Deep cavity machining assembly and machining method thereof

Abstract

The invention belongs to the technical field of semiconductor processing, and discloses a deep cavity processing assembly and a processing method thereof.In the deep cavity processing assembly, a center water outlet drill bit or a U-shaped drill bit can conduct continuous drilling operation on a semiconductor workpiece so that a plurality of deep holes can be formed in the semiconductor workpiece, and the centers of the deep holes are located on the same straight line; and the milling tool can be used for milling the plurality of deep holes so as to form a deep cavity on the semiconductor workpiece. The machining method of the deep cavity machining assembly comprises the steps that the center water outlet drill bit or the U-shaped drill bit in the deep cavity machining assembly is installed on the drilling tool; a plurality of deep holes are sequentially drilled in the machining area of the semiconductor workpiece along a straight line through a center water outlet drill bit or a U-shaped drill bit; the drilling tool is taken down, a milling tool is installed, and the multiple deep holes are milled to form a deep cavity; and carrying out quality inspection on the semiconductor workpiece to complete processing operation. According to the invention, the production cycle of different types of semiconductor workpieces can be effectively reduced, and abrasion to the cutter can be avoided.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a deep cavity processing component and a processing method thereof. Background Art

[0002] At present, when processing deep grooves or deep cavities of semiconductors, only milling with milling tools will not only wear the tools and affect the processing, but also take a long time to process, making the production cycle of semiconductors too long. At the same time, milling tools are difficult to apply to deep grooves or deep cavities with different processing requirements, making their use range relatively narrow and the operating efficiency too low. Therefore, how to ensure that semiconductors can reduce production cycles when performing deep grooves or deep cavities, avoid wear on the tools, and be applicable to different types of processing requirements is a problem that people in this field need to solve. Summary of the invention

[0003] The object of the present invention is to provide a deep cavity processing component and a processing method thereof, so as to ensure that the production cycle can be reduced when performing deep groove or deep cavity operations on semiconductors, avoid wear on the tool, and be applicable to different types of processing requirements.

[0004] To achieve this object, the present invention adopts the following technical solutions:

[0005] A deep cavity processing assembly, comprising:

[0006] A center-hole drill bit and a U-drill bit, wherein the center-hole drill bit or the U-drill bit can perform continuous drilling operations on the semiconductor workpiece to form a plurality of deep holes on the semiconductor workpiece, wherein the centers of the plurality of deep holes are located on the same straight line, and a milling tool can perform milling operations on the plurality of deep holes to form a deep cavity on the semiconductor workpiece.

[0007] As an option, the center water drill bit includes a fixing portion and a drill portion, wherein the fixing portion is connected to the drilling tool, and the drill portion is used for drilling holes.

[0008] Optionally, a water outlet hole is provided on the drill head, a water outlet channel is provided inside the drill head and the fixing part, and the water outlet hole is connected to the water outlet channel.

[0009] Optionally, the U-drill bit includes a U-drill bit body, a mounting portion and a blade are provided at the top of the U-drill bit body, and the blade is detachably connected to the mounting portion for drilling holes.

[0010] Optionally, at least two blades are provided, and the top surfaces of the two blades are higher than the top surface of the U-drill drill bit body.

[0011] Optionally, the U-drill bit also includes a U-drill bit fixing portion for connecting a drilling tool.

[0012] As an option, a positioning groove is provided on the mounting portion, and a positioning protrusion is provided on the blade, and the positioning protrusion can be limited in the positioning groove.

[0013] On the other hand, a method for processing a deep cavity processing component includes the following steps:

[0014] Installing the center-drill bit or the U-drill bit in the deep cavity processing assembly on the drilling tool;

[0015] A center-drill drill bit or a U-drill drill bit is used to sequentially drill a plurality of deep holes along a straight line in the processing area of ​​the semiconductor workpiece;

[0016] Remove the drilling tool, install the milling tool and mill several deep holes to form a deep cavity;

[0017] Perform quality inspection on semiconductor workpieces to complete processing operations.

[0018] As an option, the inner diameter of the deep hole drilled by the center water drill bit is smaller than the inner diameter of the deep hole drilled by the U drill bit.

[0019] Optionally, the lengths of some of the deep holes are less than or equal to the length of the deep cavity, and the depths of the deep holes are the same as that of the deep cavity.

[0020] Beneficial effects of the present invention:

[0021] In the present invention, the semiconductor workpiece is operated by two drill bits, a center water drill bit and a U drill bit, which can expand its scope of use, and can be selectively operated according to different types of processing requirements, effectively improving the processing efficiency, shortening the production cycle, and correspondingly reducing the maintenance cycle of each drill bit. Furthermore, the center water drill bit or the U drill bit can perform continuous drilling operations on the semiconductor workpiece to form a number of deep holes, and the centers of the several deep holes are located on the same straight line. Subsequently, the milling tool can perform milling operations on the several deep holes and then form a deep cavity, that is, the deep cavity is made by drilling first and then milling, which is not only efficient but also can avoid the wear on the tool caused by only milling in the prior art. On the other hand, the processing method using the deep cavity processing component can also effectively ensure that the production cycle of the semiconductor can be reduced when operating in a deep groove or deep cavity, and avoid excessive wear on the tool, and can be applicable to different types of processing requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a schematic diagram of a center-water-discharge drill bit in operation in a deep cavity processing assembly according to an embodiment of the present invention;

[0023] Figure 2 is a schematic diagram of a U-drill bit in operation in a deep cavity processing assembly according to an embodiment of the present invention;

[0024] Figure 3 is another schematic diagram of a U-drill bit in operation in a deep cavity processing assembly according to an embodiment of the present invention;

[0025] Figure 4 is a schematic diagram of a semiconductor workpiece being drilled into a deep hole in a deep cavity processing assembly according to an embodiment of the present invention;

[0026] Figure 5 is a schematic diagram of a semiconductor workpiece being milled into a deep cavity in a deep cavity processing assembly according to an embodiment of the present invention;

[0027] Figure 6 is a partially enlarged schematic diagram of a semiconductor workpiece in a deep cavity processing assembly according to an embodiment of the present invention;

[0028] Figure 7 It is a schematic structural diagram of a center-water-outlet drill bit in a deep cavity processing assembly according to an embodiment of the present invention;

[0029] Figure 8 It is a schematic structural diagram of a U-drill bit in a deep cavity processing assembly according to an embodiment of the present invention;

[0030] Fig. 9 is an enlarged schematic diagram of the mounting portion of a U-drill bit in a deep cavity processing assembly according to an embodiment of the present invention;

[0031] Fig.10 It is a schematic diagram of the installation of the blade of the U-drill bit in the deep cavity processing assembly described in an embodiment of the present invention.

[0032] In the figure:

[0033] 10-center water outlet drill bit; 20-U drill bit; 300-semiconductor workpiece; 301-deep hole; 302-deep cavity; 11-fixing part; 12-drill head; 101-water outlet hole; 201-installation part; 202-blade. DETAILED DESCRIPTION

[0034] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar parts or parts having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0035] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection, it can be a mechanical connection or an electrical connection, it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] In the description of the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include the first feature being in direct contact with the second feature, or may include the first feature being in contact with the second feature through another feature between them instead of being in direct contact. Moreover, a first feature being "above", "above" and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0037] At present, when processing deep grooves or deep cavities of semiconductors, only milling with milling tools will not only wear the tools and affect the processing, but also take a long time to process, making the production cycle of semiconductors too long. At the same time, milling tools are difficult to apply to deep grooves or deep cavities with different processing requirements, making their use range relatively narrow and the operating efficiency too low. Therefore, how to ensure that semiconductors can reduce production cycles when performing deep grooves or deep cavities, avoid wear on the tools, and be applicable to different types of processing requirements is a problem that people in this field need to solve.

[0038] The technical solution of this embodiment is further explained below with reference to the accompanying drawings and through specific implementation methods.

[0039] like Figure 1-Figure 10 As shown, this embodiment provides a deep cavity processing component and a processing method thereof, wherein the deep cavity processing component includes a center water drill bit 10 and a U drill bit 20, wherein the center water drill bit 10 or the U drill bit 20 can perform continuous drilling operations on a semiconductor workpiece 300 to form a plurality of deep holes 301 on the semiconductor workpiece 300, wherein the centers of the plurality of deep holes 301 are located on the same straight line, and the milling processing tool can perform milling operations on the plurality of deep holes 301 to form a deep cavity 302 on the semiconductor workpiece 300.

[0040] On the other hand, a method for processing a deep cavity processing component comprises the following steps:

[0041] Install the center water outlet drill bit 10 or the U drill bit 20 in the deep cavity processing assembly on the drilling tool;

[0042] A center-drill drill bit 10 or a U-drill drill bit 20 is used to sequentially drill a plurality of deep holes 301 along a straight line in a processing area of ​​a semiconductor workpiece 300;

[0043] Remove the drilling tool, install the milling tool and mill several deep holes 301 to form deep cavities 302;

[0044] The semiconductor workpiece 300 is quality inspected to complete the processing operation.

[0045] Specifically, in this embodiment, the semiconductor workpiece 300 is operated by two drill bits, the center water drill bit 10 and the U drill bit 20, which can expand its scope of use and can be selectively operated according to different types of processing requirements, effectively improving the processing efficiency, shortening the production cycle, and correspondingly reducing the maintenance cycle of each drill bit. Further, the center water drill bit 10 or the U drill bit 20 can perform continuous drilling operations on the semiconductor workpiece 300 to form a number of deep holes 301, and the centers of the several deep holes 301 are located on the same straight line. Subsequently, the milling tool can perform milling operations on the several deep holes 301 and then form a deep cavity 302, that is, the deep cavity 302 is made by drilling first and then milling, which is not only efficient but also can avoid the wear of the tool caused by only milling in the prior art. On the other hand, the processing method using the deep cavity processing component can also effectively ensure that the production cycle of the semiconductor workpiece 300 can be reduced when operating in a deep groove or deep cavity, and avoid excessive wear on the tool, and can be applicable to different types of processing requirements.

[0046] The specific structure of the deep cavity processing assembly in this embodiment is described below.

[0047] like Figure 1-Figure 10 As shown, the deep cavity processing assembly in this embodiment includes a center water drill bit 10 and a U drill bit 20. The two different drill bits can meet the processing requirements of semiconductor workpieces 300 with different sizes. Specifically, in this embodiment, both the center water drill bit 10 and the U drill bit 20 can perform continuous drilling operations on the semiconductor workpiece 300, thereby drilling a plurality of deep holes 301 on the semiconductor workpiece 300, and then the milling tool can perform milling operations on the plurality of deep holes 301 to form a deep cavity 302 on the semiconductor workpiece 300, thereby achieving the processing purpose. Figure 1-Figure 4 As shown, the centers of the several deep holes 301 are located on the same straight line, and the center water drill bit 10 or the U drill bit 20 can perform continuous drilling, and the several deep holes 301 are arranged along the same straight line, so that after the subsequent milling operation, the following can be achieved. Figure 5-Figure 6 The effect of the deep cavity 302 is shown.

[0048] like Figure 7 As shown, specifically, the center water drill bit 10 in this embodiment includes a fixing portion 11 and a drill portion 12, the fixing portion 11 is connected to the drilling tool, and the drill portion 12 is used for drilling holes, so that when the center water drill bit 10 is used for drilling, the connection between the fixing portion 11 and the drilling tool can ensure the stability of the center water drill bit 10 during operation. Further, a water outlet hole 101 is provided on the drill portion 12, and a water outlet channel is provided inside the drill portion 12 and the fixing portion 11, and the water outlet hole 101 is connected to the water outlet channel, so that when the center water drill bit 10 is used for drilling, water can be sprayed outward through the water outlet channel and the water outlet hole 101, which can not only cool the drill portion 12 to improve the drilling effect, but also avoid the debris generated by drilling from causing blockage and affecting the drilling efficiency. Exemplarily, in this embodiment, the center water drill bit 10 is made of cemented carbide, and the drill portion 12 and the fixing portion 11 are an integrated structure, and the corresponding size can be set as needed.

[0049] like Figure 8-Figure 10 As shown, in this embodiment, the U drill bit 20 includes a U drill bit body and a U drill bit fixing part, and the top of the U drill bit body is provided with a mounting part 201 and a blade 202. Specifically, in this embodiment, the U drill bit body is used for drilling, and the U drill bit fixing part is used to connect the drilling tool, so as to ensure the stable placement of the U drill bit 20 on the drilling tool and improve the stability during the drilling operation. Optionally, the blade 202 is detachably connected to the mounting part 201 for drilling, and can also be replaced at any time to ensure the drilling effect. Further, in this embodiment, a positioning groove is provided on the mounting part 201, and a positioning protrusion is provided on the blade 202, and the positioning protrusion can be limited in the positioning groove, so as to ensure the accurate placement of the blade 202 on the mounting part 201. Exemplarily, in this embodiment, eight positioning grooves are provided, and they are respectively located on both sides of the axis of the mounting part 201, and eight corresponding positioning protrusions are also provided, and the position corresponds to the positioning groove. Furthermore, in this embodiment, the blade 202 is fixed to the mounting portion 201 by screws or other fasteners, so as to ensure stability after connection, thereby improving the accuracy when drilling the deep hole 301. Optionally, in this embodiment, at least two blades 202 are provided, and the top surfaces of the two blades 202 are higher than the top surface of the U-drill drill bit body, so that the blades 202 can be pressed against the semiconductor workpiece 300 preferentially during the drilling operation, thereby achieving drilling under the effect of its rotation. Optionally, the U-drill drill bit 20 can also spray water outward to clean up debris and cool the workpiece. The corresponding settings are similar to the center water outlet drill bit 10, and will not be repeated here.

[0050] The specific contents of the processing method of the deep cavity processing assembly in this embodiment are described below.

[0051] Combination Figure 1-Figure 10As shown, the processing method of the deep cavity processing component includes the following steps:

[0052] Install the center water outlet drill bit 10 or the U drill bit 20 in the deep cavity processing assembly on the drilling tool;

[0053] A center-drill drill bit 10 or a U-drill drill bit 20 is used to sequentially drill a plurality of deep holes 301 along a straight line in a processing area of ​​a semiconductor workpiece 300;

[0054] Remove the drilling tool, install the milling tool and mill several deep holes 301 to form deep cavities 302;

[0055] The semiconductor workpiece 300 is quality inspected to complete the processing operation.

[0056] Specifically, the inner diameter of the deep hole 301 drilled by the center-water drill bit 10 is smaller than the inner diameter of the deep hole 301 drilled by the U-drill bit 20, so that the center-water drill bit 10 and the U-drill bit 20 can be operated separately according to different processing requirements, improving the operating efficiency while ensuring the processing accuracy. Optionally, the length of the drilled deep holes 301 is less than or equal to the length of the deep cavity 302, so that it is easy to adjust to meet the processing requirements. Furthermore, the depth of the deep cavity 302 of the deep hole 301 is the same, so that the depth will not be adjusted during the milling process, but only the length will be adjusted, thereby improving the processing efficiency. Specifically, in the prior art, a milling tool is directly used to produce a deep cavity 302, but its processing method not only accelerates the wear of the tool, but also requires at least 13 hours of processing time. The deep cavity processing component in this embodiment is used to first drill and then mill the semiconductor workpiece 300, which can increase the processing time to 8 hours. In addition, the use of a center water drill bit 10 and a U drill bit 20 as needed can also reduce tool wear, extend the service life of components, and thereby reduce operating costs.

[0057] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A deep cavity processing assembly, characterized in that: include: A center-water drill bit (10) and a U-drill bit (20), wherein the center-water drill bit (10) or the U-drill bit (20) can perform continuous drilling operations on a semiconductor workpiece (300) to form a plurality of deep holes (301) on the semiconductor workpiece (300), wherein the centers of the plurality of deep holes (301) are located on the same straight line, and a milling tool can perform milling operations on the plurality of deep holes (301) to form a deep cavity (302) on the semiconductor workpiece (300).

2. The deep cavity processing assembly according to claim 1, characterized in that: The center-water drill bit (10) comprises a fixing portion (11) and a drill portion (12); the fixing portion (11) is connected to a drilling tool, and the drill portion (12) is used for drilling holes.

3. The deep cavity processing assembly according to claim 2, characterized in that: The drill head (12) is provided with a water outlet hole (101), the drill head (12) and the fixing part (11) are provided with a water outlet channel, and the water outlet hole (101) is connected to the water outlet channel.

4. The deep cavity processing assembly according to claim 1, characterized in that: The U-drill bit (20) comprises a U-drill bit body, a mounting portion (201) and a blade (202) are arranged at the top end of the U-drill bit body, and the blade (202) is detachably connected to the mounting portion (201) and is used for drilling holes.

5. The deep cavity processing assembly according to claim 4, characterized in that: At least two blades (202) are provided, and the top surfaces of the two blades (202) are higher than the top surface of the U-drill bit body.

6. The deep cavity processing assembly according to claim 4, characterized in that: The U-drill bit (20) also includes a U-drill bit fixing portion, which is used for connecting a drilling tool.

7. The deep cavity processing assembly according to claim 4, characterized in that: The mounting portion (201) is provided with a positioning groove, and the blade (202) is provided with a positioning protrusion, and the positioning protrusion can be limited in the positioning groove.

8. A method for processing a deep cavity processing component, characterized in that: The following steps are involved: Installing the center-drill bit (10) or the U-drill bit (20) in the deep cavity processing assembly according to any one of claims 1 to 7 on a drilling tool; A center-drill drill bit (10) or a U-drill drill bit (20) is used to sequentially drill a plurality of deep holes (301) along a straight line in a processing area of ​​a semiconductor workpiece (300); Remove the drilling tool, install a milling tool and mill a plurality of deep holes (301) to form a deep cavity (302); The semiconductor workpiece (300) is quality inspected to complete the processing operation.

9. The processing method of the deep cavity processing component according to claim 8, characterized in that: The inner diameter of the deep hole (301) drilled by the center-water drill bit (10) is smaller than the inner diameter of the deep hole (301) drilled by the U-drill bit (20).

10. The processing method of a deep cavity processing component according to claim 8, characterized in that: The lengths of the plurality of deep holes (301) are less than or equal to the length of the deep cavity (302), and the depths of the deep holes (301) and the deep cavity (302) are the same.

Images