Inverted adsorption laser processing table

Abstract

The invention relates to an inverted adsorption laser processing table which comprises a moving module, an adsorption assembly and a laser cutting head, the adsorption assembly is installed on the moving module, and the laser cutting head is arranged above the adsorption assembly; the adsorption assembly sequentially comprises an adsorption plate and a bottom plate from top to bottom, the adsorption plate is installed on the bottom plate through a plurality of supporting structures, and a gap is formed between the adsorption plate and the bottom plate. Products are adsorbed in an inverted mode, a single particle directly falls off and is collected after being cut, cutting of the remaining part is not affected, and the position precision of other particles is not affected.

Description

Technical Field

[0001] The present invention relates to the technical field related to laser cutting in the semiconductor industry, and in particular to an inverted adsorption laser processing table. Background Art

[0002] After massive searches, it was found that the existing Chinese patent announcement number is CN216503023U, which discloses a warp sheet adsorption laser processing platform, including an XY processing platform, a processing adsorption platform, a galvanometer and a visual system; the processing adsorption platform includes a suction cup base, an adsorption plate is installed on the suction cup base, and an intermediate lifting component is installed in the central groove of the suction cup base. The intermediate lifting component includes a lifting bottom plate, and the driving end of the top of the screw motor is connected to the upper adsorption support plate drive setting, and a number of anti-static suction cups are installed on the adsorption support plate. The present invention uses a sealing ring to form a closed space with the bottom of the product, even if the warped and deformed product can form a closed space, so the product can be adsorbed and fixed; the present invention can improve processing efficiency and ensure product appearance.

[0003] In summary, the problems existing in the prior art are:

[0004] The conventional method in the prior art is to process the product after film pasting. During the processing, the product expands due to heat, causing squeezing between particles and position changes, which affects the subsequent processing accuracy.

[0005] In view of the above-mentioned defects, the designers have actively carried out research and innovation in order to create an inverted adsorption laser processing table to make it more valuable for industrial use. Summary of the invention

[0006] In order to solve any of the above technical problems, the purpose of the present invention is to provide an inverted adsorption laser processing table.

[0007] To achieve the above object, the present invention adopts the following technical solution:

[0008] The inverted adsorption laser processing table comprises a moving module, an adsorption component and a laser cutting head, wherein the adsorption component is mounted on the moving module, and the laser cutting head is arranged above the adsorption component;

[0009] The adsorption assembly includes an adsorption plate and a bottom plate from top to bottom, the adsorption plate is mounted on the bottom plate through a plurality of supporting structures, and a gap is provided between the adsorption plate and the bottom plate;

[0010] A processing through hole is opened in the middle of the adsorption plate, and a plurality of adsorption bosses are evenly distributed on the adsorption plate outside the bottom of the processing through hole. A trachea joint is installed on the adsorption plate outside the adsorption boss, and the product is adsorbed directly below the processing through hole between the plurality of adsorption bosses.

[0011] As a further improvement of the present invention, the supporting structure includes an adjusting screw, a plurality of threaded holes are evenly distributed on the adsorption plate, a screw lower mounting groove is opened on the bottom plate directly below the threaded holes, the top of the adjusting screw is installed in the upper threaded hole, and the bottom of the adjusting screw is installed in the lower screw lower mounting groove.

[0012] As a further improvement of the present invention, a threaded sleeve is installed in the threaded hole, and the top of the adjusting screw is screwed into the threaded sleeve.

[0013] As a further improvement of the present invention, the lower mounting groove of the screw rod is a V-shaped groove structure, and a ball head is provided at the bottom of the adjusting screw rod, and the ball head is installed in the lower mounting groove of the screw rod.

[0014] As a further improvement of the present invention, the number of the adjusting screw rod, the threaded hole and the mounting groove under the screw rod are all three.

[0015] As a further improvement of the present invention, the number of the adsorption bosses is three.

[0016] By means of the above scheme, the present invention has at least the following advantages:

[0017] The present invention adsorbs the product in an inverted manner, and a single particle is directly dropped and collected after being cut, without affecting the cutting of the remaining parts or the position accuracy of other particles.

[0018] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 It is a structural schematic diagram of an inverted adsorption laser processing table of the present invention;

[0021] Figure 2 yes Figure 1 Schematic diagram of the structure of the adsorption component;

[0022] Figure 3 yes Figure 2 Section view about AA.

[0023] The meanings of the various reference numerals in the figures are as follows.

[0024] Mobile module 1, adsorption component 2, laser cutting head 3, product 4, adsorption plate 21, processed through hole 22, adsorption boss 23, air pipe joint 24, threaded hole 25, adjustment screw 26, bottom plate 27, and screw lower mounting groove 28. DETAILED DESCRIPTION

[0025] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0026] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is only a part of the embodiment of the present invention, rather than all the embodiments. The components of the embodiment of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiment of the present invention provided in the drawings is not intended to limit the scope of the invention claimed for protection, but merely represents the selected embodiment of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present invention.

[0027] like Figure 1 to Figure 3 As shown, an inverted adsorption laser processing table includes a moving module 1, an adsorption component 2 and a laser cutting head 3. The adsorption component 2 is installed on the moving module 1, and the laser cutting head 3 is arranged above the adsorption component 2.

[0028] The moving module 1 is an X-axis and Y-axis module or a multi-axis module.

[0029] The adsorption assembly 2 includes an adsorption plate 21 and a bottom plate 27 from top to bottom. The adsorption plate 21 is installed on the bottom plate 27 through a plurality of supporting structures, and a gap is provided between the adsorption plate 21 and the bottom plate 27. A processing through hole 22 is provided in the middle of the adsorption plate 21. A plurality of adsorption bosses 23 are evenly distributed on the adsorption plate 21 outside the bottom of the processing through hole 22. An air pipe joint 24 is installed on the adsorption plate 21 outside the adsorption bosses 23. The product 4 is adsorbed directly below the processing through hole 22 between the plurality of adsorption bosses 23.

[0030] The number of the adsorption bosses 23 is three.

[0031] The supporting structure includes an adjusting screw 26, and a plurality of threaded holes 25 are evenly distributed on the adsorption plate 21. A screw lower mounting groove 28 is opened on the bottom plate 27 directly below the threaded hole 25. The top of the adjusting screw 26 is installed in the upper threaded hole 25, and the bottom of the adjusting screw 26 is installed in the lower screw lower mounting groove 28.

[0032] A threaded sleeve is installed in the threaded hole 25, and the top of the adjusting screw 26 is screwed into the threaded sleeve.

[0033] The screw rod lower mounting groove 28 is a V-shaped groove structure. A ball head is provided at the bottom of the adjusting screw rod 26 , and the ball head is installed in the screw rod lower mounting groove 28 .

[0034] The number of the adjusting screw rod 26 , the threaded hole 25 and the mounting groove 28 under the screw rod are all three.

[0035] The positional relationship and connection relationship between the components of the present invention are as follows:

[0036] It is installed on the mobile module 1 through the bottom plate 27 and moves with the platform; the laser cutting head 3 is installed above the adsorption component 2. The position relationship of the parts of the adsorption component 2 is as follows: three threaded sleeves are embedded in the bottom plate 27, three adjusting screws 26 are screwed into the three threaded sleeves respectively, three air pipe joints 24 are installed on the circumferential side of the adsorption plate 21, and three adjusting screws 26 are placed in three screw lower mounting grooves 28 of the bottom plate 27.

[0037] Working principle and working process of the present invention:

[0038] First, take out the adsorption plate 21, and place the product 4 on the three adsorption surfaces of the adsorption plate 21, align them, and turn on the vacuum of the three air pipe joints 24. The center hole of the adsorption plate 21 has three adsorption bosses 23, and the others are open to ensure that the laser can process the largest area. Then place the adsorption plate 21 with the product 4 on the bottom plate 27. There are three centripetal long V-shaped grooves on the bottom plate 27. The lower ends of the three adjustment screws 26 are ball heads. The three ball heads are placed in the three V-shaped grooves to have a centripetal effect. The adsorption plate 21 will not move relatively during the movement of the platform. The flatness of the product 4 is measured by image. If it exceeds the marked value, the posture of the adsorption plate 21 is adjusted by the three adjustment screws 26. The three-point leveling structure adjusts the posture of the product 4. After adjustment, start the mobile platform processing. When one is completely cut, it falls directly onto the bottom plate 27, and the next one is cut. After all the cutting is completed, remove the adsorption plate 21, turn off the vacuum, remove the scraps, and collect the product particles that fall on the bottom plate 27.

[0039] The present invention adsorbs the product in an inverted manner, and a single particle is directly dropped and collected after being cut, without affecting the cutting of the remaining parts or the position accuracy of other particles.

[0040] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implying the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0041] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principles of the present invention, and these improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. An inverted adsorption laser processing table, comprising a moving module (1), an adsorption component (2) and a laser cutting head (3), wherein the adsorption component (2) is mounted on the moving module (1), and the laser cutting head (3) is arranged above the adsorption component (2); characterized in that: The adsorption assembly (2) comprises, from top to bottom, an adsorption plate (21) and a bottom plate (27); the adsorption plate (21) is mounted on the bottom plate (27) via a plurality of supporting structures, and a gap is provided between the adsorption plate (21) and the bottom plate (27); A processing through hole (22) is opened in the middle of the adsorption plate (21), a plurality of adsorption bosses (23) are evenly distributed on the adsorption plate (21) outside the bottom of the processing through hole (22), and an air pipe joint (24) is installed on the adsorption plate (21) outside the adsorption bosses (23), and the product (4) is adsorbed directly below the processing through hole (22) between the plurality of adsorption bosses (23).

2. The inverted adsorption laser processing table according to claim 1, characterized in that: The support structure comprises an adjusting screw (26), a plurality of threaded holes (25) are evenly distributed on the adsorption plate (21), a screw lower mounting groove (28) is opened on the bottom plate (27) directly below the threaded holes (25), the top of the adjusting screw (26) is mounted in the upper threaded hole (25), and the bottom of the adjusting screw (26) is mounted in the lower screw lower mounting groove (28).

3. The inverted adsorption laser processing table according to claim 2, characterized in that: A threaded sleeve is installed in the threaded hole (25), and the top of the adjusting screw (26) is screwed into the threaded sleeve.

4. The inverted adsorption laser processing table according to claim 2, characterized in that: The screw rod lower mounting groove (28) is a V-shaped groove structure, and a ball head is provided at the bottom of the adjusting screw rod (26), and the ball head is installed in the screw rod lower mounting groove (28).

5. The inverted adsorption laser processing table according to claim 2, characterized in that: The number of the adjusting screw rod (26), the threaded hole (25) and the screw rod lower mounting groove (28) are all three.

6. The inverted adsorption laser processing table according to claim 1, characterized in that: The number of the adsorption bosses (23) is three.

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