Dismantling jig and dismantling method for recycling packaged chips

Abstract

The invention provides a dismantling jig and a dismantling method for recycling packaged chips. The dismantling jig comprises a jig substrate and a clamping assembly. The jig substrate is provided with a heating platform and a first guide groove used for clamping a chip and a support, and the heating platform is arranged at the bottom of the first guide groove. The clamping assembly comprises a first clamping part, the first clamping part is movably connected to the jig base plate, and the first clamping part movably abuts against the first guide groove. According to the dismantling jig for recycling the packaged chip, the first guide groove or the second guide groove is formed and used for clamping the to-be-dismantled chip and the support, the chip and the support are separated through heating of the heating platform, and the chip and the support are extruded through the clamping assembly so that the chip and the support can be separated; the chip on the support can be quickly dismounted, the chip is prevented from being damaged, and follow-up recycling of the chip cannot be affected.

Description

Technical Field

[0001] The present invention relates to the field of chip recycling, and in particular to a dismantling jig and a dismantling method for recycling packaged chips. Background Art

[0002] In the image sensor packaging process, there is a small proportion of non-functional defects in the packaging process of the image sensor chip. In the prior art, for such defective products, the components and chips are physically disassembled and recycled by using a disassembly knife. However, when using a disassembly knife, it is very easy to cause electrical and functional defects in the chip, damage the image sensor chip, and affect the subsequent recycling of the chip. Therefore, a new disassembly and recycling method is needed, which can not only quickly and effectively recycle the chip but also avoid affecting the quality of the image sensor chip. Summary of the invention

[0003] The object of the present invention is to provide a dismantling jig and a dismantling method for recycling packaged chips, which have the advantage of avoiding damage to the chips when dismantling them.

[0004] To achieve the above object, the present invention provides a dismantling jig for recycling packaged chips, comprising:

[0005] A fixture substrate, on which a heating platform and a first guide groove for clamping a chip and a bracket are provided, and the heating platform is arranged at the bottom of the first guide groove;

[0006] The clamping assembly comprises a first clamping portion, wherein the first clamping portion is movably connected to the fixture base plate and movably abuts against the first guide groove.

[0007] Optionally, a second guide groove is further provided on the fixture substrate, and the second guide groove is arranged parallel to the first guide groove.

[0008] Optionally, the clamping assembly further comprises a second clamping portion movably connected to the fixture substrate, and the second clamping portion and the first clamping portion are arranged on two sides of the fixture substrate opposite to each other.

[0009] Optionally, the first clamping portion includes a guide component and a push rod assembly, the guide component is fixedly connected to the fixture base plate, and the push rod assembly is movably connected to the guide component and moves along the guide component toward or away from the first guide groove.

[0010] Optionally, the guide component includes a circular column guide portion, one end of which is fixedly connected to the fixture base plate, a threaded hole is provided at the center of the circular column guide portion, and the push rod assembly includes a push rod portion, the outer periphery of which is provided with a thread matching the circular column guide portion.

[0011] Optionally, the push rod assembly further includes a handle portion, the handle portion is fixedly connected to the push rod portion, and the handle portion is disposed at an end of the push rod portion away from the fixture substrate.

[0012] Optionally, the push rod assembly further comprises an extrusion block, wherein the extrusion block is fixedly connected to the push rod portion, and the extrusion block and the handle portion are respectively arranged at two ends of the push rod portion.

[0013] The present invention also provides a dismantling method for recycling packaged chips, the dismantling method is performed using the dismantling jig as described above, and the dismantling method comprises:

[0014] S10, installing the chip to be removed and the bracket together on the first guide groove of the fixture substrate;

[0015] S20, the heating platform heats the chip and the bracket on the first guide groove to soften the glue between the chip and the bracket;

[0016] S30, squeezing the first guide groove by the first clamping portion to separate the chip from the bracket;

[0017] S40, removing the chip from the bracket and recovering the chip.

[0018] Optionally, before step S10, the method further includes step S01 of preheating a heating platform, wherein the first guide groove is preheated by the heating platform.

[0019] Optionally, a second guide groove is further provided on the jig substrate. In step S10, the chip to be removed and the bracket are mounted together on the first guide groove or the second guide groove of the jig substrate.

[0020] In summary, compared with the prior art, the dismantling jig and dismantling method for packaged chip recycling provided by the present invention have the following beneficial effects:

[0021] The dismantling jig for packaged chip recycling of the present invention is used to clamp the chip and the bracket to be dismantled by providing a first guide groove or a second guide groove, the chip and the bracket are separated by heating through a heating platform, and the chip and the bracket are squeezed by a clamping component to separate the two, thereby realizing rapid dismantling of the chip on the bracket and avoiding damage to the chip, and having no impact on the subsequent recycling and use of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 The figure is a schematic diagram of the overall structure of the dismantling jig for recycling packaged chips according to the present invention.

[0023] Figure 2It is a schematic diagram of the structure in which a bracket with a chip is installed in a first guide groove.

[0024] Figure 3 It is a structural schematic diagram that a bracket with a chip is installed in a first guide groove and a second guide groove respectively.

[0025] Figure 4 It is a top view of a bracket with a chip installed in a first guide groove and a second guide groove respectively.

[0026] Figure 5 The present invention is a flow chart of a dismantling method for recycling packaged chips.

[0027] Description of reference numerals:

[0028] Demolition fixture 100

[0029] Jig base plate 10

[0030] The first guide groove 11

[0031] The second guide groove 12

[0032] The first clamping portion 13

[0033] Circular column guide 131

[0034] Push rod assembly 132

[0035] Push rod 133

[0036] Handle part 134

[0037] Extrusion block 135

[0038] The second clamping portion 14

[0039] Bracket 20 DETAILED DESCRIPTION

[0040] The following will be combined with the attached embodiment of the present invention Figure 1 ~Attached Figure 5 , the technical solutions, structural features, objectives achieved and effects in the embodiments of the present invention are described in detail.

[0041] It should be noted that the drawings are in a very simplified form and use non-precise proportions. They are only used to conveniently and clearly assist in explaining the embodiments of the present invention, and are not used to limit the conditions for the implementation of the present invention. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical content disclosed by the present invention.

[0042] It should be noted that, in the present invention, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only the elements explicitly listed, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0043] like Figure 1 As shown, the present invention provides a dismantling jig 100 for recycling packaged chips. The dismantling jig 100 includes a jig substrate 10 and a clamping assembly. The jig substrate 10 is used to place a bracket 20 for the chip to be removed. After the bracket 20 is installed on the jig substrate 10, the bracket 20 is squeezed by the clamping assembly to bend the bracket 20, thereby separating the chip and the bracket 20 while avoiding damage to the chip, and effectively realizing chip recycling.

[0044] Specifically, a heating platform and a first guide groove 11 for clamping the chip and the bracket 20 are provided on the fixture substrate 10. The heating platform is arranged at the bottom of the first guide groove 11. The chip and the bracket 20 are fixed by glue, and the first guide groove 11 is heated by the heating platform. When the bracket 20 is installed in the first guide groove 11, the heating platform heats the glue between the bracket 20 and the chip to soften, and when the clamping assembly squeezes the bracket 20, the chip and the bracket 20 can be easily separated.

[0045] In this embodiment, multiple brackets 20 can be placed along the length direction of the first guide groove 11. Therefore, multiple brackets 20 can be squeezed simultaneously by the clamping assembly to achieve simultaneous separation of multiple brackets 20 and chips, thereby improving the separation efficiency of chips and brackets 20.

[0046] like Figure 2 As shown, the clamping assembly includes a first clamping portion 13, which is movably connected to the fixture substrate 10 and movably abuts against the first guide groove 11. The first clamping portion 13 is used to squeeze the edge of the first guide groove 11, thereby squeezing the bracket 20 installed in the first guide groove 11 to separate the bracket 20 and the chip.

[0047] like Figure 1 and Figure 3As shown, as a preferred embodiment, a second guide groove 12 is further provided on the jig substrate 10. The second guide groove 12 is provided in parallel with the first guide groove 11. By providing the second guide groove 12 parallel to the first guide groove 11, during one extrusion separation process, the bracket 20 to be separated can be simultaneously loaded into the second guide groove 12, that is, all the brackets 20 and chips in the first guide groove 11 and the second guide groove 12 can be separated at the same time by one extrusion. Compared with the technical solution with only the first guide groove 11, more brackets 20 and chips can be separated in the same time, thereby improving the separation efficiency of the bracket 20 and the chip.

[0048] As a preferred embodiment, the clamping assembly further includes a second clamping portion 14 movably connected to the jig substrate 10, and the second clamping portion 14 and the first clamping portion 13 are arranged on both sides of the jig substrate 10 opposite to each other. In this embodiment, the structure of the second clamping portion 14 is exactly the same as that of the first clamping portion 13, and the second clamping portion 14 and the first clamping portion 13 are arranged on both sides of the jig substrate 10 opposite to each other. The second clamping portion 14 and the first clamping portion 13 can squeeze the bracket 20 from the opposite sides of the first guide groove 11 and the second guide groove 12 at the same time. Compared with the case where only the first clamping portion 13 is provided, the second clamping portion 14 and the first clamping portion 13 are provided at the same time, which can squeeze the first guide groove 11 and the second guide groove 12 from both sides respectively (such as Figure 4 When the number of brackets 20 to be removed is small, the first guide groove 11 or the second guide groove 12 can be used alone for extrusion, thereby improving the flexibility of the removal jig 100.

[0049] In other embodiments, the second clamping portion 14 may also have a structure different from that of the first clamping portion 13 .

[0050] Continue as Figure 1 As shown, the first clamping portion 13 includes a guide component and a push rod assembly 132. The push rod assembly 132 is used to move in a direction close to or away from the jig substrate 10 to squeeze the bracket 20 in the first guide groove 11. The guide component is used to guide the push rod assembly 132 so that the push rod assembly 132 always moves in a preset direction to prevent the push rod assembly 132 from deviating from the preset direction and failing to effectively squeeze the bracket 20 to separate the chip. The guide component is fixedly connected to the jig substrate 10 to achieve reliable guidance of the push rod assembly 132. The push rod assembly 132 is movably connected to the guide component and moves along the guide component in a direction close to or away from the first guide groove 11.

[0051] In the present embodiment, the guide component includes a circular column guide portion 131. One end of the circular column guide portion 131 is fixedly connected to the jig substrate 10, and the other end extends in a direction away from the jig substrate 10. The circular column guide portion 131 is hollow inside, and a threaded hole is provided at the center of the circular column guide portion 131. In the present embodiment, the circular column guide portion 131 and the push rod assembly 132 are connected by threads. The threaded connection has the advantages of accurate positioning and the ability to transmit large loads. The push rod assembly 132 is precisely controlled along the circular column guide portion 131, and the push rod assembly 132 is pressed by a large load on the bracket 20 in the first clamping portion 13 to ensure the separation between the chip and the bracket 20. The stroke of the push rod assembly 132 to squeeze the bracket 20 can be controlled by the thread, and the squeezing is stopped when the separation between the bracket 20 and the chip is ensured to avoid excessive squeezing and damaging the chip.

[0052] The push rod assembly 132 includes a push rod portion 133 , and a thread matching the annular column guide portion 131 is provided on the outer circumference of the push rod portion 133 , so as to achieve a reliable connection between the push rod portion 133 and the annular column guide portion 131 .

[0053] As a preferred embodiment, the push rod assembly 132 further includes a handle portion 134. The handle portion 134 is fixedly connected to the push rod portion 133, and the handle portion 134 is disposed at one end of the push rod portion 133 away from the fixture substrate 10. In this embodiment, the handle portion 134 is a conical structure, which increases the contact area between the operator's hand and the push rod assembly 132, so that the operator can hold the handle portion 134 and thus operate the push rod portion 133.

[0054] In other embodiments, the handle portion 134 may also be cylindrical or in other shapes, as long as the gripping area between the hand and the push rod portion 133 can be increased to make the push rod assembly 132 easier to operate, and there is no limitation here.

[0055] The push rod assembly 132 also includes an extrusion block 135. The extrusion block 135 is fixedly connected to the push rod portion 133. The extrusion block 135 is a long block structure, and the long side of the extrusion block 135 is parallel to the first guide groove 11, so that the push rod assembly 132 can evenly apply extrusion force to the multiple brackets 20 in the first guide groove 11, avoiding the situation that the brackets 20 at different positions in the first guide groove 11 are subjected to uneven force. The extrusion block 135 and the handle portion 134 are respectively arranged at both ends of the push rod portion 133, so that the extrusion block 135 located next to the first guide groove 11 can be controlled by the handle portion 134.

[0056] like Figure 5 As shown, the present invention also provides a dismantling method for recycling packaged chips, the dismantling method is completed using the dismantling fixture 100 as described above, and the dismantling method includes:

[0057] S10 , mounting the chip to be removed and the bracket 20 together on the first guide groove 11 of the jig substrate 10 , mounting the chip to be removed and the bracket 20 on the first guide groove 11 .

[0058] S20, the heating platform heats the chip and the bracket 20 on the first guide groove 11. By heating the chip and the bracket 20 on the first guide groove 11, the glue between the chip and the bracket 20 is softened, so that the chip and the bracket 20 are easier to separate, and the chip will not be damaged when the bracket 20 is bent and deformed during the separation process.

[0059] S30, the first guide groove 11 is squeezed by the first clamping part 13 to separate the chip from the bracket 20. Since the size of the chip is smaller than the bracket 20, and the material rigidity of the chip itself is greater than the rigidity of the material of the bracket 20, when the bracket 20 is squeezed, the bracket 20 is first bent and deformed, while the chip on the bracket 20 is not squeezed and deformed at first. When the deformation of the bracket 20 is large enough, since the glue between the chip and the bracket 20 has softened, the chip will not deform with the bracket 20, and the chip and the glue can be easily separated at this time.

[0060] S40, remove the chip from the bracket 20 and recover the chip. The separation between the chip and the bracket 20 has been achieved in the previous step. In this step, the chip can be removed from the bracket 20 to achieve the separation of the two. In this process, the integrity of the chip can be guaranteed to the greatest extent, so that the chip can continue to be used later.

[0061] As a preferred embodiment, before step S10, step S01 is further included, preheating the heating platform, and preheating the first guide groove 11 through the heating platform. By preheating the first guide groove 11 in advance, when the bracket 20 with the chip is installed on the first guide groove 11, the time for the heating platform to heat the first guide groove 11 can be shortened, the glue between the chip and the bracket 20 can be softened more quickly, and the waiting time for heating and softening the glue after the chip and the bracket 20 are installed on the first guide groove 11 is shortened, thereby improving the removal efficiency.

[0062] A second guide groove 12 is also provided on the jig substrate 10. In step S10, the chip to be removed and the bracket 20 are installed together on the first guide groove 11 or the second guide groove 12 of the jig substrate 10. By setting the second guide groove 12, the second guide groove 12 is set parallel to the first guide groove 11. During one extrusion and separation process, the bracket 20 to be separated can be simultaneously loaded into the second guide groove 12, that is, all the brackets 20 and chips in the first guide groove 11 and the second guide groove 12 can be separated at the same time by one extrusion. Compared with the technical solution with only the first guide groove 11, more brackets 20 and chips can be separated in the same time, thereby improving the separation efficiency of the bracket 20 and the chip.

[0063] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. A dismantling jig for recycling packaged chips, characterized in that: The removal jig comprises: a jig substrate, on which a heating platform and a first guide groove for clamping the chip and the bracket are provided, and the heating platform is arranged at the bottom of the first guide groove; The clamping assembly comprises a first clamping portion, wherein the first clamping portion is movably connected to the fixture base plate and movably abuts against the first guide groove.

2. The removal jig according to claim 1, characterized in that: The fixture substrate is also provided with a second guide groove, and the second guide groove is arranged parallel to the first guide groove.

3. The removal jig according to claim 2, characterized in that: The clamping assembly further includes a second clamping portion movably connected to the fixture base plate, and the second clamping portion and the first clamping portion are arranged on two sides of the fixture base plate opposite to each other.

4. The removal jig according to claim 1, characterized in that: The first clamping portion includes a guide component and a push rod assembly, the guide component is fixedly connected to the fixture base plate, and the push rod assembly is movably connected to the guide component and moves along the guide component toward or away from the first guide groove.

5. The removal jig according to claim 4, characterized in that: The guide component includes a circular column guide portion, one end of which is fixedly connected to the fixture base plate, a threaded hole is provided at the center of the circular column guide portion, and the push rod assembly includes a push rod portion, the outer periphery of which is provided with a thread matching the circular column guide portion.

6. The removal jig according to claim 5, characterized in that: The push rod assembly also includes a handle portion, which is fixedly connected to the push rod portion, and the handle portion is arranged at an end of the push rod portion away from the fixture substrate.

7. The removal jig according to claim 6, characterized in that: The push rod assembly also includes an extrusion block, which is fixedly connected to the push rod portion. The extrusion block and the handle portion are respectively arranged at two ends of the push rod portion.

8. A dismantling method for recycling packaged chips, characterized in that: The dismantling method is performed using a dismantling jig as described in any one of claims 1 to 7, and the dismantling method comprises: S10, installing the chip to be removed and the bracket together on the first guide groove of the fixture substrate; S20, the heating platform heats the chip and the bracket on the first guide groove to soften the glue between the chip and the bracket; S30, squeezing the first guide groove by the first clamping portion to separate the chip from the bracket; S40, removing the chip from the bracket and recovering the chip.

9. The dismantling method for recycling packaged chips according to claim 8, characterized in that: Before step S10, the method further includes step S01 of preheating a heating platform, wherein the first guide groove is preheated by the heating platform.

10. The dismantling method for recycling packaged chips according to claim 8, characterized in that: The jig substrate is also provided with a second guide groove. In step S10, the chip to be removed and the bracket are mounted together on the first guide groove or the second guide groove of the jig substrate.

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