Pretreatment jig, pretreatment device and pretreatment method for chip recovery
By designing pre-processing fixtures and pre-processing tools for chip recycling, the problem of residual gold balls affecting bonding and threading in image sensor chip recycling is solved, and the effect of efficiently removing the pending points is achieved.
Patent Information
- Application Number
- CN202411848240.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-13
- Publication Date
- 2025-03-25
AI Technical Summary
During the recycling process of image sensor chips, the remaining gold balls will affect the subsequent bonding line yield, and these gold balls need to be removed to ensure the quality of the secondary line.
A pretreatment fixture for chip recycling is designed, including a fixture substrate and a pretreatment tool. A plurality of first grooves are provided on the fixture substrate. When the to-process chip is placed in the groove, the to-process point protrudes, and the pre-processing tool moves in the direction of the fixture substrate to scrape off the to-process point protruding.
Through this method, the points to be processed on the to-process chip can be efficiently removed, the removal efficiency can be improved, and the subsequent bonding and threading process can be ensured that the residual gold balls are not affected by the residual gold balls.
Smart Images
Figure CN119681810A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of chip recycling, and in particular to a pretreatment tool, a pretreatment device and a pretreatment method for chip recycling. Background Art
[0002] In the image sensor packaging process, there is a small proportion of non-functional defects in the packaging process of the image sensor chip. When such defective products are recycled, the gold wires need to be removed because the pads of the image sensor chip have been bonded with gold wires. After the gold wires are removed, there will still be gold ball ridges on the pads. During the secondary bonding, the residual gold balls will affect the subsequent bonding yield of the image sensor chip. Therefore, it is necessary to remove the residual gold balls on the recycled image sensor chips to avoid the residual gold balls affecting the secondary bonding of the image sensor chips. Summary of the invention
[0003] The purpose of the present invention is to provide a pretreatment jig, a pretreatment device and a pretreatment method for chip recycling, which have the advantages of high pretreatment efficiency and thorough gold ball removal.
[0004] To achieve the above object, the present invention provides a pretreatment tool for chip recycling, the pretreatment tool comprising:
[0005] A fixture substrate, on the upper surface of which a plurality of first grooves are formed, the bottom wall shape of the first grooves matches the chip to be processed, the chip to be processed has a plurality of points to be processed, and when the chip to be processed is placed in the first grooves, the points to be processed protrude from the upper surface of the fixture substrate;
[0006] A first direction is provided parallel to the upper surface of the jig substrate, and a plurality of the first grooves are arranged along the first direction on the upper surface of the jig substrate;
[0007] There are a plurality of points to be processed arranged along a second direction on the chip to be processed, and the second direction is parallel to the first direction.
[0008] Optionally, a chip blocking portion is provided on the side wall of the first groove, and the chip blocking portion protrudes from the side wall surface of the first groove in a direction opposite to the first direction.
[0009] Optionally, a third direction perpendicular to the first direction is provided parallel to the upper surface of the jig substrate, and a plurality of rows of the first grooves are provided along the third direction.
[0010] Optionally, substrate fixing holes are respectively provided at two ends of the fixture substrate along the first direction.
[0011] The present invention also provides a pre-processing device for chip recycling, characterized in that the pre-processing device comprises:
[0012] A pretreatment jig as described above;
[0013] The pretreatment tool is used to scrape off the processing points of the chip to be processed protruding from the upper surface of the jig substrate along the upper surface of the jig substrate of the pretreatment jig.
[0014] Optionally, the pre-processing tool comprises a processing blade, and a width of the processing blade is greater than a width of a first groove on a fixture substrate on the pre-processing fixture.
[0015] Optionally, a plurality of rows of first grooves are provided on a jig substrate of the pretreatment jig;
[0016] The pre-processing device comprises a plurality of the pre-processing knives, and the number of the pre-processing knives matches the number of rows of the first grooves.
[0017] Optionally, the pre-processing tool comprises a processing blade, and a width of the processing blade is greater than a width of a fixture substrate on the pre-processing fixture.
[0018] The present invention also provides a pretreatment method for chip recycling, characterized in that the pretreatment method uses the pretreatment device as described above to pretreatment the chip to be processed, and the pretreatment method comprises:
[0019] S10, installing the chip to be processed in the first groove of the fixture substrate;
[0020] S20, a pre-processing tool is attached to the upper surface of the jig substrate and moves along a first direction of the jig substrate to scrape off a portion of the chip to be processed that protrudes from the upper surface of the jig substrate.
[0021] Optionally, the preprocessing method further includes:
[0022] S30, the pre-processing tool is attached to the upper surface of the jig substrate and moves along the first direction of the jig substrate to perform secondary scraping on the portion of the chip to be processed protruding from the upper surface of the jig substrate.
[0023] In summary, compared with the prior art, the pretreatment jig, pretreatment device and pretreatment method for chip recycling provided by the present invention have the following beneficial effects:
[0024] The pretreatment jig of the present invention provides a first groove on the jig substrate. When the chip to be processed is placed in the first groove, the points to be processed protrude from the surface of the jig substrate. The points to be processed on the chip to be processed can be removed uniformly, thereby improving the removal efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 It is a schematic diagram of the partial structure of the pretreatment device of the present invention.
[0026] Figure 2 It is a schematic diagram of the overall structure of the pretreatment device of the present invention.
[0027] Figure 3 The figure is a flow chart of the pretreatment method for chip recycling of the present invention.
[0028] Description of reference numerals:
[0029] Jig base plate 100
[0030] The first groove 110
[0031] Base plate fixing hole 120
[0032] Chips to be processed 200
[0033] Pending point 210
[0034] Pre-treatment tool 300
[0035] Handle blade 310 DETAILED DESCRIPTION
[0036] The following will be combined with the attached embodiment of the present invention Figure 1 ~Attached Figure 3 , the technical solutions, structural features, objectives achieved and effects in the embodiments of the present invention are described in detail.
[0037] It should be noted that the drawings are in a very simplified form and use non-precise proportions. They are only used to conveniently and clearly assist in explaining the embodiments of the present invention, and are not used to limit the conditions for the implementation of the present invention. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical content disclosed by the present invention.
[0038] It should be noted that, in the present invention, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only the elements explicitly listed, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0039] like Figure 1 and Figure 2 As shown, the present invention provides a pretreatment jig for chip recycling, and the pretreatment jig includes a jig substrate 100. A plurality of first grooves 110 are provided on the upper surface of the jig substrate 100, and the first grooves 110 are used to place the chip to be processed 200. The shape of the bottom wall of the first groove 110 matches the chip to be processed 200. When the chip to be processed 200 is placed in the first groove 110, the point to be processed 210 on the chip to be processed 200 protrudes from the upper surface of the jig substrate 100, and the other surfaces of the chip to be processed 200 that are not provided with the point to be processed 210 are completely embedded in the first groove 110 to avoid being affected when the point to be processed 210 is processed later.
[0040] like Figure 2 As shown, a first direction is provided parallel to the upper surface of the fixture substrate 100, and the first direction is Figure 2 In the x direction, on the upper surface of the jig substrate 100, a plurality of first grooves 110 are arranged along the first direction. By providing a plurality of first grooves 110 on the jig substrate 100, when processing, the processing blade 310 can be moved along the first direction, so that a plurality of chips 200 to be processed can be processed at one time, so that the processing blade 310 can process the processing points 210 on a plurality of chips 200 to be processed by moving along the first direction once, thereby improving the processing efficiency.
[0041] As a preferred embodiment, there are multiple points to be processed 210 arranged along the second direction on the chip to be processed 200, and when the chip to be processed 200 is installed in the first groove 110 of the fixture substrate 100, the second direction is parallel to the first direction. The multiple points to be processed 210 on the chip to be processed 200 are also arranged along the second direction parallel to the first direction, so that the processing blade 310 can process multiple points to be processed 210 on the chip to be processed 200 with one movement along the first direction, thereby improving the processing efficiency.
[0042] As a preferred embodiment, when the processing blade 310 processes the chip 200 to be processed, since the processing blade 310 has a cutting effect on the processing point 210 on the chip 200 to be processed, the chip 200 to be processed has a movement tendency to follow the processing blade 310. In order to prevent the processing blade 310 from moving during the processing of the chip 200 to be processed, a chip blocking portion (not shown in the figure) is provided on the side wall of the first groove 110, and the chip blocking portion protrudes from the side wall surface of the first groove 110 in a direction opposite to the first direction. The chip blocking portion can play a role in positioning the chip 200 to be processed, so as to prevent the chip 200 to be processed from moving with the processing blade 310, thereby affecting the processing of the processing point 210 and preventing the processing blade 310 from affecting the processing of other chips 200 to be processed later.
[0043] In this embodiment, if Figure 2 As shown, a third direction (i.e. Figure 2 Along the third direction, multiple rows of first grooves 110 are provided, so that one processing blade 310 can move along multiple rows of first grooves 110 to process the chips 200 to be processed in different rows of first grooves 110, or multiple processing blades 310 can simultaneously process the chips 200 to be processed in multiple rows of first grooves 110, that is, multiple processing blades 310 move simultaneously to realize simultaneous processing of multiple chips 200 to be processed arranged along the first direction, thereby improving processing efficiency.
[0044] In this embodiment, if Figure 2 As shown, substrate fixing holes 120 are respectively opened at both ends of the jig substrate 100 along the first direction, and the jig substrate 100 is fixed by the substrate fixing holes 120 to prevent the jig substrate 100 from following the processing blade 310 when the processing blade 310 moves relative to the jig substrate 100 along the first direction, thereby improving the stability of the jig substrate 100 when the processing blade 310 scrapes the processing point 210 on the chip 200 to be processed.
[0045] The present invention further provides a pre-processing device for chip recycling, the pre-processing device comprising the pre-processing fixture and the pre-processing tool 300 as described above.
[0046] The pre-processing jig is used to arrange the chips 200 to be processed in a certain direction, so that the pre-processing tool 300 can process the chips 200 to be processed, thereby improving the processing efficiency.
[0047] The pretreatment tool 300 is used to scrape the processing points 210 of the chip to be processed 200 protruding from the upper surface of the jig substrate 100 along the upper surface of the jig substrate 100 of the pretreatment jig. When the pretreatment tool 300 processes the processing points 210 on the chip to be processed 200, the pretreatment tool 300 is firstly made to be close to the upper surface of the jig substrate 100, and then the pretreatment tool 300 is moved along the first direction of the jig substrate 100 to scrape the processing points 210 protruding from the upper surface of the jig substrate 100, thereby realizing rapid processing of the chip to be processed 200.
[0048] The preprocessing tool 300 includes a processing blade 310, the width of which is greater than the width of the first groove 110 on the fixture substrate 100 on the preprocessing fixture. Therefore, the preprocessing tool 300 can simultaneously process the points to be processed 210 located on both sides of the chip to be processed 200 during one movement, without moving back and forth to process the points to be processed 210 thereon separately, thereby improving the processing efficiency.
[0049] On the fixture substrate 100 of the pre-processing fixture, multiple rows of first grooves 110 are provided to place multiple rows of chips 200 to be processed at the same time, thereby improving the processing efficiency of the chips 200 to be processed. In addition, the pre-processing device includes multiple pre-processing tools 300, and the number of the pre-processing tools 300 matches the number of rows of the first grooves 110. In this way, the multiple pre-processing tools 300 can process the chips 200 to be processed in multiple rows of the first grooves 110 at the same time, thereby improving the processing efficiency.
[0050] In another preferred embodiment, the preprocessing tool 300 includes a processing blade 310, and the width of the processing blade 310 is greater than the width of the fixture substrate 100 on the preprocessing fixture, so that a single movement of the preprocessing tool 300 can simultaneously process all the chips 200 to be processed on the entire fixture substrate 100, thereby improving the processing efficiency.
[0051] like Figure 3 As shown, the present invention also provides a pretreatment method for chip recycling, the pretreatment method uses the pretreatment device as described above to pretreatment the chip 200 to be processed, and the pretreatment method includes:
[0052] S10 , installing the chip 200 to be processed in the first groove 110 of the jig substrate 100 , firstly placing the chip 200 to be processed in the jig substrate 100 according to the direction.
[0053] S20 , the pre-processing tool 300 is attached to the upper surface of the jig substrate 100 and moves along the first direction of the jig substrate 100 to scrape off the portion of the chip to be processed 200 protruding from the upper surface of the jig substrate 100 .
[0054] As a preferred embodiment, after step S20, it also includes S30, where the pre-processing tool 300 is attached to the upper surface of the jig substrate 100 and moves along the first direction of the jig substrate 100 to perform a secondary scraping on the portion of the chip 200 to be processed that protrudes from the upper surface of the jig substrate 100, so as to ensure that all the points to be processed 210 on the chip 200 to be processed are completely processed.
[0055] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.
Claims
1. A pretreatment jig for chip recycling, characterized in that: The pre-treatment jig comprises: a jig substrate, on the upper surface of which a plurality of first grooves are provided, the bottom wall shape of the first grooves matches the chip to be processed, the chip to be processed has a plurality of points to be processed, and when the chip to be processed is placed in the first grooves, the points to be processed protrude from the upper surface of the jig substrate; a first direction is provided parallel to the upper surface of the jig substrate, and on the upper surface of the jig substrate, a plurality of the first grooves are arranged along the first direction; There are a plurality of points to be processed arranged along a second direction on the chip to be processed, and the second direction is parallel to the first direction.
2. The pretreatment fixture according to claim 1, characterized in that: A chip blocking portion is disposed on the side wall of the first groove, and the chip blocking portion protrudes from the side wall surface of the first groove in a direction opposite to the first direction.
3. The pretreatment fixture according to claim 1, characterized in that: A third direction perpendicular to the first direction is provided parallel to the upper surface of the fixture substrate, and a plurality of rows of the first grooves are provided along the third direction.
4. The pretreatment tool according to claim 1, characterized in that: Substrate fixing holes are respectively provided at two ends of the fixture substrate along the first direction.
5. A pretreatment device for chip recycling, characterized in that: The pretreatment device comprises: a pretreatment tool as described in any one of claims 1 to 4; The pretreatment tool is used to scrape off the processing points of the chip to be processed protruding from the upper surface of the jig substrate along the upper surface of the jig substrate of the pretreatment jig.
6. The pretreatment device according to claim 5, characterized in that: The pre-processing tool comprises a processing blade, and the width of the processing blade is greater than the width of the first groove on the fixture substrate on the pre-processing fixture.
7. The pretreatment device according to claim 6, characterized in that: A plurality of rows of first grooves are provided on a jig substrate of the pretreatment jig; The pre-processing device comprises a plurality of the pre-processing knives, and the number of the pre-processing knives matches the number of rows of the first grooves.
8. The pretreatment device according to claim 5, characterized in that: The pre-processing tool comprises a processing blade, and the width of the processing blade is greater than the width of the fixture substrate on the pre-processing fixture.
9. A pretreatment method for chip recycling, characterized in that: The preprocessing method uses the preprocessing device according to any one of claims 5 to 8 to preprocess the chip to be processed, and the preprocessing method includes: S10, installing the chip to be processed in the first groove of the fixture substrate; S20, a pre-processing tool is attached to the upper surface of the jig substrate and moves along a first direction of the jig substrate to scrape off a portion of the chip to be processed that protrudes from the upper surface of the jig substrate.
10. The pretreatment method for chip recycling according to claim 9, characterized in that: The pre-processing method further comprises: S30, the pre-processing tool is attached to the upper surface of the jig substrate and moves along the first direction of the jig substrate to perform secondary scraping on the portion of the chip to be processed protruding from the upper surface of the jig substrate.