present invention;
[0023] Figure 2 It is a schematic diagram of the laser system of the present invention;
[0024] Figure 3This is a schematic diagram of a multi-axis module of a chip gripper of the present invention;
[0025] Figure 4 This is a schematic diagram of a lens fixture module of the present invention;
[0026] Figure 5 It is a schematic diagram of the electrical system of the present invention;
[0027] Figure 6 Schematic diagram of the optical system of the present invention.
[0028] Among them: 1. Laser system; 2. Mechanical alignment system; 3. Electrical system; 4. Optical system; 5. Rack; 11. Multi-axis motion module; 12. Laser module; 13. Bracket; 111. Guide rail; 112. Laser welding head; 21. XYZ translation three-axis; 22. XYZ rotation three-axis; 23. Gripper; 24. Lens fixture; 25. Fixed table; 241. Lens; 31. Auxiliary electrical hardware; 32. Drive module; 33. Motion module; 41. Parallel light tube module; 42. Relay lens; 43. Chart card module; 44. Three-in-one light source module. DETAILED DESCRIPTION
[0029] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work belong to the scope of protection of the present invention.
[0030] The specific implementation of the present invention will be described below in conjunction with the accompanying drawings:
[0031] like Figures 1 to 6 As shown, a laser welding device for actively aligning a lens with a chip board includes a frame, a mechanical alignment system, an electrical system, and an optical system. The frame is provided with an electrical system, the upper part of the frame is provided with a mechanical alignment system, and the lower part of the mechanical alignment system is provided with an optical system. The optical system assists the mechanical alignment system to accurately align the lens with the chip board, and the electrical system drives the mechanical alignment system to operate.
[0032] The mechanical alignment system includes a moving module, a clamp and a lens fixture. The lens fixture is fixedly connected to the frame, a moving module is provided above the lens fixture, and a clamp is provided on the side of the moving module close to the lens fixture. The moving module includes an xyz translation tri-axis and an xyz rotation tri-axis, the xyz translation tri-axis is fixedly connected to the xyz rotation tri-axis, and a clamp is provided on the xyz rotation tri-axis. The position of the clamp can be flexibly adjusted through the moving module. A fixed platform for matching the chip is provided near the clamp of the lens fixture. The moving module drives the clamp to transfer the chip board from the fixed platform to the lens.
[0033] A laser system is provided between the mechanical alignment system and the optical system. The laser system includes a bracket, a multi-axis motion module and a laser module. The bracket is fixedly connected to the frame, a laser module is provided on the bracket, the multi-axis motion module is slidably connected to the bracket, and a laser welding head is provided on the multi-axis motion module. The multi-axis motion module flexibly adjusts the position of the laser welding head, making it easy to directly weld the chip board to the lens, and the welding process is stable and fast.
[0034] The bracket is provided with a guide rail for matching the multi-axis motion module. A fixed laser welding head is provided at one end of the multi-axis motion module close to the optical system. The axis motion module carries the laser welding head and moves along the guide rail to facilitate welding in alignment with the lens position. The laser welding head is electrically connected to the laser module, and the laser module continuously provides an energy source for the laser welding head.
[0035] The electrical system includes auxiliary electrical hardware, drive modules and motion modules. Auxiliary electrical hardware includes relays, circuit breakers, disconnectors, contactors, transformers, etc. These devices play an important role in the electrical system and ensure the safe and stable operation of the electrical system.
[0036] The optical system includes a parallel light tube module, a relay lens, a picture card module and a three-in-one light source module. A relay lens is provided directly below the lens, and multiple parallel light tube modules are provided between the relay lens and the lens. The parallel light tube modules are evenly distributed along the circumference of the relay lens. A picture card module is provided below the relay lens, and a three-in-one light source module is provided below the picture card module. The three-in-one light source module provides light for the detection camera test. Through the relay lens, the test distance of the camera can be met, so that the test distance can be carried out in a smaller space. Shorten the test distance and reduce the test picture card to reduce the detection cost.
[0037] The method of use of the present invention is as follows:
[0038] Step 1: Take the chip board and lens manually or by a robot;
[0039] Step 2: manually or by a robot, place the chip board on the chip loading position;
[0040] Step 3: manually or mechanically place the lens in the active lens alignment position;
[0041] Step 4: The multi-axis manipulator gripper takes the chip board from the chip board loading position and places it in the active alignment position;
[0042] Step 5: The system controls the multi-axis manipulator to perform active alignment;
[0043] Step 6: After active alignment, the laser moves to the soldering position for soldering;
[0044] Step 7. After soldering, the laser moves to a safe position;
[0045] Step 8. The product after soldering is taken out by a robot or manually, thereby completing the laser soldering active alignment process.
[0046] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an element centered thereon. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an element centered thereon. The terms "upper", "lower", "left", "right", "front", "rear" and similar expressions used herein are for illustrative purposes only.
[0047] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.
Claims
1. A laser welding device for actively aligning a lens with a chip board, comprising a frame, a mechanical alignment system, an electrical system and an optical system, wherein the electrical system is arranged on the frame, the mechanical alignment system is arranged on the upper part of the frame, and the optical system is arranged below the mechanical alignment system, characterized in that: A laser system is provided between the mechanical alignment system and the optical system; the laser system comprises a bracket, a multi-axis motion module and a laser module; the bracket is fixedly connected to the frame, the laser module is provided on the bracket, the multi-axis motion module is slidably connected to the bracket, and a laser welding head is provided on the multi-axis motion module.
2. The laser welding device for active alignment of the lens and the chip board according to claim 1, characterized in that: The bracket is provided with a guide rail matching the multi-axis motion module. The multi-axis motion module is provided with a fixedly connected laser welding head at one end close to the optical system. The laser welding head is electrically connected to the laser module.
3. The laser welding device for active alignment of the lens and the chip board according to claim 1, characterized in that: The mechanical alignment system includes a moving module, a clamp and a lens fixture; the lens fixture is fixedly connected to the frame, the moving module is arranged above the lens fixture, and the clamp is arranged on a side of the moving module close to the lens fixture.
4. The laser welding device for active alignment of the lens and the chip board according to claim 3, characterized in that: The mobile module includes an xyz translation tri-axis and an xyz rotation tri-axis; the xyz translation tri-axis is fixedly connected to the xyz rotation tri-axis, and the clamp is provided on the xyz rotation tri-axis.
5. The laser welding device for active alignment of the lens and the chip board according to claim 3, characterized in that: The lens fixture is provided with a fixing platform matching the chip at a position close to the clamping claw.
6. The laser welding device for active alignment of the lens and the chip board according to claim 1, characterized in that: The electrical system includes auxiliary electrical hardware, a drive module and a motion module.
7. The laser welding device for active alignment of the lens and the chip board according to claim 1, characterized in that: The optical system includes a parallel light tube module, a relay lens, a picture card module and a three-in-one light source module; the relay lens is provided directly below the lens, a plurality of the parallel light tube modules are provided between the relay lens and the lens, and the parallel light tube modules are evenly distributed along the circumference of the relay lens; the picture card module is provided below the relay lens, and the three-in-one light source module is provided below the picture card module.
8. The method for using the laser welding device for active alignment of a lens and a chip board according to any one of claims 1 to 7, characterized in that: Here’s how to use it: Step 1: Take the chip board and lens manually or by a robot; Step 2: manually or by a robot, place the chip board on the chip loading position; Step 3: manually or mechanically place the lens in the active lens alignment position; Step 4: The multi-axis manipulator gripper takes the chip board from the chip board loading position and places it in the active alignment position; Step 5: The system controls the multi-axis manipulator to perform active alignment; Step 6: After active alignment, the laser moves to the soldering position for soldering; Step 7. After soldering, the laser moves to a safe position; Step 8: The product after soldering is taken out by a robot or manually, thereby completing the laser soldering active alignment process.
Citation Information
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